JP2018103548A - 金属樹脂接合方法及び金属樹脂接合体 - Google Patents
金属樹脂接合方法及び金属樹脂接合体 Download PDFInfo
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- JP2018103548A JP2018103548A JP2016254742A JP2016254742A JP2018103548A JP 2018103548 A JP2018103548 A JP 2018103548A JP 2016254742 A JP2016254742 A JP 2016254742A JP 2016254742 A JP2016254742 A JP 2016254742A JP 2018103548 A JP2018103548 A JP 2018103548A
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- resin
- metal
- metal material
- carboxylic acid
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Abstract
Description
金属材と樹脂材とを直接接合する方法であって、
還元性を有するカルボン酸を用いた電解処理によって前記金属材に新生面を形成すると共に、前記カルボン酸によって前記新生面を被覆し、カルボン酸被覆金属材を得る第一工程と、
前記樹脂材と前記カルボン酸被覆金属材とを重ね合わせ、被接合界面を形成する第二工程と、
加熱手段によって前記被接合界面を前記樹脂材のガラス転移温度以上に昇温することで前記被接合界面から水を除去し、前記樹脂材の分解によってカルボキシル基を生成すると共に、前記カルボン酸の除去により前記カルボン酸被覆金属材の表面に前記新生面を露出させる第三工程と、
前記被接合界面を前記ガラス転移温度未満に冷却し、前記カルボキシル基と前記新生面との結合により接合部を形成する第四工程と、を有すること、
を特徴とする金属樹脂接合方法、を提供する。
樹脂材と金属材との重ね接合部材であって、
前記樹脂材と前記金属材とは直接接合されており、
接合部の引張試験において前記金属材が伸長すること、
を特徴とする金属樹脂接合体、も提供する。
図1は、本発明の金属樹脂接合方法の工程図である。本発明の金属樹脂接合方法は、金属材と樹脂材とを直接接合する方法であって、還元性を有するカルボン酸を用いた電解処理によって金属材に新生面を形成すると共に、カルボン酸によって新生面を被覆し、カルボン酸被覆金属材を得る第一工程(S01)と、樹脂材とカルボン酸被覆金属材とを重ね合わせ、被接合界面を形成する第二工程(S02)と、加熱手段によって被接合界面を樹脂材のガラス転移温度以上に昇温することで被接合界面から水を除去し、樹脂材の分解によってカルボキシル基を生成すると共に、カルボン酸の除去によりカルボン酸被覆金属材の表面に新生面を露出させる第三工程(S03)と、被接合界面をガラス転移温度未満に冷却し、カルボキシル基と新生面との結合により接合部を形成する第四工程(S04)と、を有している。以下、各工程について詳述する。
第一工程(S01)は、還元性を有するカルボン酸を用いた電解処理によって金属材に新生面を形成すると共に、カルボン酸によって新生面を被覆し、カルボン酸被覆金属材を得るための工程である。
第二工程(S02)は、第一工程(S01)で得たカルボン酸被覆金属材と樹脂材とを重ね合わせ、被接合界面を形成するための工程である。
第三工程(S03)は、第二工程(S02)で形成させた被接合界面を、加熱手段によって樹脂材のガラス転移温度以上に昇温することで被接合界面から水を除去し、樹脂材の分解によってカルボキシル基を生成すると共に、カルボン酸の除去によりカルボン酸被覆金属材の表面に新生面を露出させるための工程である。
第四工程(S04)は、被接合界面をガラス転移温度未満に冷却し、カルボキシル基と新生面との結合により接合部を形成するための工程である。つまり、本発明の金属樹脂接合方法において、実際に接合が達成されるのは第四工程(S04)であり、第一工程(S01)〜第三工程(S03)は第四工程(S04)の準備工程となる。
図2は、本発明の金属樹脂接合体の一例を示す概略断面図である。金属樹脂接合体2の形状は本発明の効果を損なわない限りにおいて特に限定されず、従来公知の種々の形状とすることができるが、図2においては本発明の金属樹脂接合体に好適に用いることができる、ヘミング加工部を有する接合体を示している。ヘミング加工部では樹脂材4が金属材6に折り返されて固定されるヘミング加工部を有し、当該ヘミング加工部において樹脂材4と金属材6とが接合部8において直接接合されている。
金属材としてA5052アルミニウム合金板(80mm×25mm×1mm)、樹脂材としてガラス繊維強化プラスチック(東洋紡社製GFPA T402,マトリックス樹脂:PA6,ガラス繊維:60体積%)板(100mm×25mm×2mm)を用い、レーザ照射による重ね接合を行った。なお、レーザ照射にはレーザライン社製の半導体レーザ(LDF4000−40)を用い、出力:850W、ビームサイズ:30mm×3mm、走査速度:4mm/秒とした。
電解処理時間を2分とし、レーザ出力を650W〜1000Wの範囲で変化させたこと以外は実施例1と同様にして、実施金属樹脂接合体を得た。実施例1と同様にして評価したせん断引張強度を図5に示す。
金属材としてSPCC鋼板(80mm×25mm×1mm)、樹脂材として炭素繊維強化プラスチック(東レ株式会社製 トレカTLP1040,マトリックス樹脂:PA6,強化繊維:炭素繊維)板(100mm×25mm×2mm)を用い、電解処理時間を2分とし、レーザ出力を425W〜505Wとしたこと以外は実施例1と同様にして、実施金属樹脂接合体を得た。実施例1と同様にして評価したせん断引張強度を図6に示す。
金属材として合金化溶融亜鉛めっき鋼板(GA,80mm×25mm×0.8mm)を用い、電解処理時間を2分とし、レーザ出力を350Wとしたこと以外は実施例1と同様にして、実施金属樹脂接合体を得た。実施例1と同様にして評価したせん断引張強度を図8に示す。なお、比較として電解処理なしで得られた比較金属樹脂接合体のせん断引張強度も示している。
蒸留水180gに対してシュウ酸10g及びギ酸10gを混合して得られた電解液を用い、種々のパワー密度(W/mm2)でレーザ照射を行ったこと以外は実施例1と同様にして、実施金属樹脂接合体を得た。なお、用いたレーザビームの面積は26mm×3mmである。実施例1と同様にして評価したせん断引張強度を図10に示す。なお、比較として、実施例1で得られたせん断引張り強度についても、横軸をパワー密度として図10に示している。
ギ酸濃度10%の電解液を用いたこと以外は実施例5と同様にして、実施金属樹脂接合体を得た。実施例1と同様にして評価したせん断引張強度を図10に示す。
4・・・樹脂材、
6・・・金属材、
8・・・接合部。
Claims (9)
- 金属材と樹脂材とを直接接合する方法であって、
還元性を有するカルボン酸を用いた電解処理によって前記金属材に新生面を形成すると共に、前記カルボン酸によって前記新生面を被覆し、カルボン酸被覆金属材を得る第一工程と、
前記樹脂材と前記カルボン酸被覆金属材とを重ね合わせ、被接合界面を形成する第二工程と、
加熱手段によって前記被接合界面を前記樹脂材のガラス転移温度以上に昇温することで前記被接合界面から水を除去し、前記樹脂材の分解によってカルボキシル基を生成すると共に、前記カルボン酸の除去により前記カルボン酸被覆金属材の表面に前記新生面を露出させる第三工程と、
前記被接合界面を前記ガラス転移温度未満に冷却し、前記カルボキシル基と前記新生面との結合により接合部を形成する第四工程と、を有すること、
を特徴とする金属樹脂接合方法。 - 前記カルボン酸がシュウ酸又はギ酸であること、
を特徴とする請求項1に記載の金属樹脂接合方法。 - 前記加熱手段にレーザ照射を用いること、
を特徴とする請求項1又は2に記載の金属樹脂接合方法。 - 前記金属材側から前記レーザ照射を施すこと、
を特徴とする請求項3に記載の金属樹脂接合方法。 - 前記第四工程の直後に前記接合部を加圧すること、
を特徴とする請求項1〜4のうちのいずれかに記載の金属樹脂接合方法。 - 樹脂材と金属材との重ね接合部材であって、
前記樹脂材と前記金属材とは直接接合されており、
接合部の引張試験において前記金属材が伸長すること、
を特徴とする金属樹脂接合体。 - 前記引張試験において前記金属材が破断すること、
を特徴とする請求項6に記載の金属樹脂接合体。 - 前記金属材が鋼材であること、
を特徴とする請求項6又は7に記載の金属樹脂接合体。 - 前記樹脂材が前記金属材に折り返されて固定されるヘミング加工部を有し、
前記ヘミング加工部において前記樹脂材と前記金属材とが直接接合されていること、
を特徴とする請求項6〜8のうちのいずれかに記載の金属樹脂接合体。
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