JP2017208987A5 - - Google Patents
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- Publication number
- JP2017208987A5 JP2017208987A5 JP2016101733A JP2016101733A JP2017208987A5 JP 2017208987 A5 JP2017208987 A5 JP 2017208987A5 JP 2016101733 A JP2016101733 A JP 2016101733A JP 2016101733 A JP2016101733 A JP 2016101733A JP 2017208987 A5 JP2017208987 A5 JP 2017208987A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- snubber circuit
- power converter
- switching element
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000758 substrate Substances 0.000 claims 11
- 239000003990 capacitor Substances 0.000 claims 6
- 238000006243 chemical reaction Methods 0.000 claims 4
- 239000004020 conductor Substances 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 1
Claims (10)
前記スイッチング素子に並列接続されるコンデンサを含むスナバ回路が設置される第２の基板と、
前記スイッチング素子と前記スナバ回路とを電気的に接続する導体と
を備えることを特徴とする電力変換装置。 A first substrate on which a switching element is installed;
A second substrate on which a snubber circuit including a capacitor connected in parallel to the switching element is installed;
A power conversion device comprising: a conductor that electrically connects the switching element and the snubber circuit.
を特徴とする請求項１に記載の電力変換装置。 The power converter according to claim 1, wherein the second substrate has a smaller thermal expansion coefficient than the first substrate.
を特徴とする請求項１または請求項２に記載の電力変換装置。 The first substrate and the second substrate are disposed in the same plane, and the capacitor is disposed closer to the first substrate than the center of the upper surface of the second substrate. The power converter device of Claim 1 or Claim 2.
を特徴とする請求項１または請求項２に記載の電力変換装置。 The power converter according to claim 1, wherein the first substrate and the second substrate are sequentially arranged in a stacking direction.
前記コンデンサの電極の他端は前記第２の基板の導体パターンに接続されていることを特徴とする請求項６に記載の電力変換装置。 One end of the capacitor electrode is connected to the wire,
Power converter according to claim 6 and the other end of said capacitor electrode, characterized in that is connected to the conductor pattern of the second substrate.
前記抵抗、前記コンデンサおよび前記ワイヤは直列に接続されていることを特徴とする請求項６に記載の電力変換装置。 The power converter according to claim 6, wherein the resistor, the capacitor, and the wire are connected in series.
The power conversion device according to any one of claims 1 to 9 , wherein the switching element is formed using a wide gap semiconductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016101733A JP6602260B2 (en) | 2016-05-20 | 2016-05-20 | Power converter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016101733A JP6602260B2 (en) | 2016-05-20 | 2016-05-20 | Power converter |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017208987A JP2017208987A (en) | 2017-11-24 |
| JP2017208987A5 true JP2017208987A5 (en) | 2018-10-11 |
| JP6602260B2 JP6602260B2 (en) | 2019-11-06 |
Family
ID=60416608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016101733A Active JP6602260B2 (en) | 2016-05-20 | 2016-05-20 | Power converter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6602260B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019186983A (en) * | 2018-04-02 | 2019-10-24 | 株式会社豊田中央研究所 | Snubber capacitor incorporated semiconductor power module |
| JP6844746B2 (en) * | 2018-04-19 | 2021-03-17 | 三菱電機株式会社 | Power converter |
| JP7006547B2 (en) * | 2018-09-10 | 2022-01-24 | 三菱電機株式会社 | Semiconductor device |
| JP7038632B2 (en) | 2018-09-12 | 2022-03-18 | 三菱電機株式会社 | Semiconductor devices and methods for manufacturing semiconductor devices |
| CN114144965A (en) * | 2019-07-24 | 2022-03-04 | 日立安斯泰莫株式会社 | Circuit arrangement |
| JP7358921B2 (en) | 2019-11-08 | 2023-10-11 | 富士電機株式会社 | Semiconductor module and semiconductor module manufacturing method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4901652B2 (en) * | 2007-08-31 | 2012-03-21 | 三菱電機株式会社 | Semiconductor device assembly method and semiconductor device |
| JP5258721B2 (en) * | 2009-09-18 | 2013-08-07 | 三菱電機株式会社 | Inverter device |
| JP5860784B2 (en) * | 2012-09-10 | 2016-02-16 | 日立オートモティブシステムズ株式会社 | Power semiconductor module |
-
2016
- 2016-05-20 JP JP2016101733A patent/JP6602260B2/en active Active
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