JP2018177895A - Resin composition, insulation varnish, and application thereof - Google Patents
Resin composition, insulation varnish, and application thereof Download PDFInfo
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Abstract
Description
本発明はフラーレンを含む樹脂組成物、絶縁ワニス及びその用途に関する。 The present invention relates to a resin composition containing fullerene, an insulating varnish, and uses thereof.
周知のごとく、発電機や回転電機に組み込まれるコイルは、電気を流すための導体同士間や導体と対地間とを絶縁するための絶縁層を具備している。 As well known, a coil incorporated in a generator or a rotating electrical machine has an insulating layer for insulating between conductors for conducting electricity and between the conductor and the ground.
また、六フッ化硫黄ガス絶縁開閉装置や管路気中送電装置などの送変電機器においては、例えば金属容器内で高圧導体を絶縁支持する絶縁部材として注型部が用いられている。 Moreover, in a power transmission / transformation apparatus such as a sulfur hexafluoride gas insulated switchgear or a duct air-in-air power transmission apparatus, for example, a casting part is used as an insulating member for insulatingly supporting a high voltage conductor in a metal container.
このような高電圧機器の絶縁層や注型部材には、エポキシ樹脂をベース材料とする絶縁樹脂材料が用いられるのが一般的である。 In general, an insulating resin material having an epoxy resin as a base material is used for the insulating layer and the cast member of such a high voltage device.
ところで、前記絶縁コイルの絶縁層はマイカなどからなるマイカ紙をエポキシ樹脂で含浸して製造されることが多く（例えば特許文献１参照）、マイカ自体が部分放電に対して優れた耐性を有しているため、絶縁層全体としても耐部分放電性が発現している。 The insulating layer of the insulating coil is often manufactured by impregnating mica paper made of mica or the like with an epoxy resin (see, for example, Patent Document 1), and mica itself has excellent resistance to partial discharge. Therefore, partial discharge resistance is developed even in the entire insulating layer.
更に、近年、産業用低圧モーターなどでは、インバータによる可変速駆動の普及に伴い、インバータサージによりモーターが損傷しないよう、モーターの巻線の絶縁被膜材料として耐部分放電性の高い材料が求められている。 Furthermore, in recent years, with the spread of variable-speed drive by inverters in industrial low-voltage motors, etc., a material with high partial discharge resistance is required as an insulating film material of motor windings so that the motor is not damaged by inverter surge. There is.
このような点に対して、エポキシ系ワニスにシリカゾルを均一に分散添加して耐サージ性を付与した例が報告されている（特許文献２参照）。 With respect to such a point, there has been reported an example in which a silica sol is uniformly dispersed and added to an epoxy-based varnish to impart surge resistance (see Patent Document 2).
前述したマイカやシリカゾル等の無機粒子含有ワニスは、その無機粒子のために粘度が高くなり、そのため電気機器のコイルへの含浸率が低いと言う欠点があった。含浸率が低いと、ワニスが含浸されていない個所はボイドとなり、耐サージ性や耐部分放電性が劣る。 The above-mentioned inorganic particle-containing varnish such as mica and silica sol has a disadvantage that the viscosity is high due to the inorganic particles, and therefore the impregnation ratio to the coil of the electric device is low. If the impregnation rate is low, the portions not impregnated with the varnish become void, and the surge resistance and the partial discharge resistance are inferior.
本発明は、前記した従来技術の欠点を解消するため、高い絶縁破壊電圧が得られ、粘性の低い樹脂組成物を提供することにある。 The present invention is to provide a resin composition with high viscosity and low viscosity, in order to solve the above-mentioned disadvantages of the prior art.
すなわち、本発明は以下の発明を含む。
［１］ エポキシ樹脂中にフラーレンが分散し、前記フラーレンの含有量が０．１〜３質量％である樹脂組成物。
［２］ 前記フラーレンは、Ｃ６０およびＣ７０以上の高次のフラーレンを含む前項［１］に記載の樹脂組成物。
［３］ 前項［１］または［２］に記載の樹脂組成物と硬化剤とを含む絶縁ワニス。
［４］ 前項［３］に記載の絶縁ワニスの硬化物が、絶縁層として用いられているコイル。
［５］ 前項［３］に記載の絶縁ワニスの硬化物が、絶縁材料として用いられている電気機器。
That is, the present invention includes the following inventions.
[1] A resin composition in which a fullerene is dispersed in an epoxy resin, and the content of the fullerene is 0.1 to 3% by mass.
[2] The resin composition according to the above [1], wherein the fullerene comprises a C 60 and a C 70 or higher fullerene.
[3] An insulating varnish comprising the resin composition as described in the preceding item [1] or [2] and a curing agent.
[4] A coil in which the cured product of the insulating varnish according to [3] above is used as an insulating layer.
[5] An electric device in which the cured product of the insulating varnish according to [3] above is used as an insulating material.
本発明によれば、絶縁破壊電圧が高く、かつ低粘度のエポキシ樹脂組成物を提供することができる。 According to the present invention, it is possible to provide an epoxy resin composition having a high breakdown voltage and a low viscosity.
以下、本発明の実施形態に係る樹脂組成物について説明する。 Hereinafter, the resin composition concerning the embodiment of the present invention is explained.
本実施形態の樹脂組成物は、エポキシ樹脂にフラーレンが分散しており、フラーレンの含有量は０．１〜３質量％である。なお、フラーレンがＣ６０，Ｃ７０など、異なるフラーレン種の混合物であるときは、それらの合計含有量をフラーレン含有量とする。 In the resin composition of the present embodiment, fullerene is dispersed in an epoxy resin, and the content of fullerene is 0.1 to 3% by mass. Incidentally, fullerenes such as C 60, C 70, when a mixture of different fullerene species, the total content of them to the fullerene content.
（製造方法）
フラーレンは直径１ｎｍ程度の分子で、通常は数十μｍの大きさに凝集して存在する。エポキシ樹脂に凝集したフラーレンを直接添加して機械的に混合しても分散させるのは難しい。非特許文献１によると、フラーレンは、芳香族炭化水素には良く溶解し、ハロゲン化炭素に少し溶解する。フラーレンとエポキシ樹脂共に溶解する溶媒を選択し、それぞれの溶液を作製し、それら溶液を混合した後、溶媒を除去することにより、エポキシ樹脂中にフラーレンを均一に分散させることができる。溶媒の除去は、エバポレータなどを使って溶媒を留去する方法などが挙げられる。なお、具体的な前記溶媒としては、トルエンやエチルベンゼンが溶解性の観点から好ましい。
(Production method)
The fullerene is a molecule having a diameter of about 1 nm, and is usually present in the form of several tens of μm in size. It is difficult to disperse the fullerenes directly added to the epoxy resin by direct addition and mechanical mixing. According to Non-patent Document 1, fullerenes dissolve well in aromatic hydrocarbons and dissolve slightly in halogenated carbons. It is possible to uniformly disperse the fullerene in the epoxy resin by selecting a solvent that dissolves both the fullerene and the epoxy resin, preparing each solution, mixing the solutions, and removing the solvent. The removal of the solvent may, for example, be a method of distilling off the solvent using an evaporator or the like. In addition, as a specific said solvent, toluene and ethylbenzene are preferable from a soluble viewpoint.
(フラーレン)
本実施形態に用いるフラーレンは、Ｃ６０であっても良いし、Ｃ７０であってもよく、Ｃ７０より高次のフラーレンでもよい。さらに、フラーレンは、それらの混合物であってもよい。これは、フラーレンの電子受容体としての特徴は、Ｃ６０だけでなくＣ７０以上の高次フラーレンの全てに共通した特徴であるためである。
(Fullerene)
Fullerene used in the present embodiment may be a C 60, may be a C 70, may be higher fullerenes from C 70. Furthermore, the fullerene may be a mixture thereof. This is because the characteristics of fullerene as an electron acceptor are common to not only C60 but also C70 or higher higher fullerenes.
一般にフラーレンは、Ｃ６０やＣ７０以上の高次フラーレンの混合物で得られる。このため、過度な精製を行なわずに得たフラーレン混合物は、比較的安価であり、容易に入手可能であり好ましい。 In general, fullerenes are obtained from a mixture of C 60 and C 70 or higher higher-order fullerenes. For this reason, fullerene mixtures obtained without excessive purification are relatively inexpensive, readily available and preferred.
エポキシ樹脂中のフラーレン含有量が多くなるに従って、硬化後のエポキシ樹脂の絶縁破壊電圧は大きくなる（図１を参照）。ただし、絶縁破壊電圧は、エポキシ樹脂組成物中のフラーレン含有量が１質量％付近になると高止まりしてくる。その後一定となり、同含有量が２質量％付近を越えると次第に減少してくる。このため、フラーレンの含有量としては０．１〜３質量％であり、０．３〜２．５質量％が好ましく、０．４〜２質量％がより好ましく、０．７〜１．５質量％がさらに好ましい。 As the fullerene content in the epoxy resin increases, the breakdown voltage of the cured epoxy resin increases (see FIG. 1). However, the dielectric breakdown voltage is high when the content of fullerene in the epoxy resin composition is around 1% by mass. After that, it becomes constant, and gradually decreases when the content exceeds 2% by mass. Therefore, the content of the fullerene is 0.1 to 3% by mass, preferably 0.3 to 2.5% by mass, more preferably 0.4 to 2% by mass, and 0.7 to 1.5% by mass. % Is more preferred.
フラーレン含有量が多くなり過ぎると、フラーレンの凝集が起こり、絶縁破壊電圧向上の効果が抑制されると推定される。 When the content of fullerenes is too large, it is presumed that aggregation of fullerenes occurs and the effect of improving the breakdown voltage is suppressed.
（エポキシ樹脂）
本実施形態で用いるエポキシ樹脂は特に限定は無いが、絶縁ワニス用に使用されるものであれば好ましく用いることができる。エポキシ樹脂としては、例えば、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビスフェノール型エポキシ樹脂、ビフェノール型エポキシ樹脂、ナフタレン骨格含有エポキシ樹脂、複素環式エポキシ樹脂等を挙げることができる。
(Epoxy resin)
The epoxy resin used in the present embodiment is not particularly limited, but it can be preferably used if it is used for an insulating varnish. Examples of the epoxy resin include phenol novolac epoxy resin, cresol novolac epoxy resin, bisphenol epoxy resin, biphenol epoxy resin, naphthalene skeleton-containing epoxy resin, heterocyclic epoxy resin and the like.
フェノールノボラック型エポキシ樹脂としては、例えばＥＰＩＣＬＯＮ（登録商標）Ｎ−７７０（ＤＩＣ株式会社製）、ｊＥＲ（登録商標）−１５２（三菱化学株式会社製）等が挙げられる。 As a phenol novolak-type epoxy resin, EPICLON (registered trademark) N-770 (made by DIC Corporation), jER (registered trademark)-152 (made by Mitsubishi Chemical Corporation) etc. are mentioned, for example.
クレゾールノボラック型エポキシ樹脂としては、例えばＥＰＩＣＬＯＮ（登録商標）Ｎ−６９５（ＤＩＣ株式会社製）、ＥＯＣＮ（登録商標）−１０２Ｓ（日本化薬株式会社製）等が挙げられる。 Examples of cresol novolac epoxy resin include EPICLON (registered trademark) N-695 (manufactured by DIC Corporation), EOCN (registered trademark)-102S (manufactured by Nippon Kayaku Co., Ltd.), and the like.
ビスフェノール型エポキシ樹脂としては、例えばｊＥＲ（登録商標）８２８、ｊＥＲ（登録商標）１００１（三菱化学株式会社製）、ＹＤ−１２８（商品名、新日鉄住金化学株式会社製）等のビスフェノールＡ型エポキシ樹脂、ｊＥＲ（登録商標）８０６（三菱化学株式会社製）、ＹＤＦ−１７０（商品名、新日鉄住金化学株式会社製）等のビスフェノールＦ型エポキシ樹脂等が挙げられる。 Examples of bisphenol-type epoxy resins include bisphenol A-type epoxy resins such as jER (registered trademark) 828, jER (registered trademark) 1001 (manufactured by Mitsubishi Chemical Corporation), YD-128 (trade name, manufactured by Nippon Steel Sumikin Chemical Co., Ltd.) And bisphenol E-type epoxy resins such as JER (registered trademark) 806 (manufactured by Mitsubishi Chemical Corporation), YDF-170 (trade name, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), and the like.
ビフェノール型エポキシ樹脂としては、例えばｊＥＲ（登録商標）ＹＸ−４０００、ｊＥＲ（登録商標）ＹＬ−６１２１Ｈ（三菱化学株式会社製）等が挙げられる。 As a biphenol type epoxy resin, jER (registered trademark) YX-4000, jER (registered trademark) YL-6121H (made by Mitsubishi Chemical Corporation) etc. are mentioned, for example.
ナフタレン骨格含有エポキシ樹脂としては、例えばＮＣ−７０００（商品名、日本化薬株式会社製）、ＥＸＡ−４７５０（商品名、ＤＩＣ株式会社製）等が挙げられる。 As a naphthalene frame | skeleton containing epoxy resin, NC-7000 (a brand name, Nippon Kayaku Co., Ltd. make), EXA-4750 (a brand name, DIC Corporation make) etc. are mentioned, for example.
脂環式エポキシ樹脂としては、例えばＥＨＰＥ（登録商標）−３１５０（ダイセル化学工業株式会社製）等が挙げられる。 As an alicyclic epoxy resin, EHPE (registered trademark)-3150 (made by Daicel Chemical Industries, Ltd.) etc. are mentioned, for example.
複素環式エポキシ樹脂としては、例えばＴＥＰＩＣ（登録商標），ＴＥＰＩＣ−Ｌ，ＴＥＰＩＣ−Ｈ、ＴＥＰＩＣ−Ｓ（日産化学工業株式会社製）等が挙げられる。 As a heterocyclic epoxy resin, TEPIC (trademark), TEPIC-L, TEPIC-H, TEPIC-S (made by Nissan Chemical Industries, Ltd.) etc. are mentioned, for example.
（粘度）
さて、一般的に樹脂に無機材料を添加すると粘度が増大する。しかし、本実施形態のフラーレンを分散させたエポキシ樹脂では、一般的な無機材料を添加結果とは逆に、フラーレン未添加のエポキシ樹脂より粘度が低くなる。そのため、本実施形態のエポキシ樹脂を用いて作製される絶縁ワニスは含浸性に優れたものとなる。
(viscosity)
Now, generally, when an inorganic material is added to a resin, the viscosity increases. However, in the epoxy resin in which the fullerene of this embodiment is dispersed, the viscosity is lower than that of the non-fullerene-added epoxy resin, contrary to the addition result of the general inorganic material. Therefore, the insulation varnish produced using the epoxy resin of this embodiment becomes the thing excellent in impregnatability.
（絶縁ワニス）
前記樹脂組成物と硬化剤と混合して、絶縁ワニスを作製できる。硬化剤としては、用いるエポキシ樹脂を硬化させられるものであればよく、特に制限されない。また、絶縁ワニスには、必要に応じて重合開始剤等、硬化剤以外の添加剤をさらに添加してもよい。
(Insulating varnish)
The insulating varnish can be prepared by mixing the resin composition and a curing agent. The curing agent is not particularly limited as long as it can cure the epoxy resin to be used. Moreover, you may further add additives other than a hardening agent, such as a polymerization initiator, as needed to an insulation varnish.
（用途）
この絶縁ワニスを加熱等により硬化させて、電気機器の絶縁材料として好ましく用いることができる。例えば、モーターの巻線のコイルに前記絶縁ワニスを含浸させて硬化させ、絶縁層とを形成できる。
(Use)
The insulating varnish can be cured by heating or the like to be preferably used as an insulating material for electrical devices. For example, the coil of the motor winding may be impregnated with the insulating varnish and cured to form an insulating layer.
以下に本発明の実施例を示し、本発明をより具体的に説明する。なお、これらは説明のための単なる例示であって、本発明はこれらによって何ら制限されるものではない。 Hereinafter, the present invention will be described more specifically by showing examples of the present invention. In addition, these are only examples for description, and this invention is not restrict | limited at all by these.
実施例１〜９：
（樹脂組成物の作製）
エポキシ樹脂であるＪＥＲ８２８（三菱化学社製）と、フラーレンであるナノム（登録商標）ミックス（フロンティアカーボン社製、Ｃ６０６１質量％、Ｃ７０２８質量％、Ｃ７０より大きい高次のフラーレン１１質量％を含有する混合物）を、トルエン（関東化学社製）に、それぞれ溶解させて、エポキシ樹脂の１０質量％溶液およびフラーレン０．２質量％溶液を作製した。
Examples 1 to 9:
(Preparation of a resin composition)
Epoxy resin JER 828 (Mitsubishi Chemical Co., Ltd.) and fullerene NEMOM (registered trademark) mix (FRONTIER CARBON CO., LTD., C 60 61% by mass, C 70 28% by mass, higher-order fullerene 11% larger than C 70 %) Were respectively dissolved in toluene (manufactured by Kanto Chemical Co., Ltd.) to prepare a 10% by mass solution of an epoxy resin and a 0.2% by mass solution of a fullerene.
それぞれの溶液を、樹脂組成物中のフラーレンが表１に記載の含有量となるような割合で混合して混合溶液を作製した。 The respective solutions were mixed at such a ratio that the content of fullerene in the resin composition was as shown in Table 1 to prepare a mixed solution.
エバポレータを使って混合溶液からトルエンを留去し、さらに真空乾燥機を使って、真空下１６０℃に1時間放置しトルエンを除き、フラーレン含有エポキシ組成物を得た。 The toluene was distilled off from the mixed solution using an evaporator, and the mixture was allowed to stand at 160 ° C. under vacuum for 1 hour using a vacuum dryer to remove the toluene, to obtain a fullerene-containing epoxy composition.
（樹脂組成物のシートの作製）
得られたエポキシ樹脂組成物に硬化剤であるＨＮ−２２００（日立化成社製）および硬化促進剤である１−シアノエチル−２−エチル−４−メチルイミダゾール（和光純薬工業社製）をエポキシ樹脂組成物１００質量部に対してそれぞれ８０質量部、１質量部を混合した。
(Preparation of a sheet of a resin composition)
The obtained epoxy resin composition was cured with HN-2200 (made by Hitachi Chemical Co., Ltd.) as a curing agent and 1-cyanoethyl-2-ethyl-4-methylimidazole (made by Wako Pure Chemical Industries, Ltd.) as a curing accelerator. 80 parts by mass and 1 part by mass were mixed with 100 parts by mass of the composition, respectively.
この混合液を１ｍｍ厚のシートが作製できる枠に流し入れて、乾燥機を使って７０℃、１２時間の加熱硬化を行って、樹脂シートを作製した。 The mixed solution was poured into a frame capable of producing a 1 mm thick sheet, and heat curing was performed at 70 ° C. for 12 hours using a drier to produce a resin sheet.
（絶縁破壊電圧の測定）
絶縁破壊試験装置ＹＳＴ−２４３−１００ＲＨ０（ヤマヨ試験器社製）を用い、ＪＩＳ法のＣ２１１０−１に準拠し、２０秒段階法で絶縁破壊電圧を測定した。
まず、絶縁破壊電圧を測定する予定の箇所のシートの厚みを測定した。次に、樹脂シートをシリコン油浴中に入れて、樹脂シートの厚み方向から上下に直径２５ｍｍの電極で挟み、所定の電圧で２０秒間絶縁破壊されなければ、昇圧ステップを繰り返し、絶縁破壊される前の設定電圧を絶縁破壊電圧とした。なお、２０ｋＶまでは１ｋＶずつ昇圧し、２０ｋＶ以降は２ｋＶずつ昇圧した。なお、絶縁破壊電圧を測定する雰囲気を２３±２℃、５０±５％ＲＨとした。表１に、測定結果を示した。
(Measurement of breakdown voltage)
The dielectric breakdown voltage was measured by a 20-second step method using a dielectric breakdown test apparatus YST-243-100RH0 (manufactured by Yamayo Test Instruments Co., Ltd.) in accordance with JIS C2110-1.
First, the thickness of the sheet at the place where the breakdown voltage was to be measured was measured. Next, the resin sheet is put in a silicone oil bath and sandwiched between electrodes of 25 mm in diameter vertically from the thickness direction of the resin sheet, and if the insulation breakdown does not occur for 20 seconds at a predetermined voltage, the pressure rising step is repeated and the insulation breaks down The previous set voltage was taken as the breakdown voltage. The voltage was boosted by 1 kV each to 20 kV, and was boosted by 2 kV each after 20 kV. The atmosphere for measuring the dielectric breakdown voltage was 23 ± 2 ° C. and 50 ± 5% RH. Table 1 shows the measurement results.
比較例１：
エポキシ樹脂であるＪＥＲ８２８（三菱化学社製）に硬化剤であるＨＮ−２２００（日立化成社製）及び硬化促進剤である１−シアノエチル−２−エチル−４−メチルイミダゾール（和光純薬工業社製）をエポキシ樹脂１００質量部に対してそれぞれ８０質量部、１質量部の割合で添加して撹拌混合して、この混合液を１ｍｍ厚のシートが作製できる枠に流し入れて、乾燥機を使って７０℃、１２時間の加熱硬化を行って、樹脂シートを作製した。この樹脂シートを用い実施例１と同様に絶縁破壊電圧の測定を行った。表１に、測定結果を示した。
Comparative Example 1:
Epoxy resin JER 828 (Mitsubishi Chemical Co., Ltd.), curing agent HN-2200 (Hitachi Chemical Co., Ltd.) and curing accelerator 1-cyanoethyl-2-ethyl-4-methylimidazole (Wako Pure Chemical Industries, Ltd.) 80 parts by weight and 1 part by weight with respect to 100 parts by weight of the epoxy resin, stirring and mixing, the mixed solution is poured into a frame capable of producing a sheet of 1 mm thickness, and a dryer is used. Heat curing was performed at 70 ° C. for 12 hours to produce a resin sheet. The dielectric breakdown voltage was measured in the same manner as in Example 1 using this resin sheet. Table 1 shows the measurement results.
実施例１０：
（粘度測定）
実施例１と同様に樹脂組成物を作製した。ただし、樹脂組成物中のフラーレン含有量が３質量％となるように、エポキシ樹脂溶液とフラーレン溶液とを混合した。
Example 10:
(Viscosity measurement)
A resin composition was produced in the same manner as in Example 1. However, the epoxy resin solution and the fullerene solution were mixed so that the fullerene content in the resin composition was 3% by mass.
作製した樹脂組成物をコーンプレート型のＥ型粘度計（ＢＲＯＯＫＦＩＥＬＤ社製）に約０．２ｇ装填して２５℃の雰囲気で剪断速度を変えて粘度を測定した。 About 0.2 g of the produced resin composition was loaded on a cone-plate type E-type viscometer (manufactured by BROOKFIELD), and the viscosity was measured by changing the shear rate in an atmosphere at 25 ° C.
比較例２：
比較例１で用いたエポキシ樹脂についても、実施例１０と同様に粘度を測定した。
Comparative example 2:
The viscosity of the epoxy resin used in Comparative Example 1 was also measured in the same manner as in Example 10.
実施例１０及び比較例２の結果を図２に示す。図２では剪断速度に対する粘度の変化をプロットした。全ての剪断速度域でフラーレンを含むエポキシ樹脂組成物の粘度の方がフラーレンを添加していないエポキシ樹脂より低くなった。
The results of Example 10 and Comparative Example 2 are shown in FIG. The change in viscosity versus shear rate is plotted in FIG. The viscosity of the epoxy resin composition containing fullerene was lower than that of the epoxy resin to which no fullerene was added in all shear rate regions.
Claims (5)
An electric device in which the cured product of the insulating varnish according to claim 3 is used as an insulating material.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2021100881A3 (en) * | 2020-03-30 | 2021-07-15 | 東タイ株式会社 | Method for producing fullerene derivative-containing resin composition, fullerene derivative-containing resin composition obtained from same, resin paint, resin coating, and enamel wire |
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| JP2004177772A (en) * | 2002-11-28 | 2004-06-24 | Jsr Corp | Photosetting composition and its use |
| JP2008001730A (en) * | 2006-06-20 | 2008-01-10 | Yaskawa Electric Corp | Epoxy resin composition for vacuum, its manufacturing method and equipment for vacuum using the resin |
| JP2008231288A (en) * | 2007-03-22 | 2008-10-02 | Toray Ind Inc | Epoxy resin composition for fiber-reinforced composite material, prepreg and fiber-reinforced composite material |
| CN105255112A (en) * | 2015-10-29 | 2016-01-20 | 国家纳米科学中心 | Epoxy resin fullerene composite material and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2004177772A (en) * | 2002-11-28 | 2004-06-24 | Jsr Corp | Photosetting composition and its use |
| JP2008001730A (en) * | 2006-06-20 | 2008-01-10 | Yaskawa Electric Corp | Epoxy resin composition for vacuum, its manufacturing method and equipment for vacuum using the resin |
| JP2008231288A (en) * | 2007-03-22 | 2008-10-02 | Toray Ind Inc | Epoxy resin composition for fiber-reinforced composite material, prepreg and fiber-reinforced composite material |
| CN105255112A (en) * | 2015-10-29 | 2016-01-20 | 国家纳米科学中心 | Epoxy resin fullerene composite material and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2021100881A3 (en) * | 2020-03-30 | 2021-07-15 | 東タイ株式会社 | Method for producing fullerene derivative-containing resin composition, fullerene derivative-containing resin composition obtained from same, resin paint, resin coating, and enamel wire |
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