JP2017500705A - ファインピッチコネクタソケット - Google Patents
ファインピッチコネクタソケット Download PDFInfo
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- JP2017500705A JP2017500705A JP2016540479A JP2016540479A JP2017500705A JP 2017500705 A JP2017500705 A JP 2017500705A JP 2016540479 A JP2016540479 A JP 2016540479A JP 2016540479 A JP2016540479 A JP 2016540479A JP 2017500705 A JP2017500705 A JP 2017500705A
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- JP
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- Prior art keywords
- polyamide
- composition
- socket
- weight
- flame retardant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229920002647 polyamide Polymers 0.000 claims abstract description 74
- 239000004952 Polyamide Substances 0.000 claims abstract description 73
- 239000000203 mixture Substances 0.000 claims abstract description 67
- 238000002844 melting Methods 0.000 claims abstract description 28
- 230000008018 melting Effects 0.000 claims abstract description 28
- 239000003063 flame retardant Substances 0.000 claims abstract description 24
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229920000642 polymer Polymers 0.000 claims abstract description 19
- 229920006114 semi-crystalline semi-aromatic polyamide Polymers 0.000 claims abstract description 18
- 239000012744 reinforcing agent Substances 0.000 claims abstract description 14
- 238000002425 crystallisation Methods 0.000 claims abstract description 13
- 230000008025 crystallization Effects 0.000 claims abstract description 13
- 238000003780 insertion Methods 0.000 claims abstract description 13
- 230000037431 insertion Effects 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 150000003839 salts Chemical class 0.000 claims abstract description 9
- 239000002253 acid Substances 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims abstract description 6
- 239000000835 fiber Substances 0.000 claims abstract description 6
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 10
- 229920006012 semi-aromatic polyamide Polymers 0.000 claims description 10
- 238000012360 testing method Methods 0.000 claims description 10
- 239000004953 Aliphatic polyamide Substances 0.000 claims description 7
- 229920003231 aliphatic polyamide Polymers 0.000 claims description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 2
- 229910019142 PO4 Inorganic materials 0.000 abstract description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 abstract description 4
- 239000010452 phosphate Substances 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 description 15
- 238000005476 soldering Methods 0.000 description 11
- KKEYFWRCBNTPAC-UHFFFAOYSA-N terephthalic acid group Chemical group C(C1=CC=C(C(=O)O)C=C1)(=O)O KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 8
- 238000009757 thermoplastic moulding Methods 0.000 description 8
- 229920003189 Nylon 4,6 Polymers 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229920000106 Liquid crystal polymer Polymers 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 230000014759 maintenance of location Effects 0.000 description 5
- 229920006119 nylon 10T Polymers 0.000 description 5
- 101100498818 Arabidopsis thaliana DDR4 gene Proteins 0.000 description 4
- 229920002292 Nylon 6 Polymers 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- 229920006153 PA4T Polymers 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- ZJKCITHLCNCAHA-UHFFFAOYSA-K aluminum dioxidophosphanium Chemical compound [Al+3].[O-][PH2]=O.[O-][PH2]=O.[O-][PH2]=O ZJKCITHLCNCAHA-UHFFFAOYSA-K 0.000 description 3
- 229920006020 amorphous polyamide Polymers 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000004594 Masterbatch (MB) Substances 0.000 description 2
- 239000006057 Non-nutritive feed additive Substances 0.000 description 2
- 229920002302 Nylon 6,6 Polymers 0.000 description 2
- 239000004974 Thermotropic liquid crystal Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- ILRRQNADMUWWFW-UHFFFAOYSA-K aluminium phosphate Chemical compound O1[Al]2OP1(=O)O2 ILRRQNADMUWWFW-UHFFFAOYSA-K 0.000 description 2
- XSAOTYCWGCRGCP-UHFFFAOYSA-K aluminum;diethylphosphinate Chemical compound [Al+3].CCP([O-])(=O)CC.CCP([O-])(=O)CC.CCP([O-])(=O)CC XSAOTYCWGCRGCP-UHFFFAOYSA-K 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 229920006177 crystalline aliphatic polyamide Polymers 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 2
- 229920006139 poly(hexamethylene adipamide-co-hexamethylene terephthalamide) Polymers 0.000 description 2
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 2
- 229920006123 polyhexamethylene isophthalamide Polymers 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- 229920006345 thermoplastic polyamide Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 125000006832 (C1-C10) alkylene group Chemical group 0.000 description 1
- YZEZMSPGIPTEBA-UHFFFAOYSA-N 2-n-(4,6-diamino-1,3,5-triazin-2-yl)-1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(NC=2N=C(N)N=C(N)N=2)=N1 YZEZMSPGIPTEBA-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000012757 flame retardant agent Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 150000002829 nitrogen Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920006128 poly(nonamethylene terephthalamide) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000010421 standard material Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/527—Flameproof cases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/016—Flame-proofing or flame-retarding additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/305—Polyamides or polyesteramides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/47—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes fibre-reinforced plastics, e.g. glass-reinforced plastics
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Abstract
Description
− ポリアミドポリマーは、少なくとも280℃の溶融温度Tm−Aを有する少なくとも1種類の半結晶性ポリアミド(A)と、任意選択により第2のポリアミド(B)とを含み;
− 難燃剤系は、(C−1)ジアルキルホスフィン酸および/またはジホスフィン酸の金属塩と、(C−2)リン酸金属塩との組合せを含み、(C−1)および(C−2)は、組成物の全重量に対して5〜35重量%の総量、および95/5〜55/45の範囲内の重量比C−1/C−2で存在し;
− 組成物は、ISO75−1/2に準拠して測定して少なくとも265℃の加熱ひずみ温度を有する。
式中、R1、R2は、同じまたは異なるものであり、それぞれ直鎖または分岐のC1〜C6−アルキルであり;R3は、直鎖または分岐のC1〜C10−アルキレン、C6〜C10−アリーレン、C7〜C20−アルキルアリーレン、またはC7〜C20−アリールアルキレンであり;Mは、Mg、Ca、Al、Sb、Sn、Ge、Ti、Zn、Fe、Zr、Ce、Bi、Sr、Mn、Li、Na、K、プロトン化窒素塩基、またはそれらの混合物であり;mは1〜4であり;nは1〜4であり;xは1〜4である。
[HP(−O)O2]2−Mm+ (III)
の亜リン酸塩であり、式中、Mは、Mg、Ca、Al、Sb、Sn、Ge、Ti、Zn、Fe、Zr、Ce、Bi、Sr、Mn、Li、Na、K、oraそれらの混合物であり;mは1〜4である。
− 30〜80重量%のポリアミドポリマー
− 6〜25重量%の総量の(C−1)および(C−2)
− 10〜40重量%の繊維状強化剤
を含む。
− ポリアミド(A)、および任意選択のポリアミド(B)からなり、50/50〜100/0の範囲内の重量比(A)/(B)で存在する、30〜60重量%のポリアミドポリマーと;
− 95/5〜55/45の範囲内の重量比(C−1)/(C−2)で存在する8〜22重量%の総量の(C−1)および(C−2)と;
− 10〜40重量%の繊維状強化剤と;
− 0〜20重量%の少なくとも1種類のさらなる成分と
からなる。
[材料]
以下の材料を使用した:
A−1:PA 46;熱可塑性成形組成物用の標準グレード、Tm295℃。
A−2:PA4T/66コポリアミド;熱可塑性成形組成物用の低分子量グレード、Tm325℃。
A−3:PA4T/66コポリアミド;熱可塑性成形組成物用の標準分子量グレード、Tm325℃。
A−4:PA10T/6T、熱可塑性成形組成物用の「高」融点グレード、Tm300℃。
A−5:PA10T/6T、熱可塑性成形組成物用の「低」融点グレード、Tm290℃。
A−6:PA 66、熱可塑性成形組成物用の標準グレード、Tm260℃。
B−1:PA 46;ポリアミドプレポリマー、Tm290℃。
B−2:PA 46、A−1と同一。
B−3:PA 6I/6T;非晶質半芳香族ポリアミド
B−4:ポリアミド6、脂肪族ポリアミド;Tm220℃。
B−4:PA 410;脂肪族ポリアミド;Tm245℃。
C−1:Exolit OP1400、約80%のOP1230(ホスフィン酸アルミニウム)と約20%のPHOPHAL(リン酸アリミニウム(aliminium phosphate))との混合物、クラリアント(Clariant)製
C−2:Exolit OP 1230、(ホスフィン酸アルミニウム)、クラリアント製
C−3:Exolit OP1311、クラリアント製
C−4:メラムとOP1230(ホスフィン酸アルミニウム)との混合物;重量比83/17
C−5:OP1230とZnHPO3との混合物;重量比75/25
C−6:OP1230とZnHPO3との混合物;重量比60/40
C−7:OP1230とZnHPO3との混合物;重量比50/50
C−8:OP1230とFP−300との混合物;重量比80/20
FP−300は、シアノ変性環状フェノキシホスファゼン化合物である;株式会社伏見製薬所(Fushimi Pharmaceutical Co.,Ltd)より商品名ラビトルFP−300(RABITLE FP−300)で入手可能
PA−6マスターバッチ:PA−6中の顔料マスターバッチ(20重量%)
GF ガラス繊維:熱可塑性ポリアミド成形組成物用の標準グレード
MRA/安定剤:離型剤および安定剤組成物の標準パッケージ
標準的なプロセス条件を使用して、二軸スクリュー押出機上で射出成形組成物を調製した。
DDR 4ソケットを製造するための適切な金型を取り付けた一軸スクリュー押出機を用いた射出成形に使用される材料。
250℃のピーク温度の標準的な無鉛はんだ付けプロセスを用いてPCB上にソケットを無鉛はんだ付けすることによって電子組立体を製造するためにソケットを使用した。
難燃性および機械的性質のために、対応する試験方法に適合する適切な試験棒を作製した。
[難燃性]
0.8mmおよび0.4mmの試料厚さでUL−94−Vに準拠して、難燃性の試験を行った。
本明細書において詳細に前述したようにISO11357−1/−3に準拠した方法でDSCによって、溶融温度(Tm)および結晶化エンタルピー(ΔHc)を測定した。
HDT−Aの条件を適用してISO75−1/−2に準拠して加熱たわみ温度を測定した。
ISO527−1/−2に準拠して20℃で剛性を測定した(MPa)。
280×15×1mmの寸法のらせん状キャビティを取り付けた一軸スクリュー押出機を含む射出成形設定、ポリマー(A)溶融温度よりも20℃高い温度の押出機中の溶融物の温度設定において、100MPaの有効射出圧下でのらせん流動試験における流動長さを測定することによって、組成物の流動特性を測定した。
Claims (12)
- 少なくとも2つの対向する壁を含み、それらの間に、コンタクトピンの挿入を受け入れるための通路が画定され、前記壁が、ポリアミドポリマーと、難燃剤系と、繊維状強化剤とを含む繊維強化難燃性熱可塑性ポリマー組成物から形成される、ファインピッチ電気コネクタソケットであって、
− 前記ポリアミドポリマーが、少なくとも280℃の溶融温度Tm−Aを有する少なくとも1種類の半結晶性ポリアミド(A)と、任意選択により第2のポリアミド(B)とを含み;
− 前記ポリアミドポリマーが、少なくとも50J/gの結晶化エンタルピーΔHcを有し、前記溶融温度Tm−Aおよび結晶化エンタルピーΔHcは、ISO11357−1/3に準拠した方法で20℃の加熱および冷却速度でDSCによって測定され;
− 前記難燃剤系が、(C−1)ジアルキルホスフィン酸および/またはジホスフィン酸の金属塩と、(C−2)リン酸金属塩との組合せを含み;(C−1)および(C−2)は、前記組成物の全重量に対して5〜35重量%の総量、および95/5〜55/45の範囲内の重量比C−1/C−2で存在し;
− 前記組成物が、ISO75−1/2に準拠して測定して少なくとも265℃の加熱ひずみ温度を有する、ソケット。 - 前記対向する壁が1mm未満、好ましくは約500マイクロメートル(μm)以下の厚さを有する、請求項1に記載のソケット。
- 前記ソケットが、300マイクロメートル(μm)未満、好ましくは約200マイクロメートル(μm)以下の厚さの交差する壁、すなわち前記通路を分割し前記コンタクトピンを分離する壁を有する、請求項1に記載のソケット。
- 前記組成物が、非晶質半芳香族ポリアミド、脂肪族ポリアミド、またはそれらの組合せから選択される第2のポリアミド(B)を含む、請求項1に記載のソケット。
- 前記第2のポリアミド(B)が、270℃未満の溶融温度を有する脂肪族ポリアミド、または少なくとも270℃の溶融温度および最大5,000ダルトンの重量平均分子量Mw−Bを有する脂肪族ポリアミド、またはそれらの組合せである、請求項1に記載のソケット。
- ポリアミド(A)およびポリアミド(B)が100/0〜50/50の範囲内の重量比A/Bで存在する、請求項1に記載のソケット。
- (C−1)および(C−2)が90/10〜65/35の範囲内の重量比で存在する、請求項1に記載のソケット。
- 前記組成物が、
− 30〜80重量%の前記ポリアミドポリマーと;
− 6〜25重量%の総量の(C−1)および(C−2)と;
− 10〜40重量%の前記繊維状強化剤と
を含む、請求項1に記載のソケット。 - 前記組成物が少なくとも270℃の加熱ひずみ温度HDT−Aを有する、請求項1に記載のソケット。
- 前記組成物がISO527−1/2に準拠した方法で20℃において測定して少なくとも10,000MPaの剛性を有する、請求項1に記載のソケット。
- Tm−Aよりも20℃高い温度において280×15×1mmの寸法のらせん状キャビティ中でのらせん流動試験によって測定して、前記組成物が少なくとも120mmのメルトフロー長を有する、請求項1に記載のソケット。
- 前記組成物が、UL−94に準拠して測定して、0.8mmにおいて少なくともV−0の難燃性評価を有する、請求項1に記載のソケット。
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