JP2019117335A - Optical scanner and radar device - Google Patents

Optical scanner and radar device Download PDF

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JP2019117335A
JP2019117335A JP2017251972A JP2017251972A JP2019117335A JP 2019117335 A JP2019117335 A JP 2019117335A JP 2017251972 A JP2017251972 A JP 2017251972A JP 2017251972 A JP2017251972 A JP 2017251972A JP 2019117335 A JP2019117335 A JP 2019117335A
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rib
deformation
scanning device
piezoelectric body
light
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JP6962183B2 (en
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榎本　哲也
Tetsuya Enomoto
哲也 榎本
慎一 谷下
Shinichi Tanishita
慎一 谷下
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Denso Corp
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Denso Corp
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Abstract

To enable a scan angle to be expanded by dispersing the stress acting on a rib.SOLUTION: An optical scanner 1 is a device for scanning a light beam, comprising a reflection part 11, a support beam 12, and a piezoelectric substance 13. The reflection part 11 includes a reflection surface for reflecting the light beam. The support beam 12 is a tabular beam for oscillatably supporting the reflection part 11, and includes at least one deformation part 21 extending linearly, at least one connecting part 22 coupled to an edge of the deformation part 21, and a rib 23 protruding in the connecting part 22. The piezoelectric substance 13 is fixed at least to the deformation part 21 in the support beam 12, and is bent by a voltage applied thereto causing the deformation part 21 to deform. The rib 23 is provided at a longitudinal extended position of the deformation part 21, with its both ends located outward of the outer edge of a connection in the deformation part 21 where it connects to the connecting part 22 in an orthogonal direction crossing the longitudinal direction of the deformation part 21 at right angles.SELECTED DRAWING: Figure 2

Description

本開示は、光走査装置に関する。   The present disclosure relates to an optical scanning device.

光源から入射する光ビームを走査する圧電駆動型の光走査装置、いわゆる光偏向器が知られている。引用文献１には、光ビームを反射させる反射部と、反射部を所定の軸周りに揺動させるミアンダ形状のアクチュエータと、を備える光偏向器が開示されている。アクチュエータは、支持体と、圧電体と、連結部と、リブと、を備える。支持体は、直線状に延びる薄い平板部であって、その長手方向に直交する方向に間隔を空けて複数並設される。圧電体は、支持体のほぼ全面に形成され、電圧が印加されることにより屈曲して支持体を変形させる。連結部は、隣り合う支持体の端部同士を連結する半円状の平板部である。リブは、連結部の剛性を向上させるため、連結部の一方の面において突出するように設けられている。リブは、支持体の長手方向に直交する方向に沿って連結部の一方の端部から他方の端部まで延びる平板状である。換言すると、圧電体の長手方向の延長線上付近にリブの端部が位置している。   There is known a piezoelectric drive type optical scanning device for scanning a light beam incident from a light source, a so-called light deflector. Patent Document 1 discloses a light deflector including a reflecting portion that reflects a light beam, and a meander-shaped actuator that causes the reflecting portion to swing about a predetermined axis. The actuator includes a support, a piezoelectric body, a coupling portion, and a rib. The supports are thin flat portions extending linearly, and a plurality of supports are arranged in parallel at intervals in a direction perpendicular to the longitudinal direction. The piezoelectric body is formed on almost the entire surface of the support, and is bent to deform the support upon application of a voltage. The connecting portion is a semicircular flat plate portion connecting end portions of adjacent supports. The rib is provided so as to project on one surface of the connecting portion in order to improve the rigidity of the connecting portion. The rib is in the form of a flat plate extending from one end of the connecting portion to the other end along a direction perpendicular to the longitudinal direction of the support. In other words, the end of the rib is located near the longitudinal extension of the piezoelectric body.

特開２０１４−２３５２９８号公報JP 2014-235298 A

上述したような光走査装置には、活性層、ＢＯＸ層及び支持層が積層された積層構造を有するＳＯＩ基板が材料として用いられる。ＳＯＩ基板は、圧電駆動しやすいように部分的に薄化されている。具体的には、厚さの制御性を上げるために、薄化する部分、例えばリブ以外の部分は活性層からなる膜構成とされ、リブについては活性層、ＢＯＸ層及び支持層の膜構成とされることが一般的である。このように加工された基板に、圧電駆動のための圧電膜が形成される。   In the optical scanning device as described above, an SOI substrate having a laminated structure in which an active layer, a BOX layer, and a support layer are laminated is used as a material. The SOI substrate is partially thinned to facilitate piezoelectric driving. Specifically, in order to increase the controllability of the thickness, the portion to be thinned, for example, the portion other than the rib is made to have a film configuration consisting of the active layer, and the rib has the film configuration of the active layer, the BOX layer and the support layer It is common to do. A piezoelectric film for piezoelectric driving is formed on the substrate thus processed.

ところで、反射部による光ビームの走査角は、圧電膜に印加される電位差を大きくすることで拡大することができる。ただし、ＢＯＸ層は、他の層と比較して破壊応力が小さく、また、他の層と貼り合わせで形成されているため密着性が低い。したがって、大きな応力がかかると、リブのＢＯＸ層で構造破壊が生じることが懸念される。   By the way, the scanning angle of the light beam by the reflecting portion can be expanded by increasing the potential difference applied to the piezoelectric film. However, since the BOX layer has a smaller breaking stress than other layers and is formed by bonding with other layers, adhesion is low. Therefore, if a large stress is applied, there is a concern that structural failure may occur in the BOX layer of the rib.

具体的には、発明者の詳細な検討の結果、圧電体の長手方向に沿った外縁又はその延長線と、リブと、の交差部付近には特に応力が集中しやすいという課題が見出された。例えば上述した光偏向器の場合、圧電体が屈曲すると、支持体の中央部においては、支持体の長手方向に沿った曲げ応力がかかるのみであるのに対し、リブの端部においては、支持体の長手方向に沿った曲げ応力と、長手方向に直交する方向に反る力と、が同時にかかる。このため、圧電体の長手方向に沿った外縁の延長線と、リブと、が交差する交差部に応力が集中しやすくなる。このため、上述した光偏光器では、圧電膜に印加する電位差を大きくすると、リブの端部におけるＢＯＸ層に応力が集中し、リブが破壊してしまうことが懸念される。   Specifically, as a result of the inventor's detailed investigation, a problem has been found that stress tends to be concentrated particularly in the vicinity of the intersection of the outer edge or its extension along the longitudinal direction of the piezoelectric body and the rib. The For example, in the case of the light deflector described above, when the piezoelectric body is bent, bending stress along the longitudinal direction of the support is only applied in the central portion of the support, while support is provided at the end of the rib The bending stress along the longitudinal direction of the body and the force that warps in the direction perpendicular to the longitudinal direction are simultaneously applied. For this reason, stress is likely to be concentrated at the intersection where the extension of the outer edge along the longitudinal direction of the piezoelectric body and the rib intersect. For this reason, in the above-described light polarizer, when the potential difference applied to the piezoelectric film is increased, stress is concentrated on the BOX layer at the end of the rib, and there is a concern that the rib may be broken.

なお、リブの破壊を生じにくくしつつ走査角を拡大させる方法として、支持体の長さを長くすること、又は、ミアンダ形状を構成する支持体の本数を増やすことが考えられる。しかし、このような方法で反射部の走査角を拡大しようとすると、支持体の共振周波数が
低下し、外部振動に対して共振し破壊しやすい構造となってしまう。 As a method of enlarging the scanning angle while making it difficult to cause breakage of the rib, it is conceivable to increase the length of the support or to increase the number of supports constituting the meander shape. However, when attempting to expand the scanning angle of the reflective portion by such a method, the resonant frequency of the support decreases, resulting in a structure that is easily resonated with external vibrations and broken.

本開示の一局面は、リブにかかる応力を分散することにより走査角を拡大できるようにすることを目的としている。   One aspect of the present disclosure is directed to enabling the scanning angle to be increased by dispersing the stress applied to the rib.

本開示の一態様は、光ビームを走査する光走査装置（１）であって、反射部（１１）と、支持梁（１２）と、圧電体（１３，４３）と、を備える。反射部は、光ビームを反射させる反射面を有する。支持梁は、反射部を揺動可能に支持する板状の梁であって、直線状に延びる少なくとも１つの変形部（２１，２１ａ〜２１ｄ,４１）と、変形部の端部に連結する少なくとも１つの連結部（２２）と、連結部において突出するリブ（２３，３３）と、を有する。圧電体は、支持梁における少なくとも変形部に固定され、電圧が印加されることにより屈曲して変形部を変形させる。リブは、変形部をその長手方向に延長した位置に設けられ、その両端部が、長手方向に直交する直交方向において、変形部における連結部と接続する接続部の外縁よりも外側に位置する。   One aspect of the present disclosure is an optical scanning device (1) that scans a light beam, and includes a reflective portion (11), a support beam (12), and a piezoelectric body (13, 43). The reflector has a reflective surface that reflects the light beam. The support beam is a plate-like beam that swingably supports the reflection portion, and at least one deformation portion (21, 21a to 21d, 41) extending in a straight line, and at least an end portion of the deformation portion. It has one connection part (22) and the rib (23, 33) which protrudes in a connection part. The piezoelectric body is fixed to at least a deformation portion of the support beam, and is bent when a voltage is applied to deform the deformation portion. The rib is provided at a position where the deformation portion is extended in the longitudinal direction, and both ends thereof are positioned outside the outer edge of the connection portion connected to the connection portion in the deformation portion in the orthogonal direction orthogonal to the longitudinal direction.

このような構成によれば、リブの両端部が交差部から離れるため、リブにかかる応力が分散される。このため、交差部にかかる応力が緩和され、リブが破壊されにくくなる。したがって、リブにかかる応力を分散することにより走査角を拡大することができる。   According to such a configuration, since both ends of the rib are separated from the intersection, stress applied to the rib is dispersed. For this reason, the stress applied to the intersection is relaxed, and the rib is less likely to be broken. Therefore, the scanning angle can be enlarged by dispersing the stress applied to the rib.

本開示の一態様は、車両に搭載されるレーダ装置であって、照射部と、上述した光走査装置と、受光部と、を備える。照射部は、光ビームを照射する。光走査装置は、照射部により照射された光ビームを走査する。受光部は、光走査装置により走査された光ビームの反射光を受光する。   One aspect of the present disclosure is a radar device mounted on a vehicle, and includes an irradiation unit, the above-described optical scanning device, and a light receiving unit. The irradiating unit irradiates a light beam. The light scanning device scans the light beam irradiated by the irradiation unit. The light receiving unit receives the reflected light of the light beam scanned by the light scanning device.

このような構成によれば、リブにおける破壊が生じにくい光走査装置を用いて走査角を拡大することのできるレーダ装置を提供することができる。   According to such a configuration, it is possible to provide a radar device capable of enlarging a scanning angle by using an optical scanning device in which breakage in a rib is unlikely to occur.

光走査装置が搭載されるレーダ装置の構成図である。It is a block diagram of the radar apparatus by which an optical scanning device is mounted. 第１実施形態の光走査装置の構成を示す全体図である。FIG. 1 is an overall view showing a configuration of an optical scanning device of a first embodiment. 第１実施形態の支持梁の一部を示す拡大図である。It is an enlarged view which shows a part of support beam of 1st Embodiment. 第１実施形態における距離Ｌ１に対するリブのＢＯＸ層にかかる応力比を示すグラフである。It is a graph which shows the stress ratio concerning a BOX layer of a rib to distance L1 in a 1st embodiment. 第２実施形態の光走査装置の構成を示す全体図である。It is a general view which shows the structure of the optical scanning device of 2nd Embodiment. 第２実施形態の支持梁の一部を示す拡大図である。It is an enlarged view which shows a part of support beam of 2nd Embodiment. 第２実施形態における距離Ｌ２に対するリブのＢＯＸ層にかかる応力比を示すグラフである。It is a graph which shows the stress ratio concerning a BOX layer of a rib to distance L2 in a 2nd embodiment. 第３実施形態の光走査装置の構成を示す全体図である。It is a general view which shows the structure of the optical scanning device of 3rd Embodiment. 第３実施形態の支持梁の一部を示す拡大図である。It is an enlarged view which shows a part of support beam of 3rd Embodiment. 第３実施形態における接続部の幅Ｂ１に対する一定の共振周波数での走査角比率を示すグラフである。It is a graph which shows the scanning angle ratio in the fixed resonant frequency with respect to width B1 of the connection part in 3rd Embodiment.

以下、本開示の例示的な実施形態について図面を参照しながら説明する。
［１．第１実施形態］
［１−１．構成］
図１に示すレーダ装置１００は、車両に搭載され、照射部１０１と、光走査装置１と、駆動部１０２と、受光部１０３と、制御部１０４と、を備える。 Hereinafter, exemplary embodiments of the present disclosure will be described with reference to the drawings.
[1. First embodiment]
[1-1. Constitution]
The radar device 100 shown in FIG. 1 is mounted on a vehicle, and includes an irradiation unit 101, an optical scanning device 1, a drive unit 102, a light reception unit 103, and a control unit 104.

照射部１０１は、光ビームを照射する。
光走査装置１は、照射部１０１により照射された光ビームを走査する。
駆動部１０２は、光走査装置１を駆動させる駆動信号を発信する。 The irradiation unit 101 irradiates a light beam.
The light scanning device 1 scans the light beam irradiated by the irradiation unit 101.
The drive unit 102 transmits a drive signal for driving the light scanning device 1.

受光部１０２は、光走査装置１により走査された光ビームの反射光を受光する。
制御部１０４は、照射部１０１により照射された光ビームに基づいて、光ビームを反射した物標との相対関係を示す相対値を測定する。 The light receiving unit 102 receives the reflected light of the light beam scanned by the light scanning device 1.
The control unit 104 measures, based on the light beam irradiated by the irradiation unit 101, a relative value indicating a relative relationship with a target that has reflected the light beam.

図２に示すように、光走査装置１は、反射部１１と、支持梁１２と、圧電体１３と、を備える。反射部１１及び支持梁１２には、活性層、ＢＯＸ層及び支持層が積層された積層構造を有するＳＯＩ基板が材料として用いられる。   As shown in FIG. 2, the light scanning device 1 includes a reflection unit 11, a support beam 12, and a piezoelectric body 13. For the reflective portion 11 and the support beam 12, an SOI substrate having a laminated structure in which an active layer, a BOX layer, and a support layer are laminated is used as a material.

反射部１１は、光ビームを反射させる円形の反射面を有する。反射部１１は、光走査装置１において中央に配置されるように、反射部１１の一部において左右対称に支持梁１２と連結している。   The reflector 11 has a circular reflective surface that reflects the light beam. The reflective portion 11 is connected to the support beam 12 symmetrically in part in the reflective portion 11 so as to be disposed at the center of the light scanning device 1.

支持梁１２は、反射部１１を揺動可能に支持する板状の梁である。支持梁１２は、変形部２１と、連結部２２と、リブ２３と、連結リブ２４と、を有する。支持梁１２における変形部２１、連結部２２、リブ２３及び連結リブ２４は、ＳＯＩ基板を形状加工することにより一体的に形成されている。   The support beam 12 is a plate-like beam that supports the reflecting portion 11 in a swingable manner. The support beam 12 has a deformation portion 21, a connection portion 22, a rib 23, and a connection rib 24. The deformation portion 21, the connection portion 22, the rib 23 and the connection rib 24 in the support beam 12 are integrally formed by processing the SOI substrate.

変形部２１は、直線状に延びる長方形状の薄い平板部であり、ＳＯＩ基板において活性層からなる膜構成とされる。変形部２１は、変形部２１の長手方向に直交する直交方向に間隔を空けて複数並設されている。以下の説明では、変形部２１の長手方向に直交する直交方向を方向Ｘとし、変形部２１の長手方向を方向Ｙとする。本実施形態においては、変形部２１は、方向Ｘにおいて反射部１１の左右両側に各４つ並設されている。以下の説明では、変形部２１をそれぞれ反射部１１に近い側から変形部２１ａ〜２１ｄとする。   The deformation portion 21 is a thin rectangular flat portion extending in a straight line, and has a film configuration including an active layer in the SOI substrate. A plurality of deformation portions 21 are arranged in parallel at intervals in the orthogonal direction orthogonal to the longitudinal direction of the deformation portion 21. In the following description, the orthogonal direction orthogonal to the longitudinal direction of the deformation portion 21 is taken as the direction X, and the longitudinal direction of the deformation portion 21 is taken as the direction Y. In the present embodiment, four deformation portions 21 are provided side by side on the left and right sides of the reflection portion 11 in the direction X. In the following description, the deformation portions 21 are respectively referred to as deformation portions 21 a to 21 d from the side closer to the reflection portion 11.

連結部２２は、薄い平板部であり、ＳＯＩ基板において活性層からなる膜構成とされる。連結部２２は、変形部２１の端部に連結しており、互いに隣り合う２つの変形部２１の端部同士を連結することで、ミアンダ形状を形成する。具体的には、連結部２２は、例えば変形部２１ｂの一方の端部と、隣り合う変形部２１のうち一方の変形部２１ａの当該一方の端部と同じ側の端部と、を連結し、変形部２１ｂの他方の端部と、隣り合う変形部２１のうち他方の変形部２１ｃの当該他方の端部と同じ側の端部と、を連結する。このように連結部２２は、方向Ｙにおける変形部２１の両端部のそれぞれを左右に隣り合う異なる変形部２１の端部と連結する。   The connection portion 22 is a thin flat portion, and has a film configuration including an active layer in the SOI substrate. The connection portion 22 is connected to the end of the deformation portion 21 and forms a meander shape by connecting the end portions of two deformation portions 21 adjacent to each other. Specifically, the connecting portion 22 connects, for example, one end of the deforming portion 21 b and an end of the adjacent deforming portion 21 on the same side as the one end of the deforming portion 21 a. The other end of the deformation portion 21 b is connected to the end on the same side as the other end of the other deformation portion 21 c of the adjacent deformation portions 21. Thus, the connecting portion 22 connects each of the two end portions of the deformation portion 21 in the direction Y with the end portions of different deformation portions 21 adjacent to the left and right.

リブ２３は、連結部２２において連結部２２の一方の面から垂直に突出する板厚が厚い部分であり、ＳＯＩ基板において活性層、ＢＯＸ層及び支持層の膜構成とされる。リブ２３は、変形部２１を方向Ｙに延長した位置に設けられ、方向Ｘに沿って直線状に延びる。図３に示すように、リブ２３は、その両端部が、方向Ｘにおいて、変形部２１における連結部２２と接続する部分である接続部２５の外縁よりも外側に位置する。   The rib 23 is a thick portion projecting perpendicularly from one surface of the connecting portion 22 in the connecting portion 22 and has a film configuration of an active layer, a BOX layer, and a support layer in the SOI substrate. The rib 23 is provided at a position extending the deformation portion 21 in the direction Y, and extends linearly along the direction X. As shown in FIG. 3, both ends of the rib 23 are located in the direction X outside the outer edge of the connecting portion 25 which is a portion connected to the connecting portion 22 in the deformation portion 21.

連結リブ２４は、連結部２２においてリブ２３とは別にリブ２３と同じ面に突出する板厚が厚い部分であり、ＳＯＩ基板においてリブ２３と同様に活性層、ＢＯＸ層及び支持層の膜構成とされる。連結リブ２４は、連結部２２の面に直交する方向から見て連結リブ２４の両端部が変形部２１側を向くように湾曲した形状であり、連結部２２に設けられる２つの変形部２１に対応する２つのリブ２３同士を連結する。具体的には、２つのリブ２３の対向する一方の端部がそれぞれ連結リブ２４の両端部に連結される。連結リブ２４は、リブ２３よりも細く形成されているため、リブ２３よりもばね定数が低い。なお、連結部
２２の面に直交する方向とは、方向Ｘ及び方向Ｙに直交する方向である。 The connecting rib 24 is a thick portion projecting in the same plane as the rib 23 separately from the rib 23 in the connecting portion 22, and in the SOI substrate, the film configuration of the active layer, the BOX layer and the support layer is the same as the rib 23 Be done. The connection rib 24 has a curved shape so that both end portions of the connection rib 24 face the deformation portion 21 as viewed from the direction orthogonal to the surface of the connection portion 22, and the two deformation portions 21 provided in the connection portion 22 The corresponding two ribs 23 are connected to each other. Specifically, opposing one ends of the two ribs 23 are respectively connected to both ends of the connection rib 24. Since the connecting rib 24 is formed thinner than the rib 23, the spring constant is lower than that of the rib 23. The direction orthogonal to the surface of the connecting portion 22 is a direction orthogonal to the direction X and the direction Y.

圧電体１３は、変形部２１と同様、方向Ｙに沿って直線状に延びる長方形状の薄膜であり、支持梁１２においてリブ２３が設けられる面とは反対側の面に固定される。圧電体１３は、上部電極、圧電膜及び下部電極の３層から構成される。本実施形態では、圧電体１３は、方向Ｘにおいて変形部２１の外縁から少し余白を残して、支持梁１２における余白を除く変形部２１の全面及び連結部２２の一部を覆うように設けられる。連結部２２の一部において圧電体１３は、圧電体１３とは反対面に設けられるリブ２３に重なる位置まで延びている。圧電体１３の材料としては、例えば、上部電極には白金又は金が用いられ、圧電膜にはチタン酸ジルコン酸鉛が用いられ、下部電極には２層となるようにチタン及び白金が用いられる。圧電体１３は、電圧が印加されることにより屈曲して変形部２１を変形させる。これにより、反射部１１が揺動する。   The piezoelectric body 13 is a rectangular thin film linearly extending along the direction Y, as with the deformation portion 21, and is fixed to the surface of the support beam 12 opposite to the surface on which the rib 23 is provided. The piezoelectric body 13 is composed of three layers of an upper electrode, a piezoelectric film and a lower electrode. In the present embodiment, the piezoelectric body 13 is provided so as to cover the entire surface of the deformable portion 21 and a part of the connecting portion 22 except the margin in the support beam 12 with a little margin left from the outer edge of the deformable portion 21 in the direction X. . The piezoelectric body 13 extends to a position overlapping a rib 23 provided on the opposite surface to the piezoelectric body 13 in a part of the connecting portion 22. As a material of the piezoelectric body 13, for example, platinum or gold is used for the upper electrode, lead zirconate titanate is used for the piezoelectric film, and titanium and platinum are used to form two layers for the lower electrode. . The piezoelectric body 13 is bent when a voltage is applied to deform the deformation portion 21. Thereby, the reflection part 11 swings.

［１−２．効果］
以上詳述した第１実施形態によれば、以下の効果が得られる。
（１ａ）本実施形態では、リブ２３は、変形部２１を方向Ｙに延長した位置に設けられ、その両端部が、方向Ｘにおいて、接続部２５の外縁よりも外側に位置する。このため、方向Ｙに沿った圧電体１３の外縁の延長線と、リブ２３と、が交差する交差部２６からリブ２３の両端部が離れるので、電圧が印加されることによって圧電体１３が屈曲する際にリブ２３にかかる応力が分散され、リブ２３が破壊されにくくなる。したがって、リブ２３にかかる応力を分散することにより走査角を拡大することができる。図４は、リブ２３の端部と交差部２６との間の距離Ｌ１に対するリブ２３におけるＢＯＸ層にかかる応力比を示すグラフである。ここで、距離Ｌ１が１３５ｕｍの場合、距離Ｌ１が０ｕｍの場合と比較して、リブ２３のＢＯＸ層にかかる応力比が約５０％となるので、走査角を２倍に拡大してもリブ２３が破壊されにくくなる。 [1-2. effect]
According to the first embodiment described above, the following effects can be obtained.
(1a) In the present embodiment, the rib 23 is provided at a position where the deformation portion 21 is extended in the direction Y, and both ends thereof are located outside the outer edge of the connection portion 25 in the direction X. Therefore, both ends of the rib 23 separate from the intersection 26 where the extension line of the outer edge of the piezoelectric 13 along the direction Y and the rib 23 cross, so that the piezoelectric body 13 is bent by applying a voltage. The stress applied to the rib 23 is dispersed during the process, and the rib 23 is less likely to be broken. Therefore, the scanning angle can be expanded by dispersing the stress applied to the rib 23. FIG. 4 is a graph showing the stress ratio applied to the BOX layer in the rib 23 with respect to the distance L1 between the end of the rib 23 and the intersection 26. Here, when the distance L1 is 135 um, the stress ratio applied to the BOX layer of the rib 23 is about 50% as compared with the case where the distance L1 is 0 um, so the rib 23 is obtained even if the scanning angle is doubled. Is less likely to be destroyed.

（１ｂ）本実施形態では、支持梁１２は、リブ２３よりもばね定数が低く、連結部２２に設けられる２つのリブ２３同士を連結する連結リブ２４を有する。これにより、電圧が印加されることによって圧電体１３が屈曲する際に連結リブ２４が撓むことによりリブ２３にかかる応力が連結リブ２４にも分散される。したがって、連結リブ２４を有しない構成と比較して、更にリブ２３にかかる応力を緩和することができる。   (1b) In the present embodiment, the support beam 12 has a spring constant lower than that of the rib 23, and has the connecting rib 24 connecting the two ribs 23 provided in the connecting portion 22. Accordingly, when the piezoelectric body 13 is bent by the application of the voltage, the stress applied to the rib 23 is dispersed to the connection rib 24 by the bending of the connection rib 24. Therefore, the stress applied to the rib 23 can be further relieved as compared with the configuration without the connecting rib 24.

［２．第２実施形態］
［２−１．構成］
図５及び図６に示すように、第２実施形態では、リブ３３及び連結リブ３４の形状が第１実施形態のリブ２３及び連結リブ２４の形状と異なる。また、第２実施形態では、連結部２２にスリット３５が設けられる点で第１実施形態の構成と異なる。その他、基本的な構成は第１実施形態と同様であり、第１実施形態と共通する構成については、同一符号を用いて説明を省略する。 [2. Second embodiment]
[2-1. Constitution]
As shown in FIGS. 5 and 6, in the second embodiment, the shapes of the ribs 33 and the connecting ribs 34 are different from the shapes of the ribs 23 and the connecting ribs 24 of the first embodiment. Further, the second embodiment differs from the configuration of the first embodiment in that the connecting portion 22 is provided with the slits 35. The other basic configuration is the same as that of the first embodiment, and the same reference numerals are used for the configuration common to the first embodiment, and the description is omitted.

第２実施形態のリブ３３は、連結部２２の面に直交する方向から見て、リブ３３の両端部が変形部２１側を向くように湾曲した形状である。
第２実施形態の連結リブ３４は、連結部２２の面に直交する方向から見て、連結リブ３４の両端部が変形部２１側を向くようにＵ字状であり、２つのリブ３３同士を連結する。具体的には、隣り合う２つのリブ３３の中央部にそれぞれ連結リブ２４の両端部が連結される。 The rib 33 according to the second embodiment has a curved shape so that both end portions of the rib 33 are directed to the deformation portion 21 as viewed in the direction orthogonal to the surface of the connecting portion 22.
The connection rib 34 of the second embodiment is U-shaped such that both end portions of the connection rib 34 face the deformation portion 21 when viewed from the direction orthogonal to the surface of the connection portion 22. Link. Specifically, both ends of the connecting rib 24 are connected to the central portions of two adjacent ribs 33, respectively.

第２実施形態の連結部２２には、方向Ｘにおいて圧電体１３を挟む両側に、リブ３３の両端部のそれぞれと圧電体１３とを方向Ｘにおいて離間させるスリット３５が設けられる。   In the connecting portion 22 of the second embodiment, slits 35 are provided on both sides sandwiching the piezoelectric body 13 in the direction X, for separating the piezoelectric body 13 from the respective end portions of the rib 33 in the direction X.

［２−２．効果］
以上詳述した第２実施形態によれば、以下の効果が得られる。
（２ａ）第２実施形態では、リブ３３は湾曲した形状である。このため、第１実施形態の構成と比較して、方向Ｘにおけるリブ３３の外形寸法を小さくすることができる。また、第２実施形態では、連結部２２にスリット３５が設けられている。このため、電圧が印加されることによって圧電体１３が屈曲する際にリブ３３にかかる応力をスリット３５に集中させ、湾曲した形状のリブ３３で比較的均一に応力を受け止めることができる。したがって、第１実施形態の構成と比較して、方向Ｘにおける外形寸法を小さくしつつリブ３３にかかる応力を緩和することができる。図７は、リブ３３の端部における湾曲した形状の内側の内縁と、スリット３５のリブ３３側の外縁と、の間の距離Ｌ２に対する、リブ３３におけるＢＯＸ層にかかる応力比を示すグラフである。ここで、距離Ｌ２が１０ｕｍの場合、距離Ｌ２が０ｕｍの場合と比較して、リブ３３のＢＯＸ層にかかる応力比を約５０％まで下げることができる。 [2-2. effect]
According to the second embodiment described above, the following effects can be obtained.
(2a) In the second embodiment, the rib 33 has a curved shape. For this reason, the outer dimensions of the rib 33 in the direction X can be reduced as compared with the configuration of the first embodiment. Further, in the second embodiment, the connecting portion 22 is provided with the slit 35. Therefore, the stress applied to the rib 33 when the piezoelectric body 13 is bent by the application of the voltage can be concentrated on the slit 35, and the curved rib 33 can receive the stress relatively uniformly. Therefore, as compared with the configuration of the first embodiment, the stress applied to the rib 33 can be relaxed while reducing the external dimension in the direction X. FIG. 7 is a graph showing the stress ratio applied to the BOX layer in the rib 33 with respect to the distance L2 between the inner inner edge of the curved shape at the end of the rib 33 and the outer edge on the rib 33 side of the slit 35 . Here, when the distance L2 is 10 um, the stress ratio applied to the BOX layer of the rib 33 can be lowered to about 50% as compared with the case where the distance L2 is 0 um.

［３．第３実施形態］
［３−１．構成］
図８及び図９に示すように、第３実施形態では、変形部４１及び圧電体４３の形状が第２実施形態の変形部２１及び圧電体１３の形状と異なる。その他、基本的な構成は第２実施形態と同様であり、第２実施形態と共通する構成については、同一符号を用いて説明を省略する。 [3. Third embodiment]
[3-1. Constitution]
As shown in FIGS. 8 and 9, in the third embodiment, the shapes of the deformable portion 41 and the piezoelectric body 43 are different from the shapes of the deformable portion 21 and the piezoelectric body 13 of the second embodiment. The other basic configuration is the same as that of the second embodiment, and the same reference numerals are used for the configuration common to the second embodiment, and the description is omitted.

第３実施形態の変形部４１は、接続部２５の方向Ｘに沿った幅Ｂ１については、第２実施形態の接続部２５の方向Ｘに沿った幅と同じである。それに対して、変形部４１の中央部の方向Ｘに沿った幅Ｂ２は、第２実施形態の変形部２１の中央部の方向Ｘに沿った幅よりも広い。換言すると、変形部４１は、接続部２５の方向Ｘに沿った幅Ｂ１が、変形部４１の中央部の方向Ｘに沿った幅Ｂ２よりも狭く形成されている。   The deformation portion 41 of the third embodiment is the same as the width along the direction X of the connection portion 25 of the second embodiment about the width B1 of the connection portion 25 along the direction X. On the other hand, the width B2 along the direction X of the central portion of the deformation portion 41 is wider than the width along the direction X of the central portion of the deformation portion 21 of the second embodiment. In other words, the deformation portion 41 is formed such that the width B1 along the direction X of the connection portion 25 is smaller than the width B2 along the direction X of the central portion of the deformation portion 41.

第３実施形態の圧電体４３は、接続部２５における圧電体４３の方向Ｘに沿った幅Ｂ３については、第２実施形態の接続部２５における圧電体１３の方向Ｘに沿った幅と同じである。それに対して、変形部４１の中央部における圧電体４３の方向Ｘに沿った幅Ｂ４は、第２実施形態の変形部２１の中央部における圧電体１３の方向Ｘに沿った幅よりも広い。換言すると、圧電体４３は、接続部２５における圧電体４３の方向Ｘに沿った幅Ｂ３が、変形部４１の中央部における圧電体４３の方向Ｘに沿った幅Ｂ４よりも狭く形成されている。   The piezoelectric body 43 of the third embodiment has the same width B3 along the direction X of the piezoelectric body 43 in the connecting portion 25 as the width along the direction X of the piezoelectric body 13 in the connecting portion 25 of the second embodiment. is there. On the other hand, the width B4 along the direction X of the piezoelectric body 43 at the central portion of the deformation portion 41 is wider than the width along the direction X of the piezoelectric body 13 at the central portion of the deformation portion 21 of the second embodiment. In other words, the piezoelectric body 43 is formed such that the width B3 along the direction X of the piezoelectric body 43 at the connection portion 25 is narrower than the width B4 along the direction X of the piezoelectric body 43 at the central portion of the deformation portion 41 .

［３−２．効果］
以上詳述した第３実施形態によれば、以下の効果が得られる。
（３ａ）第３実施形態では、幅Ｂ１よりも幅Ｂ２が広く形成されており、幅Ｂ３よりも幅Ｂ４が広く形成されている。また、第３実施形態でも第２実施形態と同様に変形部４１の外縁から少し余白を残して圧電体４３が設けられる。このため、第３実施形態の余白の方向Ｘにおける幅が第２実施形態と同じ場合、変形部４１の方向Ｘに沿った幅に対する圧電体４３の方向Ｘに沿った幅の比率を高くすることができる。したがって、第２実施形態の構成と比較して、低電圧で大きい走査角を得ることができる。図１０は、接続部２５の幅Ｂ１に対する、一定の共振周波数での走査角比率を示すグラフである。ここで、幅Ｂ１が一定である場合、幅Ｂ２が幅Ｂ１よりも広い構成は、幅Ｂ２が幅Ｂ１と同じ構成と比較して、一定の共振周波数での走査角比率を上げることができる。また、共振周波数の狙い値が同じ場合、図１０に示すように、例えば、幅Ｂ２が幅Ｂ１と同じ構成においては幅Ｂ１が約５５０ｕｍで１００％の走査角比率を得ることができるのに対して、幅Ｂ２が幅Ｂ１よりも広い構成においては幅Ｂ１が約４００ｕｍで同等の走査角比率を得ることができ
る。つまり、第２実施形態の構成と比較して、方向Ｘにおける連結部２２の外形寸法を小さくしても第２実施形態の構成と同等の走査角が得られる。このように、方向Ｘにおける連結部２２の外形寸法が小さくなることにより、方向Ｘにおける支持梁１２の外形寸法を小さくすることができる。したがって、光走査装置１のサイズを低減することができる。 [3-2. effect]
According to the third embodiment described above, the following effects can be obtained.
(3a) In the third embodiment, the width B2 is wider than the width B1, and the width B4 is wider than the width B3. Further, in the third embodiment as well, as in the second embodiment, the piezoelectric body 43 is provided leaving a slight margin from the outer edge of the deformation portion 41. Therefore, when the width in the direction X of the margin in the third embodiment is the same as that in the second embodiment, the ratio of the width in the direction X of the piezoelectric body 43 to the width in the direction X of the deformable portion 41 should be increased. Can. Therefore, compared with the configuration of the second embodiment, a large scan angle can be obtained at a low voltage. FIG. 10 is a graph showing the scan angle ratio at a constant resonance frequency with respect to the width B1 of the connection portion 25. As shown in FIG. Here, when the width B1 is constant, the configuration in which the width B2 is wider than the width B1 can increase the scanning angle ratio at a constant resonance frequency as compared with the configuration in which the width B2 is the same as the width B1. Further, when the target value of the resonance frequency is the same, as shown in FIG. 10, for example, in the configuration in which the width B2 is the same as the width B1, a scanning angle ratio of 100% can be obtained with a width B1 of about 550 μm. In a configuration in which the width B2 is wider than the width B1, an equivalent scanning angle ratio can be obtained with the width B1 of about 400 μm. That is, as compared with the configuration of the second embodiment, even if the external dimension of the connecting portion 22 in the direction X is reduced, a scanning angle equivalent to the configuration of the second embodiment can be obtained. Thus, the outer dimensions of the support beam 12 in the direction X can be reduced by reducing the outer dimensions of the connecting portion 22 in the direction X. Therefore, the size of the light scanning device 1 can be reduced.

［４．他の実施形態］
以上、本開示の実施形態について説明したが、本開示は、上記実施形態に限定されることなく、種々の形態を採り得ることは言うまでもない。 [4. Other embodiments]
As mentioned above, although embodiment of this indication was described, it can not be overemphasized that this indication can take various forms, without being limited to the above-mentioned embodiment.

（４ａ）上記各実施形態では、圧電体１３，４３が、連結部２２において、圧電体１３，４３とは反対面に設けられるリブ２３，３３に重なる位置まで延びる構成を例示したが、例えば、圧電体１３，４３の方向Ｙに沿った端部がリブ２３，３３と重ならない構成であってもよい。   (4a) In the above embodiments, the piezoelectric members 13 and 43 are illustrated as extending to a position overlapping the ribs 23 and 33 provided on the surface opposite to the piezoelectric members 13 and 43 in the connecting portion 22, for example The ends of the piezoelectric members 13 and 43 in the direction Y may not overlap the ribs 23 and 33.

（４ｂ）上記各実施形態では、連結リブ２４，３４は、リブ２３，３３よりも細く形成される構成を例示したが、リブ２３，３３よりもばね定数を低くする方法はこれに限定されるものではない。例えば、連結リブ２４，３４を波状に形成し、連結リブ２４，３４を直線に形成した場合よりも長くすることで、リブ２３，３３よりもばね定数を低くするようにしてもよい。   (4b) In the above embodiments, the connection ribs 24 and 34 are formed to be thinner than the ribs 23 and 33, but the method for reducing the spring constant than the ribs 23 and 33 is limited to this. It is not a thing. For example, the spring constant may be made lower than that of the ribs 23 and 33 by forming the connecting ribs 24 and 34 in a wave shape and making the connecting ribs 24 and 34 longer than in the case of forming them linearly.

（４ｃ）上記第３実施形態では、幅Ｂ１よりも幅Ｂ２が広く、また幅Ｂ３よりも幅Ｂ４が広く形成される構成を例示したが、変形部４１及び圧電体４３の形状はこれに限定されるものではない。例えば、上記第１実施形態又は第２実施形態のように変形部４１における幅Ｂ２が幅Ｂ１と同じ構成において、圧電体４３のみ幅Ｂ４が幅Ｂ３よりも広く形成される構成であってもよい。また例えば、上記第１実施形態又は第２実施形態のように圧電体４３における幅Ｂ４が幅Ｂ３と同じ構成において、変形部４１のみ幅Ｂ２が幅Ｂ１よりも広く形成される構成であってもよい。   (4c) In the third embodiment, the width B2 is wider than the width B1 and the width B4 is wider than the width B3. However, the shapes of the deformation portion 41 and the piezoelectric body 43 are limited to this. It is not something to be done. For example, as in the first embodiment or the second embodiment, in the configuration in which the width B2 in the deformation portion 41 is the same as the width B1, only the piezoelectric body 43 may be configured to have the width B4 wider than the width B3. . Further, for example, even in the configuration in which the width B4 of the piezoelectric body 43 is the same as the width B3 as in the first embodiment or the second embodiment, the width B2 of only the deformation portion 41 is wider than the width B1. Good.

（４ｄ）上記各実施形態における１つの構成要素が有する機能を複数の構成要素として分散させたり、複数の構成要素が有する機能を１つの構成要素に統合したりしてもよい。また、上記実施形態の構成の一部を省略してもよい。また、上記実施形態の構成の少なくとも一部を、他の上記実施形態の構成に対して付加、置換等してもよい。なお、特許請求の範囲に記載の文言から特定される技術思想に含まれるあらゆる態様が本開示の実施形態である。   (4d) The function of one component in each of the above embodiments may be distributed as a plurality of components or the function of a plurality of components may be integrated into one component. In addition, part of the configuration of the above embodiment may be omitted. In addition, at least a part of the configuration of the above-described embodiment may be added to or replaced with the configuration of the other above-described embodiment. In addition, all the aspects contained in the technical thought specified from the wording as described in a claim are an embodiment of this indication.

１…光走査装置、１１…反射部、１２…支持梁、１３，４３…圧電体、２１，２１ａ〜２１ｄ,４１…変形部、２２…連結部、２３，３３…リブ、２４，３４…連結リブ、２５…接続部、２６…交差部、３５…スリット、１００…レーダ装置、１０１…照射部、１０２…駆動部、１０３…受光部、１０４…制御部。   DESCRIPTION OF SYMBOLS 1 ... Optical scanning device, 11 ... Reflective part, 12 ... Support beam, 13, 43 ... Piezoelectric body, 21, 21a-21d, 41 ... Deformed part, 22 ... Connection part, 23, 33 ... Rib, 24, 34 ... Connection Rib 25 connecting portion 26 crossing portion 35 slit slit 100 radar device 101 irradiating portion 102 driving portion 103 light receiving portion 104 control portion.

Claims (7)

光ビームを走査する光走査装置（１）であって、
光ビームを反射させる反射面を有する反射部（１１）と、
前記反射部を揺動可能に支持する板状の梁であって、直線状に延びる少なくとも１つの変形部（２１，２１ａ〜２１ｄ，４１）と、前記変形部の端部に連結する少なくとも１つの連結部（２２）と、前記連結部において突出するリブ（２３，３３）と、を有する支持梁（１２）と、
前記支持梁における少なくとも前記変形部に固定され、電圧が印加されることにより屈曲して前記変形部を変形させる圧電体（１３，４３）と、
を備え、
前記リブは、前記変形部をその長手方向に延長した位置に設けられ、その両端部が、前記長手方向に直交する直交方向において、前記変形部における前記連結部と接続する部分である接続部（２５）の外縁よりも外側に位置する、光走査装置。 A light scanning device (1) for scanning a light beam, wherein
A reflective portion (11) having a reflective surface that reflects the light beam;
It is a plate-like beam which supports the said reflection part so that rocking | fluctuation is possible, Comprising: At least 1 deformation | transformation part (21, 21a-21d, 41) extended linearly, At least 1 connected with the edge part of the said deformation | transformation part A support beam (12) having a connecting portion (22) and a rib (23, 33) projecting at the connecting portion;
A piezoelectric body (13, 43) fixed to at least the deformation portion of the support beam and bent when a voltage is applied to deform the deformation portion;
Equipped with
The rib is provided at a position where the deformation portion is extended in the longitudinal direction, and both ends thereof are portions connected with the connection portion in the deformation portion in the orthogonal direction orthogonal to the longitudinal direction 25) An optical scanning device located outside the outer edge of the optical scanner. 請求項１に記載の光走査装置であって、
前記リブは、前記リブの両端部が前記変形部側を向くように湾曲した形状である、光走査装置。 The optical scanning device according to claim 1,
The light scanning device according to claim 1, wherein the rib is curved such that both ends of the rib face the deformation portion. 請求項２に記載の光走査装置であって、
前記連結部には、前記直交方向において前記圧電体を挟む両側に、前記リブの両端部のそれぞれと前記圧電体とを前記直交方向において離間させるスリット（３５）が設けられる、光走査装置。 The optical scanning device according to claim 2,
The optical scanning device is provided with slits (35) on the both sides sandwiching the piezoelectric body in the orthogonal direction in the connection portion, which separates each of the both end portions of the rib and the piezoelectric body in the orthogonal direction. 請求項１から請求項３までのいずれか１項に記載の光走査装置であって、
前記圧電体は、前記接続部における前記圧電体の前記直交方向に沿った幅が、前記変形部の中央部における前記圧電体の前記直交方向に沿った幅よりも狭い、光走査装置。 The optical scanning device according to any one of claims 1 to 3, wherein
The light scanning device, wherein a width of the piezoelectric body in the connection portion along the orthogonal direction of the piezoelectric body is narrower than a width of the piezoelectric body in the central portion of the deformation portion along the orthogonal direction. 請求項１から請求項４までのいずれか１項に記載の光走査装置であって、
前記変形部は、前記接続部の前記直交方向に沿った幅が、前記変形部の中央部の前記直交方向に沿った幅よりも狭い、光走査装置。 The optical scanning device according to any one of claims 1 to 4, wherein
The deformation unit is an optical scanning device in which the width along the orthogonal direction of the connection portion is narrower than the width along the orthogonal direction of the central portion of the deformation portion. 請求項１から請求項５までのいずれか１項に記載の光走査装置であって、
前記支持梁は、前記直交方向に間隔を空けて並設された複数の前記変形部と、互いに隣り合う２つの前記変形部の端部同士を連結し、２つの前記変形部に対応する２つの前記リブを有する少なくとも１つの前記連結部と、前記連結部において前記リブとは別に突出する連結リブ（２４，３４）と、を有し、
前記連結リブは、前記リブよりもばね定数が低く、２つの前記リブ同士を連結する形状である、光走査装置。 The optical scanning device according to any one of claims 1 to 5, wherein
The support beam connects the ends of two or more adjacent deformation units adjacent to each other with the plurality of deformation units arranged in parallel at intervals in the orthogonal direction, and corresponds to two of the two deformation units. And at least one connecting portion having the rib, and a connecting rib (24, 34) projecting separately from the rib at the connecting portion,
The optical scanning device, wherein the connection rib has a spring constant lower than that of the rib and is configured to connect two of the ribs. 車両に搭載されるレーダ装置（１００）であって、
光ビームを照射する照射部（１０１）と、
前記照射部により照射された光ビームを走査する請求項１から請求項６までのいずれか１項に記載の光走査装置と、
前記光走査装置により走査された光ビームの反射光を受光する受光部（１０２）と、
を備える、レーダ装置。 A radar device (100) mounted on a vehicle,
An irradiation unit (101) for irradiating a light beam;
The light scanning device according to any one of claims 1 to 6, wherein the light beam irradiated by the irradiation unit is scanned;
A light receiving unit (102) for receiving the reflected light of the light beam scanned by the light scanning device;
Radar equipment.
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JP2016001325A (en) * 2010-06-24 2016-01-07 パナソニックＩｐマネジメント株式会社 Optical reflection element
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