JP2019031613A - Adhesive tape, wire harness, and terminal treatment method for adhesive tape - Google Patents
Adhesive tape, wire harness, and terminal treatment method for adhesive tape Download PDFInfo
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- JP2019031613A JP2019031613A JP2017152956A JP2017152956A JP2019031613A JP 2019031613 A JP2019031613 A JP 2019031613A JP 2017152956 A JP2017152956 A JP 2017152956A JP 2017152956 A JP2017152956 A JP 2017152956A JP 2019031613 A JP2019031613 A JP 2019031613A
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- Prior art keywords
- terminal
- tape
- adhesive tape
- adhesive layer
- core
- Prior art date
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- Granted
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000012790 adhesive layer Substances 0.000 claims abstract description 48
- 239000000463 material Substances 0.000 claims abstract description 35
- 238000005520 cutting process Methods 0.000 claims description 15
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 13
- 238000003672 processing method Methods 0.000 claims description 13
- 239000010410 layer Substances 0.000 claims description 12
- 238000004804 winding Methods 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 4
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000011162 core material Substances 0.000 description 19
- 239000000126 substance Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 238000004049 embossing Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 4
- 239000013256 coordination polymer Substances 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/06—Insulating conductors or cables
- H01B13/08—Insulating conductors or cables by winding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
- H01B13/26—Sheathing; Armouring; Screening; Applying other protective layers by winding, braiding or longitudinal lapping
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/302—Applications of adhesives in processes or use of adhesives in the form of films or foils for bundling cables
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Insulated Conductors (AREA)
Abstract
Description
本発明は、粘着テープ、ワイヤーハーネス及び粘着テープの端末処理方法に関する。 The present invention relates to an adhesive tape, a wire harness, and a terminal processing method for an adhesive tape.
従来、複数の電線などの線状体を束ねたり、電線のジョイント部などを絶縁したりする目的で、電線等に巻き付けられる粘着テープが知られている(例えば特許文献1〜3参照)。粘着テープは、一般に、コアと、コアに対してロール状に巻かれるテープ部とを備えており、テープ部は基材と基材の片面に設けられた粘着層とを備えている。 2. Description of the Related Art Conventionally, an adhesive tape that is wound around an electric wire or the like has been known for the purpose of bundling a linear body such as a plurality of electric wires or insulating a joint portion of an electric wire (for example, see Patent Documents 1 to 3). The adhesive tape generally includes a core and a tape portion wound around the core in a roll shape, and the tape portion includes a base material and an adhesive layer provided on one surface of the base material.
このような粘着テープは、テープ部のうち、ロール状に巻かれて最外周側となる端末部の識別性が高く(見つけ易く)、且つ剥離性が高い(剥がし易い)ことが好ましい。そこで、テープ部の端末部に加工を施す端末処理方法が提案されている(例えば特許文献4参照)。この特許文献4に記載の端末処理方法は、端末部の粘着層にホットメルト型物質を加温塗布し、その後端末部を冷却して粘着層を不活性とするものである。また、特許文献4には、粘着層に粉体を直接噴霧して付着させたり、溶液を塗布して化学変化や揮発性溶剤を揮散させたりして粘着層を不活性とする端末処理方法も提案されている。さらに、特許文献4には、粘着層中の粘着剤を熱や紫外線で化学変化させて粘着層を不活性層とする端末処理方法も提案されている。 In such an adhesive tape, it is preferable that the terminal portion which is wound in a roll shape and becomes the outermost peripheral side in the tape portion has high identification (easy to find) and high peelability (easy to peel). Therefore, a terminal processing method for processing the terminal portion of the tape portion has been proposed (see, for example, Patent Document 4). In the terminal processing method described in Patent Document 4, a hot-melt type material is heated and applied to the adhesive layer of the terminal part, and then the terminal part is cooled to inactivate the adhesive layer. Further, Patent Document 4 also includes a terminal treatment method in which the adhesive layer is inactivated by directly spraying and adhering powder onto the adhesive layer, or by applying a solution to volatilize a chemical change or a volatile solvent. Proposed. Furthermore, Patent Document 4 also proposes a terminal treatment method in which the adhesive in the adhesive layer is chemically changed with heat or ultraviolet rays to make the adhesive layer an inactive layer.
しかし、特許文献4に記載の端末処理方法では、粘着層と異質の物質を用いて粘着層を不活性としていることから、異質の物質が電線等に接触した場合における悪影響(例えば電線被覆部の早期劣化の可能性など)については何ら考慮されていない。 However, in the terminal treatment method described in Patent Document 4, since the adhesive layer is inactive using a substance different from the adhesive layer, an adverse effect when the foreign substance comes into contact with the electric wire or the like (for example, the wire coating portion No consideration is given to the possibility of early deterioration.
本発明はこのような従来の課題を解決するためになされたものであり、その目的とするところは、粘着層と異質の物質を用いることなく端末部の剥離性を高めることが可能な粘着テープ、ワイヤーハーネス及び粘着テープの端末処理方法を提供することにある。 The present invention has been made to solve such a conventional problem, and an object of the present invention is to provide a pressure-sensitive adhesive tape capable of improving the peelability of the terminal portion without using a substance different from the pressure-sensitive adhesive layer. It is providing the terminal processing method of a wire harness and an adhesive tape.
本発明の粘着テープは、コアと、前記コアに対してロール状に巻かれ、基材と前記基材の片面に設けられた粘着層とを有するテープ部と、を備えた粘着テープであって、前記テープ部は、ロール状に巻かれて最外周側となる端末から所定長さまでの領域である端末部の粘着層が、凹凸を有するエンボス構造となっており、前記所定長さを超える領域である非端末部の粘着層が、凹凸を有しない非エンボス構造となっていることを特徴とする。 The pressure-sensitive adhesive tape of the present invention is a pressure-sensitive adhesive tape comprising a core and a tape portion wound around the core in a roll shape and having a base material and a pressure-sensitive adhesive layer provided on one side of the base material. The tape part has an embossed structure in which the adhesive layer of the terminal part, which is an area from the terminal that is wound in a roll shape to the outermost peripheral side to a predetermined length, has an unevenness, and exceeds the predetermined length The non-terminal adhesive layer is a non-embossed structure having no irregularities.
この粘着テープによれば、端末から所定長さまでの領域である端末部の粘着層が凹凸を有するエンボス構造となっており、所定長さを超える領域である非端末部が凹凸を有しない非エンボス構造となっている。このため、端末部においては粘着層のうち凸部が粘着に寄与して凹部が粘着に寄与し難くなり、粘着力を低下させることができる。従って、粘着層と異質の物質を用いることなく端末部の剥離性を高めることができる。 According to this adhesive tape, the adhesive layer of the terminal part, which is an area from the terminal to a predetermined length, has an embossed structure with irregularities, and the non-terminal part, which is an area exceeding the predetermined length, has no irregularities. It has a structure. For this reason, in a terminal part, a convex part contributes to adhesion and a crevice becomes difficult to contribute to adhesion in an adhesion layer, and can reduce adhesive power. Therefore, the peelability of the terminal portion can be enhanced without using a substance different from the adhesive layer.
また、本発明の粘着テープにおいて、前記基材は、前記端末部が凹凸を有するエンボス構造となっており、前記非端末部が凹凸を有しない非エンボス構造となっていることが好ましい。 Moreover, the adhesive tape of this invention WHEREIN: It is preferable that the said base material has the embossing structure in which the said terminal part has an unevenness | corrugation, and the said non-terminal part has a non-embossing structure which does not have an unevenness | corrugation.
この粘着テープによれば、基材についても端末部がエンボス構造となっているため、基材側から視認した場合においても凹凸が確認でき、端末部を見つけ易く、端末部の識別性を向上させることができる。 According to this pressure-sensitive adhesive tape, since the terminal portion has an embossed structure even with respect to the base material, irregularities can be confirmed even when viewed from the base material side, the terminal portion can be easily found, and the terminal portion can be easily identified. be able to.
また、本発明の粘着テープにおいて、前記端末部の粘着層は、その面積に占める凸部の面積が10%以下となっていることが好ましい。 Moreover, the adhesive tape of this invention WHEREIN: It is preferable that the area of the convex part which occupies the area for the adhesive layer of the said terminal part is 10% or less.
この粘着テープによれば、端末部は、その面積に占める凸部の面積が10%以下となっているため端末部全域の粘着層を不活性とした場合と同等の剥離性を発揮することができる。 According to this adhesive tape, since the area of the convex portion occupying the area of the terminal portion is 10% or less, the terminal portion can exhibit the same peelability as when the adhesive layer in the entire terminal portion is made inactive. it can.
また、本発明のワイヤーハーネスは、電線と、前記電線の周囲に巻き回される上記のいずれか1つに記載の粘着テープの前記テープ部と、を備えることを特徴とする。 Moreover, the wire harness of this invention is equipped with an electric wire and the said tape part of the adhesive tape as described in any one of the above which is wound around the said electric wire, It is characterized by the above-mentioned.
このワイヤーハーネスによれば、電線と、電線の周囲に巻き回される上記の粘着テープのテープ部とを備えるため、剥離性を向上させた粘着テープを用いてワイヤーハーネスが製造されることとなり、製造時間の短縮化を図り、コストの低減につなげることができる。 According to this wire harness, since the wire harness is provided with the tape portion of the above-mentioned adhesive tape wound around the wire, the wire harness is manufactured using the adhesive tape with improved peelability, The manufacturing time can be shortened and the cost can be reduced.
また、本発明の粘着テープの端末処理方法は、コアと、前記コアに対してロール状に巻かれ、基材と前記基材の片面に設けられた粘着層とを有するテープ部とを備えた粘着テープの端末処理方法であって、前記コアに前記テープ部を巻き取る巻取工程と、前記巻取工程により前記コアに所定長巻き取られた前記テープ部に対して、カッターを動作させて前記テープ部を切断する切断工程と、前記切断工程における前記カッターの動作に連動させて、凹凸を有した金型を動作させることにより、前記テープ部のうち前記カッターによる切断部から所定長さまでの領域である端末部を、凹凸を有するエンボス構造に処理する端末処理工程と、を有することを特徴とする。 Moreover, the terminal processing method of the adhesive tape of this invention was equipped with the tape part which has a core and the adhesive layer provided in the single-sided surface of the said base material wound by roll shape with respect to the said core. A terminal treatment method for an adhesive tape, wherein a winding step for winding the tape portion around the core, and a cutter is operated on the tape portion wound around the core for a predetermined length by the winding step. The cutting step of cutting the tape portion, and in conjunction with the operation of the cutter in the cutting step, by operating a mold having irregularities, from the cutting portion by the cutter of the tape portion to a predetermined length And a terminal processing step of processing the terminal portion, which is a region, into an embossed structure having irregularities.
この粘着テープの端末処理方法によれば、カッターの動作に連動させて凹凸を有した金型を動作させ端末部をエンボス構造に処理するため、粘着テープを切断する際に形成される端末部に対して、切断と同時に端末処理を行うことができる。よって、粘着テープを製造する際に、粘着層と異質の物質を用いることなく剥離性を高めた端末部を形成することができる。 According to this terminal processing method of the adhesive tape, in order to process the terminal part into an embossed structure by operating a mold having irregularities in conjunction with the operation of the cutter, the terminal part formed when cutting the adhesive tape On the other hand, terminal processing can be performed simultaneously with disconnection. Therefore, when manufacturing an adhesive tape, the terminal part which improved peelability can be formed, without using a substance different from an adhesive layer.
本発明によれば、粘着層と異質の物質を用いることなく、且つ剥がし易くすることが可能な粘着テープ、ワイヤーハーネス及び粘着テープの端末処理方法を提供することができる。 ADVANTAGE OF THE INVENTION According to this invention, the adhesive tape, the wire harness, and the terminal processing method of an adhesive tape which can be made easy to peel without using a substance different from an adhesive layer can be provided.
以下、本発明を好適な実施形態に沿って説明する。なお、本発明は以下に示す実施形態に限られるものではなく、本発明の趣旨を逸脱しない範囲において適宜変更可能である。また、以下に示す実施形態においては、一部構成の図示や説明を省略している箇所があるが、省略された技術の詳細については、以下に説明する内容と矛盾点が発生しない範囲内において、適宜公知又は周知の技術が適用されていることは言うまでもない。 Hereinafter, the present invention will be described according to preferred embodiments. Note that the present invention is not limited to the embodiments described below, and can be appropriately changed without departing from the spirit of the present invention. Further, in the embodiment described below, there is a part where illustration or description of a part of the configuration is omitted, but details of the omitted technology are within a range in which there is no contradiction with the contents described below. Needless to say, a known or well-known technique is appropriately applied.
図1は、本発明の実施形態に係る粘着テープのテープ部を含むワイヤーハーネスの斜視図である。ワイヤーハーネスWHは、例えば複数の電線Wと、後述の粘着テープ(図2の符号1参照)のテープ部20とを備えており、複数の電線Wをテープ部20によって束ねた構造となっている。テープ部20は、後述する粘着層(図3の符号22参照)を有しており、粘着層の粘着力を利用して複数の電線Wを束ねたまま保持している。 FIG. 1 is a perspective view of a wire harness including a tape portion of an adhesive tape according to an embodiment of the present invention. The wire harness WH includes, for example, a plurality of electric wires W and a tape portion 20 of an adhesive tape (see reference numeral 1 in FIG. 2) described later, and has a structure in which the plurality of electric wires W are bundled by the tape portion 20. . The tape part 20 has the adhesion layer (refer code | symbol 22 of FIG. 3) mentioned later, and is holding | maintaining the some electric wire W bundled using the adhesive force of an adhesion layer.
図2は、本発明の実施形態に係る粘着テープを示す側面図であり、図3は、図2に示した粘着テープの一部拡大断面図である。なお、図2においては、粘着テープを端末側から一部剥離した状態を示している。 FIG. 2 is a side view showing the adhesive tape according to the embodiment of the present invention, and FIG. 3 is a partially enlarged sectional view of the adhesive tape shown in FIG. In addition, in FIG. 2, the state which peeled partially the adhesive tape from the terminal side is shown.
図2に示すように、粘着テープ1は、コア10と、コア10にロール状に巻かれるテープ部20とを備えている。コア10は、テープ部20を巻き取るための芯材である。テープ部20は、図3に示すように、基材21と、基材21の片面に設けられた粘着層22とを有してる。テープ部20は、粘着層22が内側となり基材21が外側となるように、コア10に巻き取られている。 As shown in FIG. 2, the adhesive tape 1 includes a core 10 and a tape portion 20 wound around the core 10 in a roll shape. The core 10 is a core material for winding the tape portion 20. As shown in FIG. 3, the tape unit 20 includes a base material 21 and an adhesive layer 22 provided on one side of the base material 21. The tape portion 20 is wound around the core 10 so that the adhesive layer 22 is on the inside and the base material 21 is on the outside.
さらに、本実施形態においてテープ部20は端末部EPに所定の加工が施されている。端末部EPは、ロール状に巻かれて最外周となる端末Eから所定長さまでの領域をいう。一方、非端末部NEPは、端末Eから所定長さを超える領域をいう。本実施形態において端末部EPは、粘着層22が凹凸を有するエンボス構造となっている。例えば図3に示すように、非端末部NEPの粘着層22の表面を基準面S1とした場合、端末部EPは、基準面S1から押し込まれるように形成された凹部22aが長手方向に断続的に形成されている。一方、非端末部NEPは、粘着層22が凹凸を有しない非エンボス構造となっている。なお、図3に示す例において所定長さは、端末Eから、凹部22aのうち最も端末Eから離れた部位P1までの長さである。 Further, in the present embodiment, the tape unit 20 has a predetermined process applied to the terminal unit EP. The terminal portion EP is an area from the terminal E that is wound in a roll shape and becomes the outermost periphery to a predetermined length. On the other hand, the non-terminal portion NEP refers to an area exceeding a predetermined length from the terminal E. In the present embodiment, the terminal portion EP has an embossed structure in which the adhesive layer 22 has irregularities. For example, as shown in FIG. 3, when the surface of the adhesive layer 22 of the non-terminal portion NEP is the reference surface S1, the terminal portion EP has a recess 22a formed so as to be pushed from the reference surface S1 in the longitudinal direction. Is formed. On the other hand, the non-terminal portion NEP has a non-embossed structure in which the adhesive layer 22 does not have irregularities. In the example shown in FIG. 3, the predetermined length is the length from the terminal E to the part P1 farthest from the terminal E in the recess 22a.
このように、本実施形態においてテープ部20の端末部EPは、粘着層22に断続的に複数の凹部22aが形成されるため、凹部22aが1周内側の基材21に接触し難くなる。すなわち、端末部EPにおいては凹部22aが粘着に寄与し難くなり凸部22bが粘着に寄与することから、端末部EPの剥離性を高めることができる。しかも、端末部EPの粘着層22を基準面S1から押し込んで凹部22aを形成するだけで剥離性を高めることができるため、粘着層22にホットメルト型物質等の異質の物質を用いる必要がなくなる。一方、非端末部NEPについては、エンボス構造となっていないことから、端末部EP以外の部位における粘着力を維持することができる。 Thus, in this embodiment, since the some recessed part 22a is intermittently formed in the adhesion layer 22, as for the terminal part EP of the tape part 20, the recessed part 22a becomes difficult to contact the base material 21 inside 1 circumference. That is, in the terminal part EP, since the recessed part 22a becomes difficult to contribute to adhesion | attachment and the convex part 22b contributes to adhesion | attachment, the peelability of the terminal part EP can be improved. Moreover, since the peelability can be improved simply by pressing the adhesive layer 22 of the terminal portion EP from the reference plane S1 to form the recess 22a, it is not necessary to use a foreign substance such as a hot-melt type material for the adhesive layer 22. . On the other hand, since the non-terminal portion NEP does not have an embossed structure, it is possible to maintain the adhesive force in a portion other than the terminal portion EP.
なお、図3に示す例において凹部22aは、テープ部20の幅方向に連続する溝として形成されているが、特にこれに限られるものではない。例えば凹部22aは、テープ部20を平面視して千鳥状や市松模様状に形成されていてもよいし、テープ部20の長手方向に連続する溝として形成されていてもよい。 In addition, in the example shown in FIG. 3, although the recessed part 22a is formed as a groove | channel continuous in the width direction of the tape part 20, it is not restricted to this in particular. For example, the recess 22 a may be formed in a zigzag or checkered pattern when the tape unit 20 is viewed in plan, or may be formed as a groove continuous in the longitudinal direction of the tape unit 20.
加えて、端末部EPは、粘着層22に凹凸を有するだけでなく、基材21側にも凹凸を有している。本実施形態において基材21は、端末部EPにおいて基準面S2から突出する突出部Pを有している。具体的に説明すると、基材21は、端末部EPにおいて、粘着層22の凹部22aに対応する部位が基準面S2から突出する凸部21aとなっている。一方、基材21は、凸部22bに対応する部位が基準面S2から突出しない凹部21bとなっている。これにより、端末部EPの基材21側に、断続的に突出する部位が形成されるため、端末部EPの識別性が向上することとなる。なお、基材21は、非端末部NEPにおいて粘着層22と同様に非エンボス構造となっている。 In addition, the terminal portion EP has not only irregularities on the adhesive layer 22 but also irregularities on the substrate 21 side. In this embodiment, the base material 21 has the protrusion part P which protrudes from the reference plane S2 in the terminal part EP. If demonstrating it concretely, the base material 21 will become the convex part 21a which the site | part corresponding to the recessed part 22a of the adhesion layer 22 protrudes from the reference plane S2 in the terminal part EP. On the other hand, the base material 21 is a concave portion 21b in which a portion corresponding to the convex portion 22b does not protrude from the reference surface S2. Thereby, since the site | part which protrudes intermittently in the base-material 21 side of the terminal part EP is formed, the discriminability of the terminal part EP will improve. The base material 21 has a non-embossed structure similar to the adhesive layer 22 in the non-terminal portion NEP.
次に、本実施形態に係る粘着テープ1の端末処理方法を説明する。図4は、本実施形態に係る粘着テープ1の端末処理方法を示す図である。 Next, the terminal processing method of the adhesive tape 1 which concerns on this embodiment is demonstrated. FIG. 4 is a diagram illustrating a terminal processing method for the adhesive tape 1 according to the present embodiment.
図4に示すように、本実施形態においては、コア10によってテープ部20が巻き取られるようになっている(巻取工程)。コア10は、複数のタッチロール30によって巻取済みのテープ部20と共に回転させられて、供給されるテープ部20を巻き取る。 As shown in FIG. 4, in this embodiment, the tape part 20 is wound up by the core 10 (winding process). The core 10 is rotated together with the tape part 20 that has been wound by a plurality of touch rolls 30 to wind the tape part 20 that is supplied.
コア10によってテープ部20が所定長巻き取られたとすると、テープ部20に対してカッター40を動作させてテープ部20を切断する(切断工程)。さらに、このカッター40の動作に連動して、凹凸を有したエンボス金型50についても動作させる(端末処理工程)。これにより、テープ部20のうちカッター40による切断部CP(すなわち端末E)から所定長さまでの領域である端末部EPを、エンボス構造に処理する。 If the tape part 20 is wound by the core 10 for a predetermined length, the tape part 20 is cut by operating the cutter 40 with respect to the tape part 20 (cutting step). Further, in conjunction with the operation of the cutter 40, the embossing mold 50 having irregularities is also operated (terminal processing step). Thereby, terminal part EP which is a field from cutting part CP (namely, terminal E) by cutter 40 to predetermined length among tape parts 20 is processed into embossed structure.
よって、本実施形態では、粘着テープ1を切断する際に形成される端末部EPに対して、切断と同時に端末処理を行うことができる。 Therefore, in this embodiment, terminal processing can be performed simultaneously with cutting | disconnection with respect to the terminal part EP formed when cut | disconnecting the adhesive tape 1. FIG.
なお、カッター40により切断されたテープ部20のうちエンボス処理されない側には、次の粘着テープ1を製造するためのコア10’が準備されており、端末処理工程の後には、次のコア10’が複数のタッチロール30にセットされる。 A core 10 ′ for manufacturing the next adhesive tape 1 is prepared on the side of the tape part 20 cut by the cutter 40 that is not embossed, and the next core 10 is prepared after the terminal processing step. 'Is set on the plurality of touch rolls 30.
次に、実施例及び比較例を説明する。実施例1〜10及び比較例1,2に示す粘着テープには、基材として塩化ビニルフィルムを用い、粘着層としてゴム系の粘着剤を用いた。 Next, examples and comparative examples will be described. In the adhesive tapes shown in Examples 1 to 10 and Comparative Examples 1 and 2, a vinyl chloride film was used as the base material, and a rubber-based adhesive was used as the adhesive layer.
実施例1〜10については、図4に示す端末処理方法にて端末処理した粘着テープを製造した。この際、端末部となる端末からの所定長さを10mmとし、端末から19mm(すなわち非端末部が9mm)を試料とした。なお、エンボス金型については、実施例1〜10でそれぞれ異なるものを用いて、端末部における粘着接触面積の割合(図3においては端末部EPの面積に対する凸部22bの面積)を変化させた。 About Examples 1-10, the adhesive tape terminal-processed with the terminal processing method shown in FIG. 4 was manufactured. At this time, a predetermined length from the terminal serving as the terminal portion was 10 mm, and 19 mm from the terminal (that is, the non-terminal portion was 9 mm) was used as a sample. In addition, about the embossing metal mold, different ones in Examples 1 to 10 were used, and the ratio of the adhesive contact area in the terminal portion (in FIG. 3, the area of the convex portion 22b relative to the area of the terminal portion EP) was changed. .
比較例1については、図4に示す端末処理構成からエンボス金型を除き、端末処理を行うことなく粘着テープを得た。この粘着テープのうち、端末から19mmを試料とした。なお、比較例1においては端末処理を行っていないことから、端末部における粘着接触面積の割合は100%となる。 For Comparative Example 1, an embossing mold was removed from the terminal processing configuration shown in FIG. 4, and an adhesive tape was obtained without performing terminal processing. Of this adhesive tape, 19 mm from the end was used as a sample. In addition, since the terminal process is not performed in the comparative example 1, the ratio of the adhesion contact area in a terminal part will be 100%.
比較例2については、粘着テープの端末から10mmの部分に有色のPP(polypropylene)フィルムを貼り付けたものを採用し、端末から19mmを試料とした。なお、比較例2においては端末から10mmの部分がPPフィルムで覆われることから、端末部における粘着接触面積の割合は0%となる。 About the comparative example 2, what stuck the colored PP (polypropylene) film in the part 10mm from the terminal of the adhesive tape was employ | adopted, and 19 mm from the terminal was made into the sample. In Comparative Example 2, since the portion 10 mm from the terminal is covered with the PP film, the ratio of the adhesive contact area in the terminal part is 0%.
以上のような、実施例1〜10及び比較例1,2に係る粘着テープに対して、剥離性及び識別性を評価した。 With respect to the adhesive tapes according to Examples 1 to 10 and Comparative Examples 1 and 2 as described above, the peelability and the distinguishability were evaluated.
剥離性については、10個の粘着テープの端末部を剥がすまでに要する時間を測定し、60秒以上掛かった場合を「1」とし、45秒以上60秒未満掛かった場合を「2」とし、30秒以上45秒未満掛かった場合を「3」とし、15秒以上30秒未満掛かった場合を「4」とし、15秒未満しか掛からなかった場合を「5」とした。 For peelability, measure the time required to peel off the terminal portions of the ten adhesive tapes, and if it takes 60 seconds or more, it is “1”, and if it takes 45 seconds or more but less than 60 seconds, it is “2”. The case where it took 30 seconds or more and less than 45 seconds was set as “3”, the case where it took 15 seconds or more and less than 30 seconds was set as “4”, and the case where it took less than 15 seconds was set as “5”.
識別性については、10個の粘着テープの端末部を見つけるまでに要する時間を測定し、30秒以上掛かった場合を「1」とし、25秒以上30秒未満掛かった場合を「2」とし、20秒以上25秒未満掛かった場合を「3」とし、15秒以上20秒未満掛かった場合を「4」とし、15秒未満しか掛からなかった場合を「5」とした。 For discriminability, measure the time required to find the terminal part of 10 adhesive tapes, and if it takes 30 seconds or more, it is “1”, if it takes 25 seconds or more and less than 30 seconds, it is “2”. The case where it took 20 seconds or more and less than 25 seconds was set as “3”, the case where it took 15 seconds or more and less than 20 seconds was set as “4”, and the case where it took less than 15 seconds was set as “5”.
剥離性及び識別性の結果を表1に示す。
表1に示すように、実施例1〜10の全てにおいて剥離性及び識別性が向上していることがわかった。さらに、実施例9,10に示すように、粘着接触面積の割合が10%以下となると、有色のPPフィルムを貼り付けた場合(すなわち粘着接触面積の割合が0%)と同等の剥離性及び識別性を達成できることがわかった。 As shown in Table 1, it was found that peelability and discriminability were improved in all of Examples 1 to 10. Furthermore, as shown in Examples 9 and 10, when the ratio of the adhesive contact area is 10% or less, the peelability equivalent to that when a colored PP film is attached (that is, the ratio of the adhesive contact area is 0%) and It was found that discrimination could be achieved.
このようにして、本実施形態に係る粘着テープ1によれば、端末Eから所定長さまでの領域である端末部EPの粘着層22が凹凸を有するエンボス構造となっており、所定長さを超える領域である非端末部NEPが凹凸を有しない非エンボス構造となっている。このため、端末部EPにおいては粘着層22のうち凸部22bが粘着に寄与して凹部22aが粘着に寄与し難くなり、粘着力を低下させることができる。従って、粘着層22と異質の物質を用いることなく端末部EPの剥離性を高めることができる。 Thus, according to the adhesive tape 1 which concerns on this embodiment, the adhesive layer 22 of the terminal part EP which is an area | region from the terminal E to predetermined length becomes the embossed structure which has an unevenness | corrugation, and exceeds predetermined length The non-terminal portion NEP which is a region has a non-embossed structure having no unevenness. For this reason, in terminal part EP, convex part 22b contributes to adhesion, and crevice 22a becomes difficult to contribute to adhesion in adhesion layer 22, and can reduce adhesive power. Therefore, the peelability of the terminal portion EP can be improved without using a substance different from the adhesive layer 22.
また、基材21についても端末部EPがエンボス構造となっているため、基材21側から視認した場合においても凹凸が確認でき、端末部EPを見つけ易く、端末部EPの識別性を向上させることができる。 Moreover, since the terminal part EP also has an embossed structure with respect to the base material 21, irregularities can be confirmed even when viewed from the base material 21 side, the terminal part EP can be easily found, and the terminal part EP is improved in distinguishability. be able to.
また、端末部EPは、その面積に占める凸部22bの面積が10%以下となっているため端末部EP全域の粘着層22を不活性とした場合と同等の剥離性を発揮することができる。 Moreover, since the area of the convex part 22b occupying the area of the terminal part EP is 10% or less, the terminal part EP can exhibit the peelability equivalent to the case where the adhesive layer 22 in the entire terminal part EP is made inactive. .
また、本実施形態に係るワイヤーハーネスWHによれば、電線Wと、電線Wの周囲に巻き回される粘着テープ1のテープ部20とを備えるため、剥離性を向上させた粘着テープ1を用いてワイヤーハーネスWHが製造されることとなり、製造時間の短縮化を図り、コストの低減につなげることができる。 Moreover, according to the wire harness WH which concerns on this embodiment, in order to provide the electric wire W and the tape part 20 of the adhesive tape 1 wound around the electric wire W, the adhesive tape 1 which improved peelability is used. Thus, the wire harness WH is manufactured, and the manufacturing time can be shortened and the cost can be reduced.
また、本実施形態に係る粘着テープ1の端末処理方法によれば、カッター40の動作に連動させて凹凸を有したエンボス金型50を動作させ端末部EPをエンボス構造に処理するため、粘着テープ1を切断する際に形成される端末部EPに対して、切断と同時に端末処理を行うことができる。よって、粘着テープ1を製造する際に、粘着層22と異質の物質を用いることなく剥離性を高めた端末部EPを形成することができる。 Moreover, according to the terminal processing method of the adhesive tape 1 which concerns on this embodiment, in order to process the terminal part EP to an emboss structure by operating the embossing metal mold | die 50 which has an unevenness | corrugation in response to the operation | movement of the cutter 40, an adhesive tape Terminal processing can be performed simultaneously with the cutting on the terminal portion EP formed when cutting 1. Therefore, when manufacturing the adhesive tape 1, the terminal part EP which improved peelability can be formed, without using a different substance from the adhesive layer 22. FIG.
以上、実施形態に基づき本発明を説明したが、本発明は上記実施形態に限られるものではなく、本発明の趣旨を逸脱しない範囲で、変更を加えてもよい。 As described above, the present invention has been described based on the embodiment, but the present invention is not limited to the above embodiment, and may be modified without departing from the gist of the present invention.
例えば、本実施形態において粘着テープ1は、粘着層22に凹部22aを有すると共に、基材21に突出部Pを有しているが、これに限らず、粘着層22に凹部22aを有するのみであってもよい。 For example, in this embodiment, the pressure-sensitive adhesive tape 1 has the concave portion 22a in the pressure-sensitive adhesive layer 22 and has the protruding portion P in the base material 21. However, the present invention is not limited to this. There may be.
また、本実施形態に係る粘着テープ1において凹部22aが断続的に複数設けられているが、これに限らず、1つだけ設けられていてもよい。さらに、テープ部20の端末Eは凸部22bとなっているが、凹部22aであってもよい。なお、凸部22bである方が、テープ部20の端末Eからゴミ等が付着し難くなるため、好ましいといえる。 Moreover, in the adhesive tape 1 which concerns on this embodiment, although the recessed part 22a is intermittently provided with two or more, not only this but only one may be provided. Furthermore, although the terminal E of the tape part 20 is the convex part 22b, the concave part 22a may be sufficient. In addition, it can be said that the convex portion 22b is preferable because dust or the like hardly adheres from the terminal E of the tape portion 20.
加えて、本実施形態において端末部EPは、粘着層22が基材21側へ押し込まれて凹部22aが形成されている。すなわち、凸部22bが基準面S1と面一となっている。しかし、これに限らず、基材21が粘着層22側に押し込まれて粘着層22に基準面S1から飛び出す凸部22bが形成されてもよい。加えて、凸部22bが基準面S1よりも突出し、凹部22aが基準面S1より凹む構造であってもよい。基材21についても基準面S2に対して同様である。 In addition, in this embodiment, the terminal portion EP has a concave portion 22a formed by pressing the adhesive layer 22 toward the base material 21 side. That is, the convex portion 22b is flush with the reference plane S1. However, the present invention is not limited to this, and a convex portion 22b that protrudes from the reference surface S1 may be formed in the adhesive layer 22 by the base material 21 being pushed into the adhesive layer 22 side. In addition, the protrusion 22b may protrude from the reference surface S1, and the recess 22a may be recessed from the reference surface S1. The same applies to the base 21 with respect to the reference plane S2.
また、本実施形態において粘着層22の凹部22aと基材21の凸部21bとは位置が対応している。さらに、粘着層22の凸部22bと基材21の凹部21aとは位置が対応している。しかし、これに限らず、非対応であってもよい。 In the present embodiment, the positions of the concave portions 22a of the adhesive layer 22 and the convex portions 21b of the substrate 21 correspond to each other. Furthermore, the positions of the convex portions 22b of the adhesive layer 22 and the concave portions 21a of the base material 21 correspond to each other. However, the present invention is not limited to this and may be non-compliant.
さらに、基材21や粘着層22は、エンボス金型50によってエンボス構造とされる場合に限らず、例えば、基材21や粘着層22がその厚みの範囲内で一部が削り取られてエンボス構造とされてもよい。さらに、粘着層22上に同一物質が部分的に積層されてエンボス構造とされてもよい。 Furthermore, the base material 21 and the adhesive layer 22 are not limited to the embossed structure formed by the embossing mold 50. For example, the base material 21 and the adhesive layer 22 are partially scraped within the thickness range to provide an embossed structure. It may be said. Furthermore, the same substance may be partially laminated on the adhesive layer 22 to form an embossed structure.
1 :粘着テープ
10 :コア
20 :テープ部
21 :基材
21a :凸部
21b :凹部
22 :粘着層
22a :凹部
40 :カッター
50 :エンボス金型(金型)
CP :切断部
E :端末
EP :端末部
NEP :非端末部
W :電線
WH :ワイヤーハーネス
1: Adhesive tape 10: Core 20: Tape part 21: Base material 21a: Convex part 21b: Concave part 22: Adhesive layer 22a: Concave part 40: Cutter 50: Embossing die (die)
CP: cutting part E: terminal EP: terminal part NEP: non-terminal part W: electric wire WH: wire harness
Claims (5)
前記テープ部は、ロール状に巻かれて最外周側となる端末から所定長さまでの領域である端末部の粘着層が、凹凸を有するエンボス構造となっており、前記所定長さを超える領域である非端末部の粘着層が、凹凸を有しない非エンボス構造となっている
ことを特徴とする粘着テープ。 An adhesive tape comprising a core and a tape portion wound in a roll shape with respect to the core, and having a base material and an adhesive layer provided on one side of the base material,
The tape part has an embossed structure in which the adhesive layer of the terminal part, which is an area from the terminal that is wound in a roll shape to the outermost peripheral side to a predetermined length, has an unevenness, and in an area that exceeds the predetermined length A pressure-sensitive adhesive tape characterized in that a non-end portion of the pressure-sensitive adhesive layer has a non-embossed structure having no irregularities.
ことを特徴とする請求項1に記載の粘着テープ。 The pressure-sensitive adhesive tape according to claim 1, wherein the base material has an embossed structure in which the terminal portion has unevenness, and the non-terminal portion has a non-embossed structure in which unevenness does not exist.
ことを特徴とする請求項1又は請求項2に記載の粘着テープ。 The pressure-sensitive adhesive tape according to claim 1 or 2, wherein the pressure-sensitive adhesive layer of the terminal portion has an area of a convex portion occupying the area of 10% or less.
前記電線の周囲に巻き回される請求項1から請求項3のいずれか1項に記載の粘着テープの前記テープ部と、
を備えることを特徴とするワイヤーハーネス。 Electric wires,
The said tape part of the adhesive tape of any one of Claims 1-3 wound around the said electric wire,
A wire harness comprising:
前記コアに前記テープ部を巻き取る巻取工程と、
前記巻取工程により前記コアに所定長巻き取られた前記テープ部に対して、カッターを動作させて前記テープ部を切断する切断工程と、
前記切断工程における前記カッターの動作に連動させて、凹凸を有した金型を動作させることにより、前記テープ部のうち前記カッターによる切断部から所定長さまでの領域である端末部を、凹凸を有するエンボス構造に処理する端末処理工程と、
を有することを特徴とする粘着テープの端末処理方法。 A terminal treatment method for an adhesive tape comprising a core and a tape portion wound in a roll shape with respect to the core and having a base material and an adhesive layer provided on one side of the base material,
A winding step of winding the tape portion around the core;
A cutting step of cutting the tape portion by operating a cutter on the tape portion wound on the core by a predetermined length by the winding step;
By interlocking with the operation of the cutter in the cutting step, by operating a die having irregularities, the terminal portion that is an area from the cutting portion by the cutter to a predetermined length in the tape portion has irregularities. A terminal processing step for processing the embossed structure;
The terminal processing method of the adhesive tape characterized by having.
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JP2017152956A JP6890063B2 (en) | 2017-08-08 | 2017-08-08 | Adhesive tape, wire harness and terminal treatment method for adhesive tape |
CN201810893184.7A CN109385221B (en) | 2017-08-08 | 2018-08-07 | Adhesive tape, wire harness, and method for treating end of adhesive tape |
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JP2017152956A JP6890063B2 (en) | 2017-08-08 | 2017-08-08 | Adhesive tape, wire harness and terminal treatment method for adhesive tape |
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JP6890063B2 JP6890063B2 (en) | 2021-06-18 |
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Citations (8)
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JPS57167744U (en) * | 1981-04-14 | 1982-10-22 | ||
JPS59157672U (en) * | 1983-04-07 | 1984-10-23 | 日東電工株式会社 | Rolled adhesive tape for cleaners |
JPS60113347U (en) * | 1984-01-09 | 1985-07-31 | 織田 義男 | rolled adhesive tape |
JP2001270649A (en) * | 2000-03-27 | 2001-10-02 | Kamoi Kakoshi Kk | End treatment method and device for adhesive tape |
JP2001279198A (en) * | 2000-01-28 | 2001-10-10 | Nitto Denko Hoso System Kk | Pressure sensitive adhesive tape |
US20020119292A1 (en) * | 2000-12-22 | 2002-08-29 | Sriram Venkatasanthanam | Three-dimensional flexible adhesive film structures |
JP2008303023A (en) * | 2007-06-07 | 2008-12-18 | Junpei Suzuki | Cutting tool having mechanism for folding fore end of adhesive tape and capable of easily peeling the tape after the use |
JP2013107969A (en) * | 2011-11-18 | 2013-06-06 | Sumiron:Kk | Wheel protective adhesive film laminate |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN200974721Y (en) * | 2006-11-06 | 2007-11-14 | 张基财 | Adhesive tape bench |
WO2013122224A1 (en) * | 2012-02-16 | 2013-08-22 | 矢崎総業株式会社 | Sheet for wire harness, wire harness, and production method for wire harness |
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2017
- 2017-08-08 JP JP2017152956A patent/JP6890063B2/en active Active
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2018
- 2018-08-07 CN CN201810893184.7A patent/CN109385221B/en active Active
Patent Citations (8)
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JPS57167744U (en) * | 1981-04-14 | 1982-10-22 | ||
JPS59157672U (en) * | 1983-04-07 | 1984-10-23 | 日東電工株式会社 | Rolled adhesive tape for cleaners |
JPS60113347U (en) * | 1984-01-09 | 1985-07-31 | 織田 義男 | rolled adhesive tape |
JP2001279198A (en) * | 2000-01-28 | 2001-10-10 | Nitto Denko Hoso System Kk | Pressure sensitive adhesive tape |
JP2001270649A (en) * | 2000-03-27 | 2001-10-02 | Kamoi Kakoshi Kk | End treatment method and device for adhesive tape |
US20020119292A1 (en) * | 2000-12-22 | 2002-08-29 | Sriram Venkatasanthanam | Three-dimensional flexible adhesive film structures |
JP2008303023A (en) * | 2007-06-07 | 2008-12-18 | Junpei Suzuki | Cutting tool having mechanism for folding fore end of adhesive tape and capable of easily peeling the tape after the use |
JP2013107969A (en) * | 2011-11-18 | 2013-06-06 | Sumiron:Kk | Wheel protective adhesive film laminate |
Also Published As
Publication number | Publication date |
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JP6890063B2 (en) | 2021-06-18 |
CN109385221A (en) | 2019-02-26 |
CN109385221B (en) | 2021-04-16 |
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