JP2017212628A - 弾性波デバイス - Google Patents
弾性波デバイス Download PDFInfo
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- JP2017212628A JP2017212628A JP2016105001A JP2016105001A JP2017212628A JP 2017212628 A JP2017212628 A JP 2017212628A JP 2016105001 A JP2016105001 A JP 2016105001A JP 2016105001 A JP2016105001 A JP 2016105001A JP 2017212628 A JP2017212628 A JP 2017212628A
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 11
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 238000010897 surface acoustic wave method Methods 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
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- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
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- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/058—Holders; Supports for surface acoustic wave devices
- H03H9/0585—Holders; Supports for surface acoustic wave devices consisting of an adhesive layer
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02913—Measures for shielding against electromagnetic fields
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0504—Holders; Supports for bulk acoustic wave devices
- H03H9/0514—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps
- H03H9/0523—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps for flip-chip mounting
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
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- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
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- H—ELECTRICITY
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- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02566—Characteristics of substrate, e.g. cutting angles of semiconductor substrates
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- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
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- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
- H03H9/0571—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including bulk acoustic wave [BAW] devices
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- H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices
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- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/058—Holders; Supports for surface acoustic wave devices
- H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
-
- H—ELECTRICITY
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- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
【解決手段】上面に第1弾性波フィルタが設けられた第1基板10と、前記第1基板の上面にバンプ36を介しフリップチップ実装され、前記第1基板の上面と空隙を介し対向する下面に第2弾性波フィルタが設けられた第2基板20と、前記第1基板の上面に支持され、前記第1弾性波フィルタの少なくとも一部と前記第2弾性波フィルタの少なくとも一部との間に前記空隙26を介し設けられたシールド電極37と、を具備する弾性波デバイス。
【選択図】図1
Description
10a 支持基板
10b、10c 圧電基板
12、22 弾性波共振器
26 空隙
27、34 配線
28、35 パッド
30 端子
32 ビア配線
36 バンプ
37 シールド電極
38 支持体
39、40 環状封止部
60 送信フィルタ
62 受信フィルタ
Claims (11)
- 上面に第1弾性波フィルタが設けられた第1基板と、
前記第1基板の上面にバンプを介しフリップチップ実装され、前記第1基板の上面と空隙を介し対向する下面に第2弾性波フィルタが設けられた第2基板と、
前記第1基板の上面に支持され、前記第1弾性波フィルタの少なくとも一部と前記第2弾性波フィルタの少なくとも一部との間に前記空隙を介し設けられたシールド電極と、
を具備する弾性波デバイス。 - 前記シールド電極は、複数の開口を有する請求項1記載の弾性波デバイス。
- 前記第1弾性波フィルタは複数の弾性波共振器を有し、前記シールド電極は、平面視において前記複数の弾性波共振器の少なくとも一部と重なる請求項1または2記載の弾性波デバイス。
- 前記シールド電極は単体で、平面視において前記複数の弾性波共振器のうち複数と重なる請求項3記載の弾性波デバイス。
- 複数の前記シールド電極は、平面視においてそれぞれ前記複数の弾性波共振器のうち複数と重なる請求項3記載の弾性波デバイス。
- 前記第1弾性波フィルタは高周波信号が入力する入力端子と高周波信号が出力する出力端子との間に接続され、
前記シールド電極は、平面視において前記入力端子と前記第1弾性波フィルタのうち最も前記入力端子側に接続された弾性波共振器とを接続する入力パッドおよび入力配線の少なくとも一部と重なる請求項1から5のいずれか一項記載の弾性波デバイス。 - 前記シールド電極は、平面視において前記出力端子と前記第1弾性波フィルタのうち最も前記出力端子側に接続された弾性波共振器とを接続する出力パッドおよび出力配線と重ならない請求項6記載の弾性波デバイス。
- 前記第1弾性波フィルタは複数の弾性波共振器を有し、
前記第1弾性波フィルタは高周波信号が入力する入力端子と高周波信号が出力する出力端子との間に接続され、
前記シールド電極は、平面視において前記複数の弾性波共振器のうち最も前記入力端子側に接続された弾性波共振器と重なる請求項1から7のいずれか一項記載の弾性波デバイス。 - 前記シールド電極は、平面視において前記複数の弾性波共振器のうち前記最も入力端子側に接続された弾性波共振器以外の弾性波共振器と重ならない請求項8記載の弾性波デバイス。
- 前記第1弾性波フィルタおよび前記第2弾性波フィルタのいずれか一方は共通端子と送信端子との間に接続された送信フィルタであり、
前記第1弾性波フィルタおよび前記第2弾性波フィルタの他方は前記共通端子と受信端子との間に接続され受信フィルタである請求項1から9のいずれか一項記載の弾性波デバイス。 - 前記第1弾性波フィルタと前記第2弾性波フィルタとの通過帯域は異なる請求項1から10のいずれか一項記載の弾性波デバイス。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2016105001A JP6556663B2 (ja) | 2016-05-26 | 2016-05-26 | 弾性波デバイス |
US15/430,849 US10250219B2 (en) | 2016-05-26 | 2017-02-13 | Acoustic wave device |
CN201710156410.9A CN107437928B (zh) | 2016-05-26 | 2017-03-16 | 声波装置 |
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JP2016105001A JP6556663B2 (ja) | 2016-05-26 | 2016-05-26 | 弾性波デバイス |
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JP2017212628A true JP2017212628A (ja) | 2017-11-30 |
JP6556663B2 JP6556663B2 (ja) | 2019-08-07 |
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JP2016105001A Expired - Fee Related JP6556663B2 (ja) | 2016-05-26 | 2016-05-26 | 弾性波デバイス |
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JP (1) | JP6556663B2 (ja) |
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Cited By (11)
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JP2018157510A (ja) * | 2017-03-21 | 2018-10-04 | 太陽誘電株式会社 | マルチプレクサ |
JP2018166259A (ja) * | 2017-03-28 | 2018-10-25 | 京セラ株式会社 | 弾性波素子 |
CN109274349A (zh) * | 2017-07-17 | 2019-01-25 | 三星电机株式会社 | 声波装置及制造该声波装置的方法 |
KR20190070274A (ko) * | 2017-12-12 | 2019-06-20 | 가부시키가이샤 무라타 세이사쿠쇼 | 전자부품 모듈 |
JP2019146025A (ja) * | 2018-02-21 | 2019-08-29 | 太陽誘電株式会社 | マルチプレクサ |
JP2020102758A (ja) * | 2018-12-21 | 2020-07-02 | 株式会社村田製作所 | 高周波モジュール |
JP2020145596A (ja) * | 2019-03-06 | 2020-09-10 | 太陽誘電株式会社 | 弾性波デバイス、フィルタおよびマルチプレクサ |
JP2021034745A (ja) * | 2019-08-13 | 2021-03-01 | 太陽誘電株式会社 | マルチプレクサ |
WO2023113003A1 (ja) * | 2021-12-15 | 2023-06-22 | 株式会社村田製作所 | 弾性波装置及び複合フィルタ装置 |
WO2023162566A1 (ja) * | 2022-02-24 | 2023-08-31 | 株式会社村田製作所 | 弾性波モジュール |
WO2023162597A1 (ja) * | 2022-02-22 | 2023-08-31 | 株式会社村田製作所 | 弾性波フィルタ装置 |
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US20180123561A1 (en) * | 2016-10-31 | 2018-05-03 | Samsung Electro-Mechanics Co., Ltd. | Filter |
CN110771035B (zh) * | 2017-06-21 | 2023-08-08 | 株式会社村田制作所 | 弹性波装置 |
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JP7231368B2 (ja) * | 2018-09-26 | 2023-03-01 | 太陽誘電株式会社 | 弾性波デバイス |
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US20230253950A1 (en) * | 2022-02-04 | 2023-08-10 | RF360 Europe GmbH | Stacked acoustic wave (aw) filter packages, including cross-talk reduction layers, and related fabrication methods |
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JP2018157510A (ja) * | 2017-03-21 | 2018-10-04 | 太陽誘電株式会社 | マルチプレクサ |
JP2018166259A (ja) * | 2017-03-28 | 2018-10-25 | 京セラ株式会社 | 弾性波素子 |
CN109274349A (zh) * | 2017-07-17 | 2019-01-25 | 三星电机株式会社 | 声波装置及制造该声波装置的方法 |
US11437563B2 (en) | 2017-07-17 | 2022-09-06 | Samsung Electro-Mechanics Co., Ltd. | Acoustic wave device and method of manufacturing the same |
KR20190070274A (ko) * | 2017-12-12 | 2019-06-20 | 가부시키가이샤 무라타 세이사쿠쇼 | 전자부품 모듈 |
KR102121827B1 (ko) * | 2017-12-12 | 2020-06-12 | 가부시키가이샤 무라타 세이사쿠쇼 | 전자부품 모듈 |
JP2019146025A (ja) * | 2018-02-21 | 2019-08-29 | 太陽誘電株式会社 | マルチプレクサ |
JP7084739B2 (ja) | 2018-02-21 | 2022-06-15 | 太陽誘電株式会社 | マルチプレクサ |
JP2020102758A (ja) * | 2018-12-21 | 2020-07-02 | 株式会社村田製作所 | 高周波モジュール |
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JP2020145596A (ja) * | 2019-03-06 | 2020-09-10 | 太陽誘電株式会社 | 弾性波デバイス、フィルタおよびマルチプレクサ |
JP2021034745A (ja) * | 2019-08-13 | 2021-03-01 | 太陽誘電株式会社 | マルチプレクサ |
JP7347989B2 (ja) | 2019-08-13 | 2023-09-20 | 太陽誘電株式会社 | マルチプレクサ |
US11658642B2 (en) | 2019-08-13 | 2023-05-23 | Taiyo Yuden Co., Ltd. | Multiplexer |
WO2023113003A1 (ja) * | 2021-12-15 | 2023-06-22 | 株式会社村田製作所 | 弾性波装置及び複合フィルタ装置 |
WO2023162597A1 (ja) * | 2022-02-22 | 2023-08-31 | 株式会社村田製作所 | 弾性波フィルタ装置 |
WO2023162566A1 (ja) * | 2022-02-24 | 2023-08-31 | 株式会社村田製作所 | 弾性波モジュール |
Also Published As
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US10250219B2 (en) | 2019-04-02 |
CN107437928B (zh) | 2020-07-14 |
JP6556663B2 (ja) | 2019-08-07 |
US20170346463A1 (en) | 2017-11-30 |
CN107437928A (zh) | 2017-12-05 |
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