JP2019110199A - Electronic component cooling apparatus - Google Patents

Electronic component cooling apparatus Download PDF

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JP2019110199A
JP2019110199A JP2017241898A JP2017241898A JP2019110199A JP 2019110199 A JP2019110199 A JP 2019110199A JP 2017241898 A JP2017241898 A JP 2017241898A JP 2017241898 A JP2017241898 A JP 2017241898A JP 2019110199 A JP2019110199 A JP 2019110199A
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evaporator
electronic component
flow path
condenser
refrigerant liquid
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英喜 佐々木
Hideki Sasaki
英喜 佐々木
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Keihin Corp
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Keihin Corp
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Abstract

To provide an electronic component cooling apparatus capable of improving cooling performance of an electronic component.SOLUTION: An electronic component cooling apparatus 1 comprises: an evaporator 10 evaporating a coolant liquid by heat of an electronic component E; a capacitor 20 condensing refrigerant vapor occurred in the evaporator 10 and reproducing it to the coolant liquid; a circulation channel 30 having a first channel 31 flowing the refrigerant vapor from the evaporator 10 to the capacitor 20, and a second channel 32 flowing the refrigerant vapor from the capacitor 20 to the evaporator 10; and a compressor 40 which is provided to the first channel 31, and acts a circulation force in the refrigerant vapor toward the capacitor 20. In a downstream part of the evaporator 10 or the second channel 32, a restriction part 12 restricting the channel of the coolant liquid is provided.SELECTED DRAWING: Figure 1

Description

本発明は、電子部品冷却装置に関する。   The present invention relates to an electronic component cooling device.

車両等に搭載されるパワーモジュールには、発熱量の多い電子部品が複数用いられるため、これらの電子部品を冷却する冷却装置が設けられている。例えば、特許文献１には、電子部品を冷媒液により冷却する冷却器と、冷媒液を冷却する凝縮器と、冷媒液を移動させるポンプと、を備える冷却装置が開示されている。   Since a plurality of electronic components having a large amount of heat generation are used in a power module mounted on a vehicle or the like, a cooling device for cooling these electronic components is provided. For example, Patent Document 1 discloses a cooling device provided with a cooler that cools an electronic component with a refrigerant liquid, a condenser that cools the refrigerant liquid, and a pump that moves the refrigerant liquid.

特開平６−３１８６５６号公報Japanese Patent Application Laid-Open No. 6-318656

特許文献１の冷却装置においては、ポンプは、凝縮器から冷却器に冷媒液を流通させる流路に設けられ、冷媒液を冷却器へ向けて流動させる。したがって、ポンプの下流側に位置する冷却器では、ポンプの作動により冷却器内の圧力が上がってしまう可能性がある。この結果、冷却器内の冷媒液の沸点が上がってしまい、電子部品の冷却性能が低下する可能性がある。   In the cooling device of Patent Document 1, the pump is provided in a flow path for circulating the refrigerant liquid from the condenser to the cooler, and causes the refrigerant liquid to flow toward the cooler. Therefore, in the cooler located downstream of the pump, the pressure in the cooler may rise due to the operation of the pump. As a result, the boiling point of the refrigerant liquid in the cooler may rise, and the cooling performance of the electronic component may be reduced.

本発明は、前述した事情に鑑みてなされたものであり、電子部品の冷却性能を向上させることができる電子部品冷却装置を提供することを目的とする。   The present invention has been made in view of the above-described circumstances, and an object thereof is to provide an electronic component cooling device capable of improving the cooling performance of the electronic component.

上記目的を達成するために、本発明では、電子部品冷却装置に係る第１の解決手段として、電子部品の熱により冷媒液を気化させる蒸発器と、前記蒸発器で発生した冷媒蒸気を凝縮させて前記冷媒液に再生する凝縮器と、前記冷媒蒸気を前記蒸発器から前記凝縮器に流通させる第１流路と、前記冷媒液を前記凝縮器から前記蒸発器に流通させる第２流路とを有する循環流路と、前記第１流路に設けられ、前記冷媒蒸気に前記凝縮器へ向けた流動力を作用させる蒸気流動化手段と、を備え、前記蒸発器又は前記第２流路の下流部には、前記冷媒液の流路を絞った絞り部が設けられる、という手段を採用する。   In order to achieve the above object, in the present invention, as a first solution according to an electronic component cooling device, an evaporator for evaporating a refrigerant liquid by heat of the electronic component and a refrigerant vapor generated in the evaporator are condensed. A condenser that regenerates the refrigerant liquid, a first flow path that causes the refrigerant vapor to flow from the evaporator to the condenser, and a second flow path that causes the refrigerant liquid to flow from the condenser to the evaporator And a fluidization means provided in the first flow path for causing a flow force directed to the condenser on the refrigerant vapor, the evaporator or the second flow path In the downstream portion, a throttling portion for throttling the flow path of the refrigerant liquid is provided.

また、本発明では、電子部品冷却装置に係る第２の解決手段として、上記第１の解決手段において、前記絞り部は、前記電子部品に対応して前記蒸発器内に設けられる表面積拡張部材である、という手段を採用する。   Further, in the present invention, as a second solution according to the electronic component cooling device, in the first solution, the throttling portion is a surface area expansion member provided in the evaporator corresponding to the electronic component. Adopt a means of

また、本発明では、電子部品冷却装置に係る第３の解決手段として、上記第１又は第２の解決手段において、前記絞り部は、前記第２流路の前記下流部に設けられる絞り通路である、という手段を採用する。   Further, in the present invention, as the third solution according to the electronic component cooling device, in the first or second solution, the throttling portion is a throttling passage provided in the downstream portion of the second flow passage. Adopt a means of

また、本発明では、電子部品冷却装置に係る第４の解決手段として、上記第１〜第３のいずれか１つの解決手段において、前記蒸発器の内部の圧力を調整する圧力調整手段をさらに備える、という手段を採用する。   Further, according to the present invention, as a fourth solution according to the electronic component cooling device, in any one of the first to third solutions, the apparatus further comprises pressure adjusting means for adjusting the pressure inside the evaporator. Adopt means of.

本発明によれば、電子部品の冷却性能を向上させることができる。   According to the present invention, the cooling performance of the electronic component can be improved.

本発明の第１実施形態に係る電子部品冷却装置の全体図である。FIG. 1 is an overall view of an electronic component cooling device according to a first embodiment of the present invention. 本発明の第２実施形態に係る電子部品冷却装置の全体図である。It is a general view of the electronic component cooling device concerning a 2nd embodiment of the present invention. 本発明の第３実施形態に係る電子部品冷却装置の全体図である。It is a general view of the electronic component cooling device concerning a 3rd embodiment of the present invention.

（第１実施形態）
以下、図１を参照し、本発明の第１実施形態に係る電子部品冷却装置１（以下、単に冷却装置１とも称する）について説明する。冷却装置１は、電子部品Ｅの冷却に用いられる。電子部品Ｅは、例えば、ハイブリッド車や電気自動車等、モータ（電動機）を動力源として走行する車両に搭載されるＰＣＵ（パワーコントロールユニット）のパワー半導体モジュールである。 First Embodiment
Hereinafter, an electronic component cooling device 1 (hereinafter, also simply referred to as a cooling device 1) according to a first embodiment of the present invention will be described with reference to FIG. The cooling device 1 is used to cool the electronic component E. The electronic component E is, for example, a power semiconductor module of a PCU (power control unit) mounted on a vehicle traveling using a motor (electric motor) as a power source, such as a hybrid vehicle or an electric vehicle.

冷却装置１は、蒸発器１０と、凝縮器２０と、循環流路３０と、圧縮機（蒸気流動化手段）４０と、を備える。
蒸発器１０は、電子部品Ｅの熱により冷媒液を気化させる。凝縮器２０は、蒸発器１０で発生した冷媒蒸気を凝縮させて冷媒液に再生する。循環流路３０は、冷媒蒸気を蒸発器１０から凝縮器２０に流通させる第１流路３１と、冷媒液を凝縮器２０から蒸発器１０に流通させる第２流路３２とを有する。圧縮機４０は、第１流路３１に設けられ、冷媒蒸気に凝縮器２０へ向けた流動力を作用させる。 The cooling device 1 includes an evaporator 10, a condenser 20, a circulation flow path 30, and a compressor (vapor fluidizing means) 40.
The evaporator 10 vaporizes the refrigerant liquid by the heat of the electronic component E. The condenser 20 condenses the refrigerant vapor generated in the evaporator 10 and regenerates it into the refrigerant liquid. The circulation flow path 30 has a first flow path 31 for circulating the refrigerant vapor from the evaporator 10 to the condenser 20 and a second flow path 32 for circulating the refrigerant liquid from the condenser 20 to the evaporator 10. The compressor 40 is provided in the first flow path 31 and exerts a flow force directed to the condenser 20 on the refrigerant vapor.

蒸発器１０は、略直方体形状のハウジング１１と、ハウジング１１の内部に設けられる表面積拡張部材１２とを有する。
ハウジング１１は、略直方体形状を有する。ハウジング１１の内部には、冷媒液が貯留される。ハウジング１１の底壁１１ａは、電子部品Ｅが取り付けられる取付面１１ｂを有する。取付面１１ｂは、底壁１１ａの外面である。
ハウジング１１の上部には、第１流路３１の一端が接続される。ハウジング１１の下部には、第２流路３２の一端が接続される。 The evaporator 10 has a substantially rectangular parallelepiped housing 11 and a surface area expansion member 12 provided inside the housing 11.
The housing 11 has a substantially rectangular parallelepiped shape. A refrigerant liquid is stored inside the housing 11. The bottom wall 11 a of the housing 11 has a mounting surface 11 b to which the electronic component E is attached. The mounting surface 11b is an outer surface of the bottom wall 11a.
One end of the first flow path 31 is connected to the upper portion of the housing 11. One end of a second flow passage 32 is connected to the lower portion of the housing 11.

表面積拡張部材（絞り部）１２は、電子部品Ｅに対応して取付面１１ｂの背面１１ｃに設けられる。背面１１ｃは、底壁１１ａの内面である。表面積拡張部材１２は、背面１１ｃに接するよう設けられる。表面積拡張部材１２は、ハウジング１１に貯留される冷媒液に浸漬されている。表面積拡張部材１２は、多孔質体である。冷媒液が表面積拡張部材１２の内部を移動することにより、冷媒液の流路が絞られる。   The surface area expansion member (throttle portion) 12 is provided on the back surface 11 c of the mounting surface 11 b corresponding to the electronic component E. The back surface 11c is an inner surface of the bottom wall 11a. The surface area expansion member 12 is provided in contact with the back surface 11 c. The surface area expansion member 12 is immersed in the refrigerant liquid stored in the housing 11. The surface area expansion member 12 is a porous body. The refrigerant liquid moves inside the surface area expansion member 12 to narrow the flow path of the refrigerant liquid.

凝縮器２０には、ファン２１が設けられる。
凝縮器２０の上部には、第１流路３１の他端が接続される。凝縮器２０の下部には、第２流路３２の他端が接続される。 The condenser 20 is provided with a fan 21.
The other end of the first flow path 31 is connected to the top of the condenser 20. The other end of the second flow path 32 is connected to the lower portion of the condenser 20.

第１流路３１は、蒸発器１０の下流と凝縮器２０の上流とを接続する。
第２流路３２は、凝縮器２０の下流と蒸発器１０の上流とを接続する。 The first flow path 31 connects the downstream of the evaporator 10 and the upstream of the condenser 20.
The second flow path 32 connects the downstream of the condenser 20 and the upstream of the evaporator 10.

圧縮機４０は、第１流路３１の途中部位に設けられる。圧縮機４０は、蒸発器１０から供給されてくる冷媒蒸気を加圧して、凝縮器２０へ送る。   The compressor 40 is provided in the middle of the first flow path 31. The compressor 40 pressurizes the refrigerant vapor supplied from the evaporator 10 and sends it to the condenser 20.

次に、上記構成の冷却装置１の動作について説明する。
蒸発器１０において、ハウジング１１に貯留される冷媒液により、電子部品Ｅが冷却される。具体的には、電子部品Ｅの熱は、底壁１１ａへ伝達される。冷媒液は、底壁１１ａの熱を回収して、冷媒蒸気を生成する。すなわち、冷媒液は、液体の状態から気体の状態に変化する時に、底壁１１ａ（電子部品Ｅ）の熱を吸収して、底壁１１ａ（電子部品Ｅ）を冷却する。このように、電子部品Ｅは、底壁１１ａを介して冷媒液と間接的に熱交換を行うことにより、冷却される。ここで、表面積拡張部材１２は、多孔質体として構成されている。したがって、冷媒液が表面積拡張部材１２の内部を移動することにより、伝熱面積が増大するため、熱交換効率が向上する。この結果、電子部品Ｅの冷却が促進される。 Next, the operation of the cooling device 1 configured as described above will be described.
In the evaporator 10, the electronic component E is cooled by the refrigerant liquid stored in the housing 11. Specifically, the heat of the electronic component E is transmitted to the bottom wall 11a. The refrigerant liquid recovers the heat of the bottom wall 11a to generate a refrigerant vapor. That is, when the refrigerant liquid changes from the liquid state to the gas state, it absorbs the heat of the bottom wall 11a (electronic component E) and cools the bottom wall 11a (electronic component E). Thus, the electronic component E is cooled by performing heat exchange indirectly with the refrigerant liquid through the bottom wall 11a. Here, the surface area expansion member 12 is configured as a porous body. Therefore, the heat transfer area is increased by moving the refrigerant liquid inside the surface area expansion member 12, so that the heat exchange efficiency is improved. As a result, cooling of the electronic component E is promoted.

蒸発器１０で発生した冷媒蒸気は、第１流路３１へ排出される。冷媒蒸気は、圧縮機４０により加圧されて、凝縮器２０へ送られる。この結果、圧縮機４０よりも上流における第１流路３１内の圧力及び蒸発器１０内の圧力は相対的に低くなり、圧縮機４０よりも下流における第１流路３１内の圧力及び凝縮器２０内の圧力は相対的に高くなる。
冷媒蒸気は、凝縮器２０で冷却されることにより凝縮（液化）する。すなわち、冷媒蒸気は、凝縮器２０において放熱することにより、気体の状態から液体の状態に戻される。この際、ファン２１からの送風により冷媒蒸気の冷却が補助される。
凝縮された冷媒液は、第２流路３２へ排出される。冷媒液は、第２流路３２を介して蒸発器１０へ戻され、ハウジング１１に貯留される。 The refrigerant vapor generated in the evaporator 10 is discharged to the first flow path 31. The refrigerant vapor is pressurized by the compressor 40 and sent to the condenser 20. As a result, the pressure in the first flow passage 31 upstream of the compressor 40 and the pressure in the evaporator 10 become relatively low, and the pressure in the first flow passage 31 downstream of the compressor 40 and the condenser The pressure in 20 is relatively high.
The refrigerant vapor is condensed (liquefied) by being cooled by the condenser 20. That is, the refrigerant vapor is released from the gaseous state to the liquid state by radiating heat in the condenser 20. At this time, cooling of the refrigerant vapor is assisted by the air blown from the fan 21.
The condensed refrigerant liquid is discharged to the second flow path 32. The refrigerant liquid is returned to the evaporator 10 via the second flow path 32 and stored in the housing 11.

以上説明したように、本実施形態によれば、圧縮機４０にて冷媒蒸気に流動力を作用させることにより、冷媒蒸気及び冷媒液を循環流路３０において循環させる。圧縮機４０にて冷媒蒸気を凝縮器２０へ向けて強制的に流動させると、多孔質体の表面積拡張部材１２により蒸発器１０内における冷媒液の流路が絞られているため、圧縮機４０よりも上流における第１流路３１内の圧力及び蒸発器１０内の圧力が下がる。この結果、蒸発器１０内の冷媒液の沸点が下がるため、蒸発器１０で冷媒蒸気が発生しやすくなる。したがって、電子部品Ｅの冷却性能が向上する。また、圧縮機４０よりも下流における第１流路３１内の圧力及び凝縮器２０内の圧力が上がる。この結果、凝縮器２０内の冷媒液の沸点（冷媒蒸気の凝縮点）が上がるため、凝縮器２０で冷媒蒸気が凝縮しやすくなる。   As described above, according to the present embodiment, the refrigerant vapor and the refrigerant liquid are circulated in the circulation flow path 30 by causing the compressor 40 to exert a flow force on the refrigerant vapor. When the refrigerant vapor is forced to flow toward the condenser 20 by the compressor 40, the flow path of the refrigerant liquid in the evaporator 10 is narrowed by the surface area expansion member 12 of the porous body, so the compressor 40 The pressure in the first flow passage 31 and the pressure in the evaporator 10 are reduced more upstream. As a result, since the boiling point of the refrigerant liquid in the evaporator 10 is lowered, the refrigerant vapor is easily generated in the evaporator 10. Therefore, the cooling performance of the electronic component E is improved. Further, the pressure in the first flow passage 31 and the pressure in the condenser 20 downstream of the compressor 40 increase. As a result, since the boiling point (the condensing point of the refrigerant vapor) of the refrigerant liquid in the condenser 20 is increased, the refrigerant vapor is easily condensed in the condenser 20.

（第２実施形態）
次に、図２を参照し、本発明の第２実施形態に係る電子部品冷却装置１００（以下、単に冷却装置１００とも称する）について説明する。なお、本実施形態においては、第１実施形態における構成要素と同一の部分については同一の符号を付し、その説明を省略し、異なる点についてのみ説明する。
本実施形態の冷却装置１００においては、第２流路３２の下流部３２ａに、冷媒液の流路を絞った絞り通路（絞り部）５０が設けられる。冷媒液が絞り通路５０を通過することで、第２流路３２から蒸発器１０に供給される冷媒液の流速が高められる。なお、絞り通路５０は、蒸発器１０内に設けられていてもよい。 Second Embodiment
Next, referring to FIG. 2, an electronic component cooling device 100 (hereinafter, also simply referred to as a cooling device 100) according to a second embodiment of the present invention will be described. In addition, in this embodiment, the same code | symbol is attached | subjected about the part same as the component in 1st Embodiment, the description is abbreviate | omitted, and only a different point is demonstrated.
In the cooling device 100 of the present embodiment, a throttling passage (throttling portion) 50 in which the flow path of the refrigerant liquid is narrowed is provided in the downstream portion 32 a of the second flow path 32. As the refrigerant liquid passes through the throttle passage 50, the flow velocity of the refrigerant liquid supplied from the second flow path 32 to the evaporator 10 is increased. The throttle passage 50 may be provided in the evaporator 10.

本実施形態によれば、圧縮機４０にて冷媒蒸気を凝縮器２０へ向けて強制的に流動させると、絞り通路５０により第２流路３２における冷媒液の流路が絞られているため、圧縮機４０よりも上流における第１流路３１内の圧力及び蒸発器１０内の圧力が下がる。この結果、蒸発器１０内の冷媒液の沸点が下がるため、蒸発器１０で冷媒蒸気が発生しやすくなる。したがって、電子部品Ｅの冷却性能が向上する。また、圧縮機４０よりも下流における第１流路３１内の圧力及び凝縮器２０内の圧力が上がる。この結果、凝縮器２０内の冷媒液の沸点（冷媒蒸気の凝縮点）が上がるため、凝縮器２０で冷媒蒸気が凝縮しやすくなる。   According to the present embodiment, when the refrigerant vapor is forced to flow toward the condenser 20 by the compressor 40, the flow path of the refrigerant liquid in the second flow path 32 is narrowed by the throttling passage 50, The pressure in the first flow passage 31 upstream of the compressor 40 and the pressure in the evaporator 10 decrease. As a result, since the boiling point of the refrigerant liquid in the evaporator 10 is lowered, the refrigerant vapor is easily generated in the evaporator 10. Therefore, the cooling performance of the electronic component E is improved. Further, the pressure in the first flow passage 31 and the pressure in the condenser 20 downstream of the compressor 40 increase. As a result, since the boiling point (the condensing point of the refrigerant vapor) of the refrigerant liquid in the condenser 20 is increased, the refrigerant vapor is easily condensed in the condenser 20.

（第３実施形態）
次に、図３を参照し、本発明の第３実施形態に係る電子部品冷却装置２００（以下、単に冷却装置２００とも称する）について説明する。なお、本実施形態においては、第１実施形態における構成要素と同一の部分については同一の符号を付し、その説明を省略し、異なる点についてのみ説明する。
本実施形態の冷却装置２００においては、蒸発器１０の内部の圧力を調整する圧力調整手段６０が設けられる。 Third Embodiment
Next, an electronic component cooling device 200 (hereinafter, also simply referred to as a cooling device 200) according to a third embodiment of the present invention will be described with reference to FIG. In addition, in this embodiment, the same code | symbol is attached | subjected about the part same as the component in 1st Embodiment, the description is abbreviate | omitted, and only a different point is demonstrated.
In the cooling device 200 of the present embodiment, pressure adjusting means 60 for adjusting the pressure inside the evaporator 10 is provided.

第１流路３１の圧縮機４０よりも上流側と、第２流路３２とを接続するバイパス流路３３が設けられる。圧力調整手段６０は、バイパス流路３３の途中部位に設けられる。圧力調整手段６０は、蒸発器１０の内部の圧力が過度に高くなった場合に、第１流路３１の圧縮機４０よりも上流側を流れる冷媒蒸気を、バイパス流路３３を介して第２流路３２に導くことにより、蒸発器１０の内部の圧力を低下させる。   A bypass flow passage 33 connecting the second flow passage 32 with the upstream side of the compressor 40 of the first flow passage 31 is provided. The pressure adjusting means 60 is provided at an intermediate position of the bypass flow path 33. The pressure adjusting means 60 is configured such that, when the pressure inside the evaporator 10 becomes excessively high, the refrigerant vapor flowing on the upstream side of the compressor 40 of the first flow path 31 is transferred via the bypass flow path 33 to the second The pressure in the evaporator 10 is reduced by introducing it into the flow path 32.

圧縮機４０が冷媒蒸気に作用させる流動力が大きすぎると、冷媒液が蒸発器１０へ過剰に供給され、蒸発器１０の内部の圧力が過度に高くなってしまう場合がある。この結果、蒸発器１０内には十分な量の冷媒液が供給されるものの、蒸発器１０内の冷媒液の沸点が上がってしまうため、電子部品Ｅの冷却性能が低下してしまう。このような場合に、圧力調整手段６０を作動させて蒸発器１０の内部の圧力を低下させる。これにより、電子部品Ｅの冷却性能の低下を防ぐことができる。   If the flow force of the compressor 40 acting on the refrigerant vapor is too large, the refrigerant liquid may be excessively supplied to the evaporator 10, and the pressure inside the evaporator 10 may be excessively high. As a result, although a sufficient amount of refrigerant liquid is supplied into the evaporator 10, the boiling point of the refrigerant liquid in the evaporator 10 rises, and the cooling performance of the electronic component E is lowered. In such a case, the pressure adjusting means 60 is operated to reduce the pressure inside the evaporator 10. As a result, it is possible to prevent the deterioration of the cooling performance of the electronic component E.

なお、本発明は、図面を参照して説明した上記実施形態に限定されるものではなく、その技術的範囲において様々な変形例が考えられる。
例えば、上述の実施形態において、蒸気流動化手段として圧縮機を例示したが、蒸気流動化手段としてファンやブロアを用いてもよい。
また、絞り部として、第1実施形態の表面積拡張部材１２と、第２実施形態の絞り通路５０との双方が設けられていてもよい。
また、上述の第３実施形態において、圧力調整手段６０を、第１流路３１の圧縮機４０よりも上流側と、第２流路３２とを接続するバイパス流路３３の途中部位に設けたが、本発明はこれに限られない。例えば、第１流路３１の圧縮機４０よりも上流側から冷媒蒸気を外部に排出することにより、蒸発器１０の内部の圧力を低下させてもよい。 The present invention is not limited to the embodiment described above with reference to the drawings, and various modifications can be considered within the technical scope thereof.
For example, in the above-mentioned embodiment, although the compressor was illustrated as steam fluidization means, you may use a fan and a blower as steam fluidization means.
Moreover, both of the surface area expansion member 12 of the first embodiment and the throttle passage 50 of the second embodiment may be provided as the throttle unit.
Further, in the above-described third embodiment, the pressure adjusting means 60 is provided at an intermediate portion of the bypass flow passage 33 connecting the second flow passage 32 and the upstream side of the compressor 40 of the first flow passage 31. However, the present invention is not limited to this. For example, the pressure inside the evaporator 10 may be reduced by discharging the refrigerant vapor from the upstream side of the compressor 40 of the first flow path 31 to the outside.

その他、本発明の趣旨に逸脱しない範囲で、前記実施形態における構成要素を周知の構成要素に置き換えることは適宜可能であり、また、前記した変形例を適宜組み合わせてもよい。   In addition, it is possible to replace components in the embodiment with known components as appropriate without departing from the spirit of the present invention, and the above-described modifications may be combined as appropriate.

１、１００、２００…電子部品冷却装置、１０…蒸発器、１２…表面積拡張部材（絞り部）、２０…凝縮器、３０…循環流路、３１…第１流路、３２…第２流路、３２ａ…下流部、４０…圧縮機（蒸気流動化手段）、５０…絞り通路（絞り部）、６０…圧力調整手段、Ｅ…電子部品   DESCRIPTION OF SYMBOLS 1, 100, 200 ... Electronic component cooling device, 10 ... Evaporator, 12 ... Surface area expansion member (throttle part) 20 ... Condenser, 30 ... Circulation flow path, 31 ... 1st flow path, 32 ... 2nd flow path , 32a: downstream part, 40: compressor (vapor fluidizing means), 50: throttle passage (throttling portion), 60: pressure adjusting means, E: electronic component

Claims (4)

電子部品の熱により冷媒液を気化させる蒸発器と、
前記蒸発器で発生した冷媒蒸気を凝縮させて前記冷媒液に再生する凝縮器と、
前記冷媒蒸気を前記蒸発器から前記凝縮器に流通させる第１流路と、前記冷媒液を前記凝縮器から前記蒸発器に流通させる第２流路とを有する循環流路と、
前記第１流路に設けられ、前記冷媒蒸気に前記凝縮器へ向けた流動力を作用させる蒸気流動化手段と、
を備え、
前記蒸発器又は前記第２流路の下流部には、前記冷媒液の流路を絞った絞り部が設けられることを特徴とする電子部品冷却装置。 An evaporator that vaporizes a refrigerant liquid by heat of electronic components;
A condenser that condenses the refrigerant vapor generated by the evaporator and regenerates the refrigerant into the refrigerant liquid;
A circulation flow path having a first flow path for circulating the refrigerant vapor from the evaporator to the condenser, and a second flow path for circulating the refrigerant liquid from the condenser to the evaporator;
A steam fluidizing unit provided in the first flow path for applying a flow force directed to the condenser to the refrigerant vapor;
Equipped with
The electronic component cooling device is characterized in that a throttling portion obtained by throttling the flow path of the refrigerant liquid is provided at a downstream portion of the evaporator or the second flow path. 前記絞り部は、前記電子部品に対応して前記蒸発器内に設けられる表面積拡張部材であることを特徴とする請求項１に記載の電子部品冷却装置。   The electronic component cooling device according to claim 1, wherein the narrowed portion is a surface area expansion member provided in the evaporator corresponding to the electronic component. 前記絞り部は、前記第２流路の前記下流部に設けられる絞り通路であることを特徴とする請求項１又は２に記載の電子部品冷却装置。   The electronic component cooling device according to claim 1, wherein the throttling portion is a throttling passage provided at the downstream portion of the second flow path. 前記蒸発器の内部の圧力を調整する圧力調整手段をさらに備えることを特徴とする請求項１〜３のいずれか一項に記載の電子部品冷却装置。   The electronic component cooling device according to any one of claims 1 to 3, further comprising pressure adjusting means for adjusting the pressure inside the evaporator.
JP2017241898A 2017-12-18 2017-12-18 Electronic component cooling apparatus Pending JP2019110199A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112736046A (en) * 2020-12-11 2021-04-30 杭州电子科技大学 Integrated chip heat dissipation device and heat dissipation method thereof
DE102022107292A1 (en) 2022-03-28 2023-09-28 Yazaki Systems Technologies Gmbh Automatically targeted heat dissipating unit with a functional device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112736046A (en) * 2020-12-11 2021-04-30 杭州电子科技大学 Integrated chip heat dissipation device and heat dissipation method thereof
CN112736046B (en) * 2020-12-11 2024-03-22 杭州电子科技大学 Integrated chip heat dissipation device and heat dissipation method thereof
DE102022107292A1 (en) 2022-03-28 2023-09-28 Yazaki Systems Technologies Gmbh Automatically targeted heat dissipating unit with a functional device

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