JP2019069269A

JP2019069269A - Radiation imaging system

Info

Publication number: JP2019069269A
Application number: JP2019010550A
Authority: JP
Inventors: 元気多川; Genki Tagawa
Original assignee: Canon Inc
Current assignee: Canon Inc
Priority date: 2019-01-24
Filing date: 2019-01-24
Publication date: 2019-05-09

Abstract

To provide a radiation imaging system capable of suppressing a possible artifact to occur in long length radiography.SOLUTION: A radiation imaging system includes multiple radiation imaging units disposed so as to overlap each other partially and spatially in view from an irradiation source, the radiation imaging unit having a radiation detection panel 2 and a housing involving the radiation detection panel 2. The radiation imaging system obtains a radiographic image on the basis of image signals from the multiple radiation imaging units. The housing of at least one radiation imaging unit D1 of the multiple radiation imaging units has a higher radiation transmission rate at a part of a region spatially overlapping other radiation imaging unit D2 than the other part of the region.SELECTED DRAWING: Figure 2

Description

本発明は、医療用画像診断装置、非破壊検査装置、放射線を用いた分析装置などに応用される放射線撮像システムに関するものである。 The present invention relates to a radiation imaging system applied to a medical diagnostic imaging apparatus, a nondestructive inspection apparatus, an analysis apparatus using radiation, and the like.

近年、例えば医療分野では被験者の躯体の歪みや異常を把握するため脊髄や下肢の全体や全身を撮影するといった、観察領域の尺が長い撮影（以下長尺撮影と称する）に対する要望がある。特に、一度の放射線照射で長尺撮影が行える放射線撮像システムは、観察領域を複数の区画に分けて複数回放射線照射を行うことで長尺撮影を行う放射線撮像システムに比べて、被験者の体動排除や被曝量低減の観点からより望ましい。 In recent years, for example, in the medical field, there is a demand for imaging with a long observation area (hereinafter referred to as “long imaging”) such as imaging the entire spinal cord and lower legs or whole body in order to grasp distortion or abnormality of a subject's case. In particular, a radiation imaging system capable of performing long-length imaging with a single radiation irradiation is different from the radiation imaging system performing long-distance imaging by dividing the observation region into a plurality of sections and performing radiation irradiation a plurality of times. It is more desirable from the viewpoint of elimination and dose reduction.

特許文献１には、複数枚の放射線撮像装置を並べて撮影することで、一度の放射線曝射でも継ぎ目に画像欠落がない長尺撮影が行える放射線撮像システムが開示されている。特許文献１では、放射線の照射方向から見て、第２の放射線撮像装置とそれより放射線照射側に配置された第１の放射線撮像装置とが重なる重ね部では、第１の放射線撮像装置の制御基板が第２の放射線撮像装置の画素アレイに重ならないようにそれぞれ配置する。重ね部に照射された放射線は、第１の放射線撮像装置の画素アレイにより画像情報が得られる。両方の放射線撮像装置からの画像を合成することで、継ぎ目に画像欠落がない長尺画像を得ることができる。 Patent Document 1 discloses a radiation imaging system capable of performing long-distance imaging without missing images even at a single radiation exposure by imaging a plurality of radiation imaging devices side by side. In Patent Document 1, the control of the first radiation imaging apparatus is performed in the overlapping portion where the second radiation imaging apparatus and the first radiation imaging apparatus disposed closer to the radiation irradiation side are viewed from the radiation irradiation direction. The substrates are respectively arranged so as not to overlap the pixel array of the second radiation imaging apparatus. The radiation irradiated to the overlapping portion is obtained as image information by the pixel array of the first radiation imaging apparatus. By combining the images from both radiation imaging devices, it is possible to obtain a long image with no missing image at the joint.

特開２０１２−０４０１４０号公報JP, 2012-040140, A

本発明の放射線撮像システムは、しかしながら、特許文献１の構成では、各放射線撮像装置の筐体による画像への影響についての言及はなく、第１の放射線撮像装置の筐体が第２の放射線撮像装置から得られる画像にアーチファクトを発生させる恐れがある。そこで、本発明は、第１の放射線撮像装置の筐体に起因して第２の放射線撮像装置から得られる画像に発生し得るアーチファクトを抑制するのに有利な技術を提供することを目的とする。 However, in the radiation imaging system of the present invention, in the configuration of Patent Document 1, there is no mention of the influence of the casing of each radiation imaging apparatus on the image, and the casing of the first radiation imaging apparatus is the second radiation imaging There is a risk of producing artifacts in the image obtained from the device. Therefore, an object of the present invention is to provide an advantageous technique for suppressing an artifact that may occur in an image obtained from a second radiation imaging apparatus due to a housing of the first radiation imaging apparatus. .

各々が、２次元マトリクス状に配列された複数の画素を有して照射された放射線を画像信号に変換する放射線検出パネルと、前記放射線検出パネルを内包する筐体と、を有する複数の放射線撮像装置を、夫々の一部が放射線照射側から見て空間的に重なるように配置して、前記複数の放射線撮像装置からの夫々の画像信号に基づいて放射線画像を取得する放射線撮像システムにおいて、前記複数の放射線撮像装置のうちの少なくとも１つの放射線撮像装置の筐体は、前記一部における領域の放射線透過率が、前記一部における領域とは異なる領域の放射線透過率に比べて高いことを特徴とする。 A plurality of radiation imagings each having a plurality of pixels arrayed in a two-dimensional matrix and converting the irradiated radiation into an image signal, and a housing including the radiation detection panel The radiation imaging system, wherein the devices are arranged such that the respective portions overlap spatially as viewed from the radiation irradiation side, and a radiation image is acquired based on respective image signals from the plurality of radiation imaging devices. The casing of at least one of the plurality of radiation imaging devices is characterized in that the radiation transmittance of the region in the part is higher than the radiation transmittance of the region different from the region in the part I assume.

本発明により、第１の放射線撮像装置の筐体に起因して第２の放射線撮像装置から得られる画像に発生し得るアーチファクトを抑制することが可能となる。 According to the present invention, it is possible to suppress an artifact that may occur in an image obtained from the second radiation imaging apparatus due to the housing of the first radiation imaging apparatus.

放射線撮像システムを説明するための概略断面図Schematic sectional view for explaining a radiation imaging system 第１の実施形態に係る放射線撮像装置の断面模式図及び平面模式図A schematic sectional view and a schematic plan view of a radiation imaging apparatus according to the first embodiment 第２の実施形態に係る放射線撮像装置の断面模式図及び平面模式図A schematic sectional view and a schematic plan view of a radiation imaging apparatus according to the second embodiment 第３の実施形態に係る放射線撮像装置の断面模式図及び平面模式図A schematic sectional view and a schematic plan view of a radiation imaging apparatus according to the third embodiment 第３の実施形態に係る放射線撮像装置セットの拡大模式図An enlarged schematic view of a radiation imaging apparatus set according to a third embodiment 第４の実施形態に係る放射線撮像装置の断面模式図及び平面模式図A schematic cross-sectional view and a schematic plan view of a radiation imaging apparatus according to the fourth embodiment

以下、本発明の実施形態について、添付の図面を参照して具体的に説明する。ただし、各実施形態に示す寸法や構造の詳細は、本文および図中に示す限りではない。なお、本明細書では、Ｘ線だけでなく、α線、β線、γ線、粒子線、宇宙線なども、放射線に含まれるものとする。 Hereinafter, embodiments of the present invention will be specifically described with reference to the attached drawings. However, details of dimensions and structures shown in each embodiment are not limited to those shown in the text and the drawings. In the present specification, radiation includes not only X-rays but also α-rays, β-rays, γ-rays, particle rays, cosmic rays and the like.

まず、図１を用いて本発明に係る放射線撮像システムを説明する。図１は、放射線撮像システムを説明するための概略断面図である。 First, a radiation imaging system according to the present invention will be described with reference to FIG. FIG. 1 is a schematic cross-sectional view for explaining a radiation imaging system.

放射線撮像システムにおける放射線撮像装置セットＳは、第１の放射線撮像装置Ｄ１と第２の放射線撮像装置Ｄ２とを含む。第１の放射線撮像装置Ｄ１は、第２の放射線撮像装置Ｄ２よりも放射線発生装置Ｒ側、すなわち、放射線照射側に配置されている。また、第１の放射線撮像装置Ｄ１は、その一部が放射線照射側から見て第２の放射線撮像装置Ｄ２の一部と空間的に重なるように、配置されている。ここで、空間的に重なるとは、物理的に接して重なっていてもよく、また、物理的に接することなく空間を介して重なっていてもよい。被験者Ｍは、放射線撮像装置セットＳの前に置かれた踏み台上に立つことで放射線撮像装置セットＳおよび放射線発生装置Ｒに対し位置決めされる。放射線発生装置Ｒから放射線撮像装置セットに向け照射された放射線Ｘは、被験者Ｍを透過して第１の放射線撮像装置Ｄ１及び第２の放射線撮像装置Ｄ２に到達し、それぞれで画像信号に変換されることで捕捉される。各放射線撮像装置Ｄ１、Ｄ２で得られた画像信号は不図示の画像処理装置で合成処理され、被験者Ｍの放射線画像が取得される。 The radiation imaging apparatus set S in the radiation imaging system includes a first radiation imaging apparatus D1 and a second radiation imaging apparatus D2. The first radiation imaging device D1 is disposed closer to the radiation generation device R than the second radiation imaging device D2, that is, on the radiation irradiation side. Further, the first radiation imaging device D1 is disposed such that a portion thereof spatially overlaps with a portion of the second radiation imaging device D2 when viewed from the radiation irradiation side. Here, “overlapping spatially” may be physically in contact with each other, or may be overlapped through spaces without being physically in contact with each other. The subject M is positioned relative to the radiation imaging device set S and the radiation generation device R by standing on a step placed in front of the radiation imaging device set S. The radiation X irradiated from the radiation generating apparatus R to the radiation imaging apparatus set passes through the subject M, reaches the first radiation imaging apparatus D1 and the second radiation imaging apparatus D2, and is converted into image signals in each of them. Are captured by The image signals obtained by the radiation imaging devices D1 and D2 are synthesized by an image processing device (not shown), and a radiation image of the subject M is obtained.

（第１の実施形態）
次に、図２（ａ）及び図２（ｂ）を用いて、本発明の第１の実施形態について説明する。図２（ａ）は、図１の丸枠部分を拡大した断面模式図及びその領域での画像信号を示す概念図であり、図２（ｂ）は第１の実施形態に係る第１の放射線撮像装置Ｄ１の平面模式図である。 First Embodiment
Next, a first embodiment of the present invention will be described with reference to FIGS. 2 (a) and 2 (b). Fig.2 (a) is the cross-sectional schematic diagram which expanded the round frame part of FIG. 1, and a conceptual diagram which shows the image signal in the area | region. FIG.2 (b) is the 1st radiation based on 1st Embodiment. It is a plane schematic diagram of imaging device D1.

図２（ａ）に示すように、複数の放射線撮像装置Ｄ１及びＤ２はそれぞれ、放射線検出パネル２、フレキシブル回路基板８及び／又はプリント回路基板５に搭載された集積回路ＩＣ、及び、第１部材１及び第２部材６を含む筐体を含む。放射線検出パネル２は、２次元マトリクス状に配列された複数の画素を含む画素アレイを有して照射された放射線を画像信号に変換する。フレキシブル回路基板８及び／又はプリント回路基板５に搭載された集積回路ＩＣは、放射線検出パネル２に電気的に接続されている。第１部材１及び第２部材６を含む筐体は、少なくとも放射線検出パネル２及び集積回路ＩＣを内包する。 As shown in FIG. 2A, the plurality of radiation imaging devices D1 and D2 respectively include an integrated circuit IC mounted on the radiation detection panel 2, the flexible circuit board 8 and / or the printed circuit board 5, and a first member It includes a housing including the first and second members 6. The radiation detection panel 2 has a pixel array including a plurality of pixels arranged in a two-dimensional matrix, and converts the irradiated radiation into an image signal. The integrated circuit IC mounted on the flexible circuit board 8 and / or the printed circuit board 5 is electrically connected to the radiation detection panel 2. The housing including the first member 1 and the second member 6 includes at least the radiation detection panel 2 and the integrated circuit IC.

このような放射線撮像セットＳの複数の放射線撮像装置のうちの少なくとも１つの放射線撮像装置の筐体は、他の放射線撮像装置と空間的に重なっている一部における領域の放射線透過率が、その領域とは異なる領域の放射線透過率に比べて高くされている。より具体的には、放射線撮像セットＳの複数の放射線撮像装置のうちの第２の放射線撮像装置Ｄ２よりも放射線照射側に配置された第１の放射線撮像装置Ｄ１の筐体は、以下の構成を備える。その筐体は、放射線照射側から見て第２の放射線撮像装置Ｄ２に空間的に重なる第１の領域の放射線透過率が、第１の放射線撮像装置Ｄ１の集積回路ＩＣと対向する第２の領域の放射線透過率に比べて高くなるように、第１部材１と第２部材６とを含む。このような構成により、第２の放射線撮像装置Ｄ２と空間的に重なる第１の放射線撮像装置Ｄ１の筐体での放射線吸収が抑制される。それにより、第２の放射線撮像装置Ｄ２で得られる画像信号のうち、第１の領域と空間的に重なる画素から得られる信号の低下が抑制され、第１の放射線撮像装置の筐体に起因して第２の放射線撮像装置から得られる画像に発生し得るアーチファクトが抑制される。 The casing of at least one radiation imaging apparatus among the plurality of radiation imaging apparatuses of such a radiation imaging set S has a radiation transmittance of a region in a part spatially overlapping with another radiation imaging apparatus. It is higher than the radiation transmittance of the area different from the area. More specifically, the casing of the first radiation imaging apparatus D1 disposed closer to the radiation irradiation side than the second radiation imaging apparatus D2 among the plurality of radiation imaging apparatuses of the radiation imaging set S has the following configuration Equipped with In the housing, the radiation transmittance of the first region spatially overlapping the second radiation imaging device D2 as viewed from the radiation irradiation side is the second of the first region where the integrated circuit IC of the first radiation imaging device D1 faces. The first member 1 and the second member 6 are included so as to be higher than the radiation transmittance of the region. With such a configuration, radiation absorption in the housing of the first radiation imaging apparatus D1 spatially overlapping with the second radiation imaging apparatus D2 is suppressed. As a result, among the image signals obtained by the second radiation imaging apparatus D2, the decrease in signals obtained from pixels spatially overlapping the first region is suppressed, and the casing of the first radiation imaging apparatus Thus, artifacts that may occur in the image obtained from the second radiation imaging apparatus are suppressed.

以下に、第１の実施形態に係る各放射線撮像装置の具体例について、説明する。各放射線撮像装置Ｄ１、Ｄ２には、放射線照射側から、放射線検出パネル２、粘着材３、基台４、プリント回路基板５の順に積層された結合体が筐体に内包される。放射線検出パネル２が粘着材３によって基台４に結合されることにより、放射線検出パネル２は基台４によって支持される。プリント回路基板５は、基台４を挟んで放射線検出パネル２とは反対側に配置される。また、各放放射線撮像装置Ｄ１、Ｄ２の筺体は、第１部材１と第２部材６とを含む。第１部材１は、第２部材６に比べて放射線透過率の高い部材からなる。第１の領域を構成する第１部材１は、放射線入射方向からの放射線透過性がアルミ当量５ｍｍ以下の材料が好ましく使用され、たとえばＣＦＲＰが用いられる。なお、第１部材１のうち画素アレイと対向する領域にあっては、第１の領域における放射線透過性よりも高いことが望ましい。一方、筐体のうち集積回路ＩＣと対向する第２の領域を構成する第２部材６は、第１部材１より剛性が高く且つ放射線透過率の低い材料が好ましく、アルミニウムやマグネシウムといった金属材料が用いられる。放射線検出パネル２は、放射線を捕捉可能な画素アレイと、該画素アレイの外周に辺縁部を有する。第２の放射線撮像装置Ｄ２は、その画素アレイが第１の放射線撮像装置Ｄ１の画素アレイと一部重なるように配置され、どのラインにおいても各放射線撮像装置Ｄ１、Ｄ２のいずれかの画素アレイが確実に画像情報を取得するように構成される。結合された放射線画像は、第１の放射線撮像装置Ｄ１の画像信号と、第２の放射線撮像装置Ｄ２の画像信号のうちの第１の放射線撮像装置Ｄ１で得られていない領域の画像信号とを合成して作成される。ここで、第１の放射線撮像装置Ｄ１の画素アレイ端から筺体の端部までのエリアは、第１の放射線撮像装置Ｄ１の構造物が第２の放射線撮像装置Ｄ２に写り込んでしまい、結合された放射線画像にアーチファクトが生じ得る。そこで、本実施形態においては、第１部材１が側壁部、および、背面部まで回り込んで、第２の放射線撮像装置Ｄ２に写り込む部分である第１の領域を構成する。これにより、当該箇所に第２部材６を用いた場合と比較して、当該領域における筺体による放射線吸収による放射線の減衰を抑制できる。放射線画像の出力低下が少なければ、たとえば事前に取得してある放射線画像の出力低下量の情報と合わせることで、当該領域の画像を補正処理して、画質を向上させることが可能である。第１部材１と第２部材６との結合は、第１の領域の外側でネジ７を用いて行うことで、ネジ７が結合された放射線画像に写り込むことの無い構成とする。 Below, the specific example of each radiation imaging device concerning 1st Embodiment is demonstrated. In each of the radiation imaging devices D1 and D2, a combined body in which the radiation detection panel 2, the adhesive 3, the base 4 and the printed circuit board 5 are sequentially stacked is included in a casing from the radiation irradiation side. The radiation detection panel 2 is supported by the base 4 by being bonded to the base 4 by the adhesive 3. The printed circuit board 5 is disposed on the opposite side of the base 4 from the radiation detection panel 2. Further, the housing of each of the radiation imaging devices D1, D2 includes the first member 1 and the second member 6. The first member 1 is made of a member having a high radiation transmittance as compared to the second member 6. The first member 1 constituting the first region is preferably made of a material having an aluminum equivalent of 5 mm or less in radiation transparency from the radiation incident direction, for example, CFRP. In the region facing the pixel array in the first member 1, it is desirable that the radiation transparency in the first region be higher than that in the first region. On the other hand, the second member 6 constituting the second region facing the integrated circuit IC in the housing is preferably a material having higher rigidity and lower radiation transmittance than the first member 1, and a metal material such as aluminum or magnesium is preferable. Used. The radiation detection panel 2 has a pixel array capable of capturing radiation and an edge on the outer periphery of the pixel array. The second radiation imaging device D2 is disposed such that the pixel array thereof partially overlaps the pixel array of the first radiation imaging device D1, and in any line, any pixel array of each radiation imaging device D1, D2 is It is configured to reliably acquire image information. The combined radiation image includes the image signal of the first radiation imaging device D1 and the image signal of the area not obtained by the first radiation imaging device D1 among the image signals of the second radiation imaging device D2. Synthesized and created. Here, in the area from the end of the pixel array of the first radiation imaging device D1 to the end of the housing, the structure of the first radiation imaging device D1 is reflected in the second radiation imaging device D2 and combined. Artefacts may occur in the radiographic image. So, in this embodiment, the 1st member 1 constitutes a 1st field which is a portion which turns around to a side wall part and a back part, and is reflected in the 2nd radiation imaging device D2. Thereby, compared with the case where the 2nd member 6 is used for the said location, attenuation of the radiation by the radiation absorption by the housing in the said area | region can be suppressed. If the reduction in radiation image output is small, it is possible to correct the image of the area and improve the image quality, for example, by combining it with the information on the amount of reduction in radiation image output that has been acquired in advance. The connection between the first member 1 and the second member 6 is performed using the screw 7 outside the first region, so that the radiation image to which the screw 7 is connected is not reflected.

図２（ｂ）に示すように、本実施形態の筐体は、略方形を有し、４辺のうちの１辺を第１部材１で構成するが、残りの３辺およびすべての角部は第２部材６で構成する。このような構成とすることで、角部からの落下強度や、装置全体の剛性の確保が可能となる。また、第１部材１としてＣＦＲＰを用いる場合は、賦形性が悪いために箱形状に形成することが困難であり、その点でも１辺だけをＣＦＲＰとすることは利点がある。筺体には、放射線撮像装置の電源スイッチ１０、放射線撮像装置の状態を表示するＬＥＤ等の表示部１１、集積回路ＩＣへの電源供給基台信号送受信を行うケーブル１２と接続される接続部９が備えられている。これらは、第１の放射線撮像装置Ｄ１においては、第２の放射線撮像装置Ｄ２と空間的に重なる第１の領域を除く領域に配置される。本実施形態では、第２部材６に設けることで、結合された放射線画像にこれらの構造物が写り込むことを無いような構成となる。放射線検出パネル２には、プリント回路基板５と電気的に接続されたフレキシブル回路基板８が、互いに直交する２辺に電気的に接続される。第１の放射線撮像装置Ｄ１のフレキシブル回路基板８は、第２の放射線撮像装置Ｄ２と空間的に重なる第１の領域を除く領域に配置されることで、結合された放射線画像にフレキシブル回路基板８が写り込むことが無いような構成となる。また、上記のように筐体のうち第１の領域を除く領域は、設置時の向きの誤りを防ぐために外部から視認可能になっていることが好ましい。 As shown in FIG. 2B, the housing of the present embodiment has a substantially rectangular shape, and one side of the four sides is formed by the first member 1, but the remaining three sides and all corner portions Is constituted by the second member 6. With such a configuration, it is possible to secure the drop strength from the corner and the rigidity of the entire device. In addition, when CFRP is used as the first member 1, it is difficult to form it into a box shape because of poor shapeability, and it is advantageous to make only one side CFRP also in that respect. The housing includes a power switch 10 of the radiation imaging apparatus, a display unit 11 such as an LED for displaying the state of the radiation imaging apparatus, and a connection unit 9 connected to a cable 12 for transmitting and receiving a power supply base signal to the integrated circuit IC. It is equipped. In the first radiation imaging apparatus D1, these are disposed in the area excluding the first area spatially overlapping with the second radiation imaging apparatus D2. In the present embodiment, by providing the second member 6, such a structure is prevented from being reflected in the combined radiation image. The flexible circuit board 8 electrically connected to the printed circuit board 5 is electrically connected to the radiation detection panel 2 at two sides orthogonal to each other. The flexible circuit board 8 of the first radiation imaging apparatus D1 is disposed in the area excluding the first area spatially overlapping with the second radiation imaging apparatus D2, so that the flexible circuit board 8 is combined with the combined radiation image. It becomes the composition that there is not to be reflected. Further, as described above, it is preferable that an area excluding the first area in the housing is visible from the outside in order to prevent an error in the orientation at the time of installation.

（第２の実施形態）
次に、図３（ａ）及び図３（ｂ）を用いて、第２の実施形態を説明する。図３（ａ）は、図１の丸枠部分を拡大した断面模式図及びその領域での画像信号を示す概念図であり、図３（ｂ）は第２の実施形態に係る第１の放射線撮像装置Ｄ１の平面模式図である。なお、第１の実施形態と同じ構成には同じ符号を付与して詳細な説明は省略する。 Second Embodiment
Next, a second embodiment will be described using FIGS. 3 (a) and 3 (b). Fig.3 (a) is the cross-sectional schematic diagram which expanded the round frame part of FIG. 1, It is a conceptual diagram which shows the image signal in the area | region. FIG.3 (b) is the 1st radiation concerning 2nd Embodiment. It is a plane schematic diagram of imaging device D1. The same components as those in the first embodiment are assigned the same reference numerals and detailed explanations thereof will be omitted.

第１の実施形態では、第１の領域における筐体の側壁においては、第１部材１で構成されているが、筐体の外形の厚み分だけ第１部材１で放射線が吸収され、第１の領域の側壁を除く他の領域に比べて、側壁の部分だけ放射線の吸収量が著しく高くなってしまう。そこで、第２の実施形態では、図３（ａ）に示すように、第１の領域における第１の放射線撮像装置Ｄ１の筐体の外形の厚さが、第１の領域とは別の例えば第２の領域における第１の放射線撮像装置の筐体Ｄの外形の厚さに比べて薄くなるように、構成されている。特に、第１の領域における第１の放射線撮像装置Ｄ１の筐体の外形の厚さが、第１の領域において端部に向かって薄くなるように構成されることが好ましい。このように構成すると、第１の実施形態に比べて、第１部材１で構成される側壁の高さが小さくなり、筐体の側壁による放射線吸収に起因する放射線画像のアーチファクトが更に抑制され得る。 In the first embodiment, the side wall of the housing in the first region is formed of the first member 1, but the radiation is absorbed by the first member 1 by the thickness of the outer shape of the housing, and the first As compared with the other regions except for the side wall of the region of (2), only the portion of the side wall has a significantly higher radiation absorption amount. Therefore, in the second embodiment, as shown in FIG. 3A, for example, the thickness of the outer shape of the casing of the first radiation imaging apparatus D1 in the first region is different from that in the first region, for example It is comprised so that it may become thin compared with the thickness of the external shape of the housing | casing D of the 1st radiation imaging device in 2nd area | region. In particular, it is preferable that the thickness of the outer shape of the casing of the first radiation imaging apparatus D1 in the first region be configured to be thinner toward the end in the first region. According to this configuration, the height of the side wall formed of the first member 1 is smaller than that of the first embodiment, and the artifact of the radiation image due to the radiation absorption by the side wall of the housing can be further suppressed. .

また、図３（ｂ）に示すように、略矩形の筐体の４辺のうち、第１領域を含む３辺が第１部材１からなり、残りの１辺が第２部材６からなる。そして、第２部材６からなる筐体の１辺に、フレキシブル回路基板８（不図示）、電源スイッチ１０、表示部１１、接続部９が設けられている。このような構成であれば、筐体が放射線照射側から見て略長方形の形状を有する場合、短辺及び長辺のいずれも第１部材１で構成される。この構成になり、より縦長の領域で結合された放射線画像を得たい場合には、短辺を第１の領域として重ねあわせ、より横長の結合された放射線画像を得たい場合には、長辺を第１の領域として重ねあわせることができる。これにより、第２の実施形態は、第１の実施形態に比べて撮影の自由度が向上する。 Further, as shown in FIG. 3B, of the four sides of the substantially rectangular casing, three sides including the first region are made of the first member 1, and the other one side is made of the second member 6. The flexible circuit board 8 (not shown), the power switch 10, the display unit 11, and the connection unit 9 are provided on one side of the casing made of the second member 6. With such a configuration, when the casing has a substantially rectangular shape when viewed from the radiation irradiation side, both the short side and the long side are configured by the first member 1. In this configuration, the short side is overlapped as the first area to obtain a combined radiation image in a longer area, and the long side is obtained to obtain a longer combined radiation image. Can be superimposed as a first area. Thereby, in the second embodiment, the degree of freedom of imaging is improved as compared with the first embodiment.

（第３の実施形態）
次に、図４（ａ）、図４（ｂ）、及び図５を用いて、第３の実施形態を説明する。図４（ａ）は第３の実施形態に係る第１の放射線撮像装置Ｄ１の平面模式図であり、図４（ｂ）は、図１の丸枠部分を拡大した断面模式図及びその領域での画像信号を示す概念図である。図５は、放射線撮像装置セットＳ内に放射線撮像装置を設置する設置部を説明する概念図である。なお、第１の実施形態と同じ構成には同じ符号を付与して詳細な説明は省略する。 Third Embodiment
Next, a third embodiment will be described using FIGS. 4 (a), 4 (b) and 5. Fig.4 (a) is a plane schematic diagram of the 1st radiation imaging device D1 which concerns on 3rd Embodiment, FIG.4 (b) is the cross-sectional schematic diagram which expanded the round frame part of FIG. 1, and its area It is a conceptual diagram showing an image signal of FIG. 5 is a conceptual diagram for explaining an installation unit for installing the radiation imaging apparatus in the radiation imaging apparatus set S. The same components as those in the first embodiment are assigned the same reference numerals and detailed explanations thereof will be omitted.

第３の実施形態では、筺体が、略矩形の４辺のうちの１辺に開口を有する第３部材１６と、第３部材１６の開口を閉じることができる蓋部１４と、蓋部１４が開閉可能に第３部材１６と接合する接合部１５とを更に含む。放射線撮像装置を単体で使用する際には、蓋部１４が閉じた形態で利用される。一方、放射線撮像装置の一部を重ねて結合された放射線画像を取得する長尺撮影を行う際には、蓋部１４が開き筺体の１辺が開口している形態で利用され、筐体内の結合体が筺体外部に一部現れるように移動することができる。結合体に含まれる放射線検出パネル２の画素は、放射線を可視光に変換する蛍光体と、可視光を電気信号に変換する光電変換素子と、を含む構成が用いられ得る。そのため、放射線検出パネル２に光が当たると所望の放射線画像を得ることが出来ないので、蓋部１４が開いた状態で放射線検出パネル２を遮光するための遮光部１７が設けられる。この遮光部１７は、実質的に筐体の一部を構成し、その放射線吸収率は第３部材１６よりも低い材料を用いて構成されている。そして、蓋部１４が開いた状態では、放射線検出パネル２及び遮光部１７が、第２の放射線撮像装置Ｄ２と空間的に重なる位置に移動し得る。すなわち、放射線検出パネル２及び遮光部１７が筐体の第１の領域となり、第１の放射線撮像装置の筐体に起因して第２の放射線撮像装置から得られる画像に発生し得るアーチファクトが抑制される。 In the third embodiment, a third member 16 having an opening on one of four sides of a substantially rectangular casing, a lid 14 capable of closing the opening of the third member 16, and a lid 14 are provided. And a joint 15 joined to the third member 16 in an openable / closable manner. When the radiation imaging apparatus is used alone, it is used in a form in which the lid portion 14 is closed. On the other hand, when performing long radiographing to acquire a radiographic image in which a part of the radiation imaging apparatus is overlapped and combined, the lid portion 14 is opened, and one side of the casing is used. The conjugate can move so as to partially appear outside the housing. The pixel of the radiation detection panel 2 included in the combined body may have a configuration including a phosphor that converts radiation into visible light and a photoelectric conversion element that converts visible light into an electrical signal. Therefore, since a desired radiation image can not be obtained when light strikes the radiation detection panel 2, a light shielding unit 17 is provided to shield the radiation detection panel 2 in a state where the lid 14 is open. The light shielding portion 17 substantially constitutes a part of the housing, and the radiation absorptivity thereof is configured using a material lower than that of the third member 16. And in the state where lid part 14 was opened, radiation detection panel 2 and shade part 17 can move to the position which overlaps with the 2nd radiation imaging device D2 spatially. That is, the radiation detection panel 2 and the light shielding unit 17 become the first region of the housing, and the artifact that may occur in the image obtained from the second radiation imaging device due to the housing of the first radiation imaging device is suppressed Be done.

また、図５に示すように、蓋部１４の端部には係止部１８が設けられており、第３部材１６に設けられた引掛け部１９にて閉じた状態で固定されている。一方、放射線撮像装置セットＳに設けられた設置部２１には、ロック解除部２０が設けられている。放射線撮像装置を放射線撮像装置セットＳの設置部２１に設置すると、ロック解除部２０によって係止部１８が押し上げられる。これにより、蓋部１４の固定が解除され、蓋部１４が図４（ｂ）に示すような開いた状態となる。このような構成により、長尺撮影を行うために放射線撮像装置を放射線撮像装置セットＳに設置した時には、長尺撮影のための形態に移行することが容易となる。 Further, as shown in FIG. 5, a locking portion 18 is provided at the end of the lid portion 14, and is fixed in a closed state by a hooking portion 19 provided on the third member 16. On the other hand, in the installation unit 21 provided in the radiation imaging apparatus set S, a lock release unit 20 is provided. When the radiation imaging apparatus is installed in the installation unit 21 of the radiation imaging apparatus set S, the locking unit 18 is pushed up by the unlocking unit 20. Thereby, the fixation of the lid portion 14 is released, and the lid portion 14 is in an open state as shown in FIG. 4 (b). With such a configuration, when the radiation imaging apparatus is installed in the radiation imaging apparatus set S in order to perform long-length imaging, it is easy to shift to a form for long-length imaging.

（第４の実施形態）
次に、図６を用いて第４の実施形態について説明する。図６は、図１の丸枠部分を拡大した断面模式図及びその領域での画像信号を示す概念図である。なお、第１の実施形態と同じ構成には同じ符号を付与して詳細な説明は省略する。 Fourth Embodiment
Next, a fourth embodiment will be described using FIG. FIG. 6 is a schematic cross-sectional view of the enlarged round frame portion of FIG. 1 and an image signal in the region. The same components as those in the first embodiment are assigned the same reference numerals and detailed explanations thereof will be omitted.

複数の放射線撮像装置を収容する放射線撮像装置セットＳの収容筐体には、被験者Ｍによる荷重から、収容されている放射線撮像装置や散乱線除去グリッド（不図示）を保護する保護板２２が設けられている。この保護板２２には、アクリルやポリカーボネードといった材料が用いられ得る。本実施形態では、この保護板２２によって、放射線画像のアーチファクトが抑制されるように、保護板２２の厚さに分布を持たせている。具体的には、第１領域に対応する領域での保護板２２と第１の放射線撮像装置Ｄ１の筺体と放射線検出パネル２の辺縁部の３層の合算した放射線透過率が、第１領域以外の領域の保護板２２分の放射線透過率と略同等となるようにする。これにより、第１の放射線撮像装置の筐体に起因して第２の放射線撮像装置から得られる画像に発生し得るアーチファクトが更に抑制される。 The housing of the radiation imaging apparatus set S for accommodating a plurality of radiation imaging apparatuses is provided with a protection plate 22 for protecting the radiation imaging apparatus and the scattered radiation removal grid (not shown) accommodated from the load by the subject M. It is done. The protective plate 22 may be made of a material such as acrylic or polycarbonate. In the present embodiment, the thickness of the protective plate 22 is made to have a distribution such that artifacts of the radiation image are suppressed by the protective plate 22. Specifically, the sum of the radiation transmittances of the protective plate 22 in the region corresponding to the first region, the three layers of the casing of the first radiation imaging apparatus D1 and the peripheral portion of the radiation detection panel 2 is the first region. It is made to be substantially equivalent to the radiation transmittance of the protective plate 22 in the other area. This further suppresses artifacts that may occur in the image obtained from the second radiation imaging apparatus due to the housing of the first radiation imaging apparatus.

Ｍ被験者
Ｒ放射線発生装置
Ｓ放射線撮像装置セット
Ｄ１第１の放射線撮像装置
Ｄ２第２の放射線撮像装置
１第１部材
２放射線検出パネル
５プリント回路基板
６第２部材
８フレキシブル回路基板 M subject R radiation generator S radiation imaging apparatus set D1 first radiation imaging apparatus D2 second radiation imaging apparatus 1 first member 2 radiation detection panel 5 printed circuit board 6 second member 8 flexible circuit board

Claims

２次元マトリクス状に配列された複数の画素を有して照射された放射線を画像信号に変換する放射線検出パネルと、前記放射線検出パネルを内包する筐体と、を有する複数の放射線撮像装置を、夫々の一部が放射線照射側から見て空間的に重なるように配置して、前記複数の放射線撮像装置からの夫々の画像信号に基づいて放射線画像を取得する放射線撮像システムにおいて、
前記複数の放射線撮像装置のうちの少なくとも１つの放射線撮像装置の筐体は、前記一部における領域の放射線透過率が、前記一部における領域とは異なる領域の放射線透過率に比べて高いことを特徴とする放射線撮像システム。 A plurality of radiation imaging devices having a radiation detection panel having a plurality of pixels arranged in a two-dimensional matrix and converting irradiated radiation into an image signal, and a case containing the radiation detection panel; In a radiation imaging system for arranging a part of each to overlap spatially as viewed from the radiation irradiation side and acquiring a radiation image based on respective image signals from the plurality of radiation imaging devices,
The casing of at least one of the plurality of radiation imaging devices has a radiation transmittance of the region in the part higher than that of the region different from the region in the part. A radiation imaging system characterized by

前記複数の放射線撮像装置は夫々、前記放射線検出パネルに電気的に接続された集積回路を更に含み、
前記筐体は、前記集積回路を更に内包し、
前記複数の放射線撮像装置のうちの第２の放射線撮像装置よりも放射線照射側に配置された第１の放射線撮像装置の筐体は、前記放射線照射側から見て前記第２の放射線撮像装置に空間的に重なる第１の領域の放射線透過率が、前記第１の放射線撮像装置の集積回路と対向する第２の領域の放射線透過率に比べて高いことを特徴とする請求項１に記載の放射線撮像システム。 Each of the plurality of radiation imaging devices further includes an integrated circuit electrically connected to the radiation detection panel;
The housing further encloses the integrated circuit;
The casing of a first radiation imaging apparatus disposed closer to the radiation irradiation side than the second radiation imaging apparatus among the plurality of radiation imaging apparatuses is the second radiation imaging apparatus as viewed from the radiation irradiation side. The radiation transmittance of a spatially overlapping first region is higher than the radiation transmittance of a second region facing the integrated circuit of the first radiation imaging apparatus. Radiation imaging system.

前記第１の領域における前記第１の放射線撮像装置の筐体の厚さは、前記第２の領域における前記第１の放射線撮像装置の筐体の厚さに比べて薄いことを特徴とする請求項２に記載の放射線撮像システム。 The thickness of the casing of the first radiation imaging apparatus in the first area is thinner than the thickness of the casing of the first radiation imaging apparatus in the second area. The radiation imaging system according to Item 2.

前記第１の領域における前記第１の放射線撮像装置の筐体の厚さは、前記第１の領域において端部に向かって薄くなることを特徴とする請求項３に記載の放射線撮像システム。 The radiation imaging system according to claim 3, wherein a thickness of a housing of the first radiation imaging apparatus in the first region becomes thinner toward an end in the first region.

前記第１の放射線撮像装置の筐体は、前記第１の領域を構成する第１部材と、第１部材１より剛性が高く且つ放射線透過率の低い第２部材と、を含む請求項２から４のいずれか１項に記載の放射線撮像システム。 The casing of the first radiation imaging apparatus includes a first member constituting the first region, and a second member having higher rigidity and lower radiation transmittance than the first member 1. The radiation imaging system of any one of 4.

前記第１の放射線撮像装置の筐体は、前記放射線照射側から見て略矩形に構成され、前記略矩形の４辺のうち少なくとも１辺は前記第１部材によって構成され、前記４辺のうちの前記少なくとも１辺を除く残りの辺は前記第２部材によって構成されることを特徴とする請求項５に記載の放射線撮像システム。 The casing of the first radiation imaging apparatus is substantially rectangular when viewed from the radiation irradiation side, and at least one side of the four sides of the substantially rectangular shape is formed by the first member, and the first side among the four sides The radiation imaging system according to claim 5, wherein the remaining side excluding at least one side of is constituted by the second member.

前記第１の放射線撮像装置は、電源スイッチを更に有し、前記電源スイッチは前記第２部材に設けられることを特徴とする請求項６に記載の放射線撮像システム。 The radiation imaging system according to claim 6, wherein the first radiation imaging apparatus further includes a power switch, and the power switch is provided to the second member.

前記第１の放射線撮像装置は、前記第１の放射線撮像装置の状態を表示する表示部を更に有し、前記表示部は前記第２部材に設けられることを特徴とする請求項６に記載の放射線撮像システム。 The said 1st radiation imaging device further has a display part which displays the state of a said 1st radiation imaging device, The said display part is provided in the said 2nd member, The said display part is characterized by the above-mentioned. Radiation imaging system.

前記第１の放射線撮像装置は、前記集積回路への電源供給及び／又は信号送受信を行うためのケーブルと接続される接続部を更に有し、前記接続部は前記第２部材に設けられることを特徴とする請求項６に記載の放射線撮像システム。 The first radiation imaging apparatus further includes a connection portion connected to a cable for performing power supply to the integrated circuit and / or signal transmission / reception, and the connection portion is provided to the second member. The radiation imaging system according to claim 6, characterized in that:

前記第１部材は、放射線透過性がアルミ当量５ｍｍ以下の材料からなることを特徴とする請求項６から９のいずれか１項に記載の放射線撮像システム。 The radiation imaging system according to any one of claims 6 to 9, wherein the first member is made of a material having a radiation permeability of 5 mm or less of aluminum equivalent.

前記複数の放射線撮像装置は夫々、前記放射線検出パネルと電気的に接続されたフレキシブル回路基板と、前記フレキシブル回路基板と電気的に接続されたプリント回路基板と、前記放射線検出パネルを支持する基台と、を更に含み、前記プリント回路基板は前記基台を挟んで前記放射線検出パネルと反対側に配置され、前記集積回路は前記プリント回路基板及び／又はフレキシブル回路基板に搭載されていることを特徴とする請求項２から１０のいずれか１項に記載の放射線撮像システム。 Each of the plurality of radiation imaging devices includes a flexible circuit board electrically connected to the radiation detection panel, a printed circuit board electrically connected to the flexible circuit board, and a base supporting the radiation detection panel. And the printed circuit board is disposed on the opposite side of the radiation detection panel with the base interposed therebetween, and the integrated circuit is mounted on the printed circuit board and / or the flexible circuit board. The radiation imaging system according to any one of claims 2 to 10, wherein

前記複数の放射線撮像装置を収容する収容筐体を更に有し、前記収容筐体は前記複数の放射線撮像装置を保護する保護板を含み、前記保護板は前記放射線画像のアーチファクトが抑制されるように厚さに分布を有することを特徴とする請求項１から１１のいずれか１項に記載の放射線撮像システム。 The apparatus further includes a housing housing for housing the plurality of radiation imaging devices, the housing housing includes a protection plate for protecting the plurality of radiation imaging devices, and the protection plate is configured to suppress an artifact of the radiation image. The radiation imaging system according to any one of claims 1 to 11, wherein the thickness has a distribution.