JP2019169645A - Manufacturing method of chip resistor - Google Patents
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Abstract
Description
本発明は、各種電子機器に使用される金属板を抵抗体としたチップ抵抗器の製造方法に関するものである。 The present invention relates to a method of manufacturing a chip resistor using a metal plate used for various electronic devices as a resistor.
金属板を抵抗体としたチップ抵抗器は、図１５、図１６に示すように、金属で構成された抵抗体１と、抵抗体１の一面１ａの両端部に形成された一対の電極２と、抵抗体１の一面１ａと対向する他面１ｂに形成された第１の保護膜３と、抵抗体１の一面１ａの一対の電極２間に形成された第２の保護膜４と、一対の電極２の露出面から抵抗体１の端面にかけて形成されためっき層５とを備えていた。また、抵抗体１の側面１ｃに第３の保護膜６を設けていた。 As shown in FIGS. 15 and 16, a chip resistor using a metal plate as a resistor includes a resistor 1 made of metal, and a pair of electrodes 2 formed on both ends of one surface 1a of the resistor 1. The first protective film 3 formed on the other surface 1b facing the one surface 1a of the resistor 1, the second protective film 4 formed between the pair of electrodes 2 on the one surface 1a of the resistor 1, and a pair And the plating layer 5 formed from the exposed surface of the electrode 2 to the end surface of the resistor 1. Further, the third protective film 6 is provided on the side surface 1 c of the resistor 1.
なお、図１５は断面図、図１６は図１５のＬ−Ｌ’線断面図である。 15 is a cross-sectional view, and FIG. 16 is a cross-sectional view taken along line L-L ′ in FIG. 15.
また、このチップ抵抗器の製造方法としては、図１７（ａ）に示すような平板状の金属板を打ち抜き加工するなどして形成されたフレーム１０を用いて製造されている。このフレーム１０は、一定方向に延びた複数の板状部１１と、これら複数の板状部１１を支持する矩形枠状の支持部１１ａとを備え、隣り合う板状部１１同士の間には、スリット１２が形成されている。 Moreover, as a manufacturing method of this chip resistor, it manufactures using the flame | frame 10 formed by stamping the flat metal plate as shown to Fig.17 (a). The frame 10 includes a plurality of plate-like portions 11 extending in a predetermined direction and a rectangular frame-like support portion 11a that supports the plurality of plate-like portions 11, and between the adjacent plate-like portions 11. , Slits 12 are formed.
各板状部１１の片面上に複数の矩形状の絶縁層１３と導電層１４とを交互に形成した後、前記片面と対抗する面にも絶縁層を形成し、かつ一対の側面１５に絶縁層１６を形成して図１７（ｂ）に示すようなバー状の金属板（抵抗器集合体）Ａ１が得られる。 After alternately forming a plurality of rectangular insulating layers 13 and conductive layers 14 on one side of each plate-like portion 11, an insulating layer is also formed on the side facing the one side and insulated to a pair of side surfaces 15. By forming the layer 16, a bar-shaped metal plate (resistor assembly) A1 as shown in FIG. 17B is obtained.
この抵抗器集合体Ａ１を図１７（ｂ）の破線の箇所で切断することで、図１７（ｃ）に示すようなハンダ層未形成のチップ抵抗器Ａ２が複数形成され、このチップ抵抗器Ａ２の両端面１７にハンダをめっきすることで図１５、図１６に示したチップ抵抗器を得ることができる。 By cutting this resistor assembly A1 at the broken line in FIG. 17B, a plurality of chip resistors A2 with no solder layer as shown in FIG. 17C are formed, and this chip resistor A2 The chip resistors shown in FIGS. 15 and 16 can be obtained by plating the end faces 17 of the solder with solder.
なお、この出願の発明に関する先行技術文献情報としては、例えば、特許文献１が知られている。 As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
上記従来のチップ抵抗器の製造方法においては、バー状に形成された金属板Ａ１の強度が低いため、工程間の搬送時や次工程での加工時に変形し易く、これにより、歩留が低くなる可能性がある。また、バー状の金属板Ａ１を支持するために、支持部１１ａを設ける必要があり、製品にならない部分が多いため、製品の取数を増やすことが出来ず、生産性が悪いという課題があった。 In the above conventional chip resistor manufacturing method, since the strength of the metal plate A1 formed in a bar shape is low, the metal plate A1 is easily deformed at the time of conveyance between processes or at the next process, thereby reducing the yield. There is a possibility. In addition, in order to support the bar-shaped metal plate A1, it is necessary to provide the support portion 11a, and since there are many portions that do not become products, there is a problem that the number of products cannot be increased and productivity is poor. It was.
第１の態様に係るチップ抵抗器の製造方法は、シート状抵抗体の一面に複数の第１の溝部を互いに平行になるように形成する工程と、前記シート状抵抗体の一面と前記複数の第
１の溝部の内部に一体的に第１の保護部材を形成する工程と、前記シート状抵抗体の一面と対向する他面に、前記複数の第１の溝部とそれぞれ接続するように複数の第２の溝部を形成する工程と、隣接する前記溝部同士の間に等間隔で複数の電極を形成する工程と、前記複数の電極間と、前記第２の溝部の内部に一体的に第２の保護部材を形成する工程と、前記複数の第１、第２の溝部および前記複数の電極の各中央部を切断して個片状に分割する工程とを備えている。
The manufacturing method of the chip resistor according to the first aspect includes a step of forming a plurality of first groove portions on one surface of the sheet-like resistor so as to be parallel to each other, a surface of the sheet-like resistor, and the plurality of A step of integrally forming a first protective member inside the first groove portion, and a plurality of first groove portions connected to the other surface opposite to one surface of the sheet-like resistor, respectively. A step of forming a second groove portion, a step of forming a plurality of electrodes at equal intervals between the adjacent groove portions, a second portion integrally between the plurality of electrodes, and inside the second groove portion. Forming a protective member, and cutting each of the plurality of first and second groove portions and the central portions of the plurality of electrodes into individual pieces.
第２の態様に係るチップ抵抗器の製造方法は、第１の態様において、前記複数の第１の溝部と交わり、前記複数の電極と対向する位置に複数の第３の溝部を形成している。 The chip resistor manufacturing method according to the second aspect is the first aspect, wherein a plurality of third groove portions are formed at positions that intersect with the plurality of first groove portions and face the plurality of electrodes. .
第３の態様に係るチップ抵抗器の製造方法は、シート状抵抗体の一面に複数の第１の溝部を互いに平行になるように形成する工程と、隣接する前記第１の溝部同士の間に等間隔で複数の電極を形成する工程と、前記複数の第１の溝部の内部と前記複数の電極間に一体的に第１の保護部材を形成する工程と、前記シート状抵抗体の一面と対向する他面に、前記複数の第１の溝部とそれぞれ接続するように複数の第２の溝部を形成する工程と、前記シート状抵抗体の他面と前記第２の溝部の内部に一体的に第２の保護部材を形成する工程と、前記複数の第１、第２の溝部および前記複数の電極の各中央部を切断して個片状に分割する工程とを備えている。 The manufacturing method of the chip resistor according to the third aspect includes a step of forming a plurality of first groove portions on one surface of the sheet-like resistor so as to be parallel to each other, and between the adjacent first groove portions. A step of forming a plurality of electrodes at equal intervals, a step of forming a first protective member integrally between the plurality of first grooves and the plurality of electrodes, and one surface of the sheet-like resistor, A step of forming a plurality of second groove portions so as to be respectively connected to the plurality of first groove portions on the opposite other surface; and the other surface of the sheet-like resistor and the inside of the second groove portion. Forming a second protective member, and cutting each of the plurality of first and second groove portions and each central portion of the plurality of electrodes into individual pieces.
第４の態様に係るチップ抵抗器の製造方法は、第３の態様において、前記複数の第２の溝部と交わり、前記複数の電極と対向する位置に複数の第３の溝部を形成している。 The chip resistor manufacturing method according to a fourth aspect is the third aspect, wherein a plurality of third groove portions are formed at positions that intersect with the plurality of second groove portions and face the plurality of electrodes. .
第５の態様に係るチップ抵抗器の製造方法は、第１〜４の態様のいずれかにおいて、前記複数の第１の溝部、前記複数の第２の溝部および前記複数の第３の溝部をエッチング工法またはダイシング工法を用いて形成している。 The method for manufacturing a chip resistor according to a fifth aspect is the method according to any one of the first to fourth aspects, wherein the plurality of first groove portions, the plurality of second groove portions, and the plurality of third groove portions are etched. It is formed using the construction method or dicing method.
第６の態様に係るチップ抵抗器の製造方法は、第１〜５の態様のいずれかにおいて、前記複数の電極を形成した後、前記第２の保護部材を形成する前に、前記シート状抵抗体を貫通せず、前記複数の第１、第２の溝部に接しないトリミング溝を形成している。 The method of manufacturing a chip resistor according to a sixth aspect is the sheet resistor according to any one of the first to fifth aspects, after forming the plurality of electrodes and before forming the second protective member. Trimming grooves that do not penetrate through the body and do not contact the first and second groove portions are formed.
本発明のチップ抵抗器の製造方法は、バー状の金属板を第１の保護部材によって固定された状態で形成出来るため、工程間の搬送時や加工時に変形するのを防ぐことが可能となる。また、バー状の金属板は第１の保護部材によって固定されるため、支持部を設ける必要がなく、製品部分を増加させ、取数を増やして生産性を向上させることができる。 Since the chip resistor manufacturing method of the present invention can be formed in a state where the bar-shaped metal plate is fixed by the first protective member, it can be prevented from being deformed at the time of transporting and processing between processes. . Further, since the bar-shaped metal plate is fixed by the first protective member, it is not necessary to provide a support portion, and the product portion can be increased, the number of products can be increased, and the productivity can be improved.
（実施の形態１）
図１は本発明の実施の形態１におけるチップ抵抗器の断面図、図２は図１のＡ−Ａ’線断面図である。
(Embodiment 1)
1 is a cross-sectional view of a chip resistor according to Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view taken along the line AA ′ of FIG.
本発明の実施の形態１におけるチップ抵抗器は、図１、図２に示すように、ＣｎＭｎＮｉ等の金属で構成された抵抗体２１と、抵抗体２１の一面（下面）２１ａの両端部に形成されＣｕで構成された一対の電極２２と、抵抗体２１の一面２１ａと対向する他面（上面）２１ｂに形成された第１の保護膜２３と、抵抗体２１の下面２１ａにおいて一対の電極２２間に形成された第２の保護膜２４と、一対の電極２２の下面から抵抗体２１の端面２１ｃにかけて形成されためっき層２５とを備えている。 As shown in FIGS. 1 and 2, the chip resistor according to the first embodiment of the present invention is formed on both ends of a resistor 21 made of a metal such as CnMnNi and one surface (lower surface) 21a of the resistor 21. The pair of electrodes 22 made of Cu, the first protective film 23 formed on the other surface (upper surface) 21b facing the one surface 21a of the resistor 21, and the pair of electrodes 22 on the lower surface 21a of the resistor 21 A second protective film 24 formed therebetween and a plating layer 25 formed from the lower surface of the pair of electrodes 22 to the end surface 21c of the resistor 21 are provided.
一対の電極２２間に流れる電流の方向と平行な側面２１ｄを覆うように第１、第２の保護膜２３、２４が形成されている。すなわち、第１、第２の保護膜２３、２４は、抵抗体２１の上面２１ｂ、下面２１ａから側面２１ｄにかけて一体的に形成されている。 First and second protective films 23 and 24 are formed so as to cover the side surface 21 d parallel to the direction of the current flowing between the pair of electrodes 22. That is, the first and second protective films 23 and 24 are integrally formed from the upper surface 21b and the lower surface 21a of the resistor 21 to the side surface 21d.
また、抵抗体２１を構成する金属は、ＴＣＲ（抵抗温度係数）が０に近く、ゼーベック効果が小さいＣｕＭｎＮｉ合金、またはＣｕＭｎＳｎ合金が好ましい。 The metal constituting the resistor 21 is preferably a CuMnNi alloy or a CuMnSn alloy having a TCR (resistance temperature coefficient) close to 0 and a small Seebeck effect.
以下、本発明の実施の形態１におけるチップ抵抗器の製造方法について図面を参照しながら説明する。 Hereinafter, the manufacturing method of the chip resistor in Embodiment 1 of the present invention will be described with reference to the drawings.
まず、図３（ａ）（ｂ）に示すように、ＣｕＭｎＮｉ等からなる金属を板状に形成したシート状抵抗体３１を用意し、このシート状抵抗体の上面３１ａと下面３１ｂの両方にレジスト３２を貼り付ける。上面のレジスト３２には、等間隔で互いに平行になるように開口部を形成する。ここで、図３（ａ）は上面図、図３（ｂ）は図３（ａ）のＢ−Ｂ’線断面図である。 First, as shown in FIGS. 3A and 3B, a sheet-like resistor 31 in which a metal made of CuMnNi or the like is formed in a plate shape is prepared, and a resist is formed on both the upper surface 31a and the lower surface 31b of the sheet-like resistor. 32 is pasted. Openings are formed in the upper resist 32 so as to be parallel to each other at equal intervals. Here, FIG. 3A is a top view, and FIG. 3B is a cross-sectional view taken along the line B-B ′ of FIG.
次に、図３（ｃ）（ｄ）に示すように、シート状抵抗体３１の上面３１ａをエッチングしてシート状抵抗体３１に複数の第１の溝部３３ａを形成し、その後、レジスト３２を除去する。ここで、図３（ｃ）は上面図、図３（ｄ）は図３（ｃ）のＣ−Ｃ’線断面図である。シート状抵抗体３１は、個片状に分割されることによって、図１、図２に示すチップ抵抗器における抵抗体２１となる。 Next, as shown in FIGS. 3C and 3D, the upper surface 31a of the sheet-like resistor 31 is etched to form a plurality of first groove portions 33a in the sheet-like resistor 31, and then the resist 32 is formed. Remove. Here, FIG. 3C is a top view, and FIG. 3D is a cross-sectional view taken along the line C-C ′ of FIG. The sheet-like resistor 31 is divided into individual pieces, thereby forming the resistor 21 in the chip resistor shown in FIGS.
なお、以降の製造方法の説明では、第１の溝部３３ａが形成される面を便宜上、「上面」とする。 In the following description of the manufacturing method, the surface on which the first groove 33a is formed is referred to as “upper surface” for convenience.
複数の第１の溝部３３ａは、シート状抵抗体３１の端部から他方の端部まで連続して延びる直線状に形成される。これにより、取数が増え、生産性が向上する。第１の溝部３３ａは図１、図２に示すチップ抵抗器においては第１の保護膜２３と対応する。 The plurality of first groove portions 33 a are formed in a straight line extending continuously from the end portion of the sheet-like resistor 31 to the other end portion. This increases the number of orders and improves productivity. The first groove 33a corresponds to the first protective film 23 in the chip resistor shown in FIGS.
次に、図４（ａ）（ｂ）に示すように、シート状抵抗体３１の上面３１ａと複数の第１の溝部３３ａの内部に、同時に第１の保護部材３４を形成する。第１の保護部材３４はエ
ポキシ系樹脂からなるフィルムやプリプレグで、真空ラミネーターや真空熱プレスなどによって流動性が増すものを使用する。
Next, as shown in FIGS. 4A and 4B, the first protective member 34 is formed simultaneously in the upper surface 31a of the sheet-like resistor 31 and the plurality of first groove portions 33a. The first protective member 34 is a film or prepreg made of an epoxy resin and has a fluidity increased by a vacuum laminator or a vacuum hot press.
そして、シート状抵抗体３１の上面３１ａに形成するとともに、複数の第１の溝部３３ａの内部にも充填した後、第１の保護部材３４を硬化させる。ここで、図４（ａ）は上面図、図４（ｂ）は、図４（ａ）のＤ−Ｄ’線断面図である。 And while forming in the upper surface 31a of the sheet-like resistor 31, and also filling also inside the some 1st groove part 33a, the 1st protection member 34 is hardened. Here, FIG. 4A is a top view, and FIG. 4B is a cross-sectional view taken along line D-D ′ in FIG.
第１の保護部材３４を形成することによって、シート状抵抗体３１の端部から他方の端部まで連続して延びる複数の第１の溝部３３ａを形成しているにもかかわらず、シート状抵抗体３１の強度が増し、以降の工程での取り扱いやすくなる。 Although the first protective member 34 is formed, the sheet-like resistance is formed despite the formation of the plurality of first groove portions 33a that continuously extend from the end of the sheet-like resistor 31 to the other end. The strength of the body 31 is increased and it becomes easy to handle in the subsequent steps.
次に、シート状抵抗体の下面３１ｂにレジストを貼り付け、シート状抵抗体３１の上面３１ａに形成した第１の溝部３３ａと平面視で同じ位置に、等間隔で互いに平行になるように開口部を形成する。 Next, a resist is affixed to the lower surface 31b of the sheet-like resistor, and the first groove 33a formed on the upper surface 31a of the sheet-like resistor 31 is opened at the same position in a plan view so as to be parallel to each other at equal intervals. Forming part.
そして、図４（ｃ）（ｄ）に示すように、シート状抵抗体３１の下面３１ｂをエッチングして、複数の第１の溝部３３ａと接続する複数の第２の溝部３３ｂを形成する。なお、第１の溝部３３ａ、第２の溝部３３ｂをそれぞれダイシングで形成してもよい。 4C and 4D, the lower surface 31b of the sheet resistor 31 is etched to form a plurality of second groove portions 33b connected to the plurality of first groove portions 33a. Note that the first groove 33a and the second groove 33b may be formed by dicing.
このように、シート状抵抗体３１の下面３１ｂと上面３１ａの両方からエッチング（ダイシング）して、第１の溝部３３ａと第２の溝部３３ｂからなる貫通孔をシート状抵抗体３１に形成している。よって、シート状抵抗体３１の厚みが厚くても安定した形状の貫通孔を形成することができる。 In this manner, etching (dicing) is performed from both the lower surface 31b and the upper surface 31a of the sheet-like resistor 31 to form a through-hole including the first groove portion 33a and the second groove portion 33b in the sheet-like resistor 31. Yes. Therefore, a stable through-hole can be formed even if the sheet-like resistor 31 is thick.
また、上述したように第１の保護部材３４をシート状抵抗体３１に形成して強度を強くしているため、支持部を設けることなく複数の第２の溝部３３ｂを安定した状態で形成でき、複数の第２の溝部３３ｂの形成箇所がずれるのを防止できる。 In addition, since the first protective member 34 is formed on the sheet-like resistor 31 to increase the strength as described above, the plurality of second groove portions 33b can be stably formed without providing a support portion. It can prevent that the formation location of the some 2nd groove part 33b shifts | deviates.
このとき、複数の第１の溝部３３ａと複数の第２の溝部３３ｂの幅は図４（ｅ）（ｆ）に示すように異なっていてもよい。これにより、複数の第１の溝部３３ａと複数の第２の溝部３３ｂの許容できる位置ずれ量を増やすことができ、個片化する際に抵抗体２１を切断してしまう可能性を低減できる。 At this time, the widths of the plurality of first groove portions 33a and the plurality of second groove portions 33b may be different as shown in FIGS. As a result, it is possible to increase the allowable amount of positional deviation between the plurality of first groove portions 33a and the plurality of second groove portions 33b, and to reduce the possibility that the resistor 21 is cut when separated.
さらに、後の工程で電極２２を形成するシート状抵抗体３１の下面３１ｂが広くなるようにし、複数の第２の溝部３３ｂが複数の第１の溝部３３ａよりも細くなるようにすることによって、抵抗体２１への電極２２形成時の許容できる位置ずれ量を増やすことができる。ここで、図４（ｃ）は上面図、図４（ｄ）（ｅ）（ｆ）は、図４（ｃ）のＥ−Ｅ’線断面図である。 Furthermore, by making the lower surface 31b of the sheet-like resistor 31 forming the electrode 22 in a later step wider, and making the plurality of second groove portions 33b narrower than the plurality of first groove portions 33a, It is possible to increase an allowable amount of displacement when the electrode 22 is formed on the resistor 21. Here, FIG. 4C is a top view, and FIGS. 4D, 4E, and 4F are cross-sectional views taken along the line E-E 'of FIG.
次に、図５（ａ）（ｂ）に示すように、シート状抵抗体３１の下面３１ｂにレジスト３５を貼り付け、シート状抵抗体３１の複数の第２の溝部３３ｂ同士の間の部分において島状に開口部を形成した後、Ｃｕめっきをしてレジスト３５を除去する。この結果、隣接する複数の第２の溝部３３ｂ同士の間の部分に等間隔でＣｕめっきからなる複数の電極３６が形成される。 Next, as shown in FIGS. 5A and 5B, a resist 35 is pasted on the lower surface 31 b of the sheet-like resistor 31, and in a portion between the plurality of second groove portions 33 b of the sheet-like resistor 31. After forming the opening in an island shape, Cu plating is performed to remove the resist 35. As a result, a plurality of electrodes 36 made of Cu plating are formed at equal intervals in a portion between a plurality of adjacent second groove portions 33b.
複数の電極３６は、図１、図２に示すチップ抵抗器においては一対の電極２２と対応する。ここで、図５（ａ）は上面図、図５（ｂ）は、図５（ａ）のＦ−Ｆ’線断面図である。 The plurality of electrodes 36 correspond to the pair of electrodes 22 in the chip resistor shown in FIGS. Here, FIG. 5A is a top view, and FIG. 5B is a cross-sectional view taken along the line F-F ′ of FIG.
次に、図５（ｃ）（ｄ）に示すように、シート状抵抗体３１の下面３１ｂ、複数の第２
の溝部３３ｂの内部および複数の電極３６に第２の保護部材３７を形成する。この第２の保護部材３７は、エポキシ樹脂で構成され、複数の電極３６を覆うように形成し、硬化させた後、図６（ａ）（ｂ）に示すように、複数の電極３６が露出するまで研磨する。
Next, as shown in FIGS. 5C and 5D, the lower surface 31b of the sheet-like resistor 31 and a plurality of second
A second protective member 37 is formed inside the groove 33 b and on the plurality of electrodes 36. The second protective member 37 is made of an epoxy resin, and is formed so as to cover the plurality of electrodes 36 and cured, and then the plurality of electrodes 36 are exposed as shown in FIGS. 6 (a) and 6 (b). Polish until finished.
ここで、図５（ｃ）は上面図、図５（ｄ）は、図５（ｃ）のＧ−Ｇ’線断面図、図６（ａ）は上面図、図６（ｂ）は、図６（ａ）のＨ−Ｈ’線断面図である。 5C is a top view, FIG. 5D is a cross-sectional view taken along the line GG ′ of FIG. 5C, FIG. 6A is a top view, and FIG. 6B is a diagram. FIG. 6A is a cross-sectional view taken along line HH ′ of FIG.
次に、図６（ａ）（ｂ）において、複数の第１、第２の溝部３３ａ、３３ｂおよび複数の電極３６の中央部（図の破線部）を切断して個片状に分割する。 Next, in FIGS. 6A and 6B, the plurality of first and second groove portions 33a and 33b and the central portions (broken line portions in the drawing) of the plurality of electrodes 36 are cut and divided into individual pieces.
最後に、個片状に分割されたチップ抵抗器の一対の電極２２の上面から抵抗体２１の端面２１ｃにかけてＮｉめっき、Ｓｎめっきを行い、めっき層２５を形成し、図１、図２に示すような、個片状のチップ抵抗器を得る。 Finally, Ni plating and Sn plating are performed from the upper surface of the pair of electrodes 22 of the chip resistor divided into individual pieces to the end surface 21c of the resistor 21 to form a plating layer 25, which is shown in FIGS. Thus, a piece-like chip resistor is obtained.
（実施の形態２）
以下、本発明の実施の形態２におけるチップ抵抗器の製造方法について図面を参照しながら説明する。
(Embodiment 2)
Hereinafter, the manufacturing method of the chip resistor in Embodiment 2 of this invention is demonstrated, referring drawings.
まず、図７（ａ）（ｂ）に示すように、ＣｕＭｎＮｉ等からなる金属を板状に構成したシート状抵抗体３１を用意し、このシート状抵抗体３１の上面３１ａと下面３１ｂの両方にレジスト３２を貼り付ける。 First, as shown in FIGS. 7A and 7B, a sheet-like resistor 31 is prepared in which a metal made of CuMnNi or the like is formed into a plate shape, and both the upper surface 31a and the lower surface 31b of the sheet-like resistor 31 are prepared. A resist 32 is pasted.
上面のレジスト３２には、シート状抵抗体３１の端部から他方の端部まで連続して延びる直線状で、等間隔で互いに平行な開口部３８ａと、この開口部３８ａと直交するようにシート状抵抗体３１の側部から他方の側部まで連続して延びる直線状で、等間隔で互いに平行な開口部３８ｂを形成する。 The resist 32 on the upper surface is a straight line that extends continuously from one end of the sheet-like resistor 31 to the other end, and is parallel to each other at equal intervals, and a sheet that is orthogonal to the opening 38a. The openings 38b are formed in a straight line extending continuously from the side of the resistor 31 to the other side, and parallel to each other at equal intervals.
このとき、開口部３８ｂは、後工程にてシート状抵抗体３１の下面３１ｂに形成する電極３６の対面となるように形成する。ここで、図７（ａ）は上面図、図７（ｂ）は図７（ａ）のＩ−Ｉ’線断面図である。 At this time, the opening 38b is formed to face the electrode 36 formed on the lower surface 31b of the sheet-like resistor 31 in a later step. Here, FIG. 7A is a top view, and FIG. 7B is a cross-sectional view taken along line I-I ′ of FIG.
次に、図８（ａ）（ｂ）（ｃ）に示すように、シート状抵抗体３１の上面３１ａをエッチングしてシート状抵抗体３１に複数の第１の溝部３３ａ、および複数の第１の溝部３３ａと直交する複数の第３の溝部３３ｃを形成し、その後、レジスト３２を除去する。 Next, as shown in FIGS. 8A, 8 </ b> B, and 8 </ b> C, the upper surface 31 a of the sheet-like resistor 31 is etched to form a plurality of first groove portions 33 a and a plurality of first grooves 31 a. A plurality of third groove portions 33c orthogonal to the groove portions 33a are formed, and then the resist 32 is removed.
ここで、図８（ａ）は上面図、図８（ｂ）は図８（ａ）のＪ−Ｊ’線断面図、図８（ｃ）は斜視図である。 8A is a top view, FIG. 8B is a cross-sectional view taken along line J-J ′ of FIG. 8A, and FIG. 8C is a perspective view.
上記した実施の形態１とは、複数の第１の溝部３３ａと直交する複数の第３の溝部３３ｃを形成した点が異なる。 The difference from Embodiment 1 described above is that a plurality of third groove portions 33c orthogonal to the plurality of first groove portions 33a are formed.
したがって、図６（ａ）（ｂ）に示すように、電極３６の中央部を切断して個片化する際に切断する抵抗体２１の厚みが、複数の第３の溝部３３ｃによって薄くなるため、切断時に形成されるバリを低減することができ、これにより、保護部材剥がれが発生しにくくなる。 Therefore, as shown in FIGS. 6A and 6B, the thickness of the resistor 21 that is cut when the center portion of the electrode 36 is cut into pieces is reduced by the plurality of third groove portions 33c. The burr formed at the time of cutting can be reduced, and thus the protective member is hardly peeled off.
次に、シート状抵抗体３１の上面３１ａと複数の第１の溝部３３ａおよび複数の第３の溝部３３ｃの内部に、同時に第１の保護部材３４を形成する。 Next, the first protective member 34 is simultaneously formed in the upper surface 31a of the sheet-like resistor 31 and the plurality of first groove portions 33a and the plurality of third groove portions 33c.
次に、シート状抵抗体の下面３１ｂにレジストを貼り付け、シート状抵抗体３１の上面
３１ａに形成した第１の溝部３３ａと平面視で同じ位置に、等間隔で互いに平行になるように開口部を形成する。
Next, a resist is affixed to the lower surface 31b of the sheet-like resistor, and the first groove 33a formed on the upper surface 31a of the sheet-like resistor 31 is opened at the same position in a plan view so as to be parallel to each other at equal intervals. Forming part.
そして、図４（ｃ）（ｄ）に示すように、シート状抵抗体３１の下面３１ｂをエッチングして、複数の第１の溝部３３ａと接続する複数の第２の溝部３３ｂを形成する。なお、第１の溝部３３ａ、第２の溝部３３ｂおよび第３の溝部３３ｃをそれぞれダイシングで形成してもよい。 4C and 4D, the lower surface 31b of the sheet resistor 31 is etched to form a plurality of second groove portions 33b connected to the plurality of first groove portions 33a. The first groove portion 33a, the second groove portion 33b, and the third groove portion 33c may be formed by dicing.
このように、シート状抵抗体３１の下面３１ｂと上面３１ａの両方からエッチング（ダイシング）して、第１の溝部３３ａと第２の溝部３３ｂからなる貫通孔をシート状抵抗体３１に形成している。よって、シート状抵抗体３１の厚みが厚くても安定した形状の貫通孔を形成することができる。 In this manner, etching (dicing) is performed from both the lower surface 31b and the upper surface 31a of the sheet-like resistor 31 to form a through-hole including the first groove portion 33a and the second groove portion 33b in the sheet-like resistor 31. Yes. Therefore, a stable through-hole can be formed even if the sheet-like resistor 31 is thick.
また、上述したように第１の保護部材３４をシート状抵抗体３１に形成して強度を強くしているため、支持部を設けることなく複数の第２の溝部３３ｂを安定した状態で形成でき、複数の第２の溝部３３ｂの形成箇所がずれるのを防止できる。 In addition, since the first protective member 34 is formed on the sheet-like resistor 31 to increase the strength as described above, the plurality of second groove portions 33b can be stably formed without providing a support portion. It can prevent that the formation location of the some 2nd groove part 33b shifts | deviates.
このとき、複数の第１の溝部３３ａと複数の第２の溝部３３ｂの幅は図４（ｅ）（ｆ）に示すように異なっていてもよい。これにより、複数の第１の溝部３３ａと複数の第２の溝部３３ｂの許容できる位置ずれ量を増やすことができ、個片化する際に抵抗体２１を切断してしまう可能性を低減できる。 At this time, the widths of the plurality of first groove portions 33a and the plurality of second groove portions 33b may be different as shown in FIGS. As a result, it is possible to increase the allowable amount of positional deviation between the plurality of first groove portions 33a and the plurality of second groove portions 33b, and to reduce the possibility that the resistor 21 is cut when separated.
さらに、後の工程で電極２２を形成するシート状抵抗体３１の下面３１ｂが広くなるようにし、複数の第２の溝部３３ｂが複数の第１の溝部３３ａよりも細くなるようにすることによって、抵抗体２１への電極２２形成時の許容できる位置ずれ量を増やすことができる。ここで、図４（ｃ）は上面図、図４（ｄ）（ｅ）（ｆ）は、図４（ｃ）のＥ−Ｅ’線断面図である。 Furthermore, by making the lower surface 31b of the sheet-like resistor 31 forming the electrode 22 in a later step wider, and making the plurality of second groove portions 33b narrower than the plurality of first groove portions 33a, It is possible to increase an allowable amount of displacement when the electrode 22 is formed on the resistor 21. Here, FIG. 4C is a top view, and FIGS. 4D, 4E, and 4F are cross-sectional views taken along the line E-E 'of FIG.
次に、シート状抵抗体３１の下面３１ｂにレジストを貼り付け、複数の第３の溝部３３ｃと対向する部分に複数の第３の溝部３３ｃと沿い、かつ第２の溝部３３ｂ同士の間の部分に島状に等間隔で開口部を形成した後、Ｃｕめっきをしてレジストを除去する。 Next, a resist is affixed to the lower surface 31b of the sheet-like resistor 31, and a portion between the plurality of third groove portions 33c and a portion between the second groove portions 33b is disposed at a portion facing the plurality of third groove portions 33c. After the openings are formed at regular intervals in an island shape, Cu plating is performed to remove the resist.
この結果、複数の第３の溝部３３ｃに沿うようにＣｕめっきからなる複数の電極３６が形成される。複数の電極３６が形成された箇所は複数の第３の溝部３３ｃによってシート状抵抗体３１の厚みが薄くなっている。 As a result, a plurality of electrodes 36 made of Cu plating are formed along the plurality of third groove portions 33c. In the place where the plurality of electrodes 36 are formed, the thickness of the sheet-like resistor 31 is reduced by the plurality of third grooves 33c.
次に、シート状抵抗体３１の下面３１ｂ、複数の第２の溝部３３ｂの内部および複数の電極３６に第２の保護部材３７を形成する。この第２の保護部材３７は、エポキシ樹脂で構成され、複数の電極３６を覆うように形成し、硬化させた後、図８（ｄ）（ｅ）に示すように、複数の電極３６が露出するまで研磨する。ここで、図８（ｄ）は上面図、図８（ｂ）は図８（ａ）のＪ’’−Ｊ’’’線断面図である。 Next, the second protective member 37 is formed on the lower surface 31 b of the sheet-like resistor 31, the inside of the plurality of second groove portions 33 b, and the plurality of electrodes 36. The second protective member 37 is made of an epoxy resin, and is formed so as to cover the plurality of electrodes 36 and cured, and then the plurality of electrodes 36 are exposed as shown in FIGS. 8D and 8E. Polish until finished. Here, FIG. 8D is a top view, and FIG. 8B is a cross-sectional view taken along the line J ″ -J ″ ″ of FIG.
次に、図８（ｄ）（ｅ）において、複数の第１、第２の溝部３３ａ、３３ｂおよび複数の電極３６の中央部（図の破線部）を切断して個片状に分割する。 Next, in FIGS. 8D and 8E, the plurality of first and second groove portions 33a and 33b and the central portions (broken line portions in the drawing) of the plurality of electrodes 36 are cut and divided into individual pieces.
最後に、個片状に分割されたチップ抵抗器の一対の電極２２の上面から抵抗体２１の端面２１ｃにかけてＮｉめっき、Ｓｎめっきを行い、めっき層１５を形成し、図９、図１０に示すような、個片状のチップ抵抗器を得る。 Finally, Ni plating and Sn plating are performed from the upper surface of the pair of electrodes 22 of the chip resistor divided into individual pieces to the end surface 21c of the resistor 21 to form a plating layer 15, which is shown in FIGS. Thus, a piece-like chip resistor is obtained.
ここで、図９は本発明の実施の形態２におけるチップ抵抗器の断面図、図１０は図９の
Ｋ−Ｋ’断面図である。
Here, FIG. 9 is a sectional view of the chip resistor according to the second embodiment of the present invention, and FIG. 10 is a sectional view taken along the line KK ′ of FIG.
一対の保護膜２３と抵抗体２１との接触面積が増えるため、一対の保護膜２３の密着強度が向上する。 Since the contact area between the pair of protective films 23 and the resistor 21 is increased, the adhesion strength between the pair of protective films 23 is improved.
（実施の形態３）
以下、本発明の実施の形態３におけるチップ抵抗器の製造方法について図面を参照しながら説明する。
(Embodiment 3)
Hereinafter, the manufacturing method of the chip resistor in Embodiment 3 of this invention is demonstrated, referring drawings.
まず、上記図３（ａ）〜（ｄ）に示す工程により、複数の第１の溝部３３ａを有するシート状抵抗体３１を形成する。 First, the sheet-like resistor 31 having a plurality of first groove portions 33a is formed by the steps shown in FIGS. 3 (a) to 3 (d).
次に、図１１（ａ）（ｂ）に示すように、シート状抵抗体３１の両面にレジスト３５を貼り付け、シート状抵抗体３１の上面３１ａの複数の第１の溝部３３ａ間の部分において島状に開口部を形成した後、Ｃｕめっきをしてレジスト３５を除去する。この結果、隣接する複数の第１の溝部３３ａ間の部分に等間隔でＣｕめっきからなる複数の電極３６が形成される。 Next, as shown in FIGS. 11A and 11B, a resist 35 is pasted on both surfaces of the sheet-like resistor 31, and at a portion between the plurality of first groove portions 33 a on the upper surface 31 a of the sheet-like resistor 31. After forming the opening in an island shape, Cu plating is performed to remove the resist 35. As a result, a plurality of electrodes 36 made of Cu plating are formed at equal intervals in a portion between a plurality of adjacent first groove portions 33a.
本発明の実施の形態３では、実施の形態１、２と異なり、複数の電極３６はシート状抵抗体３１の上面３１ａに形成される。 In the third embodiment of the present invention, unlike the first and second embodiments, the plurality of electrodes 36 are formed on the upper surface 31 a of the sheet-like resistor 31.
なお、上記開口部（複数の電極３６）は、第１の溝部３３ａと直接接続しない箇所に設ける。ここで、図１１（ａ）は上面図、図１１（ｂ）は、図１１（ａ）のＬ−Ｌ’線断面図である。 Note that the opening (the plurality of electrodes 36) is provided at a location not directly connected to the first groove 33a. Here, FIG. 11A is a top view, and FIG. 11B is a cross-sectional view taken along line L-L ′ of FIG.
次に、シート状抵抗体３１の上面３１ａ、複数の第１の溝部３３ａの内部および複数の電極３６に第１の保護部材３４を形成する。 Next, the first protective member 34 is formed on the upper surface 31 a of the sheet-like resistor 31, the inside of the plurality of first groove portions 33 a, and the plurality of electrodes 36.
この第１の保護部材３４は、エポキシ樹脂で構成され、複数の電極３６の上面を覆うように形成し、硬化させた後、図１１（ｃ）（ｄ）に示すように、複数の電極３６が露出するまで研磨する。ここで、図１１（ｃ）は上面図、図１１（ｄ）は、図１１（ｃ）のＭ−Ｍ’線断面図である。 The first protective member 34 is made of an epoxy resin, and is formed so as to cover the upper surfaces of the plurality of electrodes 36. After curing, the plurality of electrodes 36 are formed as shown in FIGS. Polish until exposed. Here, FIG. 11C is a top view, and FIG. 11D is a cross-sectional view taken along line M-M ′ of FIG.
次に、シート状抵抗体３１の下面３１ｂにレジストを貼り付け、前記シート状抵抗体３１の上面３１ａに形成した第１の溝部３３ａと同位置に、等間隔で互いに平行になるように開口部を形成し、シート状抵抗体３１の下面３１ｂをエッチングして、図１２（ａ）（ｂ）に示すように、複数の第１の溝部３３ａと接続する複数の第２の溝部３３ｂを形成する。このとき、複数の第１の溝部３３ａと複数の第２の溝部３３ｂの幅は異なっていてもよい。ここで、図１２（ａ）は上面図、図１２（ｂ）は図１２（ａ）のＮ−Ｎ’線断面図である。 Next, a resist is affixed to the lower surface 31b of the sheet-like resistor 31, and openings are formed at the same position as the first groove 33a formed on the upper surface 31a of the sheet-like resistor 31 so as to be parallel to each other at equal intervals. And the lower surface 31b of the sheet-like resistor 31 is etched to form a plurality of second groove portions 33b connected to the plurality of first groove portions 33a as shown in FIGS. . At this time, the widths of the plurality of first groove portions 33a and the plurality of second groove portions 33b may be different. Here, FIG. 12A is a top view, and FIG. 12B is a cross-sectional view taken along line N-N ′ of FIG.
次に、シート状抵抗体３１の下面３１ｂと複数の第２の溝部３３ｂの内部に、同時に第２の保護部材３７を形成する。第２の保護部材３７はエポキシ系樹脂からなるフィルムやプリプレグで、真空ラミネーターや真空熱プレスなどによって流動性が増すものを使用し、そして、シート状抵抗体３１の下面３１ｂに形成するとともに、複数の第２の溝部３３ｂの内部にも充填した後、第２の保護部材３７を硬化させる。 Next, the second protective member 37 is simultaneously formed in the lower surface 31b of the sheet-like resistor 31 and the plurality of second groove portions 33b. The second protective member 37 is a film or prepreg made of an epoxy resin, and has a fluidity increased by a vacuum laminator or a vacuum hot press, and is formed on the lower surface 31b of the sheet-like resistor 31. After filling the inside of the second groove 33b, the second protective member 37 is cured.
次に、複数の第１、第２の溝部３３ａ、３３ｂおよび複数の電極３６の中央部を切断して個片状に分割する。 Next, the central portions of the plurality of first and second groove portions 33a and 33b and the plurality of electrodes 36 are cut and divided into individual pieces.
最後に、個片状に分割されたチップ抵抗器の一対の電極２２の上面から抵抗体２１の端面２１ｃにかけてＮｉめっき、Ｓｎめっきを行い、めっき層１５を形成し、図１、図２に示すような、個片状のチップ抵抗器を得る。 Finally, Ni plating and Sn plating are performed from the upper surface of the pair of electrodes 22 of the chip resistor divided into individual pieces to the end surface 21c of the resistor 21 to form a plating layer 15, which is shown in FIGS. Thus, a piece-like chip resistor is obtained.
上述したように、本発明の実施の形態１〜３におけるチップ抵抗器の製造法は、バー状の金属板を第１の保護部材３４によって固定された状態で形成出来るため、工程間の搬送時や加工時に変形するのを防ぐことが可能となる。また、バー状の金属板は第１の保護部材３４によって固定されるため、支持部を設ける必要がなく、製品部分を増加させ、取数を増やして生産性を向上させることができるという効果が得られる。 As described above, since the chip resistor manufacturing method according to the first to third embodiments of the present invention can be formed in a state where the bar-shaped metal plate is fixed by the first protective member 34, it can be transferred between processes. It is possible to prevent deformation during processing. Further, since the bar-shaped metal plate is fixed by the first protection member 34, there is no need to provide a support portion, and there is an effect that productivity can be improved by increasing the number of products and the number of products. can get.
なお、本発明の実施の形態１〜３におけるチップ抵抗器の製造方法では、適宜抵抗値調整をしてもよい。 In the chip resistor manufacturing method according to the first to third embodiments of the present invention, the resistance value may be adjusted as appropriate.
実施の形態１、２においては、Ｃｕめっきからなる複数の電極３６を形成した後、図１３（ａ）（ｂ）に示すように、複数の電極３６間のシート状抵抗体３１をレーザなどにより切削して抵抗体２１を貫通しないトリミング溝３８を形成する。ここで、図１３（ａ）は上面図、図１３（ｂ）は図１３（ａ）のＯ−Ｏ’線断面図である。 In the first and second embodiments, after forming a plurality of electrodes 36 made of Cu plating, as shown in FIGS. 13A and 13B, the sheet-like resistor 31 between the plurality of electrodes 36 is formed by a laser or the like. A trimming groove 38 that does not penetrate through the resistor 21 is formed by cutting. Here, FIG. 13A is a top view, and FIG. 13B is a cross-sectional view taken along the line O-O ′ of FIG.
実施の形態３においては、シート状抵抗体３１に複数の第２の溝部３３ｂを形成した後、図１４（ａ）（ｂ）に示すように、複数の電極３６同士の間の位置と対向するシート状抵抗体３１の下面３１ｂをレーザなどにより切削して抵抗体２１を貫通しないトリミング溝３８を形成する。ここで、図１４（ａ）は上面図、図１３（ｂ）は図１４（ａ）のＰ−Ｐ’線断面図である。 In the third embodiment, after the plurality of second groove portions 33b are formed in the sheet-like resistor 31, as shown in FIGS. 14 (a) and 14 (b), they face the positions between the plurality of electrodes 36. The lower surface 31b of the sheet-like resistor 31 is cut with a laser or the like to form a trimming groove 38 that does not penetrate the resistor 21. Here, FIG. 14A is a top view, and FIG. 13B is a cross-sectional view taken along the line P-P ′ of FIG.
このとき、隣接する第１、第２の溝部３３ａ、３３ｂへのバリ突出や第１、第２の溝部３３ａ、３３ｂに埋め込まれている第１、第２の保護部材３４、３７の損傷を防ぐため、トリミング溝３８が隣接する複数の第１、第２の溝部３３ａ、３３ｂに接しないようにするのが好ましい。 At this time, burr protrusion to the adjacent first and second groove portions 33a and 33b and damage to the first and second protection members 34 and 37 embedded in the first and second groove portions 33a and 33b are prevented. Therefore, it is preferable that the trimming groove 38 is not in contact with the adjacent first and second groove portions 33a and 33b.
本発明に係るチップ抵抗器の製造方法は、製品歩留を改善するとともに、生産性を向上させることができるという効果を有するものであり、特に各種電子機器に使用される金属板を抵抗体としたチップ抵抗器等に適用することにより有用となるものである。 The chip resistor manufacturing method according to the present invention has an effect of improving product yield and productivity, and in particular, a metal plate used in various electronic devices as a resistor. This is useful when applied to a chip resistor or the like.
３１ シート状抵抗体
３３ａ 第１の溝部
３３ｂ 第２の溝部
３４ 第１の保護部材
３６ 電極
３７ 第２の保護部材
31 sheet-like resistor 33a first groove 33b second groove 34 first protection member 36 electrode 37 second protection member
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022014906A (en) * | 2020-07-07 | 2022-01-20 | 旺詮股▲ふん▼有限公司 | Method for mass-producing miniature resistor |
| JP2022014905A (en) * | 2020-07-07 | 2022-01-20 | 旺詮股▲ふん▼有限公司 | Method for manufacturing miniature resistor |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022014906A (en) * | 2020-07-07 | 2022-01-20 | 旺詮股▲ふん▼有限公司 | Method for mass-producing miniature resistor |
| JP2022014905A (en) * | 2020-07-07 | 2022-01-20 | 旺詮股▲ふん▼有限公司 | Method for manufacturing miniature resistor |
| JP7128940B2 (en) | 2020-07-07 | 2022-08-31 | 旺詮股▲ふん▼有限公司 | Mass production method for miniature resistors |
| JP7227315B2 (en) | 2020-07-07 | 2023-02-21 | 旺詮股▲ふん▼有限公司 | Method for manufacturing miniature resistors |
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