JP2018098111A - Planar light unit and manufacturing method of the same - Google Patents

Planar light unit and manufacturing method of the same Download PDF

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JP2018098111A
JP2018098111A JP2016243940A JP2016243940A JP2018098111A JP 2018098111 A JP2018098111 A JP 2018098111A JP 2016243940 A JP2016243940 A JP 2016243940A JP 2016243940 A JP2016243940 A JP 2016243940A JP 2018098111 A JP2018098111 A JP 2018098111A
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light emitting
guide plate
light
flexible resin
emitting element
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宮下　純司
Junji Miyashita
純司 宮下
知生 宇田川
Tomoo Udagawa
知生 宇田川
和寛 上嶋
Kazuhiro Uejima
和寛 上嶋
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Citizen Electronics Co Ltd
Citizen Watch Co Ltd
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Citizen Electronics Co Ltd
Citizen Watch Co Ltd
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Priority to JP2016243940A priority Critical patent/JP2018098111A/en
Priority to US15/794,433 priority patent/US10001672B2/en
Publication of JP2018098111A publication Critical patent/JP2018098111A/en
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Abstract

PROBLEM TO BE SOLVED: To provide a planar light unit capable of acquiring high luminous efficiency even when resin is provided between a light source and a light guide plate.SOLUTION: In a planar light unit 10, flexible resin 4 is disposed between a light guide plate 3 and a semiconductor light-emitting element 2. The flexible resin 4 has a reflection shape part 4c comprising a curve surface from an end part 2f of a light emitting surface 2e of the semiconductor light-emitting element 2 toward a corresponding end part 3g of an incident surface 3b of the light guide plate 3. The reflection shape part 4c reflects the light going outward of the flexible resin 4 into the direction of the incident surface 3b of the light guide plate 3. Thus, the light leaking outward from the flexible resin 4 can be directed to the light guide plate 3, and luminous efficiency can be enhanced.SELECTED DRAWING: Figure 3

Description

本発明は、携帯電話、パーソナルコンピュータ等の携帯用電子機器等に使用されている液晶表示装置等を照明する面状ライトユニットに関するものであり、特に、発光効率を高めたものに関する。   The present invention relates to a planar light unit that illuminates a liquid crystal display device or the like used in portable electronic devices such as a mobile phone and a personal computer, and particularly relates to a light emitting device with improved luminous efficiency.

光源からの光を導光板の側面から入射し導光板の上面から出射して面状に発光するサイドエッジ型の面状ライトユニットでは、光源であるＬＥＤと導光板との間に透明で弾性を有する樹脂を介在させて、光源から導光板の入射面までの屈折率の変化を抑えながら、ＬＥＤの発光を導光板に入射させることで反射による損失を減らし、発光効率を向上させたものが提案されていた（例えば、特許文献１参照）。   In a side-edge type planar light unit that emits light from a light source from the side surface of the light guide plate, exits from the upper surface of the light guide plate, and emits light in a planar shape, it is transparent and elastic between the light source LED and the light guide plate. Proposal is made to reduce the loss due to reflection and improve the light emission efficiency by making the light emission of the LED incident on the light guide plate while suppressing the change in the refractive index from the light source to the incident surface of the light guide plate through the resin (For example, refer to Patent Document 1).

特開２００７−１０３１０１号公報JP 2007-103101 A

しかしながら、上記面状ライトユニットでは、光源から大きな角度で樹脂に入射する光が樹脂の上下面から外方に漏れ出すことがあった。その結果、発光効率を十分に高くすることができないという問題があった。   However, in the planar light unit, light incident on the resin at a large angle from the light source sometimes leaks outward from the upper and lower surfaces of the resin. As a result, there is a problem that the luminous efficiency cannot be sufficiently increased.

本発明が解決しようとする課題は、上記従来技術の問題点を解決し、光源と導光板の間に樹脂を設けても、高い発光効率を得ることができる面状ライトユニット及びその製造方法を提供することにある。   The problem to be solved by the present invention is to solve the above-mentioned problems of the prior art and provide a planar light unit capable of obtaining high luminous efficiency even when a resin is provided between the light source and the light guide plate and a method for manufacturing the same. There is to do.

本発明の面状ライトユニットは、側端に入射面を有し、上面に出射面を有する導光板と、前記入射面の方向に光を照射する半導体発光素子と、前記導光板の入射面と前記半導体発光素子との間に配設された透光性及び柔軟性を有する柔軟性樹脂と、を備えた面状ライトユニットであって、前記柔軟性樹脂は、前記半導体発光素子の発光面の端部から対応する前記導光板の入射面の端部に向かう曲面からなる反射形状部を有し、前記反射形状部は、前記柔軟性樹脂の外方に向かう光を前記導光板の入射面の方向に反射することを特徴とするものである。   The planar light unit of the present invention includes a light guide plate having an incident surface at a side end and an output surface on an upper surface, a semiconductor light emitting element that emits light in the direction of the incident surface, and an incident surface of the light guide plate. A planar light unit provided between the semiconductor light emitting element and a flexible resin having translucency and flexibility, wherein the flexible resin is formed on the light emitting surface of the semiconductor light emitting element. A reflection shape portion having a curved surface from the end portion toward the end portion of the incident surface of the corresponding light guide plate, and the reflection shape portion transmits light directed outward of the flexible resin to the incident surface of the light guide plate. It is characterized by reflecting in the direction.

この面状ライトユニットにおける前記反射形状部は、前記半導体発光素子の発光面の端部から対応する前記導光板の入射面の端部に向かって外方に膨らむ二次曲面からなる。また、前記導光板の入射面が、前記半導体発光素子の発光面に平行で平坦な面からなるか、あるいは前記導光板の入射面と前記入射面に密着する前記柔軟性樹脂の密着面が、その一方が外方端から中心軸に向かう略Ｖ字状の凸面からなり、他方が外方端から中心軸に向かう略Ｖ字状の凹面からなる。   The reflective shape portion in the planar light unit is a quadric surface that bulges outward from the end of the light emitting surface of the semiconductor light emitting element toward the end of the corresponding incident surface of the light guide plate. In addition, the light incident surface of the light guide plate is a flat surface parallel to the light emitting surface of the semiconductor light emitting element, or the light incident surface of the light guide plate and the contact surface of the flexible resin that is in close contact with the light incident surface, One of them is a substantially V-shaped convex surface from the outer end toward the central axis, and the other is a substantially V-shaped concave surface from the outer end toward the central axis.

また、本発明の面状ライトユニットの製造方法は、導光板と、前記導光板の入射面に光を照射する半導体発光素子と、前記導光板の入射面と前記半導体発光素子との間に配設された透光性及び柔軟性を有する柔軟性樹脂とを備えた面状ライトユニットの製造方法であって、前記半導体発光素子の相対する側面方向から型締めして前記半導体発光素子の発光面上に上方に向かって断面が略椀状に広がる空洞からなる柔軟性樹脂形成部を形成する工程と、前記柔軟性樹脂形成部にその上方から樹脂を注入する工程と、前記半導体発光素子の側面外側方向へ型を開いて前記柔軟性樹脂を取り出す工程と、を備える。   In addition, the method for manufacturing a planar light unit according to the present invention includes a light guide plate, a semiconductor light emitting element that irradiates light to the incident surface of the light guide plate, and an incident surface of the light guide plate and the semiconductor light emitting element. A method for manufacturing a planar light unit comprising a flexible resin having translucency and flexibility, wherein the light emitting surface of the semiconductor light emitting element is clamped from the opposite side direction of the semiconductor light emitting element A step of forming a flexible resin forming portion formed of a cavity having a cross section extending upwardly in an upward direction; a step of injecting resin into the flexible resin forming portion from above; and a side surface of the semiconductor light emitting device And a step of opening the mold outward and taking out the flexible resin.

本発明の面状ライトユニットでは、導光板と半導体発光素子との間に配設した柔軟性樹脂が、その外方に向かう光を導光板の入射面の方向に反射する反射形状部を有している。このため、柔軟性樹脂から外方に漏れ出す光を導光板に向かわせることができ、発光効率を高めることができる。   In the planar light unit of the present invention, the flexible resin disposed between the light guide plate and the semiconductor light emitting element has a reflective shape portion that reflects light directed outwardly toward the incident surface of the light guide plate. ing. For this reason, the light leaking outward from the flexible resin can be directed to the light guide plate, and the light emission efficiency can be increased.

また、上記柔軟性樹脂を備えた面状ライトユニットを製造する際、半導体発光素子の相対する側面方向から型締めして発光面上に断面が略椀状に広がる空洞からなる柔軟性樹脂形成部を形成し、そこに樹脂を注入し、側面方向へ型を開いて取り出すことで、反射形状部を有する柔軟性樹脂を簡単に成形することができる。   In addition, when manufacturing a planar light unit including the flexible resin, the flexible resin forming portion is formed of a cavity that is clamped from the opposite side surface direction of the semiconductor light emitting element and has a substantially bowl-shaped cross section on the light emitting surface. The flexible resin having the reflective shape portion can be easily molded by injecting the resin, injecting the resin therein, and opening and removing the mold in the side surface direction.

本発明の一実施形態に係る面状ライトユニットを示す斜視図である。It is a perspective view which shows the planar light unit which concerns on one Embodiment of this invention. 図１に示す面状ライトユニットの部分切断分解斜視図である。FIG. 2 is a partially cut exploded perspective view of the planar light unit shown in FIG. 1. 図１に示す面状ライトユニットの要部断面図である。It is principal part sectional drawing of the planar light unit shown in FIG. （ａ）断面が矩形状をなす柔軟性樹脂と半導体発光素子との密着部分を示す断面図、（ｂ）図３に示す柔軟性樹脂と半導体発光素子との密着部分を示す断面図である。(A) Sectional drawing which shows the contact | adherence part of the flexible resin and semiconductor light emitting element which a cross section makes a rectangular shape, (b) It is sectional drawing which shows the contact | adherence part of the flexible resin and semiconductor light emitting element shown in FIG. 図１に示す柔軟性樹脂の一部変更例を示す斜視図である。It is a perspective view which shows the example of a partial change of the flexible resin shown in FIG. 本発明の面状ライトユニットにおける柔軟性樹脂を形成するときの状態を示す金型の要部断面図である。It is principal part sectional drawing of the metal mold | die which shows a state when forming the flexible resin in the planar light unit of this invention. 図６に示す金型を上方から内部を透視した状態を示す平面図である。FIG. 7 is a plan view showing a state where the inside of the mold shown in FIG. 図７に示す金型を開いたときの状態を示す部分切断斜視図である。FIG. 8 is a partially cut perspective view showing a state when the mold shown in FIG. 7 is opened. （ａ）図３に示す柔軟性樹脂と導光板の密着部分を示す断面図、（ｂ）柔軟性樹脂と導光板の密着部分の一部変更例を示す断面図である。(A) Sectional drawing which shows the contact | adherence part of flexible resin and light-guide plate shown in FIG. 3, (b) It is sectional drawing which shows the partial change example of the contact | adherence part of flexible resin and a light-guide plate.

図１乃至図３に示す面状ライトユニット１０は、パッケージ化した半導体発光素子２と、矩形平板状の導光板３と、半導体発光素子２と導光板３との間に配設され、断面が略椀状をなす長尺状の柔軟性樹脂４とで発光部１を構成している。なお、柔軟性樹脂４は、半導体発光素子２を覆うようにして基板１１に取付けられている。   A planar light unit 10 shown in FIGS. 1 to 3 is disposed between a packaged semiconductor light emitting element 2, a rectangular flat light guide plate 3, and between the semiconductor light emitting element 2 and the light guide plate 3. The light emitting portion 1 is composed of a long flexible resin 4 having a substantially bowl shape. The flexible resin 4 is attached to the substrate 11 so as to cover the semiconductor light emitting element 2.

パッケージ化した半導体発光素子２は、樹脂、金属、セラミック等からなる矩形のモジュール基板２ａと、その表面にダイボンド、ワイヤーボンド、フリップチップ等で実装されたＬＥＤダイ２ｂと、ＬＥＤダイ２ｂを被覆するエポキシ樹脂、シリコン樹脂等の封止樹脂２ｃと、封止樹脂２ｃの周囲を囲う白色枠等の反射性樹脂枠２ｄとから構成されている。なお、本実施形態における半導体発光素子２は、導光板３の入射面３ｂに対応する長さに設定されたフレキシブル回路基板等からなる基板１１に複数個実装されている。   The packaged semiconductor light emitting device 2 covers a rectangular module substrate 2a made of resin, metal, ceramic, etc., an LED die 2b mounted on the surface thereof by die bonding, wire bonding, flip chip, etc., and the LED die 2b. It is comprised from sealing resin 2c, such as an epoxy resin and a silicon resin, and reflective resin frames 2d, such as a white frame surrounding the periphery of the sealing resin 2c. Note that a plurality of semiconductor light emitting elements 2 in the present embodiment are mounted on a substrate 11 made of a flexible circuit board or the like set to a length corresponding to the incident surface 3 b of the light guide plate 3.

導光板３は、アクリル、ポリカーボネート、シリコン等の透光性樹脂からなり、上面に出射面３ａを有し、側面に入射面３ｂを有している。なお、導光板３は、入射面３ｂの両脇に一対の支持部３ｆを備え、支持部３ｆと入射面３ｂとで凹欠部３ｃが形成される。すなわち、本実施形態の面状ライトユニット１０において、導光板３にはその一方の側端部に横向きの凹欠部３ｃが形成されており、その凹欠部３ｃの底部に入射面３ｂが設けられている。なお、面状ライトユニット１０は、少なくとも導光板３の底面３ｄと、導光板３の左右側面及び入射面３ｂに対向する側面３ｅを覆う反射シート１２を備えている。   The light guide plate 3 is made of a translucent resin such as acrylic, polycarbonate, or silicon, and has an exit surface 3a on the top surface and an entrance surface 3b on the side surface. The light guide plate 3 includes a pair of support portions 3f on both sides of the incident surface 3b, and a recessed portion 3c is formed by the support portion 3f and the incident surface 3b. That is, in the planar light unit 10 of the present embodiment, the light guide plate 3 has a laterally recessed portion 3c formed at one side end portion thereof, and an incident surface 3b is provided at the bottom of the recessed portion 3c. It has been. The planar light unit 10 includes a reflection sheet 12 that covers at least the bottom surface 3d of the light guide plate 3, the left and right side surfaces of the light guide plate 3, and the side surface 3e facing the incident surface 3b.

柔軟性樹脂４は、シリコン、ウレタン等のエラストマからなり、透光性を有している。また、この柔軟性樹脂４は、半導体発光素子２を破壊しないように、半導体発光素子２と導光板３との間で圧縮されて約半分の丈になった場合にその圧縮応力が１〜２ＭＰａ以下となる柔軟性を有している。例えば、本実施形態における柔軟性樹脂４は０．１〜１ＭＰａ程度のヤング率を有するように柔軟性が設定されている。   The flexible resin 4 is made of an elastomer such as silicon or urethane and has translucency. Further, the flexible resin 4 has a compressive stress of 1 to 2 MPa when compressed between the semiconductor light emitting element 2 and the light guide plate 3 so as not to break the semiconductor light emitting element 2 and becomes half the length. It has the following flexibility. For example, the flexibility is set so that the flexible resin 4 in this embodiment has a Young's modulus of about 0.1 to 1 MPa.

さらに、この柔軟性樹脂４は、半導体発光素子２の発光面２ｅとなる封止樹脂２ｃの端面及び導光板３の入射面３ｂにそれぞれ密着する第１の密着面４ａ及び第２の密着面４ｂを有している。この第１及び第２の密着面４ａ，４ｂは、それぞれ半導体発光素子２の発光面２ｅ及び導光板３の入射面３ｂの高さ方向（図中上下方向）いっぱいに密着するように形成されており、第１の密着面４ａより第２の密着面４ｂの方が上下に大きくなるように設定されている。また、柔軟性樹脂４の反射形状部４ｃは、半導体発光素子２の発光面２ｅの端部２ｆから対応する導光板３の入射面３ｂの端部３ｇに向かって、断面の曲線部が外方に膨らんだ楕円、双曲線、放物線等の二次曲線になる。   Further, the flexible resin 4 includes a first contact surface 4 a and a second contact surface 4 b that are in close contact with the end surface of the sealing resin 2 c that becomes the light emitting surface 2 e of the semiconductor light emitting element 2 and the incident surface 3 b of the light guide plate 3. have. The first and second contact surfaces 4a and 4b are formed so as to be in close contact with each other in the height direction (vertical direction in the drawing) of the light emitting surface 2e of the semiconductor light emitting element 2 and the incident surface 3b of the light guide plate 3, respectively. The second contact surface 4b is set to be larger in the vertical direction than the first contact surface 4a. Further, the reflection shape portion 4 c of the flexible resin 4 has a curved portion of the cross section outward from the end portion 2 f of the light emitting surface 2 e of the semiconductor light emitting element 2 toward the end portion 3 g of the incident surface 3 b of the corresponding light guide plate 3. It becomes a quadratic curve such as an ellipse, hyperbola, parabola, etc.

この反射形状部４ｃは、図４（ｂ）に示すように、柔軟性樹脂４の外方に向かう光を導光板３の入射面３ｂの方向に反射するものである。即ち、図４（ａ）に示すように、導光板３の入射面３ｂから延長したような矩形状の断面からなる柔軟性樹脂１４を用いた場合、半導体発光素子２の近傍では半導体発光素子２からの光が柔軟性樹脂１４の側面１４ｃに内側から小さい入射角で照射され、そのまま直進して柔軟性樹脂１４の側面１４ｃから外方に漏れ出すことになる。本実施形態における柔軟性樹脂４では、図４（ｂ）に示すように、その側面が外方に膨らむ二次曲線からなる反射形状部４ｃで構成されているため、半導体発光素子２の近傍であっても、半導体発光素子２から照射される光が大きい入射角で反射形状部４ｃに照射され、ほぼ全反射されて導光板３の入射面３ｂの方向に向かうことになる。これにより、発光効率を高めることができる。   As shown in FIG. 4 (b), the reflection shape portion 4 c reflects light traveling outward from the flexible resin 4 in the direction of the incident surface 3 b of the light guide plate 3. That is, as shown in FIG. 4A, when a flexible resin 14 having a rectangular cross section extending from the incident surface 3 b of the light guide plate 3 is used, the semiconductor light emitting element 2 in the vicinity of the semiconductor light emitting element 2. The light from the side is irradiated onto the side surface 14c of the flexible resin 14 from the inside with a small incident angle, and goes straight as it is and leaks outward from the side surface 14c of the flexible resin 14. In the flexible resin 4 in the present embodiment, as shown in FIG. 4B, the side surface is configured by the reflective shape portion 4 c formed of a quadratic curve that bulges outward, and therefore, in the vicinity of the semiconductor light emitting element 2. Even if it exists, the light irradiated from the semiconductor light-emitting element 2 is irradiated to the reflective shape portion 4 c at a large incident angle, and is almost totally reflected toward the incident surface 3 b of the light guide plate 3. Thereby, luminous efficiency can be improved.

すなわち、反射形状部４ｃの断面の曲線は以下のようにして決める。半導体発光素子２の発光面２ｅの中心（図４（ｂ）において、発光面２ｅと矢印Ａの交差する点）を原点として、入射面３ｂの端部３ｇから半導体発光素子２の発光面２ｅの端部２ｆまでを微小角度ΔＲで分割する。次に、一の微小角度領域ΔＲｎにおいて、原点を発した光線の入射角が臨界角を超える線分を設定する。各ｎについて線分を設定したら、これらの線分を平行移動し、入射面３ｂの端部３ｇから半導体発光素子２の発光面２ｅの端部２ｆまで接続する。これで得られた折れ線に対し、二次関数で近似して最適な曲線を得る。   That is, the curve of the cross section of the reflective shape portion 4c is determined as follows. The center of the light emitting surface 2e of the semiconductor light emitting element 2 (the point where the light emitting surface 2e intersects the arrow A in FIG. 4B) is the origin, and the light emitting surface 2e of the semiconductor light emitting element 2 from the end 3g of the incident surface 3b. The portion up to the end 2f is divided at a minute angle ΔR. Next, in one minute angle region ΔRn, a line segment in which the incident angle of the light beam originating from the origin exceeds the critical angle is set. After the line segments are set for each n, these line segments are translated and connected from the end 3g of the incident surface 3b to the end 2f of the light emitting surface 2e of the semiconductor light emitting element 2. The polygonal line thus obtained is approximated by a quadratic function to obtain an optimal curve.

本実施形態における面状ライトユニット１０は、柔軟性樹脂４及び半導体発光素子２が取付けられた基板１１並びに導光板３からなる発光部１を、箱型のバックフレーム（下側のケース）１５に納め、導光板３の出射面３ａに対面する部分が開口した箱型のフロントフレーム（上側のケース）１６をバックフレーム１５に被せたものとなっている。また、面状ライトユニット１０では、基板１１をバックフレーム１５の直立する一の壁内面に接着し、導光板３とバックフレーム１５の直立する他の壁内面との間に弾性支持部材１７を介在させることで、発光部１をバックフレーム１５内に固定している。更に、導光板３の出射面３ａの上には、偏光フィルム、拡散フィルム、プリズムシート等からなる光学シート１８が配置されている。このような構成からなる面状ライトユニット１０は、液晶セル等の背面に配置され、面状に発光する光源として使用される。   The planar light unit 10 according to the present embodiment has a light emitting unit 1 including a substrate 11 and a light guide plate 3 to which a flexible resin 4 and a semiconductor light emitting element 2 are attached, as a box-shaped back frame (lower case) 15. A box-shaped front frame (upper case) 16 having an opening at the portion facing the light exit surface 3a of the light guide plate 3 is covered with the back frame 15. In the planar light unit 10, the substrate 11 is bonded to the inner surface of the upright wall of the back frame 15, and the elastic support member 17 is interposed between the light guide plate 3 and the inner surface of the other upright wall of the back frame 15. By doing so, the light emitting unit 1 is fixed in the back frame 15. Furthermore, an optical sheet 18 made of a polarizing film, a diffusion film, a prism sheet, or the like is disposed on the light exit surface 3a of the light guide plate 3. The planar light unit 10 having such a configuration is disposed on the back surface of a liquid crystal cell or the like, and is used as a light source that emits light in a planar shape.

なお、上記面状ライトユニット１０では、複数の半導体発光素子２に一本の細長い形状の柔軟性樹脂４を密着させたものとなっているが、図５に示すように、椀形をした個々の柔軟性樹脂２４を一つ一つの半導体発光素子２に密着させることも可能である。   In the planar light unit 10, a single elongated flexible resin 4 is adhered to a plurality of semiconductor light emitting elements 2. However, as shown in FIG. It is also possible to adhere the flexible resin 24 to each semiconductor light emitting element 2.

次に、上記面状ライトユニット１０における柔軟性樹脂４の形成工程を説明する。半導体発光素子２と柔軟性樹脂４は、柔軟性樹脂４が形成される際に半導体発光素子２に密着することで一体化される。図６乃至図８に示すように、柔軟性樹脂４を形成する際には、金型３０を用いる。この金型３０は、基板１１上に実装された半導体発光素子２の相対する側面方向から型閉めされるものであり、型閉めされると、半導体発光素子２の発光面２ｅとなる封止樹脂２ｃの端面上に、上方に向かって断面が略椀状に広がる空洞からなる柔軟性樹脂形成部３０ａが内部に形成される。   Next, the formation process of the flexible resin 4 in the planar light unit 10 will be described. The semiconductor light emitting element 2 and the flexible resin 4 are integrated by being in close contact with the semiconductor light emitting element 2 when the flexible resin 4 is formed. As shown in FIGS. 6 to 8, a mold 30 is used when the flexible resin 4 is formed. The mold 30 is closed from the opposite side direction of the semiconductor light emitting element 2 mounted on the substrate 11. When the mold is closed, a sealing resin that becomes the light emitting surface 2 e of the semiconductor light emitting element 2 is formed. On the end face of 2c, the flexible resin forming part 30a which consists of the cavity which a cross section expands in a substantially bowl shape toward upper direction is formed inside.

上記のように半導体発光素子２の側面方向から型閉めした後、金型３０の上面に設けられた注入口３０ｂから柔軟性樹脂形成部３０ａ内に樹脂を注入する。その後、半導体発光素子２の側面外側方向（図中の矢印の方向）へ金型３０を開き、柔軟性樹脂４と半導体発光素子２を取り出す。これにより柔軟性樹脂４は、半導体発光素子２に密着した状態で一体化されて形成される。   After the mold is closed from the side surface direction of the semiconductor light emitting element 2 as described above, the resin is injected into the flexible resin forming portion 30 a from the injection port 30 b provided on the upper surface of the mold 30. Thereafter, the mold 30 is opened in the direction of the outer side of the side surface of the semiconductor light emitting element 2 (the direction of the arrow in the figure), and the flexible resin 4 and the semiconductor light emitting element 2 are taken out. As a result, the flexible resin 4 is integrally formed while being in close contact with the semiconductor light emitting element 2.

上記製造方法によれば、本実施形態における柔軟性樹脂４のように、上端部が下端部より幅が大きい形状であっても金型で容易に成形することができる。しかも、柔軟性樹脂４を半導体発光素子２に一体化した状態で成形しているので、柔軟性樹脂４を単体で成形した後、半導体発光素子２に密着させる場合に比べて、精度が良く且つ組み立て易いという利点もある。   According to the said manufacturing method, like the flexible resin 4 in this embodiment, even if it is a shape whose upper end part is a width | variety larger than a lower end part, it can shape | mold easily with a metal mold | die. In addition, since the flexible resin 4 is molded in a state of being integrated with the semiconductor light emitting element 2, it is more accurate than the case where the flexible resin 4 is molded as a single unit and then adhered to the semiconductor light emitting element 2. There is also an advantage that it is easy to assemble.

一方、図９（ａ）に示すように、前述した導光板３の入射面３ｂは、半導体発光素子２の発光面２ｅとなる封止樹脂２ｃの端面に平行で平坦な面からなり、それらに密着する柔軟性樹脂４の第１の密着面４ａ及び第２の密着面４ｂも互いに並行で平坦な面からなる。この場合、各面の成形及び密着性の確保は容易であり、製造し易いものとなる。また、半導体発光素子２、柔軟性樹脂４及び導光板３の中心軸（光軸）をより合わせ易くするため、図９（ｂ）に示すように、導光板３の入射面３ｂとそれに密着する柔軟性樹脂４の第２の密着面４ｂの一方を外方端から中心軸に向かう略Ｖ字状の凸面で構成し、他方を外方端から中心軸に向かう略Ｖ字状の凹面で構成して嵌合するようにすることもできる。   On the other hand, as shown in FIG. 9A, the incident surface 3b of the light guide plate 3 described above is a flat surface parallel to the end surface of the sealing resin 2c that becomes the light emitting surface 2e of the semiconductor light emitting element 2, and The first contact surface 4a and the second contact surface 4b of the flexible resin 4 that is in close contact with each other are also parallel and flat surfaces. In this case, it is easy to mold and secure the adhesion of each surface, and it is easy to manufacture. Further, in order to make it easier to align the central axis (optical axis) of the semiconductor light emitting element 2, the flexible resin 4, and the light guide plate 3, as shown in FIG. 9B, the light entrance plate 3 is in close contact with the incident surface 3b. One of the second contact surfaces 4b of the flexible resin 4 is configured by a substantially V-shaped convex surface extending from the outer end toward the central axis, and the other is configured by a substantially V-shaped concave surface extending from the outer end toward the central axis. And can be fitted.

１ 発光部
２ 半導体発光素子
２ａ モジュール基板
２ｂ ＬＥＤダイ
２ｃ 封止樹脂
２ｄ 反射性樹脂枠
２ｅ 発光面
２ｆ 端部
３ 導光板
３ａ 出射面
３ｂ 入射面
３ｃ 凹欠部
３ｄ 底面
３ｅ 側面
３ｆ 支持部
３ｇ 端部
４，２４ 柔軟性樹脂
４ａ 第１の密着面
４ｂ 第２の密着面
４ｃ 反射形状部
１０ 面状ライトユニット
１１ 基板
１２ 反射シート
１４ 柔軟性樹脂
１４ｃ 側面
１５ バックフレーム
１６ フロントフレーム
１７ 弾性支持部材
１８ 光学シート
３０ 金型
３０ａ 柔軟性樹脂形成部
３０ｂ 注入口 DESCRIPTION OF SYMBOLS 1 Light emission part 2 Semiconductor light emitting element 2a Module board | substrate 2b LED die 2c Sealing resin 2d Reflective resin frame 2e Light emission surface 2f End part 3 Light guide plate 3a Output surface 3b Incident surface 3c Recessed part 3d Bottom surface 3e Side surface 3f Support part 3g End Portions 4, 24 Flexible resin 4a First contact surface 4b Second contact surface 4c Reflective shape portion 10 Planar light unit 11 Substrate 12 Reflective sheet 14 Flexible resin 14c Side surface 15 Back frame 16 Front frame 17 Elastic support member 18 Optical sheet 30 Mold 30a Flexible resin forming part 30b Inlet

Claims (5)

側端に入射面を有し、上面に出射面を有する導光板と、前記入射面の方向に光を照射する半導体発光素子と、前記導光板の入射面と前記半導体発光素子との間に配設された透光性及び柔軟性を有する柔軟性樹脂と、を備えた面状ライトユニットであって、
前記柔軟性樹脂は、前記半導体発光素子の発光面の端部から対応する前記導光板の入射面の端部に向かう曲面からなる反射形状部を有し、前記反射形状部は、前記柔軟性樹脂の外方に向かう光を前記導光板の入射面の方向に反射することを特徴とする面状ライトユニット。 A light guide plate having an incident surface at a side end and an output surface on an upper surface, a semiconductor light emitting element that irradiates light in the direction of the incident surface, and a light emitting plate disposed between the incident surface of the light guide plate and the semiconductor light emitting element. A planar light unit comprising a translucent resin and a flexible resin,
The flexible resin has a reflection shape portion formed of a curved surface from the end portion of the light emitting surface of the semiconductor light emitting element toward the end portion of the incident surface of the corresponding light guide plate, and the reflection shape portion includes the flexible resin. The planar light unit is characterized in that light traveling outward is reflected in the direction of the incident surface of the light guide plate. 前記反射形状部は、前記半導体発光素子の発光面の端部から対応する前記導光板の入射面の端部に向かって外方に膨らむ二次曲面からなる請求項１に記載の面状ライトユニット。   2. The planar light unit according to claim 1, wherein the reflective shape portion is a quadratic curved surface that bulges outward from an end portion of the light emitting surface of the semiconductor light emitting element toward an end portion of a corresponding incident surface of the light guide plate. . 前記導光板の入射面は、前記半導体発光素子の発光面に平行で平坦な面からなる請求項１に記載の面状ライトユニット。   The planar light unit according to claim 1, wherein an incident surface of the light guide plate is a flat surface parallel to a light emitting surface of the semiconductor light emitting element. 前記導光板の入射面と前記入射面に密着する前記柔軟性樹脂の密着面は、その一方が外方端から中心軸に向かう略Ｖ字状の凸面からなり、他方が外方端から中心軸に向かう略Ｖ字状の凹面からなる請求項１に記載の面状ライトユニット。   One of the contact surface of the light guide plate and the contact surface of the flexible resin that is in close contact with the entrance surface is a substantially V-shaped convex surface from the outer end toward the central axis, and the other is the central axis from the outer end. The planar light unit according to claim 1, comprising a substantially V-shaped concave surface facing toward the surface. 導光板と、前記導光板の入射面に光を照射する半導体発光素子と、前記導光板の入射面と前記半導体発光素子との間に配設された透光性及び柔軟性を有する柔軟性樹脂とを備えた面状ライトユニットの製造方法であって、
前記半導体発光素子の相対する側面方向から型締めして前記半導体発光素子の発光面上に上方に向かって断面が略椀状に広がる空洞からなる柔軟性樹脂形成部を形成する工程と、
前記柔軟性樹脂形成部にその上方から樹脂を注入する工程と、
前記半導体発光素子の側面外側方向へ型を開いて前記柔軟性樹脂を取り出す工程と、
を備えることを特徴とする面状ライトユニットの製造方法。 A light guide plate, a semiconductor light emitting element for irradiating light on an incident surface of the light guide plate, and a flexible resin having translucency and flexibility disposed between the incident surface of the light guide plate and the semiconductor light emitting element A method for manufacturing a planar light unit comprising:
Forming a flexible resin forming portion including a cavity having a cross section extending in a substantially bowl shape upward on the light emitting surface of the semiconductor light emitting device by clamping from the opposite side surface direction of the semiconductor light emitting device;
Injecting resin into the flexible resin forming part from above;
Opening the mold in the direction of the outer side of the side surface of the semiconductor light emitting element and taking out the flexible resin;
A method of manufacturing a planar light unit.
JP2016243940A 2016-10-28 2016-12-16 Planar light unit and manufacturing method of the same Pending JP2018098111A (en)

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003026031A1 (en) * 2001-09-11 2003-03-27 Bridgestone Corporation Condensing element and forming method therefor and condensing element-carrying led lamp and linear light emitting device using led lamp as light source
JP2004095390A (en) * 2002-08-30 2004-03-25 Fujitsu Display Technologies Corp Lighting device and display device
JP2005353486A (en) * 2004-06-11 2005-12-22 Sony Corp Backlight device, liquid crystal display device having it, and method for molding light guide plate composing backlight device
JP2006331969A (en) * 2005-05-30 2006-12-07 Sanyo Epson Imaging Devices Corp Backlight device and liquid crystal display using it
JP2007041476A (en) * 2005-08-05 2007-02-15 Matsushita Electric Ind Co Ltd Backlight
JP2008505441A (en) * 2004-06-30 2008-02-21 スリーエム イノベイティブ プロパティズ カンパニー Illumination system with phosphor having short path reflector and method for producing the same
JP2008053013A (en) * 2006-08-23 2008-03-06 Sony Corp Backlight device, and liquid crystal display device
JP2009510742A (en) * 2005-09-30 2009-03-12 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング LIGHTING UNIT WITH LIGHT EMITTING DIODE CHIP AND LIGHT GUIDE, LIGHTING UNIT MANUFACTURING METHOD, AND LCD DISPLAY
JP2015053189A (en) * 2013-09-06 2015-03-19 パナソニックＩｐマネジメント株式会社 Lighting fixture

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003026031A1 (en) * 2001-09-11 2003-03-27 Bridgestone Corporation Condensing element and forming method therefor and condensing element-carrying led lamp and linear light emitting device using led lamp as light source
JP2004095390A (en) * 2002-08-30 2004-03-25 Fujitsu Display Technologies Corp Lighting device and display device
JP2005353486A (en) * 2004-06-11 2005-12-22 Sony Corp Backlight device, liquid crystal display device having it, and method for molding light guide plate composing backlight device
JP2008505441A (en) * 2004-06-30 2008-02-21 スリーエム イノベイティブ プロパティズ カンパニー Illumination system with phosphor having short path reflector and method for producing the same
JP2006331969A (en) * 2005-05-30 2006-12-07 Sanyo Epson Imaging Devices Corp Backlight device and liquid crystal display using it
JP2007041476A (en) * 2005-08-05 2007-02-15 Matsushita Electric Ind Co Ltd Backlight
JP2009510742A (en) * 2005-09-30 2009-03-12 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング LIGHTING UNIT WITH LIGHT EMITTING DIODE CHIP AND LIGHT GUIDE, LIGHTING UNIT MANUFACTURING METHOD, AND LCD DISPLAY
JP2008053013A (en) * 2006-08-23 2008-03-06 Sony Corp Backlight device, and liquid crystal display device
JP2015053189A (en) * 2013-09-06 2015-03-19 パナソニックＩｐマネジメント株式会社 Lighting fixture

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