JP2017126556A - 照明パネルのための埋め込み照明機能 - Google Patents
照明パネルのための埋め込み照明機能 Download PDFInfo
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- 239000000758 substrate Substances 0.000 claims abstract description 72
- 238000000034 method Methods 0.000 claims abstract description 58
- 239000002131 composite material Substances 0.000 claims abstract description 56
- 229920000642 polymer Polymers 0.000 claims abstract description 56
- 238000004519 manufacturing process Methods 0.000 claims abstract description 44
- 239000004593 Epoxy Substances 0.000 claims description 4
- 229920006254 polymer film Polymers 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 4
- 230000003252 repetitive effect Effects 0.000 abstract description 2
- 230000006378 damage Effects 0.000 abstract 1
- 230000008569 process Effects 0.000 description 18
- 229920002620 polyvinyl fluoride Polymers 0.000 description 14
- 239000000463 material Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000007943 implant Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 208000031074 Reinjury Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 208000032140 Sleepiness Diseases 0.000 description 1
- 206010041349 Somnolence Diseases 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000004397 blinking Effects 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000003562 lightweight material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000007591 painting process Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001692 polycarbonate urethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000009420 retrofitting Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000037321 sleepiness Effects 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
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- B60Q3/00—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors
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- B60Q3/47—Circuits; Control arrangements
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- B60Q3/00—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors
- B60Q3/50—Mounting arrangements
- B60Q3/51—Mounting arrangements for mounting lighting devices onto vehicle interior, e.g. onto ceiling or floor
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- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
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Abstract
【解決手段】照明パネル及び照明パネルの製造方法であって、照明パネルは、平面を有する基板200、基板の平面に印刷された導電性配線並びに導電性配線が選択された導電性配線と関連する光源との間に電気的な相互接続を形成するように、装着位置210、212で導電性配線の上に装着された光源206、208を含む。照明パネルはまた、光源の上に提供されるポリマーシート220並びに印刷された導電性配線を有する基板、光源及びポリマーシートのスタックアップが適用される複合材ベース222を含む。光源は複合材ベースの中に埋め込まれ、スタックアップの上面と同一平面上に収まり、基板はまた、装着位置で光源の下の複合材ベースに埋め込まれる。
【選択図】図5
Description
Claims (10)
- 平面(202)を有する基板(200)と、
前記基板(200)の前記平面(202)上に印刷された複数の導電性配線(204)と、
前記複数の導電性配線(204)が、前記複数の導電性配線(204)の中の選択された導電性配線と複数の光源(206、208)の中の関連する光源との間に電気的な相互接続を形成するように、装着位置(210、212)で前記基板(200)の前記平面(202)上の前記複数の導電性配線(204)上に装着された複数の光源(206、208)と、
前記複数の光源(206、208)上に提供されるポリマーシート(220)と、
前記印刷された複数の導電性配線(104)を有する前記基板(200)、前記平面(202)上に装着された前記複数の光源(206、208)、及び前記ポリマーシート(220)のスタックアップ(224)が適用される複合材ベース(222)と
を備える照明パネル(234)であって、前記複数の光源(206、208)は前記複合材ベース(222)に埋め込まれ、前記スタックアップ(224)の上面と同一平面上に収まり、前記基板(200)はまた、前記装着位置(210、212)で前記複数の光源の下の前記複合材ベース(222)に埋め込まれている照明パネル(234)。 - 前記基板(200)はポリマーフィルムを含む、請求項1に記載の照明パネル(234)。
- 前記複数の導電性配線(204)は回路群を含み、前記複数の光源(206、208)は前記回路群を形成するように前記複数の導電性配線(204)の上に装着される、請求項1又は2に記載の照明パネル(234)。
- 前記複数の光源(206、208)は前記ポリマーシート(220)に接触し、前記ポリマーシート(220)を通して光を照らす、請求項1から3のいずれか一項に記載の照明パネル(234)。
- 前記ポリマーシート(220)の上に適用される装飾フィルム(232)を更に含む、請求項1から4のいずれか一項に記載の照明パネル(234)。
- 前記照明パネル(234)は航空機構造用天井パネルを含む、請求項1から5のいずれか一項に記載の照明パネル(234)。
- 照明パネル(234)を製造する方法であって、
基板(200)の平面(202)上に複数の導電性配線(204)を印刷すること(302)と、
前記複数の導電性配線(204)が、前記複数の導電性配線(204)の中の選択された導電性配線と複数の光源(206、208)の中の関連する光源との間に電気的な相互接続を形成するように、装着位置で前記基板(200)の前記平面(202)上の前記複数の導電性配線(204)上に前記複数の光源(206、208)を装着すること(304)と、
前記複数の光源(206、208)上にポリマーシート(220)を提供すること(306)と、
前記印刷された複数の導電性配線(204)を有する前記基板(200)、前記平面(202)上に装着された前記複数の光源(206、208)、及び前記ポリマーシート(220)のスタックアップ(224)を複合材ベース(222)上に提供すること(308)と、
前記スタックアップ(224)の上面と同一平面上に収まるように前記複合材ベース(222)の中へ前記複数の光源(206、208)を埋め込み、前記装着位置で前記複数の光源(206、208)の下の前記複合材ベース(222)に前記基板(200)を埋め込むため、前記スタックアップ(224)と前記複合材ベース(222)に圧力と熱を加えること(310)と
を含む方法。 - 装着位置で前記基板(200)の前記平面(202)上の前記複数の導電性配線(204)上に前記複数の光源(206、208)を装着すること(304)は、前記複数の光源(206、208)を装着するため導電性エポキシを使用することを含む、請求項7に記載の方法。
- 前記複数の導電性配線(204)は回路群を含み、前記複数の光源(206、208)は前記回路群を形成するように前記複数の導電性配線(204)の上に装着される、請求項7又は8に記載の方法。
- 前記複数の光源(206、208)の上に前記ポリマーシート(220)を提供することは、前記複数の光源(206、208)を覆うことを含む、請求項7から9のいずれか一項に記載の方法。
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