JP2019035527A - Vacuum dryer - Google Patents
Vacuum dryer Download PDFInfo
- Publication number
- JP2019035527A JP2019035527A JP2017155837A JP2017155837A JP2019035527A JP 2019035527 A JP2019035527 A JP 2019035527A JP 2017155837 A JP2017155837 A JP 2017155837A JP 2017155837 A JP2017155837 A JP 2017155837A JP 2019035527 A JP2019035527 A JP 2019035527A
- Authority
- JP
- Japan
- Prior art keywords
- solvent
- substrate
- chamber
- drying apparatus
- solvent collection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molecular Biology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Drying Of Solid Materials (AREA)
- Electroluminescent Light Sources (AREA)
- Coating Apparatus (AREA)
Abstract
Description
本発明は、チャンバ内に収納された基板上の溶液を減圧状態で乾燥させる減圧乾燥装置に関する。 The present invention relates to a vacuum drying apparatus for drying a solution on a substrate housed in a chamber in a vacuum state.
従来、有機ＥＬ（Electroluminescence）の発光を利用した発光ダイオードである有機発光ダイオード（ＯＬＥＤ：Organic Light Emitting Diode）が知られている。かかる有機発光ダイオードを用いた有機ＥＬディスプレイは、薄型軽量かつ低消費電力であるうえ、応答速度や視野角、コントラスト比の面で優れているといった利点を有していることから、次世代のフラットパネルディスプレイ（ＦＰＤ）として近年注目されている。 2. Description of the Related Art Conventionally, an organic light emitting diode (OLED) that is a light emitting diode using light emission of organic EL (Electroluminescence) is known. An organic EL display using such an organic light emitting diode is advantageous in that it is thin and lightweight, has low power consumption, and is excellent in response speed, viewing angle, and contrast ratio. In recent years, it has attracted attention as a panel display (FPD).
有機発光ダイオードは、基板上の陽極と陰極の間に有機ＥＬ層を挟んだ構造を有している。有機ＥＬ層は、例えば陽極側から順に、正孔注入層、正孔輸送層、発光層、電子輸送層及び電子注入層が積層されて形成される。これらの有機ＥＬ層の各層（特に正孔注入層、正孔輸送層及び発光層）を形成するにあたっては、例えばインクジェット方式で有機材料の液滴を基板上に吐出するといった方法が用いられる。 The organic light emitting diode has a structure in which an organic EL layer is sandwiched between an anode and a cathode on a substrate. The organic EL layer is formed, for example, by laminating a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer in this order from the anode side. In forming each layer of these organic EL layers (in particular, a hole injection layer, a hole transport layer, and a light emitting layer), for example, a method of discharging droplets of an organic material onto a substrate by an inkjet method is used.
インクジェット方式で基板上に吐出された有機材料中には、多量の溶媒が含まれている。そのため、溶媒を除去することを目的として、基板上の溶液を減圧状態で乾燥する減圧乾燥処理が行われている（特許文献１参照）。 A large amount of solvent is contained in the organic material discharged onto the substrate by the inkjet method. Therefore, for the purpose of removing the solvent, a reduced-pressure drying process is performed in which the solution on the substrate is dried under reduced pressure (see Patent Document 1).
具体的には、特許文献１の乾燥装置は、真空引き可能な処理容器と、処理容器内で基板を支持する載置台と、載置台に支持される基板に対向して設けられ、基板上の有機材料膜から揮発する溶媒を捕集する溶媒捕集部と、を備えている。
この特許文献１の乾燥装置の溶媒捕集部は、基板の表面とほぼ平行に配置された金属製の捕集プレートを有し、該捕集プレートには貫通開口が形成されている。また、特許文献１の乾燥装置は、乾燥処理が終了した後、捕集プレートで捕集した溶媒を、再度気化させて捕集プレートから脱離させるための溶媒脱離装置を備えている。さらに特許文献１の乾燥装置は、上述の捕集プレートの温度を調節するためにペルチェ素子等からなる温度調整装置を有する。
Specifically, the drying apparatus disclosed in Patent Document 1 is provided with a processing container that can be evacuated, a mounting table that supports a substrate in the processing container, and a substrate that is supported by the mounting table. And a solvent collecting unit that collects a solvent that volatilizes from the organic material film.
The solvent collection part of the drying apparatus of this patent document 1 has a metal collection plate arrange | positioned substantially parallel to the surface of a board | substrate, The through-opening is formed in this collection plate. Moreover, the drying apparatus of patent document 1 is equipped with the solvent desorption apparatus for vaporizing again the solvent collected with the collection plate after the drying process is complete | finished, and desorbing from a collection plate. Furthermore, the drying device of Patent Document 1 has a temperature adjusting device composed of a Peltier element or the like in order to adjust the temperature of the above-described collection plate.
ところで、溶媒捕集部に捕集／吸着された溶媒の脱離処理のための時間を含めた、乾燥装置における処理時間を短縮させるためには、溶媒捕集部での溶媒の捕集効率を向上させたり、溶媒捕集部からの溶媒の気化効率を向上させたりする必要がある。 By the way, in order to shorten the processing time in the drying apparatus, including the time for desorption treatment of the solvent collected / adsorbed in the solvent collection part, the solvent collection efficiency in the solvent collection part is increased. It is necessary to improve or improve the vaporization efficiency of the solvent from the solvent collection part.
しかしながら、特許文献１の乾燥装置では、溶媒捕集部すなわち捕集プレートでの溶媒の捕集効率や捕集プレートからの溶媒の気化効率を向上させるために、捕集プレートを冷却または加熱する温度調節装置を用いており、装置の構成が複雑である。 However, in the drying apparatus of Patent Document 1, the temperature at which the collection plate is cooled or heated in order to improve the solvent collection efficiency of the solvent collection unit, that is, the collection plate, and the evaporation efficiency of the solvent from the collection plate. An adjustment device is used, and the configuration of the device is complicated.
この点に関し、鋭意検討したところ、熱容量の小さい網状板を溶媒捕集用の溶媒捕集網として用いれば、温度調節装置を別途設けることなく、溶媒捕集部すなわち溶媒捕集網での溶媒の捕集効率や溶媒捕集部からの溶媒の気化効率を向上させることができるという知見を得た。しかし、さらに検討を進めたところ、熱容量の小さい網状板を溶媒捕集網として用いた場合、基板の中央に比べて端部の乾燥速度が遅く、乾燥時間を同一の基板内で均一にできず、すなわち、基板を均一に乾燥することができないことがある。 As a result of diligent investigations in this regard, if a reticulated plate having a small heat capacity is used as a solvent collection network for collecting solvent, a solvent collecting unit, that is, a solvent collection network, can be used without separately providing a temperature control device. The knowledge that the collection efficiency and the evaporation efficiency of the solvent from the solvent collection part can be improved was obtained. However, as a result of further investigations, when a mesh plate with a small heat capacity was used as the solvent collection network, the drying speed of the edges was slower than the center of the substrate, and the drying time could not be made uniform within the same substrate. That is, the substrate may not be uniformly dried.
本発明は、かかる点に鑑みてなされたものであり、基板上の溶媒の減圧乾燥処理と溶媒捕集部からの溶媒の脱離処理の両方を行うものであって、上記減圧乾燥処理の時間と上記脱離処理の時間が短く、装置の構成が簡易であり、基板を均一に乾燥することができる減圧乾燥装置を提供することを目的とする。 The present invention has been made in view of such points, and performs both the reduced-pressure drying treatment of the solvent on the substrate and the desorption treatment of the solvent from the solvent collecting section, and the time for the reduced-pressure drying treatment is as described above. Another object of the present invention is to provide a reduced-pressure drying apparatus that has a short time for the desorption treatment, a simple apparatus configuration, and can uniformly dry the substrate.
前記の目的を達成するため、本発明は、排気口が底板に設けられ、溶液が塗布された基板を収納するチャンバと、該チャンバ内において該チャンバの天板と前記基板との間に設けられ、前記基板から気化した前記溶液中の溶媒を一時的に捕集する、１ｍ２当たりの熱容量が８５０Ｊ／Ｋ以下の溶媒捕集部材と、を備え、前記チャンバ内で前記基板上の溶液を減圧状態で乾燥させる減圧乾燥装置において、前記チャンバの天板から延在し、前記溶媒捕集部材の側端と前記チャンバの側壁との間を遮るように配設された遮断部材を備える、ことを特徴としている。 In order to achieve the above object, the present invention provides a chamber in which an exhaust port is provided in a bottom plate and a substrate on which a solution is applied is stored, and the top plate of the chamber and the substrate are provided in the chamber. A solvent collecting member having a heat capacity per 1 m 2 of 850 J / K or less for temporarily collecting the solvent in the solution vaporized from the substrate, and depressurizing the solution on the substrate in the chamber A vacuum drying apparatus that dries in a state, and includes a blocking member that extends from the top plate of the chamber and is disposed so as to block a side end of the solvent collecting member and a side wall of the chamber. It is a feature.
記遮断部材の下端は、前記溶媒捕集部材の下端より下側に位置することが好ましい。 The lower end of the blocking member is preferably located below the lower end of the solvent collecting member.
前記遮断部材の下端と前記溶媒捕集部材の下端との鉛直方向の距離は１ｃｍ以上であることが好ましい。 The vertical distance between the lower end of the blocking member and the lower end of the solvent collecting member is preferably 1 cm or more.
前記基板の側端と前記遮断部材との水平方向の距離は１ｃｍ以上であることが好ましい。 The horizontal distance between the side edge of the substrate and the blocking member is preferably 1 cm or more.
前記遮断部材は、１ｍ２当たりの熱容量が２８６Ｊ／Ｋ以下であることが好ましい。 The blocking member preferably has a heat capacity per 1 m 2 of 286 J / K or less.
前記遮断部材の１ｍ２当たりの熱容量は、前記溶媒捕集部材の１ｍ２当たりの熱容量以下であることが好ましい。 It is preferable that the heat capacity per 1 m 2 of the blocking member is not more than the heat capacity per 1 m 2 of the solvent collecting member.
前記溶媒捕集部材は、網状部材から構成される溶媒捕集網であることが好ましい。 The solvent collecting member is preferably a solvent collecting net composed of a net member.
前記溶媒捕集網は、開口率が６０％以上８０％以下であることが好ましい。 The solvent collection network preferably has an opening ratio of 60% or more and 80% or less.
前記基板から前記溶媒捕集部材までの距離は、前記基板から前記チャンバの天板までの距離の４０％以上６０％以下であることが好ましい The distance from the substrate to the solvent collecting member is preferably 40% to 60% of the distance from the substrate to the top plate of the chamber.
本発明によれば、簡単な装置構成で、基板上の溶媒の減圧乾燥処理と溶媒捕集部からの溶媒の脱離処理を短時間で行うことができる。また、本発明によれば、基板を均一に乾燥することができる。 According to the present invention, it is possible to perform the solvent drying process on the substrate and the solvent desorption process from the solvent collecting unit in a short time with a simple apparatus configuration. Further, according to the present invention, the substrate can be dried uniformly.
以下、添付図面を参照して、本発明の実施の形態について説明する。なお、本明細書及び図面において、実質的に同一の機能構成を有する構成要素については、同一の符号を付することにより重複説明を省略する。また、以下に示す実施の形態によりこの発明が限定されるものではない。 Embodiments of the present invention will be described below with reference to the accompanying drawings. In addition, in this specification and drawing, about the component which has the substantially same function structure, duplication description is abbreviate | omitted by attaching | subjecting the same code | symbol. Further, the present invention is not limited to the embodiments described below.
図１は、本発明の実施の形態に係る減圧乾燥装置の概略構成を示す図であり、図１（Ａ）は減圧乾燥装置の構成の概略を示す断面図、図１（Ｂ）は減圧乾燥装置内の構成の概略を示す上面図である。図１（Ａ）では後述の溶媒捕集部を支持するための構造体の図示は省略され、図１（Ｂ）では上記構造体や後述の天板等の図示は省略されている。図２は、溶媒捕集部の取り付け構造を説明するための図であり、図２（Ａ）は減圧乾燥装置内の部分側面図、図２（Ｂ）は減圧乾燥装置における溶媒捕集部の周囲の部分下面図である。 FIG. 1 is a diagram showing a schematic configuration of a reduced-pressure drying apparatus according to an embodiment of the present invention. FIG. 1A is a cross-sectional view showing an outline of the configuration of the reduced-pressure drying apparatus, and FIG. It is a top view which shows the outline of a structure in an apparatus. In FIG. 1A, the illustration of a structure for supporting a solvent collecting section described later is omitted, and in FIG. 1B, the structure, the top plate described later, and the like are omitted. 2A and 2B are diagrams for explaining the attachment structure of the solvent collection unit, FIG. 2A is a partial side view in the vacuum drying apparatus, and FIG. 2B is a diagram of the solvent collection unit in the vacuum drying apparatus. It is a surrounding partial bottom view.
本実施形態に係る減圧乾燥装置は、基板上にインクジェット方式で塗布され溶液を、減圧状態で乾燥するものであり、本装置の処理対象の基板は例えば有機ＥＬディスプレイ用のガラス基板である。
なお、本装置の処理対象の基板に塗布される溶液は、溶質と溶媒からなり、減圧乾燥処理の対象となる成分は主に溶媒である。溶媒に含まれる有機化合物としては、高沸点のものが多く、例えば、１，３−ジメチル−２−イミダゾリジノン（1,3-dimethyl-2-imidazolidinone、沸点220℃、融点8℃）、４−tert-ブチルアニソール（4-tert-Butylanisole、沸点222℃、融点18℃）、Trans−アネトール（Trans-Anethole、沸点235℃、融点20℃）、１，２−ジメトキシベンゼン（1,2-Dimethoxybenzene、沸点206.7℃、融点22.5℃）、２−メトキシビフェニル（2-Methoxybiphenyl、沸点274℃、融点28℃）、フェニルエーテル（Phenyl Ether、沸点258.3℃、融点28℃）、２−エトキシナフタレン（2-Ethoxynaphthalene、沸点282℃、融点35℃）、ベンジルフェニルエーテル（Benzyl Phenyl Ether、沸点288℃、融点39℃）、２，６−ジメトキシトルエン（2,6-Dimethoxytoluene、沸点222℃、融点39℃）、２−プロポキシナフタレン（2-Propoxynaphthalene、沸点305℃、融点40℃）、１，２，３−トリメトキシベンゼン（1,2,3-Trimethoxybenzene、沸点235℃、融点45℃）、シクロヘキシルベンゼン（cyclohexylbenzene、沸点237.5℃、融点5℃）、ドデシルベンゼン（dodecylbenzene、沸点288℃、融点-7℃）、1,2,3,4-テトラメチルベンゼン（1,2,3,4-tetramethylbenzene、沸点203℃、融点76℃）等を挙げることができる。これらの高沸点有機化合物は、２種以上が組み合わされて溶液中に配合されている場合もある。
The reduced-pressure drying apparatus according to this embodiment is for applying a solution applied onto a substrate by an ink-jet method and drying the solution in a reduced-pressure state. The substrate to be processed by this apparatus is, for example, a glass substrate for an organic EL display.
Note that the solution applied to the substrate to be processed of the present apparatus is composed of a solute and a solvent, and the components to be subjected to the vacuum drying process are mainly solvents. Many organic compounds contained in the solvent have a high boiling point. For example, 1,3-dimethyl-2-imidazolidinone (boiling point 220 ° C., melting point 8 ° C.), 4 -Tert-Butylanisole (4-tert-Butylanisole, boiling point 222 ° C, melting point 18 ° C), Trans-Anethole (Trans-Anethole, boiling point 235 ° C, melting point 20 ° C), 1,2-dimethoxybenzene (1,2-Dimethoxybenzene) , Boiling point 206.7 ° C., melting point 22.5 ° C., 2-methoxybiphenyl (boiling point 274 ° C., melting point 28 ° C.), phenyl ether (Phenyl Ether, boiling point 258.3 ° C., melting point 28 ° C.), 2-ethoxynaphthalene (2- Ethoxynaphthalene, boiling point 282 ° C., melting point 35 ° C., benzyl phenyl ether (Benzyl Phenyl Ether, boiling point 288 ° C., melting point 39 ° C.), 2,6-dimethoxytoluene (2,6-Dimethoxytoluene, boiling point 222 ° C., melting point 39 ° C.), 2-Propoxynaphthalene, boiling point 305 ℃, melting point 40 ℃), 1,2,3-trimethoxybenzene (1,2,3-Trimethoxybenzene, boiling point 235 ℃, melting point 45 ℃), cyclohexylbenzene (cyclohexylbenzene, boiling point 237.5 ℃, melting point 5 ℃), dodecylbenzene (Dodecylbenzene, boiling point 288 ° C., melting point −7 ° C.), 1,2,3,4-tetramethylbenzene (1,2,3,4-tetramethylbenzene, boiling point 203 ° C., melting point 76 ° C.) and the like. These high boiling point organic compounds may be combined in a solution in a combination of two or more.
本実施形態に係る減圧乾燥装置は、図１に示すように、チャンバ１０と、載置台２０と、溶媒捕集部３０と、を備え、排気装置４０に接続されている。 As shown in FIG. 1, the vacuum drying apparatus according to the present embodiment includes a chamber 10, a mounting table 20, and a solvent collection unit 30, and is connected to an exhaust device 40.
チャンバ１０は、気密に構成されるものであり、ステンレス等の金属材料から形成される。チャンバ１０は、角筒状の側壁部１１と、側壁部１１の上側に取り付けられる天板１２と、側壁部１１の下側に取り付けられる底板１３と、天板１２から下方に延在する遮断部材１４を有する。 The chamber 10 is configured to be airtight and is formed from a metal material such as stainless steel. The chamber 10 includes a rectangular tubular side wall portion 11, a top plate 12 attached to the upper side of the side wall portion 11, a bottom plate 13 attached to the lower side of the side wall portion 11, and a blocking member extending downward from the top plate 12. 14
側壁部１１には、基板Ｗをチャンバ１０内に搬入出するための不図示の搬入出口が設けられている。
天板１２は、側壁部１１の上側の開口を塞ぐと共に、溶媒捕集部３０を支持する。溶媒捕集部３０の支持構造については後述する。
The side wall 11 is provided with a loading / unloading port (not shown) for loading / unloading the substrate W into / from the chamber 10.
The top plate 12 closes the upper opening of the side wall portion 11 and supports the solvent collecting portion 30. The support structure of the solvent collection unit 30 will be described later.
底板１３は、側壁部１１の下側の開口を塞ぐものであり、底板１３の上側の中央には載置台２０を支持する支持部材２１が配設されている。また、底板１３には、支持部材２１の外周を囲うように排気口１３ａが設けられ、排気口１３ａには排気管４１を介して排気装置４０が接続されている。この排気口１３ａを介して、減圧乾燥装置１のチャンバ１０内を減圧することができる。
遮断部材１４については後述する。
The bottom plate 13 closes the lower opening of the side wall 11, and a support member 21 that supports the mounting table 20 is disposed at the upper center of the bottom plate 13. Further, the bottom plate 13 is provided with an exhaust port 13 a so as to surround the outer periphery of the support member 21, and an exhaust device 40 is connected to the exhaust port 13 a via an exhaust pipe 41. The inside of the chamber 10 of the reduced pressure drying apparatus 1 can be depressurized through the exhaust port 13a.
The blocking member 14 will be described later.
載置台２０は、基板Ｗが載置されるものであり、支持部材２１を介してチャンバ１０の底板１３に支持される。載置台２０には、基板Ｗの受け渡しを行う不図示の昇降ピンが設けられており、該昇降ピンは昇降機構により自在に上下動できる。 The mounting table 20 is used for mounting the substrate W, and is supported by the bottom plate 13 of the chamber 10 via the support member 21. The mounting table 20 is provided with a lifting pin (not shown) for transferring the substrate W, and the lifting pin can be freely moved up and down by a lifting mechanism.
溶媒捕集部３０は、基板Ｗ上にインクジェット方式により塗布された溶液から気化した溶媒を捕集するものであり、チャンバ１０内の雰囲気中の溶媒濃度を調節するためのものである。 The solvent collection unit 30 collects the solvent evaporated from the solution applied on the substrate W by the inkjet method, and adjusts the solvent concentration in the atmosphere in the chamber 10.
溶媒捕集部３０は、開口が格子状に均一に形成された形状の薄板すなわち網状板から成る溶媒捕集プレート（以下、溶媒捕集網）３１を有する。
溶媒捕集網３１は、溶媒捕集部材の一例であり、ステンレスやアルミ、銅、金といった金属材料等の熱伝導性の良い材料から形成される。より具体的には、例えば、溶媒捕集網３１は、鋼板を冷間切延することにより製造されるエキスパンドメタルから構成される。溶媒捕集網３１は、１枚のエキスパンドメタルから構成されてもよいが、本例では、複数枚のエキスパンドメタルを水平方向に並べて構成されるものとする。
The solvent collection unit 30 includes a solvent collection plate (hereinafter referred to as a solvent collection network) 31 formed of a thin plate having a shape in which openings are uniformly formed in a lattice shape, that is, a net-like plate.
The solvent collection net 31 is an example of a solvent collection member, and is formed from a material having good thermal conductivity such as a metal material such as stainless steel, aluminum, copper, or gold. More specifically, for example, the solvent collection net 31 is made of expanded metal produced by cold-cutting a steel plate. Although the solvent collection net | network 31 may be comprised from one sheet of expanded metal, in this example, a plurality of sheets of expanded metal shall be arranged in the horizontal direction.
溶媒捕集網３１の厚さは例えば０．１ｍｍである。また、溶媒捕集網３１の水平方向の寸法は、基板Ｗの水平方向の寸法と略同一である。より具体的には、溶媒捕集網３１を構成する複数枚のエキスパンドメタル全体の水平方向の寸法は、基板Ｗの水平方向の寸法と略同一である。ただし、溶媒捕集網３１の水平方向の寸法は、気化した溶媒の吸着量を増やすために、基板Ｗの水平方向の寸法よりも大きくしてもよい。また、溶媒捕集網３１の水平方向の寸法は、基板Ｗの中央の上部に該溶媒捕集網３１を設置した場合に、チャンバ１０内の蒸気濃度のバランスを制御するために、基板Ｗの水平方向の寸法よりも小さくしてもよい。 The thickness of the solvent collection net 31 is, for example, 0.1 mm. The horizontal dimension of the solvent collection net 31 is substantially the same as the horizontal dimension of the substrate W. More specifically, the horizontal dimension of the plurality of expanded metals constituting the solvent collection net 31 is substantially the same as the horizontal dimension of the substrate W. However, the horizontal dimension of the solvent collection net 31 may be larger than the horizontal dimension of the substrate W in order to increase the adsorption amount of the evaporated solvent. Further, the horizontal dimension of the solvent collection network 31 is such that when the solvent collection network 31 is installed at the upper center of the substrate W, the balance of the vapor concentration in the chamber 10 is controlled. You may make it smaller than the dimension of a horizontal direction.
溶媒捕集網３１の開口率は大きく例えば６５％である。なお、開口率とは、（上面視における溶媒捕集網３１の開口部の総面積）／（上面視における溶媒捕集網３１の全面積）で与えられる。 The aperture ratio of the solvent collection network 31 is large, for example, 65%. The aperture ratio is given by (total area of opening of solvent collection network 31 in top view) / (total area of solvent collection network 31 in top view).
溶媒捕集網３１は、上述のように開口率が大きい網状であり且つ薄型であるため、１ｍ２当たりの熱容量が例えば３７２Ｊ／Ｋと低く、すなわち単位面積当たりの熱容量が例えば３７２Ｊ／Ｋ・ｍ２と低い。 Since the solvent collection net 31 has a net shape with a large aperture ratio and is thin as described above, the heat capacity per 1 m 2 is as low as 372 J / K, that is, the heat capacity per unit area is 372 J / K · m, for example. 2 is low.
この溶媒捕集網３１は、溶媒捕集網３１の上部の構造物であって溶媒捕集網３１に最も近い天板１２と基板Ｗとの間の位置に支持される。また、溶媒捕集網３１は、基板Ｗと正対するように、すなわち基板Ｗと略平行となるように、天板１２に支持される。 The solvent collection net 31 is a structure on the upper side of the solvent collection net 31 and is supported at a position between the top plate 12 and the substrate W closest to the solvent collection net 31. The solvent collection net 31 is supported by the top plate 12 so as to face the substrate W, that is, substantially parallel to the substrate W.
天板１２による溶媒捕集網３１の支持は、図２に示すように、枠体３２と脚部３３を介して行われる。以下、具体的に説明する。
溶媒捕集網３１を構成するエキスパンドメタル３１ａはそれぞれ、角筒状の枠体３２に溶接等により固定される。枠体３２の外側に設けられた耳部３２ａを、天板１２から下方向に延出する脚部３３に、ネジ等を用いて固定することにより、エキスパンドメタル３１ａすなわち溶媒捕集網３１が天板１２に支持される。
なお、枠体３２や脚部３３はステンレス等の金属材料から成る。
また、枠体３２や脚部３３は基板Ｗとは溶媒捕集網３１を間に挟んで反対側に位置している。したがって、溶媒捕集網３１が基板Ｗ側においてその全面が均一に露出しているので、基板Ｗから溶媒捕集網３１の方向への気化した溶媒の流れは枠体３２や脚部３３には阻害されない。ただし、気化した溶媒の流れをより均一にするためには、枠体３２や脚部３３の体積は小さいことが好ましい。
As shown in FIG. 2, the support plate 31 is supported by the top plate 12 via a frame 32 and legs 33. This will be specifically described below.
Each of the expanded metals 31a constituting the solvent collection net 31 is fixed to a rectangular tube frame 32 by welding or the like. By fixing the ear 32a provided on the outside of the frame 32 to a leg 33 extending downward from the top 12 using screws or the like, the expanded metal 31a, that is, the solvent collection net 31 is attached to the top. Supported by the plate 12.
The frame body 32 and the leg portion 33 are made of a metal material such as stainless steel.
Further, the frame body 32 and the leg portion 33 are located on the opposite side of the substrate W with the solvent collection net 31 in between. Accordingly, since the entire surface of the solvent collection net 31 is uniformly exposed on the substrate W side, the flow of the vaporized solvent from the substrate W toward the solvent collection net 31 is in the frame body 32 and the legs 33. Not disturbed. However, in order to make the flow of the vaporized solvent more uniform, it is preferable that the volume of the frame body 32 and the leg portion 33 is small.
図１の説明に戻る。
排気装置４０は、真空ポンプから構成され、具体的には、ターボ分子ポンプとドライポンプとが例えば上流側からこの順に直列に接続されて構成される。この排気装置４０は、底板１３の中心付近すなわち基板Ｗの中心付近の下部に配設されている。
排気管４１の排気口１３ａと排気装置４０との間の部分には自動圧力制御バルブ（ＡＰＣ（Adaptive Pressure Control）バルブ）４２が設けられている。減圧乾燥装置１では、排気装置４０の真空ポンプを作動させた状態で、ＡＰＣバルブ４２の開度を調節することにより、減圧排気の際のチャンバ１０内の真空度を制御することができる。
Returning to the description of FIG.
The exhaust device 40 is configured by a vacuum pump, and specifically, a turbo molecular pump and a dry pump are connected in series in this order from the upstream side, for example. The exhaust device 40 is disposed near the center of the bottom plate 13, that is, below the center of the substrate W.
An automatic pressure control valve (APC (Adaptive Pressure Control) valve) 42 is provided in a portion between the exhaust port 13 a of the exhaust pipe 41 and the exhaust device 40. In the vacuum drying apparatus 1, the degree of vacuum in the chamber 10 during vacuum exhaust can be controlled by adjusting the opening degree of the APC valve 42 while the vacuum pump of the exhaust apparatus 40 is operated.
なお、減圧乾燥装置１は、チャンバ１０内の圧力を測定する不図示の圧力計を有する。該圧力計での計測結果は電気信号としてＡＰＣバルブ４２に入力される。 The vacuum drying apparatus 1 includes a pressure gauge (not shown) that measures the pressure in the chamber 10. The measurement result of the pressure gauge is input to the APC valve 42 as an electrical signal.
また、減圧乾燥装置１は該装置１の不図示の制御部を備える。制御部は、例えばコンピュータであり、プログラム格納部（図示せず）を有している。プログラム格納部には、減圧乾燥装置１における減圧乾燥処理を制御するプログラムが格納されている。なお、上記プログラムは、例えばコンピュータ読み取り可能なハードディスク（ＨＤ）、フレキシブルディスク（ＦＤ）、コンパクトディスク（ＣＤ）、マグネットオプティカルデスク（ＭＯ）、メモリーカードなどのコンピュータに読み取り可能な記憶媒体に記録されていたものであって、その記憶媒体から制御部にインストールされたものであってもよい。 The vacuum drying apparatus 1 includes a control unit (not shown) of the apparatus 1. The control unit is, for example, a computer and has a program storage unit (not shown). The program storage unit stores a program for controlling the reduced pressure drying process in the reduced pressure drying apparatus 1. The above program is recorded in a computer-readable storage medium such as a computer-readable hard disk (HD), flexible disk (FD), compact disk (CD), magnetic optical desk (MO), or memory card. Or installed in the control unit from the storage medium.
続いて、チャンバ１０内に設けられている遮断部材１４について説明する。
遮断部材１４は、図１（Ａ）に示すように、前述の通り天板１２から下方に延在しており、すなわち、天板１２から連続している。また、遮断部材１４は、溶媒捕集網３１の側端と側壁部１１との間、すなわち、溶媒捕集網３１を遮るように配設され、具体的には、溶媒捕集網３１の側端とチャンバ１０の側壁との間を遮るように配設されている。より具体的には、載置台２０とチャンバ１０の側壁との間の、排気装置４０に通ずる隙間１０ａの上方に位置する。
遮断部材１４は、例えば、溶媒捕集網３１と同様に、ステンレスやアルミ、銅、金といった金属材料等の熱伝導性の良い材料から成る板状部材で構成される。
遮断部材１４の厚さは薄く例えば０．０５ｍｍである。遮断部材１４は、このように薄いため、１ｍ２当たりの熱容量が例えば２８６Ｊ／Ｋと低い。遮断部材１４の１ｍ２当たりの熱容量は２８６Ｊ／Ｋ以下であることが好ましい。
また、遮断部材１４の１ｍ２当たりの熱容量は、実際に使用している溶媒捕集網３１のもの以下であることが好ましい。なお、後述するように、溶媒捕集網３１は、板厚が０．０５ｍｍ、開口率が８０％のとき、その単位面積当たりの熱容量が１０６Ｊ／Ｋ・ｍ２であり、板厚が０．２ｍｍ、開口率が６０％のとき、その単位面積当たりの熱容量が８５０Ｊ／Ｋ・ｍ２である。
Next, the blocking member 14 provided in the chamber 10 will be described.
As shown in FIG. 1A, the blocking member 14 extends downward from the top plate 12 as described above, that is, continues from the top plate 12. Further, the blocking member 14 is disposed between the side end of the solvent collection net 31 and the side wall portion 11, that is, so as to block the solvent collection net 31, specifically, the side of the solvent collection net 31. It arrange | positions so that between the end and the side wall of the chamber 10 may be interrupted | blocked. More specifically, it is located above the gap 10 a between the mounting table 20 and the side wall of the chamber 10 that leads to the exhaust device 40.
The blocking member 14 is composed of a plate-like member made of a material having good thermal conductivity such as a metal material such as stainless steel, aluminum, copper, or gold, for example, like the solvent collection net 31.
The blocking member 14 is thin, for example, 0.05 mm. Since the blocking member 14 is thin like this, the heat capacity per 1 m 2 is as low as 286 J / K, for example. The heat capacity of 1 m 2 per blocking member 14 is preferably not more than 286J / K.
Moreover, it is preferable that the heat capacity per 1 m 2 of the blocking member 14 is equal to or less than that of the solvent collection net 31 actually used. As will be described later, when the plate thickness is 0.05 mm and the aperture ratio is 80%, the solvent collection net 31 has a heat capacity per unit area of 106 J / K · m 2 and a plate thickness of 0.00. When the opening ratio is 2 mm and 60%, the heat capacity per unit area is 850 J / K · m 2 .
また、遮断部材１４の長さは、当該遮断部材１４の下端が溶媒捕集網３１の下端より下側に位置するような長さである。遮断部材１４の下端と溶媒捕集網３１の下端との鉛直方向の距離は１ｃｍ以上である。また、載置台２０上に載置される基板Ｗの側端との水平方向の距離は１ｃｍ以上である。
さらに、遮断部材１４は、例えば、図１（Ｂ）に示すように、溶媒捕集網３１の側方全周を覆う。
The length of the blocking member 14 is such that the lower end of the blocking member 14 is positioned below the lower end of the solvent collection net 31. The vertical distance between the lower end of the blocking member 14 and the lower end of the solvent collection net 31 is 1 cm or more. Further, the distance in the horizontal direction from the side edge of the substrate W placed on the mounting table 20 is 1 cm or more.
Furthermore, the blocking member 14 covers, for example, the entire side periphery of the solvent collection net 31 as shown in FIG.
続いて、減圧乾燥装置１を用いた減圧乾燥処理について図３及び図４を用いて説明する。図３は、減圧乾燥処理の説明図であり、図３（Ａ）〜図３（Ｄ）は減圧乾燥処理の各工程におけるチャンバ１０内の様子を説明する図である。図４は、基板Ｗに塗布される溶液の溶媒の蒸気圧曲線を示す図であり、横軸は温度、縦軸は圧力である。 Subsequently, the vacuum drying process using the vacuum drying apparatus 1 will be described with reference to FIGS. 3 and 4. FIG. 3 is an explanatory diagram of the reduced-pressure drying process, and FIGS. 3A to 3D are diagrams illustrating the inside of the chamber 10 in each step of the reduced-pressure drying process. FIG. 4 is a diagram showing a vapor pressure curve of the solvent of the solution applied to the substrate W, where the horizontal axis represents temperature and the vertical axis represents pressure.
減圧乾燥装置１を用いた減圧乾燥処理では、まず、インクジェット方式で処理液が塗布された基板Ｗを載置台２０に載置する。この状態では、図３（Ａ）に示すように、基板Ｗの温度も溶媒捕集網３１の温度も室温の２３℃である。また、基板Ｗを載置台２０に載置した時点でのチャンバ１０内の圧力は、大気圧（約１０×１０４Ｐａ）であり、図４に示すように、基板Ｗの温度である２３℃における溶媒Ｓの飽和蒸気圧より大きいため、基板Ｗからの溶媒Ｓの蒸発速度は小さい。 In the reduced-pressure drying process using the reduced-pressure drying apparatus 1, first, the substrate W on which the processing liquid is applied is placed on the mounting table 20 by an inkjet method. In this state, as shown in FIG. 3A, the temperature of the substrate W and the temperature of the solvent collection network 31 are both 23 ° C., which is room temperature. Further, the pressure in the chamber 10 at the time when the substrate W is placed on the placement table 20 is atmospheric pressure (about 10 × 10 4 Pa), and the temperature of the substrate W is 23 ° C. as shown in FIG. Is larger than the saturated vapor pressure of the solvent S in FIG.
次いで、排気装置４０のドライポンプを作動させてチャンバ１０内を減圧排気する。ドライポンプによる減圧排気はチャンバ１０内の圧力が１０Ｐａとなるまで行う。
この減圧排気の際、断熱膨張によりチャンバ１０内の気体は冷却される。このようにチャンバ１０内の気体が冷却されたとしても、基板Ｗの温度は、該基板Ｗの熱容量が大きいこと等から、室温の２３℃からほとんど変化しない。しかし、熱容量が小さい溶媒捕集網３１の温度は、チャンバ１０内の冷却された気体により冷却され、低下する。具体的には、ドライポンプでの減圧排気が完了しチャンバ１０内の圧力が１０Ｐａとなった時点では、図３（Ｂ）に示すように、溶媒捕集網３１の温度は例えば８〜１５℃まで低下する。
なお、図４の点Ｐ１に示すように、ドライポンプでの減圧排気終了時のチャンバ１０内の圧力１０Ｐａは、基板Ｗの温度である２３℃における溶媒Ｓの飽和蒸気圧より大きいため、ドライポンプでの減圧排気の終了時点でも蒸発速度は大きくない。
Next, the exhaust pump 40 is operated to evacuate the chamber 10 under reduced pressure. The vacuum exhaust by the dry pump is performed until the pressure in the chamber 10 becomes 10 Pa.
During this vacuum exhaust, the gas in the chamber 10 is cooled by adiabatic expansion. Even when the gas in the chamber 10 is cooled in this way, the temperature of the substrate W hardly changes from 23 ° C. at room temperature because the heat capacity of the substrate W is large. However, the temperature of the solvent collection network 31 having a small heat capacity is cooled and lowered by the cooled gas in the chamber 10. Specifically, at the time when the vacuum exhaust with the dry pump is completed and the pressure in the chamber 10 reaches 10 Pa, the temperature of the solvent collection network 31 is, for example, 8 to 15 ° C. as shown in FIG. To fall.
As indicated by a point P1 in FIG. 4, the pressure 10 Pa in the chamber 10 at the end of the vacuum pumping at the dry pump is larger than the saturated vapor pressure of the solvent S at 23 ° C. that is the temperature of the substrate W. The evaporation rate is not large even at the end of the decompression exhaust.
排気装置４０のドライポンプによりチャンバ１０内の圧力を１０Ｐａまで減圧排気した後、排気装置４０のターボ分子ポンプを作動させてさらに減圧排気する。 After the pressure in the chamber 10 is reduced to 10 Pa by the dry pump of the exhaust device 40, the turbo molecular pump of the exhaust device 40 is operated to further reduce the pressure.
該減圧排気により、図４の点Ｐ２に示すように、チャンバ１０内の圧力が、基板Ｗの温度である２３℃における溶媒の蒸気圧である０．２Ｐａ以下となると、基板Ｗ上の溶媒Ｓの蒸発速度が大きくなる。 When the pressure in the chamber 10 becomes 0.2 Pa or less, which is the vapor pressure of the solvent at 23 ° C., which is the temperature of the substrate W, as shown by a point P2 in FIG. The evaporation rate increases.
この際、溶媒捕集網３１は前述のように減圧排気に伴って冷却されており、チャンバ１０内の圧力が０．２Ｐａまで減圧された時点で、溶媒捕集網３１の温度は例えば図３（Ｃ）に示すように８〜１５℃である。この８〜１５℃は、図４の点Ｐ３からも明らかなように、０．２Ｐａにおける溶媒の露点である２３℃より小さい。
また、溶媒捕集網３１の温度は、基板Ｗ上の溶媒Ｓの蒸発が完了するまでの間、各時点でのチャンバ１０内の圧力における溶媒Ｓの露点以下に維持される。
At this time, the solvent collection network 31 is cooled along with the vacuum exhaust as described above, and when the pressure in the chamber 10 is reduced to 0.2 Pa, the temperature of the solvent collection network 31 is, for example, FIG. It is 8-15 degreeC as shown to (C). As is apparent from point P3 in FIG. 4, this 8 to 15 ° C. is smaller than 23 ° C., which is the dew point of the solvent at 0.2 Pa.
Further, the temperature of the solvent collection network 31 is maintained below the dew point of the solvent S at the pressure in the chamber 10 at each time until the evaporation of the solvent S on the substrate W is completed.
したがって、基板Ｗから気化した溶媒は、溶媒捕集網３１により高効率で捕集されるため、チャンバ１０内の気体状の溶媒の濃度は低く維持される。したがって、基板Ｗ上の溶媒を速く除去することができる。 Therefore, since the solvent evaporated from the substrate W is collected with high efficiency by the solvent collection network 31, the concentration of the gaseous solvent in the chamber 10 is kept low. Therefore, the solvent on the substrate W can be removed quickly.
基板Ｗ上の溶媒Ｓの除去が完了した後も排気装置４０のターボ分子ポンプでの排気を継続する。溶媒捕集網３１により捕集された溶媒を該溶媒捕集網３１から除去するためである。 Even after the removal of the solvent S on the substrate W is completed, the exhaust by the turbo molecular pump of the exhaust device 40 is continued. This is because the solvent collected by the solvent collection network 31 is removed from the solvent collection network 31.
上述のようにターボ分子ポンプでの排気を継続していくと、チャンバ１０の天板１２や基板Ｗ等からの輻射熱により、熱容量の小さい溶媒捕集網３１の温度が上昇する。具体的には、基板Ｗ上の溶媒Ｓの蒸発が完了してから５分以内に、図４の点Ｐ４及び図３（Ｄ）に示すように、溶媒捕集網３１の温度がその時点のチャンバ１０の圧力（０．０５Ｐａ）における溶媒の露点以上である１８〜２３℃まで上昇する。したがって、溶媒捕集網３１から溶媒を速く除去／脱離することができる。 If exhaustion by the turbo molecular pump is continued as described above, the temperature of the solvent collection network 31 having a small heat capacity increases due to radiant heat from the top plate 12 and the substrate W of the chamber 10. Specifically, within 5 minutes after the evaporation of the solvent S on the substrate W is completed, as shown in the point P4 of FIG. 4 and FIG. The temperature rises to 18 to 23 ° C., which is equal to or higher than the dew point of the solvent at the pressure of the chamber 10 (0.05 Pa). Therefore, the solvent can be quickly removed / desorbed from the solvent collection network 31.
なお、基板Ｗ上の溶媒Ｓの蒸発が完了してから溶媒捕集網３１の温度がその時点のチャンバ１０の圧力における溶媒の露点以上となるまでの時間は、５分以内であることが好ましい。５分より大きいと、溶媒捕集網３１からの溶媒の脱離が完了するまでに長時間を要してしまい、タクトタイムが長くなってしまうからである。
また、基板Ｗ上の溶媒Ｓの蒸発が完了してから溶媒捕集網３１の温度がその時点のチャンバ１０の圧力における溶媒の露点以上となるまでの時間は、２０秒以上であることが好ましい。基板Ｗ上の溶媒Ｓは蒸発開始から約１０秒で乾燥が完了するため、溶媒捕集網３１は少なくとも１０秒以上、望ましくは２０秒以上をかけて徐々に乾燥することが好ましい。２０秒よりも短いと、溶媒捕集網３１に吸着された溶媒が気化したときに該気化した溶媒により、基板Ｗ上の乾燥した塗布膜が溶けたり、気化した溶媒が基板Ｗに吸着されたりしてしまうおそれがあるからである。
The time from the completion of the evaporation of the solvent S on the substrate W until the temperature of the solvent collection network 31 becomes equal to or higher than the dew point of the solvent at the pressure of the chamber 10 at that time is preferably within 5 minutes. . This is because if it is longer than 5 minutes, it takes a long time to complete the desorption of the solvent from the solvent collection network 31, and the tact time becomes longer.
In addition, the time from the completion of the evaporation of the solvent S on the substrate W until the temperature of the solvent collection network 31 becomes equal to or higher than the dew point of the solvent at the pressure of the chamber 10 at that time is preferably 20 seconds or more. . Since the solvent S on the substrate W is completely dried in about 10 seconds from the start of evaporation, the solvent collection network 31 is preferably dried gradually over at least 10 seconds, preferably over 20 seconds. If the time is shorter than 20 seconds, when the solvent adsorbed on the solvent collection network 31 is vaporized, the vaporized solvent dissolves the dried coating film on the substrate W, or the vaporized solvent is adsorbed on the substrate W. This is because there is a risk of doing so.
溶媒捕集網３１の温度が上述のようにその時点のチャンバ１０の圧力における溶媒の露点以上となってから所定時間が経過するまで、ターボ分子ポンプでの排気を継続することにより、溶媒捕集網３１から溶媒を除去する溶媒捕集網３１の乾燥工程が終了する。 By continuing the exhaust with the turbo molecular pump until a predetermined time has elapsed after the temperature of the solvent collection network 31 becomes equal to or higher than the dew point of the solvent at the current pressure of the chamber 10 as described above, the solvent collection is performed. The drying process of the solvent collection net 31 for removing the solvent from the net 31 is completed.
溶媒捕集網３１の乾燥工程終了後、排気装置４０を停止する。その後、チャンバ１０内の圧力を大気圧まで戻した後、基板Ｗをチャンバ１０から搬出する。これで、減圧乾燥装置１での減圧乾燥処理が終了する。 After the drying process of the solvent collection net 31 is completed, the exhaust device 40 is stopped. Thereafter, after returning the pressure in the chamber 10 to atmospheric pressure, the substrate W is unloaded from the chamber 10. Thus, the vacuum drying process in the vacuum drying apparatus 1 is completed.
このように、減圧乾燥装置１では、熱容量の小さい網状板を溶媒捕集部３０に用いるので、減圧乾燥処理に際し溶媒捕集部３０を冷却／加熱するために、別途機構を設ける必要がない。したがって、減圧乾燥装置１では、基板の乾燥に要する時間（以下、乾燥時間）と溶媒捕集網３１の乾燥時間の両方を含めた処理時間を簡易な構成で短くすることができる。言い換えると、基板上の溶媒の減圧乾燥処理と溶媒捕集部３０からの溶媒の脱離処理を簡易な構成で短時間で行うことができる。 As described above, in the reduced pressure drying apparatus 1, since the mesh plate having a small heat capacity is used for the solvent collecting unit 30, it is not necessary to provide a separate mechanism for cooling / heating the solvent collecting unit 30 during the reduced pressure drying process. Therefore, in the reduced-pressure drying apparatus 1, the processing time including both the time required for drying the substrate (hereinafter, drying time) and the drying time of the solvent collection network 31 can be shortened with a simple configuration. In other words, the drying process of the solvent on the substrate and the desorption process of the solvent from the solvent collection unit 30 can be performed in a short time with a simple configuration.
また、減圧乾燥装置１では、基板の乾燥時間のさらなる短縮のため、上述のように、溶媒捕集網３１の温度が、チャンバ１０内の圧力が基板Ｗの温度すなわち室温における蒸気圧以下となった時点で、その時点での圧力における露点すなわち室温以下とされ、さらに、蒸発が完了するまでの間、各時点での圧力における露点以下とされる。
さらに、減圧乾燥装置１では、溶媒捕集網３１の乾燥時間のさらなる短縮のため、上述のように、溶媒捕集網３１の温度が、蒸発が完了した時から５分以内に、その時点での圧力における露点以上とされる。
Further, in the reduced pressure drying apparatus 1, in order to further shorten the drying time of the substrate, as described above, the temperature of the solvent collection network 31 is such that the pressure in the chamber 10 is equal to or lower than the temperature of the substrate W, that is, the vapor pressure at room temperature. At that time, the dew point at the pressure at that time, that is, the room temperature or less, and further, below the dew point at the pressure at each time until the evaporation is completed.
Furthermore, in the vacuum drying apparatus 1, in order to further shorten the drying time of the solvent collection network 31, as described above, the temperature of the solvent collection network 31 is within 5 minutes from the time when evaporation is completed. More than the dew point at the pressure.
次に、溶媒捕集部３０の溶媒捕集網３１について詳述する。
上述の説明では、溶媒捕集網３１は単位面積当たりの熱容量が例えば３７２Ｊ／Ｋ・ｍ２とした。しかし、溶媒捕集網３１の単位面積当たりの熱容量は、上述のものに限られず、排気によるチャンバ１０内の断熱膨張により該溶媒捕集網３１の温度が低下すると共にチャンバ１０等からの輻射熱により該溶媒捕集網３１の温度が上昇すればよい。したがって、溶媒捕集網３１の単位面積当たりの熱容量は１０６〜８５０Ｊ／Ｋ・ｍ２以下であればよい。なお、溶媒捕集網３１の板厚が０．０５ｍｍ、開口率が８０％のときの単位面積当たりの熱容量が１０６Ｊ／Ｋ・ｍ２であり、溶媒捕集網３１の板厚が０．２ｍｍ、開口率が６０％のときの単位面積当たりの熱容量が８５０Ｊ／Ｋ・ｍ２である。
Next, the solvent collection net 31 of the solvent collection unit 30 will be described in detail.
In the above description, the solvent collection net 31 has a heat capacity per unit area of, for example, 372 J / K · m 2 . However, the heat capacity per unit area of the solvent collection network 31 is not limited to that described above, and the temperature of the solvent collection network 31 decreases due to adiabatic expansion in the chamber 10 due to exhaust, and radiant heat from the chamber 10 and the like. What is necessary is just to raise the temperature of this solvent collection net | network 31. FIG. Therefore, the heat capacity per unit area of the solvent collection net 31 may be 106 to 850 J / K · m 2 or less. In addition, when the plate thickness of the solvent collection net 31 is 0.05 mm and the aperture ratio is 80%, the heat capacity per unit area is 106 J / K · m 2 , and the plate thickness of the solvent collection net 31 is 0.2 mm. The heat capacity per unit area when the aperture ratio is 60% is 850 J / K · m 2 .
また、溶媒捕集網３１は上述のように基板Ｗと天板１２との間の位置に支持される。より具体的には、基板Ｗの上面と溶媒捕集網３１の厚さ方向の中心までの距離が基板Ｗの上面からチャンバ１０の天板１２の下面までの距離の４０〜６０％となる位置に支持される。減圧排気時の気体の膨張率すなわち断熱膨張による冷却強度は、上下方向に係る位置によって異なり、上述の４０〜６０％となる位置では他に場所に比べ大きい。そのため、当該位置に支持することにより溶媒捕集網３１を大きく冷却することができ、また、真空下でのチャンバ１０から溶媒捕集網３１への輻射熱による加熱はそれらの間の距離によらないため、基板Ｗからの溶媒を速く除去することができる。 Moreover, the solvent collection net | network 31 is supported by the position between the board | substrate W and the top plate 12 as mentioned above. More specifically, the position where the distance from the upper surface of the substrate W to the center in the thickness direction of the solvent collection network 31 is 40 to 60% of the distance from the upper surface of the substrate W to the lower surface of the top plate 12 of the chamber 10. Supported by The gas expansion rate during decompression, that is, the cooling strength due to adiabatic expansion, differs depending on the position in the vertical direction, and is larger than the other locations at the position of 40 to 60% described above. Therefore, the solvent collection network 31 can be greatly cooled by supporting at this position, and heating by radiant heat from the chamber 10 to the solvent collection network 31 under vacuum does not depend on the distance between them. Therefore, the solvent from the substrate W can be removed quickly.
次に、減圧乾燥装置１に遮断部材１４を設けた理由について説明する。本発明者らが調査したところ、前述のように、熱容量の小さい網状板を溶媒捕集網として用いたときに、基板の中央に比べて端部の乾燥速度が遅く、基板を均一に乾燥することができない場合があることが確認された。そこで、本発明者らは、基板を均一に乾燥できない理由についてさらに検討を重ねた結果、まず、溶媒捕集網の冷却過程において溶媒捕集網の中央と端部とで温度差があり、端部の方が温度が高いことが確認された。ここで、溶媒捕集網の温度が低い方が溶媒の捕集効率が上がるため、上述の溶媒捕集網の中央と端部とでの温度差が、基板を均一に乾燥することができない原因であると推察される。 Next, the reason why the blocking member 14 is provided in the vacuum drying apparatus 1 will be described. As a result of investigation by the present inventors, as described above, when a reticulated plate having a small heat capacity is used as the solvent collection net, the drying speed of the edge portion is slower than the center of the substrate, and the substrate is uniformly dried. It was confirmed that there were cases where it was not possible. Therefore, as a result of further investigation on the reason why the substrate cannot be uniformly dried, the inventors first have a temperature difference between the center and the end of the solvent collection network in the cooling process of the solvent collection network. It was confirmed that the temperature of the part was higher. Here, since the solvent collection efficiency increases when the temperature of the solvent collection network is lower, the temperature difference between the center and the end of the solvent collection network cannot cause the substrate to be dried uniformly. It is guessed that.
かかる考察を踏まえ、本発明者らは、溶媒捕集網の冷却過程において溶媒捕集網の中央と端部とで温度差が発生する原因を解明するため、溶媒捕集網の冷却過程における減圧乾燥装置内の温度変化と気体の流れについシミュレーションを行った。 Based on such considerations, the present inventors have developed a pressure reduction in the cooling process of the solvent collection network in order to elucidate the cause of the temperature difference between the center and the end of the solvent collection network in the cooling process of the solvent collection network. Simulations were made of temperature changes and gas flow in the dryer.
シミュレーションには、汎用熱流体解析ソフトウェアであるＦＬＵＥＮＴを使用した。
熱流体解析（ＣＦＤ：Computational Fluid Dynamics）では、排気による強制対流、気体の温度差による自然対流のみを考慮し、輻射による温度変化については考慮しなかった。これは、輻射の高温源となる天板１２や載置台２０の温度は室温でほぼ一定であり低く、対流伝熱に比べて十分小さく無視できるためである。
For the simulation, FLUENT, a general-purpose thermal fluid analysis software, was used.
In thermal fluid analysis (CFD), only forced convection due to exhaust and natural convection due to gas temperature differences are considered, and temperature changes due to radiation are not considered. This is because the temperature of the top plate 12 and the mounting table 20 serving as a high-temperature source of radiation is substantially constant at room temperature and low, which is sufficiently small compared with convective heat transfer and can be ignored.
また、本解析は、２次元軸対称解析とし、解析領域は減圧乾燥装置内の気体及び溶媒捕集網とし、解析における減圧乾燥装置は、図１の減圧乾燥装置１と同様の構成を有するが、遮断部材１４を有さないものであるとした。また、溶媒捕集網を通過する気体と当該溶媒捕集網との間での伝熱については非平衡多孔質モデルを使用した。解析対象の時間領域は、大気圧の状態から、排気開始後３０秒経過し減圧乾燥装置内の圧力が数百Ｐａになるまで、とした。このように排気動作開始直後を解析対象としたのは、減圧された気体による溶媒捕集網の冷却が行われるには、圧力がある程度高い必要（例えば１００Ｐａ以上）があるからである。また、基板の温度勾配は、排気動作開始直後についてしまうと、溶媒の揮発が始まる時まで、その状態が維持されてしまい、揮発開始のタイミングが基板上の領域毎に異なってしまい、乾燥時間に影響が出るからである。なお、上述のように圧力がある程度高いため、溶媒の気化はほとんど生じないものと考えられるため、溶媒の気化／凝縮による熱は考慮しなかった。 Further, this analysis is a two-dimensional axisymmetric analysis, the analysis region is a gas and solvent collection network in the vacuum drying apparatus, and the vacuum drying apparatus in the analysis has the same configuration as the vacuum drying apparatus 1 in FIG. It is assumed that the blocking member 14 is not provided. A non-equilibrium porous model was used for heat transfer between the gas passing through the solvent collection network and the solvent collection network. The time region to be analyzed was from the state of atmospheric pressure until 30 seconds after the start of exhausting until the pressure in the vacuum drying apparatus reached several hundred Pa. The reason for the analysis immediately after the start of the exhaust operation is that the pressure needs to be high to some extent (for example, 100 Pa or more) in order to cool the solvent collection network by the decompressed gas. In addition, if the temperature gradient of the substrate immediately follows the start of the exhaust operation, the state is maintained until the time when the volatilization of the solvent starts, and the timing of the start of volatilization varies from region to region on the substrate, resulting in a drying time. This is because there is an influence. In addition, since the pressure is high to some extent as described above, it is considered that the solvent is hardly vaporized. Therefore, heat due to the vaporization / condensation of the solvent was not taken into consideration.
解析対象の減圧乾燥装置において、基板の載置台及び溶媒捕集網の幅が２５００〜３０００ｍｍ、載置台及び溶媒捕集網からチャンバの側壁までの水平方向の距離が５０〜１００ｍｍ、溶媒捕集網からチャンバの天板までの鉛直方向の距離が５０〜１５０、載置台から天板までの水平方向の距離が８０〜３７５ｍｍ、チャンバの底板から天板が１００〜５００ｍｍであるものとし、基板の幅が２５００ｍｍであるものとした。
さらに、溶媒捕集網はＳＵＳであるものとした。つまり、溶媒捕集網の熱伝導率などの物性値にはＳＵＳのものを用いた。また、溶媒捕集網の開口率は６５％とし、厚さは０．１ｍｍとした。
In the reduced-pressure drying apparatus to be analyzed, the width of the substrate mounting table and the solvent collection network is 2500 to 3000 mm, the horizontal distance from the mounting table and the solvent collection network to the side wall of the chamber is 50 to 100 mm, and the solvent collection network The vertical distance from the top plate of the chamber to the top plate of the chamber is 50 to 150, the horizontal distance from the mounting table to the top plate is 80 to 375 mm, and the top plate from the bottom plate of the chamber is 100 to 500 mm. Was 2500 mm.
Further, the solvent collection network was SUS. That is, SUS was used as a physical property value such as the thermal conductivity of the solvent collection network. The aperture ratio of the solvent collection net was 65% and the thickness was 0.1 mm.
減圧乾燥装置内の気体の温度及び圧力の初期値は室温（２５度）及び大気圧であるものとした。境界条件としてのInlet（流入口）は設定せず、Outlet（流出口）の圧力については、実際の減圧乾燥装置の排気口で測定された値を指定した。また、減圧乾燥装置の側壁、天板及び載置台並びに基板は、熱容量が大きく、減圧乾燥装置内の気体による温度変化はほとんど生じないため、これらの温度は室温（２５℃）で一定であるものとした。 The initial values of the temperature and pressure of the gas in the vacuum drying apparatus were room temperature (25 degrees) and atmospheric pressure. The Inlet (inlet) as the boundary condition was not set, and the value measured at the outlet of the actual vacuum drying apparatus was specified for the outlet pressure. Moreover, since the side wall, the top plate, the mounting table, and the substrate of the vacuum drying apparatus have a large heat capacity, and temperature changes due to the gas in the vacuum drying apparatus hardly occur, these temperatures are constant at room temperature (25 ° C.). It was.
シミュレーション結果を図５〜図８に示す。図５は、排気開始から３０秒後における、減圧乾燥装置内の溶媒捕集網の温度分布のシミュレーション結果を示す図である。図６は、排気開始から１６．５秒後における、減圧乾燥装置内の各領域における気体の温度、流れる方向及び流速を示す図である。図７は、図６の減圧乾燥装置の端部部分を拡大して示す部分拡大図である。図８は、図７のシミュレーション結果に基づく減圧乾燥装置の端部部分での気体の流れを示す図である。なお、図５〜図７において、温度の高低がグレースケールで示されており、温度が高いほど濃く示されている。また、図６及び図７において矢印の向きは気体の流れる方向を示し、矢印の長さは流速を示している。図８の矢印は気体の流れを示す。 The simulation results are shown in FIGS. FIG. 5 is a diagram showing a simulation result of the temperature distribution of the solvent collection network in the vacuum drying apparatus 30 seconds after the start of exhaust. FIG. 6 is a diagram showing the gas temperature, flowing direction, and flow velocity in each region in the vacuum drying apparatus after 16.5 seconds from the start of exhaust. FIG. 7 is a partially enlarged view showing an end portion of the reduced pressure drying apparatus of FIG. 6 in an enlarged manner. FIG. 8 is a diagram illustrating a gas flow in the end portion of the vacuum drying apparatus based on the simulation result of FIG. In FIGS. 5 to 7, the temperature level is shown in gray scale, and the higher the temperature, the darker the level. 6 and 7, the direction of the arrow indicates the direction of gas flow, and the length of the arrow indicates the flow velocity. The arrows in FIG. 8 indicate the gas flow.
図５に示すように、シミュレーションにおける排気開始から３０秒後の減圧乾燥装置Ｍ内の溶媒捕集網Ｎは、実際と同様に、その端部の温度が中央部に比べて高くなっている。このことから、発明者らが行ったシミュレーションは実際の様子を表現できているものと考えられる。
図６〜図８に示すように、シミュレーション結果によれば、減圧乾燥装置Ｍでは、下方から排気されるにも関わらず、チャンバの側壁Ｍ１に沿って上昇気流が生じている。これは、チャンバの側壁Ｍ１により暖められた気体が上昇することにより生じているものと考えられる。また、チャンバの側壁Ｍ１に沿って天板Ｍ２まで上昇した気体は、減圧乾燥装置Ｍの中央に向けて天板Ｍ２に沿って移動するがほとんど移動せず、溶媒捕集網Ｎの上部の領域Ｍ３に溜まる。これにより、溶媒捕集網Ｎの端部の上部の領域Ｍ３において気体の温度が他の領域に比べて高くなっている。
このシミュレーション結果により、溶媒捕集網Ｎの端部の上部に領域Ｍ３に位置する気体の温度が他の領域に比べて高くなっていることによって溶媒捕集網Ｎの端部の温度が高くなり、その結果、基板Ｗを均一に乾燥できないことが知見された。
As shown in FIG. 5, the temperature of the end of the solvent collection network N in the vacuum drying apparatus M 30 seconds after the start of exhaust in the simulation is higher than that in the center, as in the actual case. From this, it is considered that the simulation conducted by the inventors can express the actual situation.
As shown in FIGS. 6 to 8, according to the simulation results, in the reduced pressure drying apparatus M, an updraft is generated along the side wall M <b> 1 of the chamber, although it is exhausted from below. This is considered to be caused by the rising of the gas heated by the side wall M1 of the chamber. The gas rising to the top plate M2 along the side wall M1 of the chamber moves along the top plate M2 toward the center of the vacuum drying apparatus M, but hardly moves, and is a region above the solvent collection network N. Accumulate in M3. Thereby, in the area | region M3 of the upper part of the edge part of the solvent collection net | network N, the temperature of gas is high compared with another area | region.
From this simulation result, the temperature of the gas located in the region M3 above the end of the solvent collection network N is higher than that in the other regions, so that the temperature of the end of the solvent collection network N increases. As a result, it has been found that the substrate W cannot be dried uniformly.
この知見に基づいて、本実施形態の減圧乾燥装置１には、遮断部材１４が設けられている。 Based on this knowledge, the blocking member 14 is provided in the vacuum drying apparatus 1 of the present embodiment.
図９は、遮断部材１４の作用効果について説明する図であり、減圧乾燥装置１内における遮断部材１４の周辺の様子を示す。
遮断部材１４は、前述のように、天板１２から下方に延在し該天板１２から連続しており、また、溶媒捕集網３１の側端と側壁部１１との間に配設され、具体的には、溶媒捕集網３１の側端とチャンバ１０の側壁との間であって、載置台２０とチャンバ１０の側壁との間の、排気装置４０（図１参照）に通ずる隙間１０ａの上方に位置する。
FIG. 9 is a diagram for explaining the function and effect of the blocking member 14 and shows the surroundings of the blocking member 14 in the vacuum drying apparatus 1.
As described above, the blocking member 14 extends downward from the top plate 12 and is continuous from the top plate 12, and is disposed between the side end of the solvent collection net 31 and the side wall portion 11. Specifically, a gap between the side end of the solvent collection net 31 and the side wall of the chamber 10, and between the mounting table 20 and the side wall of the chamber 10, leading to the exhaust device 40 (see FIG. 1). Located above 10a.
したがって、図９に示すように、チャンバ１０の側壁に沿って天板１２まで上昇した気体は、天板１２に沿って装置中央に向けて移動するが、遮断部材１４が存在するため、溶媒捕集網３１の端部の上方の領域Ａまで移動しない。その結果、溶媒捕集網３１の端部の上方の温度が高くならないため、溶媒捕集網３１の端部の温度のみが高くなることがない。言い換えると、溶媒捕集網３１の端において網温度の低下を阻害している上昇暖気流を、遮断部材１４により遮蔽することができる。よって、減圧乾燥装置１では基板Ｗの乾燥速度を面内で均一に乾燥することができる。遮断部材１４は、特に、載置台２０とチャンバ１０の側壁との間の距離が小さいときに有用である。 Therefore, as shown in FIG. 9, the gas rising to the top plate 12 along the side wall of the chamber 10 moves toward the center of the apparatus along the top plate 12, but since the blocking member 14 exists, It does not move to the area A above the end of the collection net 31. As a result, since the temperature above the end of the solvent collection net 31 does not increase, only the temperature at the end of the solvent collection net 31 does not increase. In other words, the rising warm air flow that inhibits the decrease in the net temperature at the end of the solvent collection net 31 can be shielded by the blocking member 14. Therefore, the reduced-pressure drying apparatus 1 can uniformly dry the substrate W at the in-plane drying speed. The blocking member 14 is particularly useful when the distance between the mounting table 20 and the side wall of the chamber 10 is small.
また、溶媒捕集網３１の端部の温度が低く、基板の端部の乾燥速度が遅いと、基板の端部の乾燥速度でプロセス速度が決まっている場合、低スループットとなってしまう。それに対し、本実施形態では、遮断部材１４を設けない場合に比べ、基板の端部の乾燥速度が速いため、スループットすなわちプロセス性能が向上する。 In addition, if the temperature of the end of the solvent collection network 31 is low and the drying speed of the end of the substrate is low, the throughput becomes low when the process speed is determined by the drying speed of the end of the substrate. On the other hand, in this embodiment, since the drying speed of the edge part of a board | substrate is quick compared with the case where the interruption | blocking member 14 is not provided, a throughput, ie, process performance, improves.
また、遮断部材１４の下端は、溶媒捕集網３１の下端より下側に位置する。したがって、天板１２に沿って装置中央に向け移動し、遮断部材１４によって溶媒捕集網３１の端部の上方までの移動が遮られた気体が、遮断部材１４に沿って下方に移動したときに、該気体によって溶媒捕集網３１の端部が熱せられるのを防ぐことができる。特に、遮断部材１４の下端と溶媒捕集網３１の下端との鉛直方向の距離は１ｃｍ以上である。したがって、上述のように遮断部材１４に沿って下方に移動した気体によって溶媒捕集網３１の端部が熱せられるのをより確実に防ぐことができる。 Further, the lower end of the blocking member 14 is positioned below the lower end of the solvent collection net 31. Therefore, when the gas that moves toward the center of the apparatus along the top plate 12 and is blocked by the blocking member 14 from moving upward to the end of the solvent collection net 31 moves downward along the blocking member 14. Moreover, it can prevent that the edge part of the solvent collection net | network 31 is heated by this gas. In particular, the vertical distance between the lower end of the blocking member 14 and the lower end of the solvent collection net 31 is 1 cm or more. Therefore, it can prevent more reliably that the edge part of the solvent collection net | network 31 is heated by the gas which moved below along the interruption | blocking member 14 as mentioned above.
さらに、遮断部材１４と基板Ｗの側端との水平方向の距離が１ｃｍ以上であるため、減圧により冷却された気体の底部側方に向かう流れが基板Ｗの端部付近において遮断部材１４によって遮られることがないため、基板Ｗの端部の冷却が遮断部材１４によって抑制されるのを防ぐことができる。 Furthermore, since the horizontal distance between the blocking member 14 and the side edge of the substrate W is 1 cm or more, the flow toward the bottom side of the gas cooled by the reduced pressure is blocked by the blocking member 14 in the vicinity of the edge of the substrate W. Therefore, the cooling of the end portion of the substrate W can be prevented from being suppressed by the blocking member 14.
さらにまた、遮断部材１４は、熱容量が小さく、具体的には、１ｍ２当たりの熱容量が２８６Ｊ／Ｋ以下であるため、減圧により冷却された気体によって遮断部材１４も冷却される。したがって、遮断部材１４によって気体が熱せられて、該気体によって基板Ｗの端部の冷却が抑制されるのを防ぐことができる。
また、遮断部材１４の１ｍ２当たりの熱容量を、溶媒捕集網３１の１ｍ２当たりの熱容量以下とすることにより、遮断部材１４の方が溶媒捕集網３１に比べてより容易に冷却されやすくなるため、遮断部材１４の温度により溶媒捕集網３１の冷却が抑制されるのを防ぐことができる。
Furthermore, since the shielding member 14 has a small heat capacity, specifically, the heat capacity per 1 m 2 is 286 J / K or less, the shielding member 14 is also cooled by the gas cooled by the reduced pressure. Therefore, it can be prevented that the gas is heated by the blocking member 14 and the cooling of the end portion of the substrate W is suppressed by the gas.
Moreover, the heat capacity of 1 m 2 per blocking member 14, by the following heat capacity of 1 m 2 per solvents collecting network 31, easily towards the blocking member 14 is more easily cooled as compared to the solvent collecting network 31 Therefore, it is possible to prevent the cooling of the solvent collection net 31 from being suppressed by the temperature of the blocking member 14.
図１０は、遮断部材１４の他の例の説明図であり、溶媒捕集網３１と遮断部材１４のみを上方から視た様子を模式的に示す。
図１の例の遮断部材１４は、溶媒捕集網３１の側方全周を覆っていたが、図７の例の遮断部材１４は、載置台２０上の基板Ｗの各辺に対向するように設けられた４つの部材を有し、各部材は連結されておらず、基板Ｗの角部の側方は覆わない構成である。
この構成では、基板Ｗの角部の上方に位置する溶媒捕集網３１の角部は、前述のチャンバ１０の側壁に沿った上昇気流により冷却されにくいが、基板Ｗの角部の乾燥速度は速い。そのため、この構成であっても、基板を均一に乾燥することができる。
FIG. 10 is an explanatory diagram of another example of the blocking member 14 and schematically shows a state in which only the solvent collection net 31 and the blocking member 14 are viewed from above.
The blocking member 14 in the example of FIG. 1 covers the entire circumference of the side of the solvent collection net 31, but the blocking member 14 in the example of FIG. 7 is provided so as to face each side of the substrate W on the mounting table 20. The four members are not connected to each other, and the sides of the corners of the substrate W are not covered.
In this configuration, the corner of the solvent collection net 31 located above the corner of the substrate W is difficult to be cooled by the rising air flow along the side wall of the chamber 10 described above, but the drying speed of the corner of the substrate W is fast. Therefore, even with this configuration, the substrate can be dried uniformly.
なお、遮断部材１４は、剛性を有する板状部材としたが、熱容量が１ｍ２当たり２８６Ｊ／Ｋ以下と小さければ、可撓性を有するフィルム状のものであってもよい。
また、遮断部材１４は、本例では天板１２から垂直に垂下していたが、垂下方向は垂直に限らず、例えば、その下端に向かうにつれて、溶媒捕集網３１からの水平方向の距離が徐々に増加していくように垂下してもよい。
Although the blocking member 14 is a plate member having rigidity, it may be a film having flexibility as long as the heat capacity is as small as 286 J / K or less per 1 m 2 .
In addition, the blocking member 14 hangs vertically from the top plate 12 in this example, but the suspending direction is not limited to vertical, for example, the distance in the horizontal direction from the solvent collection net 31 increases toward the lower end. You may droop so that it may increase gradually.
本発明はインクジェット方式で溶液が塗布された基板に対し減圧乾燥を行う技術に有用である。 The present invention is useful for a technique for drying under reduced pressure on a substrate coated with a solution by an inkjet method.
１…減圧乾燥装置
１０…チャンバ
１１…側壁部
１２…天板
１３…底板
１３ａ…排気口
１４…遮断部材
２０…載置台
３０…溶媒捕集部（基板乾燥用捕集部）
３１…該溶媒捕集網
３１…溶媒捕集網
３１ａ…エキスパンドメタル
３２…枠体
３２ａ…耳部
３３…脚部
４０…排気装置
４２…ＡＰＣバルブ
５０…赤外線放射体
５０…当該赤外線放射体
７０…別の溶媒捕集部（枯らし用捕集部）
DESCRIPTION OF SYMBOLS 1 ... Vacuum drying apparatus 10 ... Chamber 11 ... Side wall part 12 ... Top plate 13 ... Bottom plate 13a ... Exhaust port 14 ... Blocking member 20 ... Mounting stand 30 ... Solvent collection part (collection part for board | substrate drying)
DESCRIPTION OF SYMBOLS 31 ... This solvent collection net 31 ... Solvent collection net 31a ... Expanded metal 32 ... Frame 32a ... Ear part 33 ... Leg part 40 ... Exhaust device 42 ... APC valve 50 ... Infrared radiator 50 ... Infrared radiator 70 ... Another solvent collector (withering collector)
Claims (9)
前記チャンバの天板から延在し、前記溶媒捕集部材の側端と前記チャンバの側壁との間を遮るように配設された遮断部材を備える、ことを特徴とする減圧乾燥装置。 An exhaust port is provided in the bottom plate, and a chamber for storing the substrate coated with the solution is provided between the top plate of the chamber and the substrate in the chamber, and the solvent in the solution evaporated from the substrate is removed. A solvent collecting member having a heat capacity per 1 m 2 that is temporarily collected and having a heat capacity of 850 J / K or less; and a vacuum drying apparatus that dries the solution on the substrate in a reduced pressure state in the chamber.
A reduced-pressure drying apparatus comprising: a blocking member that extends from a top plate of the chamber and is disposed so as to block between a side end of the solvent collecting member and a side wall of the chamber.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017155837A JP6920131B2 (en) | 2017-08-10 | 2017-08-10 | Decompression drying device |
| CN201810901188.5A CN109390253A (en) | 2017-08-10 | 2018-08-09 | Decompression dry device |
| KR1020180093817A KR20190017699A (en) | 2017-08-10 | 2018-08-10 | Pressure reduction drying apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017155837A JP6920131B2 (en) | 2017-08-10 | 2017-08-10 | Decompression drying device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019035527A true JP2019035527A (en) | 2019-03-07 |
| JP6920131B2 JP6920131B2 (en) | 2021-08-18 |
Family
ID=65418196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017155837A Active JP6920131B2 (en) | 2017-08-10 | 2017-08-10 | Decompression drying device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6920131B2 (en) |
| KR (1) | KR20190017699A (en) |
| CN (1) | CN109390253A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111540846A (en) * | 2019-05-08 | 2020-08-14 | 广东聚华印刷显示技术有限公司 | Reduced pressure drying device and reduced pressure drying method |
| CN114771111B (en) * | 2022-02-28 | 2024-03-22 | 深圳市华星光电半导体显示技术有限公司 | Vacuum drying device, substrate vacuum drying method and vacuum drying equipment |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5581905A (en) * | 1995-09-18 | 1996-12-10 | Minnesota Mining And Manufacturing Company | Coated substrate drying system |
| JP2003159558A (en) * | 2001-11-27 | 2003-06-03 | Seiko Epson Corp | Coating film drying process and equipment |
| JP2010169308A (en) * | 2009-01-22 | 2010-08-05 | Panasonic Corp | Dryer |
| JP2011240309A (en) * | 2010-05-21 | 2011-12-01 | Panasonic Corp | Drying method and drying apparatus |
| JP2013250000A (en) * | 2012-05-31 | 2013-12-12 | Konica Minolta Inc | Drying device and drying method for coating film |
| JP2014009880A (en) * | 2012-06-29 | 2014-01-20 | Konica Minolta Inc | Drying apparatus and method for coating film |
| JP2014199806A (en) * | 2013-03-14 | 2014-10-23 | 東京エレクトロン株式会社 | Dryer and dry processing method |
| JP2014238194A (en) * | 2013-06-06 | 2014-12-18 | 東京エレクトロン株式会社 | Dryer and drying treatment method |
| JP2015068513A (en) * | 2013-09-27 | 2015-04-13 | 東京エレクトロン株式会社 | Dry device, dry processing method, substrate holder and solvent adsorption sheet |
| WO2017087337A1 (en) * | 2015-11-16 | 2017-05-26 | Kateeva, Inc. | Systems and methods for thermal processing of a substrate |
| JP2018059697A (en) * | 2016-09-30 | 2018-04-12 | 東京エレクトロン株式会社 | Reduced-pressure drying apparatus |
| JP2018204810A (en) * | 2017-05-31 | 2018-12-27 | 東京エレクトロン株式会社 | Vacuum dryer |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10321585A (en) * | 1997-05-22 | 1998-12-04 | Mitsubishi Electric Corp | Drying method and apparatus |
| KR101994874B1 (en) * | 2013-03-14 | 2019-07-01 | 도쿄엘렉트론가부시키가이샤 | Drying apparatus and drying method |
-
2017
- 2017-08-10 JP JP2017155837A patent/JP6920131B2/en active Active
-
2018
- 2018-08-09 CN CN201810901188.5A patent/CN109390253A/en active Pending
- 2018-08-10 KR KR1020180093817A patent/KR20190017699A/en active IP Right Grant
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5581905A (en) * | 1995-09-18 | 1996-12-10 | Minnesota Mining And Manufacturing Company | Coated substrate drying system |
| JP2003159558A (en) * | 2001-11-27 | 2003-06-03 | Seiko Epson Corp | Coating film drying process and equipment |
| JP2010169308A (en) * | 2009-01-22 | 2010-08-05 | Panasonic Corp | Dryer |
| JP2011240309A (en) * | 2010-05-21 | 2011-12-01 | Panasonic Corp | Drying method and drying apparatus |
| JP2013250000A (en) * | 2012-05-31 | 2013-12-12 | Konica Minolta Inc | Drying device and drying method for coating film |
| JP2014009880A (en) * | 2012-06-29 | 2014-01-20 | Konica Minolta Inc | Drying apparatus and method for coating film |
| JP2014199806A (en) * | 2013-03-14 | 2014-10-23 | 東京エレクトロン株式会社 | Dryer and dry processing method |
| JP2014238194A (en) * | 2013-06-06 | 2014-12-18 | 東京エレクトロン株式会社 | Dryer and drying treatment method |
| JP2015068513A (en) * | 2013-09-27 | 2015-04-13 | 東京エレクトロン株式会社 | Dry device, dry processing method, substrate holder and solvent adsorption sheet |
| WO2017087337A1 (en) * | 2015-11-16 | 2017-05-26 | Kateeva, Inc. | Systems and methods for thermal processing of a substrate |
| JP2018059697A (en) * | 2016-09-30 | 2018-04-12 | 東京エレクトロン株式会社 | Reduced-pressure drying apparatus |
| JP2018204810A (en) * | 2017-05-31 | 2018-12-27 | 東京エレクトロン株式会社 | Vacuum dryer |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190017699A (en) | 2019-02-20 |
| CN109390253A (en) | 2019-02-26 |
| JP6920131B2 (en) | 2021-08-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6909617B2 (en) | Decompression drying device | |
| JP6328434B2 (en) | Drying apparatus and drying processing method | |
| KR101994874B1 (en) | Drying apparatus and drying method | |
| JP6391362B2 (en) | Vacuum drying apparatus, substrate processing apparatus, and vacuum drying method | |
| JP6920131B2 (en) | Decompression drying device | |
| CN107878044B (en) | Decompression drying device | |
| JP7316095B2 (en) | Vacuum dryer | |
| JP6886866B2 (en) | Vacuum drying device | |
| JP2006302980A (en) | Reduced pressure drier | |
| JP2005085814A (en) | Device and method for reduced-pressure drying and trapping device | |
| JP2020176746A (en) | Vacuum dryer | |
| JP2021167696A (en) | Reduced pressure drying apparatus and reduced pressure drying method | |
| WO2022234716A1 (en) | Depressurization drying device, depressurization drying method, and method for shortening time required for depressurization drying process | |
| JP2022172679A (en) | Vacuum dryer, vacuum drying method, and method for shortening the time for vacuum drying process | |
| JP2022172691A (en) | Vacuum dryer, vacuum drying method, and method for shortening the time for vacuum drying process | |
| JP2022172684A (en) | Vacuum dryer, vacuum drying method, and method for shortening the time for vacuum drying process | |
| TWI837341B (en) | Reduced pressure drying device | |
| JP2016070515A (en) | Vacuum dryer | |
| JP2022170308A (en) | Vacuum drying device and vacuum drying treatment method | |
| JP2024057845A (en) | Reduced pressure drying apparatus and reduced pressure drying method | |
| KR102391631B1 (en) | Vacuum Dryer | |
| JP5939118B2 (en) | Substrate processing apparatus, substrate processing method, and storage medium | |
| CN114628279A (en) | Observation device, decompression drying device, display method, and storage medium |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20190201 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200513 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20210325 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210406 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210602 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210629 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210726 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6920131 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |