JP2019025914A - シート材、メタルメッシュ、及びそれらの製造方法 - Google Patents
シート材、メタルメッシュ、及びそれらの製造方法 Download PDFInfo
- Publication number
- JP2019025914A JP2019025914A JP2018138552A JP2018138552A JP2019025914A JP 2019025914 A JP2019025914 A JP 2019025914A JP 2018138552 A JP2018138552 A JP 2018138552A JP 2018138552 A JP2018138552 A JP 2018138552A JP 2019025914 A JP2019025914 A JP 2019025914A
- Authority
- JP
- Japan
- Prior art keywords
- plating film
- electroless plating
- resin layer
- main surface
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- 239000002184 metal Substances 0.000 title claims description 65
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- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C23C18/1601—Process or apparatus
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- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
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- C23C18/1689—After-treatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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Abstract
【解決手段】本発明に係るシート材1は、バインダー2及びポリピロール粒子3を含む樹脂層4と、樹脂層4の一方の主面4a側に設けられ、第1の無電解めっき膜5及び第2の無電解めっき膜6を有する無電解めっき膜7と、樹脂層4の他方の主面4b側に設けられた透明基材8と、を備える。ポリピロール粒子3の少なくとも一部は、樹脂層4の一方の主面4aから露出する露出面3aを有し、露出面3aは、樹脂層4の一方の主面4a上に散在している。第1の無電解めっき膜5は、ポリピロール粒子3のそれぞれの露出面3aを囲むように樹脂層4の一方の主面4a上に設けられている。第2の無電解めっき膜6は、第1の無電解めっき膜5を覆うように設けられ、第2の無電解めっき膜6の一方の主面6aは、第1の無電解めっき膜5に対応する凹部6rを備える。
【選択図】図1
Description
図1は、シート材の一実施形態を示す模式断面図である。図1に示すように、本実施形態に係るシート材1は、バインダー2及び複数のポリピロール粒子3を含む樹脂層4と、樹脂層4の一方の主面4a側に設けられ、第1の無電解めっき膜5及び第2の無電解めっき膜6を有する無電解めっき膜7と、樹脂層4の他方の主面4b側に設けられた透明基材8とを備えている。複数のポリピロール粒子3の少なくとも一部は、樹脂層4の一方の主面4aから露出する露出面3aを有し、複数の露出面3aは、樹脂層4の一方の主面4a上に散在している。第1の無電解めっき膜5は、複数のポリピロール粒子3の複数の露出面3aのそれぞれを囲むように樹脂層4の一方の主面4a上に設けられており、第2の無電解めっき膜6は、第1の無電解めっき膜5を覆うように設けられ、第2の無電解めっき膜6の第1の無電解めっき膜5側の主面6aが、第1の無電解めっき膜5の表面に沿う凹部6rを形成している。
本実施形態に係る第1のメタルメッシュは、バインダー及び複数のポリピロール粒子を含む樹脂層と、樹脂層の一方の主面側にメッシュ状のパターンを形成するように設けられ、第1の無電解めっき膜及び第2の無電解めっき膜を有する無電解めっき膜と、樹脂層の他方の主面側に設けられた透明基材と、を備え、複数のポリピロール粒子の少なくとも一部が、樹脂層の一方の主面から露出する露出面を有し、複数の露出面が、樹脂層の一方の主面上に散在しており、第1の無電解めっき膜が、複数のポリピロール粒子の露出面のそれぞれを囲むように樹脂層の一方の主面上に設けられており、第2の無電解めっき膜が、第1の無電解めっき膜を覆うように設けられ、第2の無電解めっき膜の第1の無電解めっき膜側の主面が、第1の無電解めっき膜の表面に沿う凹部を形成している。
本実施形態に係る第2のメタルメッシュは、透明基材と、透明基材上にメッシュ状のパターンを形成するように設けられ、バインダー及び複数のポリピロール粒子を含む樹脂層と、樹脂層を覆いながら樹脂層のメッシュ状のパターンに沿って透明基材上に設けられ、第1の無電解めっき膜及び第2の無電解めっき膜を有する無電解めっき膜と、を備え、複数のポリピロール粒子の少なくとも一部が、樹脂層の表面から露出する露出面を有し、複数の露出面が、樹脂層の表面上に散在しており、第1の無電解めっき膜が、ポリピロール粒子の複数の露出面のそれぞれを囲むように樹脂層の表面上に設けられており、第2の無電解めっき膜が、第1の無電解めっき膜を覆うように設けられ、第2の無電解めっき膜の第1の無電解めっき膜側の主面が、第1の無電解めっき膜の表面に沿う凹部を形成している。
(実施例1)
アニオン性界面活性剤ぺレックスOT−P(花王株式会社製、商品名)1.5mmol、トルエン50ml及びイオン交換水100mlを加えて、20℃に保持しつつ撹拌し、乳化液を得た。得られた乳化液にピロールモノマー21.2mmolを加え、1時間撹拌した後、過硫酸アンモニウム6mmolを加えて2時間重合反応を行った。反応終了後、有機層を回収し、イオン交換水で数回洗浄して、トルエンに分散した平均粒子径40nmのポリピロール粒子を得た。
得られたポリピロール粒子1質量部に対して、バインダーとしてスーパーベッカミンJ−820(DIC株式会社製、商品名)を5質量部加えて樹脂組成物を作製した(バインダー及びポリピロール粒子の質量比=5:1)。得られた樹脂組成物をPETフィルム(東洋紡績株式会社製、商品名「コスモシャインA4100」)上に塗布し、乾燥させることにより、PETフィルム上に厚さ60μmでポリピロール粒子が表面に露出している樹脂層を備える第1の積層体を得た。
続いて、1g/Lのパラジウムイオンを含む水溶液に第1の積層体を浸漬し、水洗させた後、さらに第1の積層体を10g/Lの次亜リン酸を含む水溶液に浸漬し、水洗することにより、ポリピロール粒子の露出面に触媒核が吸着された第2の積層体を得た。第2の積層体を0.5g/Lのニッケルイオンを含む無電解めっき浴に浸漬し、該めっき浴の温度82℃で、20秒間無電解めっき処理を行い、凹凸表面を有する第1の無電解めっき膜が形成された第3の積層体を得た。続いて、第3の積層体を、3g/Lの銅イオンを含む無電解めっき浴に浸漬し、めっき浴の温度38℃で、45分間無電解めっき処理を行い、第1の無電解めっき膜の凹凸表面上に第2の無電解めっき膜が形成されたシート材を作製した。第2の無電解めっき膜の厚さは1μmであり、第1の無電解めっき膜の表面に沿う凹部を形成していた。
ニッケルイオンを含む無電解めっき浴に浸漬させる時間を30秒間とした以外は、実施例1と同様の操作を行い、シート材を得た。
ニッケルイオンを含む無電解めっき浴に浸漬させる時間を40秒間とした以外は、実施例1と同様の操作を行い、シート材を得た。
ニッケルイオンを含む無電解めっき浴に浸漬させる時間を50秒間とした以外は、実施例1と同様の操作を行い、シート材を得た。
ニッケルイオンを含む無電解めっき浴に浸漬させる時間を60秒間とした以外は、実施例1と同様の操作を行い、シート材を得た。
ニッケルイオンを含む無電解めっき浴に浸漬させる時間を90秒間とした以外は、実施例1と同様の操作を行い、シート材を得た。
ニッケルイオンを含む無電解めっき浴に浸漬させる時間を120秒間とした以外は、実施例1と同様の操作を行い、シート材を得た。
PETフィルム(東洋紡績株式会社製、商品名「コスモシャインA4100」)上に、スパッタリング法にてパラジウムを厚さ20nmとなるように製膜し、積層体を得た。続いて、0.5g/Lのニッケルイオンを含む無電解めっき浴に、得られた積層体を浸漬し、該めっき浴の温度82℃で、20秒間無電解めっき処理を行い、平滑な表面を有する第1の無電解めっき膜が形成された第3の積層体を得た。続いて、0.1g/Lのパラジウムイオンを含む水溶液に、第3の積層体を浸漬し、水洗させた後、3g/Lの銅イオンを含む無電解めっき浴に浸漬し、めっき浴の温度38℃で、45分間無電解めっき処理を行い、ニッケルを含む第1の無電解めっき膜の表面上に銅を含む第2の無電解めっき膜が形成されたシート材を得た。銅を含む第2の無電解めっき膜の厚さは1μmであった。
PETフィルム(東洋紡績株式会社製、商品名「コスモシャインA4100」)上に、スパッタリング法にてニッケルを厚さ20nmとなるように製膜し、平滑な表面を有する膜が形成された第3の積層体を得た。続いて、0.1g/Lのパラジウムイオンを含む水溶液に、第3の積層体を浸漬し、水洗させた後、10g/Lの次亜リン酸を含む水溶液に浸漬し、水洗させた。その後、3g/Lの銅イオンを含む無電解めっき浴に浸漬し、めっき浴の温度38℃で、45分間無電解めっき処理を行い、ニッケルを含む膜の表面上に銅を含む第2の無電解めっき膜が形成されたシート材を得た。無電解めっき膜の厚さは1μmであった。
PETフィルム(東洋紡績株式会社製、標品名「コスモシャインA4100」)を、Sn−Pdコロイド溶液に25℃、5分間浸漬し、水洗した後、0.5g/Lのニッケルイオンを含む無電解めっき浴に浸漬し、該めっき浴の温度82℃で、20秒間無電解めっき処理を行い、凹凸表面を有する第1の無電解めっき膜が形成された第3の積層体を得た。続いて、0.1g/Lのパラジウムイオンを含む水溶液に、第3の積層体を浸漬し、水洗させた後、3g/Lの銅イオンを含む無電解めっき浴に浸漬し、めっき浴の温度38℃で、45分間無電解めっき処理を行い、ニッケルを含む膜の凹凸表面上に銅を含む第2の無電解めっき膜が形成されたシート材を得た。
(第1の無電解めっき膜の最長径及び面積比率の測定)
上記各実施例及び比較例で得られた第3の積層体における第1の無電解めっき膜の最長径及び面積比率を、SEM写真の画像解析により測定した。測定は、それぞれの第3の積層体を縦500μm、横600μmの視野で、20万倍の倍率で観察することにより行い、それぞれの第1の無電解めっき膜の最長径の平均値及び、視野に占める第1の無電解めっき膜の面積比率を算出した。なお、比較例1及び2で作製された第3の積層体は、膜の表面が平滑であったため、最長径を測定できなかった。測定結果を表1に示す。
Spectrophotometer CM−5(コニカミノルタ株式会社製、製品名)を用い、JIS K 8729に準拠した方法に従って、上記各実施例及び比較例で得られたシート材におけるPETフィルム側からの光の反射率を測定した。測定結果を表1に示す。反射率が20%以下であれば、反射率が低く抑えられた良好なシート材といえる。
上記各実施例及び比較例で得られたシート材における無電解めっき膜上に、フォトリソグラフィーによりL/S=5/10μmのメッシュ状のレジストパターンを形成した。その後、5%過硫酸ナトリウム水溶液に浸漬して、25℃、5分間でエッチングを行い、レジストを除去することでメタルメッシュを作製した。
(密着性の評価)
得られたメタルメッシュを直径1mmのステンレスの棒に巻き付け、以下の評価基準にしたがって、無電解めっき膜の密着性を評価した。結果を表1に示す。
A:500回の巻き付け後でもめっき膜の剥がれが認められなかった。
B:500回未満の巻き付けでめっき膜の剥がれが認められた。
エッチングによるラインの断線の有無を目視により観察し、以下の評価基準にしたがって、エッチング性を評価した。結果を表1に示す。
A:エッチングを行った際にラインの断線が認められなかった。
B:エッチングを行った際にラインの断線が認められた。
Claims (9)
- バインダー及び複数のポリピロール粒子を含む樹脂層と、前記樹脂層の一方の主面側に設けられ、第1の無電解めっき膜及び第2の無電解めっき膜を有する無電解めっき膜と、前記樹脂層の他方の主面側に設けられた透明基材と、を備え、
複数の前記ポリピロール粒子の少なくとも一部が、前記樹脂層の前記一方の主面から露出する露出面を有し、複数の前記露出面が、前記樹脂層の前記一方の主面上に散在しており、
前記第1の無電解めっき膜が、前記ポリピロール粒子の複数の前記露出面のそれぞれを囲むように前記樹脂層の前記一方の主面上に設けられており、
前記第2の無電解めっき膜が、前記第1の無電解めっき膜を覆うように設けられ、前記第2の無電解めっき膜の前記第1の無電解めっき膜側の主面が、前記第1の無電解めっき膜の表面に沿う凹部を形成している、シート材。 - 前記樹脂層の前記一方の主面を前記無電解めっき膜側から平面視したときに、前記第1の無電解めっき膜の最長径の平均値が18〜90nmである、請求項1に記載のシート材。
- 前記樹脂層の前記一方の主面を前記無電解めっき膜側から平面視したときに、前記一方の主面に占める前記第1の無電解めっき膜の面積比率が80〜99%である、請求項1又は2に記載のシート材。
- 前記第2の無電解めっき膜の前記第1の無電解めっき膜とは反対側の主面が粗面である、請求項1〜3のいずれか一項に記載のシート材。
- 透明基材上に、バインダー及び複数のポリピロール粒子を含む樹脂層を形成する工程であって、複数の前記ポリピロール粒子の少なくとも一部が、前記樹脂層の一方の主面から露出する露出面を有し、複数の前記露出面が前記樹脂層の前記一方の主面上に散在し、前記透明基材が前記樹脂層の他方の主面側に設けられる、工程と、
前記ポリピロール粒子の前記露出面に触媒を含む溶液を接触させて、複数の前記露出面のそれぞれに付着した触媒核を形成する工程と、
複数の前記露出面のそれぞれと前記触媒核とを囲むように、前記樹脂層の前記一方の主面上に第1の無電解めっき膜を形成する工程と、
前記第1の無電解めっき膜を覆うように第2の無電解めっき膜を形成する工程であって、前記第2の無電解めっき膜の前記第1の無電解めっき膜側の主面が前記第1の無電解めっき膜の表面に沿う凹部を形成する、工程と、
を備える、シート材の製造方法。 - 請求項1〜4のいずれか一項に記載のシート材における前記無電解めっき膜に対するエッチングによって、メッシュ状のパターンを有する無電解めっき膜を形成する工程を備える、メタルメッシュの製造方法。
- バインダー及び複数のポリピロール粒子を含む樹脂層と、前記樹脂層の一方の主面側にメッシュ状のパターンを形成するように設けられ、第1の無電解めっき膜及び第2の無電解めっき膜を有する無電解めっき膜と、前記樹脂層の他方の主面側に設けられた透明基材と、を備え、
複数の前記ポリピロール粒子の少なくとも一部が、前記樹脂層の前記一方の主面から露出する露出面を有し、複数の前記露出面が、前記樹脂層の前記一方の主面上に散在しており、
前記第1の無電解めっき膜が、前記ポリピロール粒子の複数の前記露出面のそれぞれを囲むように前記樹脂層の前記一方の主面上に設けられており、
前記第2の無電解めっき膜が、前記第1の無電解めっき膜を覆うように設けられ、前記第2の無電解めっき膜の前記第1の無電解めっき膜側の主面が、前記第1の無電解めっき膜の表面に沿う凹部を形成している、メタルメッシュ。 - 透明基材と、前記透明基材上にメッシュ状のパターンを形成するように設けられ、バインダー及び複数のポリピロール粒子を含む樹脂層と、前記樹脂層を覆いながら前記樹脂層のメッシュ状のパターンに沿って前記透明基材上に設けられ、第1の無電解めっき膜及び第2の無電解めっき膜を有する無電解めっき膜と、を備え、
複数の前記ポリピロール粒子の少なくとも一部が、前記樹脂層の表面から露出する露出面を有し、複数の前記露出面が、前記樹脂層の表面上に散在しており、
前記第1の無電解めっき膜が、前記ポリピロール粒子の複数の前記露出面のそれぞれを囲むように前記樹脂層の表面上に設けられており、
前記第2の無電解めっき膜が、前記第1の無電解めっき膜を覆うように設けられ、前記第2の無電解めっき膜の前記第1の無電解めっき膜側の表面が、前記第1の無電解めっき膜の表面に沿う凹部を形成している、メタルメッシュ。 - 前記第2の無電解めっき膜の前記第1の無電解めっき膜とは反対側の表面が粗面である、請求項7又は8に記載のメタルメッシュ。
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