JP2018178237A5

JP2018178237A5 -

Info

Publication number: JP2018178237A5
Application number: JP2017084770A
Authority: JP
Filing date: 2017-04-21
Publication date: 2020-01-23
Anticipated expiration: 2037-04-21

Claims

非導電性基材の最表面に、ルテニウム（Ｒｕ）層またはルテニウム合金層が設けられた積層めっき被覆材であって、
非導電性基材と、ルテニウム層またはルテニウム合金層との間に、
下地層としての、ニッケル（Ｎｉ）層と、
その上に中間層としての、Ｓｎ、ＳｎＮｉ、ＳｎＣｏ、ＳｎＣｕ、ＳｎＰｄ、ＳｎＡｇ、ＮｉＷ、またはＮｉＷＰからなる層と
を有することを特徴とする、積層めっき被覆材。 A laminated plating coating material provided with a ruthenium (Ru) layer or a ruthenium alloy layer on the outermost surface of a non-conductive substrate,
Between the non-conductive substrate and the ruthenium or ruthenium alloy layer,
A nickel (Ni) layer as an underlayer;
A laminated plating coating material comprising, as an intermediate layer, a layer made of Sn, SnNi, SnCo, SnCu, SnPd, SnAg, NiW, or NiWP .

非導電性基材において、下地層と接する表面が導電処理されてなる、請求項１に記載の積層めっき被覆材。 The laminated plating coating material according to claim 1, wherein a surface of the non-conductive substrate that is in contact with the underlayer is subjected to a conductive treatment.

下地層の代わりに、非導電性基材の表面が導電処理されて形成された導電処理面を有する、請求項１に記載の積層めっき被覆材。 The multilayer plating coating material according to claim 1, wherein the surface of the non-conductive substrate has a conductive treatment surface formed by conducting a conductive treatment instead of the underlayer.

非導電性基材が、樹脂またはセラミックからなる、請求項１〜３のいずれか一項に記載の積層めっき被覆材。 The laminated plating covering material according to any one of claims 1 to 3, wherein the non-conductive substrate is made of resin or ceramic.

非導電性基材の表面上に、
Ｎｉめっきにより、下地層を形成させ、
下地層の上に、Ｓｎ、ＳｎＮｉ、ＳｎＣｏ、ＳｎＣｕ、ＳｎＰｄ、ＳｎＡｇ、ＮｉＷ、またはＮｉＷＰのめっきにより、中間層を形成させ、
中間層の上に、ルテニウムめっきまたはルテニウム合金めっきにより、最表面層を形成させる
工程を含む、積層めっき被覆材の製造方法。 On the surface of the non-conductive substrate,
The base layer is formed by Ni plating,
An intermediate layer is formed on the underlayer by plating of Sn, SnNi, SnCo, SnCu, SnPd, SnAg, NiW, or NiWP ,
A method for producing a laminated plating covering material, comprising a step of forming an outermost surface layer on an intermediate layer by ruthenium plating or ruthenium alloy plating.

非導電性基材の表面が導電処理した後、下地層を形成させる、請求項５に記載の方法。 The method according to claim 5 , wherein the underlayer is formed after the surface of the non-conductive substrate is subjected to the conductive treatment.

下地層を形成させる代わりに、非導電性基材の表面を導電処理して導電処理面を形成させる、請求項５に記載の方法。
The method according to claim 5 , wherein instead of forming the underlayer, the surface of the non-conductive substrate is subjected to conductive treatment to form a conductive treated surface.