JP2018198232A - Substrate mounting device, substrate mounting method, film deposition device, film deposition method, alignment device, alignment method, and, method of manufacturing electronic device - Google Patents

Substrate mounting device, substrate mounting method, film deposition device, film deposition method, alignment device, alignment method, and, method of manufacturing electronic device Download PDF

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JP2018198232A
JP2018198232A JP2017101251A JP2017101251A JP2018198232A JP 2018198232 A JP2018198232 A JP 2018198232A JP 2017101251 A JP2017101251 A JP 2017101251A JP 2017101251 A JP2017101251 A JP 2017101251A JP 2018198232 A JP2018198232 A JP 2018198232A
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substrate
clamping
mounting
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tools
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JP6393802B1 (en
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石井　博
Hiroshi Ishii
石井　　博
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Canon Tokki Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

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Abstract

To reduce distortion occurring when a substrate is mounted on a mounting body in manufacture of an organic EL display.SOLUTION: A substrate mounting device is provided that comprises sandwiching means having a plurality of sandwiching implements sandwiching a peripheral part of a substrate, and mounting means for mounting the substrate on a mounting body. The sandwiching means has sandwiching force varying means varying sandwiching forces of the plurality of sandwiching implements. The sandwiching force varying means varies the sandwiching forces of some of the plurality of sandwiching implements independently of the other sandwiching implements.SELECTED DRAWING: Figure 5

Description

本発明は、基板載置装置、基板載置方法、成膜装置、成膜方法、アライメント装置、アライメント方法、および、電子デバイスの製造方法に関する。   The present invention relates to a substrate mounting apparatus, a substrate mounting method, a film forming apparatus, a film forming method, an alignment apparatus, an alignment method, and an electronic device manufacturing method.

有機ＥＬディスプレイ等の電子デバイス製造において、基板に有機材料を蒸着させる工程がある。蒸着装置は蒸着工程において、基板の周縁部（四辺）を支持または挟持する基板保持ユニットによって、基板を支持している。また、基板保持ユニットは、基板を支持した状態で、基板をマスク等の載置体に接触および載置させる。ここで、基板の外周のうち、一方の対向辺部（例えば長辺部）では基板を挟持し、他方の対向辺部（例えば短辺部）では挟持せずに支持のみする。特許文献１には、蒸着により有機ＥＬディスプレイを製造する装置の一例が記載されている。   In manufacturing an electronic device such as an organic EL display, there is a step of depositing an organic material on a substrate. In the vapor deposition process, the vapor deposition apparatus supports the substrate by a substrate holding unit that supports or sandwiches the peripheral edge (four sides) of the substrate. In addition, the substrate holding unit contacts and places the substrate on a mounting body such as a mask while supporting the substrate. Here, of the outer periphery of the substrate, the substrate is sandwiched between one opposing side portion (for example, the long side portion) and supported only without being sandwiched between the other opposing side portion (for example, the short side portion). Patent Document 1 describes an example of an apparatus for manufacturing an organic EL display by vapor deposition.

特開２００９−２７７６５５号公報JP 2009-277655 A

上記の、有機材料等を蒸着する際の挟持工程において、成膜領域を基板中央部に設ける関係上、基板を挟持できるのは基板の周縁部に限られている。そのため、基板自体の重量によって中央部に撓みが発生する場合がある。特に近年、基板の大型化、薄型化が進んでおり、基板を載置する際の自重による撓みの影響が大きくなっている。撓みが発生した状態で基板を載置体に載置すると、基板に歪みが発生し、その歪みをアライメントにより修正するために時間が掛かったり、製造品質が低下したりするおそれがある。   In the sandwiching step when vapor-depositing an organic material or the like, the substrate can be sandwiched only at the peripheral portion of the substrate because the film formation region is provided at the center of the substrate. Therefore, the center part may bend due to the weight of the substrate itself. In particular, in recent years, the substrate is becoming larger and thinner, and the influence of bending due to its own weight when placing the substrate is increasing. When the substrate is placed on the mounting body in a state where the bending has occurred, the substrate is distorted, and it may take time to correct the distortion by alignment, and the production quality may be deteriorated.

本発明は上記課題に鑑みてなされたものであり、有機ＥＬディスプレイの製造において基板を載置体に載置するときの歪みを低減することを目的とする。   This invention is made | formed in view of the said subject, and it aims at reducing the distortion at the time of mounting a board | substrate on a mounting body in manufacture of an organic electroluminescent display.

上記目的のため、本発明は以下の構成を採用する。すなわち、
基板の周縁を挟持するための複数の挟持具を有する挟持手段と、
基板を載置体の上に載置するための載置手段とを有する基板載置装置であって、
前記挟持手段は、更に、前記複数の挟持具の挟力を可変する挟力可変手段を有し、
前記挟力可変手段は、前記複数の挟持具のうちの一部の挟持具の挟力を、その他の挟持具とは独立して可変することを特徴とする基板載置装置である。
本発明はまた、以下の構成を採用する。すなわち、
基板の周縁を挟持するための複数の挟持具を有する挟持手段と、
基板を載置体の上に載置するための載置手段とを有する基板載置装置であって、
前記挟持手段は、更に、前記複数の挟持具の挟力を可変する挟力可変手段を有し、
前記挟力可変手段は、前記複数の挟持具の挟力を、挟持具ごとに夫々独立して可変する挟力可変手段であることを特徴とする基板載置装置である。
本発明はまた、以下の構成を採用する。すなわち、
基板の周縁部を複数の挟持具で挟持する挟持工程と、
挟持された基板を載置体の上に載置する載置工程とを有する基板載置方法であって、
前記挟持工程は、複数の挟持具のうちの、一部の挟持具の挟力とその他の挟持具の挟力
とを異ならせて、基板を挟持することを特徴とする基板載置方法である。
本発明はまた、以下の構成を採用する。すなわち、
基板の周縁を挟持具で挟持する挟持工程と、
挟持された基板を載置体の上に載置する載置工程とを有する基板載置方法であって、
前記挟持工程は、前記挟持具で、基板の周縁のうちの一辺内を挟持することを特徴とする基板載置方法である。 For the above purpose, the present invention adopts the following configuration. That is,
Clamping means having a plurality of clamping tools for clamping the peripheral edge of the substrate;
A substrate mounting device having mounting means for mounting the substrate on the mounting body,
The clamping means further includes clamping force varying means for varying the clamping force of the plurality of clamping tools,
The clamping force varying means is a substrate mounting apparatus characterized in that the clamping force of a part of the plurality of clamping tools is varied independently of the other clamping tools.
The present invention also employs the following configuration. That is,
Clamping means having a plurality of clamping tools for clamping the peripheral edge of the substrate;
A substrate mounting device having mounting means for mounting the substrate on the mounting body,
The clamping means further includes clamping force varying means for varying the clamping force of the plurality of clamping tools,
The clamping force varying means is a clamping force varying means that varies the clamping force of the plurality of clamping tools independently for each clamping tool.
The present invention also employs the following configuration. That is,
A clamping step of clamping the peripheral edge of the substrate with a plurality of clamping tools;
A substrate mounting method including a mounting step of mounting the sandwiched substrate on a mounting body,
The clamping step is a substrate mounting method characterized in that the clamping force of some clamping tools and the clamping force of other clamping tools among the plurality of clamping tools are different from each other to clamp the substrate. .
The present invention also employs the following configuration. That is,
A clamping step of clamping the periphery of the substrate with a clamping tool;
A substrate mounting method including a mounting step of mounting the sandwiched substrate on a mounting body,
The clamping step is a substrate mounting method characterized in that one of the peripheral edges of the substrate is clamped by the clamping tool.

本発明によれば、有機ＥＬディスプレイの製造において基板を載置体に載置するときの歪みを低減することができる。   ADVANTAGE OF THE INVENTION According to this invention, the distortion at the time of mounting a board | substrate on a mounting body in manufacture of an organic electroluminescent display can be reduced.

電子デバイスの製造装置の構成の一部を模式的に示す上視図Top view schematically showing a part of the configuration of an electronic device manufacturing apparatus 成膜装置の構成を模式的に示す断面図Sectional drawing which shows the structure of a film-forming apparatus typically 基板保持ユニットの斜視図Perspective view of substrate holding unit 有機ＥＬ表示装置の構造を示す図The figure which shows the structure of an organic electroluminescence display 実施例１における基板の挟持および載置処理の流れを示す図The figure which shows the flow of the clamping of the board | substrate in Example 1, and a mounting process 実施例１において基板にかける挟力を示す平面図The top view which shows the pinching force applied to a board | substrate in Example 1. 実施例２における基板保持ユニットおよび挟持機構の構成を示す図The figure which shows the structure of the board | substrate holding unit in Example 2, and a clamping mechanism. 実施例３にかかる基板の挟持および載置処理の流れを示す図The figure which shows the flow of the clamping and mounting process of the board | substrate concerning Example 3. 実施例４にかかる基板の挟持および載置処理の流れを示す図The figure which shows the flow of the clamping and mounting process of the board | substrate concerning Example 4. FIG.

以下、図面を参照しつつ本発明の好適な実施形態及び実施例を説明する。ただし、以下の実施形態及び実施例は本発明の好ましい構成を例示的に示すものにすぎず、本発明の範囲をそれらの構成に限定されない。また、以下の説明における、装置のハードウェア構成及びソフトウェア構成、処理フロー、製造条件、寸法、材質、形状などは、特に特定的な記載がないかぎりは、本発明の範囲をそれらのみに限定する趣旨のものではない。   Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are merely illustrative of preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. In the following description, the hardware configuration and software configuration of the apparatus, processing flow, manufacturing conditions, dimensions, materials, shapes, and the like limit the scope of the present invention only to those unless otherwise specified. It is not intended.

本発明は、基板上に薄膜を形成する成膜装置及びその制御方法に関し、特に、基板の高精度な搬送および位置調整のための技術に関する。本発明は、平行平板の基板の表面に真空蒸着により所望のパターンの薄膜（材料層）を形成する装置に好ましく適用できる。基板の材料としては、ガラス、樹脂、金属などの任意の材料を選択でき、また、蒸着材料としても、有機材料、無機材料（金属、金属酸化物など）などの任意の材料を選択できる。また、有機膜だけではなく金属膜を成膜することも可能である。本発明の技術は、具体的には、有機電子デバイス（例えば、有機ＥＬ表示装置、薄膜太陽電池）、光学部材などの製造装置に適用可能である。なかでも、有機ＥＬ表示装置の製造装置は、基板の大型化あるいは表示パネルの高精細化により基板の搬送精度及び基板とマスクのアライメント精度のさらなる向上が要求されているため、本発明の好ましい適用例の一つである。   The present invention relates to a film forming apparatus for forming a thin film on a substrate and a control method thereof, and more particularly, to a technique for highly accurate conveyance and position adjustment of a substrate. The present invention can be preferably applied to an apparatus for forming a thin film (material layer) having a desired pattern by vacuum deposition on the surface of a parallel plate substrate. Arbitrary materials such as glass, resin, and metal can be selected as the material of the substrate, and any material such as organic material and inorganic material (metal, metal oxide, etc.) can be selected as the vapor deposition material. Further, not only an organic film but also a metal film can be formed. Specifically, the technology of the present invention can be applied to manufacturing apparatuses such as organic electronic devices (for example, organic EL display devices, thin film solar cells), optical members, and the like. In particular, the organic EL display device manufacturing apparatus is required to further improve the substrate transport accuracy and the substrate / mask alignment accuracy by increasing the size of the substrate or increasing the definition of the display panel. This is one example.

＜製造装置及び製造プロセス＞
図１は、電子デバイスの製造装置の構成の一部を模式的に示す上視図である。図１の製造装置は、例えば、スマートフォン用の有機ＥＬ表示装置の表示パネルの製造に用いられる。スマートフォン用の表示パネルの場合、例えば約１８００ｍｍ×約１５００ｍｍ、厚み約０．５ｍｍのサイズの基板に有機ＥＬの成膜を行った後、該基板をダイシングして複数の小サイズのパネルが作製される。 <Manufacturing equipment and manufacturing process>
FIG. 1 is a top view schematically showing a part of the configuration of an electronic device manufacturing apparatus. The manufacturing apparatus of FIG. 1 is used, for example, for manufacturing a display panel of an organic EL display device for a smartphone. In the case of a display panel for a smartphone, for example, after forming an organic EL film on a substrate having a size of about 1800 mm × about 1500 mm and a thickness of about 0.5 mm, the substrate is diced to produce a plurality of small size panels. The

電子デバイスの製造装置は、一般に、図１に示すように、複数の成膜室１１１、１１２と、搬送室１１０とを有する。搬送室１１０内には、基板１０を保持し搬送する搬送ロボット１１９が設けられている。搬送ロボット１１９は、例えば、多関節アームに、基板を
保持するロボットハンドが取り付けられた構造をもつロボットであり、各成膜室への基板１０の搬入／搬出を行う。 An electronic device manufacturing apparatus generally has a plurality of film forming chambers 111 and 112 and a transfer chamber 110 as shown in FIG. In the transfer chamber 110, a transfer robot 119 for holding and transferring the substrate 10 is provided. The transfer robot 119 is, for example, a robot having a structure in which a robot hand that holds a substrate is attached to an articulated arm, and carries the substrate 10 into and out of each film forming chamber.

各成膜室１１１、１１２にはそれぞれ成膜装置（蒸着装置ともよぶ）が設けられている。搬送ロボット１１９との基板１０の受け渡し、基板１０とマスクの相対位置の調整（アライメント）、マスク上への基板１０の固定、成膜（蒸着）などの一連の成膜プロセスは、成膜装置によって自動で行われる。各成膜室の成膜装置は、蒸着源の違いやマスクの違いなど細かい点で相違する部分はあるものの、基本的な構成（特に基板の搬送やアライメントに関わる構成）はほぼ共通している。以下、各成膜室の成膜装置の共通構成について説明する。   Each of the film formation chambers 111 and 112 is provided with a film formation apparatus (also referred to as a vapor deposition apparatus). A series of film formation processes such as delivery of the substrate 10 to the transfer robot 119, adjustment of the relative position between the substrate 10 and the mask (alignment), fixation of the substrate 10 on the mask, film formation (evaporation) are performed by the film formation apparatus. It is done automatically. The film forming apparatus in each film forming chamber has almost the same basic structure (particularly, the structure related to substrate transport and alignment), although there are differences in details such as the difference in vapor deposition source and mask. . Hereinafter, a common configuration of the film forming apparatuses in the respective film forming chambers will be described.

＜成膜装置＞
図２は、成膜装置の構成を模式的に示す断面図である。以下の説明においては、鉛直方向をＺ方向とするＸＹＺ直交座標系を用いる。成膜時に基板は水平面（ＸＹ平面）と平行となるよう固定されるものとし、このときの基板の短手方向（短辺に平行な方向）をＸ方向、長手方向（長辺に平行な方向）をＹ方向とする。またＺ軸まわりの回転角をθで表す。 <Deposition system>
FIG. 2 is a cross-sectional view schematically showing the configuration of the film forming apparatus. In the following description, an XYZ orthogonal coordinate system in which the vertical direction is the Z direction is used. At the time of film formation, the substrate is fixed so as to be parallel to the horizontal plane (XY plane), and the short direction (direction parallel to the short side) of the substrate at this time is the X direction, and the long direction (direction parallel to the long side). ) In the Y direction. The rotation angle around the Z axis is represented by θ.

成膜装置は、真空チャンバ２００を有する。真空チャンバ２００の内部は、真空雰囲気か、窒素ガスなどの不活性ガス雰囲気に維持されている。真空チャンバ２００の内部には、概略、基板保持ユニット２１０と、マスク２２０と、マスク台２２１と、冷却板２３０と、蒸着源２４０が設けられる。基板保持ユニット２１０は、搬送ロボット１１９から受け取った基板１０を保持・搬送する手段であり、基板ホルダとも呼ばれる。マスク２２０は、基板１０上に形成する所定パターンの薄膜パターンに対応する開口パターンをもつメタルマスクであり、枠状のマスク台２２１の上に固定されている。成膜時にはマスク２２０の上に基板１０が載置される。したがってマスク２２０は基板１０を載置する載置体としての役割も担う。冷却板２３０は、成膜時に基板１０（のマスク２２０とは反対側の面）に密着し、基板１０の温度上昇を抑えることで有機材料の変質や劣化を抑制する部材である。冷却板２３０がマグネット板を兼ねていてもよい。マグネット板とは、磁力によってマスク２２０を引き付けることで、成膜時の基板１０とマスク２２０の密着性を高める部材である。蒸着源２４０は、蒸着材料、ヒータ、シャッタ、蒸発源の駆動機構、蒸発レートモニタなどから構成される（いずれも不図示）。   The film forming apparatus has a vacuum chamber 200. The inside of the vacuum chamber 200 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. In the vacuum chamber 200, a substrate holding unit 210, a mask 220, a mask base 221, a cooling plate 230, and a vapor deposition source 240 are generally provided. The substrate holding unit 210 is means for holding and transporting the substrate 10 received from the transport robot 119, and is also called a substrate holder. The mask 220 is a metal mask having an opening pattern corresponding to a predetermined thin film pattern formed on the substrate 10, and is fixed on a frame-shaped mask base 221. The substrate 10 is placed on the mask 220 during film formation. Therefore, the mask 220 also serves as a mounting body on which the substrate 10 is mounted. The cooling plate 230 is a member that is in close contact with the substrate 10 (the surface opposite to the mask 220) during film formation and suppresses an increase in temperature of the substrate 10, thereby suppressing deterioration and deterioration of the organic material. The cooling plate 230 may also serve as a magnet plate. The magnet plate is a member that enhances the adhesion between the substrate 10 and the mask 220 during film formation by attracting the mask 220 with a magnetic force. The evaporation source 240 includes an evaporation material, a heater, a shutter, an evaporation source drive mechanism, an evaporation rate monitor, and the like (all not shown).

真空チャンバ２００の上（外側）には、基板Ｚアクチュエータ２５０、クランプＺアクチュエータ２５１、冷却板Ｚアクチュエータ２５２、Ｘアクチュエータ（不図示）、Ｙアクチュエータ（不図示）、θアクチュエータ（不図示）が設けられている。これらのアクチュエータは、例えば、モータとボールねじ、モータとリニアガイドなどで構成される。基板Ｚアクチュエータ２５０は、基板保持ユニット２１０の全体を昇降（Ｚ方向移動）させるための駆動手段である。クランプＺアクチュエータ２５１は、基板保持ユニット２１０の挟持機構（後述）を開閉させるための駆動手段である。冷却板Ｚアクチュエータ２５２は、冷却板２３０を昇降させるための駆動手段である。Ｘアクチュエータ、Ｙアクチュエータ、θアクチュエータ（以下まとめて「ＸＹθアクチュエータ」と呼ぶ）は基板１０のアライメントのための駆動手段である。ＸＹθアクチュエータは、基板保持ユニット２１０及び冷却板２３０の全体を、Ｘ方向移動、Ｙ方向移動、θ回転させる。なお、本実施形態では、マスク２２０を固定した状態で基板１０のＸ，Ｙ，θを調整する構成としたが、マスク２２０の位置を調整し、又は、基板１０とマスク２２０の両者の位置を調整することで、基板１０とマスク２２０のアライメントを行ってもよい。   A substrate Z actuator 250, a clamp Z actuator 251, a cooling plate Z actuator 252, an X actuator (not shown), a Y actuator (not shown), and a θ actuator (not shown) are provided above (outside) the vacuum chamber 200. ing. These actuators include, for example, a motor and a ball screw, a motor and a linear guide, and the like. The substrate Z actuator 250 is a driving means for moving the entire substrate holding unit 210 up and down (moving in the Z direction). The clamp Z actuator 251 is a driving unit for opening and closing a clamping mechanism (described later) of the substrate holding unit 210. The cooling plate Z actuator 252 is driving means for moving the cooling plate 230 up and down. The X actuator, Y actuator, and θ actuator (hereinafter collectively referred to as “XYθ actuator”) are drive means for alignment of the substrate 10. The XYθ actuator rotates the entire substrate holding unit 210 and the cooling plate 230 in the X direction, the Y direction, and θ rotation. In this embodiment, the X, Y, and θ of the substrate 10 are adjusted with the mask 220 fixed. However, the position of the mask 220 is adjusted, or the positions of both the substrate 10 and the mask 220 are adjusted. By adjusting, the substrate 10 and the mask 220 may be aligned.

真空チャンバ２００の上（外側）には、基板１０及びマスク２２０のアライメントのために、基板１０及びマスク２２０それぞれの位置を測定するカメラ２６０、２６１が設け
られている。カメラ２６０、２６１は、真空チャンバ２００に設けられた窓を通して、基板１０とマスク２２０を撮影する。その画像から基板１０上のアライメントマーク及びマスク２２０上のアライメントマークを認識することで、各々のＸＹ位置やＸＹ面内での相対ズレを計測することができる。短時間で高精度なアライメントを実現するために、大まかに位置合わせを行う第１アライメント（「ラフアライメント」とも称す）と、高精度に位置合わせを行う第２アライメント（「ファインアライメント」とも称す）の２段階のアライメントを実施することが好ましい。その場合、低解像だが広視野の第１アライメント用のカメラ２６０と狭視野だが高解像の第２アライメント用のカメラ２６１の２種類のカメラを用いるとよい。本実施形態では、基板１０及びマスク２２０それぞれについて、対向する一対の辺の２箇所に付されたアライメントマークを２台の第１アライメント用のカメラ２６０で測定し、基板１０及びマスク２２０の４隅に付されたアライメントマークを４台の第２アライメント用のカメラ２６１で測定する。 Cameras 260 and 261 for measuring the positions of the substrate 10 and the mask 220 are provided above (outside) the vacuum chamber 200 in order to align the substrate 10 and the mask 220. The cameras 260 and 261 photograph the substrate 10 and the mask 220 through a window provided in the vacuum chamber 200. By recognizing the alignment mark on the substrate 10 and the alignment mark on the mask 220 from the image, each XY position and relative displacement in the XY plane can be measured. In order to achieve high-precision alignment in a short time, a first alignment that roughly aligns (also referred to as “rough alignment”) and a second alignment that aligns with high accuracy (also referred to as “fine alignment”). It is preferable to perform the two-stage alignment. In that case, it is preferable to use two types of cameras, a low-resolution but wide-field first alignment camera 260 and a narrow-field but high-resolution second alignment camera 261. In the present embodiment, for each of the substrate 10 and the mask 220, alignment marks attached to two locations on a pair of opposing sides are measured by two first alignment cameras 260, and the four corners of the substrate 10 and the mask 220 are measured. The alignment marks attached to are measured with four second alignment cameras 261.

成膜装置は、制御部２７０を有する。制御部２７０は、基板Ｚアクチュエータ２５０、クランプＺアクチュエータ２５１、冷却板Ｚアクチュエータ２５２、ＸＹθアクチュエータ、及びカメラ２６０、２６１の制御の他、基板１０の搬送及びアライメント、蒸着源の制御、成膜の制御などの機能を有する。制御部２７０は、例えば、プロセッサ、メモリ、ストレージ、Ｉ／Ｏなどを有するコンピュータにより構成可能である。この場合、制御部２７０の機能は、メモリ又はストレージに記憶されたプログラムをプロセッサが実行することにより実現される。コンピュータとしては、汎用のパーソナルコンピュータを用いてもよいし、組込型のコンピュータ又はＰＬＣ（ｐｒｏｇｒａｍｍａｂｌｅ ｌｏｇｉｃ ｃｏｎｔｒｏｌｌｅｒ）を用いてもよい。あるいは、制御部２７０の機能の一部又は全部をＡＳＩＣやＦＰＧＡのような回路で構成してもよい。なお、成膜装置ごとに制御部２７０が設けられていてもよいし、１つの制御部２７０が複数の成膜装置を制御してもよい。   The film forming apparatus includes a control unit 270. The control unit 270 controls the substrate Z actuator 250, the clamp Z actuator 251, the cooling plate Z actuator 252, the XYθ actuator, and the cameras 260 and 261, as well as transport and alignment of the substrate 10, deposition source control, and film formation control. It has functions such as. The control unit 270 can be configured by a computer having a processor, memory, storage, I / O, and the like, for example. In this case, the function of the control unit 270 is realized by the processor executing a program stored in the memory or storage. As the computer, a general-purpose personal computer may be used, or an embedded computer or a PLC (programmable logic controller) may be used. Alternatively, some or all of the functions of the control unit 270 may be configured by a circuit such as an ASIC or FPGA. Note that a control unit 270 may be provided for each film forming apparatus, or one control unit 270 may control a plurality of film forming apparatuses.

なお、基板１０の保持・搬送及びアライメントに関わる構成部分（基板保持ユニット２１０、基板Ｚアクチュエータ２５０、クランプＺアクチュエータ２５１、ＸＹθアクチュエータ、カメラ２６０、２６１、制御部２７０など）は、「基板載置装置」、「基板挟持装置」、「基板搬送装置」などとも呼ばれる。   Note that the components related to holding, transporting, and alignment of the substrate 10 (substrate holding unit 210, substrate Z actuator 250, clamp Z actuator 251, XYθ actuator, cameras 260, 261, control unit 270, etc.) "," Substrate clamping device "," substrate transfer device "and the like.

＜基板保持ユニット＞
図３を参照して基板保持ユニット２１０の構成を説明する。図３は基板保持ユニット２１０の斜視図である。
基板保持ユニット２１０は、挟持機構（挟持具とも呼ぶ）によって基板１０の周縁部を挟持することにより、基板１０を保持・搬送する手段である。具体的には、基板保持ユニット２１０は、基板１０の４辺それぞれを下から支持する複数の支持具３００が設けられた支持枠体３０１と、各支持具３００との間で基板１０を挟み込む複数の押圧具３０２が設けられたクランプ部材３０３とを有する。一対の支持具３００と押圧具３０２とで１つの挟持機構が構成される。図３の例では、基板１０の短辺に沿って３つの支持具３００が配置され、長辺に沿って６つの挟持機構（支持具３００と押圧具３０２のペア）が配置されており、長辺２辺を挟持する構成となっている。ただし挟持機構の構成は図３の例に限られず、処理対象となる基板のサイズや形状あるいは成膜条件などに合わせて、挟持機構の数や配置を適宜変更してもよい。なお、支持具３００は「受け爪」又は「フィンガ」とも呼ばれ、押圧具３０２は「クランプ」とも呼ばれる。 <Board holding unit>
The configuration of the substrate holding unit 210 will be described with reference to FIG. FIG. 3 is a perspective view of the substrate holding unit 210.
The substrate holding unit 210 is means for holding and transporting the substrate 10 by clamping the peripheral edge portion of the substrate 10 by a clamping mechanism (also called a clamping tool). Specifically, the substrate holding unit 210 includes a plurality of support frames 301 provided with a plurality of support tools 300 that support each of the four sides of the substrate 10 from below, and a plurality of the substrate 10 sandwiched between the support tools 300. And a clamp member 303 provided with the pressing tool 302. The pair of support tools 300 and the pressing tool 302 constitute one clamping mechanism. In the example of FIG. 3, three support tools 300 are arranged along the short side of the substrate 10, and six clamping mechanisms (a pair of the support tool 300 and the pressing tool 302) are arranged along the long side. It is configured to sandwich two sides. However, the configuration of the clamping mechanism is not limited to the example of FIG. 3, and the number and arrangement of the clamping mechanisms may be changed as appropriate in accordance with the size and shape of the substrate to be processed or the film formation conditions. The support tool 300 is also called a “receiving claw” or “finger”, and the pressing tool 302 is also called a “clamp”.

搬送ロボット１１９から基板保持ユニット２１０への基板１０の受け渡しは例えば次のように行われる。まず、クランプＺアクチュエータ２５１によりクランプ部材３０３を上昇させ、押圧具３０２を支持具３００から離間させることで、挟持機構を解放状態にする。搬送ロボット１１９によって支持具３００と押圧具３０２の間に基板１０を導入した後、クランプＺアクチュエータ２５１によってクランプ部材３０３を下降させ、押圧具３０
２を所定の押圧力で支持具３００に押し当てる。これにより、押圧具３０２と支持具３００の間で基板１０が挟持される。この状態で基板Ｚアクチュエータ２５０により基板保持ユニット２１０を駆動することで、基板１０を昇降（Ｚ方向移動）させることができる。なお、クランプＺアクチュエータ２５１は基板保持ユニット２１０と共に上昇／下降するため、基板保持ユニット２１０が昇降しても挟持機構の状態は変化しない。かかる構成を、基板昇降手段とも呼ぶ。基板昇降手段は、制御部やアクチュエータなども含めた載置手段に含まれると考えても良い。なお、マスク２２０を昇降させる載置体昇降手段を設けることによっても、マスク２２０と基板１０を接触させることができる。さらに基板昇降手段とともに載置体昇降手段を設けても良い。 For example, the transfer of the substrate 10 from the transfer robot 119 to the substrate holding unit 210 is performed as follows. First, the clamp member 303 is raised by the clamp Z actuator 251, and the pressing tool 302 is separated from the support tool 300, so that the clamping mechanism is released. After the substrate 10 is introduced between the support tool 300 and the pressing tool 302 by the transfer robot 119, the clamp member 303 is lowered by the clamp Z actuator 251, and the pressing tool 30.
2 is pressed against the support 300 with a predetermined pressing force. As a result, the substrate 10 is sandwiched between the pressing tool 302 and the support tool 300. In this state, by driving the substrate holding unit 210 by the substrate Z actuator 250, the substrate 10 can be moved up and down (moved in the Z direction). Since the clamp Z actuator 251 is raised / lowered together with the substrate holding unit 210, the state of the clamping mechanism does not change even when the substrate holding unit 210 is raised / lowered. Such a configuration is also referred to as substrate lifting / lowering means. The substrate lifting / lowering means may be considered to be included in mounting means including a control unit and an actuator. Note that the mask 220 and the substrate 10 can also be brought into contact with each other by providing a mounting body elevating means for elevating the mask 220. Furthermore, a mounting body lifting / lowering means may be provided together with the substrate lifting / lowering means.

なお、図３の符号１０１は、基板１０の４隅に付された第２アライメント用のアライメントマークを示し、符号１０２は、基板１０の短辺中央に付された第１アライメント用のアライメントマークを示している。   3 indicates a second alignment alignment mark attached to the four corners of the substrate 10, and reference numeral 102 indicates a first alignment alignment mark attached to the center of the short side of the substrate 10. Show.

＜電子デバイスの製造方法の実施例＞
次に、本実施形態の成膜装置を用いた電子デバイスの製造方法の一例を説明する。以下、電子デバイスの例として有機ＥＬ表示装置の構成及び製造方法を例示する。
まず、製造する有機ＥＬ表示装置について説明する。図４（ａ）は有機ＥＬ表示装置６０の全体図、図４（ｂ）は１画素の断面構造を表している。 <Example of Manufacturing Method of Electronic Device>
Next, an example of an electronic device manufacturing method using the film forming apparatus of the present embodiment will be described. Hereinafter, as an example of an electronic device, a configuration and a manufacturing method of an organic EL display device will be exemplified.
First, an organic EL display device to be manufactured will be described. 4A shows an overall view of the organic EL display device 60, and FIG. 4B shows a cross-sectional structure of one pixel.

図４（ａ）に示すように、有機ＥＬ表示装置６０の表示領域６１には、発光素子を複数備える画素６２がマトリクス状に複数配置されている。詳細は後で説明するが、発光素子のそれぞれは、一対の電極に挟まれた有機層を備えた構造を有している。なお、ここでいう画素とは、表示領域６１において所望の色の表示を可能とする最小単位を指している。本実施例にかかる有機ＥＬ表示装置の場合、互いに異なる発光を示す第１発光素子６２Ｒ、第２発光素子６２Ｇ、第３発光素子６２Ｂの組合せにより画素６２が構成されている。画素６２は、赤色発光素子と緑色発光素子と青色発光素子の組合せで構成されることが多いが、黄色発光素子とシアン発光素子と白色発光素子の組み合わせでもよく、少なくとも１色以上であれば特に制限されるものではない。   As shown in FIG. 4A, in the display area 61 of the organic EL display device 60, a plurality of pixels 62 each including a plurality of light emitting elements are arranged in a matrix. Although details will be described later, each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. Here, the pixel refers to a minimum unit that enables display of a desired color in the display area 61. In the case of the organic EL display device according to this example, the pixel 62 is configured by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B that emit different light. The pixel 62 is often composed of a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element. It is not limited.

図４（ｂ）は、図４（ａ）のＡ−Ｂ線における部分断面模式図である。画素６２は、基板６３上に、第１電極（陽極）６４と、正孔輸送層６５と、発光層６６Ｒ，６６Ｇ，６６Ｂのいずれかと、電子輸送層６７と、第２電極（陰極）６８と、を備える有機ＥＬ素子を有している。これらのうち、正孔輸送層６５、発光層６６Ｒ，６６Ｇ，６６Ｂ、電子輸送層６７が有機層に当たる。また、本実施形態では、発光層６６Ｒは赤色を発する有機ＥＬ層、発光層６６Ｇは緑色を発する有機ＥＬ層、発光層６６Ｂは青色を発する有機ＥＬ層である。発光層６６Ｒ，６６Ｇ，６６Ｂは、それぞれ赤色、緑色、青色を発する発光素子（有機ＥＬ素子と記述する場合もある）に対応するパターンに形成されている。また、第１電極６４は、発光素子ごとに分離して形成されている。正孔輸送層６５と電子輸送層６７と第２電極６８は、複数の発光素子６２Ｒ，６２Ｇ，６２Ｂと共通で形成されていてもよいし、発光素子毎に形成されていてもよい。なお、第１電極６４と第２電極６８とが異物によってショートするのを防ぐために、第１電極６４間に絶縁層６９が設けられている。さらに、有機ＥＬ層は水分や酸素によって劣化するため、水分や酸素から有機ＥＬ素子を保護するための保護層７０が設けられている。   FIG. 4B is a schematic partial cross-sectional view taken along the line AB of FIG. The pixel 62 includes a first electrode (anode) 64, a hole transport layer 65, one of the light emitting layers 66 </ b> R, 66 </ b> G, and 66 </ b> B, an electron transport layer 67, and a second electrode (cathode) 68 on a substrate 63. And an organic EL element. Among these, the hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to the organic layer. In the present embodiment, the light emitting layer 66R is an organic EL layer that emits red, the light emitting layer 66G is an organic EL layer that emits green, and the light emitting layer 66B is an organic EL layer that emits blue. The light emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light emitting elements that emit red, green, and blue (sometimes referred to as organic EL elements). The first electrode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. Note that an insulating layer 69 is provided between the first electrodes 64 in order to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign matter. Furthermore, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 70 for protecting the organic EL element from moisture and oxygen is provided.

有機ＥＬ層を発光素子単位に形成するためには、マスクを介して成膜する方法が用いられる。近年、表示装置の高精細化が進んでおり、有機ＥＬ層の形成には開口の幅が数十μｍのマスクが用いられる。このようなマスクを用いた成膜の場合、マスクが成膜中に蒸発源から受熱して熱変形するとマスクと基板との位置がずれてしまい、基板上に形成される薄膜のパターンが所望の位置からずれて形成されてしまう。そこで、これら有機ＥＬ層の
成膜には本発明にかかる成膜装置（真空蒸着装置）が好適に用いられる。 In order to form the organic EL layer in units of light emitting elements, a method of forming a film through a mask is used. In recent years, display devices have been improved in definition, and a mask having an opening width of several tens of μm is used for forming an organic EL layer. In the case of film formation using such a mask, if the mask receives heat from the evaporation source during film formation and is thermally deformed, the position of the mask and the substrate is shifted, and the pattern of the thin film formed on the substrate is desired. It will be formed out of position. Therefore, a film forming apparatus (vacuum evaporation apparatus) according to the present invention is suitably used for forming these organic EL layers.

次に、有機ＥＬ表示装置の製造方法の例について具体的に説明する。
まず、有機ＥＬ表示装置を駆動するための回路（不図示）および第１電極６４が形成された基板６３を準備する。 Next, an example of a method for manufacturing an organic EL display device will be specifically described.
First, a circuit (not shown) for driving the organic EL display device and a substrate 63 on which the first electrode 64 is formed are prepared.

第１電極６４が形成された基板６３の上にアクリル樹脂をスピンコートで形成し、アクリル樹脂をリソグラフィ法により、第１電極６４が形成された部分に開口が形成されるようにパターニングし絶縁層６９を形成する。この開口部が、発光素子が実際に発光する発光領域に相当する。   An acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by a lithography method so that an opening is formed in a portion where the first electrode 64 is formed. 69 is formed. This opening corresponds to a light emitting region where the light emitting element actually emits light.

絶縁層６９がパターニングされた基板６３を第１の成膜装置に搬入し、基板保持ユニットにて基板を保持し、正孔輸送層６５を、表示領域の第１電極６４の上に共通する層として成膜する。正孔輸送層６５は真空蒸着により成膜される。実際には正孔輸送層６５は表示領域６１よりも大きなサイズに形成されるため、高精細なマスクは不要である。   The substrate 63 patterned with the insulating layer 69 is carried into the first film formation apparatus, the substrate is held by the substrate holding unit, and the hole transport layer 65 is a common layer on the first electrode 64 in the display region. As a film formation. The hole transport layer 65 is formed by vacuum deposition. Actually, since the hole transport layer 65 is formed in a size larger than the display region 61, a high-definition mask is not necessary.

次に、正孔輸送層６５までが形成された基板６３を第２の成膜装置に搬入し、基板保持ユニットにて保持する。基板とマスクとのアライメントを行い、基板をマスクの上に載置し、基板６３の赤色を発する素子を配置する部分に、赤色を発する発光層６６Ｒを成膜する。本例によれば、マスクと基板とを良好に重ね合わせることができ、高精度な成膜を行うことができる。   Next, the substrate 63 on which the hole transport layer 65 is formed is carried into the second film forming apparatus and held by the substrate holding unit. The substrate and the mask are aligned, the substrate is placed on the mask, and the light emitting layer 66R that emits red is formed on the portion of the substrate 63 where the element that emits red is disposed. According to this example, the mask and the substrate can be satisfactorily overlapped, and highly accurate film formation can be performed.

発光層６６Ｒの成膜と同様に、第３の成膜装置により緑色を発する発光層６６Ｇを成膜し、さらに第４の成膜装置により青色を発する発光層６６Ｂを成膜する。発光層６６Ｒ、６６Ｇ、６６Ｂの成膜が完了した後、第５の成膜装置により表示領域６１の全体に電子輸送層６７を成膜する。電子輸送層６５は、３色の発光層６６Ｒ、６６Ｇ、６６Ｂに共通の層として形成される。   Similarly to the formation of the light emitting layer 66R, the light emitting layer 66G that emits green is formed by the third film forming apparatus, and the light emitting layer 66B that emits blue is formed by the fourth film forming apparatus. After the formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed on the entire display region 61 by the fifth film formation apparatus. The electron transport layer 65 is formed as a layer common to the three-color light emitting layers 66R, 66G, and 66B.

電子輸送層６５までが形成された基板をスパッタリング装置に移動し、第２電極６８を成膜し、その後プラズマＣＶＤ装置に移動して保護層７０を成膜して、有機ＥＬ表示装置６０が完成する。   The substrate on which the electron transport layer 65 is formed is moved to the sputtering apparatus, the second electrode 68 is formed, and then the protective layer 70 is formed by moving to the plasma CVD apparatus, and the organic EL display device 60 is completed. To do.

絶縁層６９がパターニングされた基板６３を成膜装置に搬入してから保護層７０の成膜が完了するまでは、水分や酸素を含む雰囲気にさらしてしまうと、有機ＥＬ材料からなる発光層が水分や酸素によって劣化してしまうおそれがある。従って、本例において、成膜装置間の基板の搬入搬出は、真空雰囲気または不活性ガス雰囲気の下で行われる。   From when the substrate 63 with the insulating layer 69 patterned is carried into the film formation apparatus until the film formation of the protective layer 70 is completed, if the light emitting layer made of an organic EL material is exposed to an atmosphere containing moisture or oxygen, There is a risk of deterioration due to moisture and oxygen. Therefore, in this example, the carrying-in / out of the substrate between the film forming apparatuses is performed in a vacuum atmosphere or an inert gas atmosphere.

このようにして得られた有機ＥＬ表示装置は、発光素子ごとに発光層が精度よく形成される。従って、上記製造方法を用いれば、発光層の位置ずれに起因する有機ＥＬ表示装置の不良の発生を抑制することができる。   In the organic EL display device thus obtained, a light emitting layer is accurately formed for each light emitting element. Therefore, if the manufacturing method is used, it is possible to suppress the occurrence of defects in the organic EL display device due to the displacement of the light emitting layer.

＜実施例１＞
図５（ａ）〜（ｅ）は、本発明の実施例１にかかる基板の挟持および載置処理の流れを示す図である。各図は、挟持された基板１０を図３に示す基板保持ユニットにて載置体に載置する様子を順次示しており、基板保持ユニットおよび基板１０を図３のＸＺ平面で切断した断面図である。なお必要に応じて、挟持機構の４辺のうち一方の長辺側（図５の左側）に配置された押圧具に符号３０２ａ、それと対向する長辺側（図５の右側）に配置された押圧具に符号３０２ｂを付して区別する。 <Example 1>
FIGS. 5A to 5E are diagrams showing the flow of the substrate clamping and placing processes according to the first embodiment of the present invention. Each drawing sequentially shows a state in which the sandwiched substrate 10 is placed on the placement body by the substrate holding unit shown in FIG. 3, and the sectional view of the substrate holding unit and the substrate 10 taken along the XZ plane of FIG. It is. If necessary, the pressing tool disposed on one long side (left side in FIG. 5) of the four sides of the clamping mechanism is disposed on the long side (right side in FIG. 5) opposite to the reference numeral 302a. The pressing tool is distinguished by being denoted by reference numeral 302b.

図５（ａ）は、搬送ロボット１１９により基板１０が支持具３００と押圧具３０２の間
に導入され、基板１０の周縁部１０ａが支持具３００によって支持された状態である。図５（ａ）の状態では基板１０が固定されていないため、基板１０の中央が撓んでいる。 FIG. 5A shows a state in which the substrate 10 is introduced between the support tool 300 and the pressing tool 302 by the transfer robot 119 and the peripheral edge 10 a of the substrate 10 is supported by the support tool 300. Since the substrate 10 is not fixed in the state of FIG. 5A, the center of the substrate 10 is bent.

図５（ｂ）では、制御部２７０の制御に応じてクランプＺアクチュエータ２５１がクランプ部材３０３を下降させることにより、押圧具３０２ａおよび３０２ｂが下降して、支持具３００との間で基板１０を挟持する。ここで、制御部２７０は、一辺内（一方の長辺側）の押圧具３０２ａと支持具３００の間には通常通りの挟力を発生させるが（図中、「通常」と記した下向き矢印）、対向する他方の長辺側の押圧具３０２ｂと支持具３００の間には、通常より弱い挟力を発生させるか、挟力が発生しないようにする（図中、「弱
ｏｒ Ｆｒｅｅ」と記した下向き矢印）。このような制御は例えば、クランプＺアクチュ
エータ２５１による押圧力を左右で変更することで実施できる。このように挟力が可変であることによって、本発明の制御が可能である。かかる挟力を可変する制御を可能にする制御部や各アクチュエータを、挟力可変手段と称しても良い。 In FIG. 5B, the clamp Z actuator 251 lowers the clamp member 303 in accordance with the control of the control unit 270, so that the pressing tools 302a and 302b are lowered, and the substrate 10 is sandwiched between the support tool 300. To do. Here, the control unit 270 generates a normal pinching force between the pressing tool 302a within one side (one long side) and the support tool 300 (the downward arrow indicated as “normal” in the drawing). ), Or a pinching force that is weaker than usual is generated between the pressing tool 302b on the other long side facing the support tool 300, or no pinching force is generated ("weak" in the figure).
or Free Arrow "). Such control can be carried out, for example, by changing the pressing force by the clamp Z actuator 251 on the left and right. Thus, the control of the present invention is possible because the pinching force is variable. A control unit or each actuator that enables control to vary the clamping force may be referred to as clamping force varying means.

押圧具３０２ａと支持具３００の間の挟力は、基板１０が容易にズレないような力が好ましい。一方、押圧具３０２ｂと支持具３００の間の挟力は基板１０にある程度の力が働いたときに、押圧具３０２ｂと支持具３００の間にある基板１０がズレて挟持位置が変わる程度の力が好ましい。なお、挟持機構が基板１０を保持する挟力には、押圧具３０２ａ，３０２ｂにかける力の他に、基板１０と挟持機構の間の摩擦力も寄与しているので、押圧具３０２ｂにかける力を制御する際には、摩擦力も加味することが好ましい。   The clamping force between the pressing tool 302a and the support tool 300 is preferably a force that does not easily shift the substrate 10. On the other hand, the clamping force between the pressing tool 302b and the support tool 300 is such that when a certain amount of force is applied to the substrate 10, the substrate 10 between the pressing tool 302b and the support tool 300 is displaced to change the clamping position. Is preferred. In addition, since the friction force between the board | substrate 10 and the clamping mechanism contributes to the clamping force which a clamping mechanism hold | maintains the board | substrate 10 besides the force applied to the pressing tools 302a and 302b, the force applied to the pressing tool 302b is applied. When controlling, it is preferable to also consider a frictional force.

図５（ｃ）は、図５（ｂ）のように片側の挟力が弱いかゼロの状態で、基板Ｚアクチュエータ２５０が基板１０を下降させ、基板１０が載置体であるマスク２２０に接触した状態を示す。   FIG. 5C shows a state in which the clamping force on one side is weak or zero as shown in FIG. 5B, the substrate Z actuator 250 lowers the substrate 10, and the substrate 10 contacts the mask 220 which is a mounting body. Shows the state.

図５（ｄ）は、図５（ｃ）の状態から、基板Ｚアクチュエータ２５０がさらに基板１０を下降させ、基板１０とマスク２２０の接触領域が増大した状態を示す。このとき、マスク２２０からの応力と基板中央に生じていた撓みによって基板１０の形状が変化し、歪みが生じていることが分かる。従来の挟持方法および載置方法では、この形状変化が、基板１０のアライメントに時間を要する原因となっていた。
しかし本発明では、押圧具３０２ｂと支持具３００の間の挟力が、押圧具３０２ａと支持具３００の間の挟力よりも弱いか、ゼロになっている。そのため図５（ｄ）に示すように、マスク２２０からの応力によって、押圧具３０２ｂと支持具３００の間の基板１０に、矢印５０１で示す方向のズレ力が発生する。その結果、図５（ｅ）に示すように基板１０の撓みや歪みが解消し、基板１０とマスク２２０の接触状態が改善される。 FIG. 5D shows a state in which the substrate Z actuator 250 further lowers the substrate 10 from the state of FIG. 5C and the contact area between the substrate 10 and the mask 220 is increased. At this time, it can be seen that the shape of the substrate 10 is changed due to the stress from the mask 220 and the bending that has occurred in the center of the substrate, causing distortion. In the conventional clamping method and mounting method, this shape change has caused time for alignment of the substrate 10.
However, in the present invention, the clamping force between the pressing tool 302b and the support tool 300 is weaker or zero than the clamping force between the pressing tool 302a and the support tool 300. Therefore, as shown in FIG. 5D, a stress in the direction indicated by the arrow 501 is generated on the substrate 10 between the pressing tool 302 b and the support tool 300 due to the stress from the mask 220. As a result, the bending and distortion of the substrate 10 are eliminated as shown in FIG. 5E, and the contact state between the substrate 10 and the mask 220 is improved.

図６（ａ）は、挟持機構によって基板１０が通常通りに挟持された様子を示し、図３の基板保持ユニットをＺ軸の上方向から見た平面図である。図３の説明で述べたように、短辺側においては、基板の周縁部１０ａが支持具３００に載っているだけで、挟持はされていない。また、長辺側においては、基板の周縁部１０ａが、支持具３００と押圧具３０２の間に挟持されている。   FIG. 6A shows a state in which the substrate 10 is normally held by the holding mechanism, and is a plan view of the substrate holding unit of FIG. As described in the explanation of FIG. 3, on the short side, the peripheral edge portion 10 a of the substrate is merely placed on the support 300 and is not clamped. On the long side, the peripheral edge portion 10 a of the substrate is sandwiched between the support tool 300 and the pressing tool 302.

図６（ｂ）は、図５（ｂ）によって説明した挟持の様子を示す。図中、左側の長辺においては、基板の周縁部１０ａが、通常の挟力で支持具３００と押圧具３０２ａの間に挟持されている。一方、図中右側の長編においては、基板の周縁部１０ａが、左辺よりも弱い挟力で挟持されているか、挟持されていない。これにより、基板１０がマスク２２０に接触した後、矢印５０１で示す方向にズレ力が発生する。   FIG. 6B shows a state of clamping described with reference to FIG. In the left long side in the figure, the peripheral edge portion 10a of the substrate is held between the support tool 300 and the pressing tool 302a by a normal holding force. On the other hand, in the long feature on the right side in the figure, the peripheral edge portion 10a of the substrate is clamped with a clamping force weaker than that of the left side or is not clamped. Thereby, after the substrate 10 comes into contact with the mask 220, a displacement force is generated in the direction indicated by the arrow 501.

本実施例の挟持機構（挟持装置）を用いた挟持方法、かかる挟持機構を含む基板載置装置を用いた基板載置方法によれば、基板１０を載置体であるマスク２２０に載置したとき
の歪みが、挟力の弱い側（または挟力がゼロである側）に基板１０がズレることによって低減または解消される。言い換えると、載置時に基板１０がズレる方向が一定になり、ズレ方（ズレ量や方向）に再現性が出る。これにより、マスク２２０と基板１０とのアライメントを良好に実施可能となるため、アライメント時間短縮及びアライメント精度向上といった効果が得られる。なお、挟持装置とアライメントに用いるカメラ、相対位置を調整する位置調整手段（アクチュエータなど）を合わせて、アライメント機構と考えることもできる。
なお、本実施例の挟持力制御は、第１アライメントの前、第１アライメントと第２アライメントの間、第２アライメントの後、いずれの場面においても適用できる。 According to the clamping method using the clamping mechanism (clamping device) of the present embodiment and the substrate mounting method using the substrate mounting device including the clamping mechanism, the substrate 10 is placed on the mask 220 which is a placement body. The distortion at the time is reduced or eliminated by shifting the substrate 10 to the side where the pinching force is weak (or the side where the pinching force is zero). In other words, the direction in which the substrate 10 is displaced at the time of mounting becomes constant, and reproducibility is exhibited in the direction of displacement (the amount and direction of displacement). As a result, alignment between the mask 220 and the substrate 10 can be carried out satisfactorily, and the effects of shortening the alignment time and improving the alignment accuracy can be obtained. The holding device, the camera used for alignment, and the position adjusting means (such as an actuator) for adjusting the relative position can be combined to be considered as an alignment mechanism.
Note that the clamping force control of this embodiment can be applied to any scene before the first alignment, between the first alignment and the second alignment, and after the second alignment.

＜実施例２＞
実施例１で説明したような、基板１０の長辺のうち一方に通常の挟力をかけ、他方に通常より弱い挟力をかける（または挟力をゼロにする）ような制御であれば、図３に示した基板保持ユニットが備える挟持機構によって実現できる。本実施例では、より精密な挟力制御を行って基板１０の歪みを低減する構成について説明する。 <Example 2>
If the control is such that a normal clamping force is applied to one of the long sides of the substrate 10 and a weaker clamping force than the normal is applied to the other (or the clamping force is zero) as described in the first embodiment, This can be realized by a clamping mechanism provided in the substrate holding unit shown in FIG. In this embodiment, a configuration for reducing distortion of the substrate 10 by performing more precise pinching force control will be described.

図７（ａ）は、本実施例にかかる基板保持ユニットの主要部分を示した模式図である。基板保持ユニットには、それぞれが互いに独立した複数の挟持機構を備えている。図７（ａ）では基板１０の両長辺側に複数の挟持機構が配置され、両短辺側の構成は省略されている。しかし短辺側にも挟持機構を設けても良いし、図３と同様に、短辺側には支持具３００のみを設けても構わない。   FIG. 7A is a schematic diagram showing the main part of the substrate holding unit according to the present embodiment. The substrate holding unit includes a plurality of clamping mechanisms that are independent of each other. In FIG. 7A, a plurality of clamping mechanisms are arranged on both long sides of the substrate 10, and the configuration on both short sides is omitted. However, a clamping mechanism may be provided on the short side, or only the support 300 may be provided on the short side as in FIG.

図７（ｂ）は、本実施例にかかる挟持機構を１つ取り出したものである。それぞれの挟持機構は支持体３０５によって支持された、押圧具３０２および支持具３００を備えている。例えば、制御部２７０の制御に従って、支持体３０５に組み込まれた個別Ｚアクチュエータ（不図示）が押圧具３０２をＺ方向に昇降させることによって、押圧具３０２と支持具３００の間の挟力が変化する。   FIG. 7B shows one clamping mechanism according to this embodiment. Each clamping mechanism includes a pressing tool 302 and a supporting tool 300 supported by a support body 305. For example, the clamping force between the pressing tool 302 and the support tool 300 is changed by an individual Z actuator (not shown) incorporated in the support body 305 moving the pressing tool 302 up and down in the Z direction according to the control of the control unit 270. To do.

例えば、押圧具３０２と支持具４００の状態を、基板１０のズレが発生しないような通常の挟力がかかっている状態、ある程度の力が加わると基板１０がズレるような弱い挟力がかかっている状態、挟力がかかっていない（挟力がゼロである）状態、の間で切り替えることが可能である。すなわち、図７（ｃ）に示すように、押圧具３０２と支持具３００の間の挟力を弱める、あるいはゼロにすることで、基板１０を載置した時に、矢印５０１で示す方向にズレ力が発生する。   For example, the pressing tool 302 and the support tool 400 are in a state where a normal clamping force is applied so that the substrate 10 is not displaced, or a weak clamping force is applied such that the substrate 10 is displaced when a certain amount of force is applied. And a state where no pinching force is applied (the pinching force is zero). That is, as shown in FIG. 7C, when the substrate 10 is placed by weakening or reducing the pinching force between the pressing tool 302 and the support tool 300 to the direction indicated by the arrow 501. Will occur.

挟持機構の個別制御の一例を述べる。図７（ａ）には各長辺に８個の挟持機構が示されているが、このうち一辺において、中央の４つを通常の挟持力とし、端の４つを弱い挟持力とする。また、それに対向する辺においては、挟持力を弱くするか、ゼロにする。これにより、載置により発生した歪みが、挟持力の弱い（またはゼロの）側の長辺方向だけではなく、短辺方向にも逃げやすくなる。   An example of individual control of the clamping mechanism will be described. FIG. 7 (a) shows eight clamping mechanisms on each long side. In one of these, the central four are normal clamping forces and the four ends are weak clamping forces. In addition, on the side opposite to it, the clamping force is weakened or made zero. As a result, the distortion generated by the placement can easily escape not only in the long side direction on the side where the clamping force is weak (or zero) but also in the short side direction.

以上のように、本実施例の構成によれば、複数設けた挟持機構ごと挟力を制御することにより、基板１０が載置体であるマスク２２０に載置されたときのズレの量や方向を精密に制御できるようになる。
なお、本実施例の挟持機構を用いた挟持力制御は、第１アライメントの前、第１アライメントと第２アライメントの間、第２アライメントの後、いずれの場面においても適用できる。 As described above, according to the configuration of the present embodiment, the amount and direction of displacement when the substrate 10 is placed on the mask 220 which is a placement body by controlling the clamping force for each of the plurality of clamping mechanisms provided. Can be controlled precisely.
Note that the clamping force control using the clamping mechanism of the present embodiment can be applied to any scene before the first alignment, between the first alignment and the second alignment, and after the second alignment.

＜実施例３＞
図８（ａ）〜（ｅ）は、本発明の実施例３にかかる基板の挟持および載置処理の流れを
示す図である。各図は、挟持された基板１０を図３に示す基板保持ユニットにて載置体に載置する様子を順次示しており、基板保持ユニットおよび基板１０を図３のＸＺ平面で切断した断面図である。図５と共通する部材には同じ符号を付する。 <Example 3>
FIGS. 8A to 8E are diagrams illustrating the flow of the substrate clamping and placing processes according to the third embodiment of the present invention. Each drawing sequentially shows a state in which the sandwiched substrate 10 is placed on the placement body by the substrate holding unit shown in FIG. 3, and the sectional view of the substrate holding unit and the substrate 10 taken along the XZ plane of FIG. It is. Members common to those in FIG.

図８（ａ）は、搬送ロボット１１９のロボットハンドによって、基板１０が支持具３００と押圧具３０２の間に導入された状態である。また、基板１０の短辺側の周縁部は、短辺側用の支持具３００にて支持されている。   FIG. 8A shows a state in which the substrate 10 is introduced between the support tool 300 and the pressing tool 302 by the robot hand of the transfer robot 119. Further, the peripheral edge portion on the short side of the substrate 10 is supported by a support 300 for the short side.

図８（ｂ）では、ロボットハンドが後退することにより基板１０の長辺側の周縁部が支持具３００にて支持されるとともに、制御部２７０の制御に応じてクランプＺアクチュエータ２５１がクランプ部材３０３を下降させることにより、押圧具３０２ａおよび３０２ｂが下降して、支持具３００との間で基板１０を挟持する。このとき、支持具３００によって支持されていない領域においては、基板１０に撓みが発生している。図８（ｂ）において、図５（ｂ）と同様に、押圧具３０２ａの側に強い挟力が発生し、押圧具３０２ｂの側に弱い挟力が発生する（または挟力が発生しない）ような制御を行う。押圧具３０２ａの側の挟力と押圧具３０２ｂの側の挟力の好適な関係は、図５（ｂ）での説明と同様である。すなわち押圧具３０２ｂの側では、基板１０にかかる力による、押圧具３０２ｂと支持具３００の間にある基板１０が移動可能な程度の力が好ましい。   In FIG. 8B, when the robot hand moves backward, the peripheral edge of the long side of the substrate 10 is supported by the support 300, and the clamp Z actuator 251 is clamped by the clamp member 303 according to the control of the control unit 270. Is lowered, and the pressing tools 302 a and 302 b are lowered to sandwich the substrate 10 with the support tool 300. At this time, in the region not supported by the support tool 300, the substrate 10 is bent. 8B, as in FIG. 5B, a strong pinching force is generated on the pressing tool 302a side, and a weak pinching force is generated on the pressing tool 302b side (or no pinching force is generated). Control. The preferable relationship between the pressing force on the pressing tool 302a side and the pressing force on the pressing tool 302b side is the same as that described with reference to FIG. That is, on the side of the pressing tool 302 b, a force that can move the substrate 10 between the pressing tool 302 b and the support tool 300 by the force applied to the substrate 10 is preferable.

なお、本実施例の基板保持ユニットは、基板１０の中央部を支持する中央支持具３０６を備えている。中央支持具３０６が制御部２７０の制御に従ってＺ方向上下に移動することで、基板１０の撓みをある程度低減できる。図８（ｃ）は、片側の長辺の挟力が弱いかゼロの状態で中央支持具３０６が上昇し、矢印５０１の方向にズレ力が発生する。ここで、基板１０にかかっている挟力は、基板１０が移動可能な程度後からであるため、基板１０が右側にズレる。これにより、基板１０の撓みの一部が解消する。   Note that the substrate holding unit of this embodiment includes a central support 306 that supports the central portion of the substrate 10. The central support 306 moves up and down in the Z direction under the control of the control unit 270, so that the bending of the substrate 10 can be reduced to some extent. In FIG. 8C, the center support 306 is raised while the pinching force on one long side is weak or zero, and a displacement force is generated in the direction of the arrow 501. Here, since the clamping force applied to the substrate 10 is after the substrate 10 can move, the substrate 10 is shifted to the right side. Thereby, a part of bending of the board | substrate 10 is eliminated.

図８（ｄ）において、基板Ｚアクチュエータ２５０が基板１０を下降させ、基板１０がマスク２２０に載置される。このとき、マスク２２０からの応力によって、押圧具３０２ｂと支持具３００の間の基板１０に、矢印５０１で示す方向のズレ力が再び発生する。その結果、図８（ｅ）に示すように基板１０の撓みや歪みが解消し、基板１０とマスク２２０の接触状態が改善される。   In FIG. 8D, the substrate Z actuator 250 lowers the substrate 10 and the substrate 10 is placed on the mask 220. At this time, due to the stress from the mask 220, a displacement force in the direction indicated by the arrow 501 is generated again on the substrate 10 between the pressing tool 302b and the support tool 300. As a result, the bending and distortion of the substrate 10 are eliminated as shown in FIG. 8E, and the contact state between the substrate 10 and the mask 220 is improved.

なお、図８（ｅ）において、カメラ２６０，２６１によるアライメントマークの撮像結果に基づいて第２アライメントを行い、さらに基板１０とマスク２２０の相対位置を調整することも好ましい。その際、押圧具３０２ｂの側の挟力を通常の値にしても良い。これにより、基板１０が安定した状態でアライメントを実施できる。   In FIG. 8E, it is also preferable to perform the second alignment based on the imaging result of the alignment marks by the cameras 260 and 261 and further adjust the relative position between the substrate 10 and the mask 220. At that time, the clamping force on the pressing tool 302b side may be set to a normal value. Thereby, alignment can be performed in a state where the substrate 10 is stable.

以上述べたように、本実施例の挟持機構（挟持装置）を用いた挟持方法、かかる挟持機構を含む基板載置装置を用いた基板載置方法によれば、中央支持具３０６の移動による基板１０のズレと、マスク２２０への載置による基板１０のズレという複数の段階を経て基板１０の歪みが良好に低減される。その結果、アライメント時間短縮及びアライメント精度向上といった効果が得られる。
なお、本実施例の挟持力制御は、第１アライメントの前、第１アライメントと第２アライメントの間、第２アライメントの後、いずれの場面においても適用できる。 As described above, according to the clamping method using the clamping mechanism (clamping device) of the present embodiment and the substrate mounting method using the substrate mounting apparatus including the clamping mechanism, the substrate by the movement of the central support 306 is used. The distortion of the substrate 10 can be satisfactorily reduced through a plurality of stages of displacement of 10 and displacement of the substrate 10 due to placement on the mask 220. As a result, the effects of shortening the alignment time and improving the alignment accuracy can be obtained.
Note that the clamping force control of this embodiment can be applied to any scene before the first alignment, between the first alignment and the second alignment, and after the second alignment.

＜実施例４＞
図９（ａ）〜（ｆ）は、本発明の実施例４にかかる基板の挟持および載置処理の流れを示す図である。各図は、挟持された基板１０を図３に示す基板保持ユニットにて載置体に載置する様子を順次示しており、基板保持ユニットおよび基板１０を図３のＸＺ平面で切断した断面図である。図５、図８と共通する部材には同じ符号を付する。 <Example 4>
FIGS. 9A to 9F are diagrams illustrating the flow of the substrate clamping and placing processes according to the fourth embodiment of the present invention. Each drawing sequentially shows a state in which the sandwiched substrate 10 is placed on the placement body by the substrate holding unit shown in FIG. 3, and the sectional view of the substrate holding unit and the substrate 10 taken along the XZ plane of FIG. It is. Members common to FIGS. 5 and 8 are denoted by the same reference numerals.

図９（ａ）は、図８（ａ）と同様に、ロボットハンドによって基板１０が支持具３００と押圧具３０２の間に導入された状態を示す。   FIG. 9A shows a state in which the substrate 10 is introduced between the support tool 300 and the pressing tool 302 by the robot hand, as in FIG. 8A.

図９（ｂ）では、ロボットハンドが後退することにより基板１０の長辺側の周縁部が支持具３００にて支持される。   In FIG. 9B, the peripheral edge on the long side of the substrate 10 is supported by the support tool 300 by the robot hand moving backward.

図９（ｃ）では、制御部２７０の制御に応じてクランプＺアクチュエータ２５１がクランプ部材３０３を下降させることにより、押圧具３０２ａおよび３０２ｂが下降して、支持具３００との間で基板１０を挟持する。図９（ｃ）においても、押圧具３０２ａの側に強い挟力が発生し、押圧具３０２ｂの側に弱い挟力が発生する（または挟力が発生しない）ような制御を行う。さらに、図９（ｃ）においては、中央支持具３０６がＺ方向に上昇して基板１０と接触することにより矢印５０１の方向にズレ力が発生して、基板１０が紙面上右側にズレている。これにより、基板１０の撓みの一部が解消している。   In FIG. 9C, the clamp Z actuator 251 lowers the clamp member 303 according to the control of the control unit 270, so that the pressing tools 302 a and 302 b are lowered and the substrate 10 is sandwiched between the support tool 300. To do. Also in FIG. 9C, control is performed such that a strong pinching force is generated on the pressing tool 302a side and a weak pinching force is generated on the pressing tool 302b side (or no pinching force is generated). Further, in FIG. 9C, when the central support 306 is raised in the Z direction and comes into contact with the substrate 10, a displacement force is generated in the direction of the arrow 501 so that the substrate 10 is displaced to the right on the paper surface. . Thereby, a part of bending of the board | substrate 10 is eliminated.

図９（ｄ）は、本実施例に特有の操作であり、基板１０をマスク２２０に載置する前に、カメラ２６０によるアライメントマークの撮像結果に基づいて基板１０とマスク２２０との相対位置を調整する第１アライメントを行っている。このように、基板１０がマスク２２０に接触する前に第１アライメントを行うことで、その後、マスク２２０への接触後に行われる第２アライメントの精度が向上する。   FIG. 9D shows an operation unique to the present embodiment. Before placing the substrate 10 on the mask 220, the relative position between the substrate 10 and the mask 220 is determined based on the result of imaging the alignment mark by the camera 260. The first alignment to be adjusted is performed. Thus, by performing the first alignment before the substrate 10 contacts the mask 220, the accuracy of the second alignment performed after the contact with the mask 220 is improved thereafter.

図９（ｅ）において、基板Ｚアクチュエータ２５０の動作によって基板１０がマスク２２０に載置される。このとき、マスク２２０からの応力によって、押圧具３０２ｂと支持具３００の間の基板１０に、矢印５０１で示す方向のズレ力が再び発生する。その結果、図９（ｆ）に示すように基板１０の撓みや歪みが解消し、基板１０とマスク２２０の接触状態が改善される。なお、図９（ｆ）において、カメラ２６１によるアライメントマークの撮像結果に基づいて第２アライメントを行い、さらに基板１０とマスク２２０の相対位置を調整することも好ましい。その際、押圧具３０２ｂの側の挟力を通常の値にしても良い。これにより、基板１０の挟持位置が固定可能となり、かつ、対向する両辺の挟力が同じになるため、安定的にアライメントを実施できる。   In FIG. 9E, the substrate 10 is placed on the mask 220 by the operation of the substrate Z actuator 250. At this time, due to the stress from the mask 220, a displacement force in the direction indicated by the arrow 501 is generated again on the substrate 10 between the pressing tool 302b and the support tool 300. As a result, the bending and distortion of the substrate 10 are eliminated as shown in FIG. 9F, and the contact state between the substrate 10 and the mask 220 is improved. In FIG. 9F, it is also preferable to perform the second alignment based on the imaging result of the alignment mark by the camera 261 and further adjust the relative position between the substrate 10 and the mask 220. At that time, the clamping force on the pressing tool 302b side may be set to a normal value. As a result, the holding position of the substrate 10 can be fixed, and the holding forces on the opposite sides are the same, so that the alignment can be stably performed.

以上述べたように、本実施例の挟持機構（挟持装置）を用いた挟持方法、かかる挟持機構を含む基板載置装置を用いた基板載置方法によれば、中央支持具３０６の移動による基板１０のズレと、第１アライメントと、マスク２２０への載置による基板１０のズレという複数の段階を経て基板１０の位置ズレや歪みが良好に低減される。その結果、アライメント時間短縮及びアライメント精度向上といった効果が得られる。
なお、本実施例の挟持力制御は、第１アライメントの前、第１アライメントと第２アライメントの間、第２アライメントの後、いずれの場面においても適用できる。 As described above, according to the clamping method using the clamping mechanism (clamping device) of the present embodiment and the substrate mounting method using the substrate mounting apparatus including the clamping mechanism, the substrate by the movement of the central support 306 is used. The positional deviation and distortion of the substrate 10 can be satisfactorily reduced through a plurality of stages of deviation of 10, first alignment, and deviation of the substrate 10 due to placement on the mask 220. As a result, the effects of shortening the alignment time and improving the alignment accuracy can be obtained.
Note that the clamping force control of this embodiment can be applied to any scene before the first alignment, between the first alignment and the second alignment, and after the second alignment.

１０：基板、２１０：基板保持ユニット、２２０：マスク、２５１：基板Ｚアクチュエータ、２７０：制御部、３００：支持具、３０２：押圧具   10: Substrate, 210: Substrate holding unit, 220: Mask, 251: Substrate Z actuator, 270: Control unit, 300: Support tool, 302: Pressing tool

Claims (31)

基板の周縁部を挟持するための複数の挟持具を有する挟持手段と、
前記基板を載置体の上に載置するための載置手段とを有する基板載置装置であって、
前記挟持手段は、前記複数の挟持具の挟力を可変する挟力可変手段を有し、
前記挟力可変手段は、前記複数の挟持具のうちの一部の挟持具の挟力を、その他の挟持具とは独立して可変することを特徴とする基板載置装置。 Clamping means having a plurality of clamping tools for clamping the peripheral edge of the substrate;
A substrate mounting device having mounting means for mounting the substrate on a mounting body,
The clamping means has clamping force variable means for varying the clamping force of the plurality of clamping tools,
The substrate mounting apparatus, wherein the clamping force varying means varies the clamping force of a part of the plurality of clamping tools independently of the other clamping tools. 前記一部の挟持具は、前記基板の周縁部のうちの一辺内を挟持する挟持具であり、前記その他の挟持具は、前記基板の周縁部のうちの前記一辺と対向した辺内を挟持する挟持具であることを特徴とする請求項１に記載の基板載置装置。   The part of the sandwiching tool is a sandwiching tool that sandwiches one side of the peripheral portion of the substrate, and the other sandwiching tool sandwiches the inside of the peripheral portion of the substrate that faces the one side. The substrate mounting apparatus according to claim 1, wherein the substrate mounting apparatus is a holding tool. 前記一部の挟持具、及び、前記その他の挟持具は、夫々複数の挟持具で構成されることを特徴とする請求項１または２に記載の基板載置装置。   3. The substrate mounting apparatus according to claim 1, wherein each of the part of the clamping tools and the other clamping tool includes a plurality of clamping tools. 4. 基板の周縁部を挟持するための複数の挟持具を有する挟持手段と、
前記基板を載置体の上に載置するための載置手段とを有する基板載置装置であって、
前記挟持手段は、前記複数の挟持具の挟力を可変する挟力可変手段を有し、
前記挟力可変手段は、前記複数の挟持具の挟力を、挟持具ごとに夫々独立して可変する挟力可変手段であることを特徴とする基板載置装置。 Clamping means having a plurality of clamping tools for clamping the peripheral edge of the substrate;
A substrate mounting device having mounting means for mounting the substrate on a mounting body,
The clamping means has clamping force variable means for varying the clamping force of the plurality of clamping tools,
The substrate mounting apparatus, wherein the clamping force varying means is a clamping force varying means that varies the clamping force of the plurality of clamping tools independently for each clamping tool. 前記複数の挟持具のうちの一部の挟持具は、前記基板の周縁部のうちの一辺内を挟持する挟持具であり、その他の挟持具は、前記基板の周縁部のうちの前記一辺と対向した辺内を挟持する挟持具であることを特徴とする請求項４に記載の基板載置装置。   A part of the plurality of holding tools is a holding tool that holds the inside of one side of the peripheral portion of the substrate, and the other holding tools are the one side of the peripheral portion of the substrate. The substrate mounting apparatus according to claim 4, wherein the substrate mounting apparatus is a holding tool that holds the opposite sides. 前記一部の挟持具、及び、前記その他の挟持具は、夫々複数の挟持具で構成されていることを特徴とする請求項５に記載の基板載置装置。   The substrate mounting apparatus according to claim 5, wherein each of the part of the holding tools and the other holding tool includes a plurality of holding tools. 前記挟持手段の挟持具は、前記基板を支持するための支持具と、前記基板を前記支持具に押圧するための押圧具とを有することを特徴とする請求項１〜６のいずれか１項に記載の基板載置装置。   The clamping tool of the clamping means includes a support tool for supporting the substrate and a pressing tool for pressing the substrate against the support tool. The substrate mounting apparatus according to the above. 前記載置手段は、前記基板を昇降させるための基板昇降手段を有することを特徴とする請求項１〜７のいずれか１項に記載の基板載置装置。   The substrate mounting apparatus according to claim 1, wherein the placing unit includes a substrate lifting unit for moving the substrate up and down. 前記載置手段は、前記載置体を昇降させるための載置体昇降手段を有することを特徴とする請求項１〜８のいずれか１項に記載の基板載置装置。   The substrate placing apparatus according to claim 1, wherein the placing means includes placing body lifting / lowering means for lifting and lowering the placing body. 請求項１〜９のいずれか１項に記載の基板載置装置と、
前記基板と前記載置体との相対位置を調整するための位置調整手段を有することを特徴とするアライメント装置。 The substrate mounting apparatus according to any one of claims 1 to 9,
An alignment apparatus comprising: a position adjusting means for adjusting a relative position between the substrate and the mounting body. 前記載置体は、前記基板上に所定パターンの成膜を行うために用いられる、前記所定パターンを有するマスクであることを特徴とする請求項１０に記載のアライメント装置。   The alignment apparatus according to claim 10, wherein the mounting body is a mask having the predetermined pattern, which is used to form a predetermined pattern on the substrate. 請求項１１に記載のアライメント装置を有し、前記基板上に前記所定パターンの成膜を行うことを特徴とする成膜装置。   A film forming apparatus comprising the alignment apparatus according to claim 11, wherein the predetermined pattern is formed on the substrate. 基板の周縁部を複数の挟持具で挟持する挟持工程と、
挟持された前記基板を載置体の上に載置する載置工程とを有する基板載置方法であって
、
前記挟持工程は、複数の挟持具のうちの、一部の挟持具の挟力とその他の挟持具の挟力とを異ならせて、前記基板を挟持することを特徴とする基板載置方法。 A clamping step of clamping the peripheral edge of the substrate with a plurality of clamping tools;
A substrate mounting method including a mounting step of mounting the sandwiched substrate on a mounting body,
In the clamping step, the substrate is clamped by differentiating the clamping force of some clamping tools and the clamping force of other clamping tools among the plurality of clamping tools. 前記挟持工程は、前記一部の挟持具で前記基板の周縁部のうちの一辺内を挟持し、前記その他の挟持具で前記基板の周縁部のうちの前記一辺と対向した辺内を挟持することを特徴とする請求項１３に記載の基板載置方法。   In the clamping step, the inside of one side of the peripheral part of the substrate is clamped by the part of the clamping tool, and the inside of the side facing the one side of the peripheral part of the substrate is clamped by the other clamping tool. The substrate mounting method according to claim 13. 前記挟持工程は、前記一部の挟持具と前記その他の挟持具のうち一方の挟持具が、挟持している前記基板の挟持位置が移動可能な挟力で前記基板を挟持することを特徴とする請求項１３または１４に記載の基板載置方法。   The clamping step is characterized in that one of the clamping devices and the other clamping device clamps the substrate with a clamping force that can move the clamping position of the substrate being clamped. The substrate mounting method according to claim 13 or 14. 前記挟持位置が移動可能な挟力は、前記載置工程において前記載置体から前記基板にかかる力によって、挟持位置が移動可能な挟力であることを特徴とする請求項１５に記載の基板載置方法。   16. The substrate according to claim 15, wherein the clamping force that allows the clamping position to move is a clamping force that allows the clamping position to be moved by a force applied to the substrate from the placement body in the placement step. Placement method. 前記載置工程は、前記基板を前記載置体に載置した後に、前記一部の挟持具と前記その他の挟持具とが、同じ挟力で前記基板を挟持することを特徴とする請求項１３〜１６のいずれか１項に記載の基板載置方法。   2. The mounting step according to claim 1, wherein after the substrate is placed on the mounting body, the partial clamping tool and the other clamping tool clamp the substrate with the same clamping force. The substrate mounting method according to any one of 13 to 16. 前記載置工程は、前記基板を前記載置体に載置した後に、前記一部の挟持具と前記その他の挟持具とが、前記基板の挟持位置を固定可能な挟力で前記基板を挟持することを特徴とする請求項１３〜１６のいずれか１項に記載の基板載置方法。   In the placing step, after the substrate is placed on the placing body, the part of the sandwiching tool and the other sandwiching tool sandwich the substrate with a sandwiching force capable of fixing the sandwiching position of the substrate. The substrate mounting method according to claim 13, wherein the substrate mounting method is performed. 基板の周縁部を挟持具で挟持する挟持工程と、
挟持された前記基板を載置体の上に載置する載置工程とを有する基板載置方法であって、
前記挟持工程は、前記挟持具で、前記基板の周縁部のうちの一辺内を挟持することを特徴とする基板載置方法。 A clamping step of clamping the peripheral edge of the substrate with a clamping tool;
A substrate mounting method including a mounting step of mounting the sandwiched substrate on a mounting body,
In the clamping step, the inside of one side of the peripheral portion of the substrate is clamped by the clamping tool. 前記挟持工程は、前記挟持具の複数で、前記基板の周縁部のうちの一辺内を挟持することを特徴とする請求項１９に記載の基板載置方法。   20. The substrate mounting method according to claim 19, wherein in the clamping step, a plurality of the clamping tools are clamped within one side of the peripheral edge of the substrate. 前記載置工程は、前記基板を載置体に載置した後に、前記挟持具で前記基板の周縁部のうちの一辺内を挟持し、その他の挟持具で前記基板の周縁部のうちの前記一辺と対向した辺内を挟持することを特徴とする請求項１９または２０に記載の基板載置方法。   In the placing step, after placing the substrate on a placing body, the holding tool sandwiches one side of the peripheral portion of the substrate, and the other holding device holds the one of the peripheral portions of the substrate. 21. The substrate mounting method according to claim 19, wherein the inside of the side facing one side is sandwiched. 前記挟持具と前記その他の挟持具は、前記基板を前記載置体に載置した後では、同じ挟力で前記基板を挟持することを特徴とする請求項２１に記載の基板載置方法。   The substrate holding method according to claim 21, wherein the holding device and the other holding device hold the substrate with the same holding force after the substrate is placed on the mounting body. 前記挟持具と前記その他の挟持具とは、前記基板を前記載置体に載置した後では、前記基板の挟持位置が固定可能な挟力で前記基板を挟持することを特徴とする請求項２１に記載の基板載置方法。   The holding device and the other holding device hold the substrate with a holding force capable of fixing a holding position of the substrate after the substrate is placed on the mounting body. 22. The substrate mounting method according to 21. 前記載置工程の前に、前記基板と前記載置体との相対位置を調整する第１の位置調整工程を有することを特徴とする請求項１３〜２３のいずれか１項に記載の基板載置方法。   The substrate mounting according to any one of claims 13 to 23, further comprising a first position adjusting step of adjusting a relative position between the substrate and the mounting body before the placing step. Placement method. 請求項１３〜２４のいずれか１項に記載の基板載置方法により、前記基板を前記載置体の上に載置した後に、前記基板と前記載置体との相対位置を調整する第２の位置調整工程を有することを特徴とするアライメント方法。   25. A second method of adjusting a relative position between the substrate and the mounting body after mounting the substrate on the mounting body by the substrate mounting method according to any one of claims 13 to 24. An alignment method comprising the step of adjusting the position. 請求項１３〜２４のいずれか１項に記載の基板載置方法により、前記基板を前記載置体の上に載置した後に、前記基板を前記載置体から離間して、前記基板と前記載置体との相対位置を調整する第２の位置調整工程を有することを特徴とするアライメント方法。   The substrate mounting method according to any one of claims 13 to 24, wherein after placing the substrate on the mounting body, the substrate is separated from the mounting body, and the substrate and the front An alignment method comprising: a second position adjustment step of adjusting a relative position with the placing object. 前記載置体は、前記基板上に所定パターンの成膜を行うために用いられる、前記所定パターンを有するマスクであることを特徴とする請求項２５または２６に記載のアライメント方法。   27. The alignment method according to claim 25 or 26, wherein the mounting body is a mask having the predetermined pattern used to form a predetermined pattern on the substrate. 前記基板上に所定パターンの成膜を行う成膜方法であって、請求項２７に記載のアライメント方法により、前記基板と前記マスクとの相対位置の調整が行われた後に、前記基板上に前記所定パターンの成膜を行うことを特徴とする成膜方法。   28. A film forming method for forming a predetermined pattern on the substrate, wherein after the relative position of the substrate and the mask is adjusted by the alignment method according to claim 27, the substrate is formed on the substrate. A film forming method, wherein a film having a predetermined pattern is formed. 基板上に形成された有機膜を有する電子デバイスの製造方法であって、
請求項２８に記載の成膜方法により前記有機膜が形成されることを特徴とする電子デバイスの製造方法。 A method of manufacturing an electronic device having an organic film formed on a substrate,
29. A method of manufacturing an electronic device, wherein the organic film is formed by the film forming method according to claim 28. 基板上に形成された金属膜を有する電子デバイスの製造方法であって、
請求項２８に記載の成膜方法により前記金属膜が形成されることを特徴とする電子デバイスの製造方法。 A method of manufacturing an electronic device having a metal film formed on a substrate,
29. A method of manufacturing an electronic device, wherein the metal film is formed by the film forming method according to claim 28. 前記電子デバイスが、有機ＥＬ表示装置の表示パネルであることを特徴とする請求項２９または３０に記載の電子デバイスの製造方法。   The method of manufacturing an electronic device according to claim 29 or 30, wherein the electronic device is a display panel of an organic EL display device.
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