JP2017211879A - Heat detector - Google Patents

Heat detector Download PDF

Info

Publication number
JP2017211879A
JP2017211879A JP2016105562A JP2016105562A JP2017211879A JP 2017211879 A JP2017211879 A JP 2017211879A JP 2016105562 A JP2016105562 A JP 2016105562A JP 2016105562 A JP2016105562 A JP 2016105562A JP 2017211879 A JP2017211879 A JP 2017211879A
Authority
JP
Japan
Prior art keywords
heat
receiving plate
heat receiving
sensor
temperature sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016105562A
Other languages
Japanese (ja)
Other versions
JP6682357B2 (en
Inventor
嘉夫 中村
Yoshio Nakamura
嘉夫 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hochiki Corp
Original Assignee
Hochiki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hochiki Corp filed Critical Hochiki Corp
Priority to JP2016105562A priority Critical patent/JP6682357B2/en
Publication of JP2017211879A publication Critical patent/JP2017211879A/en
Priority to JP2020047472A priority patent/JP6945028B2/en
Application granted granted Critical
Publication of JP6682357B2 publication Critical patent/JP6682357B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Radiation Pyrometers (AREA)
  • Fire-Detection Mechanisms (AREA)
  • Fire Alarms (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a good looking heat detector having a heat receiving plate with improved thermal response.SOLUTION: A heat detector 1 is used for monitoring temperature in a monitoring region and comprises; a heat receiving plate 17 for receiving heat from the monitoring region; a contactless temperature sensor 14 disposed at a distance from the heat receiving plate 17 and configured to detect infrared rays radiating from the heat receiving plate 17; an electric circuit configured to send a heat detection signal to outside on the basis of a result of detection by the contactless temperature sensor 14; and a housing 10 that accommodates the contactless temperature sensor 14 and the electric circuit. A surface 17b of the heat receiving plate 17 facing the contactless temperature sensor 14 is black coated.SELECTED DRAWING: Figure 2

Description

本発明は、監視領域における熱を感知して警報等を行う熱感知器に関する。   The present invention relates to a heat detector that senses heat in a monitoring area and issues an alarm or the like.

従来から、火災により発生する熱で火災の発生を感知する熱感知器が知られている。従来の熱感知器は、温度に応じて抵抗値が変化するサーミスタが用いられることが多かった。こうした熱感知器では、サーミスタを熱気流にさらして温度を測定するために、サーミスタを筐体から突出させていた。   2. Description of the Related Art Conventionally, a heat detector that detects the occurrence of a fire with heat generated by a fire is known. Conventional thermistors often use a thermistor whose resistance value varies with temperature. In such a heat sensor, the thermistor is protruded from the housing in order to measure the temperature by exposing the thermistor to a hot air stream.

ところが、サーミスタに棒体等が衝突して外力が加わると、変形して正確な温度測定ができなくなることがあった。この課題に鑑み、特許文献1では、熱感知器の薄型化を図った熱感知器が提案されている。特許文献1に記載された熱感知器は、熱感知器本体と、該本体に設けられたカーボン製吸熱板と、該カーボン製吸熱板の内面と対向する位置であって、該カーボン製吸熱板と離して設けられた非接触温度センサとを有する。この熱感知器は、熱伝導率と赤外線放射率が共に高いカーボン製の吸熱板を用いているので、熱が伝わり易いと共に赤外線放射エネルギーが大きく、吸熱板の温度及びそれに対応する赤外線放射エネルギーが迅速に変化し、周囲環境の温度変化を検出し易くなっている。   However, if a rod or the like collides with the thermistor and an external force is applied, it may be deformed and accurate temperature measurement may not be possible. In view of this problem, Patent Document 1 proposes a heat sensor in which the heat sensor is thinned. The heat sensor described in Patent Document 1 is a heat sensor main body, a carbon heat absorption plate provided on the main body, and a position facing the inner surface of the carbon heat absorption plate, the carbon heat absorption plate And a non-contact temperature sensor provided apart from each other. Since this heat detector uses a carbon heat absorbing plate having both high thermal conductivity and infrared emissivity, heat is easily transmitted and infrared radiant energy is large, and the temperature of the heat absorbing plate and the corresponding infrared radiant energy are high. It changes quickly, making it easy to detect temperature changes in the surrounding environment.

特許5236539号公報Japanese Patent No. 5236539

しかし、上記した熱感知器では、吸熱板(受熱板)は監視領域に晒されているものであるにもかかわらず、吸熱板の材質がカーボン製に限定されてしまっており、熱感知器の見栄えが悪いという問題があった。吸熱板の機能を確保するために材質が限定されていることに起因して、感知器の構造にも制約があった。また、熱応答性のさらなる向上に対する要求もあった。
そこで、本発明は、吸熱板の構造を工夫した熱感知器を提供することを目的とする。
However, in the above-described heat sensor, although the heat absorption plate (heat reception plate) is exposed to the monitoring area, the material of the heat absorption plate is limited to carbon. There was a problem that it looked bad. Due to the limited material used to ensure the function of the heat absorbing plate, the structure of the sensor was also limited. There has also been a demand for further improvement in thermal response.
SUMMARY OF THE INVENTION An object of the present invention is to provide a heat detector with a devised structure of the heat absorbing plate.

本発明の熱感知器は、監視領域の温度を監視するための熱感知器であって、前記監視領域から熱を受ける受熱板と、前記受熱板から離隔して設けられると共に、前記受熱板から放射された赤外線を検出する非接触温度センサと、前記非接触温度センサによる検出結果に基づいて外部に熱感知信号を送出する電気回路と、前記非接触温度センサ及び前記電気回路を収納する筐体とを備え、前記受熱板の前記非接触温度センサと対向する面は黒体塗装されている。   The heat sensor of the present invention is a heat sensor for monitoring the temperature of the monitoring region, and is provided with a heat receiving plate that receives heat from the monitoring region, a space apart from the heat receiving plate, and from the heat receiving plate. Non-contact temperature sensor for detecting radiated infrared rays, an electric circuit for sending a heat sensing signal to the outside based on a detection result by the non-contact temperature sensor, and a housing for housing the non-contact temperature sensor and the electric circuit The surface of the heat receiving plate facing the non-contact temperature sensor is painted black.

このように受熱板の非接触温度センサと対向する面を黒体塗装することにより、赤外線の放射率を高めることができると共に、受熱板としては熱伝導性の高い任意の材料を用いることができるので、受熱板の材質の選択の自由度を高めることができる。   Thus, by coating the surface of the heat receiving plate facing the non-contact temperature sensor with a black body, the emissivity of infrared rays can be increased, and any material having high thermal conductivity can be used as the heat receiving plate. Therefore, the freedom degree of selection of the material of a heat receiving plate can be raised.

本発明の熱感知器は、前記筐体の一部が前記受熱板を構成している。この構成により、監視領域の熱を筐体の一部で吸収し、内部にある非接触温度センサにて受熱板の温度を検出できる。   In the heat sensor of the present invention, a part of the casing constitutes the heat receiving plate. With this configuration, the heat in the monitoring region is absorbed by a part of the housing, and the temperature of the heat receiving plate can be detected by the non-contact temperature sensor inside.

本発明の熱感知器は、前記筐体から前記監視領域に向かって延びる支持部材を備え、前記受熱板は、前記支持部材に支持されている。この構成により、受熱板の上下面を気流が通過するので、監視領域の熱が効率良く受熱板に伝導し、熱感知器の熱応答性を向上させることができる。   The heat sensor of the present invention includes a support member that extends from the housing toward the monitoring area, and the heat receiving plate is supported by the support member. With this configuration, since the airflow passes through the upper and lower surfaces of the heat receiving plate, the heat in the monitoring region is efficiently conducted to the heat receiving plate, and the thermal responsiveness of the heat detector can be improved.

本発明の熱感知器において、前記筐体は、ポリエチレン樹脂によって構成される。温度による火災検知には、60〜80℃(333〜353K)の温度が用いられるところ、この温度の物体から出る赤外線の波長は10マイクロメートル近辺である。ポリエチレン樹脂は、10マイクロメートル近辺の波長を有する赤外線を透過するので、筐体をポリエチレン樹脂で構成することにより、受熱板から放射された赤外線が筐体を透過し、非接触温度センサにて受熱板の温度変化を捉えることができる。   In the heat sensor of the present invention, the casing is made of polyethylene resin. The temperature of 60 to 80 ° C. (333 to 353 K) is used for fire detection by temperature, and the wavelength of infrared rays emitted from an object at this temperature is around 10 micrometers. Since the polyethylene resin transmits infrared light having a wavelength around 10 micrometers, the infrared radiation radiated from the heat receiving plate is transmitted through the housing and received by the non-contact temperature sensor. It can capture the temperature change of the plate.

本発明の熱感知器において、前記筐体は、防水構造を有する。この構成により、筐体内部の非接触温度センサや電気回路を湿気等から保護すると共に、受熱板を筐体から分離して監視領域の気流から熱を受けやすくすることができる。   In the heat sensor of the present invention, the casing has a waterproof structure. With this configuration, the non-contact temperature sensor and the electric circuit inside the housing can be protected from moisture and the like, and the heat receiving plate can be separated from the housing to easily receive heat from the airflow in the monitoring area.

本発明の熱感知器において、前記受熱板の前記監視領域側の面は、前記非接触温度センサと対向する面とは異なる表面処理がなされている。この構成により、受熱板の監視領域側の面と筐体側の面で機能を分け、筐体側の面で赤外線放射率の高さを担保すると共に、監視領域側の面で外観を良くすることで、熱感知器の見栄えを良くすることができる。   In the heat sensor of the present invention, the surface on the monitoring region side of the heat receiving plate is subjected to a surface treatment different from the surface facing the non-contact temperature sensor. With this configuration, the function is divided between the surface on the monitoring area side and the surface on the housing side of the heat receiving plate, ensuring high infrared emissivity on the surface on the housing side, and improving the appearance on the surface on the monitoring area side. The appearance of the heat sensor can be improved.

本発明は、受熱板の材質の選択の自由度を高めることができるという効果を有する。また、受熱板の材質の自由度向上に起因して、感知器の構造を従来よりも自由に設計することが可能になり、意匠性の向上を図ることができる。また、受熱板を黒体塗装する構成によって熱応答性を高めることもできる。   The present invention has an effect that the degree of freedom in selecting the material of the heat receiving plate can be increased. In addition, due to the improvement in the degree of freedom of the material of the heat receiving plate, the structure of the sensor can be designed more freely than before, and the design can be improved. Moreover, thermal responsiveness can also be improved by the structure which coats a heat receiving plate with black body.

第1の実施の形態の熱感知器の外観を示す斜視図である。It is a perspective view which shows the external appearance of the heat sensor of 1st Embodiment. 第1の実施の形態の熱感知器の構成を示す断面図である。It is sectional drawing which shows the structure of the heat sensor of 1st Embodiment. 第2の実施の形態の熱感知器の構成を示す断面図である。It is sectional drawing which shows the structure of the heat sensor of 2nd Embodiment. 第3の実施の形態の熱感知器の構成を示す断面図である。It is sectional drawing which shows the structure of the heat sensor of 3rd Embodiment.

以下、本発明の実施の形態の熱感知器について図面を参照しながら説明する。
(第1の実施の形態)
図1は、第1の実施の形態の熱感知器1の外観を示す斜視図である。熱感知器1は、監視領域の熱を感知して火災を判断する部品を収容した略円筒状の筐体10と、筐体10に突設された複数の支持部材16で支持された受熱板17とを有している。熱感知器1は、受熱板17を有する側が監視領域に向けられ、受熱板17と反対側が天井や壁等の設置面に取り付けられる。受熱板17を支持する支持部材16は、樹脂等の熱を通しにくい材質によって構成される。これにより、受熱板17にて吸収した熱が支持部材16を介して筐体10へと逃げるのを防止し、受熱板17の温度上昇によって、監視領域の温度上昇をいち早く検知することができる。
Hereinafter, a heat detector according to an embodiment of the present invention will be described with reference to the drawings.
(First embodiment)
FIG. 1 is a perspective view showing an appearance of a heat sensor 1 according to the first embodiment. The heat detector 1 is a heat receiving plate supported by a substantially cylindrical casing 10 that contains a part that detects a fire by detecting heat in a monitoring area, and a plurality of support members 16 that protrude from the casing 10. 17. The heat detector 1 has the side having the heat receiving plate 17 facing the monitoring area, and the side opposite to the heat receiving plate 17 is attached to an installation surface such as a ceiling or a wall. The support member 16 that supports the heat receiving plate 17 is made of a material that is difficult to transmit heat, such as resin. Thereby, it is possible to prevent the heat absorbed by the heat receiving plate 17 from escaping to the housing 10 via the support member 16, and the temperature increase in the monitoring region can be quickly detected by the temperature increase of the heat receiving plate 17.

図2は、熱感知器1の構成を示す断面図である。筐体10の内部には、受熱板17の温度変化を検知する非接触温度センサ14と、非接触温度センサ14を載置したプリント基板11とを有している。プリント基板11は、筐体10の内部において支持部材12によって支持されている。プリント基板11は、受熱板17と対向して配置され、プリント基板11上に載置された非接触温度センサ14も受熱板17と対向している。   FIG. 2 is a cross-sectional view showing the configuration of the heat sensor 1. The housing 10 includes a non-contact temperature sensor 14 that detects a temperature change of the heat receiving plate 17 and a printed board 11 on which the non-contact temperature sensor 14 is placed. The printed circuit board 11 is supported by a support member 12 inside the housing 10. The printed circuit board 11 is disposed facing the heat receiving plate 17, and the non-contact temperature sensor 14 placed on the printed circuit board 11 is also opposed to the heat receiving plate 17.

プリント基板11には、電気回路が搭載されている。電気回路は、CPU等の制御部を含んでいる。制御部は、非接触温度センサ14にて検知した温度が一定の温度に達した場合、または、温度の上昇率が一定の割合を超えた場合に火災と判断する。プリント基板11には、外部の監視装置につながるリード線13が接続されている。通常の監視状態においては、熱感知器1は、リード線13によって監視装置とループ接続されている。制御部が火災と判断した場合には、熱感知器1の内部でリード線を短絡することにより、監視装置に熱感知信号を送出して、火災の発生を発報する。   An electric circuit is mounted on the printed circuit board 11. The electric circuit includes a control unit such as a CPU. The control unit determines that a fire has occurred when the temperature detected by the non-contact temperature sensor 14 reaches a certain temperature or when the rate of temperature increase exceeds a certain rate. A lead wire 13 connected to an external monitoring device is connected to the printed circuit board 11. In a normal monitoring state, the heat sensor 1 is loop-connected to the monitoring device by a lead wire 13. When the control unit determines that there is a fire, the lead wire is short-circuited inside the heat detector 1, thereby sending a heat detection signal to the monitoring device and reporting the occurrence of the fire.

非接触温度センサ14としては、例えばサーモパイルが用いられる。サーモパイルは、物体から放射される赤外線を受け、そのエネルギー量に応じた熱起電力を発生する赤外線センサである。筐体10には、サファイヤガラス等の遠赤外線を透過させる部材によって構成された窓15が設けられている。この窓15を通じて、非接触温度センサ14は受熱板17から放射された赤外線を検知し、受熱板17の温度変化を検知する。なお、窓15は、ポリカーボネート等の樹脂の薄膜(0.1mm程度)によって構成することとしてもよい。   As the non-contact temperature sensor 14, for example, a thermopile is used. The thermopile is an infrared sensor that receives infrared rays emitted from an object and generates a thermoelectromotive force according to the amount of energy. The housing 10 is provided with a window 15 made of a member that transmits far infrared rays such as sapphire glass. Through this window 15, the non-contact temperature sensor 14 detects infrared rays radiated from the heat receiving plate 17 and detects a temperature change of the heat receiving plate 17. In addition, the window 15 is good also as comprising with thin films (about 0.1 mm) of resin, such as a polycarbonate.

受熱板17は、アルミ基材に表面処理を施して構成されている。ここでは、説明の便宜上、受熱板17の監視領域側の面を「表面17a」、筐体10側の面を「裏面17b」という。受熱板の表面17aは、熱感知器1の見栄えを良くするために、着色やシボ加工等の表面処理がなされている。受熱板17bの裏面17bは黒体塗装がなされ、赤外線の放射効率を高めている。   The heat receiving plate 17 is configured by subjecting an aluminum base material to a surface treatment. Here, for convenience of explanation, the surface on the monitoring region side of the heat receiving plate 17 is referred to as “front surface 17a”, and the surface on the housing 10 side is referred to as “back surface 17b”. The surface 17a of the heat receiving plate is subjected to a surface treatment such as coloring or embossing in order to improve the appearance of the heat sensor 1. The back surface 17b of the heat receiving plate 17b is painted with a black body to enhance infrared radiation efficiency.

以上、第1の実施の形態の熱感知器1について説明した。第1の実施の形態の熱感知器1は、受熱板17を用いているので、従来のサーミスタのような点状部分による熱感知ではなく、面状部分による熱感知を行うことができ、熱応答性を高めることができる。   The heat sensor 1 according to the first embodiment has been described above. Since the heat detector 1 of the first embodiment uses the heat receiving plate 17, it can perform heat detection by a planar portion instead of heat detection by a point-like portion like a conventional thermistor. Responsiveness can be improved.

また、受熱板17の表面17aは、受熱板17の裏面17bには黒体塗装がなされていることにより、筐体10側への赤外線の放射率を高め、熱の検知速度やS/Nの向上を図ることができる。これにより、受熱板17の材質の選択の自由度が高まり、表面17aに着色やシボ加工等の表面処理を行うことができるので、熱感知器1の見栄えを良くすることができる。   Further, the surface 17a of the heat receiving plate 17 has a black body coating on the back surface 17b of the heat receiving plate 17, thereby increasing the infrared emissivity toward the housing 10 side, and the heat detection speed and S / N ratio. Improvements can be made. Thereby, the freedom degree of selection of the material of the heat-receiving plate 17 increases, and since surface treatments, such as coloring and embossing, can be performed to the surface 17a, the appearance of the heat sensor 1 can be improved.

また、受熱板17は、支持部材16によって支持されているので、受熱板17の表面17aのみならず裏面17bに対しても監視領域内の気流が接するので、受熱板17は、監視領域の温度変化を速やかに反映し、熱応答性を高めることができる。   In addition, since the heat receiving plate 17 is supported by the support member 16, the air flow in the monitoring region is in contact with not only the front surface 17a of the heat receiving plate 17 but also the back surface 17b. The change can be reflected quickly and the thermal response can be improved.

(第2の実施の形態)
図3は、第2の実施の形態の熱感知器2の構成を示す断面図である。熱感知器2では、筐体10の一部が受熱板17によって構成されている。
(Second Embodiment)
FIG. 3 is a cross-sectional view illustrating a configuration of the heat sensor 2 according to the second embodiment. In the heat sensor 2, a part of the housing 10 is constituted by a heat receiving plate 17.

筐体10の内部には、受熱板17の温度変化を検知する非接触温度センサ14と、非接触温度センサ14を載置したプリント基板11とを有している。非接触温度センサ14、プリント基板11、及びプリント基板11に接続されたリード線13等の構成は、第1の実施の形態の熱感知器1と同じである。   The housing 10 includes a non-contact temperature sensor 14 that detects a temperature change of the heat receiving plate 17 and a printed board 11 on which the non-contact temperature sensor 14 is placed. The configuration of the non-contact temperature sensor 14, the printed circuit board 11, and the lead wire 13 connected to the printed circuit board 11 is the same as that of the heat sensor 1 of the first embodiment.

受熱板17は、アルミ基材に表面処理を施して構成されている。受熱板の表面17aは、熱感知器1の見栄えを良くするために、着色やシボ加工等の表面処理がなされている。受熱板17bの裏面17bは黒体塗装がなされ、赤外線の放射効率を高めている。   The heat receiving plate 17 is configured by subjecting an aluminum base material to a surface treatment. The surface 17a of the heat receiving plate is subjected to a surface treatment such as coloring or embossing in order to improve the appearance of the heat sensor 1. The back surface 17b of the heat receiving plate 17b is painted with a black body to enhance infrared radiation efficiency.

第2の実施の形態の熱感知器2は、筐体10の一部が受熱板17を兼ねているので、熱感知器2の構成をコンパクトにすることができる。また、第2の実施の形態の熱感知器2は、第1の実施の形態の熱感知器1と同様に、面状の受熱板17による熱感知により、熱応答性が高い。   In the heat sensor 2 according to the second embodiment, since a part of the housing 10 also serves as the heat receiving plate 17, the configuration of the heat sensor 2 can be made compact. Further, the heat sensor 2 of the second embodiment has high thermal responsiveness due to heat detection by the planar heat receiving plate 17 as in the heat sensor 1 of the first embodiment.

また、受熱板17の表面17aは、着色やシボ加工等の表面処理がなされ、熱感知器1の見栄えが良いと共に、受熱板17の裏面17bには黒体塗装がなされていることにより、筐体10側への赤外線の放射率を高め、筐体10内に設けられた非接触温度センサ14により受熱板17の温度変化を適切に検知することができる。   In addition, the surface 17a of the heat receiving plate 17 is subjected to surface treatment such as coloring or embossing, the appearance of the heat sensor 1 is good, and the back surface 17b of the heat receiving plate 17 is black body coated. The emissivity of infrared rays toward the body 10 can be increased, and the temperature change of the heat receiving plate 17 can be appropriately detected by the non-contact temperature sensor 14 provided in the housing 10.

(第3の実施の形態)
図4は、第3の実施の形態の熱感知器3の構成を示す断面図である。第3の実施の形態の熱感知器3の基本的な構成は、第1の実施の形態の熱感知器1と同じであり、筐体18の内部に、受熱板17の温度変化を検知する非接触温度センサ14や非接触温度センサ14を載置したプリント基板11等を有している。
(Third embodiment)
FIG. 4 is a cross-sectional view illustrating a configuration of the heat sensor 3 according to the third embodiment. The basic configuration of the heat sensor 3 of the third embodiment is the same as that of the heat sensor 1 of the first embodiment, and a temperature change of the heat receiving plate 17 is detected inside the housing 18. The non-contact temperature sensor 14 and the printed circuit board 11 on which the non-contact temperature sensor 14 is mounted are included.

第3の実施の形態の熱感知器3は、波長10マイクロメートルの赤外線を透過させるポリエチレン樹脂によって筐体18が構成されている。筐体18は、ポッティングまたはパッキンにより防水構造が採用されている。そして、この筐体18の上に、支持部材16を介して、受熱板17が設けられている。   In the heat sensor 3 of the third embodiment, the casing 18 is made of polyethylene resin that transmits infrared light having a wavelength of 10 micrometers. The casing 18 has a waterproof structure by potting or packing. A heat receiving plate 17 is provided on the housing 18 via a support member 16.

また、熱感知器3は、筐体18を覆う化粧カバー19を備えている。化粧カバー19は、受熱板17を支持している領域を除き、筐体18を覆っており、熱感知器3の見栄えを良くしている。化粧カバー19が覆われていない領域が赤外線を透過させる窓の役割を有する。   The heat sensor 3 includes a decorative cover 19 that covers the housing 18. The decorative cover 19 covers the casing 18 except for the region supporting the heat receiving plate 17, and improves the appearance of the heat sensor 3. An area where the decorative cover 19 is not covered has a role of a window that transmits infrared rays.

受熱板17は、アルミ基材に表面処理を施して構成されている。受熱板の表面17aは、熱感知器1の見栄えを良くするために、着色やシボ加工等の表面処理がなされている。受熱板17の裏面17bは黒体塗装がなされ、赤外線の放射効率を高めている。   The heat receiving plate 17 is configured by subjecting an aluminum base material to a surface treatment. The surface 17a of the heat receiving plate is subjected to a surface treatment such as coloring or embossing in order to improve the appearance of the heat sensor 1. The back surface 17b of the heat receiving plate 17 is painted with black body to enhance infrared radiation efficiency.

第3の実施の形態の熱感知器3は防水構造を有する筐体18を備え、筐体18内の部品を湿気などの水分から保護すると共に、支持部材16を介して受熱板17を保持しているので、受熱部を分類して監視領域内の気流から熱を受けやすくするという効果を有する。   The heat sensor 3 according to the third embodiment includes a casing 18 having a waterproof structure, protects components in the casing 18 from moisture such as moisture, and holds the heat receiving plate 17 via the support member 16. Therefore, it has an effect that the heat receiving parts are classified and heat is easily received from the airflow in the monitoring area.

また、第3の実施の形態の熱感知部3は、第1の実施の形態と同様に、熱応答性を高めることができる。   In addition, the heat sensing unit 3 according to the third embodiment can improve the thermal responsiveness as in the first embodiment.

以上、本発明の熱感知器について実施の形態を挙げて詳細に説明したが、本発明は上記した実施の形態に限定されるものではない。   The heat detector of the present invention has been described in detail with reference to the embodiment. However, the present invention is not limited to the above-described embodiment.

上記した第1の実施の形態では、アルミ基材の表面17aと裏面17bに異なる表面処理を施して受熱板17を構成する例について説明したが、受熱板17は、異なる材料からなる複数の層によって構成してもよい。例えば、表面をアルミ層とし、裏面を樹脂薄膜とすることも可能である。   In the first embodiment described above, the example in which the heat receiving plate 17 is configured by performing different surface treatments on the front surface 17a and the back surface 17b of the aluminum base material has been described. However, the heat receiving plate 17 includes a plurality of layers made of different materials. You may comprise by. For example, the front surface can be an aluminum layer and the back surface can be a resin thin film.

上記した実施の形態において、受熱板17の温度を検知する非接触温度センサ14とは別に、筐体10,18の内部の温度を検知する温度センサ(例えば、サーミスタ)を備えることとしてもよい。非接触温度センサ14は受熱板17の温度変化のみならず、筐体10,18内の温度変化をも検知してしまう可能性があるが、温度センサによって筐体10,18内の温度を検知することで、温度補正を行うことができる。   In the above-described embodiment, a temperature sensor (for example, a thermistor) that detects the temperature inside the housings 10 and 18 may be provided separately from the non-contact temperature sensor 14 that detects the temperature of the heat receiving plate 17. Although the non-contact temperature sensor 14 may detect not only the temperature change of the heat receiving plate 17 but also the temperature change in the housings 10 and 18, the temperature sensor detects the temperature in the housings 10 and 18. By doing so, temperature correction can be performed.

上記した実施の形態では、円形の平板状の受熱板17を例として説明したが、受熱板17の形状は、円形や平板状に限定されるものではなく、矩形や湾曲形状であってもよいし、また、その大きさについても実施の形態で説明した例に限定されるものではない。受熱板17を湾曲形状とした場合には、湾曲に沿って気流が流れるので、監視領域の熱を受けやすくなる。また、受熱板17は、熱伝導性の高い部材で連結された複数枚の板で構成されてもよい。これにより、気流の温度が伝導しやすくなる。また、複数の板で受熱板17を構成した場合には、筐体10側に赤外線放射率の高い材質の板を用い、監視領域側に表面処理加工を行いやすい材質の板を用いるという構成とすることもできる。   In the embodiment described above, the circular flat plate heat receiving plate 17 has been described as an example. However, the shape of the heat receiving plate 17 is not limited to a circular shape or a flat plate shape, and may be a rectangular shape or a curved shape. In addition, the size is not limited to the example described in the embodiment. When the heat receiving plate 17 has a curved shape, an air flow flows along the curve, so that the heat in the monitoring area is easily received. The heat receiving plate 17 may be composed of a plurality of plates connected by a member having high thermal conductivity. Thereby, the temperature of the airflow is easily conducted. In addition, when the heat receiving plate 17 is configured by a plurality of plates, a plate made of a material having a high infrared emissivity is used on the housing 10 side, and a plate made of a material that is easy to perform surface treatment processing is used on the monitoring region side. You can also

上記した第3の実施の形態では、筐体18を化粧カバー19で覆うと共に、支持部材16によって受熱板17を支持する例を挙げたが、化粧カバー19と支持部材16と受熱板17を一体に形成することとしてもよい。   In the above-described third embodiment, the case 18 is covered with the decorative cover 19 and the heat receiving plate 17 is supported by the support member 16, but the decorative cover 19, the supporting member 16, and the heat receiving plate 17 are integrated. It is good also as forming in.

本発明は、監視領域における熱を感知して警報等を行う熱感知器として有用である。   The present invention is useful as a heat detector that senses heat in a monitoring area and gives an alarm or the like.

1〜3 熱感知器
10 筐体
11 プリント基板
12 支持部材
13 リード線
14 非接触温度センサ
15 窓
16 支持部材
17 受熱板
18 筐体
19 化粧カバー
1-3 Heat sensor 10 Case 11 Printed circuit board 12 Support member 13 Lead wire 14 Non-contact temperature sensor 15 Window 16 Support member 17 Heat receiving plate 18 Case 19 Cosmetic cover

Claims (6)

監視領域の温度を監視するための熱感知器であって、
前記監視領域から熱を受ける受熱板と、
前記受熱板から離隔して設けられると共に、前記受熱板から放射された赤外線を検出する非接触温度センサと、
前記非接触温度センサによる検出結果に基づいて外部に熱感知信号を送出する電気回路と、
前記非接触温度センサ及び前記電気回路を収納する筐体と、
を備え、
前記受熱板の前記非接触温度センサと対向する面は黒体塗装されている熱感知器。
A heat sensor for monitoring the temperature of the monitoring area,
A heat receiving plate that receives heat from the monitoring area;
A non-contact temperature sensor that is provided apart from the heat receiving plate and detects infrared rays radiated from the heat receiving plate;
An electric circuit for sending a heat sensing signal to the outside based on a detection result by the non-contact temperature sensor;
A housing for housing the non-contact temperature sensor and the electric circuit;
With
A heat sensor in which a surface of the heat receiving plate facing the non-contact temperature sensor is painted black.
前記筐体の一部が前記受熱板を構成している請求項1に記載の熱感知器。   The heat sensor according to claim 1, wherein a part of the housing constitutes the heat receiving plate. 前記筐体から前記監視領域に向かって延びる支持部材を備え、
前記受熱板は、前記支持部材に支持されている請求項1に記載の熱感知器。
A support member extending from the housing toward the monitoring area;
The heat detector according to claim 1, wherein the heat receiving plate is supported by the support member.
前記筐体は、ポリエチレン樹脂によって構成される請求項3に記載の熱感知器。   The heat detector according to claim 3, wherein the casing is made of polyethylene resin. 前記筐体は、防水構造を有する請求項4に記載の熱感知器。   The heat detector according to claim 4, wherein the housing has a waterproof structure. 前記受熱板の前記監視領域側の面は、前記非接触温度センサと対向する面とは異なる表面処理がなされている請求項1乃至5のいずれかに記載の熱感知器。   The heat sensor according to any one of claims 1 to 5, wherein a surface of the heat receiving plate on the monitoring region side is subjected to a surface treatment different from a surface facing the non-contact temperature sensor.
JP2016105562A 2016-05-26 2016-05-26 Heat sensor Active JP6682357B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016105562A JP6682357B2 (en) 2016-05-26 2016-05-26 Heat sensor
JP2020047472A JP6945028B2 (en) 2016-05-26 2020-03-18 Heat detector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016105562A JP6682357B2 (en) 2016-05-26 2016-05-26 Heat sensor

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020047472A Division JP6945028B2 (en) 2016-05-26 2020-03-18 Heat detector

Publications (2)

Publication Number Publication Date
JP2017211879A true JP2017211879A (en) 2017-11-30
JP6682357B2 JP6682357B2 (en) 2020-04-15

Family

ID=60476888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016105562A Active JP6682357B2 (en) 2016-05-26 2016-05-26 Heat sensor

Country Status (1)

Country Link
JP (1) JP6682357B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110232795A (en) * 2019-06-20 2019-09-13 中煤电气有限公司 A kind of monitoring method and system based on infrared thermal imaging technique

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010218044A (en) * 2009-03-13 2010-09-30 Nohmi Bosai Ltd Heat sensor
JP2011192245A (en) * 2010-03-17 2011-09-29 Nohmi Bosai Ltd Heat and smoke compound type fire sensor
JP2011192244A (en) * 2010-03-17 2011-09-29 Nohmi Bosai Ltd Heat sensor
US20150379847A1 (en) * 2013-03-06 2015-12-31 Siemens Schweiz Ag Danger Detector With A Non-Contact Heat Radiation Sensor For Establishing An Ambient Temperature

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010218044A (en) * 2009-03-13 2010-09-30 Nohmi Bosai Ltd Heat sensor
JP2011192245A (en) * 2010-03-17 2011-09-29 Nohmi Bosai Ltd Heat and smoke compound type fire sensor
JP2011192244A (en) * 2010-03-17 2011-09-29 Nohmi Bosai Ltd Heat sensor
US20150379847A1 (en) * 2013-03-06 2015-12-31 Siemens Schweiz Ag Danger Detector With A Non-Contact Heat Radiation Sensor For Establishing An Ambient Temperature

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110232795A (en) * 2019-06-20 2019-09-13 中煤电气有限公司 A kind of monitoring method and system based on infrared thermal imaging technique

Also Published As

Publication number Publication date
JP6682357B2 (en) 2020-04-15

Similar Documents

Publication Publication Date Title
US8366317B2 (en) Sensor for detecting electromagnetic radiation
WO2011046163A1 (en) Infrared sensor and circuit substrate equipped therewith
JP2015166743A5 (en)
JP5541576B2 (en) Wind direction anemometer and wind direction wind speed device
JP2011128067A (en) Infrared sensor module
JP2008157754A (en) Thermal mass flowmeter
JP5696831B2 (en) Infrared sensor
JP2011216323A (en) Induction heating cooker
JP5741830B2 (en) Infrared sensor device
JP6682357B2 (en) Heat sensor
JP2022100256A (en) Pyranometer and method of assembling pyranometer
JP6945028B2 (en) Heat detector
JP2011192244A (en) Heat sensor
KR20170052294A (en) Temperature sensor with thermopile
KR20170121820A (en) Thermometer package
JP2014119280A (en) Temperature sensor
JP5920388B2 (en) Temperature sensor
US10024722B2 (en) Temperature detection device for a vehicle heater
KR20180061996A (en) Wrist watch
KR101651901B1 (en) Temperature measuring device
KR101778841B1 (en) Radiative heat flux sensor device
JP5754223B2 (en) Fixing device
JP2012173015A (en) Temperature sensor device and induction heating cooker
JP2011192245A (en) Heat and smoke compound type fire sensor
US20170131729A1 (en) Thermostat with thermal radiation detector

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190215

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20191203

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20191129

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20191224

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200310

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200325

R150 Certificate of patent or registration of utility model

Ref document number: 6682357

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150