JP2018077095A - Temperature sensor device - Google Patents

Temperature sensor device Download PDF

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JP2018077095A
JP2018077095A JP2016218330A JP2016218330A JP2018077095A JP 2018077095 A JP2018077095 A JP 2018077095A JP 2016218330 A JP2016218330 A JP 2016218330A JP 2016218330 A JP2016218330 A JP 2016218330A JP 2018077095 A JP2018077095 A JP 2018077095A
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temperature sensor
sensor device
inner convex
convex portion
mounting portion
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JP6855758B2 (en
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裕 若林
Hiroshi Wakabayashi
裕 若林
勇喜 今野
Yuki Konno
勇喜 今野
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TDK Corp
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TDK Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/01—Mounting; Supporting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a temperature sensor device which can be easily attached to an object to detect its temperature, and whose heat sensitive element is hardly peeled off.SOLUTION: A temperature sensor device 2 includes: a heat sensitive element 4; an attachment bracket 10 to which the heat sensitive element 4 is attached; and a bonding resin 30 filled in a gap between the attachment bracket 10 and the heat sensitive element 4. The attachment bracket 10 includes inside protrusions 20 protruding from inner surfaces 14d of side walls 14 of the attachment bracket 10 toward the bonding resin 30.SELECTED DRAWING: Figure 2

Description

本発明は、温度を検出したい物体に対して容易に取り付けることが可能で、感熱素子が剥がれにくい温度センサ装置に関する。   The present invention relates to a temperature sensor device that can be easily attached to an object whose temperature is to be detected, and a thermal element is difficult to peel off.

温度を検出したい物体に対して容易に取り付けることが可能な温度センサ装置として、たとえば下記の特許文献１に示す温度センサ装置が知られている。この温度センサ装置では、金属板が感熱素子に絶縁性樹脂を用いて取り付けられ、その金属板が、温度測定対象物に取り付けられる。   As a temperature sensor device that can be easily attached to an object whose temperature is to be detected, for example, a temperature sensor device shown in Patent Document 1 below is known. In this temperature sensor device, the metal plate is attached to the thermal element using an insulating resin, and the metal plate is attached to the temperature measurement object.

しかしながら、従来の温度センサ装置では、感熱素子が絶縁性樹脂と共に、素子取付部としての金属板から剥がれやすいという課題を有している。   However, the conventional temperature sensor device has a problem that the thermal element is easily peeled off from the metal plate as the element mounting portion together with the insulating resin.

特開平１０−２７４５６７号公報JP-A-10-274567

本発明は、このような実状に鑑みてなされ、その目的は、温度を検出したい物体に対して容易に取り付けることが可能で、しかも感熱素子が剥がれにくい温度センサ装置を提供することである。   The present invention has been made in view of such a situation, and an object of the present invention is to provide a temperature sensor device that can be easily attached to an object whose temperature is to be detected and in which a thermal element is not easily peeled off.

上記目的を達成するために、本発明に係る温度センサ装置は、
感熱素子と、
前記感熱素子が取り付けられる素子取付部と、
前記素子取付部と前記感熱素子との間の隙間に充填される接着用樹脂と、を有する温度センサ装置であって、
前記素子取付部が、当該素子取付部の内面から前記接着用樹脂に向けて突出する内側凸部を有する。 In order to achieve the above object, a temperature sensor device according to the present invention includes:
A thermal element;
An element mounting portion to which the thermosensitive element is mounted;
A temperature sensor device having an adhesive resin filled in a gap between the element mounting portion and the thermosensitive element,
The element mounting portion has an inner convex portion that protrudes from the inner surface of the element mounting portion toward the adhesive resin.

本発明の温度センサ装置では、素子取付部を温度測定対象物に、ねじやボルトあるいはクリップなどの締結具などで容易に取り付けることができる。また、素子取付部が、当該素子取付部の内面から接着用樹脂に向けて突出する内側凸部を有するため、その内側凸部が接着用樹脂の抜け止めとなり、接着用樹脂が感熱素子と共に素子取付部から容易に剥がれることはなくなる。なお、感熱素子の表面には、樹脂などで構成してある被覆層が形成してあることから、感熱素子と接着用樹脂との接続は強固であり、その界面で剥がれるおそれは少ない。   In the temperature sensor device of the present invention, the element attachment portion can be easily attached to the temperature measurement object with a fastener such as a screw, bolt or clip. In addition, since the element mounting portion has an inner convex portion that protrudes from the inner surface of the element mounting portion toward the adhesive resin, the inner convex portion serves to prevent the adhesive resin from coming off, and the adhesive resin together with the thermal element is an element. It will not be easily peeled off from the mounting portion. In addition, since the coating layer comprised with resin etc. is formed in the surface of a thermal element, the connection of a thermal element and adhesive resin is strong, and there is little possibility of peeling at the interface.

好ましくは、前記素子取付部の内面からの前記内側凸部の突出高さは、前記素子取付部の厚みの４／５以下、さらに好ましくは２／５〜４／５である。このような範囲で内側凸部を形成することで、内側凸部に沿って貫通孔が形成されることはなく、貫通孔を通して接着用樹脂が素子取付部の外面に漏れ出すことはない。   Preferably, the protruding height of the inner convex portion from the inner surface of the element mounting portion is 4/5 or less, more preferably 2/5 to 4/5 of the thickness of the element mounting portion. By forming the inner convex portion in such a range, the through hole is not formed along the inner convex portion, and the adhesive resin does not leak to the outer surface of the element mounting portion through the through hole.

好ましくは、前記素子取付部は、板状部材で構成してあり、
底壁と、前記底壁の側端から立ち上げて形成してある側壁とを有し、
前記内側凸部は、前記底壁または側壁の内面に形成してある。 Preferably, the element mounting portion is constituted by a plate-shaped member,
A bottom wall and a side wall formed by rising from a side end of the bottom wall;
The inner convex portion is formed on the inner surface of the bottom wall or side wall.

内側凸部の形成位置は特に限定されないが、たとえば温度測定対象物に近い底壁に内側凸部が形成されることで、内側凸部を通しての感熱素子への伝熱経路も加わり、感熱応答性が向上することも期待できる。また、感熱素子の外形状に合わせて内側凸部の数を増やしたり、配置位置を工夫することで、接着用樹脂が感熱素子と共に素子取付部から容易に剥がれるおそれをさらに少なくすることができる。   The formation position of the inner convex part is not particularly limited, but for example, the inner convex part is formed on the bottom wall close to the temperature measurement object, so that a heat transfer path to the thermal element through the inner convex part is also added, and the heat sensitive response Can also be expected to improve. Further, by increasing the number of the inner convex portions according to the outer shape of the thermal element or by devising the arrangement position, it is possible to further reduce the possibility that the adhesive resin is easily peeled off from the element mounting portion together with the thermal element.

また、前記板状部材は、前記感熱素子の周囲を覆う筒状部を有し、前記筒状部の内面に、前記内側凸部が形成してあってもよい。内側凸部は、筒状部の内面に、周方向に沿って複数配置することもできる。   The plate-shaped member may have a cylindrical portion that covers the periphery of the thermosensitive element, and the inner convex portion may be formed on the inner surface of the cylindrical portion. A plurality of inner convex portions can be arranged on the inner surface of the cylindrical portion along the circumferential direction.

好ましくは、前記内側凸部は、前記接着用樹脂には接触するが、前記感熱素子には、直接的には接触しない。内側凸部は、感熱素子を傷つけないように配置してあることが好ましい。内側凸部が感熱素子を傷つけない限りは、内側凸部は、感熱素子に接触していてもよい。   Preferably, the inner convex portion contacts the adhesive resin, but does not directly contact the thermal element. The inner convex portion is preferably arranged so as not to damage the thermal element. As long as the inner convex portion does not damage the thermal element, the inner convex portion may be in contact with the thermal element.

好ましくは、前記内側凸部は、前記感熱素子のリード線が伸びる方向に向けて傾斜する緩傾斜面と、前記感熱素子のリード線が伸びる方向と反対方向に向けて傾斜する急傾斜面とを有し、前記急傾斜面の傾斜角度が、前記緩傾斜面の傾斜角度よりも大きい。   Preferably, the inner convex portion includes a gently inclined surface that is inclined toward a direction in which the lead wire of the thermal element extends, and a steeply inclined surface that is inclined in a direction opposite to the direction in which the lead wire of the thermal element extends. And the inclination angle of the steeply inclined surface is larger than the inclination angle of the gently inclined surface.

このように構成することで、特にリード線が引っ張られる方向に感熱素子に外力が作用しても、急傾斜面が接着用樹脂との間で楔のように作用し、接着用樹脂が素子取付部から、さらに剥がれにくくなる。   With this configuration, even if an external force is applied to the thermal element, particularly in the direction in which the lead wire is pulled, the steeply inclined surface acts like a wedge between the adhesive resin and the adhesive resin is attached to the element. It becomes more difficult to peel from the part.

好ましくは、前記内側凸部に対応して、前記素子取付部の外面には、外側凹部が形成してある。このような構成の内側凸部は、素子取付部の外側から外面を押圧加工することで、容易に成形することができる。また、好ましくは、外側凹部は、前記素子取付部の内側に貫通していない。このように構成することで、接着用樹脂が貫通孔を通して素子取付部の外面に漏れ出すおそれがない。   Preferably, an outer concave portion is formed on the outer surface of the element mounting portion corresponding to the inner convex portion. The inner convex portion having such a configuration can be easily formed by pressing the outer surface from the outside of the element mounting portion. Preferably, the outer concave portion does not penetrate inside the element mounting portion. With this configuration, there is no possibility that the adhesive resin leaks to the outer surface of the element mounting portion through the through hole.

図１は本発明の一実施形態に係る温度センサ装置の斜視図である。FIG. 1 is a perspective view of a temperature sensor device according to an embodiment of the present invention. 図２は接着用樹脂を省略し被覆層を透明に図示した場合の図１に示す温度センサ装置の斜視図である。FIG. 2 is a perspective view of the temperature sensor device shown in FIG. 1 when the adhesive resin is omitted and the coating layer is shown transparent. 図３は図１に示す温度センサ装置のIII−III線に沿う一部断面斜視図である。FIG. 3 is a partial cross-sectional perspective view taken along line III-III of the temperature sensor device shown in FIG. 図４は図１に示す温度センサ装置のIII−III線に沿う横断面図である。4 is a transverse sectional view taken along line III-III of the temperature sensor device shown in FIG. 図５は図１に示す温度センサ装置のV−V線に沿う一部断面斜視図である。FIG. 5 is a partial cross-sectional perspective view taken along line VV of the temperature sensor device shown in FIG. 図６は本発明の他の実施形態に係る温度センサ装置の図４に対応する横断面図である。FIG. 6 is a cross-sectional view corresponding to FIG. 4 of a temperature sensor device according to another embodiment of the present invention. 図７は本発明の他の実施形態に係る温度センサ装置の斜視図である。FIG. 7 is a perspective view of a temperature sensor device according to another embodiment of the present invention.

以下、本発明を、図面に示す実施形態に基づき説明する。   Hereinafter, the present invention will be described based on embodiments shown in the drawings.

第１実施形態
図１および図２に示すように、本発明の一実施形態に係る温度センサ装置２は、感熱素子４を有している。感熱素子４は、素子本体６と、素子本体６の外周を被覆している被覆層７とを有する。 First Embodiment As shown in FIGS. 1 and 2, a temperature sensor device 2 according to an embodiment of the present invention has a thermal element 4. The thermosensitive element 4 has an element body 6 and a coating layer 7 that covers the outer periphery of the element body 6.

素子本体６としては、温度を検出することができるものであれば、特に限定されないが、たとえばＮＴＣ（Negative Temperature Coefficient）サーミスタ素子、ＰＴＣ（Positive Temperature Coefficient）サーミスタ素子などが用いられる。被覆層７は、絶縁性の樹脂あるいはガラスなどで構成される。被覆層７を構成する樹脂としては、特に限定されないが、たとえばエポキシ樹脂、ウレタン樹脂、シリコン樹脂、ABS樹脂、PPS樹脂、PBT樹脂などが用いられる。また、被覆層７を構成するガラスとしては、特に限定されない。   The element body 6 is not particularly limited as long as it can detect the temperature. For example, an NTC (Negative Temperature Coefficient) thermistor element, a PTC (Positive Temperature Coefficient) thermistor element, or the like is used. The covering layer 7 is made of an insulating resin or glass. Although it does not specifically limit as resin which comprises the coating layer 7, For example, an epoxy resin, a urethane resin, a silicon resin, ABS resin, PPS resin, PBT resin etc. are used. Moreover, it does not specifically limit as glass which comprises the coating layer 7. FIG.

図２に示すように、素子本体６には、一対のリード線８の芯線８ａがそれぞれ接続してあり、リード線８の芯線８ａを通して、素子本体６により検出した温度信号を、測定装置や制御装置などの他の装置に送信可能になっている。リード線８の先端は、素子本体６および芯線８ａの先端と共に被覆層７により覆われ、リード線８の後端側は、被覆層７からＸ軸方向に飛び出している。   As shown in FIG. 2, a core wire 8a of a pair of lead wires 8 is connected to the element main body 6, and a temperature signal detected by the element main body 6 through the core wire 8a of the lead wire 8 is measured and controlled. It can be transmitted to other devices such as a device. The leading end of the lead wire 8 is covered with the coating layer 7 together with the leading ends of the element body 6 and the core wire 8a, and the rear end side of the lead wire 8 protrudes from the coating layer 7 in the X-axis direction.

リード線８としては、特に限定されず、たとえば塩ビ電線、ポリエチレン電線、シリコン電線、フッ素電線などが用いられる。図４に示すように、一対のリード線８の芯線８ａの相互は絶縁被膜８ｂによりそれぞれ覆われて絶縁されている。各リード線８の絶縁被膜８ｂは、図示するように連結部８ｃで長手方向に沿って連結してあってもよいし、相互に分離して構成してあってもよい。芯線８ａは、たとえば銅線などの導電性材料により構成してある。   The lead wire 8 is not particularly limited, and for example, a polyvinyl chloride wire, a polyethylene wire, a silicon wire, a fluorine wire, or the like is used. As shown in FIG. 4, the core wires 8a of the pair of lead wires 8 are covered and insulated from each other by an insulating film 8b. The insulating coating 8b of each lead wire 8 may be connected along the longitudinal direction by a connecting portion 8c as shown in the drawing, or may be separated from each other. The core wire 8a is made of a conductive material such as a copper wire, for example.

図２に示すように、被覆層７で覆われた素子本体６から成る感熱素子４は、板状部材から成る素子取付部としての取付金具１０に取り付けられる。取付金具１０は、感熱素子４がＺ軸方向の上部に位置する底壁１２と、底壁１２のＹ軸方向の両端からＺ軸方向の上部に一体的に立上げられる側壁１４と、底壁１２のＸ軸方向の前方に底壁１２と略面一で突出している張り出し部１６とを有する。   As shown in FIG. 2, the thermosensitive element 4 composed of the element body 6 covered with the covering layer 7 is attached to an attachment fitting 10 as an element attachment portion made of a plate-like member. The mounting bracket 10 includes a bottom wall 12 in which the thermal element 4 is located in the upper part in the Z-axis direction, a side wall 14 that is integrally raised from both ends in the Y-axis direction of the bottom wall 12 to the upper part in the Z-axis direction, and a bottom wall 12 has an overhanging portion 16 protruding substantially flush with the bottom wall 12 in the front in the X-axis direction.

平板状の張り出し部１６は、底壁１２および側壁１４と一体に形成してある。張り出し部１６は、Ｘ−Ｙ軸平面に平行な平面を有し、略中央部に、Ｚ軸方向に貫通する貫通孔１８を有する。貫通孔１８には、たとえばボルトやねじが通され、測温対象物自体あるいは測温対象物の近くに位置する取付用突起または取付用平面に張り出し部１６を固定するために用いられる。なお、図面において、Ｘ軸とＹ軸とＺ軸は、相互に略垂直であり、本実施形態では、Ｘ軸がリード線８の延びる方向に一致しているが、特に限定されない。   The flat plate-like protruding portion 16 is formed integrally with the bottom wall 12 and the side wall 14. The overhanging portion 16 has a plane parallel to the XY axis plane, and has a through hole 18 penetrating in the Z-axis direction at a substantially central portion. For example, a bolt or a screw is passed through the through-hole 18 and used to fix the overhanging portion 16 to the temperature measurement object itself or an attachment projection or attachment plane located near the temperature measurement object. In the drawings, the X axis, the Y axis, and the Z axis are substantially perpendicular to each other. In the present embodiment, the X axis coincides with the direction in which the lead wire 8 extends, but there is no particular limitation.

本実施形態では、一対の側壁１４は、底壁１２から略直角よりも狭い角度でＺ軸方向の上部にそれぞれ立ち上げられ、図４に示すように、側壁１４のＺ軸方向の上端部でのＹ軸方向の開口幅Ｗ１は、底壁１２のＹ軸方向の幅Ｗ２よりも狭く構成してある。また、本実施形態では、開口幅Ｗ１は、感熱素子４における被覆層７のＹ軸方向の最大幅Ｗ３よりも大きいことが好ましい。接着用樹脂３０を充填する前に、感熱素子４を側壁１４のＺ軸方向の上方開口部１４ａから取り付け易くするためである。   In the present embodiment, the pair of side walls 14 are respectively raised from the bottom wall 12 at an upper portion in the Z-axis direction at an angle narrower than a substantially right angle, and as shown in FIG. The opening width W1 in the Y-axis direction is configured to be narrower than the width W2 of the bottom wall 12 in the Y-axis direction. In the present embodiment, the opening width W1 is preferably larger than the maximum width W3 in the Y-axis direction of the coating layer 7 in the thermal element 4. This is to make it easier to attach the thermal element 4 from the upper opening 14 a in the Z-axis direction of the side wall 14 before filling the adhesive resin 30.

なお、感熱素子４を、図１に示す一対の側壁１４間のＸ軸方向の前方開口部１４ｂまたは後方開口部１４ｃから、底壁１２と一対の側壁１４とで３方が囲まれる空間に取り付ける場合には、図４に示す開口幅Ｗ１は最大幅Ｗ３よりも小さくてもよい。ただし、側壁１４のＺ軸方向の高さＨ１は、感熱素子４（被覆層７）のＺ軸方向高さＨ２の１／２よりも大きいことが好ましく、各側壁１４の内面１４ｄの大部分は、感熱素子４（被覆層７）の外周面に接触せずに隙間を有することが好ましい。これらの隙間に接着用樹脂３０が充填されるからである。   The thermal element 4 is attached to the space surrounded by the bottom wall 12 and the pair of side walls 14 from the front opening 14b or the rear opening 14c in the X-axis direction between the pair of side walls 14 shown in FIG. In this case, the opening width W1 shown in FIG. 4 may be smaller than the maximum width W3. However, the height H1 in the Z-axis direction of the side wall 14 is preferably larger than ½ of the height H2 in the Z-axis direction of the thermal element 4 (the coating layer 7), and most of the inner surface 14d of each side wall 14 is It is preferable that there is a gap without contacting the outer peripheral surface of the thermal element 4 (coating layer 7). This is because these gaps are filled with the adhesive resin 30.

本実施形態では、Ｈ１／Ｈ２は、好ましくは０．６〜０．８である。この比率を上記範囲内とすることで、十分な量の接着用樹脂３０を充填することができると共に、温度センサ装置２のＺ軸方向高さをコンパクトにすることができる。   In the present embodiment, H1 / H2 is preferably 0.6 to 0.8. By setting this ratio within the above range, a sufficient amount of the adhesive resin 30 can be filled and the height of the temperature sensor device 2 in the Z-axis direction can be made compact.

接着用樹脂３０としては、特に限定されないが、たとえばエポキシ樹脂、ウレタン樹脂、シリコン樹脂で構成される。被覆層７が樹脂で構成される場合には、被覆層７を構成する樹脂に比較して、接着用樹脂３０は、接着特性、熱伝導特性に優れた樹脂が好ましい。接着用樹脂３０には、フィラーなどが混入してあっても良い。   Although it does not specifically limit as resin 30 for adhesion | attachment, For example, it is comprised with an epoxy resin, a urethane resin, and a silicon resin. In the case where the coating layer 7 is made of a resin, the adhesive resin 30 is preferably a resin having excellent adhesion characteristics and heat conduction characteristics as compared with the resin constituting the coating layer 7. The adhesive resin 30 may be mixed with a filler or the like.

接着用樹脂３０は、素子取付部としての取付金具１０と感温素子４との隙間を埋めるように充填され、図１に示す開口部１４ａ，１４ｂおよび１４ｃから多少はみ出して形成されても良い。感温素子４は、取付金具１０の底壁１２および一対の側壁１４で３方が囲まれた空間の内部に存在する接着用樹脂３０により取付金具１０に取り付けられている。なお、感温素子４のＸ軸方向の後方に位置するリード線８の先端部を覆う被覆層７は、取付金具１０の底壁１２および一対の側壁１４で３方が囲まれた空間の内部に位置する接着用樹脂３０からＸ軸方向の後ろ側にはみ出していてもよい。   The adhesive resin 30 is filled so as to fill a gap between the mounting bracket 10 as the element mounting portion and the temperature sensitive element 4, and may be formed so as to protrude slightly from the openings 14a, 14b and 14c shown in FIG. The temperature sensitive element 4 is attached to the attachment metal fitting 10 by an adhesive resin 30 existing inside a space surrounded on three sides by the bottom wall 12 and the pair of side walls 14 of the attachment metal fitting 10. The covering layer 7 covering the tip of the lead wire 8 located behind the thermosensitive element 4 in the X-axis direction is inside the space surrounded by the bottom wall 12 and the pair of side walls 14 of the mounting bracket 10 on three sides. It may protrude from the adhesive resin 30 located at the rear side in the X-axis direction.

図４に示すように、本実施形態では、各側壁１４の内面１４ｄまたは底壁１２の内面１２ｄにおいて、感熱素子４（被覆層７）の外周面との隙間が最大になる位置またはその近くに、内側凸部２０が形成してある。図４では、各側壁１４の内面１４ｄにのみ内側凸部２０が形成してあるが、底壁１２の内面１２ｄにも、感熱素子４（被覆層７）の外周面との隙間が最大になる位置の近くに、内側凸部２０を一体的に成形しても良い。   As shown in FIG. 4, in this embodiment, the inner surface 14d of each side wall 14 or the inner surface 12d of the bottom wall 12 is at or near the position where the gap with the outer peripheral surface of the thermal element 4 (coating layer 7) is maximized. The inner convex part 20 is formed. In FIG. 4, the inner convex portion 20 is formed only on the inner surface 14 d of each side wall 14, but the gap between the inner surface 12 d of the bottom wall 12 and the outer peripheral surface of the thermal element 4 (coating layer 7) is maximized. The inner convex portion 20 may be integrally formed near the position.

図５に示すように、各内側凸部２０に対応して、側壁１４の外面１４ｅには、外側凹部２２が形成してある。各内側凸部２０は、Ｘ軸方向の前方（張り出し部１６の方向）に向けて傾斜する急傾斜面２４と、それに隣接してＸ軸方向の後方（図１に示すリード線８が延びる方向）に向けて傾斜する緩傾斜面２６とを有する。内面１４ｄに対する急傾斜面２４の傾斜角度が、緩傾斜面２６の傾斜角度よりも大きい。   As shown in FIG. 5, an outer recess 22 is formed on the outer surface 14 e of the side wall 14 corresponding to each inner protrusion 20. Each inner convex portion 20 has a steeply inclined surface 24 inclined toward the front in the X-axis direction (the direction of the overhanging portion 16), and the rear in the X-axis direction adjacent thereto (the direction in which the lead wire 8 shown in FIG. 1 extends). ) And a gently inclined surface 26 inclined toward the surface. The inclination angle of the steeply inclined surface 24 with respect to the inner surface 14d is larger than the inclination angle of the gently inclined surface 26.

内面１４ｄからの内側凸部２０の突出高さは、側壁１４の厚みｔの４／５以下、さらに好ましくは２／５〜４／５である。このような範囲で内側凸部２０を形成することで、内側凸部２０に沿って内面１４ｄと外面１４ｅとの間で貫通孔が形成されることはなく、貫通孔を通して接着用樹脂３０が外面１４ｅに漏れ出すことはない。   The protruding height of the inner convex portion 20 from the inner surface 14d is 4/5 or less of the thickness t of the side wall 14, more preferably 2/5 to 4/5. By forming the inner convex portion 20 in such a range, no through hole is formed between the inner surface 14d and the outer surface 14e along the inner convex portion 20, and the adhesive resin 30 passes through the through hole. It does not leak into 14e.

また、本実施形態に示す構成の内側凸部２０は、側壁１４の外側から外面１４ｅをプレス加工具などで押圧加工することで、容易に成形することができる。また、内側凸部２０と同時に形成される外側凹部２２は、側壁１４の内面１４ｄにに対して貫通せずに形成することができる。   Moreover, the inner side convex part 20 of the structure shown to this embodiment can be easily shape | molded by pressing the outer surface 14e from the outer side of the side wall 14 with a press work tool. Further, the outer concave portion 22 formed simultaneously with the inner convex portion 20 can be formed without penetrating the inner surface 14d of the side wall 14.

取付金具１０は、たとえば銅、黄銅などの銅合金、鉄、アルミニウム、ＳＵＳなどのステンレスなどの金属、あるいはその他の導電性材で構成される板材をブレス加工および折り曲げ加工して形成することができる。取付金具１０の底壁１２および一対の側壁１４で三方が囲まれた空間内に感熱素子４を配置した後に、感熱素子４の外周面と、底壁１２の内面１２ｄおよび側壁１４の内面１４ｄとの隙間に接着用樹脂を充填して硬化させる。あるいは、接着用樹脂を塗布した後に、感熱素子４を取り付けて樹脂を硬化させてもよい。このようにして図１に示す温度センサ装置２を製造することができる。   The mounting bracket 10 can be formed by, for example, breathing and bending a plate material made of a copper alloy such as copper or brass, a metal such as stainless steel such as iron, aluminum, or SUS, or other conductive material. . After the thermal element 4 is disposed in a space surrounded on three sides by the bottom wall 12 and the pair of side walls 14 of the mounting bracket 10, the outer peripheral surface of the thermal element 4, the inner surface 12 d of the bottom wall 12, and the inner surface 14 d of the side wall 14 The gap is filled with an adhesive resin and cured. Alternatively, after applying the adhesive resin, the thermal element 4 may be attached to cure the resin. In this way, the temperature sensor device 2 shown in FIG. 1 can be manufactured.

本実施形態に係る温度センサ装置２では、張り出し部１６を用いて、温度を検出したい物体（測温対象物）またはその付近の取付部に対して容易に取り付けることが可能である。たとえば張り出し部１６に、ボルト穴としての貫通孔１８を設け、ボルトやねじあるいはクリップなどにより、測温対象物自体またはその付近の取付用突起または取付用平面に温度センサ装置２を容易に着脱自在に取り付けることができる。   In the temperature sensor device 2 according to the present embodiment, the overhanging portion 16 can be easily attached to an object (temperature measurement object) whose temperature is to be detected or an attachment portion in the vicinity thereof. For example, a through hole 18 as a bolt hole is provided in the overhanging portion 16, and the temperature sensor device 2 can be easily attached to and detached from the temperature measurement object itself or a mounting projection or a mounting plane in the vicinity thereof by bolts, screws, clips, or the like. Can be attached to.

また、本実施形態では、素子取付部としての取付金具１０が、接着用樹脂３０に向けて突出する内側凸部２０を有するため、その内側凸部２０が接着用樹脂３０の抜け止めとなり、接着用樹脂３０が感熱素子４と共に取付金具１０から容易に剥がれることはなくなる。なお、感熱素子４の表面には、樹脂などで構成してある被覆層７が形成してあることから、感熱素子４と接着用樹脂３０との接続は強固であり、その界面で剥がれるおそれは少ない。   Further, in this embodiment, the mounting bracket 10 as the element mounting portion has the inner convex portion 20 that protrudes toward the adhesive resin 30, so that the inner convex portion 20 serves to prevent the adhesive resin 30 from coming off, and adhesion The resin 30 is not easily peeled off from the mounting bracket 10 together with the thermal element 4. In addition, since the coating layer 7 made of a resin or the like is formed on the surface of the thermal element 4, the connection between the thermal element 4 and the adhesive resin 30 is strong, and there is a possibility that the thermal element 4 may be peeled off at the interface. Few.

さらに本実施形態では、図３に示すように、内側凸部２０の急傾斜面２４が、リード線８が延びる方向と反対側を向いている。このために、特にリード線８がＸ軸の後ろ方向に引っ張られるように感熱素子４（図２参照）に外力が作用しても、急傾斜面２４が接着用樹脂３０との間で楔のように作用し、接着用樹脂３０が取付金具１０から、さらに剥がれにくくなる。   Further, in the present embodiment, as shown in FIG. 3, the steeply inclined surface 24 of the inner convex portion 20 faces the side opposite to the direction in which the lead wire 8 extends. Therefore, even when an external force is applied to the thermal element 4 (see FIG. 2) so that the lead wire 8 is pulled in the rearward direction of the X axis, the steeply inclined surface 24 is wedged between the adhesive resin 30 and Thus, the adhesive resin 30 is more difficult to peel off from the mounting bracket 10.

特に本実施形態では、各側壁１４の内面１４ｄにおいて、感熱素子４（被覆層７）の外周面との隙間が最大になる位置またはその近くに、内側凸部２０が形成してあるために、十分に大きな内側凸部２０を形成しやすく、この点でも、接着用樹脂３０が取付金具１０から、さらに剥がれにくくなる。   In particular, in the present embodiment, because the inner convex portion 20 is formed at or near the position where the gap with the outer peripheral surface of the thermal element 4 (the coating layer 7) is maximized on the inner surface 14d of each side wall 14, It is easy to form a sufficiently large inner convex portion 20, and in this respect also, the adhesive resin 30 is more difficult to peel off from the mounting bracket 10.

また、本実施形態では、内側凸部２０は、接着用樹脂３０には接触するが、感熱素子４には、直接的には接触しない。本実施形態では、内側凸部２０は、感熱素子４を傷つけないように配置してある。なお、内側凸部２０が感熱素子４を傷つけない限りは、内側凸部２０は、感熱素子４に接触していてもよい。   Further, in the present embodiment, the inner convex portion 20 contacts the adhesive resin 30 but does not contact the thermal element 4 directly. In the present embodiment, the inner convex portion 20 is disposed so as not to damage the thermal element 4. As long as the inner convex portion 20 does not damage the thermal element 4, the inner convex portion 20 may be in contact with the thermal element 4.

第２実施形態
図６に示すように、本実施形態の温度センサ装置２ａは、取付金具１０ａの構成が第１実施形態と異なるのみであり、以下に示す構成と作用効果以外は、第１実施形態の温度センサ装置２と同様であり、共通する部分には共通する符号を付し、共通する部分の図示と説明は省略する。 Second Embodiment As shown in FIG. 6, the temperature sensor device 2a of this embodiment is different from the first embodiment only in the configuration of the mounting bracket 10a. It is the same as that of the temperature sensor apparatus 2 of a form, A common code | symbol is attached | subjected to a common part and illustration and description of a common part are abbreviate | omitted.

図６に示すように、本実施形態では、取付金具１０ａは、感熱素子４の周囲４方を覆うように、一対の側壁１４の上端部が上壁１５で一体的に連結してある筒状部１７を有する。筒状部１７の内面には、内側凸部２０が形成してある。本実施形態では、内側凸部は、側壁１４の内面１４ｄのみではなく、底壁１２の内面１２ｄと上壁１５の内面１５ｄにも、筒状部１７の内面に、周方向に沿って複数配置してある。   As shown in FIG. 6, in the present embodiment, the mounting bracket 10 a has a cylindrical shape in which upper ends of a pair of side walls 14 are integrally connected by an upper wall 15 so as to cover the four sides around the thermal element 4. Part 17. An inner convex portion 20 is formed on the inner surface of the cylindrical portion 17. In the present embodiment, a plurality of inner convex portions are arranged not only on the inner surface 14 d of the side wall 14 but also on the inner surface 12 d of the bottom wall 12 and the inner surface 15 d of the upper wall 15 along the circumferential direction on the inner surface of the cylindrical portion 17. It is.

本実施形態では、たとえば温度測定対象物に近い底壁１２に内側凸部２０が形成されることで、内側凸部２０を通しての感熱素子４（その被覆層７）への伝熱経路も加わり、感熱応答性が向上することも期待できる。また、感熱素子４の外形状に合わせて内側凸部２０の数を増やしたり、配置位置を工夫することで、接着用樹脂３０が感熱素子４と共に取付金具１０ａから容易に剥がれるおそれをさらに少なくすることができる。   In the present embodiment, for example, by forming the inner convex portion 20 on the bottom wall 12 close to the temperature measurement object, a heat transfer path to the thermal element 4 (its coating layer 7) through the inner convex portion 20 is also added, It can also be expected that the thermal sensitivity is improved. Further, by increasing the number of the inner convex portions 20 according to the outer shape of the thermal element 4 or by devising the arrangement position, the possibility that the adhesive resin 30 is easily peeled off from the mounting bracket 10a together with the thermal element 4 is further reduced. be able to.

第３実施形態
図７に示すように、本実施形態の温度センサ装置２ｂは、取付金具１０に対する感熱素子４およびリード線８の傾斜角度θが第１実施形態と異なるのみであり、以下に示す構成と作用効果以外は、第１実施形態または第２実施形態と同様であり、共通する部分には共通する符号を付し、共通する部分の図示と説明は省略する。 Third Embodiment As shown in FIG. 7, the temperature sensor device 2b of the present embodiment is different from the first embodiment only in the inclination angle θ of the thermal element 4 and the lead wire 8 with respect to the mounting bracket 10, and will be described below. Except for the configuration and operational effects, the second embodiment is the same as the first or second embodiment. Common parts are denoted by common reference numerals, and illustration and description of the common parts are omitted.

図７に示すように、本実施形態では、取付金具１０の底板１２の平面に対して、感熱素子４およびリード線８の傾斜角度θが、たとえば０〜３０度程度に傾斜している。その状態で、感熱素子４の先端部が、取付金具１０の底壁１２および一対の側壁１４で３方が囲まれた空間の内部に存在する接着用樹脂３０により取付金具１０に取り付けられている。本実施形態においても、第１実施形態または第２実施形態と同様な作用効果を奏することができる。   As shown in FIG. 7, in this embodiment, the inclination angle θ of the thermal element 4 and the lead wire 8 is inclined, for example, about 0 to 30 degrees with respect to the plane of the bottom plate 12 of the mounting bracket 10. In this state, the tip of the thermosensitive element 4 is attached to the mounting bracket 10 by the adhesive resin 30 existing inside the space surrounded by the bottom wall 12 and the pair of side walls 14 of the mounting bracket 10. . Also in this embodiment, the same operational effects as those of the first embodiment or the second embodiment can be obtained.

なお、本発明は、上述した実施形態に限定されるものではなく、本発明の範囲内で種々に改変することができる。   The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention.

たとえば、張り出し部１６には、必ずしも貫通孔１８を形成する必要はない。たとえば張り出し部１６を、測温対象物またはその付近の取付部に具備された差し込み溝に差し込むことで、測温対象物またはその付近の取付部に温度センサ装置を容易に着脱自在に取り付けてもよい。あるいは、張り出し部１６を測温対象物またはその付近の取付部に接着することで、測温対象物またはその付近の取付部に温度センサ装置２を取り付けても良い。   For example, the through hole 18 is not necessarily formed in the overhanging portion 16. For example, the temperature sensor device can be easily and detachably attached to the temperature measurement object or its vicinity by inserting the overhanging portion 16 into the insertion groove provided in the temperature measurement object or its vicinity. Good. Alternatively, the temperature sensor device 2 may be attached to the temperature measurement object or its vicinity by attaching the overhang portion 16 to the temperature measurement object or its vicinity.

また、図６に示す実施形態では、筒部１７の横断面形状が台形筒形状であるが、特に限定されず、三角筒、四角筒、あるいはその他の多角筒形状、円筒あるいは楕円筒形状、あるいはその他の異形筒形状でも良い。   In the embodiment shown in FIG. 6, the cross-sectional shape of the cylindrical portion 17 is a trapezoidal cylindrical shape, but is not particularly limited, and is a triangular cylinder, a rectangular cylinder, or other polygonal cylindrical shape, a cylindrical or elliptical cylindrical shape, or Other irregular cylindrical shapes may be used.

２，２ａ，２Ｂ… 温度センサ
４… 感熱素子
６… 素子本体
７… 被覆層
８… リード線
８ａ… 芯線
８ｂ… 絶縁被膜
８ｃ… 連結部
１０，１０ａ… 取付金具（素子取付部）
１２… 底壁
１２ｄ… 内面
１４… 側壁
１４ａ… 上方開口部
１４ｂ… 前方開口部
１４ｃ… 後方開口部
１４ｄ… 内面
１４ｅ… 外面
１５… 上壁
１５ｄ… 内面
１６… 張り出し部
１７… 筒状部
１８… 貫通孔
２０… 内側凸部
２２… 外側凹部
２４… 急傾斜面
２６… 緩傾斜面
３０… 接着用樹脂 2, 2a, 2B ... Temperature sensor 4 ... Thermal element 6 ... Element body 7 ... Cover layer 8 ... Lead wire 8a ... Core wire 8b ... Insulating coating 8c ... Connecting part 10, 10a ... Mounting bracket (element mounting part)
DESCRIPTION OF SYMBOLS 12 ... Bottom wall 12d ... Inner surface 14 ... Side wall 14a ... Upper opening part 14b ... Front opening part 14c ... Rear opening part 14d ... Inner surface 14e ... Outer surface 15 ... Upper wall 15d ... Inner surface 16 ... Overhang part 17 ... Cylindrical part 18 ... Through-hole Hole 20 ... Inner convex portion 22 ... Outer concave portion 24 ... Steeply inclined surface 26 ... Slightly inclined surface 30 ... Adhesive resin

Claims (7)

感熱素子と、
前記感熱素子が取り付けられる素子取付部と、
前記素子取付部と前記感熱素子との間の隙間に充填される接着用樹脂と、を有する温度センサ装置であって、
前記素子取付部が、当該素子取付部の内面から前記接着用樹脂に向けて突出する内側凸部を有する温度センサ装置。 A thermal element;
An element mounting portion to which the thermosensitive element is mounted;
A temperature sensor device having an adhesive resin filled in a gap between the element mounting portion and the thermosensitive element,
The temperature sensor device, wherein the element mounting portion includes an inner convex portion that protrudes from an inner surface of the element mounting portion toward the adhesive resin. 前記素子取付部の内面からの前記内側凸部の突出高さは、前記素子取付部の厚みの４／５以下である請求項１に記載の温度センサ装置。   The temperature sensor device according to claim 1, wherein a protruding height of the inner convex portion from an inner surface of the element mounting portion is 4/5 or less of a thickness of the element mounting portion. 前記素子取付部は、板状部材で構成してあり、
底壁と、前記底壁の側端から立ち上げて形成してある側壁とを有し、
前記内側凸部は、前記底壁または側壁の内面に形成してある請求項１または２に記載の温度センサ装置。 The element mounting portion is composed of a plate-shaped member,
A bottom wall and a side wall formed by rising from a side end of the bottom wall;
The temperature sensor device according to claim 1, wherein the inner convex portion is formed on an inner surface of the bottom wall or the side wall. 前記素子取付部は、板状部材で構成してあり、
前記板状部材は、前記感熱素子の周囲を覆う筒状部を有し、前記筒状部の内面に、前記内側凸部が形成してある請求項１または２に記載の温度センサ装置。 The element mounting portion is composed of a plate-shaped member,
3. The temperature sensor device according to claim 1, wherein the plate-shaped member has a cylindrical portion that covers the periphery of the thermal element, and the inner convex portion is formed on an inner surface of the cylindrical portion. 前記内側凸部は、前記接着用樹脂には接触するが、前記感熱素子には、直接的には接触しない請求項１〜４のいずれかに記載の温度センサ装置。   The temperature sensor device according to any one of claims 1 to 4, wherein the inner convex portion contacts the adhesive resin but does not directly contact the thermal element. 前記内側凸部は、前記感熱素子のリード線が伸びる方向に向けて傾斜する緩傾斜面と、前記感熱素子のリード線が伸びる方向と反対方向に向けて傾斜する急傾斜面とを有し、前記急傾斜面の傾斜角度が、前記緩傾斜面の傾斜角度よりも大きい請求項１〜５のいずれかに記載の温度センサ装置。   The inner convex portion has a gently inclined surface that is inclined toward a direction in which the lead wire of the thermal element extends, and a steeply inclined surface that is inclined in a direction opposite to the direction in which the lead wire of the thermal element extends. The temperature sensor device according to any one of claims 1 to 5, wherein an inclination angle of the steeply inclined surface is larger than an inclination angle of the gently inclined surface. 前記内側凸部に対応して、前記素子取付部の外面には、外側凹部が形成してあり、外側凹部は、前記素子取付部の内側に貫通していない請求項１〜６のいずれかに記載の温度センサ装置。   The outer concave portion is formed on the outer surface of the element mounting portion corresponding to the inner convex portion, and the outer concave portion does not penetrate through the inner side of the element mounting portion. The temperature sensor device described.
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