JP2017198754A - Imaging apparatus - Google Patents

Imaging apparatus Download PDF

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JP2017198754A
JP2017198754A JP2016087575A JP2016087575A JP2017198754A JP 2017198754 A JP2017198754 A JP 2017198754A JP 2016087575 A JP2016087575 A JP 2016087575A JP 2016087575 A JP2016087575 A JP 2016087575A JP 2017198754 A JP2017198754 A JP 2017198754A
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base member
heat
heat generating
surface area
lens
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卓也 町田
Takuya Machida
卓也 町田
遼 菊田
Ryo Kikuta
遼 菊田
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Nidec Copal Corp
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Nidec Copal Corp
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Abstract

PROBLEM TO BE SOLVED: To provide an imaging apparatus having heat release capability so that its durability is high even under high temperature.SOLUTION: An imaging apparatus includes: a lens part for holding the lens; a base member for supporting the lens part; and a substrate mounted with a sensor for receiving incident light having passed through the lens and a heat generating member. The heat generating member comes into contact with the base member through a heat release member having heat conductivity. The base member is formed with unevenness so that a surface area on a subject side, near an area being in contact with the heat generating member, becomes wider than an apparent surface area.SELECTED DRAWING: Figure 2

Description

本発明の一態様は、小型軽量化を図りながら所定の強度も保ちつつ放熱効率を向上させた撮像装置に関する。   One embodiment of the present invention relates to an imaging device in which heat dissipation efficiency is improved while maintaining a predetermined strength while reducing size and weight.

車載カメラや監視カメラ等に用いられる撮像装置として、複数のレンズを配列して保持するレンズホルダー、撮像素子を実装したプリント配線基板（センサ基板）、レンズホルダーとプリント配線基板とを連結固定するベース部材等を備えたものがある（例えば特許文献１）。この撮像装置では、ベース部材の筒部（レンズホルダーを受容する部分）の中心軸と撮像素子の受光部の中心とが合致するようにベース部材にプリント配線基板を固定し、かつ、レンズを保持したレンズホルダーの雄ネジ部をベース部材の筒部の雌ネジ部に螺合して光軸方向のフォーカス調整を行うよう構成されている。   As an imaging device used for in-vehicle cameras and surveillance cameras, a lens holder that arranges and holds a plurality of lenses, a printed wiring board (sensor board) on which an imaging element is mounted, and a base that connects and fixes the lens holder and the printed wiring board There is one provided with a member or the like (for example, Patent Document 1). In this imaging device, the printed wiring board is fixed to the base member and the lens is held so that the central axis of the cylindrical portion of the base member (the portion that receives the lens holder) and the center of the light receiving portion of the imaging element coincide. The male screw portion of the lens holder is screwed into the female screw portion of the cylindrical portion of the base member to adjust the focus in the optical axis direction.

特開２００５−２１５３６９号公報JP 2005-215369 A

ところで、上記のような従来構成の撮像装置を車載カメラとして用いる場合、高温下などの過酷な環境での使用に耐えられるよう設計する必要がある。特に、近年の撮像装置に搭載される高性能な電子部品は熱を発しやすいため、高温により破壊されてしまうことも想定される。そこで、高温下での使用にも耐えられる撮像装置が求められてきた。   By the way, when using an image pickup apparatus having the conventional configuration as described above as an in-vehicle camera, it is necessary to design it to withstand use in a harsh environment such as a high temperature. In particular, since high-performance electronic components mounted on recent imaging devices are likely to generate heat, it is assumed that they are destroyed by high temperatures. Therefore, there has been a demand for an imaging device that can withstand use at high temperatures.

本発明は、上記課題を解決するために次のような手段を採る。なお、以下の説明において、発明の理解を容易にするために図面中の符号等を括弧書きで付記するが、本発明の各構成要素はこれらの付記したものに限定されるものではなく、当業者が技術的に理解しうる範囲にまで広く解釈されるべきものである。   The present invention adopts the following means in order to solve the above problems. In the following description, in order to facilitate understanding of the invention, reference numerals and the like in the drawings are appended in parentheses, but each component of the present invention is not limited to these appendices. It should be construed broadly to the extent that contractors can technically understand.

本発明の一の手段は、
レンズを保持するレンズ部（２）と、
前記レンズ部を支持するベース部材（３）と、
前記レンズを通過した入射光を受光するセンサ（１１）及び発熱部材（１２）を搭載した基板（１）と、を備え、
前記発熱部材は、熱伝導性を有する放熱部材（１３）を介して前記ベース部材に接触しており、
前記ベース部材は、前記発熱部材との接触領域の被写体側の表面積が見かけの表面積よりも広くなるような凹凸（３１）が形成されている、
撮像装置である。 One means of the present invention is to
A lens part (2) for holding the lens;
A base member (3) for supporting the lens unit;
A sensor (11) that receives incident light that has passed through the lens, and a substrate (1) on which a heating member (12) is mounted,
The heat generating member is in contact with the base member via a heat radiating member (13) having thermal conductivity,
The base member is provided with irregularities (31) such that the surface area on the subject side of the contact area with the heat generating member is larger than the apparent surface area.
An imaging device.

上記構成の撮像装置では、発熱部材から発せられた熱を、放熱部材を介してベース部材から放熱することができる。さらに、ベース部材には表面積が広くなるような凹凸が形成されているため、これらの凹凸が放熱フィンのように機能し、効率的に放熱を行うことが可能となる。この効率的に放熱を行うことが可能となることで、より高温下での使用にも耐えられる撮像装置が提供できる。   In the imaging device having the above configuration, heat generated from the heat generating member can be radiated from the base member via the heat radiating member. Further, since the base member is provided with irregularities that increase the surface area, these irregularities function like radiating fins and can efficiently dissipate heat. Since it is possible to efficiently dissipate heat, an imaging device that can withstand use at higher temperatures can be provided.

上記撮像装置において、好ましくは、
前記ベース部材に形成された前記凹凸は、前記発熱部材との前記接触領域の被写体側の表面積が、見かけの表面積の２倍以上の面積になっている。 In the imaging apparatus, preferably,
The unevenness formed on the base member has a surface area on the subject side of the contact area with the heat generating member that is more than twice the apparent surface area.

上記の撮像装置によれば、より効率的に放熱を行うことが可能となる。より好ましくは、ベース部材の所望の強度を保つ観点で、見かけ表面積を３倍程度にすることが好ましい。   According to the above imaging device, it is possible to dissipate heat more efficiently. More preferably, from the viewpoint of maintaining the desired strength of the base member, the apparent surface area is preferably about three times.

上記撮像装置において、好ましくは、
前記ベース部の凹凸がリブ形状を形成している。 In the imaging apparatus, preferably,
The unevenness of the base portion forms a rib shape.

上記の撮像装置によれば、放熱性を高めるのみでなく、ベース部材の強度を高めることなどが可能となる。より好ましくは、ベース部材をアルミニウムなどの熱伝導性の高い材料で形成する。   According to the above imaging device, it is possible not only to improve heat dissipation but also to increase the strength of the base member. More preferably, the base member is formed of a material having high thermal conductivity such as aluminum.

撮像装置の外観斜視図。The external appearance perspective view of an imaging device. 撮像装置の分解斜視図。The exploded perspective view of an imaging device. 撮像装置の三面図。FIG. 図３のＡ−Ａの位置から見た側面図。The side view seen from the position of AA of FIG.

本発明に係る実施形態について、以下の構成に従って図面を参照しながら具体的に説明する。ただし、以下で説明する実施形態はあくまで本発明の一例にすぎず、本発明の技術的範囲を限定的に解釈させるものではない。なお、各図面において、同一の構成要素には同一の符号を付しており、その説明を省略する場合がある。
１．実施形態
２．補足事項 An embodiment according to the present invention will be specifically described according to the following configuration with reference to the drawings. However, the embodiment described below is merely an example of the present invention and does not limit the technical scope of the present invention. In addition, in each drawing, the same code | symbol is attached | subjected to the same component and the description may be abbreviate | omitted.
1. Embodiment 2. FIG. Supplementary matter

＜１．実施形態＞
本実施形態の撮像装置は、基板に搭載された熱を発する半導体装置（ＤＳＰまたはＡＳＩＣなど）を、熱伝導性を有する放熱部材を介して、アルミニウム等で形成されリブ形状を有するベース部材に接触させることで、放熱性能を高める構成としている点を特徴としている。以下、本実施形態の撮像装置の構成について具体的に説明する。 <1. Embodiment>
The imaging device of this embodiment contacts a semiconductor device (DSP or ASIC, etc.) that generates heat mounted on a substrate with a base member having a rib shape formed of aluminum or the like through a heat radiating member having thermal conductivity. It is characterized by the configuration that improves the heat dissipation performance. Hereinafter, the configuration of the imaging apparatus of the present embodiment will be specifically described.

図１は、本実施形態の撮像装置を前面側（被写体側）から見た外観斜視図である。図２は、本実施形態の撮像装置を前面側から見た分解斜視図である。図３は、本実施形態の撮像装置の三面図であり、図３（ａ）は前面側から見た図、図３（ｂ）は上面側から見た図、図３（ｃ）は裏面側（基板側から被写体に向かった側）から見た図である。図４は、図３（ａ）のＡ−Ａの位置における側面図である。図４は断面のみでなく側面図であるため、断面の先に見られるねじ４ａ〜４ｃなどが図中に示されている。   FIG. 1 is an external perspective view of the imaging apparatus according to the present embodiment as viewed from the front side (subject side). FIG. 2 is an exploded perspective view of the imaging apparatus according to the present embodiment as viewed from the front side. 3A and 3B are three views of the imaging apparatus of the present embodiment, in which FIG. 3A is a view seen from the front side, FIG. 3B is a view seen from the top side, and FIG. It is the figure seen from (the side which went to the to-be-photographed object from the board | substrate side). FIG. 4 is a side view at the position AA in FIG. Since FIG. 4 is a side view as well as a cross section, the screws 4a to 4c and the like seen at the end of the cross section are shown in the drawing.

図１〜図４（特に図２）に示されるように、本実施形態の撮像装置は、基板１、レンズ部２、及びベース部材３を含んで構成される。ベース部材３の開口部に挿入されたレンズ部２は、ねじ結合または接着剤などでベース部材３に連結されている。ベース部材３は、ねじ４ａ〜４ｃなどによって基板１と連結され固定されている。   As shown in FIGS. 1 to 4 (particularly FIG. 2), the imaging apparatus according to this embodiment includes a substrate 1, a lens unit 2, and a base member 3. The lens part 2 inserted into the opening of the base member 3 is connected to the base member 3 by screw connection or an adhesive. The base member 3 is connected and fixed to the substrate 1 with screws 4a to 4c and the like.

＜基板１＞
基板１は、特に図２に示されるように、センサ１１、発熱部材１２、及び各種電子部品を搭載したプリント基板であって、ベース部材３と連結される。 <Substrate 1>
As shown in FIG. 2 in particular, the board 1 is a printed board on which the sensor 11, the heat generating member 12, and various electronic components are mounted, and is connected to the base member 3.

センサ１１は、レンズ部２のレンズを透過した光を受光し、電気信号に変換して出力する光電変換機能を有するＣＭＯＳまたはＣＣＤなどの撮像素子である。センサ１１から出力された撮像信号は、基板１に搭載された電子部品及び／または発熱部材１２に入力され処理される。   The sensor 11 is an image sensor such as a CMOS or a CCD having a photoelectric conversion function that receives light transmitted through the lens of the lens unit 2, converts the light into an electric signal, and outputs the electric signal. The imaging signal output from the sensor 11 is input to the electronic component and / or the heat generating member 12 mounted on the substrate 1 and processed.

発熱部材１２は、例えばセンサ１１から出力された撮像信号を処理するＩＳＰ（Ｉｍａｇｅ Ｓｉｇｎａｌ Ｐｒｏｃｅｓｓｏｒ）などの画像処理装置であって、例えばＤＳＰやＡＳＩＣなどの半導体装置である。従来のセンサでは、ＩＳＰはセンサと一体的に構成されたものが一般的であったが、放熱の必要性などから近年はセンサとは別の構成とされることが多くなってきている。このようなＩＳＰでは、処理負荷の高い画像処理を行うため、基板１に搭載された電子部品の中で特に発熱性が高くなっている。なお、この発熱部材１２は必ずしもＩＳＰである必要はなく、放熱の必要性の高い素子を選択する。また、発熱部材１２は必ずしも１つの部材に限定されるものではなく、複数の部材を対象としてもよい。   The heat generating member 12 is an image processing device such as an ISP (Image Signal Processor) that processes an imaging signal output from the sensor 11, for example, and is a semiconductor device such as a DSP or an ASIC. In the conventional sensor, the ISP is generally configured integrally with the sensor. However, in recent years, the ISP is often configured differently from the sensor because of the necessity of heat dissipation. In such an ISP, image processing with a high processing load is performed, so that heat generation is particularly high among electronic components mounted on the substrate 1. The heat generating member 12 is not necessarily an ISP, and an element having a high need for heat dissipation is selected. Further, the heat generating member 12 is not necessarily limited to one member, and a plurality of members may be targeted.

発熱部材１２は基板１に半田等で固定されており、その上（基板１とは反対の面）には放熱緩衝材１３が搭載されている。放熱緩衝材１３は、高い熱伝導性と弾性とを有する素材で、例えば略矩形の板状に形成されており、その一面は発熱部材に接し、他面はベース部材３に弾性的に密着している（特に図４の断面図参照）。放熱緩衝材１３の両面は、発熱部材１２の前面を覆うような面積及び形状で形成されている。放熱緩衝材１３は、一般的な放熱シートまたは放熱グリスなどが用いられる。   The heat generating member 12 is fixed to the substrate 1 with solder or the like, and a heat dissipation buffer 13 is mounted thereon (on the surface opposite to the substrate 1). The heat dissipation buffer 13 is a material having high thermal conductivity and elasticity, and is formed, for example, in a substantially rectangular plate shape. One surface thereof is in contact with the heat generating member, and the other surface is in close contact with the base member 3 elastically. (See particularly the cross-sectional view of FIG. 4). Both surfaces of the heat dissipation buffer 13 are formed in an area and shape so as to cover the front surface of the heat generating member 12. As the heat dissipation buffer 13, a general heat dissipation sheet or heat dissipation grease is used.

＜レンズ部２＞
レンズ部２は、一または複数（一般的には複数）のレンズを含み、これらのレンズを支持するよう円筒状に形成されており、ベース部材３とねじ結合（螺合）などで連結されている。レンズ部２に含まれるレンズは、被写体からの入射光を屈折しながらセンサ１１に向かって導光していく。 <Lens part 2>
The lens unit 2 includes one or a plurality of (generally a plurality of) lenses, is formed in a cylindrical shape to support these lenses, and is connected to the base member 3 by screw connection (screwing) or the like. Yes. The lens included in the lens unit 2 guides the incident light from the subject toward the sensor 11 while refracting the incident light.

＜ベース部材３＞
ベース部材３は、アルミニウムなどの高い熱伝導性と剛性とを有する金属素材で形成されており、円形に形成された開口部にレンズ部２を支持するよう構成されている。ベース部材３は、ねじ４ａ〜４ｃなどで基板１と連結されている。ベース部材３の基板１と対向する面の一部は、放熱緩衝材１３と接触している（図４参照）。ベース部材３の被写体側の面には、図１〜図４に示されるように凹凸３１が形成されている。この凹凸３１の底部を基準に考えると、この凹凸３１によりリブ形状が形成されるということもできる。本実施形態では、このように凹凸が形成されつつ、補強のための壁に類似した形状を有する構造をリブ形状と呼んでいる。このような凹凸３１によるリブ形状が形成されることで、リブ形状が形成されない見かけ表面積に対して、外気に接する表面積が広くなっている。特に放熱の必要性の高い、発熱部材１２の表面領域（発熱部材１２が放熱緩衝材１３を介してベース部材３に接触する領域、及びその近傍領域）に対応する部分では、表面積が見かけ表面積の２〜３倍になるように、リブ形状が形成されている。ベース部材３にリブ形状が形成されることで、外気と接する表面積が広くなるとともに、必要となる素材の量が減少しつつも、必要な強度が確保されている。 <Base member 3>
The base member 3 is formed of a metal material having high thermal conductivity and rigidity, such as aluminum, and is configured to support the lens unit 2 in a circular opening. The base member 3 is connected to the substrate 1 with screws 4a to 4c and the like. A part of the surface of the base member 3 facing the substrate 1 is in contact with the heat dissipation buffer 13 (see FIG. 4). Concavities and convexities 31 are formed on the subject-side surface of the base member 3 as shown in FIGS. Considering the bottom of the irregularities 31 as a reference, it can be said that the irregularities 31 form a rib shape. In the present embodiment, a structure having a shape similar to a wall for reinforcement while the unevenness is formed is called a rib shape. By forming the rib shape by such irregularities 31, the surface area in contact with the outside air is wider than the apparent surface area where the rib shape is not formed. In particular, in the portion corresponding to the surface area of the heat generating member 12 (the area where the heat generating member 12 contacts the base member 3 via the heat radiating buffer 13 and the vicinity thereof) where the necessity of heat dissipation is high, the surface area is the apparent surface area. The rib shape is formed to be 2 to 3 times. By forming the rib shape on the base member 3, the surface area in contact with the outside air is widened, and the necessary strength is ensured while the amount of the necessary material is reduced.

なお、本特許請求の範囲記載の「（ベース部材における）発熱部材との接触領域」とは、（１）発熱部材１２が（場合により、放熱緩衝材１３を介して）ベース部材に接触する領域、又は（２）発熱部材１２が（場合により、放熱緩衝材１３を介して）ベース部材に接触する領域及びその接触する領域の近傍領域、をいう。   In addition, the “contact region with the heat generating member (in the base member)” described in the claims means (1) a region in which the heat generating member 12 is in contact with the base member (possibly through the heat dissipation buffer member 13). Or (2) An area in which the heat generating member 12 contacts the base member (possibly via the heat dissipation buffer 13) and an area in the vicinity of the contact area.

このように、本実施形態の撮像装置では、基板１に搭載された発熱部材１２の上に放熱緩衝材１３を配置してベース部材３に接触させ、発熱部材１２の熱を、放熱緩衝材１３を介してベース部材３に伝導させて、広い表面積を有するベース部材３から放熱する構成としている。これによって、発熱部材１２から発せられた熱を、効率的に放熱することができる。また、ベース部材３に形成されたリブ形状が放熱フィンのように機能し、効率的に放熱を行うことが可能となる。さらに、ベース部材３にリブ形状が形成されることで、撮像装置の小型軽量化が可能になるとともに、ベース部材３の成形時間を短くし、材料費を削減することなどが可能となる。   As described above, in the imaging apparatus according to the present embodiment, the heat dissipation buffer member 13 is disposed on the heat generating member 12 mounted on the substrate 1 and brought into contact with the base member 3, and the heat of the heat generating member 12 is converted to the heat dissipation buffer member 13. The heat is conducted to the base member 3 through the base member 3 to dissipate heat from the base member 3 having a large surface area. Thereby, the heat generated from the heat generating member 12 can be efficiently radiated. Moreover, the rib shape formed in the base member 3 functions like a heat radiating fin, and heat can be efficiently radiated. Furthermore, since the rib shape is formed on the base member 3, it is possible to reduce the size and weight of the imaging apparatus, shorten the molding time of the base member 3, and reduce the material cost.

また、ベース部材３に形成された凹凸３１によるリブ形状は、リブ形状が形成されていないときの見かけ表面積に対して２〜３倍の表面積を有している。これによって、ベース部材３の所望の強度を保ちつつ、より効果的に発熱部材１２の熱を放熱することが可能となる。   Moreover, the rib shape by the unevenness | corrugation 31 formed in the base member 3 has a surface area of 2 to 3 times with respect to the apparent surface area when the rib shape is not formed. As a result, the heat of the heat generating member 12 can be radiated more effectively while maintaining the desired strength of the base member 3.

＜２．補足事項＞
以上、本発明の実施形態についての具体的な説明を行った。上記説明では、あくまで一実施形態としての説明であって、本発明の範囲はこの一実施形態に留まらず、当業者が把握可能な範囲にまで広く解釈されるものである。 <2. Supplementary items>
The specific description of the embodiment of the present invention has been given above. In the above description, the description is merely an embodiment, and the scope of the present invention is not limited to this embodiment, but is broadly interpreted to the extent that a person skilled in the art can grasp.

例えば、上記実施形態の撮像装置では、ベース部材３に形成されたリブ形状は、見かけ面積に対して２〜３倍の表面積を有するよう形成されていたが、この面積は見かけ表面積の２倍より狭くなっていても一定の効果を得ることができる。   For example, in the imaging device of the above embodiment, the rib shape formed on the base member 3 is formed to have a surface area of 2 to 3 times the apparent area, but this area is more than twice the apparent surface area. Even if it becomes narrow, a certain effect can be obtained.

また、上記実施形態の撮像装置では、ベース部材３はアルミニウムで形成されていたが、必ずしもアルミニウムに限定されるものではなく、熱伝導性に優れた他の材料を採用してもよい。また、ベース部材３のうち、発熱部材１２が配置された領域の周辺部分のみがアルミニウムなどの熱伝導性に優れる材料で形成され、その他の部分は別の熱伝導性に劣る材料で形成されていてもよい。   In the imaging device of the above embodiment, the base member 3 is made of aluminum. However, the base member 3 is not necessarily limited to aluminum, and other materials having excellent thermal conductivity may be adopted. Of the base member 3, only the peripheral portion of the region where the heat generating member 12 is disposed is formed of a material having excellent thermal conductivity such as aluminum, and the other portion is formed of another material having inferior thermal conductivity. May be.

また、上記実施形態の撮像装置におけるベース部材３にはリブ形状の凹凸３１が形成されていたが、リブ形状ではない凹凸、または放熱フィン形状に形成されていても、一定の放熱効果を得ることができる。   In addition, the base member 3 in the imaging device of the above embodiment has the rib-shaped unevenness 31, but a certain heat dissipation effect can be obtained even if the rib-shaped unevenness or the heat dissipation fin shape is formed. Can do.

本発明は、高温下での使用されることがある車載カメラなどとして特に効果的に利用される。   The present invention is particularly effectively used as a vehicle-mounted camera that may be used at high temperatures.

１…基板
１１…センサ
１２…発熱部材
１３…放熱緩衝材
２…レンズ部
３…ベース部材
４ａ〜４ｃ…ねじ DESCRIPTION OF SYMBOLS 1 ... Board | substrate 11 ... Sensor 12 ... Heat-generating member 13 ... Radiation buffer material 2 ... Lens part 3 ... Base members 4a-4c ... Screw

Claims (3)

レンズを保持するレンズ部と、
前記レンズ部を支持するベース部材と、
前記レンズを通過した入射光を受光するセンサ及び発熱部材を搭載した基板と、を備え、
前記発熱部材は、熱伝導性を有する放熱部材を介して前記ベース部材に接触しており、
前記ベース部材は、前記発熱部材との接触領域の被写体側の表面積が見かけの表面積よりも広くなるような凹凸が形成されている、
撮像装置。 A lens unit for holding the lens;
A base member that supports the lens unit;
A sensor on which incident light that has passed through the lens is received and a substrate on which a heating member is mounted,
The heat generating member is in contact with the base member through a heat radiating member having thermal conductivity,
The base member is formed with irregularities such that the surface area on the subject side of the contact area with the heat generating member is larger than the apparent surface area.
Imaging device. 前記ベース部材に形成された前記凹凸は、前記発熱部材との前記接触領域の被写体側の表面積が、見かけの表面積の２倍以上の面積になっている、
請求項１に記載の撮像装置。 The unevenness formed on the base member has a surface area on the subject side of the contact area with the heat generating member that is at least twice the apparent surface area.
The imaging device according to claim 1. 前記ベース部の凹凸がリブ形状を形成している、
請求項１または請求項２に記載の撮像装置。 The unevenness of the base part forms a rib shape,
The imaging device according to claim 1 or 2.
JP2016087575A 2016-04-25 2016-04-25 Imaging apparatus Pending JP2017198754A (en)

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