JP2017505551A - 小型化及び改良されたアセンブリスループットのための有機支持部を利用するアセンブリアーキテクチャ - Google Patents
小型化及び改良されたアセンブリスループットのための有機支持部を利用するアセンブリアーキテクチャ Download PDFInfo
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- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
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- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09963—Programming circuit by using small elements, e.g. small PCBs
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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Abstract
Description
具体例1は装置であり、本装置は、第1の側と反対側の第2の側とを有する基板;前記基板の前記第1の側における少なくとも1つの第1回路デバイス;前記基板の前記第2の側における少なくとも1つの第2回路デバイス;及び前記基板の前記第2の側における支持部を有し、前記支持部は前記支持部を貫通する少なくとも1つの相互接続部を有し、前記相互接続部の各々は前記少なくとも1つの第1回路デバイス及び前記少なくとも1つの第2回路デバイスに結合され、前記支持部は、前記少なくとも1つの第2回路デバイスの厚み寸法より大きな、前記基板からの寸法を規定するために使用可能な厚み寸法を有する。
Claims (24)
- 第1の側と反対側の第2の側とを有する基板;
前記基板の前記第1の側における少なくとも1つの第1回路デバイス;
前記基板の前記第2の側における少なくとも1つの第2回路デバイス;及び
前記基板の前記第2の側における支持部であって、前記支持部を貫通する相互接続部を有し、前記相互接続部の各々は前記少なくとも1つの第1回路デバイス及び前記少なくとも1つの第2回路デバイスに結合され、前記支持部は、前記少なくとも1つの第2回路デバイスの厚み寸法より大きな、前記基板からの寸法を規定するために使用可能な厚み寸法を有する、支持部;
を有する装置。 - 前記支持部は1つ以上のピラーを有する、請求項1に記載の装置。
- 前記1つ以上のピラーは前記基板の各コーナーに配置される、請求項2に記載の装置。
- 前記厚みはz寸法を有し、前記支持部はX寸法及びY寸法を有し、前記X寸法及び前記Y寸法のうちの一方は、前記X寸法及び前記Y寸法のうちの他方以上である、請求項1に記載の装置。
- 前記X寸法及び前記Y寸法のうちの一方は、前記X寸法及び前記Y寸法のうちの他方の2倍より大きい、請求項4に記載の装置。
- 前記支持部は有機材料ボディを有し、前記有機材料ボディを通じて前記相互接続部が伸びる、請求項1に記載の装置。
- モジュール基板と前記モジュール基板に結合される1つ以上の回路コンポーネント;
ボード基板;及び
第1端部において前記モジュール基板に及び第2端部において前記ボード基板に結合される支持部であって、有機材料ボディを有し、前記有機材料ボディはそこを貫通する1つ以上の導電性相互接続部を有し、前記1つ以上の導電性相互接続部のうちの少なくとも1つは、前記モジュール基板におけるコンタクトポイントと前記ボード基板におけるコンタクトポイントとに結合される、支持部;
を有する装置。 - 前記支持部は、前記モジュール基板に結合される1つ以上の回路コンポーネントに相応しい、前記モジュール基板及び前記ボード基板の間のキャビティを規定する厚み寸法を有する、請求項7に記載の装置。
- 前記支持部は1つ以上のピラーを有する、請求項7に記載の装置。
- 前記1つ以上のピラーは前記の基板の各コーナーに配置される、請求項9に記載の装置。
- 前記の厚みはz寸法を有し、前記支持部はX寸法及びY寸法を有し、前記X寸法及び前記Y寸法のうちの一方は、前記X寸法及び前記Y寸法のうちの他方以上である、請求項7に記載の装置。
- 前記ボード基板に結合されるバッテリを有する請求項7に記載の装置。
- 前記ボード基板に結合される1つ以上の追加的な回路コンポーネントを有する請求項12に記載の装置。
- 当該装置はウェアラブル形状因子を有する請求項12に記載の装置。
- 当該装置はモノのインターネットを構成する請求項12に記載の装置。
- 基板の第1の側に少なくとも1つの第1回路コンポーネントを配置するステップ;
前記基板の第2の側に少なくとも1つの第2回路コンポーネントを配置するステップ;及び
前記基板に支持部を結合するステップであって、前記基板は、前記少なくとも1つの第2回路コンポーネントの厚み寸法より大きな、前記基板からの寸法を規定する、ステップ;
を有する方法。 - 前記支持部は1つ以上のピラーを有する、請求項16に記載の方法。
- 前記1つ以上のピラーを前記基板に結合することが、前記基板の各コーナーにおいて結合することを含む、請求項17に記載の方法。
- 前記厚みはz寸法を有し、前記支持部はX寸法及びY寸法を有し、前記X寸法及び前記Y寸法のうちの一方は、前記X寸法及び前記Y寸法のうちの他方以上である、請求項16に記載の方法。
- 前記X寸法及び前記Y寸法のうちの一方は、前記X寸法及び前記Y寸法のうちの他方の2倍より大きい、請求項19に記載の方法。
- 前記支持部はフレームを有する、請求項16に記載の方法。
- 前記基板は第1基板を有し、当該方法は、前記少なくとも1つの第2回路コンポーネントが前記第1基板及び第2基板の間に配置されるように、前記支持部を前記第2基板に結合するステップを有する請求項16に記載の方法。
- 請求項16ないし22のうち何れか1項に記載の方法により形成されるウェアラブルアセンブリ。
- 請求項16ないし22のうち何れか1項に記載の方法により形成されるモノのインターネット。
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PCT/US2014/072446 WO2016105435A1 (en) | 2014-12-26 | 2014-12-26 | Assembly architecture employing organic support for compact and improved assembly throughput |
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US (1) | US10368439B2 (ja) |
EP (1) | EP3227917B1 (ja) |
JP (1) | JP2017505551A (ja) |
KR (1) | KR20160091250A (ja) |
CN (1) | CN105960833A (ja) |
BR (1) | BR112015029665A2 (ja) |
TW (1) | TWI618457B (ja) |
WO (1) | WO2016105435A1 (ja) |
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TWI688850B (zh) | 2013-08-13 | 2020-03-21 | 飛利斯有限公司 | 具有電子顯示器之物品 |
WO2015031501A1 (en) | 2013-08-27 | 2015-03-05 | Polyera Corporation | Attachable device having a flexible electronic component |
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JP2017504204A (ja) | 2013-12-24 | 2017-02-02 | ポリエラ コーポレイション | 可撓性電子構成要素のための支持構造 |
CN106031308B (zh) | 2013-12-24 | 2019-08-09 | 飞利斯有限公司 | 用于附接式二维挠性电子装置的支撑结构 |
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- 2014-12-26 BR BR112015029665A patent/BR112015029665A2/pt unknown
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- 2014-12-26 US US14/778,027 patent/US10368439B2/en active Active
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Also Published As
Publication number | Publication date |
---|---|
EP3227917A1 (en) | 2017-10-11 |
US20160360618A1 (en) | 2016-12-08 |
EP3227917B1 (en) | 2023-04-19 |
BR112015029665A2 (pt) | 2017-07-25 |
KR20160091250A (ko) | 2016-08-02 |
TWI618457B (zh) | 2018-03-11 |
US10368439B2 (en) | 2019-07-30 |
EP3227917A4 (en) | 2018-10-03 |
CN105960833A (zh) | 2016-09-21 |
TW201633857A (zh) | 2016-09-16 |
WO2016105435A1 (en) | 2016-06-30 |
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