JP2019163760A - Fluid heating component, and fluid heating component composite - Google Patents

Fluid heating component, and fluid heating component composite Download PDF

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JP2019163760A
JP2019163760A JP2019005518A JP2019005518A JP2019163760A JP 2019163760 A JP2019163760 A JP 2019163760A JP 2019005518 A JP2019005518 A JP 2019005518A JP 2019005518 A JP2019005518 A JP 2019005518A JP 2019163760 A JP2019163760 A JP 2019163760A
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fluid heating
heating component
fluid
honeycomb structure
columnar member
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JP7146657B2 (en
JP2019163760A5 (en
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博紀 高橋
Hironori Takahashi
博紀 高橋
弘樹 石田
Hiroki Ishida
弘樹 石田
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NGK Insulators Ltd
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NGK Insulators Ltd
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Priority to US16/296,734 priority Critical patent/US11310873B2/en
Priority to CN201910187017.5A priority patent/CN110307648A/en
Priority to DE102019203792.5A priority patent/DE102019203792A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H9/00—Details
    • F24H9/18—Arrangement or mounting of grates or heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H2250/00—Electrical heat generating means
    • F24H2250/02—Resistances
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H2250/00—Electrical heat generating means
    • F24H2250/08—Induction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2206/00—Aspects relating to heating by electric, magnetic, or electromagnetic fields covered by group H05B6/00
    • H05B2206/02—Induction heating

Abstract

To provide a fluid heating component for enabling efficient heating by an electromagnetic induction heating system and quick heating without being affected by difference of a thermal expansion coefficient.SOLUTION: A fluid heating component 1 includes a ceramic honeycomb structure 2 in which cells 6 with a fluid F circulating are formed, and a conductive coating layer 4 provided on at least a portion of the outer peripheral surface 3 of the honeycomb structure 2. The conductive coating layer 4 covers the whole circumference of a cross section of the honeycomb structure 2 in an electrically connected state in the cross section of the honeycomb structure 2 perpendicular to the circulation direction of the fluid F.SELECTED DRAWING: Figure 1

Description

本発明は、流体加熱部品、及び流体加熱部品複合体に関する。更に詳しくは、ハニカム構造体等のセラミックス部材を用い、電磁誘導加熱方式によって気体や液体等の流体を加熱するための流体加熱部品、及び当該流体加熱部品を組み合わせて形成された流体加熱部品複合体に関する。   The present invention relates to a fluid heating component and a fluid heating component composite. More specifically, a fluid heating part for heating a fluid such as gas or liquid by an electromagnetic induction heating method using a ceramic member such as a honeycomb structure, and a fluid heating part composite formed by combining the fluid heating parts About.

従来、自動車の燃費性能の改善等を目的として、エンジン始動時のフリクション（摩擦）損失の低減や、排ガス浄化用触媒の浄化性能を高めることが行われている。特に、エンジン始動直後は、冷却水やエンジンオイル、及びＡＴＦ（オートマチックトランスミッションフルード）等の液体、或いは排ガス浄化用触媒が冷めた状態にあるため、エンジン性能を十分に発揮できないことがある。そこで、冷却水等の液体を速やかに適温まで加熱させたり、或いは排ガス浄化用触媒を早期に活性化させたりするための加熱システムが採用されている。   2. Description of the Related Art Conventionally, for the purpose of improving the fuel efficiency performance of automobiles, reduction of friction (friction) loss at the time of engine start and improvement of purification performance of an exhaust gas purification catalyst have been performed. In particular, immediately after the engine is started, liquids such as cooling water, engine oil, ATF (automatic transmission fluid), or exhaust gas purifying catalyst are in a cooled state, and therefore engine performance may not be sufficiently exhibited. Therefore, a heating system is employed for quickly heating a liquid such as cooling water to an appropriate temperature or activating the exhaust gas purifying catalyst at an early stage.

加熱システムには、流体（冷却水やエンジンオイル等の液体或いは排気ガス等の気体等）を加熱するために、例えば、高い熱伝導率を有するセラミックス製のハニカム構造体と、抵抗加熱式ヒーター、高周波加熱式ヒーター、或いは燃焼加熱式ヒーター等の加熱体とを備えた流体加熱部品が用いられている（例えば、特許文献１参照）。セラミックス製のハニカム構造体は、隔壁によって区画された複数のセルを有し、当該セルが上記流体の流路となる。複数のセルを備えることで流体との接触面積が大きくなり、加熱体によって発生させた熱を当該流体に対して効率的に伝搬させることができる。   In order to heat a fluid (liquid such as cooling water or engine oil or gas such as exhaust gas), the heating system includes, for example, a ceramic honeycomb structure having high thermal conductivity, a resistance heating heater, A fluid heating component including a heating body such as a high-frequency heating heater or a combustion heating heater is used (see, for example, Patent Document 1). A ceramic honeycomb structure has a plurality of cells partitioned by partition walls, and the cells serve as a flow path for the fluid. By providing a plurality of cells, the contact area with the fluid is increased, and the heat generated by the heating body can be efficiently propagated to the fluid.

一方、電磁誘導加熱方式によって導電性の担体を加熱しながら、ハロゲン化炭化水素ガス等を含む流体を担体内部に流通させることで、ハロゲン化炭化水素を高温で熱分解処理する分解方法が知られている（例えば、特許文献２参照）。これによると、炭化珪素（ＳｉＣ）等のカーボンセラミックスやステンレス鋼等を上記担体のベースとして用い、更に当該担体にハロゲン化炭化水素ガスに対する耐腐食性の高い白金（Ｐｔ）、パラジウム（Ｐｄ）、金（Ａｕ）、ロジウム（Ｒｈ）、及びニッケル（Ｎｉ）の少なくとも一種類の金属元素（第一群元素）、及び、タングステン（Ｗ）、クロム（Ｃｒ）、鉄（Ｆｅ）、モリブデン（Ｍｏ）、及びバナジウム（Ｖ）の少なくとも一種類の金属元素（第二群元素）を触媒として担持したものが使用される。これらの触媒を担持した導電性の担体は、外部に設置された電磁誘導コイルによって生じた渦電流のジュール熱によって加熱され、担体の内部を流通する流体を加熱することができる。   On the other hand, a decomposition method is known in which a halogenated hydrocarbon is pyrolyzed at a high temperature by circulating a fluid containing a halogenated hydrocarbon gas or the like inside the carrier while heating the conductive carrier by electromagnetic induction heating. (For example, refer to Patent Document 2). According to this, carbon ceramics such as silicon carbide (SiC), stainless steel, or the like is used as the base of the carrier, and platinum (Pt), palladium (Pd), palladium (Pd), which has high corrosion resistance against halogenated hydrocarbon gas. At least one metal element (first group element) of gold (Au), rhodium (Rh), and nickel (Ni), tungsten (W), chromium (Cr), iron (Fe), molybdenum (Mo) , And at least one metal element (second group element) of vanadium (V) supported as a catalyst is used. The conductive carrier carrying these catalysts is heated by Joule heat of eddy current generated by the electromagnetic induction coil installed outside, and can heat the fluid flowing through the inside of the carrier.

特開２０１３−２３８１１６号公報JP 2013-238116 A 特開２００１−５４７２３号公報JP 2001-54723 A

しかしながら、上記に示したような流体加熱部品や加熱による流体（ハロゲン化炭化水素ガス）の分解方法は、下記に掲げる不具合を生じる可能性があった。すなわち、特許文献１に示すような流体加熱部品の場合、セラミックス製のハニカム構造体と、主に金属等で構成される加熱体との異なる材質の二つの部材で構成されていた。これにより、ハニカム構造体及び加熱体の間の境界付近での熱抵抗が大きくなり、加熱体によって発生させた熱がハニカム構造体に効率的に伝搬されないことがあった。その結果、加熱効率が低くなるおそれがあった。   However, the fluid heating component and the method for decomposing a fluid (halogenated hydrocarbon gas) by heating as described above may cause the following problems. That is, in the case of a fluid heating component as shown in Patent Document 1, it is composed of two members made of different materials: a ceramic honeycomb structure and a heating body mainly composed of metal or the like. Thereby, the thermal resistance in the vicinity of the boundary between the honeycomb structure and the heating body is increased, and the heat generated by the heating body may not be efficiently transmitted to the honeycomb structure. As a result, the heating efficiency may be lowered.

更に、それぞれ異なる材質でハニカム構造体及び加熱体が形成されているため、加熱時における両者の熱膨張率の違いが問題となることがあった。すなわち、熱膨張率の違いによってハニカム構造体及び加熱体の境界付近に隙間や空隙等が生じる可能性があり、加熱効率がより低くなる可能性があった。特に、比較的大型の流体加熱部品を形成した場合、上記熱膨張率の違いによる不具合が顕著に現れることがあった。   Furthermore, since the honeycomb structure and the heating body are formed of different materials, the difference in thermal expansion coefficient between the two during heating sometimes becomes a problem. That is, there is a possibility that gaps or voids are generated near the boundary between the honeycomb structure and the heating body due to the difference in thermal expansion coefficient, which may lower the heating efficiency. In particular, when a relatively large fluid heating component is formed, a problem due to the difference in the coefficient of thermal expansion may appear remarkably.

一方、特許文献２に示すような導電性の担体を用いるものは、担体として使用されるＳｉＣ自体の電気抵抗が高いため、電磁誘導加熱方式による発熱効率が低く、速やかに担体を所定の温度まで上昇させられないことがあった。その結果、触媒が活性化するまでに時間が必要となるとともに、当該温度まで上昇させるために多くの電気エネルギーが必要となる等のデメリットがあった。   On the other hand, those using a conductive carrier as shown in Patent Document 2 have low heat generation efficiency due to electromagnetic induction heating because the SiC itself used as the carrier has a high electric resistance, and the carrier is quickly brought to a predetermined temperature. Sometimes it could not be raised. As a result, there is a demerit such that it takes time until the catalyst is activated and a lot of electric energy is required to raise the temperature.

そこで、本発明は、上記実情に鑑み、電磁誘導加熱方式による効率的な加熱を可能とするとともに、熱膨張率の違いによる影響を受けることのない、速やかな加熱が可能なセラミックス製の流体加熱部品、及び流体加熱部品複合体の提供を課題とする。   Therefore, in view of the above circumstances, the present invention enables efficient heating by an electromagnetic induction heating method, and is capable of rapid heating without being affected by the difference in thermal expansion coefficient. An object is to provide a component and a fluid heating component composite.

本発明によれば、以下に掲げる流体加熱部品、及び流体加熱部品複合体が提供される。   According to the present invention, the following fluid heating component and fluid heating component composite are provided.

［１］ 流体の流通する流路が形成されたセラミックス製の柱状部材と、前記柱状部材の外周面の少なくとも一部に被設された導電性皮膜層とを具備し、前記導電性皮膜層は、前記流体の流通方向に直交する前記柱状部材の切断面において、電気的に接続した状態で前記柱状部材の切断面全周を被設している流体加熱部品。 [1] A ceramic columnar member in which a fluid flow path is formed, and a conductive coating layer provided on at least a part of the outer peripheral surface of the columnar member, A fluid heating component in which the entire circumference of the cut surface of the columnar member is provided in an electrically connected state on the cut surface of the columnar member orthogonal to the fluid flow direction.

［２］ 前記柱状部材は、一方の端面から他方の端面まで延びる前記流路として形成された複数のセルを区画形成する隔壁を備えたハニカム構造体である前記［１］に記載の流体加熱部品。 [2] The fluid heating component according to [1], wherein the columnar member is a honeycomb structure including a partition wall that partitions and forms a plurality of cells formed as the flow path extending from one end face to the other end face. .

［３］ 前記柱状部材は、緻密質のセラミックスであり、気孔率が０.１％〜１０％の範囲である前記［１］または［２］に記載の流体加熱部品。 [3] The fluid heating component according to [1] or [2], wherein the columnar member is a dense ceramic and has a porosity in a range of 0.1% to 10%.

［４］ 前記柱状部材は、熱伝導率が５０Ｗ／ｍ・Ｋ〜３００Ｗ／ｍ・Ｋの範囲にあるセラミックスである前記［１］〜［３］のいずれかに記載の流体加熱部品。 [4] The fluid heating component according to any one of [1] to [3], wherein the columnar member is a ceramic having a thermal conductivity in a range of 50 W / m · K to 300 W / m · K.

［５］ 前記柱状部材は、炭化珪素、窒化珪素、窒化アルミニウム、酸化マグネシウムから選択される少なくとも１つ以上を主成分とするセラミックスである前記［１］〜［４］のいずれかに記載の流体加熱部品。 [5] The fluid according to any one of [1] to [4], wherein the columnar member is a ceramic mainly including at least one selected from silicon carbide, silicon nitride, aluminum nitride, and magnesium oxide. Heating parts.

［６］ 前記柱状部材は、炭化珪素を主成分とするセラミックスであり、電気抵抗率が０．０１Ωｃｍ〜１０Ωｃｍである前記［１］〜［４］のいずれかに記載の流体加熱部品。 [6] The fluid heating component according to any one of [1] to [4], wherein the columnar member is a ceramic mainly composed of silicon carbide and has an electrical resistivity of 0.01 Ωcm to 10 Ωcm.

［７］ 前記柱状部材は、熱膨張率が０．１ｐｐｍ／Ｋ〜２ｐｐｍ／Ｋのコージェライトを主成分とするセラミックスである前記［１］〜［３］のいずれかに記載の流体加熱部品。 [7] The fluid heating component according to any one of [1] to [3], wherein the columnar member is a ceramic mainly composed of cordierite having a coefficient of thermal expansion of 0.1 ppm / K to 2 ppm / K.

［８］ 前記導電性皮膜層は、層構造を呈し、前記柱状部材の前記表面と接する無電解めっき層と、前記無電解めっき層の上に積層された少なくとも一層以上の誘導加熱層とを備える前記［１］〜［７］のいずれかに記載の流体加熱部品。 [8] The conductive coating layer has a layer structure, and includes an electroless plating layer in contact with the surface of the columnar member, and at least one induction heating layer laminated on the electroless plating layer. The fluid heating component according to any one of [1] to [7].

［９］ 前記導電性皮膜層は、皮膜層厚さが０．１μｍ〜５００μｍの範囲である前記［１］〜［８］のいずれかに記載の流体加熱部品。 [9] The fluid heating component according to any one of [1] to [8], wherein the conductive coating layer has a coating layer thickness in a range of 0.1 μm to 500 μm.

［１０］ 前記［１］〜［９］のいずれかに記載の流体加熱部品を用いて形成され、複数の角柱状の前記流体加熱部品を用いて一体的に構築され、若しくは、少なくとも一つ以上の角柱状の前記流体加熱部品、及び、流体の流通する流路が形成された、一または複数の角柱状のセラミックス製の柱状部材を用いて一体的に構築された流体加熱部品複合体。 [10] The fluid heating component according to any one of [1] to [9] is formed, and is integrally constructed using a plurality of prismatic fluid heating components, or at least one or more. And a fluid heating component composite constructed integrally using one or a plurality of prismatic ceramic columnar members, in which the fluid heating component having a prismatic shape and a flow path through which a fluid flows are formed.

本発明の流体加熱部品、及び流体加熱部品複合体によれば、電磁誘導加熱方式によって流体加熱部品を速やかに、かつ効率的に加熱することができる。その結果、自動車のエンジンの始動直後であっても、排ガス浄化用触媒が活性化する温度まで速やかに加熱することができる加熱システムに当該流体加熱部品を採用することが可能となる。   According to the fluid heating component and the fluid heating component composite of the present invention, the fluid heating component can be quickly and efficiently heated by the electromagnetic induction heating method. As a result, it is possible to employ the fluid heating component in a heating system capable of quickly heating to a temperature at which the exhaust gas purifying catalyst is activated even immediately after starting the automobile engine.

また、本発明の流体加熱部品、及び流体加熱部品複合体を自動車エンジンの排ガス浄化用フィルタに用いる場合には、フィルタに溜まったカーボン微粒子を電磁誘導加熱方式によって燃焼除去を助けることが可能となる。   Further, when the fluid heating component and the fluid heating component composite of the present invention are used for a filter for exhaust gas purification of an automobile engine, it becomes possible to assist the combustion removal of the carbon fine particles accumulated in the filter by an electromagnetic induction heating method. .

特に、セラミックス製の柱状部材（ハニカム構造体等）の少なくとも外周表面に導電性皮膜層が被設され、切断面全周において電気的に接続された状態のため、電磁誘導による効率的な加熱を可能にし、局所的な温度の上昇が生じることがなく、かつ柱状部材と導電性皮膜層等との間の熱膨張率によって、加熱効率が低下したり、クラック等の割れが発生したりする不具合が発生するおそれが小さくなる。   In particular, since a conductive coating layer is provided on at least the outer peripheral surface of a ceramic columnar member (honeycomb structure, etc.) and is electrically connected over the entire cut surface, efficient heating by electromagnetic induction is possible. It is possible that the local temperature does not increase and the thermal expansion coefficient between the columnar member and the conductive film layer decreases the heating efficiency or causes cracks. Is less likely to occur.

本発明の一実施形態の流体加熱部品の概略構成を示す斜視図である。It is a perspective view which shows schematic structure of the fluid heating component of one Embodiment of this invention. 流体加熱部品の概略構成を示す平面図である。It is a top view which shows schematic structure of a fluid heating component. 流体加熱部品の別例構成を示す平面図である。It is a top view which shows another example structure of a fluid heating component. 流体加熱部品の別例構成を示す平面図である。It is a top view which shows another example structure of a fluid heating component. 不適合な流体加熱部品の一例を示す斜視図である。It is a perspective view which shows an example of an incompatible fluid heating component. 不適合な流体加熱部品の一例を示す斜視図である。It is a perspective view which shows an example of an incompatible fluid heating component. 流体加熱部品複合体の概略構成を示す分解斜視図である。It is a disassembled perspective view which shows schematic structure of a fluid heating components composite_body | complex. 図７の流体加熱部品複合体の概略構成を示す斜視図である。It is a perspective view which shows schematic structure of the fluid heating components composite body of FIG. 流体加熱部品複合体の別例の概略構成を示す分解斜視図である。It is a disassembled perspective view which shows schematic structure of another example of a fluid heating components composite_body | complex. 図９の流体加熱部品複合体の概略構成を示す斜視図である。It is a perspective view which shows schematic structure of the fluid heating components composite body of FIG. 誘導加熱試験装置、及び温度測定の概略構成を示す説明図である。It is explanatory drawing which shows schematic structure of an induction heating test apparatus and temperature measurement. ハニカム構造体の隔壁に形成された表面層の概略構成の一例を示す一部拡大端面図である。It is a partially expanded end view which shows an example of schematic structure of the surface layer formed in the partition of a honeycomb structure.

以下、図面を参照しつつ、本発明の流体加熱部品、及び流体加熱部品複合体の実施の形態について説明する。なお、本発明の流体加熱部品、及び流体加熱部品複合体は、以下の実施形態に限定されるものではなく、本発明の範囲を逸脱しない限りにおいて、変更、修正、改良等を加え得るものである。   Hereinafter, embodiments of a fluid heating component and a fluid heating component composite according to the present invention will be described with reference to the drawings. The fluid heating component and fluid heating component composite according to the present invention are not limited to the following embodiments, and can be changed, modified, improved, and the like without departing from the scope of the present invention. is there.

１．流体加熱部品
本発明の一実施形態の流体加熱部品１は、図１及び図２に示すように、セラミックス製のハニカム構造体２と、ハニカム構造体２の少なくとも一部の外周面３（表面）に被設された導電性皮膜層４とを具備するものである。 1. Fluid Heating Component A fluid heating component 1 according to an embodiment of the present invention includes a ceramic honeycomb structure 2 and at least a part of the outer peripheral surface 3 (surface) of the honeycomb structure 2 as shown in FIGS. 1 and 2. And a conductive coating layer 4 disposed on the substrate.

更に、流体Ｆ（図１参照）の流通方向（図２における紙面手前方向から紙面奥行方向に相当）、換言すれば、ハニカム構造体２の軸方向Ａ（図１参照）に直交するハニカム構造体２の切断面において、ハニカム構造体２の外周面３の全周（切断面全周）をリング状に囲み、かつ電気的に接続した状態で導電性皮膜層４が被設されたものである。   Furthermore, the flow direction of the fluid F (see FIG. 1) (corresponding to the depth direction on the paper surface in FIG. 2), in other words, the honeycomb structure perpendicular to the axial direction A (see FIG. 1) of the honeycomb structure 2 2, the conductive coating layer 4 is provided in a state in which the entire circumference (the entire circumference of the cut surface) of the outer peripheral surface 3 of the honeycomb structure 2 is ring-shaped and electrically connected. .

ここで、図２は流体加熱部品１を上方から視た平面図である。更に、外周面３に被設される導電性皮膜層４は、ハニカム構造体２の外周面３の全体に亘って必ずしも被設される必要はなく、外周面３ａの少なくとも一部においてリング状（環状）を呈して電気的に接続された状態であればよい（詳細は後述する）。   Here, FIG. 2 is a plan view of the fluid heating component 1 as viewed from above. Furthermore, the conductive coating layer 4 provided on the outer peripheral surface 3 does not necessarily have to be provided over the entire outer peripheral surface 3 of the honeycomb structure 2, and is formed in a ring shape (at least part of the outer peripheral surface 3 a). It suffices as long as it is in an electrically connected state (details will be described later).

ハニカム構造体２が本発明の流体加熱部品１におけるセラミックス製の柱状部材に相当する。更に具体的に説明すると、ハニカム構造体２は、一方の端面５ａから他方の端面５ｂまで延びる流体Ｆの流路となる複数のセル６を区画形成する格子状の隔壁７を備えた、略円柱状を呈する構造のものである。   The honeycomb structure 2 corresponds to a ceramic columnar member in the fluid heating component 1 of the present invention. More specifically, the honeycomb structure 2 includes a substantially circular partition wall 7 that includes a plurality of lattice-shaped partition walls 7 that define a plurality of cells 6 that serve as flow paths for the fluid F extending from one end surface 5a to the other end surface 5b. It has a columnar structure.

柱状部材としてのハニカム構造体２が、このような構成を備えることで、流体加熱部品１のハニカム構造体２の一方の端面５ａから内部に導入された流体Ｆは、ハニカム構造体２の内部のセル６を通過し、他方の端面５ｂから放出される。なお、本発明の流体加熱部品における柱状部材は、図１等に示した略円柱状のハニカム構造体２に限定されるものではなく、柱状部材の内部に流体Ｆの流路となる構成を備えるものであれば構わない。   Since the honeycomb structure 2 as the columnar member has such a configuration, the fluid F introduced into the inside from one end face 5a of the honeycomb structure 2 of the fluid heating component 1 is contained inside the honeycomb structure 2. It passes through the cell 6 and is emitted from the other end face 5b. Note that the columnar member in the fluid heating component of the present invention is not limited to the substantially cylindrical honeycomb structure 2 shown in FIG. 1 and the like, and has a configuration that becomes a flow path of the fluid F inside the columnar member. Anything can be used.

柱状部材としてのハニカム構造体２は、セラミックスを主成分とすることにより、隔壁７や外周面３の熱伝導率を高くすることができ、効率的な流体Ｆの加熱等を行うことができる。なお、本明細書において、“主成分”とは、柱状部材において５０質量％以上のセラミックスを含むものとして定義し、金属複合セラミックスなども含まれる。   The honeycomb structure 2 as the columnar member can have high thermal conductivity of the partition walls 7 and the outer peripheral surface 3 by using ceramics as a main component, and can efficiently heat the fluid F or the like. In the present specification, the “main component” is defined as including 50% by mass or more of ceramics in the columnar member, and includes metal composite ceramics and the like.

上記セラミックスとしては、周知のコージェライトや炭化珪素等の種々の材料を使用することができる。特に、流体Ｆに対する伝熱性を考慮した場合、高い熱伝導率を有する炭化珪素、窒化珪素、窒化アルミニウム、酸化マグネシウムから選択される少なくとも１つ以上を主成分とすることが好適である。更に、炭化珪素をハニカム構造体２の主成分とすることで、上記熱伝導率以外に、耐熱性及び耐腐食性に優れるといったメリットを有する。   As the ceramic, various materials such as known cordierite and silicon carbide can be used. In particular, in consideration of heat conductivity with respect to the fluid F, it is preferable that at least one selected from silicon carbide, silicon nitride, aluminum nitride, and magnesium oxide having high thermal conductivity be a main component. Furthermore, by using silicon carbide as the main component of the honeycomb structure 2, in addition to the above thermal conductivity, there is an advantage that heat resistance and corrosion resistance are excellent.

更に、ハニカム構造体２を構成する基材の材料としては、Ｓｉ含浸ＳｉＣ、（Ｓｉ＋Ａｌ）含浸ＳｉＣ、金属複合ＳｉＣ、再結晶ＳｉＣ、及びＳｉＣ等を採用することができる。ここで、更に高い熱伝導率を得るために、炭化珪素を主成分とするハニカム構造体２（柱状部材）は、緻密質（または略緻密質）であることが好適である。   Furthermore, Si-impregnated SiC, (Si + Al) -impregnated SiC, metal composite SiC, recrystallized SiC, SiC, and the like can be used as the base material constituting the honeycomb structure 2. Here, in order to obtain a higher thermal conductivity, the honeycomb structure 2 (columnar member) mainly composed of silicon carbide is preferably dense (or substantially dense).

すなわち、ハニカム構造体２の気孔率を０．１％〜１０％以下にすることが好ましく、０．１％〜５％以下することがより好ましく、０．１％〜２％以下にすることが特に好ましい。特に、上記Ｓｉ含浸ＳｉＣや（Ｓｉ＋Ａｌ）含浸ＳｉＣを採用することが好適である。ＳｉＣは、それ自体で高い熱伝導率を有し、かつ放熱しやすい特性を有するが、Ｓｉ含浸ＳｉＣの場合、更に緻密質に形成することができ、高い熱伝導率を持ち、十分な強度を有するハニカム構造体２を得ることができる。本明細書において、気孔率が１０％以下のハニカム構造体（柱状部材）を緻密質のハニカム構造体と定義する。   That is, the porosity of the honeycomb structure 2 is preferably 0.1% to 10%, more preferably 0.1% to 5%, and more preferably 0.1% to 2%. Particularly preferred. In particular, it is preferable to employ the above-described Si-impregnated SiC or (Si + Al) -impregnated SiC. SiC itself has a high thermal conductivity and has a characteristic of easily radiating heat. However, in the case of Si-impregnated SiC, it can be formed more densely, has a high thermal conductivity, and has sufficient strength. A honeycomb structure 2 having the above structure can be obtained. In this specification, a honeycomb structure (columnar member) having a porosity of 10% or less is defined as a dense honeycomb structure.

例えば、一般的な炭化珪素の場合、熱伝導率が２０Ｗ／ｍ・Ｋ程度に対し、気孔率を２％以下とすることにより、１５０Ｗ／ｍ・Ｋ程度にすることができる。なお、上記気孔率は、アルキメデス法により測定したものである。   For example, in the case of general silicon carbide, the thermal conductivity can be about 150 W / m · K by setting the porosity to 2% or less with respect to about 20 W / m · K. The porosity is measured by Archimedes method.

ここで、ハニカム構造体２は、上記熱伝導率が５０Ｗ／ｍ・Ｋ〜３００Ｗ／ｍ・Ｋの範囲であり、更に１００Ｗ／ｍ・Ｋ以上であることが好ましい。より好ましくは、１２０Ｗ／ｍ・Ｋ〜３００Ｗ／ｍ・Ｋ、最も好ましくは、１５０Ｗ／ｍ・Ｋ〜３００Ｗ／ｍ・Ｋのものである。熱伝導率を上記範囲とすることで、熱伝導性が良好なものとなり、効率的にハニカム構造体２の内部に熱を伝達することができ、流体Ｆに対する加熱を速やかに行うことができる。   Here, the honeycomb structure 2 has a thermal conductivity of 50 W / m · K to 300 W / m · K, preferably 100 W / m · K or more. More preferred is 120 W / m · K to 300 W / m · K, and most preferred is 150 W / m · K to 300 W / m · K. By setting the thermal conductivity within the above range, the thermal conductivity becomes good, heat can be efficiently transferred to the inside of the honeycomb structure 2, and the fluid F can be heated quickly.

また、ハニカム構造体２が炭化珪素を主成分とする場合は、電気抵抗率が０．０１Ωｃｍ〜１０Ωｃｍの範囲であり、更に１Ωｃｍ以下であることが好ましい。より好ましくは、０．１Ωｃｍ以下、特に好ましくは０．０５Ωｃｍ以下であることが好ましい。これにより、電磁誘導加熱方式による加熱効率をより高めることができる。   When the honeycomb structure 2 contains silicon carbide as a main component, the electrical resistivity is in the range of 0.01 Ωcm to 10 Ωcm, and preferably 1 Ωcm or less. More preferably, it is 0.1 Ωcm or less, particularly preferably 0.05 Ωcm or less. Thereby, the heating efficiency by an electromagnetic induction heating system can be raised more.

一方、コージェライトを主成分として柱状部材を形成する場合、熱膨張率は０．１ｐｐｍ／Ｋ〜２ｐｐｍ／Ｋであることが好ましい。なお、熱膨張率の測定方法としては、たとえば、流体Ｆの流通方向に沿った１０ｍｍ以上の長さを有する試験片であって、この流通方向に直交する方向を含む断面の面積が１ｍｍ２以上、１００ｍｍ２以下である試験片を柱状部材から切り出し、この試験片の流通方向の熱膨張率を、石英を標準比較サンプルとする示差式の熱膨張計により測定する方法を採用することができる。 On the other hand, when the columnar member is formed using cordierite as a main component, the coefficient of thermal expansion is preferably 0.1 ppm / K to 2 ppm / K. In addition, as a method for measuring the coefficient of thermal expansion, for example, a test piece having a length of 10 mm or more along the flow direction of the fluid F, and an area of a cross section including a direction orthogonal to the flow direction is 1 mm 2 or more. A test piece of 100 mm 2 or less is cut out from the columnar member, and the thermal expansion coefficient in the flow direction of this test piece can be measured by a differential thermal dilatometer using quartz as a standard comparison sample.

ここで、コージェライトを主成分として柱状部材を形成する場合、上記炭化珪素と同様に緻密質（気孔率が１０％以下）のものであることが好適である。この場合、炭化珪素を主成分とするハニカム構造体と比較して、熱伝導率が低くなるものの、熱膨張率を小さく抑えることができ、かつ比熱が小さいために耐熱衝撃性が優れたものにできる。これにより、加熱時における割れ（クラック）の発生を抑えることができ、また比重も小さいため、速やかな昇温が可能となる利点を備えている。   Here, when the columnar member is formed using cordierite as a main component, it is preferable that the columnar member is dense (porosity is 10% or less) as in the case of the silicon carbide. In this case, the thermal conductivity is lower than that of the honeycomb structure mainly composed of silicon carbide, but the thermal expansion coefficient can be kept small and the thermal shock resistance is excellent because the specific heat is small. it can. As a result, the occurrence of cracks during heating can be suppressed, and since the specific gravity is small, there is an advantage that rapid temperature rise is possible.

また、本発明の流体加熱部品におけるハニカム構造体４０は、例えば、隔壁４１の隔壁表面４１ａ及び隔壁４１の細孔の内部に、触媒（図示しない）が担持されたものであってもよい。このように、ハニカム構造体４０は、触媒を担持した触媒担体や、排ガス中の粒状物質（カーボン微粒子）を浄化するために目封止部４４を設けたフィルタ（例えば、ディーゼルパティキュレートフィルタ（以下、「ＤＰＦ」ともいう）、ガソリンパティキュレートフィルタ）として構成されたものであってもよい（図１２参照）。ここで、図１２は、上記ハニカム構造体４０の隔壁４１に形成された表面層４２の概略構成の一例を示す一部拡大端面図である。   In addition, the honeycomb structure 40 in the fluid heating component of the present invention may be a structure in which a catalyst (not shown) is supported inside the partition wall surface 41a of the partition wall 41 and the pores of the partition wall 41, for example. As described above, the honeycomb structure 40 includes a catalyst carrier carrying a catalyst and a filter (for example, a diesel particulate filter (hereinafter, referred to as a diesel particulate filter) provided with a plugging portion 44 for purifying particulate matter (carbon fine particles) in exhaust gas. , Also referred to as “DPF”), or a gasoline particulate filter (see FIG. 12). Here, FIG. 12 is a partially enlarged end view showing an example of a schematic configuration of the surface layer 42 formed on the partition walls 41 of the honeycomb structure 40.

ハニカム構造体４０を自動車用の触媒担体や排ガス浄化フィルタとして用いる場合は、所定のセラミックスを主成分とし、気孔率を３０〜６０％としてもかまわない。３０％未満の気孔率であると、触媒を効率的に担持できなくなり、また、フィルタとしての機能を低下させるため、好ましくない。また、６０％以上の気孔率であると、強度が十分でなく、耐久性が低下するため好ましくない。   When the honeycomb structure 40 is used as a catalyst carrier for automobiles or an exhaust gas purification filter, a predetermined ceramic may be used as a main component, and the porosity may be 30 to 60%. If the porosity is less than 30%, the catalyst cannot be supported efficiently, and the function as a filter is lowered, which is not preferable. Moreover, since the intensity | strength is not enough and durability falls that it is a porosity of 60% or more, it is unpreferable.

更に、ハニカム構造体４０を自動車用の触媒担体や排ガス浄化フィルタとして用いる場合は、その隔壁４１の隔壁表面４１ａの少なくとも一部において、通気性を有する表面層４２を有していてもかまわない。表面層４２の材質は、特に限定するものではなく、セラミックス、金属、ＣＭＣ(セラミックスマトリックスコンポジット）など、必要に応じて適宜材質を選択することができる。   Further, when the honeycomb structure 40 is used as an automobile catalyst carrier or an exhaust gas purification filter, at least a part of the partition wall surface 41a of the partition wall 41 may have a surface layer 42 having air permeability. The material of the surface layer 42 is not particularly limited, and a material such as ceramics, metal, CMC (ceramic matrix composite) or the like can be appropriately selected as necessary.

表面層４２は、単層でも多層でもかまわない。隔壁４１の隔壁表面４１ａに表面層４２を形成する。ここで、通気性を有するとは、表面層４２のパーミアビリティーが、１．０×１０−１３ｍ２以上であることをいう。圧力損失をさらに低減する観点から、パーミアビリティーが、１．０×１０−１２ｍ２以上であることが好ましい。表面層４２が通気性を有することで、表面層４２に起因する圧力損失を抑制することができる。 The surface layer 42 may be a single layer or a multilayer. A surface layer 42 is formed on the partition wall surface 41 a of the partition wall 41. Here, having air permeability means that the permeability of the surface layer 42 is 1.0 × 10 −13 m 2 or more. From the viewpoint of further reducing the pressure loss, the permeability is preferably 1.0 × 10 −12 m 2 or more. Since the surface layer 42 has air permeability, pressure loss due to the surface layer 42 can be suppressed.

また、本明細書において「パーミアビリティー」は、下記数１により算出される物性値をいい、所定のガスがその物（隔壁等）を通過する際の通過抵抗を表す指標となる値である。ここで、下記数１中、Ｃはパーミアビリティー（ｍ２）、Ｆはガス流量（ｃｍ３／ｓ）、Ｔは試料厚み（ｃｍ）、Ｖはガス粘性（ｄｙｎｅｓ・ｓｅｃ／ｃｍ２）、Ｄは試料直径（ｃｍ）、Ｐはガス圧力（ＰＳＩ）を示す。なお、下記数１中の数値は、１３．８３９（ＰＳＩ）＝１（ａｔｍ）であり、６８９４７．６（ｄｙｎｅｓ・ｓｅｃ／ｃｍ２）＝１（ＰＳＩ）である。 Further, in this specification, “permeability” refers to a physical property value calculated by the following formula 1, and is a value serving as an index representing a passage resistance when a predetermined gas passes through the material (such as a partition wall). Here, in the following formula 1, C is permeability (m 2 ), F is gas flow rate (cm 3 / s), T is sample thickness (cm), V is gas viscosity (dynes · sec / cm 2 ), D Indicates the sample diameter (cm), and P indicates the gas pressure (PSI). In addition, the numerical value in the following formula 1 is 13.839 (PSI) = 1 (atm), and 68947.6 (dynes · sec / cm 2 ) = 1 (PSI).

Figure 2019163760
Figure 2019163760

パーミアビリティーを測定する際には、表面層４２つきの隔壁４１を切り出し、この表面層４２つきの状態で、パーミアビリティーを測定した後、表面層４２を削りとった状態でのパーミアビリティー測定を行い、表面層４２と隔壁４１の厚さの比率と、これらのパーミアビリティー測定結果から、表面層４２のパーミアビリティーを算出する。   When measuring the permeability, the partition wall 41 with the surface layer 42 is cut out, the permeability is measured with the surface layer 42, and then the permeability measurement is performed with the surface layer 42 removed. The permeability of the surface layer 42 is calculated from the ratio of the thickness of the layer 42 and the partition wall 41 and the measurement results of these permeabilities.

更に、ハニカム構造体のセルの形状は、特に限定されるものではなく、円形、楕円形、三角形、四角形、及び六角形その他の多角形等の中から任意のものを選択することができる。例えば、図３に示す流体加熱部品１０のように、セル１１を放射状に配したハニカム構造体１２を用い、ハニカム構造体１２の外周面１３に導電性皮膜層１４を形成したものであってもよい。   Furthermore, the shape of the cells of the honeycomb structure is not particularly limited, and an arbitrary shape can be selected from a circle, an ellipse, a triangle, a quadrangle, a hexagon, and other polygons. For example, as in the fluid heating component 10 shown in FIG. 3, a honeycomb structure 12 in which the cells 11 are arranged radially may be used, and the conductive coating layer 14 may be formed on the outer peripheral surface 13 of the honeycomb structure 12. Good.

或いは、図４に示す流体加熱部品２０のように端面形状がドーナツ状のハニカム構造体２１を用いるものであってもよい。この場合、流体加熱部品２０は、ドーナツ状のハニカム構造体２１の外周面２２（表面）及び内周面２３（表面）のいずれにも導電性皮膜層２４が被設されていても良い。或いは、外周面２２（表面）のみ、若しくは内周面２３（表面）のみに導電性皮膜層２４が被設されているものであっても構わない。その他、ハニカム構造体の外形状、外周壁厚さ、内周壁厚さ、セル密度、隔壁の隔壁厚さ、隔壁密度等は任意に設定することができる。   Or you may use the honeycomb structure 21 whose end surface shape is donut shape like the fluid heating component 20 shown in FIG. In this case, the fluid heating component 20 may be provided with the conductive coating layer 24 on both the outer peripheral surface 22 (surface) and the inner peripheral surface 23 (surface) of the doughnut-shaped honeycomb structure 21. Alternatively, the conductive coating layer 24 may be provided only on the outer peripheral surface 22 (surface) or only on the inner peripheral surface 23 (surface). In addition, the outer shape, the outer peripheral wall thickness, the inner peripheral wall thickness, the cell density, the partition wall thickness, the partition wall density, and the like of the honeycomb structure can be arbitrarily set.

ここで、ハニカム構造体１２の外周壁及び内周壁のそれぞれの厚さは、特に限定されるものではないが、例えば、０．１ｍｍ〜３．０ｍｍの範囲が好ましく、０．５〜２．５ｍｍの範囲がより好ましく、０．５ｍｍ〜１．０ｍｍの範囲が更に好ましい。外周壁等の厚さが薄過ぎる場合、構造強度が低くなり易く、使用時の耐久性が低下する等の問題が生じる。一方、外周壁等の厚さが厚過ぎる場合、ハニカム構造体１２の形成時の不具合が生じやすく製造コストが高くなる問題があるとともに、ハニカム構造体１２に対して急激な温度上昇があったり、急激な温度低下があったりする等の熱衝撃に対する耐久性が低下するおそれがある。そのため、外周壁等を上記範囲内に限定してハニカム構造体１２を形成する必要がある。   Here, the thicknesses of the outer peripheral wall and the inner peripheral wall of the honeycomb structure 12 are not particularly limited, but are preferably in the range of 0.1 mm to 3.0 mm, for example, 0.5 to 2.5 mm. Is more preferable, and a range of 0.5 mm to 1.0 mm is more preferable. If the thickness of the outer peripheral wall or the like is too thin, the structural strength tends to be low, and problems such as a decrease in durability during use arise. On the other hand, when the thickness of the outer peripheral wall or the like is too thick, there is a problem that a problem in forming the honeycomb structure 12 is likely to occur and the manufacturing cost is increased, and there is a rapid temperature rise with respect to the honeycomb structure 12; There is a risk that durability against thermal shock such as rapid temperature drop may be reduced. Therefore, it is necessary to form the honeycomb structure 12 by limiting the outer peripheral wall or the like within the above range.

導電性皮膜層４は、ハニカム構造体２の外周面３に対し、例えば、めっき法、溶射法、真空蒸着法、メタライジング法、ＣＶＤ（化学気相蒸着法）、ＰＶＤ（物理気相蒸着法）、及びイオンプレーティング法等の周知の方法により形成することが可能である。皮膜層厚さを均一にし、欠陥のない導電性皮膜層４を形成するために、めっき法或いは溶射法を採用するものが好ましい。これらの方法は、低コストで実施することができるメリットも備えている。   The conductive coating layer 4 is formed on the outer peripheral surface 3 of the honeycomb structure 2 by, for example, plating, spraying, vacuum deposition, metallizing, CVD (chemical vapor deposition), PVD (physical vapor deposition). ) And a known method such as an ion plating method. In order to make the coating layer thickness uniform and to form the conductive coating layer 4 having no defects, it is preferable to employ a plating method or a thermal spraying method. These methods also have a merit that can be implemented at low cost.

導電性皮膜層４を構成する材質は、特に限定されるものではないが、例えば、めっき法の場合は、Ｎｉ，Ｎｉ−Ｐ、Ｎｉ−Ｆｅ、Ｎｉ−Ｗ、Ｎｉ−Ｂ−Ｗ、Ｎｉ−Ｃｏ、Ｎｉ−Ｃｒ，Ｎｉ−Ｃｄ、Ｎｉ−Ｚｎ、Ｃｒ、その他クロメート処理皮膜、Ｃｏ−Ｗ、Ｆｅ−Ｗ、Ｆｅ−Ｃｒ、Ｃｒ−Ｃ、及びＺｎ−Ｆｅ等の周知の材料を組み合わせて用いることができる。   Although the material which comprises the electroconductive film layer 4 is not specifically limited, For example, in the case of the plating method, Ni, Ni-P, Ni-Fe, Ni-W, Ni-BW, Ni- Co, Ni-Cr, Ni-Cd, Ni-Zn, Cr, other chromate-treated films, Co-W, Fe-W, Fe-Cr, Cr-C, and Zn-Fe are used in combination. be able to.

更に、上記以外にもスズ（Ｓｎ）、亜鉛（Ｚｎ）、金（Ａｕ）、銀（Ａｇ）、銅（Ｃｕ）、白金（Ｐｔ）、ロジウム（Ｒｈ）、パラジウム（Ｐｄ）、及びカドミウム（Ｃｄ）等の金属元素を使用することができる。また、必要に応じて炭化物（炭化珪素、炭化タングステン、炭化クロム、炭化硼素等）、酸化物（アルミナ、シリカ、ジルコニア、酸化タングステン、二酸化チタン、二酸化モリブデン等）、黒鉛、窒化硼素、及び各種機能性粒子を複合化させたものであっても構わない。また、必要に応じて、封孔処理を行うことも好ましい形態の一つである。封孔処理を行うことにより、耐熱性、防錆性等を高めることができ、流体加熱部品としての耐久性を向上させることができる。   In addition to the above, tin (Sn), zinc (Zn), gold (Au), silver (Ag), copper (Cu), platinum (Pt), rhodium (Rh), palladium (Pd), and cadmium (Cd ) And the like can be used. In addition, if necessary, carbide (silicon carbide, tungsten carbide, chromium carbide, boron carbide, etc.), oxide (alumina, silica, zirconia, tungsten oxide, titanium dioxide, molybdenum dioxide, etc.), graphite, boron nitride, and various functions It may also be a composite of conductive particles. Moreover, it is also one of the preferable forms to perform a sealing process as needed. By performing the sealing treatment, heat resistance, rust prevention, etc. can be improved, and durability as a fluid heating component can be improved.

一方、溶射法によって導電性皮膜層４を形成する場合、特に限定はないが、例えば、フレーム溶射法、高速フレーム溶射法、アーク溶射法、ガスプラズマ溶射法、水プラズマ溶射法、コールドスプレー法、ＡＤ（エアロゾルデポジション）法等を用いることができる。特に、ガスプラズマ溶射法及び高速フレーム溶射法が好ましく、高速フレーム溶射法が特に好ましい。これらの溶射法は、緻密、かつ酸化の少ない高品質な導電性皮膜層４を形成することが可能であり、電磁誘導加熱方式による加熱を行う場合には好適である。また、めっき法と同様に、必要に応じて、封孔処理を行うことも好ましい形態の一つである。   On the other hand, when the conductive coating layer 4 is formed by a thermal spraying method, there is no particular limitation. For example, flame spraying method, high-speed flame spraying method, arc spraying method, gas plasma spraying method, water plasma spraying method, cold spray method, An AD (aerosol deposition) method or the like can be used. In particular, a gas plasma spraying method and a high-speed flame spraying method are preferable, and a high-speed flame spraying method is particularly preferable. These thermal spraying methods can form a high-quality conductive coating layer 4 that is dense and has little oxidation, and is suitable when heating by an electromagnetic induction heating method. In addition, as with the plating method, it is also a preferable form to perform a sealing treatment as necessary.

ここで、導電性皮膜層４は、既に示したように、流体Ｆの流通方向（ハニカム構造体２の軸方向Ａ）に直交するハニカム構造体２の切断面において、当該ハニカム構造体２の外周面３の全周に沿って少なくとも一部で電気的に接続されている必要がある（図２参照）。上記の通り、本発明の流体加熱部品は、電磁誘導加熱方式によって、外部から加熱されるものであり、流体加熱部品１自体に加熱手段を設けるものではない。   Here, as already shown, the conductive coating layer 4 is formed on the outer periphery of the honeycomb structure 2 on the cut surface of the honeycomb structure 2 perpendicular to the flow direction of the fluid F (the axial direction A of the honeycomb structure 2). It is necessary to be electrically connected at least partially along the entire circumference of the surface 3 (see FIG. 2). As described above, the fluid heating component of the present invention is heated from the outside by the electromagnetic induction heating method, and the fluid heating component 1 itself is not provided with heating means.

そのため、外周面３の全周に沿って電気的に接続されていない（電気的に途切れた）箇所が存在すると、加熱効率が極端に悪化する。所定の温度に加熱するためには、より多くの出力が必要となったり、周波数を大幅に上げる必要が出てくるため、電磁誘導加熱装置が大型にあるいは高価になり、自動車等の車載向けとしては好ましくない。また、当該部位において高いジュール熱が発生し、局所的な加熱や放電が発生したりするなどの不具合を生じる可能性がある。これらの事態を防ぎ、流体加熱部品１の全体において均一な加熱を可能とし、放電の発生を抑えるため、少なくとも一部において外周面３の全周に沿って電気的に接続した状態とされる。   Therefore, if there is a portion that is not electrically connected (electrically interrupted) along the entire circumference of the outer peripheral surface 3, the heating efficiency is extremely deteriorated. In order to heat to a predetermined temperature, more output is required or the frequency needs to be significantly increased, so the electromagnetic induction heating device becomes large or expensive, and is intended for use in vehicles such as automobiles. Is not preferred. In addition, high Joule heat is generated in the part, and there is a possibility of causing problems such as local heating and discharge. In order to prevent these situations, enable uniform heating throughout the fluid heating component 1, and suppress the occurrence of electric discharge, at least a part of the fluid heating component 1 is electrically connected along the entire circumference of the outer peripheral surface 3.

ここで、不適合な流体加熱部品５０ａ，５０ｂの例をそれぞれ図５及び図６に示す。すなわち、図５の場合、円柱状のハニカム構造体５１ａの外周面５２ａに沿って導電性皮膜層５３ａが形成されているものの、外周面５２ａの一部で導電性皮膜層５３ａが途切れ、切断面においてリング状になっていない。すなわち、導電性皮膜層５３ａの間に絶縁部５４ａが形成されている。   Here, examples of incompatible fluid heating components 50a and 50b are shown in FIGS. 5 and 6, respectively. That is, in the case of FIG. 5, although the conductive coating layer 53a is formed along the outer peripheral surface 52a of the cylindrical honeycomb structure 51a, the conductive coating layer 53a is interrupted at a part of the outer peripheral surface 52a, and the cut surface It is not ring-shaped. That is, the insulating part 54a is formed between the conductive coating layers 53a.

一方、図６の場合、角柱状のハニカム構造体５１ｂの外周面５２ｂに沿って導電性皮膜層５３ｂが形成されているものの、ハニカム構造体５１ａと同様に、外周面５２ｂの一部で導電性皮膜層５３ｂが途切れ、切断面においてリング状になっていない。すなわち、導電性皮膜５３ｂの間に絶縁部５４ｂが形成されている。このような場合、電磁誘導加熱方式による加熱では、流体加熱部品５０ａ，５０ｂにおける加熱時の電磁誘導の効率が大幅に悪化するため、より大きな電力が必要となり、速やかな加熱をすることができなくなる。また、温度分布に局所的な偏向が生じる場合があり、流体加熱部品５０ａ，５０ｂの全体を均一に加熱することができなくなる。   On the other hand, in the case of FIG. 6, although the conductive coating layer 53b is formed along the outer peripheral surface 52b of the prismatic honeycomb structure 51b, the conductive film layer 53b is electrically conductive at a part of the outer peripheral surface 52b as in the honeycomb structure 51a. The coating layer 53b is interrupted and is not ring-shaped on the cut surface. That is, the insulating part 54b is formed between the conductive films 53b. In such a case, in the heating by the electromagnetic induction heating method, the efficiency of electromagnetic induction at the time of heating in the fluid heating components 50a and 50b is greatly deteriorated, so that a larger amount of electric power is required and rapid heating cannot be performed. . In addition, local deflection may occur in the temperature distribution, and the entire fluid heating component 50a, 50b cannot be heated uniformly.

導電性皮膜層４は、多層構造を呈するものであっても構わない。すなわち、柱状部材としてのハニカム構造体２の外周面３に当接する当接層（最下層）と、当該当接層の上に少なくとも一層以上が積層した積重層とで構成されるものであっても構わない。なお、上記当接層は、ハニカム構造体２の外周面３（柱状部材の表面）との接着性を良好とするため、セラミックス材料との相性がよい、熱膨張率が小さく、低硬度、かつ高温で基材となるセラミックス材料（炭化珪素やコージェライト等）と反応しない材質であることが特に好適である。   The conductive coating layer 4 may have a multilayer structure. That is, it is composed of a contact layer (lowermost layer) that contacts the outer peripheral surface 3 of the honeycomb structure 2 as a columnar member, and a stacked layer in which at least one layer is stacked on the contact layer. It doesn't matter. The contact layer has good adhesion to the outer peripheral surface 3 (the surface of the columnar member) of the honeycomb structure 2 and therefore has good compatibility with the ceramic material, has a low coefficient of thermal expansion, low hardness, and A material that does not react with a ceramic material (such as silicon carbide or cordierite) that is a base material at a high temperature is particularly preferable.

上記当接層がめっき法による皮膜の場合は、無電解めっき法による無電解めっき層であるものが好ましく、炭化物（炭化珪素、炭化タングステン、炭化クロム、炭化硼素等）、酸化物（アルミナ、シリカ、ジルコニア、酸化タングステン、二酸化チタン、二酸化モリブデン等）、黒鉛、窒化硼素、及び各種機能性粒子を複合化させたものであることも、好ましい形態の一つである。複合化させることで、熱膨張率が小さくセラミックスとの相性がよい当接層とすることが可能となる。   When the contact layer is a film formed by a plating method, an electroless plating layer formed by an electroless plating method is preferable, and a carbide (silicon carbide, tungsten carbide, chromium carbide, boron carbide, etc.), oxide (alumina, silica) Zirconia, tungsten oxide, titanium dioxide, molybdenum dioxide, etc.), graphite, boron nitride, and a combination of various functional particles are also one of preferred embodiments. By making it composite, it is possible to obtain a contact layer having a low coefficient of thermal expansion and good compatibility with ceramics.

一方、上記当接層（最下層）に積層される積重層は、それぞれ導電性皮膜層４に求められる特性に特化した材質であっても構わない。例えば、電磁誘導加熱を行うために強磁性体の材料で形成された誘導加熱層を少なくとも有するとともに、更に誘導加熱層の上に積重され、耐熱性や耐熱衝撃性、耐腐食性に優れたＣｒ、Ｓｉ、Ａｌ、Ｎｉ、Ｗ、Ｂ、Ａｕ、Ｒｄ、ＰＤ、Ｐｔのうち、少なくとも一種類の金属元素が含有している耐熱層とを備えるものであっても構わない。これにより、導電性皮膜層の全体で、柱状部材との接着性、加熱性、及び耐熱性等の優れた効果を奏することができる。なお、図１〜図１０において、図示を簡略化するため、導電性皮膜層４等はそれぞれ単層で示している。   On the other hand, the stacked layers laminated on the contact layer (lowermost layer) may be made of materials specialized in the characteristics required for the conductive coating layer 4. For example, it has at least an induction heating layer formed of a ferromagnetic material for electromagnetic induction heating, and is further stacked on the induction heating layer, and has excellent heat resistance, thermal shock resistance, and corrosion resistance. It may be provided with a heat-resistant layer containing at least one kind of metal element among Cr, Si, Al, Ni, W, B, Au, Rd, PD, and Pt. Thereby, with the whole electroconductive coating layer, there can exist excellent effects, such as adhesiveness with a columnar member, heat property, and heat resistance. 1 to 10, the conductive coating layer 4 and the like are each shown as a single layer in order to simplify the illustration.

導電性皮膜層４は、皮膜層厚さが０．１μｍ〜５００μｍ、更に好ましくは０．３μｍ〜４００μｍであり、より好ましくは０．５μｍ〜２００μｍであり、特に０．５μｍ〜１００μｍが好適なものである。導電性皮膜層４の皮膜層厚さを上記範囲内とすることで、ハニカム構造体２との間の熱膨張率の違いによる、外周面３からの剥離やハニカム構造体２の割れを抑えることができ、効率的な加熱が可能になる。皮膜層厚さが薄すぎると電磁誘導加熱方式による加熱効率が著しく低下する問題が生じ、また、皮膜形成時に欠陥が生じやすく、耐熱性、耐食性、導電性を維持することが難しくなる。また、皮膜層厚さが厚すぎると、必要以上に熱容量が増加し抵抗も下がるため、加熱効率や加熱速度が悪化する場合がある。そのため、導電性皮膜層４の皮膜層厚さは、上記範囲内が好適なものとなる。この場合、上述した多層構造の導電性皮膜層であっても皮膜層厚さは、上記範囲内である必要がある。   The conductive coating layer 4 has a coating layer thickness of 0.1 μm to 500 μm, more preferably 0.3 μm to 400 μm, more preferably 0.5 μm to 200 μm, and particularly preferably 0.5 μm to 100 μm. It is. By setting the thickness of the conductive coating layer 4 within the above range, peeling from the outer peripheral surface 3 and cracking of the honeycomb structure 2 due to a difference in thermal expansion coefficient with the honeycomb structure 2 can be suppressed. And efficient heating becomes possible. When the film layer thickness is too thin, there arises a problem that the heating efficiency by the electromagnetic induction heating method is remarkably lowered, and defects are easily generated at the time of film formation, and it becomes difficult to maintain heat resistance, corrosion resistance, and conductivity. On the other hand, if the film layer thickness is too thick, the heat capacity is increased more than necessary and the resistance is lowered, so that the heating efficiency and the heating rate may be deteriorated. Therefore, the film thickness of the conductive film layer 4 is preferably within the above range. In this case, the thickness of the coating layer needs to be within the above range even in the case of the conductive coating layer having the multilayer structure described above.

２．流体加熱部品複合体
上記のように構成された本発明の流動加熱部品を複数組み合わせることで一体的に構築された流体加熱部品複合体３０ａ，３０ｂを形成することができる。ここで、図７は流体加熱部品複合体３０ａの構築前の状態を示す分解斜視図であり、図８は流体加熱部品複合体３０ａの構築後の概略構成を示す斜視図であり、図９は別例構成の流体加熱部品複合体３０ｂの構築前の状態を示す分解斜視図であり、図１０は図９の流体加熱部品複合体３０ｂの構築後の概略構成を示す斜視図である。 2. Fluid Heating Component Composites The fluid heating component composites 30a and 30b constructed integrally can be formed by combining a plurality of fluid heating components of the present invention configured as described above. Here, FIG. 7 is an exploded perspective view showing a state before the construction of the fluid heating component composite 30a, FIG. 8 is a perspective view showing a schematic configuration after construction of the fluid heating component composite 30a, and FIG. FIG. 10 is an exploded perspective view showing a state before the construction of the fluid heating component composite body 30b of another example configuration, and FIG. 10 is a perspective view showing a schematic configuration after construction of the fluid heating part composite body 30b of FIG.

流体加熱部品複合体３０ａは、図７及び図８に示すように、角柱状のハニカム構造体３１と、ハニカム構造体３１の外周面３２に沿って被設された導電性皮膜層３３とを具備する複数の流体加熱部品３４を組み合わせて構成されたものである。   As shown in FIGS. 7 and 8, the fluid heating component composite 30 a includes a prismatic honeycomb structure 31 and a conductive coating layer 33 provided along the outer peripheral surface 32 of the honeycomb structure 31. The plurality of fluid heating components 34 are combined.

すなわち、同じ形状の９つの流体加熱部品３４が使用され、互いの導電性皮膜層３３を相対させるようにして、縦３つ×横３つに組み合わせたものである。なお、流体加熱部品３４の接合は、セラミックス材料同士を接合する際の周知の接着剤等を用いるため、ここでは詳細な説明は省略する。これにより、大型自動車や工作機械等のシステムに用いることのできる流体加熱部品複合体が形成される。この場合であっても、流体Ｆの流通方向に直交する切断面において、導電性皮膜層３３が電気的に接続されている。   That is, nine fluid heating components 34 having the same shape are used, and the conductive coating layers 33 are combined with each other so that the length is 3 × 3. In addition, since the well-known adhesive agent etc. at the time of joining ceramic materials are used for joining of fluid heating component 34, detailed explanation is omitted here. This forms a fluid heating component composite that can be used in systems such as large automobiles and machine tools. Even in this case, the conductive coating layer 33 is electrically connected to the cut surface perpendicular to the flow direction of the fluid F.

更に、図９及び図１０に示す別例構成の流体加熱部品複合体３０ｂを構成するものであっても構わない。別例構成の流体加熱部品複合体３０ｂは、５つの角柱状の流体加熱部品３４と、導電性皮膜層３３を有しない４つの角柱状のハニカム構造体３５とを交互に配し、縦３つ×横３つに組み合わせたものである。この場合でも電磁誘導加熱方式によって流体Ｆを効率的に加熱することができる。なお、図７及び図８において示した流体加熱部品複合体３０ａと同一の構成については、同一番号を付し、説明を省略する。   Furthermore, you may comprise the fluid heating components composite body 30b of another example structure shown in FIG.9 and FIG.10. In another example of the fluid heating component composite 30 b, five prismatic fluid heating components 34 and four prismatic honeycomb structures 35 that do not have the conductive coating layer 33 are alternately arranged to form three vertical components. × Combined in three horizontal. Even in this case, the fluid F can be efficiently heated by the electromagnetic induction heating method. In addition, about the same structure as the fluid heating components composite body 30a shown in FIG.7 and FIG.8, the same number is attached | subjected and description is abbreviate | omitted.

（１）ハニカム構造体
ＳｉＣを主成分とするハニカム構造体の製造を行った。始めに、所定の粒度、調合量に調整したＳｉＣ粉末、バインダー、水又は有機溶剤などを混練した成形用原料を、所望の形状に押出成形し、乾燥させてハニカム成形体を得た後、適宜加工を加えて、高温でＳｉ含浸焼成を行い、ハニカム構造体を得た。ここで、ハニカム構造体は、ハニカム径が４３ｍｍ、軸方向のハニカム長さが２３ｍｍのサイズのものを用いた。ここで、Ｓｉ含浸焼成の含浸比率等を変更することにより、実施例１ではハニカム構造体の気孔率が１０％以下になるように調整した。同様に、実施例２〜６、及び比較例１，２では、ハニカム構造体の気孔率が５％以下、実施例１２ではハニカム構造体の気孔率が１０％以上となるように調整を行った。実施例７〜１２については、実施例１〜６のハニカムと同様の条件で焼成したものを準備し、ハニカム径が４０ｍｍになるように外周壁を研削加工し、実施例１〜６と比べて外周壁の薄いハニカム構造体を準備した。外周壁厚さは、測定顕微鏡を用いて計１６か所の測定を行い、平均した値を外周壁厚さとした。すなわち、実施例１２を除き、流体加熱部品のベースとなるハニカム構造体（柱状部材）は、緻密質のものである。 (1) Honeycomb structure A honeycomb structure mainly composed of SiC was manufactured. First, a forming raw material kneaded with SiC powder, a binder, water, an organic solvent, or the like adjusted to a predetermined particle size and blending amount is extruded into a desired shape and dried to obtain a honeycomb formed body. Processing was performed, and Si impregnation firing was performed at a high temperature to obtain a honeycomb structure. Here, a honeycomb structure having a honeycomb diameter of 43 mm and an axial honeycomb length of 23 mm was used. Here, in Example 1, the porosity of the honeycomb structure was adjusted to 10% or less by changing the impregnation ratio of the Si impregnation firing. Similarly, in Examples 2 to 6 and Comparative Examples 1 and 2, adjustment was performed so that the porosity of the honeycomb structure was 5% or less, and in Example 12, the porosity of the honeycomb structure was 10% or more. . About Examples 7-12, what was baked on the conditions similar to the honeycomb of Examples 1-6 was prepared, the outer peripheral wall was ground so that a honeycomb diameter might be 40 mm, and compared with Examples 1-6 A honeycomb structure with a thin outer peripheral wall was prepared. The outer peripheral wall thickness was measured at a total of 16 locations using a measuring microscope, and the average value was taken as the outer peripheral wall thickness. That is, except for Example 12, the honeycomb structure (columnar member) serving as the base of the fluid heating component is dense.

（２）流体加熱部品の製造（導電性皮膜層の形成）
上記（１）によって得られたハニカム構造体の外周面に対し、導電性皮膜層を形成した。ここで、実施例１〜３及び７〜１２は、導電性皮膜層として銅（Ｃｕ）めっきを施したものであり、以下、実施例４はＮｉ−Ｂめっき、実施例５はＮｉ溶射、実施例６はＭｏ溶射を行ったものである。なお、それぞれのめっき法及び溶射法は周知のものであるため、ここでは説明を省略する。 (2) Manufacture of fluid heating parts (formation of conductive coating layer)
A conductive coating layer was formed on the outer peripheral surface of the honeycomb structure obtained by the above (1). Here, Examples 1 to 3 and 7 to 12 are obtained by performing copper (Cu) plating as the conductive coating layer. Hereinafter, Example 4 is Ni-B plating, Example 5 is Ni spraying, and Example 5 is performed. In Example 6, Mo was sprayed. In addition, since each plating method and thermal spraying method are well-known, description is abbreviate | omitted here.

一方、比較例１は、導電性皮膜層を形成しないハニカム構造体のままのものであり、比較例２はＣｕメッキであり、かつ、ハニカム構造体の外周面の一部に絶縁部を設け、電気的に接続されていない状態にしたものである。すなわち、外周面に部分的に導電性皮膜層を施したものである。実施例１〜１２、及び比較例２における各導電性皮膜層の皮膜層厚さをまとめたものを下記表１にそれぞれ示す。   On the other hand, Comparative Example 1 is a honeycomb structure that does not form a conductive coating layer, Comparative Example 2 is Cu plating, and an insulating portion is provided on a part of the outer peripheral surface of the honeycomb structure. It is in a state where it is not electrically connected. That is, the outer peripheral surface is partially provided with a conductive coating layer. Table 1 below summarizes the film thicknesses of the respective conductive film layers in Examples 1 to 12 and Comparative Example 2.

（３）誘導加熱試験
図１１に示す概略構成を示す誘導加熱試験装置１００を用い、流体加熱部品としてのハニカム構造体の誘導加熱試験を実施した。ここで、誘導加熱試験装置１００は、高周波を発生させる高周波電源装置１０１と、フィーダーダクト１０２を通して高周波電源装置１０１と電気的に接続されたフレキフィーダー１０３と、フレキフィーダー１０３の一端と接続された加熱コイル１０４と、加熱コイル１０４の周囲に配されたケーシング１０５と、加熱コイル１０４の内部に収容されたハニカム構造体１０６（流体加熱部品）の上方に配置され、加熱コイル１０４による誘導加熱時におけるハニカム構造体１０６の温度（一方の端面１０６ａの温度）を非接触で測定するサーモカメラ１０７とを具備している。ここで、サーモカメラ１０７は、熱画像カメラとも呼ばれ、例えば、ＣＨＩＮＯ製のＣＰＡ−２３００等を使用することができる。 (3) Induction heating test An induction heating test of a honeycomb structure as a fluid heating component was performed using an induction heating test apparatus 100 having a schematic configuration shown in FIG. Here, the induction heating test apparatus 100 includes a high-frequency power supply apparatus 101 that generates a high frequency, a flexible feeder 103 that is electrically connected to the high-frequency power supply apparatus 101 through a feeder duct 102, and a heating that is connected to one end of the flexible feeder 103. The coil 104, the casing 105 disposed around the heating coil 104, and the honeycomb structure 106 (fluid heating component) accommodated inside the heating coil 104 are disposed above the honeycomb structure 106 during induction heating by the heating coil 104. A thermo camera 107 that measures the temperature of the structure 106 (the temperature of one end face 106a) in a non-contact manner is provided. Here, the thermo camera 107 is also called a thermal image camera, and for example, CPA-2300 manufactured by CHINO or the like can be used.

誘導加熱試験は、始めに誘導加熱試験装置１００の加熱コイル１０４の内部の空間に試験対象のハニカム構造体１０６を配置した状態で、高周波電源装置１０１から高周波電流を発生させ、フィーダーダクト１０２及びフレキフィーダー１０３を介して高周波電源装置１０１と接続された加熱コイル１０４に高周波電流を流す。これにより、加熱コイル１０４において高周波磁束が発生する。発生した高周波磁束の中に設置されたハニカム構造体１０６は電流を誘導し、加熱される。本実施例では、高周波電源装置１０１は、最大出力４０ｋＷ、周波数３０ｋＨｚであり、出力制御の範囲を１０％〜１００％の範囲で調整した。なお、加熱コイル１０４は、銅製パイプを用いたコイルの内径ＩＤがφ８０ｍｍであり、コイル長さＬが２００ｍｍの円形コイルを用いて構成されている。なお、加熱コイル１０４の銅製パイプのパイプ内部には、冷却水を流している。なお、加熱コイル１０４の内部への冷却水の供給の詳細はここでは説明を省略する。   In the induction heating test, first, a high frequency current is generated from the high frequency power supply device 101 in a state where the honeycomb structure 106 to be tested is arranged in the space inside the heating coil 104 of the induction heating test device 100, and the feeder duct 102 and the flexible cable are connected. A high frequency current is passed through the heating coil 104 connected to the high frequency power supply device 101 via the feeder 103. Thereby, a high frequency magnetic flux is generated in the heating coil 104. The honeycomb structure 106 installed in the generated high-frequency magnetic flux induces an electric current and is heated. In the present embodiment, the high-frequency power supply device 101 has a maximum output of 40 kW and a frequency of 30 kHz, and the output control range was adjusted in the range of 10% to 100%. The heating coil 104 is configured by using a circular coil having a coil inner diameter ID of φ80 mm and a coil length L of 200 mm using a copper pipe. Note that cooling water is flowing inside the copper pipe of the heating coil 104. The details of the supply of cooling water to the inside of the heating coil 104 are omitted here.

（４）温度の測定方法
上記の誘導加熱試験装置１００を用いた誘導加熱試験の際に、加熱コイル１０４の上方に設置されたサーモカメラ１０７によってハニカム構造体１０６の一方の端面１０６ａの温度を平面的に測定し、測定された一方の端面１０６ａにおける最も低い（中央位置の）温度を測定温度とした。 (4) Temperature measurement method In the induction heating test using the induction heating test apparatus 100 described above, the temperature of one end face 106a of the honeycomb structure 106 is flattened by the thermo camera 107 installed above the heating coil 104. The measured temperature was the lowest (center position) temperature at one end face 106a.

（５）実験条件
高周波電源装置１０１による高周波電流の出力を１０％〜１００％の間で任意の出力値に設定した後、上記（４）に示した手法でサーモカメラ１０７によって加熱速度を測定した。ここで、加熱コイル１０４に高周波電流を出力した際の誘導加熱出力（ｋW）は、高周波電源装置１０１に搭載されている電圧計、及び電流計（図示しない）の数値から算出した。更に、高周波電流の出力を開始してから、ハニカム構造体１０６の測定温度が３００℃に到達するまでの到達時間を測定し、これを“経過時間”とした。なお、３００℃に達するまでの時間が６０ｓ以上の場合や、昇温が途中で止まる場合には、その時点における到達温度及び経過時間を記録した。 (5) Experimental conditions After setting the output of the high-frequency current from the high-frequency power supply device 101 to an arbitrary output value between 10% and 100%, the heating rate was measured by the thermo camera 107 by the method shown in (4) above. . Here, the induction heating output (kW) when a high-frequency current was output to the heating coil 104 was calculated from numerical values of a voltmeter and an ammeter (not shown) mounted on the high-frequency power supply device 101. Furthermore, the arrival time from when the output of the high-frequency current was started until the measurement temperature of the honeycomb structure 106 reached 300 ° C. was measured, and this was defined as “elapsed time”. In addition, when the time to reach 300 ° C. was 60 seconds or more, or when the temperature increase stopped halfway, the temperature reached and the elapsed time at that time were recorded.

（６）誘導加熱試験後の液体加熱部品の外観変化の評価
上記（３）による誘導加熱試験後の流体加熱部品の外観の変化、特にハニカム構造体の割れの発生の有無を目視により確認した。割れがないものを“Ａ”、誘導加熱の継続が不可能なレベルの割れがあるものを“Ｃ”、誘導加熱の継続が可能なレベルの微小なクラックについては“Ｂ”と評価した。総合評価としては、３００℃に到達するまでの時間が３０ｓ未満で、かつ割れがないものを“Ａ”、３００℃に到達するまでの時間が３０ｓ未満であるものの、微小なクラックが発生したものを“Ｂ”、及び３００℃に到達するまでの時間が３０ｓ以上、若しくは誘導加熱の継続が不可能なレベルの割れがあるものを“Ｃ”とした。上記（３）〜（５）の試験結果、割れの有無、及び総合評価の結果をまとめたものを下記表１に示す。 (6) Evaluation of appearance change of liquid heating component after induction heating test The appearance change of the fluid heating component after the induction heating test according to the above (3), particularly the presence or absence of cracking of the honeycomb structure was visually confirmed. “A” indicates that there is no crack, “C” indicates that there is a crack at a level at which induction heating cannot be continued, and “B” indicates a micro crack at a level at which induction heating can continue. Comprehensive evaluation is “A” when the time to reach 300 ° C. is less than 30 s and there is no crack, and the time until it reaches 300 ° C. is less than 30 s, but a minute crack has occurred “B” and the time until reaching 300 ° C. was 30 s or more, or “C” was a crack having a level at which induction heating cannot be continued. Table 1 below summarizes the test results (3) to (5) above, the presence or absence of cracks, and the results of comprehensive evaluation.

Figure 2019163760
Figure 2019163760

（７）まとめ
表１に示されるように、本願発明の要件を満たす実施例１〜１２は、誘導加熱試験において、加熱開始からの経過時間がいずれも３０ｓ以内で３００℃まで到達することができる。更に、その際のハニカム構造体に誘導加熱の継続が不可能なレベルの割れが生じることがない、総合評価が“Ａ”または“Ｂ”のものである。そのため、排ガス浄化用触媒の加熱システムの一部として使用されることにより、エンジン始動直後から触媒を活性化させることができ、燃費の改善に大きな効果を奏することが期待される。 (7) Summary As shown in Table 1, Examples 1 to 12 satisfying the requirements of the present invention can reach 300 ° C. within 30 s in the elapsed time from the start of heating in the induction heating test. . Furthermore, the overall evaluation is “A” or “B” so that the honeycomb structure does not have cracks at a level where induction heating cannot be continued. Therefore, by using it as a part of the heating system for the exhaust gas purifying catalyst, the catalyst can be activated immediately after the engine is started, and it is expected to have a great effect on improving the fuel consumption.

なお、実施例１〜６の流動加熱部品においては、ハニカム構造体の外周面に形成される導電性皮膜層の金属種類及び形成方法については、特に大きな有意性は認められず、本願発明の規定した範囲であれば良好な結果を得ることが確認された。また、外周壁の薄い実施例７〜１２の流動加熱部品においても良好な結果が得られることを確認し、実施例１〜６と比べて、より大きな加熱速度においても割れを生じずに加熱が可能であることが確認された。   In addition, in the fluid heating parts of Examples 1 to 6, the metal type and the forming method of the conductive coating layer formed on the outer peripheral surface of the honeycomb structure are not particularly significant, and the provisions of the present invention are not specified. It was confirmed that good results were obtained within the above range. Moreover, it confirmed that a favorable result was obtained also in the fluid heating parts of Examples 7-12 with a thin outer peripheral wall, and compared with Examples 1-6, heating did not produce a crack even at a larger heating rate. It was confirmed that it was possible.

一方、導電性皮膜層を有しない流動加熱部品（比較例１）、及び、流体の流通方向に直交するハニカム構造体の切断面において、電気的に接続した状態でハニカム構造体の切断面全周を被設していない流動加熱部品（比較例２）は、いずれも加熱速度が遅く、誘導加熱試験による加熱開始から３００℃に到達するまでの経過時間が１００ｓ必要であったり（比較例１）、または１１５ｓを経過して、ようやく１００℃に到達するもの（比較例２）であり、速やかな加熱や昇温ができないことが示された。そのため、燃費改善のための加熱システムに採用することが困難であることが確認された。   On the other hand, in the fluid heating component (Comparative Example 1) that does not have the conductive coating layer and the cut surface of the honeycomb structure perpendicular to the fluid flow direction, the entire circumference of the cut surface of the honeycomb structure in an electrically connected state The fluid heating parts (Comparative Example 2) that are not provided with a low heating rate are both slow, and an elapsed time from the start of heating by the induction heating test to reach 300 ° C. is required for 100 seconds (Comparative Example 1) Or after 115 s, it finally reached 100 ° C. (Comparative Example 2), and it was shown that rapid heating and temperature increase were not possible. Therefore, it was confirmed that it was difficult to employ in a heating system for improving fuel consumption.

更に、実施例１２に示すように、ハニカム構造体の気孔率が他の実施例よりも高い場合（＝１２．０％）は、誘導加熱試験においてクラックが発生し易いことが示された。但し、比較的軽微なものであり実用上の問題はほとんどない。そのため、本願発明において柱状部材は、気孔率が１０％以下の緻密質のセラミックス材料を使用することが特に好適であることが確認された。   Furthermore, as shown in Example 12, when the porosity of the honeycomb structure was higher than that of the other examples (= 12.0%), it was shown that cracks are likely to occur in the induction heating test. However, it is relatively minor and has few practical problems. Therefore, in the present invention, it was confirmed that the columnar member is particularly suitable to use a dense ceramic material having a porosity of 10% or less.

本発明の流体加熱部品、及び流体加熱部品複合体は、自動車の燃費改善のための排ガス浄化用触媒を加熱するための加熱システム等に使用することができる。   The fluid heating component and the fluid heating component composite according to the present invention can be used in a heating system for heating an exhaust gas purification catalyst for improving the fuel efficiency of an automobile.

１，１０，２０，３４：流体加熱部品、２，１２，２１，３１，３５，４０，１０６：ハニカム構造体、３，１３，２２，３２：外周面、４，１４，２４，３３：導電性皮膜層、５ａ，１０６ａ：一方の端面、５ｂ：他方の端面、６，１１：セル、７，４１：隔壁、２３：内周面、３０ａ，３０ｂ：流体加熱部品複合体、４１ａ：隔壁表面、４２：表面層、４４：目封止部、５０ａ，５０ｂ：流体加熱部品（不適合な例）、５１ａ，５１ｂ：ハニカム構造体（不適合な例）、５２ａ，５２ｂ：外周面（不適合な例）、５３ａ，５３ｂ：導電性皮膜層（不適合な例）、５４ａ，５４ｂ：絶縁部、１００：誘導加熱試験装置、１０１：高周波電源装置、１０２：フィーダーダクト、１０３：フレキフィーダー、１０４：加熱コイル、１０５：ケーシング、１０７：サーモカメラ、Ａ：軸方向、Ｆ：流体、ＩＤ：コイルの内径、Ｌ：コイル長さ。 1, 10, 20, 34: Fluid heating component, 2, 12, 21, 31, 35, 40, 106: Honeycomb structure, 3, 13, 22, 32: Outer peripheral surface, 4, 14, 24, 33: Conductive 5a, 106a: one end face, 5b: the other end face, 6, 11: cell, 7, 41: partition wall, 23: inner peripheral surface, 30a, 30b: fluid heating component composite, 41a: partition wall surface , 42: surface layer, 44: plugged portion, 50a, 50b: fluid heating component (incompatible example), 51a, 51b: honeycomb structure (incompatible example), 52a, 52b: outer peripheral surface (incompatible example) 53a, 53b: conductive coating layer (non-conforming example), 54a, 54b: insulation, 100: induction heating test device, 101: high frequency power supply device, 102: feeder duct, 103: flexible feeder, 104: heating coil, 105: K Ring, 107: thermo cameras, A: axial, F: Fluid, ID: inner diameter of the coil, L: coil length.

Claims (10)

流体の流通する流路が形成されたセラミックス製の柱状部材と、
前記柱状部材の外周面の少なくとも一部に被設された導電性皮膜層と
を具備し、
前記導電性皮膜層は、
前記流体の流通方向に直交する前記柱状部材の切断面において、電気的に接続した状態で前記柱状部材の切断面全周を被設している流体加熱部品。 A ceramic columnar member in which a fluid flow path is formed;
Comprising a conductive coating layer provided on at least a part of the outer peripheral surface of the columnar member;
The conductive coating layer is
A fluid heating component in which the entire cut surface of the columnar member is provided in an electrically connected state on the cut surface of the columnar member orthogonal to the fluid flow direction. 前記柱状部材は、
一方の端面から他方の端面まで延びる前記流路として形成された複数のセルを区画形成する隔壁を備えたハニカム構造体である請求項１に記載の流体加熱部品。 The columnar member is
The fluid heating component according to claim 1, wherein the fluid heating component is a honeycomb structure including a partition wall that partitions and forms a plurality of cells formed as the flow path extending from one end surface to the other end surface. 前記柱状部材は、
緻密質のセラミックスであり、
気孔率が０．１％〜１０％の範囲である請求項１または２に記載の流体加熱部品。 The columnar member is
Dense ceramics,
The fluid heating component according to claim 1 or 2, wherein the porosity is in a range of 0.1% to 10%. 前記柱状部材は、
熱伝導率が５０Ｗ／ｍ・Ｋ〜３００Ｗ／ｍ・Ｋの範囲にあるセラミックスである請求項１〜３のいずれか一項に記載の流体加熱部品。 The columnar member is
The fluid heating component according to any one of claims 1 to 3, wherein the fluid heating component is a ceramic having a thermal conductivity in a range of 50 W / m · K to 300 W / m · K. 前記柱状部材は、
炭化珪素、窒化珪素、窒化アルミニウム、酸化マグネシウムから選択される少なくとも１つ以上を主成分とするセラミックスである請求項１〜４のいずれか一項に記載の流体加熱部品。 The columnar member is
The fluid heating component according to any one of claims 1 to 4, wherein the fluid heating component is a ceramic mainly composed of at least one selected from silicon carbide, silicon nitride, aluminum nitride, and magnesium oxide. 前記柱状部材は、
炭化珪素を主成分とするセラミックスであり、電気抵抗率が０．０１Ωｃｍ〜１０Ωｃｍである請求項１〜４のいずれか一項に記載の流体加熱部品。 The columnar member is
The fluid heating component according to any one of claims 1 to 4, wherein the fluid heating component is a ceramic mainly composed of silicon carbide and has an electrical resistivity of 0.01? Cm to 10? Cm. 前記柱状部材は、
熱膨張率が０．１ｐｐｍ／Ｋ〜２ｐｐｍ／Ｋのコージェライトを主成分とするセラミックスである請求項１〜３のいずれか一項に記載の流体加熱部品。 The columnar member is
The fluid heating component according to any one of claims 1 to 3, wherein the fluid heating component is a ceramic mainly composed of cordierite having a coefficient of thermal expansion of 0.1 ppm / K to 2 ppm / K. 前記導電性皮膜層は、
層構造を呈し、前記柱状部材の前記表面と接する無電解めっき層と、
前記無電解めっき層の上に積層された少なくとも一層以上の誘導加熱層と
を備える請求項１〜７のいずれか一項に記載の流体加熱部品。 The conductive coating layer is
An electroless plating layer having a layer structure and in contact with the surface of the columnar member;
The fluid heating component according to any one of claims 1 to 7, further comprising at least one induction heating layer laminated on the electroless plating layer. 前記導電性皮膜層は、
皮膜層厚さが０．１μｍ〜５００μｍの範囲である請求項１〜８のいずれか一項に記載の流体加熱部品。 The conductive coating layer is
The fluid heating component according to any one of claims 1 to 8, wherein a film layer thickness is in a range of 0.1 µm to 500 µm. 請求項１〜９のいずれか一項に記載の流体加熱部品を用いて形成され、
複数の角柱状の前記流体加熱部品を用いて一体的に構築され、若しくは、
少なくとも一つ以上の角柱状の前記流体加熱部品、及び、流体の流通する流路が形成された、
一または複数の角柱状のセラミックス製の柱状部材を用いて一体的に構築された流体加熱部品複合体。 Formed using the fluid heating component according to any one of claims 1 to 9,
Constructed integrally using a plurality of prismatic fluid heating components, or
At least one or more prismatic fluid heating parts, and a flow path through which the fluid flows, are formed.
A fluid heating component composite integrally constructed using one or a plurality of prismatic ceramic columnar members.
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