JP2018150444A - Heat-melting composition and use of the same - Google Patents
Heat-melting composition and use of the same Download PDFInfo
- Publication number
- JP2018150444A JP2018150444A JP2017046889A JP2017046889A JP2018150444A JP 2018150444 A JP2018150444 A JP 2018150444A JP 2017046889 A JP2017046889 A JP 2017046889A JP 2017046889 A JP2017046889 A JP 2017046889A JP 2018150444 A JP2018150444 A JP 2018150444A
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- Prior art keywords
- heat
- ethylene
- mass
- container
- copolymer
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- IAQRGUVFOMOMEM-ONEGZZNKSA-N trans-but-2-ene Chemical compound C\C=C\C IAQRGUVFOMOMEM-ONEGZZNKSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 235000013618 yogurt Nutrition 0.000 description 1
Landscapes
- Packages (AREA)
- Wrappers (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
本発明は、熱溶融性組成物及びそれを用いてなる蓋材に関する。また、蓋材を用いてなる密封容器に関する。 The present invention relates to a heat-meltable composition and a lid material using the same. Moreover, it is related with the sealed container which uses a cover material.
従来からヨーグルト、ゼリー菓子、プリン、乳酸菌飲料、シロップ等の内容物を食品容器に入れ、予め熱溶融性組成物等が塗布された熱接着可能な蓋材により封緘し、密封包装物が形成される食品包装材料が使用されている。これらの内容物を封緘する蓋材に用いられる熱溶融性組成物には、内容物を充填した食品容器を密封するためのシール性能及び開封強度を有し、容器を開封する際に内容物が飛散することを防止する易剥離性、容器を開封する際に内容物が蓋に付着していない非付着性、容器を開封する際に熱溶融性組成物が容器のフランジに残らないこと、運搬時や落下時に容器内の内容物が飛散しない耐衝撃性等が要求されている。そこで、従来、上記の包装用としてのホットメルト接着剤について、下記特許文献１〜２に示されるような種々の提案がなされてきた。 Traditionally, yogurt, jelly confectionery, pudding, lactic acid bacteria beverages, syrup, etc. are put in food containers and sealed with a heat-adhesive lid that has been pre-coated with a hot-melt composition, etc. to form a sealed package. Food packaging materials are used. The heat-meltable composition used for the lid for sealing these contents has a sealing performance and an opening strength for sealing the food container filled with the contents. Easily peelable to prevent scattering, non-adhesiveness when the contents are not attached to the lid when opening the container, no heat-meltable composition remaining on the flange of the container when opening the container, transportation There is a demand for impact resistance so that the contents in the container do not scatter when being dropped or dropped. Therefore, conventionally, various proposals as shown in Patent Documents 1 and 2 have been made for the hot melt adhesive for packaging.
特許文献１に開示されたホットメルト接着剤組成物は、低温塗工性に優れているが、接着性においては剥離時の接着強度は制御されておらず、基材破壊をする設計であるため、開封強度が強く、粘着付与樹脂の使用量が多いことから剥離時に容器のフランジ部分に接着剤残りが発生するという課題があった。 Although the hot melt adhesive composition disclosed in Patent Document 1 is excellent in low-temperature coating properties, the adhesive strength at the time of peeling is not controlled in adhesiveness, and it is designed to break the substrate. Since the opening strength is strong and the amount of the tackifying resin used is large, there is a problem that an adhesive residue is generated in the flange portion of the container at the time of peeling.
特許文献２に開示されたホットメルト接着剤組成物は、粘着付与樹脂を含まないため被着体汚染は抑制されるが、粘着付与樹脂、エチレン酢酸ビニル共重合体も含まないため、シール適正範囲（温度、時間、圧力）が狭く、シール性や開封強度が劣る課題があった。 The hot melt adhesive composition disclosed in Patent Document 2 contains no tackifying resin, so that adherend contamination is suppressed. However, since it does not contain a tackifying resin or an ethylene vinyl acetate copolymer, the proper sealing range (Temperature, time, pressure) was narrow, and there were problems of poor sealing properties and unsealing strength.
本発明は、内容物を充填した食品容器を密封するための適切なシール性能及び開封強度を有し、容器の開封時に容易に剥離することができ、容器の開封時に内容物が付着することなく、容器の開封時に容器のフランジに熱溶融性組成物が残ることなく、運搬時、落下時においても内容物が飛散しない耐衝撃性を有する熱溶融性組成物の提供を目的とする。 The present invention has an appropriate sealing performance and opening strength for sealing a food container filled with the contents, can be easily peeled when the container is opened, and the contents do not adhere when the container is opened. An object of the present invention is to provide a heat-meltable composition having an impact resistance that prevents the contents from scattering even during transportation or dropping without leaving the heat-meltable composition on the flange of the container when the container is opened.
本発明は、エチレン酢酸ビニル共重合体（Ａ）、オレフィン系ポリマー（Ｂ）、ワックス（Ｃ）及び粘着付与樹脂（Ｄ）を含む熱溶融性組成物であって、
荷重２１．１８Ｎ、１９０℃で測定したＭＦＲが１００〜２７００（ｇ／１０分）であるエチレン酢酸ビニル共重合体（Ａ）：２〜２５質量％、
荷重２１．１８Ｎ、１９０℃で測定したＭＦＲが０．５〜６０（ｇ／１０分）であるオレフィン系ポリマー（Ｂ）：１０〜４０質量％、
融点が４０〜６５℃のワックス（Ｃ）：３５〜６５質量％、
軟化点が１００〜１６０℃の粘着付与樹脂（Ｄ）：３〜２５質量％、
を含む熱溶融性組成物に関する。
The present invention is a hot-melt composition comprising an ethylene vinyl acetate copolymer (A), an olefin polymer (B), a wax (C) and a tackifying resin (D),
Ethylene vinyl acetate copolymer (A) having an MFR measured at a load of 21.18 N and 190 ° C. of 100 to 2700 (g / 10 min): 2 to 25% by mass,
Olefin polymer (B) having a MFR measured at a load of 21.18 N and 190 ° C. of 0.5 to 60 (g / 10 min): 10 to 40% by mass,
Wax (C) having a melting point of 40 to 65 ° C .: 35 to 65% by mass,
Tackifying resin (D) having a softening point of 100 to 160 ° C .: 3 to 25% by mass,
The present invention relates to a hot melt composition.
また本発明は、オレフィン系ポリマー（Ｂ）が、エチレンと１−オクテンとの共重合体を含む、上記熱溶融性組成物に関する。 Moreover, this invention relates to the said heat-meltable composition in which an olefin type polymer (B) contains the copolymer of ethylene and 1-octene.
また本発明は、蓋基材上に、上記熱溶融性組成物からなる熱溶融層を有する蓋材に関する。 Moreover, this invention relates to the cover material which has a heat melting layer which consists of the said thermomeltable composition on a cover base material.
また本発明は、蓋基材が、樹脂シート、紙、ガラス及びアルミニウムからなる群から選択される少なくとも２種以上が任意の構成で積層された積層体である上記蓋材に関する。 The present invention also relates to the above lid material, wherein the lid base material is a laminate in which at least two or more selected from the group consisting of a resin sheet, paper, glass and aluminum are laminated in an arbitrary configuration.
さらに本発明は、容器の開口部が、上記蓋材における熱溶融性組成物層でヒートシールされてなる、開封可能な密封容器に関する。 The present invention further relates to an openable sealed container in which the opening of the container is heat-sealed with a hot-melt composition layer in the lid.
本発明により、内容物を充填した食品容器を密封するための適切なシール性能及び開封強度を有し、容器の開封時に容易に剥離することができ、容器の開封時に内容物が付着することなく、容器の開封時に容器のフランジに熱溶融性組成物が残ることなく、運搬時、落下時においても内容物が飛散しない耐衝撃性を有する熱溶融性組成物を提供することが出来た。 According to the present invention, it has an appropriate sealing performance and opening strength for sealing a food container filled with the contents, can be easily peeled when the container is opened, and the contents are not attached when the container is opened. It was possible to provide a heat-meltable composition having impact resistance in which the contents do not scatter during transportation and dropping without leaving the heat-meltable composition on the flange of the container when the container is opened.
本発明は、オレフィン系ポリマーを含む熱溶融性組成物であり、強固な接着性と接着剤残りのしない剥離性のバランスを維持することにより、優れた蓋材として好適に用いられることを達成するという効果を有するものである。
以下、本発明を詳細について説明する。
The present invention is a heat-meltable composition containing an olefin-based polymer, and achieves being suitably used as an excellent lid material by maintaining a balance between strong adhesiveness and peelability without adhesive residue. It has the effect.
Hereinafter, the present invention will be described in detail.
＜エチレン酢酸ビニル共重合体（Ａ）＞
本発明のエチレン酢酸ビニル共重合体（Ａ）は、酢酸ビニル由来の構成単位の含有量が１０〜３５質量％、かつ１９０℃、２１．１８Ｎにおけるメルトフローレートが１００〜２７００ｇ／１０分の範囲であり、エチレン及び酢酸ビニルを共重合したものである。
<Ethylene vinyl acetate copolymer (A)>
In the ethylene-vinyl acetate copolymer (A) of the present invention, the content of structural units derived from vinyl acetate is 10 to 35% by mass, and the melt flow rate at 190 ° C. and 21.18 N is in the range of 100 to 2700 g / 10 minutes. It is a copolymer of ethylene and vinyl acetate.
エチレン酢酸ビニル共重合体（Ａ）中の酢酸ビニル由来の構成単位は、エチレン酢酸ビニル共重合体全体を１００質量％とした場合に１０〜３５質量％の範囲であることが好ましく、１２〜３２質量％の範囲がより好ましく、1３〜３０質量％の範囲が特に好ましい。酢酸ビニル由来の構成単位の質量が前記範囲内であると、接着性及び耐ブロッキング性に優れる。 The structural unit derived from vinyl acetate in the ethylene vinyl acetate copolymer (A) is preferably in the range of 10 to 35% by mass when the total amount of ethylene vinyl acetate copolymer is 100% by mass, The range of mass% is more preferable, and the range of 13 to 30 mass% is particularly preferable. When the mass of the structural unit derived from vinyl acetate is within the above range, the adhesion and blocking resistance are excellent.
エチレン酢酸ビニル共重合体（Ａ）のメルトフローレートは１００〜２７００ｇ／１０分の範囲であることが重要であり、より好ましくは１５０〜２６００ｇ／１０分であり、さらに好ましくは２００〜２５００ｇ／１０分であり、特に好ましくは、２５０〜２４００である。なお、本発明においてメルトフローレートとは、ＪＩＳ Ｋ７２１０に準拠して測定を行い、ヒーターで加熱された円筒容器内で一定量の樹脂などを温度１９０℃、荷重２１．１８Ｎで加圧し、容器底部に設けられた開口部（ノズル）から１０分間あたりに押出された樹脂などの量を測定した値を示し、「ｇ／１０分」で表示する。 It is important that the melt flow rate of the ethylene vinyl acetate copolymer (A) is in the range of 100 to 2700 g / 10 minutes, more preferably 150 to 2600 g / 10 minutes, and even more preferably 200 to 2500 g / 10. Minute, particularly preferably 250 to 2400. In the present invention, the melt flow rate is measured according to JIS K7210, and a certain amount of resin or the like is pressurized at a temperature of 190 ° C. and a load of 21.18 N in a cylindrical container heated by a heater, A value obtained by measuring the amount of resin or the like extruded per 10 minutes from the opening (nozzle) provided in is shown in “g / 10 minutes”.
＜オレフィン系ポリマー（Ｂ）＞
本発明のオレフィン系ポリマー（Ｂ）は、１９０℃、２１．１８Ｎにおけるメルトフローレートが０．５〜６０ｇ／１０分の範囲にあるものである。オレフィンの単独重合体でも、オレフィンの共重合体でもよく、具体的には、ポリエチレン、ポリプロピレン、ポリブテン、ポリイソブチレン、ポリペンテン、ポリヘキセン、ポリヘプテン、ポリオクテン、ポリデテン等の単独重合体、エチレンとエチレン以外のオレフィンとの共重合体、プロピレンとエチレン、プロピレン以外のオレフィンとの共重合体、エチレン、プロピレン以外のオレフィンとエチレン、プロピレン以外のオレフィンの共重合体が挙げられ、エチレンとエチレン以外のオレフィンとの共重合体がより好ましい。
<Olefin polymer (B)>
The olefin polymer (B) of the present invention has a melt flow rate at 190 ° C. and 21.18 N in the range of 0.5 to 60 g / 10 min. An olefin homopolymer or an olefin copolymer may be used. Specifically, a homopolymer such as polyethylene, polypropylene, polybutene, polyisobutylene, polypentene, polyhexene, polyheptene, polyoctene, polydeten, or an olefin other than ethylene and ethylene. Copolymers of propylene and ethylene, olefins other than propylene, ethylene, copolymers of olefins other than propylene and ethylene, olefins other than propylene, and copolymers of ethylene and olefins other than ethylene. A polymer is more preferred.
エチレン以外のオレフィンとしては、１−プロピレン、１−ブテン、１−ペンテン、１−ヘキセン、１−ヘプテン、１−オクテン、１−ノネン、１−デセン、ｃｉｓ−２−ブテン、ｔｒａｎｓ−２−ブテン、イソブチレン、ｃｉｓ−２−ペンテン、ｔｒａｎｓ−２−ペンテン、３−メチル−１−ブテン、２−メチル−２−ブテン及び２，３−ジメチル−２−ブテン等が挙げられる。 Examples of olefins other than ethylene include 1-propylene, 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 1-nonene, 1-decene, cis-2-butene, and trans-2-butene. , Isobutylene, cis-2-pentene, trans-2-pentene, 3-methyl-1-butene, 2-methyl-2-butene and 2,3-dimethyl-2-butene.
エチレン以外のオレフィンとしては、炭素数が３〜１０のオレフィンが好ましく、１−プロピレン、１−ブテン、１−ヘキセン、１−オクテンがより好ましく、１−ブテン、１−オクテンが特に好ましい。 As olefins other than ethylene, olefins having 3 to 10 carbon atoms are preferable, 1-propylene, 1-butene, 1-hexene and 1-octene are more preferable, and 1-butene and 1-octene are particularly preferable.
エチレンとエチレン以外のオレフィンとの共重合体としては、エチレン−１−プロピレン共重合体、エチレン−１-ブテン共重合体、エチレン−１−ヘキセン共重合体、エチレン−１−オクテン共重合体、エチレン−１−デセン共重合体などが挙げられる。これらの中でも、エチレン−１−ブテン共重合体、エチレン−１−オクテン共重合体が好ましい。 As a copolymer of ethylene and an olefin other than ethylene, an ethylene-1-propylene copolymer, an ethylene-1-butene copolymer, an ethylene-1-hexene copolymer, an ethylene-1-octene copolymer, An ethylene-1-decene copolymer is exemplified. Among these, an ethylene-1-butene copolymer and an ethylene-1-octene copolymer are preferable.
プロピレンとエチレン、プロピレン以外のオレフィンとの共重合体としては、プロピレン−１−ブテン共重合体、プロピレン−１−ヘキセン共重合体、プロピレン−１−オクテン共重合体、プロピレン−１−デセン共重合体などが挙げられる。これらの中でも、プロピレン−１−ブテン共重合体、プロピレン−１−オクテン共重合体が好ましい。 Examples of copolymers of propylene and ethylene, and olefins other than propylene include propylene-1-butene copolymer, propylene-1-hexene copolymer, propylene-1-octene copolymer, propylene-1-decene copolymer Examples include coalescence. Among these, a propylene-1-butene copolymer and a propylene-1-octene copolymer are preferable.
エチレン、プロピレン以外のオレフィンとエチレン、プロピレン以外のオレフィンとの共重合体としては、１−ブテン−１−ヘキセン共重合体、１−ブテン−１−オクテン共重合体、１−ブテン−１−デセン共重合体、１−オクテン−１−デセン共重合体などが挙げられる。これらの中でも、１−ブテン−１−オクテン共重合体、１−オクテン−１−デセン共重合体が好ましい。 Examples of copolymers of ethylene and olefins other than propylene and ethylene and olefins other than propylene include 1-butene-1-hexene copolymer, 1-butene-1-octene copolymer, and 1-butene-1-decene. Examples thereof include a copolymer and a 1-octene-1-decene copolymer. Among these, a 1-butene-1-octene copolymer and a 1-octene-1-decene copolymer are preferable.
本発明のオレフィン系ポリマー（Ｂ）は、単独または２種以上が使用できるが、メルトフローレートの異なる２種類のオレフィン系ポリマーを使用することが好ましい。中でも、エチレン−１−ブテン共重合体及びエチレン−１−オクテン共重合体の併用が好ましい。 Although the olefin polymer (B) of the present invention can be used alone or in combination of two or more, it is preferable to use two types of olefin polymers having different melt flow rates. Especially, combined use of an ethylene-1-butene copolymer and an ethylene-1-octene copolymer is preferable.
＜ワックス（Ｃ）＞
上記熱溶融性組成物の必須成分であるワックス（Ｃ）としては特に限定されないが、例えば、パラフィンワックス、マイクロクリスタリンワックス、モンタンワックス、フィッシャートロプシュワックス、ポリエチレンワックス、ポリプロピレンワックス、ポリエチレン・ポリプロピレンワックス、カルナバワックス、低分子量ポリエチレン、低分子量ポリプロピレン、低分子量エチレン・プロピレン共重合物、低分子量エチレン・プロピレン共重合物の酸化物、低分子量エチレン・ブテン共重合体、低分子量プロピレン・ブテン・エチレン共重合物、低分子量エチレン・プロピレン共重合物のスチレングラフト物、エチレン・プロピレン共重合物の無水マレイン酸化物、プロピレン・ブテン・エチレン共重合物の無水マレイン酸化物などの変性ワックス等が挙げられる。これらの中でも、パラフィンワックスが好ましい。これらのワックスは、単独または２種以上使用できる。
<Wax (C)>
The wax (C), which is an essential component of the hot melt composition, is not particularly limited. For example, paraffin wax, microcrystalline wax, montan wax, Fischer-Tropsch wax, polyethylene wax, polypropylene wax, polyethylene / polypropylene wax, carnauba Wax, low molecular weight polyethylene, low molecular weight polypropylene, low molecular weight ethylene / propylene copolymer, oxide of low molecular weight ethylene / propylene copolymer, low molecular weight ethylene / butene copolymer, low molecular weight propylene / butene / ethylene copolymer Styrene graft product of low molecular weight ethylene / propylene copolymer, anhydrous maleic oxide of ethylene / propylene copolymer, anhydrous maleic oxide of propylene / butene / ethylene copolymer, etc. Sex wax. Among these, paraffin wax is preferable. These waxes can be used alone or in combination of two or more.
ワックス（Ｃ）の融点は４０〜６５℃であることが重要であり、好ましくは４６〜６３℃の範囲が好ましく、より好ましくは４７〜６２℃であり、特に好ましくは、５０〜６０℃である。なお、本発明において融点とは、示差走査熱量計（ＤＳＣ）測定で、１０℃／分で昇温した際のピークトップの温度である。 It is important that the melting point of the wax (C) is 40 to 65 ° C., preferably 46 to 63 ° C., more preferably 47 to 62 ° C., and particularly preferably 50 to 60 ° C. . In the present invention, the melting point is the peak top temperature when the temperature is raised at 10 ° C./min by differential scanning calorimetry (DSC) measurement.
＜粘着付与樹脂（Ｄ）＞
上記熱溶融性組成物の必須成分である粘着付与樹脂（Ｄ）としては、例えば、テルペン系樹脂、水素添加されたテルペン系樹脂、ロジン系樹脂、水素添加されたロジン系樹脂、炭化水素系樹脂、水素添加された炭化水素系樹脂、エポキシ系樹脂、水素添加されたエポキシ系樹脂、ポリアミド系樹脂、水素添加されたポリアミド系樹脂、エラストマー系樹脂、水素添加されたエラストマー系樹脂、フェノール系樹脂、水素添加されたフェノール系樹脂、ケトン系樹脂、水素添加されたケトン系樹脂、石油系樹脂、水素添加された石油系樹脂、スチレン系樹脂及び水素添加されたスチレン系樹脂などが挙げられる。これらの粘着付与樹脂は、単独または２種以上使用できる。これらの中でも、水素添加された石油系樹脂が好ましい。
<Tackifying resin (D)>
Examples of the tackifying resin (D) that is an essential component of the hot-melt composition include, for example, terpene resins, hydrogenated terpene resins, rosin resins, hydrogenated rosin resins, and hydrocarbon resins. , Hydrogenated hydrocarbon resins, epoxy resins, hydrogenated epoxy resins, polyamide resins, hydrogenated polyamide resins, elastomer resins, hydrogenated elastomer resins, phenol resins, Examples include hydrogenated phenolic resins, ketone resins, hydrogenated ketone resins, petroleum resins, hydrogenated petroleum resins, styrene resins, and hydrogenated styrene resins. These tackifying resins can be used alone or in combination of two or more. Of these, hydrogenated petroleum resins are preferred.
粘着付与樹脂（Ｄ）の軟化点は１００〜１６０℃以下であることが重要であり、好ましくは１１０〜１５０℃の範囲が好ましく、より好ましくは１１５〜１４５℃であり、特に好ましくは１１７〜１４３℃である。なお、本発明で軟化点とは、ＪＩＳ Ｋ ６８６３に規定される方法により求められる温度である。すなわち、規定の環に粘着付与樹脂（Ｄ）を充填し、熱媒体中に入れて水平に保持し、粘着付与樹脂（Ｄ）の中央に規定の球を置き、一定の割合で熱媒体の温度を上昇させたとき、粘着付与樹脂（Ｄ）の軟化により球が沈み、環台の底板に触れたときの温度である。 It is important that the softening point of the tackifier resin (D) is 100 to 160 ° C or less, preferably 110 to 150 ° C, more preferably 115 to 145 ° C, and particularly preferably 117 to 143. ° C. In the present invention, the softening point is a temperature determined by a method defined in JIS K 6863. That is, a prescribed ring is filled with a tackifier resin (D), placed in a heat medium and held horizontally, a prescribed sphere is placed in the center of the tackifier resin (D), and the temperature of the heat medium at a constant rate. Is the temperature when the ball sinks due to the softening of the tackifier resin (D) and touches the bottom plate of the ring base.
本発明の熱溶融性組成物は、前記エチレン酢酸ビニル共重合体（Ａ）、前記オレフィン系ポリマー（Ｂ）、前記ワックス（Ｃ）、及び前記粘着付与樹脂（Ｄ）を、（Ａ）：（Ｂ）：（Ｃ）：（Ｄ）＝２〜２５：１０〜４０：３５〜６５：３〜２５（質量％）
の組成で含有するものであり、（Ａ）：（Ｂ）：（Ｃ）：（Ｄ）＝３〜２３：１２〜３８：３８〜６３：５〜２３（質量％）の組成で含有することが好ましい。但し、（Ａ）〜（Ｄ）の合計を１００質量％とする。エチレン酢酸ビニル共重合体（Ａ）、粘着付与樹脂（Ｄ）の含有量は、主に開封強度と耐衝撃性とのバランスに影響を及ぼす。また、オレフィン系ポリマー（Ｂ）の含有量は、剥離感、被着体汚染に影響を及ぼす。さらに、ワックス（Ｃ）の含有量は、主に耐ブロッキング性、生産性及び凝集力の両立に影響を及ぼす。
The hot-melt composition of the present invention comprises the ethylene vinyl acetate copolymer (A), the olefin polymer (B), the wax (C), and the tackifying resin (D). B): (C): (D) = 2 to 25:10 to 40:35 to 65: 3 to 25 (mass%)
It is contained with the composition of (A) :( B) :( C) :( D) = 3-23: 12-38: 38-63: 5-23 (mass%) Is preferred. However, the total of (A) to (D) is 100% by mass. The contents of the ethylene vinyl acetate copolymer (A) and the tackifier resin (D) mainly affect the balance between the opening strength and the impact resistance. Further, the content of the olefin polymer (B) affects the feeling of peeling and adherend contamination. Furthermore, the content of the wax (C) mainly affects the compatibility between blocking resistance, productivity and cohesion.
＜その他成分＞
本発明の熱溶融性組成物は、任意成分として酸化防止剤、疎水性酸化物微粒子、シランカップリング剤、シリコーンオイル、ブロッキング防止剤などを含有できる。
<Other ingredients>
The hot-melt composition of the present invention can contain an antioxidant, hydrophobic oxide fine particles, silane coupling agent, silicone oil, anti-blocking agent and the like as optional components.
酸化防止剤としては、例えば、ペンタエリスリトールテトラキス［３−（３，５−ジ−ｔ−ブチル−４−ヒドロキシフェニル）プロピオネート］、オクタデシル−３−（３，５−ジ−ｔ−ブチル−４−ヒドロキシフェニル）プロピオネート、ジエチル〔［３，５−ビス（１，１−ジメチルエチル）−４−ヒドロキシフェニル］メチル〕ホスフォネート、４，６−ビス（オクチルチオメチル）−ｏ−クレゾール、エチレンビス（オキシエチレン）ビス［３−（５−ｔ−ブチル−４−ヒドロキシ−ｍ−トリル］プロピオネート、トリス（２，４−ジ−ｔ−ブチルフェニル）フォスファイト、ビス（２，４−ジ−ｔ−ブチルフェニル）ペンタエリスリトールジフォスファイト等が挙げられる。 Examples of the antioxidant include pentaerythritol tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate], octadecyl-3- (3,5-di-t-butyl-4- Hydroxyphenyl) propionate, diethyl [[3,5-bis (1,1-dimethylethyl) -4-hydroxyphenyl] methyl] phosphonate, 4,6-bis (octylthiomethyl) -o-cresol, ethylenebis (oxy Ethylene) bis [3- (5-t-butyl-4-hydroxy-m-tolyl] propionate, tris (2,4-di-t-butylphenyl) phosphite, bis (2,4-di-t-butyl) Phenyl) pentaerythritol diphosphite and the like.
フェノール系酸化防止剤は、ペンタエリスリトールテトラキス［３−（３，５−ジ−ｔ−ブチル−４−ヒドロキシフェニル）プロピオネート］が好ましく、リン系酸化防止剤は、トリス（２，４−ジ−ｔ−ブチルフェニル）フォスファイトが好ましい。これらは単独または２種以上が使用できる。 The phenolic antioxidant is preferably pentaerythritol tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate], and the phosphorus antioxidant is tris (2,4-di-t. -Butylphenyl) phosphite is preferred. These can be used alone or in combination of two or more.
疎水性酸化物微粒子としては、例えば、シリカ（二酸化ケイ素）、アルミナ、チタニア、酸化カルシウム、炭酸カルシウム、硫酸カルシウム、ケイ酸カルシウム等が挙げられる。これらは単独または２種以上が使用できる。 Examples of the hydrophobic oxide fine particles include silica (silicon dioxide), alumina, titania, calcium oxide, calcium carbonate, calcium sulfate, and calcium silicate. These can be used alone or in combination of two or more.
シランカップリング剤としては、例えば、ビニルトリメトキシシラン、ビニルトリエトキシシラン、メタクリロキシプロピルトリメトキシシラン、３−メタクリロキシプロピルメチルジメトキシシラン、３−グリシドキシプロピルトリメトキシシラン、３−グリシドキシプロピルトリエトキシシラン、３−グリシドキシプロピルメチルジメトキシシラン、３−グリシドキシプロピルメチルジエトキシシラン、２−（３，４−エポキシシクロヘキシル）エチルトリメトキシシラン、３−アミノプロピルトリメトキシシラン、３−アミノプロピルトリエトキシシラン、３−アミノプロピルメチルジメトキシシラン、Ｎ−（２−アミノエチル）３−アミノプロピルトリメトキシシラン、Ｎ−（２−アミノエチル）３−アミノプロピルメチルジメトキシシラン、３−メルカプトプロピルトリメトキシシラン、３−メルカプトプロピルトリエトキシシラン、メルカプトブチルトリメトキシシラン及び３−メルカプトプロピルメチルジメトキシシラン等が挙げられる。これらは単独または２種以上が使用できる。 Examples of the silane coupling agent include vinyltrimethoxysilane, vinyltriethoxysilane, methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, and 3-glycidoxy. Propyltriethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3 -Aminopropyltriethoxysilane, 3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) 3-aminopropyltrimethoxysilane, N- (2-aminoethyl) 3-aminopropylmethyldimethoxy Silane, 3-mercaptopropyl trimethoxysilane, 3-mercaptopropyl triethoxysilane, and the like-mercapto-butyl trimethoxysilane and 3-mercaptopropyl methyl dimethoxy silane. These can be used alone or in combination of two or more.
シリコーンオイルとしては、例えば、ジメチルシリコーンオイル、メチルフェニルシリコーンオイル、メチルハイドロジェンシリコーンオイル、反応性シリコーンオイルや非反応性シリコーンオイル等の変性シリコーンオイル等が挙げられる。これらは単独または２種以上が使用できる。 Examples of the silicone oil include dimethyl silicone oil, methylphenyl silicone oil, methyl hydrogen silicone oil, modified silicone oil such as reactive silicone oil and non-reactive silicone oil. These can be used alone or in combination of two or more.
ブロッキング防止剤としては、例えば、無機質微粉末及び有機質微粉末を用いることができる。無機質微粉末としては、重質炭酸カルシウム、軽質炭酸カルシウム、シリカ、タルク、クレー、ケイ酸微粉末、合成ケイ酸塩、沈降性硫酸バリウム、ケイ酸カルシウム、水酸化アルミニウム等が使用でき、有機質微粉末として、耐熱性を有するポリエチレン、ポリプロピレン、ウレタン、アクリル、ナイロン、尿素系樹脂等からなるフィラー、スチレン架橋フィラー、ベンゾグアナミン架橋フィラー、クエン酸脂肪酸モノグリセライド、グリセリンモノステアレート、グリセリンモノベヘネート、グリセリンモノオレート等が挙げられる。これらは単独または２種以上が使用できる。 As an antiblocking agent, for example, inorganic fine powder and organic fine powder can be used. As the inorganic fine powder, heavy calcium carbonate, light calcium carbonate, silica, talc, clay, silicate fine powder, synthetic silicate, precipitated barium sulfate, calcium silicate, aluminum hydroxide, etc. can be used. As a powder, heat-resistant polyethylene, polypropylene, urethane, acrylic, nylon, urea resin filler, styrene crosslinked filler, benzoguanamine crosslinked filler, citrate fatty acid monoglyceride, glycerin monostearate, glycerin monobehenate, glycerin mono Examples include oleate. These can be used alone or in combination of two or more.
上記の任意成分の配合量は、後述する物性との関係で様々であるため下限値は限定できない。しかし、その上限値は、熱溶融性組成物１００質量部に対し、１０質量部以下が好ましく、８質量部以下がより好ましい。配合量が１０質量部以下になることで任意成分のブリードアウト等がより生じにくくなる。 Since the compounding amount of the above-mentioned optional components varies depending on the physical properties described later, the lower limit value cannot be limited. However, the upper limit is preferably 10 parts by mass or less and more preferably 8 parts by mass or less with respect to 100 parts by mass of the heat-meltable composition. When the blending amount is 10 parts by mass or less, bleed out of an arbitrary component is less likely to occur.
本発明の熱溶融性組成物は、エチレン酢酸ビニル共重合体（Ａ）と、オレフィン系ポリマー（Ｂ）と、ワックス（Ｃ）と、粘着付与樹脂（Ｄ）と、その他必要に応じて用いられる任意成分をロール、バンバリーミキサー、ニーダー、撹拌機を備えた溶融釜、一軸若しくは二軸の押し出し機などを用いて加熱混合してなる加熱溶融性組成物や、適当な溶剤に溶解して攪拌混合してなる溶剤型組成物を用いて得ることができる。本発明に用いられる熱溶融性組成物は、溶剤を使用しない加熱溶融性組成物が好ましい。 The heat-meltable composition of the present invention is used as necessary in an ethylene vinyl acetate copolymer (A), an olefin polymer (B), a wax (C), a tackifier resin (D), and the like. Dissolve and stir in a suitable solvent with a hot-melt composition or any suitable solvent that heats and mixes optional ingredients using a roll, Banbury mixer, kneader, melting kettle equipped with a stirrer, uniaxial or biaxial extruder, etc. It can obtain using the solvent-type composition formed. The heat-meltable composition used in the present invention is preferably a heat-meltable composition that does not use a solvent.
本発明の熱溶融性組成物は、１５０℃での粘度が５００〜５００００ｍＰａ・ｓであることが好ましく、８００〜４８０００ｍＰａ・ｓであることがより好ましい。なお、粘度は、Ｂ型粘度計（測定条件は、１５０℃、ローターＮｏ．３、１２ｒｐｍ、３０秒間）を使用し、測定した値である。 The heat-meltable composition of the present invention preferably has a viscosity at 150 ° C. of 500 to 50000 mPa · s, and more preferably 800 to 48000 mPa · s. The viscosity is a value measured using a B-type viscometer (measurement conditions are 150 ° C., rotor No. 3, 12 rpm, 30 seconds).
＜蓋材＞
本発明の熱溶融性組成物は、蓋材用として好適に使用することができる。蓋材は、基材の片面に熱溶融性組成物を塗布した熱溶融性組成物層を有しており、開封可能な容器に用いることができる。また、蓋材は基材の片面に熱溶融性組成物を塗布した後、熱溶融性組成物の最外面に疎水性酸化物微粒子を付着させることができ、開封可能な容器に用いることができる。
<Cover material>
The hot melt composition of the present invention can be suitably used for a lid material. The lid material has a heat-meltable composition layer obtained by applying a heat-meltable composition on one side of a substrate, and can be used for an openable container. In addition, the lid material can be applied to an openable container by applying the heat-meltable composition to one side of the substrate and then attaching the hydrophobic oxide fine particles to the outermost surface of the heat-meltable composition. .
蓋材の製造方法は、本発明が目的とする蓋材を製造することができる限り、特に限定されるものではなく、既知の製造方法を使用して製造することができる。熱溶融性組成物、熱溶融性組成物の最外面に付着させる疎水性酸化物微粒子の塗工方法は、特に限定されることはなく、通常知られた接触塗工法、非接触塗工法により塗工することができる。接触塗工法とは、熱溶融性組成物を塗工する際、噴出機を部材やフィルムに接触させる塗工方法である。非接触塗工法とは、熱溶融性組成物を塗工する際、噴出機を部材やフィルムに接触させない塗工方法である。 The method for producing the lid material is not particularly limited as long as the lid material targeted by the present invention can be produced, and can be produced using a known production method. The method for applying the heat-meltable composition and the hydrophobic oxide fine particles to be adhered to the outermost surface of the heat-meltable composition is not particularly limited, and is usually applied by a known contact coating method or non-contact coating method. Can be crafted. The contact coating method is a coating method in which an ejector is brought into contact with a member or a film when a hot-melt composition is applied. The non-contact coating method is a coating method in which an ejector is not brought into contact with a member or a film when a hot-melt composition is applied.
接触塗工法として、例えば、スロットコーター塗工、グラビアコーター塗工、ロールコーター塗工などが挙げられ、非接触塗工法として、例えば、螺旋状に塗工できるスパイラル塗工、波状に塗工できるオメガ塗工、コントロールシーム塗工、面状に塗工できるスロットスプレー塗工、カーテンスプレー塗工、点状に塗工できるドット塗工、線状に塗工できるビード塗工などが挙げられる。熱溶融性組成物層の厚みは、１〜１００μｍが好ましい。疎水性酸化物微粒子層の厚みは、０．３〜５μｍが好ましい。また、熱溶融性組成物層は、加熱または紫外線照射によって架橋することもできる。 Examples of the contact coating method include slot coater coating, gravure coater coating, roll coater coating, and the like. Non-contact coating methods include, for example, spiral coating that can be applied in a spiral manner, and omega that can be applied in a corrugated manner. Examples thereof include coating, control seam coating, slot spray coating that can be applied in the form of a plane, curtain spray coating, dot coating that can be applied in the form of dots, and bead coating that can be applied in the form of lines. The thickness of the heat-meltable composition layer is preferably 1 to 100 μm. The thickness of the hydrophobic oxide fine particle layer is preferably 0.3 to 5 μm. Further, the hot-melt composition layer can be crosslinked by heating or ultraviolet irradiation.
基材は、樹脂シート、紙、ガラス、アルミニウム（アルミ箔）から選ばれる少なくとも１種以上で構成されてなる。例えば、樹脂シートとしては、ポリエチレンテレフタレート等のポリエステル系樹脂、ポリカーボネート系樹脂、ポリアリレート系樹脂、アクリル系樹脂、ポリフェニレンサルファイド系樹脂、ポリスチレン系樹脂、ビニル系樹脂、塩化ビニル系樹脂、ポリイミド系樹脂、エポキシ樹脂、ポリエチレン、ポリプロピレン、ポリノルボルネン等のオレフィン系樹脂などの樹脂から形成される樹脂シートが挙げられる。蓋材は１層であっても積層されていても良く、さらに不織布、織布、布などを積層することができる。 The substrate is composed of at least one selected from a resin sheet, paper, glass, and aluminum (aluminum foil). For example, as a resin sheet, polyester resin such as polyethylene terephthalate, polycarbonate resin, polyarylate resin, acrylic resin, polyphenylene sulfide resin, polystyrene resin, vinyl resin, vinyl chloride resin, polyimide resin, Examples thereof include resin sheets formed from resins such as epoxy resins, olefinic resins such as polyethylene, polypropylene, and polynorbornene. The lid material may be a single layer or may be laminated, and a nonwoven fabric, a woven fabric, a cloth, or the like can be further laminated.
積層構成としては特に限定されず任意であるが、好ましい具体例としては「紙／ポリエチレン」、「アルミニウム／ポリエチレン」、「紙／アルミニウム／ポリエチレン」、「ポリエチレンテレフタレート／紙／ポリエチレン」、「ポリエチレンテレフタレート／アルミニウム／ポリエチレン」、「ポリエチレンテレフタレート／紙／アルミニウム／ポリエチレン」等が挙げられる。また、基材には必要に応じて、基材の表面にコロナ放電処理、プラズマ処理、ブラスト処理、ケミカルエッチング処理などの易接着処理、帯電防止処理、着色処理などを施してもよい。基材の厚みには特に制限はないが、１〜３００μｍが好ましい。 The laminated structure is not particularly limited and is arbitrary. Preferred examples include “paper / polyethylene”, “aluminum / polyethylene”, “paper / aluminum / polyethylene”, “polyethylene terephthalate / paper / polyethylene”, “polyethylene terephthalate”. / Aluminum / polyethylene ”,“ polyethylene terephthalate / paper / aluminum / polyethylene ”and the like. Further, the substrate may be subjected to easy adhesion treatment such as corona discharge treatment, plasma treatment, blast treatment, chemical etching treatment, antistatic treatment, coloring treatment, and the like, as necessary. Although there is no restriction | limiting in particular in the thickness of a base material, 1-300 micrometers is preferable.
＜密封容器＞
上記蓋材は、容器と共に好適に使用することができる。また、上記容器は、容器の開口部と蓋材をヒートシールして用いられる。
<Sealed container>
The said lid | cover material can be used conveniently with a container. Moreover, the said container is used by heat-sealing the opening part and cover material of a container.
以下、本発明を実施例により具体的かつ詳細に説明するが、これらの実施例は本発明の一態様に過ぎず、本発明はこれらの例によって限定されるものではない。なお、例中、「部」、「％」は、それぞれ「質量部」、「質量％」を表す。 EXAMPLES Hereinafter, the present invention will be described specifically and in detail with reference to examples. However, these examples are only one aspect of the present invention, and the present invention is not limited to these examples. In the examples, “part” and “%” represent “part by mass” and “% by mass”, respectively.
＜熱溶融性組成物の製造＞
［実施例１〜１２、比較例１〜１２］
表１、２に記載した原料を表１、２の組成に従い撹拌機を備えたニーダーに入れ、減圧下、１４０℃で均一になるまで撹拌し、熱溶融性組成物１〜２４を得た。
<Manufacture of hot melt composition>
[Examples 1-12, Comparative Examples 1-12]
The raw materials described in Tables 1 and 2 were put into a kneader equipped with a stirrer according to the compositions in Tables 1 and 2 and stirred at 140 ° C. under reduced pressure until uniform, to obtain hot melt compositions 1 to 24.
以下に、表１、２中の原料について示す。
ＥＶＡ１：エチレン酢酸ビニル共重合体（ＭＦＲ：１５０ｇ、酢酸ビニル量：２８％、融点：６９℃）
ＥＶＡ２：エチレン酢酸ビニル共重合体（ＭＦＲ：３５０ｇ、酢酸ビニル量：２０％、融点：７８℃）
ＥＶＡ３：エチレン酢酸ビニル共重合体（ＭＦＲ：４００ｇ、酢酸ビニル量：２８％、融点：６７℃）
ＥＶＡ４：エチレン酢酸ビニル共重合体（ＭＦＲ：１０００ｇ、酢酸ビニル量：２０％、融点：６９℃）
ＥＶＡ５：エチレン酢酸ビニル共重合体（ＭＦＲ：２０００ｇ、酢酸ビニル量：２０％、融点：７２℃）
ＥＶＡ６：エチレン酢酸ビニル共重合体（ＭＦＲ：２５００ｇ、酢酸ビニル量：１４％、融点：７９℃）
ＥＶＡ７：エチレン酢酸ビニル共重合体（ＭＦＲ：３０ｇ、酢酸ビニル量：３２％、融点：６６℃）
オレフィン系ポリマー１：エチレン−１−ブチレンポリマー（ＭＦＲ：１ｇ／１０分（１９０℃）、融点：１１０℃）
オレフィン系ポリマー２：エチレン−１−ブチレンポリマー（ＭＦＲ：４ｇ／１０分（１９０℃）、融点：１００℃）
オレフィン系ポリマー３：エチレン−１−オクテン共重合物（ＭＦＲ：３０ｇ／１０分（１９０℃）、融点：８０℃）
オレフィン系ポリマー４：エチレン−１−オクテン共重合物（ＭＦＲ：３０ｇ／１０分（１９０℃）、融点：６５℃）
オレフィン系ポリマー５：エチレン−１−オクテン共重合物（ＭＦＲ：３０ｇ／１０分（１９０℃）、融点：９６℃）
オレフィン系ポリマー６：エチレン−１−オクテン共重合物（ＭＦＲ：１５ｇ／１０分（１９０℃）、融点：１２０℃）
オレフィン系ポリマー７：エチレン−１−オクテン共重合物（ＭＦＲ：５００ｇ／１０分（１９０℃）、融点：７０℃）
ＷＡＸ１：パラフィンワックス（融点：４７℃）
ＷＡＸ２：パラフィンワックス（融点：５３℃）
ＷＡＸ３：パラフィンワックス（融点：５５℃）
ＷＡＸ４：パラフィンワックス（融点：６１℃）
ＷＡＸ５：パラフィンワックス（融点：６９℃）
粘着付与樹脂１：ロジン系粘着付与樹脂（軟化点：１２５℃）
粘着付与樹脂２：水添テルペン系粘着付与樹脂（軟化点１２５℃）
粘着付与樹脂３：部分水添石油系粘着付与樹脂（軟化点：１３５℃）
粘着付与樹脂４：水添石油系粘着付与樹脂（軟化点：１４０℃）
粘着付与樹脂５：水添石油系粘着付与樹脂（軟化点：９０℃）
酸化防止剤：ペンタエリスリトールテトラキス［３−（３，５−ジ−ｔ−ブチル−４−ヒドロキシフェニル）プロピオネート］
シランカップリング剤：メタクリロキシプロピルトリメトキシシラン
シリコーン：ジメチルシリコーンオイル（動粘度：５００ｍｍ２／ｓ（２５℃））
ブロッキング防止剤：クエン酸脂肪酸モノグリセライド（融点：６０℃）
The raw materials in Tables 1 and 2 are shown below.
EVA1: ethylene vinyl acetate copolymer (MFR: 150 g, vinyl acetate content: 28%, melting point: 69 ° C.)
EVA2: ethylene vinyl acetate copolymer (MFR: 350 g, vinyl acetate content: 20%, melting point: 78 ° C.)
EVA3: ethylene vinyl acetate copolymer (MFR: 400 g, vinyl acetate content: 28%, melting point: 67 ° C.)
EVA4: ethylene vinyl acetate copolymer (MFR: 1000 g, vinyl acetate content: 20%, melting point: 69 ° C.)
EVA5: ethylene vinyl acetate copolymer (MFR: 2000 g, vinyl acetate content: 20%, melting point: 72 ° C.)
EVA6: ethylene vinyl acetate copolymer (MFR: 2500 g, vinyl acetate content: 14%, melting point: 79 ° C.)
EVA7: ethylene vinyl acetate copolymer (MFR: 30 g, vinyl acetate content: 32%, melting point: 66 ° C.)
Olefin polymer 1: ethylene-1-butylene polymer (MFR: 1 g / 10 min (190 ° C.), melting point: 110 ° C.)
Olefin polymer 2: ethylene-1-butylene polymer (MFR: 4 g / 10 min (190 ° C.), melting point: 100 ° C.)
Olefin polymer 3: Ethylene-1-octene copolymer (MFR: 30 g / 10 min (190 ° C.), melting point: 80 ° C.)
Olefin polymer 4: Ethylene-1-octene copolymer (MFR: 30 g / 10 min (190 ° C.), melting point: 65 ° C.)
Olefin polymer 5: ethylene-1-octene copolymer (MFR: 30 g / 10 min (190 ° C.), melting point: 96 ° C.)
Olefin-based polymer 6: ethylene-1-octene copolymer (MFR: 15 g / 10 min (190 ° C.), melting point: 120 ° C.)
Olefin-based polymer 7: ethylene-1-octene copolymer (MFR: 500 g / 10 min (190 ° C.), melting point: 70 ° C.)
WAX1: Paraffin wax (melting point: 47 ° C)
WAX2: Paraffin wax (melting point: 53 ° C)
WAX3: Paraffin wax (melting point: 55 ° C)
WAX4: Paraffin wax (melting point: 61 ° C)
WAX5: Paraffin wax (melting point: 69 ° C)
Tackifying resin 1: Rosin-based tackifying resin (softening point: 125 ° C)
Tackifying resin 2: hydrogenated terpene-based tackifying resin (softening point 125 ° C.)
Tackifying resin 3: Partially hydrogenated petroleum-based tackifying resin (softening point: 135 ° C.)
Tackifying resin 4: hydrogenated petroleum-based tackifying resin (softening point: 140 ° C.)
Tackifying resin 5: hydrogenated petroleum-based tackifying resin (softening point: 90 ° C.)
Antioxidant: Pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate]
Silane coupling agent: methacryloxypropyltrimethoxysilane silicone: dimethyl silicone oil (kinematic viscosity: 500 mm 2 / s (25 ° C.))
Anti-blocking agent: Citric acid fatty acid monoglyceride (melting point: 60 ° C.)
＜蓋材の作製＞
［実施例１３〜２４、比較例１３〜２４］
得られた熱溶融性組成物（組成物１〜組成物２４）を１４０℃に加熱して、積層構成がＰＥＴ／アルミニウム／ポリエチレンである基材（厚さ１００μｍ）のポリエチレン上に、塗布量が２０ｇ／ｍ２になるように塗布し、「ＰＥＴ／アルミニウム／ポリエチレン／熱溶融性組成物」という構成の積層体である蓋材（蓋材１〜蓋材２４）を得た。
<Production of lid material>
[Examples 13 to 24, Comparative Examples 13 to 24]
The obtained heat-meltable composition (Composition 1 to Composition 24) was heated to 140 ° C., and the coating amount was on the polyethylene of the base material (thickness: 100 μm) whose laminated structure was PET / aluminum / polyethylene. It apply | coated so that it might become 20 g / m < 2 >, and the cover material (cover material 1-cover material 24) which is a laminated body of the structure of "PET / aluminum / polyethylene / hot-melt composition" was obtained.
＜蓋材の評価＞
得られた蓋材（蓋材１〜蓋材２４）について、後述する方法に従い、開封強度（０℃雰囲気及び２３℃雰囲気）、剥離感、熱溶融性組成物の被着体汚染、落下時の耐衝撃性、耐ブロッキング性を評価し、結果を表３に示す。
<Evaluation of lid>
About the obtained cover materials (cover materials 1 to 24), according to the method described later, the unsealing strength (0 ° C. atmosphere and 23 ° C. atmosphere), peeling feeling, adherend contamination of the hot-melt composition, falling The impact resistance and blocking resistance were evaluated, and the results are shown in Table 3.
［開封強度（０℃、２３℃）］
得られた蓋材を、容器の形状（タブ付きの直径７５ｍｍの円形）に切り抜き、フランジ付きポリスチレン製容器（フランジ幅３ｍｍ、フランジ外径７０ｍｍ、高さ５５ｍｍ、内容積約１３０ｃｍ３、厚み約４００μｍになるように成形した容器）のフランジ上にヒートシールして食品容器をそれぞれ作製した。ヒートシール条件は、温度１５０℃、圧力３ｋｇ／ｃｍ２、時間０．５秒とした。その後、低温(０℃）及び常温（２３℃）の各条件において、各食品容器上の蓋材のタブを開封始点からみて仰角４５度の方向に１００ｍｍ／分の速度で引っ張り、開封時の最大荷重をシール強度（Ｎ）とした。各食品容器についてｎ＝５点測定し、その平均値を求め下記基準で判断した。○を実用可能と判断した。
○：シール強度平均値が、１０Ｎ以上１５Ｎ未満
×：シール強度平均値が、１０Ｎ未満または１５Ｎ以上
[Opening strength (0 ° C, 23 ° C)]
The obtained lid material was cut out in the shape of a container (circular with a diameter of 75 mm with a tab), and a polystyrene container with a flange (flange width 3 mm, flange outer diameter 70 mm, height 55 mm, internal volume about 130 cm 3 , thickness about 400 μm The food containers were prepared by heat-sealing on the flanges of the containers). The heat sealing conditions were a temperature of 150 ° C., a pressure of 3 kg / cm 2 , and a time of 0.5 seconds. Then, under each condition of low temperature (0 ° C.) and normal temperature (23 ° C.), the tab of the lid on each food container is pulled at a speed of 100 mm / min in the direction of an elevation angle of 45 degrees when viewed from the opening start point, and the maximum at the time of opening The load was the seal strength (N). For each food container, n = 5 points were measured, and the average value was obtained and judged according to the following criteria. ○ was judged to be practical.
○: The average value of seal strength is 10N or more and less than 15N ×: The average value of seal strength is less than 10N or 15N or more
［剥離感］
得られた蓋材を、容器の形状（タブ付きの直径７５ｍｍの円形）に切り抜き、フランジ付きポリスチレン製容器（フランジ幅３ｍｍ、フランジ外径７０ｍｍ、高さ５５ｍｍ、内容積約１３０ｃｍ３、厚み約４００μｍになるように成形した容器）のフランジ上にヒートシールして食品容器をそれぞれ作製した。ヒートシール条件は、温度１５０℃、圧力３ｋｇ／ｃｍ２、時間０．５秒とした。その後、常温（２３℃）の条件で、各食品容器上の蓋材のタブを開封始点からみて仰角４５度の方向に剥離した際のスリップスティックの有無をｎ＝５点測定し、確認した。〇、△を実用可能と判断した。
○：滑らかに蓋材が剥離でき、スリップスティックは発生しなかった
△：若干抵抗感はあったが、蓋材が剥離でき、スリップスティックは発生しなかった
×：剥離時にスリップスティックが発生した
[Peeling feeling]
The obtained lid material was cut out in the shape of a container (circular with a diameter of 75 mm with a tab), and a polystyrene container with a flange (flange width 3 mm, flange outer diameter 70 mm, height 55 mm, internal volume about 130 cm 3 , thickness about 400 μm The food containers were prepared by heat-sealing on the flanges of the containers). The heat sealing conditions were a temperature of 150 ° C., a pressure of 3 kg / cm 2 , and a time of 0.5 seconds. Thereafter, the presence or absence of slip sticks when the tab of the lid on each food container was peeled in the direction of an elevation angle of 45 degrees as viewed from the opening start point was measured by n = 5 points under normal temperature (23 ° C.) conditions. 〇 and △ were judged as practical.
○: The lid material could be smoothly peeled off and no slip stick was generated. △: Although there was some resistance, the lid material could be peeled off and no slip stick was generated. ×: A slip stick was generated at the time of peeling.
［熱溶融性組成物の被着体汚染］
得られた蓋材を、容器の形状（タブ付きの直径７５ｍｍの円形）に切り抜き、フランジ付きポリスチレン製容器（フランジ幅３ｍｍ、フランジ外径７０ｍｍ、高さ５５ｍｍ、内容積約１３０ｃｍ２、厚み約４００μｍになるように成形した容器）のフランジ上にヒートシールして食品容器をそれぞれ作製した。ヒートシール条件は、温度１５０℃、圧力３ｋｇ／ｃｍ２、時間０．５秒とした。その後、常温（２３℃）の条件で、蓋材のタブを手剥離し、フランジ付きポリスチレン製容器のフランジ部分の熱溶融性組成物の有無をｎ＝５点測定し、確認した。〇、△を実用可能と判断した。
〇：目視で確認し、熱溶融性組成物が残っていない
△：目視で確認し、フランジ全体の面積中に熱溶融性組成物が５％未満残っている
×：目視で確認し、フランジ全体の面積中に熱溶融性組成物が５％以上残っている
[Adherent contamination of hot-melt composition]
The obtained lid material was cut out in the shape of a container (circular with a diameter of 75 mm with a tab), and a polystyrene container with a flange (flange width 3 mm, flange outer diameter 70 mm, height 55 mm, internal volume about 130 cm 2 , thickness about 400 μm The food containers were prepared by heat-sealing on the flanges of the containers). The heat sealing conditions were a temperature of 150 ° C., a pressure of 3 kg / cm 2 , and a time of 0.5 seconds. Thereafter, the tab of the lid was manually peeled off at room temperature (23 ° C.), and the presence or absence of the hot-melt composition in the flange portion of the flanged polystyrene container was measured and confirmed. 〇 and △ were judged as practical.
◯: Visually confirmed, no heat-meltable composition left Δ: Visually confirmed, less than 5% of the heat-meltable composition remains in the entire area of the flange ×: Visually confirmed, the entire flange 5% or more of the hot-melt composition remains in the area of
［落下時の耐衝撃性］
得られた蓋材を、容器の形状（タブ付きの直径７５ｍｍの円形）に切り抜き、容器の形状（タブ付きの直径７５ｍｍの円形）に切り抜いた蓋材を、水１００ｇを添加したフランジ付きポリスチレン製容器（フランジ幅３ｍｍ、フランジ外径７０ｍｍ、高さ５５ｍｍ、内容積約１３０ｃｍ２、厚み約４００μｍになるように成形した容器）のフランジ上にヒートシールして食品容器をそれぞれ作製した。ヒートシール条件は、温度１５０℃、圧力３ｋｇ／ｃｍ２、時間０．５秒とした。その後、常温（２３℃）の条件で、１ｍの高さから落下させ、蓋材の開封及び空気漏れの有無をｎ＝５点測定し、確認した。〇、△を実用可能と判断した。
○：蓋の開封及び空気漏れなし
△：蓋の開封はなかったが、若干空気漏れあり
×：蓋の開封及び空気漏れあり
[Shock resistance when dropped]
The obtained lid material was cut into a container shape (circular with a diameter of 75 mm with a tab), and the lid material cut out into a container shape (circular with a diameter of 75 mm with a tab) was made of flanged polystyrene to which 100 g of water was added. Food containers were prepared by heat-sealing on the flanges of containers (containers formed to have a flange width of 3 mm, a flange outer diameter of 70 mm, a height of 55 mm, an internal volume of about 130 cm 2 and a thickness of about 400 μm). The heat sealing conditions were a temperature of 150 ° C., a pressure of 3 kg / cm 2 , and a time of 0.5 seconds. Then, it was dropped from a height of 1 m under the condition of normal temperature (23 ° C.), and n = 5 points were measured and confirmed for the presence or absence of opening of the lid material and air leakage. 〇 and △ were judged as practical.
○: Opening of lid and no air leakage △: No opening of lid, but slight air leakage ×: Opening of lid and air leakage
［耐ブロッキング性］
得られた蓋材を、５ｃｍ角に切ったものを１０枚重ね、その上に１０ｋｇの重りを置いて、４０℃雰囲気内で２４時間静置する。その後、重りを取り除き、２３℃雰囲気下に１時間静置し、蓋材を剥離した際のブロッキングの有無を確認した。〇、△を実用可能と判断した。
○：剥離抵抗感がなく剥離できる
△：剥離抵抗感が若干あるが剥離できる
×：剥離時にブロッキングが発生し、剥離できない
[Blocking resistance]
10 pieces of the obtained lid material cut into 5 cm squares are stacked, a 10 kg weight is placed thereon, and the plate is allowed to stand in an atmosphere of 40 ° C. for 24 hours. Thereafter, the weight was removed, and the mixture was left to stand in an atmosphere at 23 ° C. for 1 hour, and the presence or absence of blocking when the lid member was peeled was confirmed. 〇 and △ were judged as practical.
○: Peeling without peeling resistance △: Peeling with some peeling resistance but can be peeled ×: Blocking occurs at the time of peeling, and peeling is not possible
表３の結果からも明らかなように、比較例では結果は不十分であったのに対し、実施例では良好な結果を示している。 As is clear from the results in Table 3, the results were insufficient in the comparative example, whereas the results were good in the examples.
Claims (5)
荷重２１．１８Ｎ、１９０℃で測定したＭＦＲが１００〜２７００（ｇ／１０分）であるエチレン酢酸ビニル共重合体（Ａ）：２〜２５質量％、
荷重２１．１８Ｎ、１９０℃で測定したＭＦＲが０．５〜６０（ｇ／１０分）であるオレフィン系ポリマー（Ｂ）：１０〜４０質量％、
融点が４０〜６５℃のワックス（Ｃ）：３５〜６５質量％、
軟化点が１００〜１６０℃の粘着付与樹脂（Ｄ）：３〜２５質量％、
を含む熱溶融性組成物。 A hot melt composition comprising an ethylene vinyl acetate copolymer (A), an olefin polymer (B), a wax (C) and a tackifying resin (D),
Ethylene vinyl acetate copolymer (A) having an MFR measured at a load of 21.18 N and 190 ° C. of 100 to 2700 (g / 10 min): 2 to 25% by mass,
Olefin polymer (B) having a MFR measured at a load of 21.18 N and 190 ° C. of 0.5 to 60 (g / 10 min): 10 to 40% by mass,
Wax (C) having a melting point of 40 to 65 ° C .: 35 to 65% by mass,
Tackifying resin (D) having a softening point of 100 to 160 ° C .: 3 to 25% by mass,
A hot-melt composition comprising:
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| JP7240067B2 (en) | 2019-06-27 | 2023-03-15 | 東洋インキＳｃホールディングス株式会社 | Adhesive resin composition, sheet, lid material, member set for sealed container and container |
| TWI799898B (en) * | 2020-06-22 | 2023-04-21 | 日商東洋油墨Ｓｃ控股股份有限公司 | Adhesive resin composition, sheet, lid, member set for container, and container |
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