JP2018082095A - Electronic component mounting system and electronic component mounting method - Google Patents

Electronic component mounting system and electronic component mounting method Download PDF

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JP2018082095A
JP2018082095A JP2016224371A JP2016224371A JP2018082095A JP 2018082095 A JP2018082095 A JP 2018082095A JP 2016224371 A JP2016224371 A JP 2016224371A JP 2016224371 A JP2016224371 A JP 2016224371A JP 2018082095 A JP2018082095 A JP 2018082095A
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component mounting
electronic component
printing
substrate
substrates
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秀典 太田
Hidenori Ota
秀典 太田
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Hanwha Vision Co Ltd
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Hanwha Techwin Co Ltd
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Priority to JP2016224371A priority Critical patent/JP2018082095A/en
Priority to KR1020170059909A priority patent/KR20180055668A/en
Priority to CN201810133397.XA priority patent/CN108882553A/en
Publication of JP2018082095A publication Critical patent/JP2018082095A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting system and an electronic component mounting method capable of improving the printing quality of solder by screen printing as compared with the conventional technique.SOLUTION: According to characteristics of substrates on the basis of actually measured positional data of electrodes of the substrates, the substrates are classified into groups, and screen masks corresponding to groups of substrates are prepared. In a printing apparatus 1, screen printing is executed by using a screen mask corresponding to the group to which the substrate belongs.SELECTED DRAWING: Figure 1

Description

本発明は、基板に電子部品を半田接合により実装して実装基板を製造する電子部品実装システム及び電子部品実装方法に関する。   The present invention relates to an electronic component mounting system and an electronic component mounting method for manufacturing a mounting substrate by mounting electronic components on a substrate by solder bonding.

かかる電子部品実装システム（電子部品実装方法）は、基板に形成された電子部品接合用の電極に半田を印刷する印刷装置（印刷工程）と、半田が印刷された基板に電子部品を搭載する電子部品搭載装置（電子部品搭載工程）とを含んで成り、一般的に印刷装置（印刷工程）では、スクリーンマスクを用いたスクリーン印刷が実行される。そして、従来、スクリーン印刷においては、基板の種類ごとに共通のスクリーンマスクが用いられていた。   Such an electronic component mounting system (electronic component mounting method) includes a printing device (printing process) that prints solder on an electrode for joining electronic components formed on a substrate, and an electronic device that mounts the electronic component on a substrate printed with solder. In general, the printing apparatus (printing process) executes screen printing using a screen mask. Conventionally, in screen printing, a common screen mask is used for each type of substrate.

スクリーン印刷において基板に印刷される半田の相対的な位置は、スクリーンマスクの形状（開口パターン）によって決定され、理想的には半田の印刷は、基板の各電極に対応した位置に行われるべきである。しかし、スクリーンマスクの形状と各電極との相対的位置関係に位置ズレ（不適合）が生じれば、全ての半田を完全に正しい位置に印刷することは不可能である。   In the screen printing, the relative position of the solder printed on the substrate is determined by the shape (opening pattern) of the screen mask, and ideally the solder printing should be performed at a position corresponding to each electrode on the substrate. is there. However, if a positional shift (nonconformity) occurs in the relative positional relationship between the shape of the screen mask and each electrode, it is impossible to print all the solder completely at the correct position.

ところで、実際の基板は１枚ごとに製造誤差によるバラツキがあり、電極の厳密な位置は、基板ごとに僅かに異なっている。このため、基板の種類が同一で、一見、全て同一に見える幾つかの基板も、実際には準備されたスクリーンマスクとの適合性の高いものと低いものが混在していることになる。スクリーンマスクと適合性の高い基板であれば、良好な印刷品質が得られるが、適合性が低いものに対しては必然的にそれよりも印刷品質が悪化する。   By the way, the actual substrates have variations due to manufacturing errors, and the exact positions of the electrodes are slightly different from substrate to substrate. For this reason, some substrates that are the same and seem to be the same at all seem to have a mixture of high and low compatibility with the prepared screen mask. If the substrate is highly compatible with the screen mask, good print quality can be obtained, but the print quality is inevitably deteriorated for those having low compatibility.

本発明が解決しようとする課題は、スクリーン印刷による半田の印刷品質を従来技術に対して向上させることができる電子部品実装システム及び電子部品実装方法を提供することにある。   The problem to be solved by the present invention is to provide an electronic component mounting system and an electronic component mounting method capable of improving the print quality of solder by screen printing as compared with the prior art.

本発明の一観点によれば、次の電子部品実装システムが提供される。
「スクリーンマスクを用いたスクリーン印刷により、基板に形成された電子部品接合用の電極に半田を印刷する印刷装置と、前記半田が印刷された基板に電子部品を搭載する電子部品搭載装置とを備える電子部品実装システムであって、
実測した前記電極の位置データに基づく基板の特徴に応じて、基板をグループ分けする機能を備えるとともに、基板のグループに対応させたスクリーンマスクを備え、
前記印刷装置は、その基板の属するグループに対応するスクリーンマスクを用いてスクリーン印刷を実行することを特徴とする電子部品実装システム。」 According to one aspect of the present invention, the following electronic component mounting system is provided.
“A printing device that prints solder on an electrode for joining electronic components formed on a substrate by screen printing using a screen mask, and an electronic component mounting device that mounts electronic components on the substrate on which the solder is printed. An electronic component mounting system,
According to the characteristics of the substrate based on the measured position data of the electrodes, the function of grouping the substrates, and a screen mask corresponding to the group of substrates,
The electronic component mounting system, wherein the printing apparatus performs screen printing using a screen mask corresponding to a group to which the board belongs. "

本発明の他の観点によれば、次の電子部品実装方法が提供される。
「スクリーンマスクを用いたスクリーン印刷により、基板に形成された電子部品接合用の電極に半田を印刷する印刷工程と、前記半田が印刷された基板に電子部品を搭載する電子部品搭載工程とを含む電子部品実装方法であって、
実測した前記電極の位置データに基づく基板の特徴に応じて、基板をグループ分けする工程と、基板のグループに対応させたスクリーンマスクを準備する工程とをさらに含み、
前記印刷工程では、その基板の属するグループに対応するスクリーンマスクを用いてスクリーン印刷を実行することを特徴とする電子部品実装システム。」 According to another aspect of the present invention, the following electronic component mounting method is provided.
“Includes a printing process in which solder is printed on the electrodes for joining electronic components formed on the substrate by screen printing using a screen mask, and an electronic component mounting step in which the electronic components are mounted on the substrate on which the solder is printed. An electronic component mounting method,
Further comprising the steps of grouping the substrates according to the characteristics of the substrates based on the measured position data of the electrodes, and preparing a screen mask corresponding to the group of the substrates,
In the printing process, the electronic component mounting system is characterized in that screen printing is performed using a screen mask corresponding to a group to which the board belongs. "

本発明によれば、実測した電極の位置データに基づく基板の特徴に応じて基板をグループ分けすることで、基板のグループごとに適切なスクリーンマスクを選択することができるので、スクリーン印刷による半田の印刷品質を従来技術に対して向上させることができる。   According to the present invention, it is possible to select an appropriate screen mask for each group of the substrates by grouping the substrates according to the characteristics of the substrates based on the measured electrode position data. The print quality can be improved over the prior art.

本発明の一実施形態の電子部品実装システムを示すシステム構成図である。1 is a system configuration diagram showing an electronic component mounting system according to an embodiment of the present invention.

図１は、本発明の一実施形態の電子部品実装システムを示すシステム構成図である。図１において電子部品実装システムは、印刷装置１、印刷検査装置２、電子部品搭載装置３、搭載状態検査装置４、リフロー装置５及び実装状態検査装置６の各装置を連結して成り、各装置を通信ネットワーク７によって接続し、全体を管理コンピュータ８によって制御する構成となっている。   FIG. 1 is a system configuration diagram showing an electronic component mounting system according to an embodiment of the present invention. In FIG. 1, the electronic component mounting system includes a printing apparatus 1, a printing inspection apparatus 2, an electronic component mounting apparatus 3, a mounting state inspection apparatus 4, a reflow apparatus 5, and a mounting state inspection apparatus 6. Are connected by a communication network 7 and the whole is controlled by a management computer 8.

以下、各装置の機能を説明しつつ、図１の電子部品実装システムによる電子部品実装方法を説明する。   Hereinafter, the electronic component mounting method by the electronic component mounting system of FIG. 1 will be described while explaining the functions of each device.

印刷装置１は、スクリーンマスクを用いたスクリーン印刷により、基板に形成された電子部品接合用の電極に半田を印刷する。具体的には印刷装置１は、実際に半田を印刷する対象の基板（以下「実物基板」という。）の属するグループに対応するスクリーンを用いてスクリーン印刷を実行する。   The printing apparatus 1 prints solder on the electrodes for joining electronic components formed on the substrate by screen printing using a screen mask. Specifically, the printing apparatus 1 executes screen printing using a screen corresponding to a group to which a board (hereinafter referred to as “real board”) to which solder is actually printed belongs.

より具体的に説明すると、予め、当該電子部品実装システムの前工程である基板製造工程において、最終検査時等に基板ごとに電極位置の測定を行い、その測定データ（電極の位置データ）から得られる基板の特徴によって基板をグループ分けしておく。例えば、基板の特徴として、基板の伸縮方向と伸縮度ごとに基板を複数のグループにグループ分けする。併せて、グループごとに適正化したスクリーンマスクを準備しておく。すなわち、図１に概念的に示すように、基板をＡ、Ｂ、Ｃ・・・の複数のグループにグループ分けし、グループごとに適正化したスクリーンマスクＡ、Ｂ、Ｃ・・・を準備しておく。   More specifically, in the board manufacturing process, which is a pre-process of the electronic component mounting system, the electrode position is measured for each board at the time of final inspection, and obtained from the measurement data (electrode position data). The substrates are grouped according to the characteristics of the substrates to be obtained. For example, as a feature of the substrate, the substrates are grouped into a plurality of groups according to the expansion direction and the expansion degree of the substrate. In addition, a screen mask optimized for each group is prepared. That is, as conceptually shown in FIG. 1, the substrates are grouped into a plurality of groups A, B, C... And screen masks A, B, C. Keep it.

そして、印刷装置１は、実物基板の属するグループに対応するスクリーンマスクを用いてスクリーン印刷を実行する。すなわち、印刷装置１では、基板の属するグループ情報（以下「基板所属グループ情報」という。）に基づいて、実物基板ごとに適切なスクリーンマスクを選択してスクリーン印刷を実行する。   Then, the printing apparatus 1 performs screen printing using a screen mask corresponding to the group to which the actual substrate belongs. That is, the printing apparatus 1 executes screen printing by selecting an appropriate screen mask for each real board based on group information to which the board belongs (hereinafter referred to as “board board group information”).

この基板所属グループ情報は、直接又は管理コンピュータ８を経由して印刷装置１に伝達され、基板に印字されている識別番号、バーコード、当該電子部品実装システム上の処理順序等から、実物基板と一対一で対応可能である。   This board affiliation group information is transmitted to the printing apparatus 1 directly or via the management computer 8, and from the identification number printed on the board, the barcode, the processing order on the electronic component mounting system, etc. One-to-one correspondence is possible.

印刷装置１又は管理コンピュータ８は、この基板所属グループ情報に基づいて、実物基板の属するグループに対応するスクリーンマスクを自動的に選択する機能を付加的に備えることができる。この機能は、図１に概念的に示すように基板のグループとスクリーンマスクとの対応関係のデータと、基板所属グループ情報があれば実現可能である。なお、前記の基板のグループとスクリーンマスクとの対応関係のデータは、基板所属グループ情報に含めることができる。   The printing apparatus 1 or the management computer 8 can additionally have a function of automatically selecting a screen mask corresponding to a group to which the actual board belongs based on the board affiliation group information. As conceptually shown in FIG. 1, this function can be realized if there is data on the correspondence between a group of substrates and a screen mask and substrate group information. The data on the correspondence between the substrate group and the screen mask can be included in the substrate affiliation group information.

さらに、印刷装置１又は管理コンピュータ８は、現物基板の属するグループに対応する適切なスクリーンマスクが印刷装置１に装着されているか否かを確認する機能、及び適切でない場合に警告を発する機能を付加的に備えることができる。これらの機能は、印刷装置１に実際に装着されているスクリーンマスクを識別する手段があれば実現可能である。   Further, the printing apparatus 1 or the management computer 8 has a function of confirming whether or not an appropriate screen mask corresponding to the group to which the actual board belongs is mounted on the printing apparatus 1 and a function of issuing a warning when it is not appropriate. Can be prepared. These functions can be realized if there is a means for identifying the screen mask actually mounted on the printing apparatus 1.

図１に戻って、印刷検査装置２は、半田印刷後の基板における印刷状態を検査する。電子部品搭載装置３は半田が印刷された基板に電子部品を搭載する。搭載状態検査装置４は電子部品搭載後の基板上における電子部品の有無や位置ズレを検査する。リフロー装置５は電子部品搭載後の基板を加熱して、電子部品を基板に半田接合する。そして、実装状態検査装置６は、半田接合後の基板上における電子部品の実装状態を検査する。以上により実装基板が製造される。   Returning to FIG. 1, the print inspection apparatus 2 inspects the printing state on the substrate after solder printing. The electronic component mounting apparatus 3 mounts electronic components on a board on which solder is printed. The mounting state inspection device 4 inspects the presence / absence of the electronic component and the positional deviation on the substrate after the electronic component is mounted. The reflow device 5 heats the substrate after the electronic component is mounted, and solders the electronic component to the substrate. Then, the mounting state inspection device 6 inspects the mounting state of the electronic component on the substrate after the solder bonding. The mounting board is manufactured as described above.

このように本実施形態では、実測した電極の位置データに基づく基板の特徴に応じて基板をグループ分けし、その基板のグループごとに適切な（適合性の高い）スクリーンマスクを選択することができるので、スクリーン印刷による半田の印刷品質を従来技術に対して向上させることができる。また、グループ分けするクループ数を増やしてスクリーンマスクのバリエーション（種類）を増やすことで、より適合性の高いスクリーンマスクを選択できるようになり、印刷品質が向上するとともに、対応できる基板数が増え結果的に歩留まりも上昇する。   As described above, in this embodiment, the substrates can be grouped according to the characteristics of the substrates based on the measured electrode position data, and an appropriate (highly compatible) screen mask can be selected for each group of the substrates. Therefore, the print quality of solder by screen printing can be improved as compared with the conventional technology. In addition, by increasing the number of groups to be grouped and increasing screen mask variations (types), it becomes possible to select screen masks with higher suitability, improving print quality and increasing the number of substrates that can be handled. Therefore, the yield also increases.

なお、本実施形態では、基板所属グループ情報を電子部品実装システムの前工程である基板製造工程で取得し、これを電子部品実装システムに伝達するようにしたが、基板所属グループ情報は、電子部品実装システム内で取得することもできる。すなわち、電子部品実装システム内において印刷装置１の上流に、基板の電極位置を測定する装置を設置することもできる。   In this embodiment, the board affiliation group information is acquired in the board manufacturing process, which is the previous process of the electronic component mounting system, and is transmitted to the electronic component mounting system. It can also be acquired in the mounting system. In other words, a device for measuring the electrode position of the substrate can be installed upstream of the printing device 1 in the electronic component mounting system.

１ 印刷装置
２ 印刷検査装置
３ 電子部品搭載装置
４ 搭載状態検査装置
５ リフロー装置
６ 実装状態検査装置
７ 通信ネットワーク
８ 管理コンピュータ DESCRIPTION OF SYMBOLS 1 Printing apparatus 2 Print inspection apparatus 3 Electronic component mounting apparatus 4 Mounting condition inspection apparatus 5 Reflow apparatus 6 Mounting condition inspection apparatus 7 Communication network 8 Management computer

Claims (6)

スクリーンマスクを用いたスクリーン印刷により、基板に形成された電子部品接合用の電極に半田を印刷する印刷装置と、前記半田が印刷された基板に電子部品を搭載する電子部品搭載装置とを備える電子部品実装システムであって、
実測した前記電極の位置データに基づく基板の特徴に応じて、基板をグループ分けする機能を備えるとともに、基板のグループに対応させたスクリーンマスクを備え、
前記印刷装置は、その基板の属するグループに対応するスクリーンマスクを用いてスクリーン印刷を実行することを特徴とする電子部品実装システム。 An electronic apparatus comprising: a printing device that prints solder on an electrode for joining electronic components formed on a substrate by screen printing using a screen mask; and an electronic component mounting device that mounts electronic components on the substrate on which the solder is printed. A component mounting system,
According to the characteristics of the substrate based on the measured position data of the electrodes, the function of grouping the substrates, and a screen mask corresponding to the group of substrates,
The electronic component mounting system, wherein the printing apparatus performs screen printing using a screen mask corresponding to a group to which the board belongs. 基板の属するグループに対応するスクリーンマスクを選択する機能をさらに備える、請求項１に記載の電子部品実装システム。   The electronic component mounting system according to claim 1, further comprising a function of selecting a screen mask corresponding to a group to which the substrate belongs. 基板の属するグループに対応する適切なスクリーンマスクが前記印刷装置に装着されているか否かを確認する機能をさらに備える、請求項１又は２に記載の電子部品実装システム。   The electronic component mounting system according to claim 1, further comprising a function of confirming whether an appropriate screen mask corresponding to a group to which the substrate belongs is mounted on the printing apparatus. スクリーンマスクを用いたスクリーン印刷により、基板に形成された電子部品接合用の電極に半田を印刷する印刷工程と、前記半田が印刷された基板に電子部品を搭載する電子部品搭載工程とを含む電子部品実装方法であって、
実測した前記電極の位置データに基づく基板の特徴に応じて、基板をグループ分けする工程と、基板のグループに対応させたスクリーンマスクを準備する工程とをさらに含み、
前記印刷工程では、その基板の属するグループに対応するスクリーンマスクを用いてスクリーン印刷を実行することを特徴とする電子部品実装システム。 An electronic device including a printing process for printing solder on an electrode for joining electronic components formed on a substrate by screen printing using a screen mask, and an electronic component mounting step for mounting electronic components on the substrate on which the solder is printed A component mounting method,
Further comprising the steps of grouping the substrates according to the characteristics of the substrates based on the measured position data of the electrodes, and preparing a screen mask corresponding to the group of the substrates,
In the printing process, the electronic component mounting system is characterized in that screen printing is performed using a screen mask corresponding to a group to which the board belongs. 基板の属するグループに対応するスクリーンマスクを選択する工程をさらに含む、請求項４に記載の電子部品実装方法。   The electronic component mounting method according to claim 4, further comprising selecting a screen mask corresponding to a group to which the substrate belongs. 基板の属するグループに対応する適切なスクリーンマスクが前記印刷工程で使用されているか否か確認する工程をさらに含む、請求項４又は５に記載の電子部品実装システム。   The electronic component mounting system according to claim 4, further comprising a step of confirming whether an appropriate screen mask corresponding to a group to which the substrate belongs is used in the printing step.
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