JP2017201689A - キャリア、キャリアリードフレーム、及び発光デバイス - Google Patents
キャリア、キャリアリードフレーム、及び発光デバイス Download PDFInfo
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- JP2017201689A JP2017201689A JP2017089648A JP2017089648A JP2017201689A JP 2017201689 A JP2017201689 A JP 2017201689A JP 2017089648 A JP2017089648 A JP 2017089648A JP 2017089648 A JP2017089648 A JP 2017089648A JP 2017201689 A JP2017201689 A JP 2017201689A
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- light emitting
- emitting device
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- electrode
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- 238000007747 plating Methods 0.000 claims abstract description 57
- 230000001681 protective effect Effects 0.000 claims abstract description 37
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 abstract description 35
- 229910000679 solder Inorganic materials 0.000 abstract description 8
- 238000005520 cutting process Methods 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 abstract description 3
- 239000004033 plastic Substances 0.000 description 67
- 229920003023 plastic Polymers 0.000 description 67
- 238000000034 method Methods 0.000 description 43
- 230000008569 process Effects 0.000 description 37
- 239000011800 void material Substances 0.000 description 30
- 238000010586 diagram Methods 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 239000000969 carrier Substances 0.000 description 9
- 230000036961 partial effect Effects 0.000 description 7
- 238000007789 sealing Methods 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
- 239000003963 antioxidant agent Substances 0.000 description 5
- 230000003078 antioxidant effect Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000012467 final product Substances 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000002905 metal composite material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical class [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004954 Polyphthalamide Substances 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PCTXFKUTDJMZPU-UHFFFAOYSA-N aluminum;oxygen(2-);terbium(3+) Chemical class [O-2].[O-2].[O-2].[Al+3].[Tb+3] PCTXFKUTDJMZPU-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- OHSVLFRHMCKCQY-UHFFFAOYSA-N lutetium atom Chemical compound [Lu] OHSVLFRHMCKCQY-UHFFFAOYSA-N 0.000 description 1
- 238000011326 mechanical measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920006375 polyphtalamide Polymers 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
本出願は、2015年5月22日に出願された米国特許出願第14/720,230号の一部継続出願であり、該出願と共に、2016年5月5日に出願された米国仮出願第62/331,984号、2014年5月23日に出願された台湾特許出願第103118060号、及び2015年2月3日に出願された台湾特許出願第104103527号の優先権を主張し、これら全てがその全体として参照によって本明細書に組み込まれる。
Claims (20)
- 発光デバイスであって、
発光チップと、
保護めっき層によって覆われた少なくとも1つの電極部と、
反射材料を含有する樹脂筐体と、を備え、
前記保護めっき層を有する前記少なくとも1つの電極部は、前記樹脂筐体によって部分的に覆われ、
前記少なくとも1つの電極部は、翼部をさらに備え、前記翼部の少なくとも一部が外部保護めっき層を含み、
前記保護めっき層と前記外部保護めっき層との厚みは、同一ではない、前記発光デバイス。 - 前記外部保護めっき層の厚みは、均一ではない、請求項1に記載の発光デバイス。
- 前記翼部は、中央領域と、少なくとも1つのエッジ領域とをさらに備える、請求項2に記載の発光デバイス。
- 前記少なくとも1つのエッジ領域は、前記中央領域から突出する、請求項3に記載の発光デバイス。
- 前記中央領域の外側面は、前記外部保護めっき層によって覆われる、請求項4に記載の発光デバイス。
- 前記エッジ領域は、電極部断面を有する、請求項5に記載の発光デバイス。
- 前記電極部断面は、前記外部保護めっき層によって覆われる、請求項6に記載の発光デバイス。
- 前記中央領域の前記外部保護めっき層の厚みは、前記保護めっき層と同一である、請求項7に記載の発光デバイス。
- 前記中央領域の前記外部保護めっき層の厚みは、前記電極部断面の前記外部保護めっき層の厚みよりも厚い、請求項8に記載の発光デバイス。
- 前記電極部断面の前記外部保護めっき層は、前記保護めっき層から延在する、請求項9に記載の発光デバイス。
- 前記電極部断面の上部領域は、前記外部保護めっき層によって覆われる、請求項10に記載の発光デバイス。
- 前記電極部断面は、曲面を有する、請求項11に記載の発光デバイス。
- 筐体断面が前記樹脂筐体の角の近傍に位置する、請求項12に記載の発光デバイス。
- 前記樹脂筐体は、少なくとも1つの筐体断面をさらに有する、請求項13に記載の発光デバイス。
- 前記筐体断面は、前記樹脂筐体の4つの角の近傍に位置する、請求項14に記載の発光デバイス。
- 前記筐体断面は、前記電極部断面と同じ高さではない、請求項15に記載の発光デバイス。
- 発光デバイスであって、
発光チップと、
反射材料を含有する樹脂筐体と、
保護めっき層によって覆われた少なくとも1つの電極部と、を備え、
前記保護めっき層を有する前記少なくとも1つの電極部は、前記樹脂筐体によって部分的に覆われ、
前記少なくとも1つの電極部は、外部保護めっき層によって覆われた電極部断面を有し、
前記外部保護めっき層は、前記保護めっき層から延在する、前記発光デバイス。 - 前記筐体断面は、前記樹脂筐体の角の近傍に位置する、請求項18に記載の発光デバイス。
- 前記保護めっき層の厚みは、前記外部保護めっき層の厚みよりも厚い、請求項19に記載の発光デバイス。
- 前記外部保護めっき層は、前記電極部断面の上部領域を覆う、請求項20に記載の発光デバイス。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662331984P | 2016-05-05 | 2016-05-05 | |
US62/331,984 | 2016-05-05 | ||
US15/470,009 | 2017-03-27 | ||
US15/470,009 US10177292B2 (en) | 2014-05-23 | 2017-03-27 | Carrier, carrier leadframe, and light emitting device |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2017201689A true JP2017201689A (ja) | 2017-11-09 |
Family
ID=58671494
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017089648A Pending JP2017201689A (ja) | 2016-05-05 | 2017-04-28 | キャリア、キャリアリードフレーム、及び発光デバイス |
JP2017003463U Expired - Fee Related JP3212949U (ja) | 2016-05-05 | 2017-07-28 | キャリア、キャリアリードフレーム、及び発光デバイス |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017003463U Expired - Fee Related JP3212949U (ja) | 2016-05-05 | 2017-07-28 | キャリア、キャリアリードフレーム、及び発光デバイス |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP3242337A1 (ja) |
JP (2) | JP2017201689A (ja) |
CN (1) | CN207896083U (ja) |
DE (1) | DE202017104765U1 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000036621A (ja) * | 1998-07-16 | 2000-02-02 | Shichizun Denshi:Kk | 側面型電子部品の電極構造 |
US20130270588A1 (en) * | 2012-04-11 | 2013-10-17 | Lite-On Technology Corp. | Lead frame assembly, led package and led light bar |
JP2015226063A (ja) * | 2014-05-23 | 2015-12-14 | 億光電子工業股▲ふん▼有限公司Everlight Electronics Co.,Ltd. | キャリア、キャリアリードフレーム、及び、発光デバイス |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030011048A1 (en) * | 1999-03-19 | 2003-01-16 | Abbott Donald C. | Semiconductor circuit assembly having a plated leadframe including gold selectively covering areas to be soldered |
JP4830768B2 (ja) * | 2006-05-10 | 2011-12-07 | 日亜化学工業株式会社 | 半導体発光装置及び半導体発光装置の製造方法 |
CN102834941B (zh) * | 2010-12-28 | 2016-10-12 | 日亚化学工业株式会社 | 发光装置及其制造方法 |
-
2017
- 2017-04-28 JP JP2017089648A patent/JP2017201689A/ja active Pending
- 2017-05-05 DE DE202017104765.2U patent/DE202017104765U1/de active Active
- 2017-05-05 CN CN201720501045.6U patent/CN207896083U/zh active Active
- 2017-05-05 EP EP17169634.7A patent/EP3242337A1/en not_active Withdrawn
- 2017-07-28 JP JP2017003463U patent/JP3212949U/ja not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000036621A (ja) * | 1998-07-16 | 2000-02-02 | Shichizun Denshi:Kk | 側面型電子部品の電極構造 |
US20130270588A1 (en) * | 2012-04-11 | 2013-10-17 | Lite-On Technology Corp. | Lead frame assembly, led package and led light bar |
JP2015226063A (ja) * | 2014-05-23 | 2015-12-14 | 億光電子工業股▲ふん▼有限公司Everlight Electronics Co.,Ltd. | キャリア、キャリアリードフレーム、及び、発光デバイス |
Also Published As
Publication number | Publication date |
---|---|
EP3242337A1 (en) | 2017-11-08 |
CN207896083U (zh) | 2018-09-21 |
JP3212949U (ja) | 2017-10-12 |
DE202017104765U1 (de) | 2017-11-15 |
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