JP2019114589A - Vacuum suction member - Google Patents
Vacuum suction member Download PDFInfo
- Publication number
- JP2019114589A JP2019114589A JP2017244690A JP2017244690A JP2019114589A JP 2019114589 A JP2019114589 A JP 2019114589A JP 2017244690 A JP2017244690 A JP 2017244690A JP 2017244690 A JP2017244690 A JP 2017244690A JP 2019114589 A JP2019114589 A JP 2019114589A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- main surface
- vacuum suction
- base
- suction member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
本発明は、半導体ウエハなど基板を真空吸着保持するために用いられる真空吸着部材に関する。 The present invention relates to a vacuum suction member used to vacuum hold a substrate such as a semiconductor wafer.
基体と、基体の主面において分散配置され、かつ、基体の主面から突出する複数の凸部と、基体の主面に開口部を有する通気路と、を備え、当該複数の凸部のそれぞれの端面を含む仮想面が湾曲形状に形成されている真空吸着部材が提案されている（例えば、特許文献１参照）。反りなどのために湾曲している半導体ウエハなどの基板が、基体の主面側において真空吸着部材に載置されると、当該基板が全体的に仮想面になじむように複数の凸部のそれぞれにより支持される。 A substrate, a plurality of protrusions distributed on the main surface of the substrate and protruding from the main surface of the substrate, and an air passage having an opening in the main surface of the substrate, each of the plurality of protrusions There has been proposed a vacuum suction member in which a virtual surface including the end face of is formed in a curved shape (see, for example, Patent Document 1). When a substrate such as a semiconductor wafer which is curved due to warpage or the like is placed on the vacuum suction member on the main surface side of the substrate, each of the plurality of convex portions is adapted to conform to the virtual surface as a whole. Supported by
しかし、基板の周縁領域である外側領域が当該外側領域により囲まれている内側領域と比較して外側に徐々に厚みが低減している場合がある。この場合、基板の平坦度が内側領域において確保されたとしても外側領域において局所的に低下する。これにより、基板の外側領域に対して、所望の回路形成のためのエッチング処理などの所定の処理を施すことが困難となる。 However, in some cases, the thickness may be gradually reduced outward as compared with the inner region surrounded by the outer region, which is the peripheral region of the substrate. In this case, even if the flatness of the substrate is ensured in the inner region, it locally decreases in the outer region. As a result, it becomes difficult to perform predetermined processing such as etching processing for forming a desired circuit on the outer region of the substrate.
そこで、本発明は、外側領域を含めて基板の全体的な平坦度の向上を図ることができる真空吸着部材を提供することを目的とする。 Then, an object of this invention is to provide the vacuum suction member which can aim at the improvement of the whole planarity of a board | substrate including an outer side area | region.
本発明の真空吸着部材は、基体と、前記基体の主面から突出する複数の凸部と、前記基体の内部を通り、前記基体の主面に開口部を有する通気経路と、を備え、前記複数の凸部が、前記基体の主面において内側領域に配置されている内側凸部群と、前記基体の主面において前記内側領域を取り囲む環状の外側領域に配置されている外側凸部群と、により構成され、前記外側凸部群を構成する複数の外側凸部のうち少なくとも一部である複数の指定外側凸部のそれぞれの前記基体の主面を基準とする端面位置が、前記内側凸部群を構成する複数の内側凸部のそれぞれの前記基体の主面を基準とする端面位置よりも高いことを特徴とする。 The vacuum suction member according to the present invention comprises a substrate, a plurality of convex portions projecting from the main surface of the substrate, and a ventilation path having an opening in the main surface of the substrate passing through the inside of the substrate, A plurality of convexes, an inner convex group arranged in an inner area on the main surface of the base, and an outer convex group arranged in an annular outer area surrounding the inner area on the main surface of the base; The end surface position based on the main surface of the base of each of the plurality of designated outer convex portions which is at least a part of the plurality of outer convex portions constituting the outer convex portion group is the inner convex It is characterized by being higher than the end face position on the basis of the main surface of the above-mentioned base of a plurality of inner convex parts which constitute a part group.
本発明の真空吸着部材によれば、基体の主面側において基板が真空吸着部材に載置されることにより、基体の主面から突出する複数の凸部のうち少なくとも一部の凸部により基板が支持される。この状態で、基体の主面および基板の裏面により挟まれた空間から通気経路を介して空気が排出されることにより、当該空間に負圧領域が形成される。その結果、基板の内側領域が内側凸部群により支持される一方、基板の外側領域が外側凸部群のうち少なくとも一部を構成する複数の指定外側凸部により支持される。 According to the vacuum suction member of the present invention, the substrate is mounted on the vacuum suction member on the main surface side of the substrate, whereby at least a part of the plurality of convex portions protruding from the main surface of the substrate is the substrate Is supported. In this state, air is discharged from the space sandwiched between the main surface of the base and the back surface of the substrate through the ventilation path to form a negative pressure region in the space. As a result, the inner region of the substrate is supported by the inner convex group, and the outer region of the substrate is supported by the plurality of designated outer convex portions constituting at least a part of the outer convex group.
基板が外側領域において内側領域よりも薄くなっているため、基板裏面の全体的な平坦度が確保された場合に基板表面の平坦度が外側領域で低下する場合がある。すなわち、内側領域において基板の裏面を全体的に平面に一致させた際に、外側領域において基板の裏面が当該平面から基板の表面側に浮き上がる場合がある。しかるに、複数の指定外側凸部の端面位置（面の「位置」という記載は、「基体の主面を基準とする当該面の位置」を意味する。）が、内側凸部群を構成する複数の内側凸部のそれぞれの端面位置よりも高い。このため、基板の外側領域の裏面位置が内側領域の裏面位置よりも高くなるように当該基板が保持される。よって、前記のような場合であっても、基板表面の全体的な平坦度の向上が図られるように当該基板が真空吸着保持されうる。 Since the substrate is thinner in the outer region than in the inner region, the flatness of the substrate surface may be reduced in the outer region when the overall flatness of the back surface of the substrate is ensured. That is, when the back surface of the substrate is entirely matched to the flat surface in the inner region, the back surface of the substrate may be lifted from the flat surface to the front surface side of the substrate in the outer region. However, the end face positions of the plurality of designated outer convex portions (description of "position of the surface" means "the position of the surface with respect to the main surface of the base") constitute a plurality of inner convex portion groups. Higher than the end face position of each of the inner convexes of Therefore, the substrate is held such that the back surface position of the outer region of the substrate is higher than the back surface position of the inner region. Therefore, even in the case as described above, the substrate can be held by vacuum suction so as to improve the overall flatness of the substrate surface.
本発明の真空吸着部材において、前記複数の指定外側凸部のそれぞれの端面の少なくとも一部と、前記複数の内側凸部のそれぞれの端面の少なくとも一部と、が前記基体の主面に対して平行であることが好ましい。 In the vacuum suction member of the present invention, at least a portion of each end face of the plurality of designated outer convex portions and at least a portion of each end face of each of the plurality of inner convex portions with respect to the main surface of the base It is preferred that they be parallel.
当該構成の真空吸着部材によれば、基板の内側領域および外側領域のそれぞれにおける、基体の主面を基準とした基板裏面の位置に差をつけながら、基板の内側領域および外側領域のそれぞれにおいて基板裏面を基体の主面に対して平行な状態で基板が保持される。これにより、基板の内側領域よりも外側領域が薄く、かつ、基板の内側領域および外側領域のそれぞれにおいて基板裏面が平行または略平行（わずかに基板裏面に対して傾斜した面）である場合、基板表面の全体的な平坦度の向上が図られる。 According to the vacuum suction member of the configuration, the substrate in each of the inner region and the outer region of the substrate is provided while the position of the back surface of the substrate relative to the main surface of the substrate is different in each of the inner region and the outer region of the substrate. The substrate is held with the back surface parallel to the main surface of the substrate. Thus, when the outer region is thinner than the inner region of the substrate and the back surface of the substrate is parallel or substantially parallel (a surface slightly inclined to the back surface of the substrate) in each of the inner and outer regions of the substrate, The overall flatness of the surface is improved.
本発明の真空吸着部材において、前記複数の凸部を囲むように、前記基体の主面から突出する環状凸部をさらに備え、前記環状凸部の前記基体の主面を基準とする端面位置が、前記複数の指定外側凸部のそれぞれの前記基体の主面を基準とする端面位置よりも低いまたは前記複数の指定外側凸部のそれぞれの前記基体の主面を基準とする端面位置と同一であることが好ましい。 In the vacuum suction member of the present invention, an annular convex portion protruding from the main surface of the base is further provided to surround the plurality of convex portions, and an end face position of the annular convex portion with respect to the main surface of the base is The same as the end face position lower than the end face position based on the main surface of the base of each of the plurality of designated outer convex parts or the end face position based on the main face of the base of each of the plurality of designated outer convexes Is preferred.
当該構成の真空吸着部材によれば、少なくとも一部の凸部により支持された状態の基板の裏面と、基体の主面とにより挟まれた空間が周囲を環状凸部により囲まれている分だけ、当該空間においてより強い負圧領域が形成されうる。このため、当該空間に負圧領域が形成された際、基板の裏面と複数の内側凸部および複数の指定外側凸部のそれぞれの端面とを確実に当接させることができる。また、環状凸部の端面と基板の裏面との間に間隙が存在する場合、当該空間に負圧領域が形成される際、当該間隙を通じて当該空間に流れ込む空気の流速が局所的に高くなり、基板の外側領域に対してベルヌーイ力を作用させることができる。このため、当該空間に負圧領域が形成された際、基板の裏面と複数の指定外側凸部のそれぞれの端面とをさらに確実に当接させることができる。 According to the vacuum suction member of the configuration, the space between the back surface of the substrate supported by at least a part of the convex portion and the main surface of the base is surrounded by the annular convex portion. A stronger negative pressure region may be formed in the space. Therefore, when the negative pressure region is formed in the space, the end face of the back surface of the substrate can be reliably brought into contact with the end faces of the plurality of inner protrusions and the plurality of designated outer protrusions. Further, when a gap exists between the end face of the annular convex portion and the back surface of the substrate, when a negative pressure region is formed in the space, the flow velocity of air flowing into the space through the gap locally increases. Bernoulli force can be exerted on the outer area of the substrate. Therefore, when the negative pressure region is formed in the space, the back surface of the substrate can be more reliably brought into contact with the end surfaces of the plurality of designated outer convex portions.
本発明の真空吸着部材において、前記複数の指定外側凸部のそれぞれの端面位置と、前記複数の内側凸部のそれぞれの端面位置と、の高さの差が１０ｎｍ〜６００ｎｍの範囲に含まれていることが好ましい。 In the vacuum suction member of the present invention, the difference in height between the end face position of each of the plurality of designated outer convex portions and the end face position of each of the plurality of inner convex portions is included in the range of 10 nm to 600 nm. Is preferred.
当該構成の真空吸着部材によれば、内側領域において基板の裏面を全体的に平面に一致させた際に、外側領域において基板の裏面が当該平面から基板の表面側に１０ｎｍ〜６００ｎｍだけ浮き上がる場合がある。しかるに、前記のように基板の外側領域の裏面位置が、基板の内側領域の裏面位置よりも当該浮き上がり量または高さの差だけ高くなるように基板が保持される。よって、前記のような場合であっても、基板表面の全体的な平坦度の向上が図られるように当該基板が真空吸着保持されうる。 According to the vacuum suction member of the configuration, when the back surface of the substrate in the inner region is entirely matched with the flat surface, the back surface of the substrate may be lifted by 10 nm to 600 nm from the flat surface in the outer region. is there. However, as described above, the substrate is held such that the back surface position of the outer region of the substrate is higher than the back surface position of the inner region of the substrate by the difference in the floating amount or the height. Therefore, even in the case as described above, the substrate can be held by vacuum suction so as to improve the overall flatness of the substrate surface.
（第１実施形態）
（構成）
図１および図２に示されている本発明の第１実施形態としての真空吸着部材は、基体１と、基体１の主面１０２から突出する複数の凸部１０と、複数の凸部１０を取り囲むように延在して基体１の主面１０から突出する環状凸部１４と、基体１の内部を通り、基体１の主面１０２に開口部２０２を有する通気経路２０と、を備えている。
First Embodiment
(Constitution)
The vacuum suction member according to the first embodiment of the present invention shown in FIGS. 1 and 2 comprises a base 1, a plurality of projections 10 projecting from the main surface 102 of the base 1, and a plurality of projections 10. An annular convex portion 14 extending so as to surround and project from the main surface 10 of the base 1 and a ventilation path 20 having an opening 202 in the main surface 102 of the base 1 through the inside of the base 1 .
基体１は、例えば略平板状のＳｉＣ、ＡｌＮ、Ａｌ2Ｏ3等のセラミックス焼結体からなる。複数の凸部１０、環状凸部１４および通気経路２０のそれぞれは、研削加工、ブラスト加工、ミリング加工もしくはレーザー加工またはこれらの組み合わせにより形成される。基体１の主面１０２は略平面状に形成されている。 The substrate 1 is made of, for example, a substantially flat plate-like sintered body of ceramic such as SiC, AlN, Al 2 O 3 or the like. Each of the plurality of projections 10, the annular projection 14 and the ventilation path 20 is formed by grinding, blasting, milling, laser processing, or a combination thereof. The main surface 102 of the base 1 is formed in a substantially planar shape.
複数の凸部１０は、基体１の主面１０２において三角格子もしくは正方格子等の格子様に配置されるほか、複数の同心円のそれぞれに沿って配置され、あるいは、中心から延在する複数の放射線のそれぞれに沿って規則的に配置される等、規則的に配置されてもよく、不規則的に配置されていてもよい。各凸部１０は、略柱状、略錐台状、柱状体または錐台状体の端面または上底に、小面積の底面または下底を有する柱状体、半球、半楕円球または錐台状体が乗ったような複数の段差付きの略柱状など、様々な形状に形成されていてもよい。 The plurality of convex portions 10 are arranged in a lattice form such as a triangular lattice or a square lattice on the main surface 102 of the base body 1, and are arranged along each of a plurality of concentric circles or a plurality of radiations extending from the center They may be regularly arranged, such as regularly arranged along each of the two, or may be irregularly arranged. Each convex portion 10 is a columnar body, a hemisphere, a semi-elliptic sphere or a frustum having a bottom surface or a lower base of a small area on the end face or upper bottom of a substantially columnar, substantially frustum shape, columnar body or frustum shape It may be formed in various shapes, such as a substantially columnar shape with a plurality of steps, such as the ones on which it rides.
真空吸着部材の縦断面図において環状凸部１４の形状が略矩形状のほか、略台形状、半楕円形状、真円形状、または、矩形と当該矩形の一辺を直径とする半円形とが組み合わせられた形状など、様々な形状であってもよい。なお、環状凸部１４が省略されてもよい。 In the longitudinal sectional view of the vacuum suction member, in addition to the substantially rectangular shape, the shape of the annular convex portion 14 is a substantially trapezoidal shape, a semielliptical shape, a perfect circle shape, or a combination of a rectangle and a semicircle having one side of the rectangle as a diameter The shape may be various, such as the shape that has been made. The annular convex portion 14 may be omitted.
複数の凸部１０は、内側凸部群１１および外側凸部群１２により構成されている。内側凸部群１１は、基体１の主面１０２において中心から半径Ｒ1の円形状の内側領域Ｓ1に配置されている複数の内側凸部１１２により構成されている。外側凸部群１２は、基体１の主面１０２において内側領域Ｓ1を取り囲む、中心から半径Ｒ2の外縁を有する環状の外側領域Ｓ2に配置されている複数の外側凸部１２２により構成されている。外側領域Ｓ2の外縁および環状凸部１４の内縁とは一致している。 The plurality of convex portions 10 are configured by the inner convex portion group 11 and the outer convex portion group 12. Inner convex portion group 11 is composed of a plurality of inner protrusions 112 are arranged from the center in the main surface 102 of the substrate 1 to the circular inner area S 1 of radius R 1. The outer convex group 12 is constituted by a plurality of outer convex parts 122 disposed in an annular outer area S 2 having an outer edge of radius R 2 from the center and surrounding the inner area S 1 on the main surface 102 of the base 1 ing. It is coincident with the inner edge of the outer edge and the annular convex portion 14 of the outer region S 2.
内側領域Ｓ1および外側領域Ｓ2の合計面積（＝πＲ2 2）に対する、外側領域Ｓ2の面積（＝π（Ｒ2 2−Ｒ1 2））の比率（＝１−Ｒ1 2／Ｒ2 2）は、例えば０．０１〜０．０７の範囲に含まれるように内側領域Ｓ1および外側領域Ｓ2が定義されている。内側領域Ｓ1の外縁は円環状に限られず、円環に沿って延在する波線状またはジグザグ線状であってもよい。外側領域Ｓ2の外縁は円環状に限られず、円環に沿って延在する波線状またはジグザグ線状であってもよい。その場合における「外縁」とは、波線状またはジグザグ線状の最外径部分を意味する。 To the total area of the inner region S 1 and the outer region S 2 (= πR 2 2) , the area of the outer region S 2 (= π (R 2 2 -R 1 2)) Ratio of (= 1-R 1 2 / R 2 2), the inner region S 1 and the outer area S 2 are defined to be within the scope of example 0.01 to 0.07. The outer edge of the inner area S 1 is not limited to the annular shape, or may be a wavy or zigzag line shape extending along the torus. The outer edge of the outer region S 2 is not limited to the annular shape, or may be a wavy or zigzag line shape extending along the torus. The "outer edge" in that case means the outermost part of a wavy line or zigzag line shape.
基体１の主面１０２において、複数の内側凸部１１２の配置態様と複数の外側凸部１２２の配置態様とが同一であってもよく、複数の内側凸部１１２が三角格子様に配置される一方で、複数の外側凸部１２２が一の円または複数の同心円に沿って配列されるなど相違していてもよい。各内側凸部１１２の形状と各外側凸部１２２の形状とが同一であっても相違していてもよい。 In the main surface 102 of the base 1, the arrangement of the plurality of inner projections 112 and the arrangement of the plurality of outer projections 122 may be the same, and the plurality of inner projections 112 are arranged in a triangular lattice shape. On the other hand, the plurality of outer projections 122 may be arranged to be arranged along one circle or a plurality of concentric circles. The shape of each inner protrusion 112 and the shape of each outer protrusion 122 may be the same or different.
外側凸部群１２のうち少なくとも一部を構成する複数の指定外側凸部１２２の基体１の主面１０２を基準とする端面１２２０の位置（突出高さＨ2）が、内側凸部群１１を構成する複数の内側凸部１１２のそれぞれの基体１の主面１０２を基準とする端面１１２０の位置（突出高さＨ1）よりも高い。本実施形態では、外側凸部群１２の「全部」を構成する複数の外側凸部１２２が「指定外側凸部」に該当するが、他の実施形態として外側凸部群１２の「一部のみ」を構成する複数の外側凸部１２２が「指定外側凸部」に該当していてもよい。 The position (protruding height H 2 ) of the end face 1220 based on the major surfaces 102 of the plurality of designated outer convex portions 122 constituting at least a part of the outer convex portion group 12 with respect to the inner convex portion group 11 It is higher than the position (protruding height H 1 ) of the end face 1120 based on the main surface 102 of the base 1 of each of the plurality of inner projections 112 to be configured. In the present embodiment, the plurality of outer protrusions 122 that constitute "all" of the outer protrusion group 12 correspond to "designated outer protrusions", but as another embodiment, "only a part of the outer protrusion group 12 is A plurality of outside convex parts 122 which constitute "" may correspond to a "designated outside convex part".
複数の指定外側凸部１２２のそれぞれの端面１２２０の位置と、複数の内側凸部１１２のそれぞれの端面１１２０の位置と、の高さの差Ｈ2−Ｈ1は、例えば１０ｎｍ〜６００ｎｍの範囲に含まれている。環状凸部１４の基体１の主面１０２を基準とする端面１４０の位置（突出高さＨ4）が、複数の指定外側凸部１２２のそれぞれの基体１の主面１０２を基準とする端面１２２０の位置（突出高さＨ2）よりも低いまたは当該端面１２２０の位置（突出高さＨ2）と同一である。本実施形態では、複数の指定外側凸部１２２のそれぞれの端面１２２０の少なくとも一部と、複数の内側凸部１１２のそれぞれの端面１１２０の少なくとも一部と、が基体１の主面１０２に対して平行である。 The height difference H 2 −H 1 between the positions of the end faces 1220 of the plurality of designated outer convex portions 122 and the positions of the end faces 1120 of the plurality of inner convex portions 112 is, for example, in the range of 10 nm to 600 nm. include. The position (protruding height H 4 ) of the end surface 140 of the annular convex portion 14 with respect to the main surface 102 of the base 1 is the end surface 1220 with respect to the main surface 102 of each of the plurality of designated outer convex portions 122. position the position (protruding height H 2) lower or the end surface 1220 than (protruding height H 2) to be identical. In the present embodiment, at least a portion of each of the end surfaces 1220 of the plurality of designated outer convex portions 122 and at least a portion of each of the end surfaces 1120 of each of the plurality of inner convex portions 112 It is parallel.
通気経路２０は、基体１の主面１０２における開口部２０２とは異なる開口部（主面１０２とは反対側の面における開口部）を通じて、通気経路２０の気圧を調整する圧力調整装置または真空吸引装置（図示略）に接続されている。 A pressure adjusting device or vacuum suction which adjusts the air pressure of the ventilation passage 20 through the opening (opening in the surface opposite to the main surface 102) different from the opening 202 in the main surface 102 of the base 1 It is connected to a device (not shown).
なお、図１および図２では真空吸着部材が概略的に表されており、当該真空吸着部材の構成要素のアスペクト比、間隔、個数などは、原則的に実際の設計値とは異なっている。これは、すべての実施形態において同様である。 1 and 2 schematically show the vacuum suction member, and the aspect ratio, interval, number, etc. of the components of the vacuum suction member are basically different from the actual design values. This is the same in all embodiments.
（機能）
本発明の第１実施形態としての真空吸着部材によれば、基体１の主面１０２の側において基板Ｗが真空吸着部材に載置されることにより、複数の凸部１０のうち少なくとも一部の凸部１０により基板Ｗが支持される（図３参照）。基板Ｗは、例えば図３に示されているように、内側領域Ｘ1よりも外側領域Ｘ2が薄く、かつ、基板Ｗの内側領域Ｘ1において裏面Ｗ2が一の平面に一致する際、基板Ｗの外側領域Ｘ2において裏面Ｗ2が当該一の平面よりも表面Ｗ1に近い他の平面に一致するような形状を本来的形状として有している。
(function)
According to the vacuum suction member as the first embodiment of the present invention, the substrate W is mounted on the vacuum suction member on the main surface 102 side of the substrate 1, whereby at least a part of the plurality of convex portions 10 is removed. The substrate W is supported by the convex portion 10 (see FIG. 3). Substrate W, as shown in FIG. 3, for example, thin outer region X 2 than the inner region X 1, and, when the back surface W 2 is equal to one plane in the inner region X 1 of the substrate W, in the outer region X 2 of the substrate W has a shape such as the back surface W 2 coincides with another plan close to the surface W 1 than the plane of the one as the original shape.
この状態で、基体１の主面１０２および基板Ｗの裏面Ｗ2により挟まれた空間から通気経路２０を介して空気が排出されることにより、当該空間に負圧領域が形成される。当該空間が周囲を環状凸部１４により囲まれている分だけ、当該空間においてより強い負圧領域が形成されうる（図１参照）。このため、基板Ｗの裏面Ｗ2と複数の内側凸部１１２および複数の指定外側凸部１２２のそれぞれの端面とを確実に当接させることができる。また、環状凸部１４の端面１４０と基板Ｗの裏面Ｗ2との間に間隙が存在する場合、当該空間に負圧領域が形成される際、当該間隙を通じて当該空間に流れ込む空気の流速が局所的に高くなり、基板Ｗの外側領域Ｘ2に対してベルヌーイ力を作用させることができる。その結果、図３に示されているように、基板Ｗの内側領域Ｘ1が複数の内側凸部１１２のそれぞれにより支持される一方、基板Ｗの外側領域Ｘ2が複数の指定外側凸部１２２により支持される。 In this state, the air is discharged from the space between the back surface W 2 of the main surface 102 and the substrate W of the substrate 1 through the vent path 20, a negative pressure region in the space is formed. As the space is surrounded by the annular convex portion 14, a stronger negative pressure region can be formed in the space (see FIG. 1). Therefore, it is possible to reliably abut the respective end surfaces of the back W 2 and a plurality of inner protrusions 112 and the plurality of designated outer projection 122 of the substrate W. Also, if there is a gap between the back surface W 2 of the end face 140 and the substrate W of the annular protrusion 14, when the negative pressure region in the space is formed, the flow rate of air flowing into the space through the gap topical And the Bernoulli force can act on the outer region X 2 of the substrate W. As a result, as shown in FIG. 3, while the inner region X 1 of the substrate W is supported by each of the plurality of inner convex portion 112, designated outer region X 2 of the substrate W is more outward projection 122 Supported by
基板Ｗが外側領域Ｘ2において内側領域Ｘ1よりも薄くなっているため、基板Ｗの裏面Ｗ2の全体的な平坦度が確保された場合に基板Ｗの表面Ｗ1の平坦度が外側領域Ｘ2で低下する場合がある。しかるに、基体１の主面１０２において外側領域Ｓ2に配置されている複数の指定外側凸部１２２の端面１２２０の位置が、基体１の主面１０２において内側領域Ｓ1に配置されている複数の内側凸部１１２のそれぞれの端面１１２０の位置よりも高い（図１参照）。 Since the substrate W is thinner than the inner region X 1 in the outer region X 2, the outer region flatness of the surface W 1 of the substrate W when the overall flatness of the back surface W 2 of the substrate W is ensured it may decrease in X 2. However, in the main surface 102 of the base 1, the positions of the end faces 1220 of the plurality of designated outer convex portions 122 arranged in the outer area S 2 are arranged in the inner area S 1 in the main surface 102 of the base 1. It is higher than the position of each end face 1120 of the inner side convex part 112 (refer FIG. 1).
このため、基板Ｗの外側領域Ｘ2の裏面Ｗ2の位置が内側領域Ｘ1の裏面Ｗ2の位置よりも高くなるように基板が保持される（図３参照）。よって、前記のような場合であっても、基板Ｗの表面Ｗ1の全体的な平坦度の向上が図られるように当該基板Ｗが真空吸着保持されうる。そして、基板Ｗの表面Ｗ1において、内側領域Ｘ1のみならず外側領域Ｘ2においても、所望のパターンの回路形成のためのエッチング処理など、所定の処理が実施されうる。 Therefore, the substrate is held to be higher than the position the position of the back surface W 2 of the outer region X 2 is a back surface W 2 of the inner region X 1 of the substrate W (see FIG. 3). Therefore, even when the like, the substrate W can be held vacuum suction as improving the overall flatness of the surface W 1 of the substrate W can be achieved. Then, the surface W 1 of the substrate W, even in the outer region X 2 not only the inner region X 1, such as an etching process for circuit formation of the desired pattern, the predetermined processing may be performed.
（第２実施形態）
（構成）
図４に一部が示されている本発明の第２実施形態としての真空吸着部材においては、指定外側凸部１２２の端面１２２０が基体１の主面１０２に対して傾斜している。詳細には、指定外側凸部１２２の端面１２２０の径方向最内側（突出高さＨ21）から径方向最外側（突出高さＨ22）にかけて基体１の主面１０２を基準とした位置が徐々に高くなるように、指定外側凸部１２２の端面１２２０が傾斜している。これ以外の構成は、第１実施形態の真空吸着部材と同様なので、同一の符号を用いるとともに説明を省略する。
Second Embodiment
(Constitution)
In the vacuum suction member according to the second embodiment of the present invention partially shown in FIG. 4, the end face 1220 of the designated outer convex portion 122 is inclined with respect to the main surface 102 of the base 1. More specifically, the position based on the main surface 102 of the base 1 is gradually made from the radially innermost (protruding height H 21 ) to the radial outermost (protruding height H 22 ) of the end face 1220 of the designated outer convex portion 122 The end face 1220 of the designated outer convex portion 122 is inclined so as to be high. The other configuration is the same as that of the vacuum suction member according to the first embodiment, so the same reference numerals will be used and the description will be omitted.
（機能）
本発明の第２実施形態としての真空吸着部材によれば、基体１の主面１０２の側において基板Ｗが真空吸着部材に載置されることにより、複数の凸部１０のうち少なくとも一部の凸部１０により基板Ｗが支持される（図４参照）。基板Ｗは、例えば図４に示されているように、少なくとも外側領域Ｘ2の一部において径方向内側から外側に行くにつれて徐々に薄くなり、かつ、基板Ｗの内側領域Ｘ1において裏面Ｗ2が一の平面に一致する際、基板Ｗの外側領域Ｘ2において裏面Ｗ2が当該一の平面に対して外側に行くほど表面Ｗ1に近づくように傾斜している他の平面に一致するような形状を本来的形状として有している。
(function)
According to the vacuum suction member as the second embodiment of the present invention, the substrate W is mounted on the vacuum suction member on the main surface 102 side of the substrate 1, whereby at least a part of the plurality of convex portions 10 is removed. The substrate W is supported by the convex portion 10 (see FIG. 4). For example, as shown in FIG. 4, the substrate W becomes gradually thinner at least in a part of the outer region X 2 as it goes from the radially inner side to the outer side, and the back surface W 2 in the inner region X 1 of the substrate W There when matching one plane, so that the back surface W 2 matches the other plane are inclined so as to approach the surface W 1 toward the outside with respect to the plane of the one in the outer region X 2 of the substrate W Shape as an inherent shape.
この状態で、基体１の主面１０２および基板Ｗの裏面Ｗ2により挟まれた空間から通気経路２０を介して空気が排出されることにより、当該空間に負圧領域が形成される。この結果、第１実施形態と同様、図４に示されているように、基板Ｗの内側領域Ｘ1が複数の内側凸部１１２のそれぞれにより支持される一方、基板Ｗの外側領域Ｘ2が複数の指定外側凸部１２２により支持される。すなわち、基板Ｗの外側領域Ｘ2の裏面Ｗ2の位置が、基板Ｗの内側領域Ｘ1の裏面Ｗ2の位置よりも高くなるように基板が保持される（図４参照）。よって、前記のような場合であっても、基板Ｗの表面Ｗ1の全体的な平坦度の向上が図られるように当該基板Ｗが真空吸着保持されうる。 In this state, the air is discharged from the space between the back surface W 2 of the main surface 102 and the substrate W of the substrate 1 through the vent path 20, a negative pressure region in the space is formed. As a result, similarly to the first embodiment, as shown in FIG. 4, while the inner region X 1 of the substrate W is supported by each of the plurality of inner convex portion 112, the outer region X 2 of the substrate W It is supported by a plurality of designated outer protrusions 122. That is, the position of the back surface W 2 of the outer region X 2 of the substrate W, the substrate is held to be higher than the position of the back surface W 2 of the inner region X 1 of the substrate W (see FIG. 4). Therefore, even when the like, the substrate W can be held vacuum suction as improving the overall flatness of the surface W 1 of the substrate W can be achieved.
（実施例）
第１実施形態にしたがって実施例の真空吸着部材が作製された（図１参照）。外径φ３００［ｍｍ］、厚み１．２［ｍｍ］の略円盤状の炭化珪素（ＳｉＣ）セラミックス焼結体により基体１が作製された。
(Example)
The vacuum suction member of the example was produced according to the first embodiment (see FIG. 1). A substrate 1 was produced from a substantially disk-shaped silicon carbide (SiC) ceramic sintered body having an outer diameter of 300 mm and a thickness of 1.2 mm.
基体１の主面１０２の径φ２９３［ｍｍ］の内側領域Ｓ1において、ピッチ３．０［ｍｍ］の三角格子の各格子点に配置された径φ０．５［ｍｍ］、突出高さＨ1＝１５０［μｍ］の略円柱状の複数の突起が、複数の凸部１０として形成された。 In the inner region S 1 of the diameter φ293 [mm] of the main surface 102 of the base 1, the pitch 3.0 diameter located at each lattice point of the triangular lattice of [mm] φ0.5 [mm], the protruding height H 1 A plurality of substantially cylindrical protrusions of 150 [μm] are formed as the plurality of protrusions 10.
基体１の主面１０２において内径φ２９３［ｍｍ］、外径φ２９８［ｍｍ］の環状の外側領域Ｓ2において、ピッチ３．０［ｍｍ］の三角格子の各格子点に配置された径φ０．５［ｍｍ］、突出高さＨ2＝１５０．１［μｍ］の略円柱状の複数の突起が、指定外側凸部１２２として形成された。 Inner diameter φ293 [mm] in the main surface 102 of the substrate 1, the annular outer area S 2 of the outer diameter φ298 [mm], the diameter located at each lattice point of a triangular lattice of pitch 3.0 [mm] φ0.5 A plurality of substantially cylindrical protrusions having a projection height H 2 of 150.1 μm were formed as the designated outer convex portions 122.
基体１の主面１０２において、外径φ２９９［ｍｍ］、幅０．５［ｍｍ］、突出高さＨ4＝１５０［μｍ］の円環状の凸部が環状凸部１４として形成された。基体１において主面１０２の中心にφ０．８［ｍｍ］の厚さ方向に貫通する１個の貫通孔が通気経路２０として形成された。 On the main surface 102 of the base 1, an annular convex having an outer diameter of 299 [mm], a width of 0.5 [mm], and a protruding height H 4 = 150 [μm] is formed as the annular convex part 14. In the base 1, one through hole penetrating in the thickness direction of φ 0.8 [mm] at the center of the main surface 102 was formed as the ventilation path 20.
（比較例）
外側領域Ｓ2に配置された径φ０．５［ｍｍ］、突出高さＨ2＝１５０［μｍ］の略円柱状の複数の突起が、指定外側凸部１２２として形成された点を除き、実施例と同様に比較例１の真空吸着部材が作製された。
(Comparative example)
Implementation except that a plurality of substantially cylindrical protrusions with a diameter of φ0.5 mm and a protrusion height H 2 of 150 μm disposed in the outer region S 2 are formed as the designated outer protrusion 122 The vacuum suction member of Comparative Example 1 was manufactured as in the example.
（評価）
実施例および比較例のそれぞれの真空吸着部材の基体１の主面１０２の側に径φ３００［ｍｍ］、厚さｔ０．７［ｍｍ］の基板Ｗ（シリコンウエハ）が載置された。非接触式のレーザー干渉計（ＺＹＧＯ社製 ＧＰＩ Ｈｓ）を用いて測定された基板Ｗの表面Ｗ1の本来的な平坦度（２０ｍｍ×２０ｍｍの正方領域のローカルフラットネス）を表わすＰＶ値の最大値は０．０３７［μｍ］であった。その後、基板Ｗの裏面Ｗ2および基体１の主面１０２により挟まれた空間が通気経路２０を通じて真空吸引装置により減圧された。これによって真空吸着部材に基板Ｗが保持された。
(Evaluation)
A substrate W (silicon wafer) with a diameter of 300 mm and a thickness of 0.7 mm was mounted on the main surface 102 side of the base 1 of the vacuum suction member of each of the example and the comparative example. Maximum PV value representing the inherent flatness (local flatness of 20 mm × 20 mm square area) of the surface W 1 of the substrate W measured using a non-contact laser interferometer (GPI Hs manufactured by ZYGO) The value was 0.037 [μm]. Thereafter, the space sandwiched by the back surface W 2 of the substrate W and the main surface 102 of the base 1 was depressurized by the vacuum suction device through the ventilation path 20. Thus, the substrate W was held by the vacuum suction member.
この状態で、基板Ｗの表面Ｗ1において径φ２９７［ｍｍ］の円形領域における２０ｍｍ×２０ｍｍのＰＶ値の最大値が測定された。また、基板Ｗの表面Ｗ1において径φ２９８［ｍｍ］以下の円形領域（内側領域Ｘ1および外側領域Ｘ2の少なくとも一部を含む）におけるＰＶ値の最大値が、非接触式のレーザー干渉計を用いてＰＶ値として測定された。これらの測定結果を表１にまとめて示す。 In this state, the maximum value of the PV value of 20 mm × 20 mm in the circular area of diameter 297 [mm] on the surface W 1 of the substrate W was measured. The maximum value of the PV values in the radial φ298 the surface W 1 of the substrate W [mm] or less circular region (including at least part of the inner region X 1 and the outer region X 2) is a laser interferometer of the non-contact Was measured as a PV value using These measurement results are summarized in Table 1 below.
表１から、実施例の真空吸着部材によれば、基板Ｗの表面Ｗ1の内側領域Ｘ1のみならず、内側領域Ｘ1および外側領域Ｘ2を含む全体的な平坦度の向上が図られていることがわかる。 From Table 1, according to the vacuum suction member embodiment, not only the inner region X 1 of the surface W 1 of the substrate W, are reduced to improve the overall flatness including an inner region X 1 and the outer region X 2 Know that
１‥基体、１０‥凸部、１１‥内側凸部群、１２‥外側凸部群、１４‥環状凸部、２０‥通気経路、１０２‥基体の主面、１１２‥内側凸部、１２２‥外側突部（指定外側凸部）、２０２‥開口部、１１２０‥内側凸部の端面、１２２０‥外側凸部の端面、Ｓ1‥主面の内側領域、Ｓ2‥主面の外側領域、Ｗ‥基板（ウエハ）、Ｗ1‥基板表面、Ｗ2‥基板裏面、Ｘ1‥基板の内側領域、Ｘ2‥基板の外側領域。 1. base body 10. convex portion 11. inner convex portion group 12. outer convex portion group 14. annular convex portion 20 ventilating path 102 main surface of base 112 inner convex portion 122 outer side Projection (designated outer convex portion), 202. opening, 1120 .. end face of inner convex portion, 1220 .. end face of outer convex portion, S 1 .. inner region of main surface, S 2 .. outer region of main surface, W .. Substrate (Wafer), W 1 .. Substrate surface, W 2 .. Substrate back surface, X 1 .. Substrate inner region, X 2 .. Substrate outer region.
Claims (4)
前記基体の主面から突出する複数の凸部と、
前記基体の内部を通り、前記基体の主面に開口部を有する通気経路と、を備え、
前記複数の凸部が、前記基体の主面において内側領域に配置されている内側凸部群と、前記基体の主面において前記内側領域を取り囲む環状の外側領域に配置されている外側凸部群と、により構成され、
前記外側凸部群を構成する複数の外側凸部のうち少なくとも一部である複数の指定外側凸部のそれぞれの前記基体の主面を基準とする端面位置が、前記内側凸部群を構成する複数の内側凸部のそれぞれの前記基体の主面を基準とする端面位置よりも高いことを特徴とする真空吸着部材。 A substrate,
A plurality of projections projecting from the main surface of the substrate;
Passing through the interior of the substrate, and a venting passage having an opening in the main surface of the substrate;
The plurality of convex portions are an inner convex group arranged in an inner area on the main surface of the base, and an outer convex group arranged in an annular outer area surrounding the inner area on the main surface of the base And consists of
An end face position based on the main surface of the base of each of a plurality of designated outer convex portions which are at least a part of the plurality of outer convex portions constituting the outer convex portion group constitutes the inner convex portion group A vacuum suction member characterized by being higher than the end face position based on the main surface of said base of each of a plurality of inner convex parts.
前記複数の指定外側凸部のそれぞれの端面の少なくとも一部と、前記複数の内側凸部のそれぞれの端面の少なくとも一部と、が前記基体の主面に対して平行であることを特徴とする真空吸着部材。 In the vacuum suction member according to claim 1,
At least a portion of the end face of each of the plurality of designated outer convex portions and at least a portion of each end face of each of the plurality of inner convex portions are parallel to the main surface of the base. Vacuum suction member.
前記複数の凸部を囲むように、前記基体の主面から突出する環状凸部をさらに備え、
前記環状凸部の前記基体の主面を基準とする端面位置が、前記複数の指定外側凸部のそれぞれの前記基体の主面を基準とする端面位置よりも低いまたは前記複数の指定外側凸部のそれぞれの前記基体の主面を基準とする端面位置と同一であることを特徴とする真空吸着部材。 In the vacuum suction member according to claim 1 or 2,
An annular convex portion protruding from the main surface of the base body is further provided to surround the plurality of convex portions,
The end surface position of the annular convex portion based on the main surface of the base is lower than the end surface position based on the main surface of the base of each of the plurality of designated outer convex portions or the plurality of designated outer convex portions The vacuum suction member characterized in that it is the same as the end face position based on the main surface of each of the substrates.
前記複数の指定外側凸部のそれぞれの端面位置と、前記複数の内側凸部のそれぞれの端面位置と、の高さの差が１０ｎｍ〜６００ｎｍの範囲に含まれていることを特徴とする真空吸着部材。 In the vacuum suction member according to any one of claims 1 to 3,
The difference in height between the end face position of each of the plurality of designated outer convex portions and the end face position of each of the plurality of inner convex portions is included in the range of 10 nm to 600 nm. Element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017244690A JP7011459B2 (en) | 2017-12-21 | 2017-12-21 | Vacuum suction member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017244690A JP7011459B2 (en) | 2017-12-21 | 2017-12-21 | Vacuum suction member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019114589A true JP2019114589A (en) | 2019-07-11 |
| JP7011459B2 JP7011459B2 (en) | 2022-01-26 |
Family
ID=67223797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017244690A Active JP7011459B2 (en) | 2017-12-21 | 2017-12-21 | Vacuum suction member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7011459B2 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001060617A (en) * | 1999-08-20 | 2001-03-06 | Canon Inc | Substrate suction holding device, aligner using the substrate suction holding device and manufacture of the device |
| JP2001176957A (en) * | 1999-12-20 | 2001-06-29 | Ngk Spark Plug Co Ltd | Suction plate and evacuator |
| JP2006054379A (en) * | 2004-08-13 | 2006-02-23 | Komatsu Electronic Metals Co Ltd | Suction tool and polishing apparatus |
| JP2008103703A (en) * | 2006-09-20 | 2008-05-01 | Canon Inc | Substrate retaining unit, exposure apparatus provided with substrate retaining unit, and device manufacturing method |
| WO2014084060A1 (en) * | 2012-11-28 | 2014-06-05 | 京セラ株式会社 | Placement member and method for manufacturing same |
| JP2017174898A (en) * | 2016-03-22 | 2017-09-28 | 日本特殊陶業株式会社 | Substrate support member |
-
2017
- 2017-12-21 JP JP2017244690A patent/JP7011459B2/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001060617A (en) * | 1999-08-20 | 2001-03-06 | Canon Inc | Substrate suction holding device, aligner using the substrate suction holding device and manufacture of the device |
| JP2001176957A (en) * | 1999-12-20 | 2001-06-29 | Ngk Spark Plug Co Ltd | Suction plate and evacuator |
| JP2006054379A (en) * | 2004-08-13 | 2006-02-23 | Komatsu Electronic Metals Co Ltd | Suction tool and polishing apparatus |
| JP2008103703A (en) * | 2006-09-20 | 2008-05-01 | Canon Inc | Substrate retaining unit, exposure apparatus provided with substrate retaining unit, and device manufacturing method |
| WO2014084060A1 (en) * | 2012-11-28 | 2014-06-05 | 京セラ株式会社 | Placement member and method for manufacturing same |
| JP2017174898A (en) * | 2016-03-22 | 2017-09-28 | 日本特殊陶業株式会社 | Substrate support member |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7011459B2 (en) | 2022-01-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6650345B2 (en) | Substrate holding device and method of manufacturing the same | |
| JP6546550B2 (en) | Vacuum adsorption member and vacuum adsorption method | |
| JP6510461B2 (en) | Substrate holding device | |
| JP6496255B2 (en) | Substrate holding device | |
| JPWO2012043349A1 (en) | Suction plate | |
| JP2019114589A (en) | Vacuum suction member | |
| KR102071123B1 (en) | Substrate holding device, substrate holding member, and substrate holding method | |
| JP7125326B2 (en) | Substrate holding member | |
| JP6680649B2 (en) | Vacuum suction member | |
| JP2022111715A (en) | Substrate holding member | |
| JP2021197373A (en) | Substrate holding device | |
| JP2023045060A (en) | Substrate holding member | |
| JP7178831B2 (en) | Substrate holding member | |
| JP2019114590A (en) | Vacuum suction member | |
| JP6960293B2 (en) | Board holding member | |
| JP6975601B2 (en) | Board holding member and board holding method | |
| JP2017199790A (en) | Vacuum suction member | |
| US20240139913A1 (en) | Substrate holding member | |
| JP7260984B2 (en) | Substrate holding member | |
| JP6711721B2 (en) | Vacuum suction member | |
| JP6581495B2 (en) | Substrate holding device | |
| JP2020177952A (en) | Substrate holding member | |
| JP6236256B2 (en) | Vacuum adsorption apparatus and vacuum adsorption method | |
| JP6946167B2 (en) | Board holding member | |
| CN117878048A (en) | Substrate holding member |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200904 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20210819 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210914 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20211013 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220111 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220114 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7011459 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |