JP2017207711A - Sound-absorbing structure - Google Patents

Sound-absorbing structure Download PDF

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JP2017207711A
JP2017207711A JP2016101612A JP2016101612A JP2017207711A JP 2017207711 A JP2017207711 A JP 2017207711A JP 2016101612 A JP2016101612 A JP 2016101612A JP 2016101612 A JP2016101612 A JP 2016101612A JP 2017207711 A JP2017207711 A JP 2017207711A
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sound
absorbing structure
heat
source
structure according
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真也 三通田
Shinya Mitorida
真也 三通田
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Fujifilm Business Innovation Corp
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Fuji Xerox Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a sound-absorbing structure that has a high quietness and a high heat dissipation.SOLUTION: A sound-absorbing structure disposed in a substrate having a sound source and heat source includes: a film vibration sound absorber disposed so as to surround the sound source and heat source; and a heat conductor that is sandwiched between the top faces of the sound source and heat source and the film vibration sound absorber and conducts the heat of the heat source to the film vibration sound absorber. The film vibration sound absorber includes: a frame body having a hole whose area is changed in response to the frequency of the sound source; and an air layer formed by covering the hole with a film-like vibrator.SELECTED DRAWING: Figure 3

Description

本発明は、吸音構造体に関する。   The present invention relates to a sound absorbing structure.

多数の開口を有する板状体で、樹脂薄膜を挟持してなる膜振動吸音材が知られている（特許文献１）。
金属基材と、金属基材上に形成され、絶縁性を有する樹脂からなる絶縁層と、金属基材上に絶縁層が形成されていない部分であり、かつ絶縁層の中心部分を囲うように連続して形成された絶縁層除去部とを有する熱伝導性封止部材も知られている（特許文献２）。 A membrane vibration sound-absorbing material formed by sandwiching a resin thin film with a plate-like body having a large number of openings is known (Patent Document 1).
A metal substrate, an insulating layer formed on the metal substrate and made of an insulating resin, and a portion where the insulating layer is not formed on the metal substrate, and surrounding the central portion of the insulating layer A heat conductive sealing member having a continuously formed insulating layer removing portion is also known (Patent Document 2).

特開平６−８３３６５号公報JP-A-6-83365 特開２０１１−２２２３３３号公報JP 2011-222333 A

静音性に優れるとともに高い放熱性を備えた吸音構造体を提供することを目的とする。   An object of the present invention is to provide a sound-absorbing structure having excellent silence and high heat dissipation.

前記課題を解決するために、請求項１に記載の吸音構造体は、
音源及び熱源を有する基板の表面に設けられる吸音構造体であって、
前記音源及び熱源を囲うように配置された膜振動吸音材と、
前記音源及び熱源の上面と前記膜振動吸音材との間に挟み入れられて前記熱源の熱を前記膜振動吸音材に伝える熱伝導体と、を備えた、
ことを特徴とする。 In order to solve the above problem, the sound absorbing structure according to claim 1,
A sound absorbing structure provided on the surface of a substrate having a sound source and a heat source,
A membrane vibration absorbing material arranged so as to surround the sound source and the heat source;
A heat conductor that is sandwiched between the sound source and the upper surface of the heat source and the membrane vibration absorbing material, and transmits the heat of the heat source to the membrane vibration absorbing material,
It is characterized by that.

請求項２記載の発明は、請求項１に記載の吸音構造体において、
前記膜振動吸音材は、孔部を有する枠体と、前記孔部を膜状の振動体で覆うことで形成される空気層とからなる、
ことを特徴とする。 The invention according to claim 2 is the sound absorbing structure according to claim 1,
The membrane vibration-absorbing material comprises a frame having holes and an air layer formed by covering the holes with a film-like vibrating body.
It is characterized by that.

請求項３記載の発明は、請求項２に記載の吸音構造体において、
前記孔部は、前記音源の周波数に応じて前記孔部の面積を変化させる、
ことを特徴とする。 The invention according to claim 3 is the sound absorbing structure according to claim 2,
The hole changes the area of the hole according to the frequency of the sound source,
It is characterized by that.

請求項４記載の発明は、請求項２又は３に記載の吸音構造体において、
前記枠体は、熱伝導性が高い材料で形成されている、
ことを特徴とする。 The invention according to claim 4 is the sound absorbing structure according to claim 2 or 3,
The frame is formed of a material having high thermal conductivity.
It is characterized by that.

請求項５記載の発明は、請求項１ないし４のいずれか１項に記載の吸音構造体において、
前記熱伝導体は、前記音源及び熱源の前記上面と相補的な形状をもつ相補形状部を有する、
ことを特徴とする。 The invention according to claim 5 is the sound absorbing structure according to any one of claims 1 to 4,
The heat conductor has a complementary shape portion having a shape complementary to the upper surface of the sound source and the heat source.
It is characterized by that.

請求項６記載の発明は、請求項１ないし５のいずれか１項に記載の吸音構造体において、
前記熱伝導体は、絶縁性および熱伝導性が良好な材料で形成されている、
ことを特徴とする。 A sixth aspect of the present invention is the sound absorbing structure according to any one of the first to fifth aspects,
The thermal conductor is formed of a material having good insulation and thermal conductivity.
It is characterized by that.

請求項７記載の発明は、請求項６に記載の吸音構造体において、
前記材料は、ＰＰＳ樹脂である、
ことを特徴とする。 The invention according to claim 7 is the sound absorbing structure according to claim 6,
The material is PPS resin.
It is characterized by that.

請求項８記載の発明は、請求項１ないし７のいずれか１項に記載の吸音構造体において、
前記膜振動吸音材の上面にヒートシンク形状部分を設けた、
ことを特徴とする。 The invention according to claim 8 is the sound absorbing structure according to any one of claims 1 to 7,
A heat sink shape portion was provided on the upper surface of the membrane vibration absorbing material,
It is characterized by that.

請求項９記載の発明は、請求項１ないし８のいずれか１項に記載の吸音構造体において、
前記音源及び熱源が、トナー像を形成する画像形成装置の画像形成手段に印加する交流電圧を発生させる高圧電源装置に含まれるトランスである、
ことを特徴とする。 The invention according to claim 9 is the sound absorbing structure according to any one of claims 1 to 8,
The sound source and the heat source are a transformer included in a high-voltage power supply device that generates an alternating voltage to be applied to image forming means of an image forming apparatus that forms a toner image.
It is characterized by that.

請求項１に記載の発明によれば、放熱性を確保しつつ静音性の高い吸音構造体を提供することができる。
請求項２、３に記載の発明によれば、音源の周波数に応じて遮音することができる。
請求項４、５、６、７、８に記載の発明によれば、熱源の熱を効率的に放熱することができる。
請求項９に記載の発明によれば、静音性及び放熱性に優れた画像形成装置を提供することができる。 According to the first aspect of the present invention, it is possible to provide a sound-absorbing structure with high noise reduction while ensuring heat dissipation.
According to the second and third aspects of the invention, sound insulation can be performed according to the frequency of the sound source.
According to the invention of Claims 4, 5, 6, 7, and 8, the heat of the heat source can be efficiently radiated.
According to the ninth aspect of the present invention, it is possible to provide an image forming apparatus excellent in silence and heat dissipation.

（ａ）は吸音構造体の外観を示す斜視図、（ｂ）はヒートシンク形状部分を有する蓋体を有する吸音構造体の外観を示す斜視図である。(A) is a perspective view which shows the external appearance of a sound absorption structure, (b) is a perspective view which shows the external appearance of the sound absorption structure which has a cover body which has a heat sink shape part. （ａ）は膜振動吸音材の概略平面図、（ｂ）は同Ａ−Ａ線における断面模式図である。(A) is a schematic plan view of a film | membrane vibration sound-absorbing material, (b) is a cross-sectional schematic diagram in the AA line. （ａ）は吸音構造体を音源及び熱源を有する基板上に取り付けた状態を示す縦断面模式図、（ｂ）は同横断面模式図である。(A) is a longitudinal cross-sectional schematic diagram which shows the state which attached the sound absorption structure on the board | substrate which has a sound source and a heat source, (b) is the cross-sectional schematic diagram. 画像形成装置の内部構成を示す断面模式図である。1 is a schematic cross-sectional view showing an internal configuration of an image forming apparatus. 吸音構造体を固定配置した高圧電源の斜視図である。It is a perspective view of the high voltage power source which fixedly arranged the sound absorption structure.

次に図面を参照しながら、以下に実施形態及び具体例を挙げ、本発明を更に詳細に説明するが、本発明はこれらの実施形態及び具体例に限定されるものではない。
また、以下の図面を使用した説明において、図面は模式的なものであり、各寸法の比率等は現実のものとは異なることに留意すべきであり、理解の容易のために説明に必要な部材以外の図示は適宜省略されている。 Next, the present invention will be described in more detail with reference to the drawings with reference to embodiments and specific examples. However, the present invention is not limited to these embodiments and specific examples.
Also, in the description using the following drawings, it should be noted that the drawings are schematic and the ratio of each dimension and the like are different from the actual ones, and are necessary for the description for easy understanding. Illustrations other than the members are omitted as appropriate.

（１）吸音構造体の構成
図１（ａ）は吸音構造体１の外観を示す斜視図、（ｂ）はヒートシンク形状部分２１を有する蓋体２０を有する吸音構造体１の外観を示す斜視図、図２（ａ）は吸音構造体１を音源及び熱源を有する基板１４１上に取り付けた状態を示す縦断面模式図、（ｂ）は同横断面模式図、図３（ａ）は膜振動吸音材の概略平面図、（ｂ）は同Ａ−Ａ線における断面模式図である。
以下、図面を参照しながら、吸音構造体１の構成について説明する。 (1) Configuration of Sound Absorbing Structure FIG. 1A is a perspective view showing the appearance of the sound absorbing structure 1, and FIG. 1B is a perspective view showing the appearance of the sound absorbing structure 1 having a lid 20 having a heat sink shape portion 21. 2A is a schematic longitudinal sectional view showing a state in which the sound absorbing structure 1 is mounted on a substrate 141 having a sound source and a heat source, FIG. 2B is a schematic cross sectional view thereof, and FIG. The schematic plan view of a material and (b) are the cross-sectional schematic diagrams in the AA line.
Hereinafter, the structure of the sound absorbing structure 1 will be described with reference to the drawings.

（１．１）全体構成
吸音構造体１は、図１に示すように、膜振動吸音材１０と、蓋体２０と、熱伝導体３０（図３に図示）と、からなり、音源及び熱源の一例としての高圧電源２００の基板２１０上に配置されたトランスＴｒを囲むように固定配置された状態で使用される（図３（ａ）参照）。 (1.1) Overall Configuration As shown in FIG. 1, the sound absorbing structure 1 includes a membrane vibration sound absorbing material 10, a lid 20, and a heat conductor 30 (shown in FIG. 3). As an example, the high-voltage power supply 200 is used in a state of being fixedly disposed so as to surround a transformer Tr disposed on a substrate 210 (see FIG. 3A).

（１．２）膜振動吸音材
膜振動吸音材１０は、図２に示すように、多数の孔部１２を有する枠体１１と、板状または膜状の振動体としての樹脂薄膜１３からなる。
枠体１１は、図２に示すように、外形形状が矩形で、枠体１１の板厚方向に貫通する多数（本実施形態においては１２個）の孔部１２が設けられている。枠体１１の材質は特に制限されないが、熱伝導率が高い材料、一例として、アルミニウムが好ましい。 (1.2) Membrane Vibration Sound Absorbing Material As shown in FIG. 2, the film vibration sound absorbing material 10 includes a frame body 11 having a large number of holes 12 and a resin thin film 13 as a plate-like or film-like vibration body. .
As shown in FIG. 2, the frame 11 has a rectangular outer shape, and is provided with a large number (12 in this embodiment) of holes 12 that penetrate in the thickness direction of the frame 11. The material of the frame 11 is not particularly limited, but a material having high thermal conductivity, for example, aluminum is preferable.

孔部１２の形状は、本実施形態においては、ａ×ｂの大きさを有する矩形であるが、大きさは膜振動吸音材１０の孔部１２の面積（ａ×ｂ）と吸音周波数ｆとの相関を利用し、音源の周波数に応じて選択することができる。また、矩形に限らず、円形、多角形などの任意の形状とすることができる。
枠体１１の板厚によって、樹脂薄膜１３によって孔部１２内に画成される空気層の層厚Ｌが決定される。 In the present embodiment, the shape of the hole 12 is a rectangle having a size of a × b. However, the size is determined by the area (a × b) of the hole 12 of the membrane vibration absorbing material 10 and the sound absorption frequency f. Can be selected according to the frequency of the sound source. Further, the shape is not limited to a rectangle, and may be an arbitrary shape such as a circle or a polygon.
The thickness L of the air layer defined in the hole 12 by the resin thin film 13 is determined by the plate thickness of the frame 11.

樹脂薄膜１３（図１、図２（ａ）においては破線で図示）は、孔部１２を枠体１１の両面から塞いで孔部１２内に空気層を形成することができる非通気性のシートからなり、具体的には、熱可塑性樹脂のシートを用いることができる。
熱可塑性樹脂としては、ＰＥ（ポリエチレン）、ＰＶＣ（ポリ塩化ビニル）、ＰＰ（ポリプロピレン）、ＰＥＴ（ポリエチレンテレフタレート）、アクリル樹脂、ＰＥＥＫ（ポリエーテルエーテルケトン）、環状オレフィン、ポリ乳酸等から選ばれる１種または２種以上の樹脂が挙げられる。
上記に挙げた熱可塑性樹脂の中でも、強度、加工性に優れるＰＥＴ（ポリエチレンテレフタレート）が好ましい。 The resin thin film 13 (illustrated by a broken line in FIGS. 1 and 2A) is a non-breathable sheet capable of closing the hole 12 from both sides of the frame 11 and forming an air layer in the hole 12. Specifically, a thermoplastic resin sheet can be used.
The thermoplastic resin is selected from PE (polyethylene), PVC (polyvinyl chloride), PP (polypropylene), PET (polyethylene terephthalate), acrylic resin, PEEK (polyether ether ketone), cyclic olefin, polylactic acid, and the like. A seed | species or 2 or more types of resin is mentioned.
Among the thermoplastic resins listed above, PET (polyethylene terephthalate), which is excellent in strength and workability, is preferable.

樹脂薄膜１３は、面密度が低すぎると吸音周波数が高周波数側になり、吸音率は低下する。また、面密度が高すぎると吸音周波数が低周波数側になるが、膜振動が抑制されて吸音率は低下する。そのために、面密度は０．０５〜２．０［ｋｇ／ｍ２］が好ましい。
樹脂薄膜１３の膜厚ｈ（図２（ｂ）に図示）は、特に限定されないが、良好な膜振動を得て、吸音効果を得るためには、１０〜１００μｍ程度とするのが好ましい。 If the surface density of the resin thin film 13 is too low, the sound absorption frequency becomes higher and the sound absorption rate is lowered. On the other hand, if the surface density is too high, the sound absorption frequency becomes lower, but the membrane vibration is suppressed and the sound absorption rate is lowered. Therefore, the surface density is preferably 0.05 to 2.0 [kg / m 2 ].
The film thickness h (illustrated in FIG. 2B) of the resin thin film 13 is not particularly limited, but is preferably about 10 to 100 μm in order to obtain good film vibration and obtain a sound absorbing effect.

このような膜振動吸音材１０における吸音周波数ｆは下記式によって示されることが知られている。
ｆ＝１／２π［ρｃ２／ｍＬ＋（π４／ｍ）（Ｅｈ３／１２（１−ρ２））（（ｐ／ａ）２＋（ｑ／ａ）２）］１／２
上記式において、Ｌは空気層の層厚［ｍ］、ｍは樹脂薄膜の面密度［ｋｇ／ｍ２］、Ｅは樹脂薄膜のヤング率［Ｎ／ｍ２］、ｈは樹脂薄膜の膜厚［ｍ］、ｃは音速［ｍ／ｓｅｃ］、ａ、ｂは開口部の大きさ［ｍ］、ｐ、ｑは正整数、をそれぞれ示す。尚、上記式はhttp://esd.env.kitakyu-u.ac.jp/kuroki/KAANET_kaap/kuroki/text/txt21.htmlに記載の事項を参照及び引用したものである。 It is known that the sound absorption frequency f in such a membrane vibration sound absorbing material 10 is represented by the following equation.
f = 1 / 2π [ρc 2 / mL + (π 4 / m) (Eh 3/12 (1-ρ 2)) ((p / a) 2 + (q / a) 2)] 1/2
In the above formula, L is the air layer thickness [m], m is the resin thin film surface density [kg / m 2 ], E is the resin thin film Young's modulus [N / m 2 ], and h is the resin thin film thickness. [M] and c are sound velocity [m / sec], a and b are aperture sizes [m], and p and q are positive integers, respectively. The above formula refers to and refers to the matters described in http://esd.env.kitakyu-u.ac.jp/kuroki/KAANET_kaap/kuroki/text/txt21.html.

上記式より、枠体１１の板厚を厚くして空気層の層厚Ｌを大きくし、孔部１２の大きさ（ａ×ｂ）を大きくすると、吸音周波数ｆは低くなる。また、枠体１１の板厚を薄くして空気層の層厚Ｌを小さくし、孔部１２の大きさ（ａ×ｂ）を小さくすると、吸音周波数ｆは高くなる。
また、樹脂薄膜１３の膜厚ｈを薄くすると吸音周波数ｆは低くなり、樹脂薄膜１３の膜厚ｈを厚くすると吸音周波数ｆは高くなる。 From the above formula, if the thickness of the frame 11 is increased to increase the layer thickness L of the air layer, and the size (a × b) of the hole 12 is increased, the sound absorption frequency f decreases. Moreover, if the plate | board thickness of the frame 11 is made thin, the layer thickness L of an air layer is made small, and the magnitude | size (axb) of the hole 12 is made small, the sound absorption frequency f will become high.
Further, when the film thickness h of the resin thin film 13 is reduced, the sound absorption frequency f is decreased, and when the film thickness h of the resin thin film 13 is increased, the sound absorption frequency f is increased.

このように構成される膜振動吸音材１０は、基板２１０にトランスＴｒを囲むように互いの膜振動吸音材１０が相対して固定配置される。それぞれの膜振動吸音材１０は、はんだ又は接着剤ＡＤを介して基板１４１に固定される。
尚、接着剤ＡＤとしては剥がれ防止及び基板２１０への熱伝導を抑制するために、耐熱性があり、熱伝導性の低いものが好ましい。また、図３（ｃ）に示すように、枠体１１の一端１１ａをフランジ状に形成して断熱材やウレタンシール材Ｓを介して基板１４１に対して取り外し可能に接着してもよい。 The membrane vibration sound absorbing material 10 configured in this way is fixedly disposed relative to each other so that the substrate 210 surrounds the transformer Tr. Each film vibration sound absorbing material 10 is fixed to the substrate 141 via solder or an adhesive AD.
The adhesive AD preferably has heat resistance and low thermal conductivity in order to prevent peeling and suppress thermal conduction to the substrate 210. Moreover, as shown in FIG.3 (c), the end 11a of the frame 11 may be formed in a flange shape, and you may adhere | attach to the board | substrate 141 via a heat insulating material or the urethane seal material S so that removal is possible.

（１．３）蓋体
蓋体２０は、トランスＴｒを囲むように基板１４１に固定配置された膜振動吸音材１０に蓋をすることが可能な大きさの非通気性の放熱部材であり、熱伝導率が高い材料、一例として、アルミニウムの板部材が好ましい。尚、蓋体２０は膜振動吸音材１０の一つの枠体１１と一体に形成してもよい。
また、図１（ｂ）及び図３（ａ）に示すように、蓋体２０の上面にはヒートシンク形状部分２１が設けられていることが好ましい。ヒートシンク形状部分２１を設けることで、熱源としてのトランスＴｒからの放熱を促進することができる。 (1.3) Lid The lid 20 is a non-breathable heat radiating member having a size capable of covering the membrane vibration sound absorber 10 fixedly disposed on the substrate 141 so as to surround the transformer Tr. A material having high thermal conductivity, for example, an aluminum plate member is preferable. The lid 20 may be formed integrally with one frame 11 of the membrane vibration sound absorbing material 10.
Further, as shown in FIGS. 1B and 3A, it is preferable that a heat sink-shaped portion 21 is provided on the upper surface of the lid 20. By providing the heat sink shape portion 21, heat radiation from the transformer Tr as a heat source can be promoted.

（１．４）熱伝導体
熱伝導体３０は、トランスＴｒの上面と蓋体２０との間に挟み入れられて熱源としてのトランスＴｒの熱を蓋体２０に伝える熱的接続部材であり、絶縁性および熱伝導性が良好な材料の一例としてＰＰＳ（ポリフェニレンサルファイド）樹脂で形成されていることが好ましい。 (1.4) Thermal Conductor The thermal conductor 30 is a thermal connection member that is sandwiched between the upper surface of the transformer Tr and the lid 20 and transmits heat of the transformer Tr as a heat source to the lid 20. As an example of a material having good insulation and thermal conductivity, it is preferably made of PPS (polyphenylene sulfide) resin.

また、熱伝導体３０は、図３（ａ）に示すように、トランスＴｒの上面の形状と相補的な形状をもつ相補形状部３１を有することがより好ましい。トランスＴｒの上面の凹凸形状に合わせて嵌り合う凸凹形状を有することで、トランスＴｒで発生する熱を蓋体２０により効率的に伝達することができる。   Further, as shown in FIG. 3A, the heat conductor 30 preferably has a complementary shape portion 31 having a shape complementary to the shape of the upper surface of the transformer Tr. By having an uneven shape that fits in accordance with the uneven shape on the upper surface of the transformer Tr, the heat generated in the transformer Tr can be efficiently transmitted by the lid 20.

熱伝導体３０と蓋体２０は、放熱シート３２を介して接着されることが好ましい。放熱シート３２は、図３（ａ）に示すように、粘着性を有する熱伝導性低硬度樹脂層３２ａと非粘着性の熱伝導性樹脂層３２ｂからなり、熱源としてのトランスＴｒと放熱部材としての蓋体２０との間に挟みこんでトランスＴｒの放熱効果を高めることができる。
また、放熱シート３２を用いて接着することで、保全のために蓋体２０を取り外すことができる。 It is preferable that the heat conductor 30 and the lid body 20 are bonded via a heat dissipation sheet 32. As shown in FIG. 3A, the heat radiating sheet 32 includes a heat-conductive low-hardness resin layer 32a having adhesiveness and a non-adhesive heat-conductive resin layer 32b, and a transformer Tr serving as a heat source and a heat radiating member. The heat dissipation effect of the transformer Tr can be enhanced by being sandwiched between the lid 20 and the lid 20.
Moreover, the lid 20 can be removed for maintenance by adhering using the heat dissipation sheet 32.

（２）吸音構造体の作用・効果
以下、本実施形態に係る吸音構造体１の作用について画像形成装置１００を利用例に説明する。図４は本実施形態に係る吸音構造体１が用いられる一例としての画像形成装置１００の内部構成を示す断面模式図、図５は本実施形態に係る吸音構造体１を固定配置した高圧電源２００の斜視図である。 (2) Action / Effect of Sound Absorbing Structure The action of the sound absorbing structure 1 according to the present embodiment will be described below using the image forming apparatus 100 as an application example. FIG. 4 is a schematic cross-sectional view showing an internal configuration of an image forming apparatus 100 as an example in which the sound absorbing structure 1 according to this embodiment is used. FIG. 5 is a high-voltage power supply 200 in which the sound absorbing structure 1 according to this embodiment is fixedly arranged. FIG.

画像形成装置１００は、制御装置１１０、給紙装置１２０、感光体ユニット１３０、現像装置１４０、転写装置１５０、定着装置１６０を備えて構成されている。画像形成装置１００の上面（Ｚ方向）には、画像が記録された用紙Ｐが排出・収容される排出トレイ１００ａが形成されている。   The image forming apparatus 100 includes a control device 110, a paper feeding device 120, a photosensitive unit 130, a developing device 140, a transfer device 150, and a fixing device 160. On the upper surface (Z direction) of the image forming apparatus 100, a discharge tray 100a for discharging and storing the paper P on which an image is recorded is formed.

制御装置１１０は、画像形成装置１００の動作を制御する画像形成装置制御部１１１と、印刷処理要求に応じた画像データを準備するコントローラ部１１２、露光装置ＬＨの点灯を制御する露光制御部１１３、電源装置１１４を有する。電源装置１１４は高圧電源２００を備え、帯電ローラ１３２、現像ローラ１４２、一次転写ローラ１５２、二次転写ローラ１５３等に画像形成動作時に必要な高圧電圧を印加する。   The control device 110 includes an image forming device control unit 111 that controls the operation of the image forming device 100, a controller unit 112 that prepares image data corresponding to a print processing request, an exposure control unit 113 that controls lighting of the exposure device LH, A power supply device 114 is included. The power supply device 114 includes a high voltage power supply 200 and applies a high voltage necessary for an image forming operation to the charging roller 132, the developing roller 142, the primary transfer roller 152, the secondary transfer roller 153, and the like.

コントローラ部１１２は、外部の情報送信装置（例えばパーソナルコンピュータ等）から入力された印刷情報を潜像形成用の画像情報に変換して予め設定されたタイミングで、駆動信号を露光装置ＬＨに出力する。   The controller unit 112 converts print information input from an external information transmission apparatus (for example, a personal computer) into image information for forming a latent image, and outputs a drive signal to the exposure apparatus LH at a preset timing. .

回転する感光体ドラム１３１の表面は、帯電ローラ１３２により帯電され、露光装置ＬＨから出射する潜像形成光により静電潜像が形成される。感光体ドラム１３１上に形成された静電潜像は現像ローラ１４２によりトナー像として現像される。   The surface of the rotating photosensitive drum 131 is charged by the charging roller 132, and an electrostatic latent image is formed by the latent image forming light emitted from the exposure device LH. The electrostatic latent image formed on the photosensitive drum 131 is developed as a toner image by the developing roller 142.

各感光体ユニット１３０の感光体ドラム１３１に形成された各色トナー像は、画像形成装置制御部１１１により制御される高圧電源２００から所定の転写電圧が印加された一次転写ローラ１５２により中間転写ベルト１５１上に順次静電転写（一次転写）され、各色トナーが重畳された重畳トナー像が形成される。   Each color toner image formed on the photosensitive drum 131 of each photosensitive unit 130 is transferred to an intermediate transfer belt 151 by a primary transfer roller 152 to which a predetermined transfer voltage is applied from a high voltage power source 200 controlled by the image forming apparatus control unit 111. The toner images are sequentially electrostatically transferred (primary transfer), and a superimposed toner image in which toners of respective colors are superimposed is formed.

中間転写ベルト１５１上の重畳トナー像は、中間転写ベルト１５１の移動に伴って二次転写ローラ１５３が配置された領域（二次転写部ＴＲ）に搬送される。重畳トナー像が二次転写部ＴＲに搬送されると、そのタイミングに合わせて給紙装置１２０から用紙Ｐが二次転写部ＴＲに供給される。そして、二次転写ローラ１５３には、画像形成装置制御部１１１により制御される高圧電源２００から所定の転写電圧が印加され、給紙装置１２０から送り出された用紙Ｐに中間転写ベルト１５１上の多重トナー像が一括転写される。   The superimposed toner image on the intermediate transfer belt 151 is conveyed to a region (secondary transfer unit TR) where the secondary transfer roller 153 is disposed as the intermediate transfer belt 151 moves. When the superimposed toner image is conveyed to the secondary transfer unit TR, the paper P is supplied from the paper feeding device 120 to the secondary transfer unit TR in accordance with the timing. A predetermined transfer voltage is applied to the secondary transfer roller 153 from the high-voltage power source 200 controlled by the image forming apparatus control unit 111, and the sheet P sent out from the sheet feeding device 120 is multiplexed on the intermediate transfer belt 151. The toner image is batch transferred.

転写装置１５０においてトナー像が転写された用紙Ｐは、トナー像が未定着の状態で搬送ガイドを経由して定着装置１６０に搬送される。定着装置１６０に搬送された用紙Ｐは、一対の加熱モジュール１６１と加圧モジュール１６２により、圧着と加熱の作用でトナー像が定着される。
定着トナー像が形成された用紙Ｐは、画像形成装置１００上面の排出トレイ１００ａに排出される。 The paper P on which the toner image has been transferred by the transfer device 150 is conveyed to the fixing device 160 via the conveyance guide in a state where the toner image is not fixed. The sheet P conveyed to the fixing device 160 is fixed with a toner image by a pair of heating module 161 and pressure module 162 by the action of pressure bonding and heating.
The paper P on which the fixing toner image is formed is discharged to a discharge tray 100a on the upper surface of the image forming apparatus 100.

このように構成される画像形成装置１００においては、画像形成動作を実行している間、現像ローラ４２には高圧電源２００から直流現像バイアスＶＤに交流現像バイアスＶＡが重畳された現像バイアスが印加される。交流現像バイアスＶＡは、主として画像形成装置１００のプロセススピードに応じて、交流現像バイアスＶＡの大きさ（ピークトゥピーク値）と周波数が決定され、周波数は３ｋＨｚないし９ｋＨｚ以下の範囲から選択される。   In the image forming apparatus 100 configured as described above, a developing bias in which the AC developing bias VA is superimposed on the DC developing bias VD is applied from the high-voltage power source 200 to the developing roller 42 during the image forming operation. The The AC developing bias VA has a magnitude (peak-to-peak value) and frequency determined according to the process speed of the image forming apparatus 100, and the frequency is selected from a range of 3 kHz to 9 kHz or less.

交流現像バイアスＶＡは高圧電源２００のトランスＴｒで生成される。一方、トランスＴｒは磁性材料からなるチョークコイルを有し、交流電流を流すことで磁性体に歪が生じる磁歪現象が発生するために、チュークコイルの伸び縮みが空気を振動させることで高周波の励磁音が発生する。   The AC developing bias VA is generated by the transformer Tr of the high voltage power source 200. On the other hand, the transformer Tr has a choke coil made of a magnetic material, and a magnetostriction phenomenon occurs in which a magnetic material is distorted when an alternating current is applied. Sound is generated.

高圧電源２００に発生する高周波の励磁音が、画像形成装置１００の外部に漏れ出ると耳障りになることがある。一方、高圧電源２００のトランスＴｒは交流現像バイアスＶＡの生成時に発熱するために、励磁音を遮音するためにトランスＴｒの周囲を遮音材で覆うと放熱が妨げられる虞があった。   When high-frequency excitation sound generated in the high-voltage power supply 200 leaks out of the image forming apparatus 100, it may be annoying. On the other hand, since the transformer Tr of the high-voltage power supply 200 generates heat when the AC developing bias VA is generated, there is a possibility that heat radiation may be hindered if the periphery of the transformer Tr is covered with a sound insulating material in order to isolate the excitation sound.

図５に示すように、本実施形態に係る吸音構造体１を高圧電源２００の基板２１０表面にトランスＴｒを囲むように固定配置した場合、吸音構造体１の膜振動吸音材１０でトランスＴｒから発生する励磁音を吸音しながら、トランスＴｒで発生する熱は熱伝導体３０を介してヒートシンク形状部分２１を有する蓋体２０から放熱する。
その結果、高圧電源２００のトランスＴｒに発生する熱を放熱しながら画像形成装置１００の外部に漏れ出る高周波の励磁音を吸音することができる。 As shown in FIG. 5, when the sound absorbing structure 1 according to the present embodiment is fixedly disposed on the surface of the substrate 210 of the high-voltage power supply 200 so as to surround the transformer Tr, the film vibration absorbing material 10 of the sound absorbing structure 1 is separated from the transformer Tr. While absorbing the generated excitation sound, the heat generated in the transformer Tr is radiated from the lid body 20 having the heat sink shape portion 21 through the heat conductor 30.
As a result, it is possible to absorb high-frequency excitation sound that leaks outside the image forming apparatus 100 while dissipating heat generated in the transformer Tr of the high-voltage power supply 200.

「実施例」
本実施形態に係る吸音構造体１として、画像形成装置１００の交流現像バイアスＶＡの特定周波数に応じて、膜振動吸音材１０の開口部１２の大きさ（ａ×ｂ）と、空気層の層厚Ｌを設定し、樹脂薄膜１３を所定の膜厚ｈのＰＥＴ樹脂フィルムとして、高圧電源２００の基板２１０表面にトランスＴｒを囲むように固定配置した。その結果、特定周波数における高周波の励磁音の約９０％を吸音することができた。 "Example"
As the sound absorbing structure 1 according to this embodiment, the size (a × b) of the opening 12 of the membrane vibration sound absorbing material 10 and the layer of the air layer according to the specific frequency of the AC developing bias VA of the image forming apparatus 100. The thickness L was set, and the resin thin film 13 was fixed as a PET resin film having a predetermined thickness h so as to surround the transformer Tr on the surface of the substrate 210 of the high-voltage power supply 200. As a result, it was possible to absorb about 90% of high-frequency excitation sound at a specific frequency.

１・・・吸音構造体
１０・・・膜振動吸音材
１１・・・枠体
１２・・・孔部
１３・・・樹脂薄膜
２０・・・蓋体
２１・・・ヒートシンク形状部
３０・・・熱伝導体
３１・・・相補形状部
３２・・・放熱シート
１００・・・画像形成装置
２００・・・高圧電源
Ｔｒ・・・トランス
DESCRIPTION OF SYMBOLS 1 ... Sound absorption structure 10 ... Membrane vibration sound-absorbing material 11 ... Frame body 12 ... Hole part 13 ... Resin thin film 20 ... Lid body 21 ... Heat sink shape part 30 ... Thermal conductor 31 ... Complementary shaped part 32 ... Heat dissipation sheet 100 ... Image forming apparatus 200 ... High voltage power supply Tr ... Transformer

Claims (9)

音源及び熱源を有する基板に設けられる吸音構造体であって、
前記音源及び熱源を囲うように配置された膜振動吸音材と、
前記音源及び熱源の上面と前記膜振動吸音材との間に挟み入れられて前記熱源の熱を前記膜振動吸音材に伝える熱伝導体と、を備えた、
ことを特徴とする吸音構造体。 A sound absorbing structure provided on a substrate having a sound source and a heat source,
A membrane vibration absorbing material arranged so as to surround the sound source and the heat source;
A heat conductor that is sandwiched between the sound source and the upper surface of the heat source and the membrane vibration absorbing material, and transmits the heat of the heat source to the membrane vibration absorbing material,
A sound-absorbing structure characterized by that. 前記膜振動吸音材は、孔部を有する枠体と、前記孔部を膜状の振動体で覆うことで形成される空気層とからなる、
ことを特徴とする請求項１に記載の吸音構造体。 The membrane vibration-absorbing material comprises a frame having holes and an air layer formed by covering the holes with a film-like vibrating body.
The sound-absorbing structure according to claim 1. 前記孔部は、前記音源の周波数に応じて前記孔部の面積を変化させる、
ことを特徴とする請求項２に記載の吸音構造体。 The hole changes the area of the hole according to the frequency of the sound source,
The sound-absorbing structure according to claim 2. 前記枠体は、熱伝導性が高い材料で形成されている、
ことを特徴とする請求項２又は３に記載の吸音構造体。 The frame is formed of a material having high thermal conductivity.
The sound absorbing structure according to claim 2 or 3, wherein 前記熱伝導体は、前記音源及び熱源の前記上面と相補的な形状をもつ相補形状部を有する、
ことを特徴とする請求項１ないし４のいずれか１項に記載の吸音構造体。 The heat conductor has a complementary shape portion having a shape complementary to the upper surface of the sound source and the heat source.
The sound absorbing structure according to any one of claims 1 to 4, wherein the sound absorbing structure is provided. 前記熱伝導体は、絶縁性および熱伝導性が良好な材料で形成されている、
ことを特徴とする請求項１ないし５のいずれか１項に記載の吸音構造体。 The thermal conductor is formed of a material having good insulation and thermal conductivity.
The sound-absorbing structure according to any one of claims 1 to 5, wherein: 前記材料は、ＰＰＳ樹脂である、
ことを特徴とする請求項６に記載の吸音構造体。 The material is PPS resin.
The sound absorbing structure according to claim 6. 前記膜振動吸音材の上面にヒートシンク形状部分を設けた、
ことを特徴とする請求項１ないし７のいずれか１項に記載の吸音構造体。 A heat sink shape portion was provided on the upper surface of the membrane vibration absorbing material,
The sound-absorbing structure according to any one of claims 1 to 7, 前記音源及び熱源が、トナー像を形成する画像形成装置の画像形成手段に印加する交流電圧を発生させる高圧電源装置に含まれるトランスである、
ことを特徴とする請求項１ないし８のいずれか１項に記載の吸音構造体。 The sound source and the heat source are a transformer included in a high-voltage power supply device that generates an alternating voltage to be applied to image forming means of an image forming apparatus that forms a toner image.
The sound-absorbing structure according to any one of claims 1 to 8, wherein
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Citations (8)

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Publication number Priority date Publication date Assignee Title
JPS54120826A (en) * 1978-03-13 1979-09-19 Hitachi Ltd Transformer
JPH0683365A (en) * 1992-03-13 1994-03-25 Yunitsukusu:Kk Film vibrating sound absorber
JPH10222170A (en) * 1997-02-07 1998-08-21 Unix:Kk Film vibration sound absorber and sound absorption method
JP2002009475A (en) * 2000-06-16 2002-01-11 Hitachi Ltd Heat sink and electronic apparatus
JP2003051573A (en) * 2001-05-31 2003-02-21 Matsushita Electric Ind Co Ltd Power module and its manufacturing method
JP2006351653A (en) * 2005-06-14 2006-12-28 Sumitomo Electric Ind Ltd Reactor device
JP2010277017A (en) * 2009-06-01 2010-12-09 Inoac Corp Sound absorbing panel
JP2016015248A (en) * 2014-07-02 2016-01-28 株式会社豊田自動織機 Power storage device unit

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54120826A (en) * 1978-03-13 1979-09-19 Hitachi Ltd Transformer
JPH0683365A (en) * 1992-03-13 1994-03-25 Yunitsukusu:Kk Film vibrating sound absorber
JPH10222170A (en) * 1997-02-07 1998-08-21 Unix:Kk Film vibration sound absorber and sound absorption method
JP2002009475A (en) * 2000-06-16 2002-01-11 Hitachi Ltd Heat sink and electronic apparatus
JP2003051573A (en) * 2001-05-31 2003-02-21 Matsushita Electric Ind Co Ltd Power module and its manufacturing method
JP2006351653A (en) * 2005-06-14 2006-12-28 Sumitomo Electric Ind Ltd Reactor device
JP2010277017A (en) * 2009-06-01 2010-12-09 Inoac Corp Sound absorbing panel
JP2016015248A (en) * 2014-07-02 2016-01-28 株式会社豊田自動織機 Power storage device unit

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