JP2018533206A - プリント接着促進剤をその上に含む、アンテナ、1または複数の金属トレース、および/またはインダクタを有する電子デバイス、ならびにその製造方法 - Google Patents
プリント接着促進剤をその上に含む、アンテナ、1または複数の金属トレース、および/またはインダクタを有する電子デバイス、ならびにその製造方法 Download PDFInfo
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- G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
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- G08B13/2437—Tag layered structure, processes for making layered tags
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- G—PHYSICS
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- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B13/00—Burglar, theft or intruder alarms
- G08B13/22—Electrical actuation
- G08B13/24—Electrical actuation by interference with electromagnetic field distribution
- G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
- G08B13/2428—Tag details
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- G08B13/2442—Tag materials and material properties thereof, e.g. magnetic material details
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- H—ELECTRICITY
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- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H01Q7/005—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with variable reactance for tuning the antenna
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/36—Assembling printed circuits with other printed circuits
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
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- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
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Abstract
Description
本願は、ここに完全に記載されたものとして参照により本明細書に組み込まれる、2015年10月6日に出願された米国仮特許出願第62/238,045号の利益を主張する。
本発明は、第1基板上に第1金属層を形成する段階と、第2基板上に電気デバイスを形成する段階と、電気デバイスの入力端子および/または出力端子上に電気コネクタを形成する段階と、第1金属層の少なくとも一部の上に第2金属を選択的に堆積する段階と、電気コネクタを第2金属に接触させることにより、電気コネクタを第1金属層に電気的に接続する段階とを備える、電子デバイスを製造する方法に関する。第2金属は、第1金属層とは異なり、電気デバイス上の電気コネクタに対する、第1金属層の接着性および/または電気的接続性を向上させる。電子デバイスは、無線通信デバイスであってよい。様々な実施形態において、無線通信デバイスおよび無線デバイスは、無線周波数(RFおよび/またはRFID)、近距離無線通信(NFC)、短波(HF)、超短波(VHF)、極超短波(UHF)、または電子商品監視(EAS)タグおよび/もしくはデバイスを含む。1つの例において、デバイスは、NFCタグ、スマートタグ、またはスマートラベルのようなNFCデバイスである。
図2Aから図2Eは、本発明の1または複数の実施形態に係る、例示的なプロセスにおける例示的な中間体の平面図および断面図を示し、図2Fから図2Gは、本発明の1または複数の実施形態に係る、パラジウムの表面層をアルミニウムアンテナ上に有する例示的な電子デバイスの平面図および断面図を示す。
本電子デバイスおよびその製造方法は、薄膜もしくはプリント集積回路、またはディスクリートデバイスのバックプレーン上の、アンテナ、金属トレース、および/またはインダクタに一般に用いられる金属の(例えば、接着性のための)機械的平滑度および電気的接触性または接続性を有利に向上させる。加えて、本発明は、OCPまたはACP技術を用いることなく、アンテナ、1または複数の金属トレースおよび/またはインダクタ上の半田バンプ、または直接的な半田取付けのような様々な取付け技術を有利に可能にする。このように、ディスクリートコンデンサ、インダクタ、またはスイッチのような様々なコンポーネントが、堅牢で信頼できる半田で組み立てられることができる。さらに、本発明は、様々な取付け技術、費用の最小化、および製造プロセスの増大をさらに有利に可能にする。
Claims (18)
- a)第1基板上に第1金属層を形成する段階と、
b)第2基板上に電気デバイスを形成する段階と、
c)前記電気デバイスの複数の入力端子、出力端子または入力/出力端子上に電気コネクタを形成する段階と、
d)前記第1金属層の少なくとも一部の上に第2金属を選択的に堆積する段階であって、前記第2金属は、前記電気デバイス上の前記電気コネクタに対する、前記第1金属層の接着性および電気的接続性のうち少なくとも1つを向上させ、第2金属は、前記第1金属層に含まれる第1金属とは異なる、選択的に堆積する段階と、
e)前記電気コネクタを前記第2金属に接触させることにより、前記電気コネクタを前記第1金属層に電気的に接続する段階と
を備える、電子デバイスを製造する方法。 - 前記電子デバイスは、無線通信デバイスである、請求項1に記載の方法。
- 前記電気デバイスは、コンデンサまたは集積回路を含む、請求項1または2に記載の方法。
- 前記第1基板は、プラスチック膜を含む、請求項1から3の何れか一項に記載の方法。
- 前記第1金属層を形成する段階は、前記第1基板上にアルミニウム層を堆積する段階を含む、請求項1から4の何れか一項に記載の方法。
- 前記第1金属層を形成する段階は、(i)前記第1基板上に、シード金属を含む第1インクをアンテナ、1または複数の金属トレース、およびインダクタのうち少なくとも1つに対応するパターンでプリントする段階と、(ii)プリントされた前記シード金属上にバルク金属を電気めっきする、または無電解めっきする段階であって、前記バルク金属および前記シード金属のうち少なくとも1つが、前記第1金属である、電気めっきする、または無電解めっきする段階とを備える、請求項1から5の何れか一項に記載の方法。
- 前記第2金属を選択的に堆積する段階は、前記第2金属またはその前駆体を、前記電気コネクタが電気的に接続される、前記第1金属層の部分に含む第2インクをプリントする段階を含む、請求項1から6の何れか一項に記載の方法。
- 前記第2金属上に、ニッケル、銅、スズ、銀、金、またはその組み合わせを含む第3金属を無電解めっきする段階を含む、請求項1から7の何れか一項に記載の方法。
- 前記電気コネクタは、(i)第1半田バンプまたは半田ボールを前記複数の入力端子、出力端子または入力/出力端子のうち第1のものの上に、および(ii)第2半田バンプまたは半田ボールを前記複数の入力端子、出力端子または入力/出力端子のうち第2のものの上に含み、前記電気コネクタを前記第1金属層に電気的に接続する段階は、前記第1半田バンプおよび前記第2半田バンプまたは半田ボールを加熱し、前記第2金属に押圧する段階を含む、請求項1から8の何れか一項に記載の方法。
- a)第1金属層を有する第1基板と、
b)第2基板上の電気デバイスであって、前記電気デバイスは、複数の入力端子、出力端子または入力/出力端子、ならびにその少なくとも1つの上に電気コネクタを有し、前記電気コネクタは、第1金属に電気的に接続される、電気デバイスと、
c)前記第1金属層の少なくとも一部の上にある第2金属であって、前記第2金属は、前記電気コネクタに対する、前記第1金属層の接着性および電気的接続性のうち少なくとも1つを向上させる、第2金属と
を備える電子デバイス。 - 前記電子デバイスは、無線通信デバイスを含む、請求項10に記載の電子デバイス。
- 前記電気デバイスは、ディスクリートデバイスまたは集積回路を含む、請求項10または11に記載の電子デバイス。
- 前記第1基板は、プラスチック膜を含む、請求項10から12の何れか一項に記載の電子デバイス。
- 前記第1金属層は、アルミニウム層を含む、請求項10から13の何れか一項に記載の電子デバイス。
- 前記第2金属は、パラジウムを含む、請求項10から14の何れか一項に記載の電子デバイス。
- 前記第2金属上に、ニッケル、銅、スズ、銀、金、またはその組み合わせを含む第3金属をさらに備える、請求項15に記載の電子デバイス。
- 前記第2基板は、金属箔またはプラスチックを含む、請求項10から14の何れか一項に記載の電子デバイス。
- 前記電気コネクタは、第1半田バンプまたは半田ボールを前記複数の入力端子、出力端子または入力/出力端子のうち第1のものの上に、および、第2半田バンプまたは半田ボールを前記複数の入力端子、出力端子または入力/出力端子のうち第2のものの上に含む、請求項10から14の何れか一項に記載の電子デバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562238045P | 2015-10-06 | 2015-10-06 | |
US62/238,045 | 2015-10-06 | ||
PCT/US2016/055817 WO2017062662A1 (en) | 2015-10-06 | 2016-10-06 | Electronic device having an antenna, metal trace (s) and/or inductor with a printed adhesion promoter thereon |
Publications (2)
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JP2018533206A true JP2018533206A (ja) | 2018-11-08 |
JP2018533206A5 JP2018533206A5 (ja) | 2020-01-23 |
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JP2018515538A Pending JP2018533206A (ja) | 2015-10-06 | 2016-10-06 | プリント接着促進剤をその上に含む、アンテナ、1または複数の金属トレース、および/またはインダクタを有する電子デバイス、ならびにその製造方法 |
Country Status (5)
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US (1) | US20180285706A1 (ja) |
EP (1) | EP3360397A4 (ja) |
JP (1) | JP2018533206A (ja) |
CN (1) | CN108432356A (ja) |
WO (1) | WO2017062662A1 (ja) |
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US20200000548A1 (en) * | 2018-07-02 | 2020-01-02 | Covidien Lp | Method and apparatus related to fabricated wireless transponder devices to be used in medical procedures |
KR102662861B1 (ko) * | 2018-07-13 | 2024-05-03 | 삼성전기주식회사 | 인쇄회로기판 및 이를 포함하는 배터리 모듈 |
KR102597160B1 (ko) * | 2018-07-13 | 2023-11-02 | 삼성전기주식회사 | 인쇄회로기판 및 이를 포함하는 배터리 모듈 |
US20220173066A1 (en) * | 2020-12-02 | 2022-06-02 | Flex Ltd. | Flexible hybrid electronics manufacturing method |
Citations (2)
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JPS6453427A (en) * | 1986-09-25 | 1989-03-01 | Toshiba Corp | Bonding process |
JP2011516932A (ja) * | 2007-10-10 | 2011-05-26 | コヴィオ インコーポレイテッド | プリント集積回路を含む無線デバイス並びにその製造及び使用方法 |
Family Cites Families (13)
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US6421013B1 (en) * | 1999-10-04 | 2002-07-16 | Amerasia International Technology, Inc. | Tamper-resistant wireless article including an antenna |
US6710433B2 (en) * | 2000-11-15 | 2004-03-23 | Skyworks Solutions, Inc. | Leadless chip carrier with embedded inductor |
AU2004269715A1 (en) * | 2003-08-29 | 2005-03-10 | Peter S. Atherton | A radio frequency identification tag with tamper detection capability |
US7251884B2 (en) * | 2004-04-26 | 2007-08-07 | Formfactor, Inc. | Method to build robust mechanical structures on substrate surfaces |
EP1771919A1 (en) * | 2004-07-23 | 2007-04-11 | Fractus, S.A. | Antenna in package with reduced electromagnetic interaction with on chip elements |
US9953259B2 (en) * | 2004-10-08 | 2018-04-24 | Thin Film Electronics, Asa | RF and/or RF identification tag/device having an integrated interposer, and methods for making and using the same |
WO2007146026A2 (en) * | 2006-06-08 | 2007-12-21 | Dsi Products, Llc | Container wrap |
WO2009058543A1 (en) * | 2007-10-10 | 2009-05-07 | Kovio, Inc. | High reliability surveillance and/or identification tag/devices and methods of making and using the same |
KR101634819B1 (ko) * | 2008-05-15 | 2016-06-29 | 씬 필름 일렉트로닉스 에이에스에이 | 멀티플 커패시터를 이용한 감시 장치 |
EP2366271B1 (en) * | 2008-11-25 | 2019-03-20 | Thin Film Electronics ASA | Printed antennas, methods of printing an antenna, and devices including the printed antenna |
CN201478440U (zh) * | 2009-09-09 | 2010-05-19 | 余章军 | 一种手机内置天线 |
US8912890B2 (en) * | 2012-10-01 | 2014-12-16 | Thin Film Electronics Asa | Surveillance devices with multiple capacitors |
US9785881B2 (en) * | 2016-02-15 | 2017-10-10 | R.R. Donnelley & Sons Company | System and method for producing an electronic device |
-
2015
- 2015-10-06 US US15/765,885 patent/US20180285706A1/en not_active Abandoned
-
2016
- 2016-10-06 WO PCT/US2016/055817 patent/WO2017062662A1/en active Application Filing
- 2016-10-06 JP JP2018515538A patent/JP2018533206A/ja active Pending
- 2016-10-06 EP EP16854348.6A patent/EP3360397A4/en not_active Withdrawn
- 2016-10-06 CN CN201680058540.2A patent/CN108432356A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS6453427A (en) * | 1986-09-25 | 1989-03-01 | Toshiba Corp | Bonding process |
JP2011516932A (ja) * | 2007-10-10 | 2011-05-26 | コヴィオ インコーポレイテッド | プリント集積回路を含む無線デバイス並びにその製造及び使用方法 |
Also Published As
Publication number | Publication date |
---|---|
US20180285706A1 (en) | 2018-10-04 |
EP3360397A1 (en) | 2018-08-15 |
WO2017062662A1 (en) | 2017-04-13 |
CN108432356A (zh) | 2018-08-21 |
EP3360397A4 (en) | 2019-05-22 |
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