JP2017123418A - Illumination device - Google Patents

Illumination device Download PDF

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JP2017123418A
JP2017123418A JP2016002470A JP2016002470A JP2017123418A JP 2017123418 A JP2017123418 A JP 2017123418A JP 2016002470 A JP2016002470 A JP 2016002470A JP 2016002470 A JP2016002470 A JP 2016002470A JP 2017123418 A JP2017123418 A JP 2017123418A
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mounting hole
substrate
inner peripheral
peripheral wall
wall surface
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暁子 木村
Akiko Kimura
暁子 木村
志幸 田中
Yukisachi Tanaka
志幸 田中
陽祐 土屋
Yosuke Tsuchiya
陽祐 土屋
俊晶 森
Toshiaki Mori
俊晶 森
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Toyoda Gosei Co Ltd
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Toyoda Gosei Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide an illumination device capable of preventing deterioration of the strength of a substrate while enhancing the light extraction efficiency.SOLUTION: An LED chip 11 is mounted face down on the surface of a package 12. A fitting hole 13c is formed through a substrate 13 to be larger than the dimension in plan view of the LED chip 11, and the inner peripheral wall surface of the fitting hole 13c is perpendicular to the front and back surfaces of the fitting hole 13c. A package 12 is fixedly fitted and mounted on the back surface side of the substrate 13, and the LED chip 11 is inserted into the fitting hole 13c so that a gap is formed between the LED chip 11 and the inner peripheral wall surface of the fitting hole 13c. Wiring layers 12a and 12b of the package 12 are connected to wiring layers 13a and 13b of the substrate 13, respectively. The inner peripheral wall surface of the fitting hole 13c of the substrate 13 has higher light reflectivity than the surface as the basis material of the substrate 13.SELECTED DRAWING: Figure 1

Description

本発明は照明装置に関するものである。   The present invention relates to a lighting device.

特許文献１には、複数の貫通開口と第１面および第２面とを有する配線板と、前記配線板に配置された複数の接触パッドと、前記複数の貫通開口の１つずつの中に拘束可能にそれぞれ連結され且つ前記第１面を越えて延びる第３面と前記第２面を通して露出された第４面とを有する複数のＬＥＤ（Light Emitting Diode）と、前記複数のＬＥＤの各々から前記複数の接触パッドの少なくとも１つまで延びる少なくとも１つの電気導線と、前記複数のＬＥＤの各々の前記第３面に熱的に連結された吸熱部とを備えた電気光学配列が開示されている。   In Patent Document 1, a wiring board having a plurality of through-openings and a first surface and a second surface, a plurality of contact pads arranged on the wiring board, and one each of the plurality of through-openings. A plurality of LEDs (Light Emitting Diodes) each having a third surface that is connected so as to be constrained and that extends beyond the first surface and a fourth surface exposed through the second surface; and each of the plurality of LEDs An electro-optic arrangement is disclosed that includes at least one electrical lead extending to at least one of the plurality of contact pads and a heat absorbing portion thermally coupled to the third surface of each of the plurality of LEDs. .

特許文献２には、所要の導電パターン及び半導体装置取付孔を有するテープ状のフレキシブル配線基板と、前記フレキシブル配線基板に取り付けられて前記導電パターンと接続される複数の半導体装置とからなる半導体モジュールであって、前記半導体装置は、所要の配線パターンを有するシリコンサブマウント素子と、当該シリコンサブマウント素子上に実装されて前記半導体装置取付孔に挿入された１乃至複数個の発光ダイオードとからなり、前記シリコンサブマウント素子のうち、前記発光ダイオードが実装された面が前記フレキシブル配線基板の一方の面に対向して配置され、前記発光ダイオードが前記半導体装置取付孔を介して、前記フレキシブルプリント配線基板の他方の面よりも突出するように配設されている半導体モジュールが開示されている。   Patent Document 2 discloses a semiconductor module comprising a tape-like flexible wiring board having a required conductive pattern and a semiconductor device mounting hole, and a plurality of semiconductor devices attached to the flexible wiring board and connected to the conductive pattern. The semiconductor device comprises a silicon submount element having a required wiring pattern, and one or more light emitting diodes mounted on the silicon submount element and inserted into the semiconductor device mounting hole. Of the silicon submount element, the surface on which the light emitting diode is mounted is disposed so as to face one surface of the flexible wiring board, and the light emitting diode passes through the semiconductor device mounting hole and the flexible printed wiring board. Semiconductor module arranged so as to protrude from the other surface of There has been disclosed.

また、特許文献２には、発光ダイオードから放射された光をシリコンサブマウント素子の法線方向に効率よく照射するため、シリコンサブマウント素子における発光ダイオードの周辺部分にミラー構造体を配置する技術が開示されている。
そして、特許文献２には、光反射率の高い金属材料又は表面に光反射率の高い金属材料からなる反射層が形成されたプラスチック成形体によりミラー構造体を形成することと、所要の接着剤によりミラー構造体を発光ダイオードの周辺部分に取り付けることと、ミラー構造体の反射面の形状を斜面形状または凹状の曲面形状にすることとが記載されている。 Further, Patent Document 2 discloses a technique for disposing a mirror structure around the light emitting diode in the silicon submount element in order to efficiently irradiate the light emitted from the light emitting diode in the normal direction of the silicon submount element. It is disclosed.
Patent Document 2 discloses that a mirror structure is formed from a plastic material in which a reflective layer made of a metal material having a high light reflectivity or a metal material having a high light reflectivity is formed on the surface, and a required adhesive. Describes that the mirror structure is attached to the peripheral portion of the light emitting diode, and that the shape of the reflection surface of the mirror structure is an inclined surface shape or a concave curved surface shape.

特表２００７−５００４４８号公報Special Table 2007-500448 特開２００７−１２９１８８号公報JP 2007-129188 A

特許文献１，２に例示したように、従来より、発光素子が実装されたパッケージと、取付孔が貫通形成された基板とを備え、前記パッケージは前記基板の背面側に取付固定されて実装され、前記発光素子は前記取付孔に挿入されている照明装置が知られている。
このような照明装置は、パッケージが基板の背面（裏面）側に実装されているため、背面（裏面）実装型と呼ばれている。 As exemplified in Patent Documents 1 and 2, conventionally, a package including a light emitting element mounted thereon and a substrate through which an attachment hole is formed is mounted, and the package is mounted and fixed on the back side of the substrate. A lighting device in which the light emitting element is inserted into the mounting hole is known.
Such a lighting device is called a back (back) mounting type because the package is mounted on the back (back) side of the substrate.

背面実装型の照明装置では、発光素子の放射光が基板の取付孔により遮断されるため、発光素子の放射光を照明装置から取り出す光取り出し効率が悪いという問題がある。
そこで、特許文献２の技術では、シリコンサブマウント素子における発光ダイオードの周辺部分にミラー構造体を配置しているが、ミラー構造体を半導体装置取付孔に挿入するため、半導体装置取付孔が大きくなり、フレキシブル配線基板の強度が低下するという問題がある。 In the back-mounting type lighting device, since the emitted light of the light emitting element is blocked by the mounting hole of the substrate, there is a problem that the light extraction efficiency for extracting the emitted light of the light emitting element from the lighting device is poor.
Therefore, in the technique of Patent Document 2, the mirror structure is disposed in the peripheral portion of the light emitting diode in the silicon submount element. However, since the mirror structure is inserted into the semiconductor device mounting hole, the semiconductor device mounting hole becomes large. There exists a problem that the intensity | strength of a flexible wiring board falls.

本発明は前記問題を解決するためになされたものであって、その目的は、光取り出し効率を向上させることが可能な照明装置を提供することにある。
また、本発明の別の目的は、光取り出し効率を向上させた上で、基板の強度低下を防止することが可能な照明装置を提供することにある。 The present invention has been made to solve the above problems, and an object of the present invention is to provide an illumination device capable of improving light extraction efficiency.
Another object of the present invention is to provide an illuminating device that can prevent a reduction in strength of a substrate while improving light extraction efficiency.

本発明者らは前記課題を解決するために鋭意検討を重ねた結果、下記のように本発明の各局面に想到した。   As a result of intensive studies in order to solve the above-mentioned problems, the present inventors have arrived at each aspect of the present invention as follows.

＜第１局面＞
第１局面は、
発光素子と
前記発光素子が実装されたパッケージと、
取付孔が貫通形成された基板とを備え、
前記パッケージは前記基板の背面側に取付固定されて実装され、前記発光素子は前記取付孔に挿入されており、
前記取付孔の内周壁面は、前記基板の表面よりも光反射性が高い照明装置である。 <First phase>
The first aspect is
A light emitting element and a package on which the light emitting element is mounted;
A substrate having a mounting hole formed therethrough,
The package is mounted and fixed on the back side of the substrate, and the light emitting element is inserted into the mounting hole.
The inner peripheral wall surface of the mounting hole is a lighting device having higher light reflectivity than the surface of the substrate.

第１局面では、基板の取付孔の内周壁面の光反射性が高いため、取付孔の内周壁面が、発光素子の放射光を発光素子の前方向へ反射するリフレクタとして機能し、発光素子の放射光が取付孔により遮断され難くなることから、発光素子の放射光を照明装置から取り出す光取り出し効率を向上させることができる。
また、特許文献２の前記構成（シリコンサブマウント素子における発光ダイオードの周辺部分にミラー構造体を配置）に比べて、第１局面では、「ミラー構造体」を備えない分だけ、取付孔を小さくすることが可能であるため、取付孔が大きくなることによる基板の強度低下を防止することができる。 In the first aspect, since the light reflectivity of the inner peripheral wall surface of the mounting hole of the substrate is high, the inner peripheral wall surface of the mounting hole functions as a reflector that reflects the emitted light of the light emitting element in the forward direction of the light emitting element. Therefore, the light extraction efficiency of taking out the radiated light of the light emitting element from the lighting device can be improved.
Further, compared to the configuration of Patent Document 2 (a mirror structure is disposed in the peripheral portion of the light emitting diode in the silicon submount element), in the first aspect, the mounting hole is made smaller by the amount not provided with the “mirror structure”. Therefore, it is possible to prevent a reduction in the strength of the substrate due to an increase in the mounting hole.

＜第２局面＞
第２局面は、第１局面において、前記取付孔の内周壁面の少なくとも一部分を覆うように形成された光反射膜を備える。
第２局面では、光反射膜を設けることにより、取付孔の内周壁面の光反射性を高めることが可能であるため、第１局面の前記作用・効果を更に確実に得ることができる。 <Second phase>
In a first aspect, a second aspect includes a light reflecting film formed so as to cover at least a part of the inner peripheral wall surface of the mounting hole.
In the second aspect, by providing the light reflecting film, it is possible to improve the light reflectivity of the inner peripheral wall surface of the mounting hole, and thus the above-mentioned action and effect of the first aspect can be obtained more reliably.

＜第３局面＞
第３局面は、第１局面または第２局面において、前記取付孔の内周壁面が、当該取付孔の開口部に向かって当該取付孔の横断面積が広がるように傾斜した傾斜面に形成されている。
第３局面では、基板の取付孔の内周壁面を傾斜面にすることにより、取付孔の内周壁面のリフレクタ機能を高めることが可能であるため、第１局面の前記作用・効果を更に確実に得ることができる。 <Third phase>
According to a third aspect, in the first aspect or the second aspect, an inner peripheral wall surface of the mounting hole is formed on an inclined surface that is inclined so that a cross-sectional area of the mounting hole widens toward an opening of the mounting hole. Yes.
In the third aspect, since the reflector function of the inner peripheral wall surface of the mounting hole can be enhanced by making the inner peripheral wall surface of the mounting hole of the substrate into an inclined surface, the operation and effect of the first aspect are further ensured. Can get to.

＜第４局面＞
第４局面は、第１局面または第２局面において、
前記取付孔に取付固定された第１光反射部材を備え、
前記第１光反射部材の内周壁面が、前記取付孔の内周壁面になっていると共に、前記取付孔の開口部に向かって前記取付孔の横断面積が広がるように傾斜した傾斜面に形成されている。 <4th phase>
The fourth aspect is the first aspect or the second aspect,
A first light reflecting member fixedly mounted in the mounting hole;
An inner peripheral wall surface of the first light reflecting member is an inner peripheral wall surface of the mounting hole, and is formed on an inclined surface inclined so that a cross-sectional area of the mounting hole is widened toward the opening of the mounting hole. Has been.

第４局面では、第１光反射部材を設けることにより、取付孔の内周壁面の光反射性を高めることが可能であるため、第１局面の前記作用・効果を更に確実に得ることができる。   In the fourth aspect, by providing the first light reflecting member, it is possible to enhance the light reflectivity of the inner peripheral wall surface of the mounting hole, and thus the above-mentioned operation and effect of the first aspect can be obtained more reliably. .

＜第５局面＞
第５局面は、第１〜第４局面において、前記取付孔の少なくとも一部分を囲むように配置形成され、前記基板の表面上に取付固定された第２光反射部材を備える。 <5th aspect>
In a first to fourth aspect, a fifth aspect includes a second light reflecting member that is disposed and formed so as to surround at least a part of the mounting hole and is fixedly mounted on the surface of the substrate.

第５局面では、第２光反射部材が、発光素子の放射光を発光素子の前方向へ反射するリフレクタとして機能するため、照明装置の光取り出し効率を更に向上させることができる。
また、特許文献２の前記構成に比べて、第５局面では、第２光反射部材を基板の表面上に取付固定することにより、取付孔を小さくすることが可能であるため、取付孔が大きくなることによる基板の強度低下を防止することができる。 In the fifth aspect, since the second light reflecting member functions as a reflector that reflects the emitted light of the light emitting element in the forward direction of the light emitting element, the light extraction efficiency of the illumination device can be further improved.
Compared to the configuration of Patent Document 2, in the fifth aspect, the mounting hole can be made smaller by mounting and fixing the second light reflecting member on the surface of the substrate. Accordingly, it is possible to prevent a decrease in the strength of the substrate.

本発明を具体化した第１実施形態の照明装置１０の縦断面の端面図（図２に示すＸ−Ｘ矢示断面の端面図）。The end view (end view of the XX arrow section shown in Drawing 2) of the longitudinal section of lighting installation 10 of the 1st embodiment which materialized the present invention. 第１実施形態の照明装置１０の上面図。The top view of the illuminating device 10 of 1st Embodiment. 本発明を具体化した第２実施形態の照明装置２０の縦断面の端面図（図４に示すＸ−Ｘ矢示断面の端面図）。The end view of the longitudinal section of the illuminating device 20 of 2nd Embodiment which actualized this invention (end view of the XX arrow cross section shown in FIG. 4). 第２実施形態の照明装置２０の上面図。The top view of the illuminating device 20 of 2nd Embodiment. 本発明を具体化した第３実施形態の照明装置３０の縦断面の端面図（図６に示すＸ−Ｘ矢示断面の端面図）。The end view of the longitudinal section of the illuminating device 30 of 3rd Embodiment which actualized this invention (end view of the XX arrow cross section shown in FIG. 6). 第３実施形態の照明装置３０の上面図。The top view of the illuminating device 30 of 3rd Embodiment. 本発明を具体化した第４実施形態の照明装置４０の縦断面の端面図（図８に示すＸ−Ｘ矢示断面の端面図）。The end view of the longitudinal section of the illuminating device 40 of 4th Embodiment which actualized this invention (end view of the XX arrow cross section shown in FIG. 8). 第４実施形態の照明装置４０の上面図。The top view of the illuminating device 40 of 4th Embodiment. 本発明を具体化した第５実施形態の照明装置５０の縦断面の端面図（図１０に示すＸ−Ｘ矢示断面の端面図）。The end view of the longitudinal section of the illuminating device 50 of 5th Embodiment which actualized this invention (end view of the XX arrow cross section shown in FIG. 10). 第５実施形態の照明装置５０の上面図。The top view of the illuminating device 50 of 5th Embodiment.

以下、本発明を具体化した各実施形態について図面を参照しながら説明する。尚、各実施形態において、同一の構成部材および構成要素については符号を等しくすると共に、同一内容の箇所については重複説明を省略する。
また、各図面では、説明を分かり易くするために、各実施形態の構成部材の寸法形状および配置箇所を誇張して模式的に図示してあり、各構成部材の寸法形状および配置箇所が実物とは必ずしも一致しないことがある。 Hereinafter, embodiments embodying the present invention will be described with reference to the drawings. In each embodiment, the same constituent members and constituent elements are denoted by the same reference numerals, and redundant description of the same contents is omitted.
Moreover, in each drawing, in order to make the explanation easy to understand, the dimensional shape and arrangement location of the constituent members of each embodiment are schematically illustrated in an exaggerated manner, and the dimensional shape and arrangement location of each constituent member are the real thing. May not always match.

＜第１実施形態＞
図１および図２に示すように、第１実施形態の照明装置１０は、ＬＥＤチップ１１（アノード電極１１ａ、カソード電極１１ｂ）、パッケージ１２（配線層１２ａ，１２ｂ）、基板１３（配線層１３ａ，１３ｂ、取付孔１３ｃ）、封止部１４などを備える。 <First Embodiment>
As shown in FIGS. 1 and 2, the illumination device 10 of the first embodiment includes an LED chip 11 (anode electrode 11a and cathode electrode 11b), a package 12 (wiring layers 12a and 12b), a substrate 13 (wiring layers 13a, 13b, mounting hole 13c), sealing portion 14 and the like.

ＬＥＤチップ１１は長尺略直方体状であり、ＬＥＤチップ１１の裏面には長尺方向の両端部近傍にアノード電極１１ａおよびカソード電極１１ｂが形成されている。
パッケージ（サブマウント）１２は平板矩形状であり、パッケージ１２の表面には配線層１２ａ，１２ｂが形成されている。
パッケージ１２は十分な強度および絶縁性を有し、その形成材料には、例えば、シリコン、セラミックス（例えば、酸化アルミニウム、窒化アルミニウムなど）、ガラスエポキシ、ポリイミドなどがある。形成材料にシリコンを用いた場合、パッケージ１２は「シリコンサブマウント」とも呼ばれる。
ＬＥＤチップ１１はパッケージ１２の表面にフェイスダウン実装され、ＬＥＤチップ１１の各電極１１ａ，１１ｂはそれぞれ、パッケージ１２の各配線層１２ａ，１２ｂにフリップチップ接続（フリップチップボンディング）されている。 The LED chip 11 has a long and substantially rectangular parallelepiped shape, and an anode electrode 11a and a cathode electrode 11b are formed on the back surface of the LED chip 11 in the vicinity of both ends in the longitudinal direction.
The package (submount) 12 has a flat rectangular shape, and wiring layers 12 a and 12 b are formed on the surface of the package 12.
The package 12 has sufficient strength and insulation, and examples of the forming material include silicon, ceramics (for example, aluminum oxide, aluminum nitride, etc.), glass epoxy, polyimide, and the like. When silicon is used as the forming material, the package 12 is also referred to as a “silicon submount”.
The LED chip 11 is mounted face-down on the surface of the package 12, and the electrodes 11a and 11b of the LED chip 11 are flip-chip connected (flip chip bonding) to the wiring layers 12a and 12b of the package 12, respectively.

基板１３は平板状であり、基板１３の裏面には配線層１３ａ，１３ｂが形成されており、基板１３には取付孔１３ｃが貫通形成されている。
取付孔１３ｃは、ＬＥＤチップ１１の寸法形状に合わせた平面視矩形状であり、ＬＥＤチップ１１の平面視寸法よりも大きく形成されており、取付孔１３ｃの内周壁面は取付孔１３ｃの表裏面に対して垂直である。
封止部１４は、パッケージ１２に実装されたＬＥＤチップ１１を被覆して封止する。封止部１４は透光性を有する樹脂材料から成り、その形成材料には、例えば、シリコン樹脂、エポキシ樹脂、フッ素樹脂、または、これらのハイブリッド樹脂などがある。 The substrate 13 has a flat plate shape, and wiring layers 13 a and 13 b are formed on the back surface of the substrate 13, and a mounting hole 13 c is formed through the substrate 13.
The mounting hole 13c has a rectangular shape in plan view that matches the size and shape of the LED chip 11, is formed larger than the size in plan view of the LED chip 11, and the inner peripheral wall surface of the mounting hole 13c is the front and back surfaces of the mounting hole 13c. Is perpendicular to.
The sealing unit 14 covers and seals the LED chip 11 mounted on the package 12. The sealing portion 14 is made of a light-transmitting resin material, and examples of the forming material include a silicon resin, an epoxy resin, a fluororesin, or a hybrid resin thereof.

パッケージ１２は基板１３の背面（裏面）側に取付固定されて実装され、ＬＥＤチップ１１は取付孔１３ｃに挿入され、ＬＥＤチップ１１と取付孔１３ｃの内周壁面との間には空隙が設けられている。
パッケージ１２の各配線層１２ａ，１２ｂはそれぞれ、基板１３の各配線層１３ａ，１３ｂに接続されている。
各電極１１ａ，１１ｂと各配線層１２ａ，１２ｂとの接続方法、および、各配線層１２ａ，１２ｂと各配線層１３ａ，１３ｂとの接続方法には、例えば、熱圧着接続、超音波接続、はんだ付け、接続部材（バンプ、金属ペースト、金属ナノペースト、異方性導電接着剤など）を用いた接続法などがある。 The package 12 is mounted and fixed on the back surface (back surface) side of the substrate 13, the LED chip 11 is inserted into the mounting hole 13c, and a gap is provided between the LED chip 11 and the inner peripheral wall surface of the mounting hole 13c. ing.
The wiring layers 12a and 12b of the package 12 are connected to the wiring layers 13a and 13b of the substrate 13, respectively.
Examples of the connection method between the electrodes 11a and 11b and the wiring layers 12a and 12b and the connection method between the wiring layers 12a and 12b and the wiring layers 13a and 13b include, for example, thermocompression bonding, ultrasonic connection, and soldering. And connection methods using connection members (bumps, metal pastes, metal nano pastes, anisotropic conductive adhesives, etc.).

基板１３は十分な強度および絶縁性を有し、その形成材料には、例えば、シリコン、セラミックス（例えば、酸化アルミニウム、窒化アルミニウムなど）、ガラスエポキシ、ポリイミドなどがある。
基板１３の取付孔１３ｃの内周壁面は、基板１３の素地である表面よりも光反射性が高くなっている。
取付孔１３ｃの内周壁面の光反射性を高めるには、例えば、取付孔１３ｃの内周壁面の表面粗さを、基板１３の表面の表面粗さよりも小さくする方法などがある。 The substrate 13 has sufficient strength and insulation, and examples of the forming material include silicon, ceramics (for example, aluminum oxide, aluminum nitride, etc.), glass epoxy, polyimide, and the like.
The inner peripheral wall surface of the mounting hole 13 c of the substrate 13 has higher light reflectivity than the surface that is the base of the substrate 13.
In order to improve the light reflectivity of the inner peripheral wall surface of the mounting hole 13c, for example, there is a method of making the surface roughness of the inner peripheral wall surface of the mounting hole 13c smaller than the surface roughness of the surface of the substrate 13.

［第１実施形態の作用・効果］
第１実施形態の照明装置１０によれば、以下の作用・効果を得ることができる。 [Operations and effects of the first embodiment]
According to the illumination device 10 of the first embodiment, the following actions and effects can be obtained.

［１］基板１３の取付孔１３ｃの内周壁面の光反射性が高いため、取付孔１３ｃの内周壁面が、ＬＥＤチップ１１（発光素子）の放射光をＬＥＤチップ１１の前方向（図１に示す矢印α方向）へ反射するリフレクタとして機能し、ＬＥＤチップ１１の放射光が取付孔１３ｃにより遮断され難くなることから、ＬＥＤチップ１１の放射光を照明装置１０から取り出す光取り出し効率を向上させることができる。   [1] Since the light reflectivity of the inner peripheral wall surface of the mounting hole 13c of the substrate 13 is high, the inner peripheral wall surface of the mounting hole 13c transmits the emitted light of the LED chip 11 (light emitting element) forward of the LED chip 11 (FIG. 1). It functions as a reflector that reflects in the direction indicated by arrow α), and the light emitted from the LED chip 11 is less likely to be blocked by the mounting hole 13c, thereby improving the light extraction efficiency for extracting the light emitted from the LED chip 11 from the illumination device 10. be able to.

［２］ＬＥＤチップ１１が基板１３の表面から突出している場合には、取付孔１３ｃの内周壁面のリフレクタ機能が得られ難くなる。
そのため、取付孔１３ｃの内周壁面のリフレクタ機能を高めるには、ＬＥＤチップ１１が基板１３の表面から突出しないよう、図１に示すように、パッケージ１２の表面から基板１３の表面までの高さｄを、パッケージ１２の表面からＬＥＤチップ１１の表面までの高さｈ以上に設定すればよい（ｄ≧ｈ）。 [2] When the LED chip 11 protrudes from the surface of the substrate 13, it is difficult to obtain the reflector function of the inner peripheral wall surface of the mounting hole 13c.
Therefore, in order to improve the reflector function of the inner peripheral wall surface of the mounting hole 13c, the height from the surface of the package 12 to the surface of the substrate 13 is prevented so that the LED chip 11 does not protrude from the surface of the substrate 13 as shown in FIG. d may be set to a height h or more from the surface of the package 12 to the surface of the LED chip 11 (d ≧ h).

［３］特許文献２の前記構成（シリコンサブマウント素子における発光ダイオードの周辺部分にミラー構造体を配置）に比べて、照明装置１０では、「ミラー構造体」を備えない分だけ、取付孔１３ｃを小さくすることが可能であるため、取付孔１３ｃが大きくなることによる基板１３の強度低下を防止することができる。   [3] Compared to the above-described configuration of Patent Document 2 (a mirror structure is disposed in the peripheral portion of the light emitting diode in the silicon submount element), the illumination device 10 is provided with the mounting hole 13c by the amount that does not include the “mirror structure”. Therefore, it is possible to prevent the strength of the substrate 13 from being lowered due to the increase in the mounting hole 13c.

＜第２実施形態＞
図３および図４に示すように、第２実施形態の照明装置２０は、ＬＥＤチップ１１（アノード電極１１ａ、カソード電極１１ｂ）、パッケージ１２（配線層１２ａ，１２ｂ）、基板１３（配線層１３ａ，１３ｂ、取付孔１３ｃ）、封止部１４、光反射膜２１などを備える。
第２実施形態の照明装置２０において、第１実施形態の照明装置１０と異なるのは、基板１３の取付孔１３ｃの内周壁面の全体を覆うように光反射膜２１が形成されている点である。 Second Embodiment
As shown in FIGS. 3 and 4, the illumination device 20 of the second embodiment includes an LED chip 11 (anode electrode 11a and cathode electrode 11b), a package 12 (wiring layers 12a and 12b), a substrate 13 (wiring layers 13a, 13b, mounting hole 13c), sealing portion 14, light reflecting film 21 and the like.
The illumination device 20 of the second embodiment is different from the illumination device 10 of the first embodiment in that a light reflecting film 21 is formed so as to cover the entire inner peripheral wall surface of the mounting hole 13 c of the substrate 13. is there.

光反射膜２１は光反射性の高い塗装膜または金属膜から成る。
光反射膜２１を形成する塗装膜には、光反射性の高い白色顔料（例えば、酸化チタン、酸化アルミニウムなど）が塗膜形成成分（基材）に含有混合された塗料を用いればよい。
また、光反射膜２１を形成する金属膜には、光反射性の高い金属材料（例えば、スズ、銀、金、クロムなど）のメッキ膜またはＰＶＤ（Physical Vapor Deposition）膜を用いればよい。 The light reflecting film 21 is made of a paint film or a metal film having high light reflectivity.
For the coating film forming the light reflecting film 21, a paint in which a white pigment having high light reflectivity (for example, titanium oxide, aluminum oxide, etc.) is mixed and contained in a coating film forming component (base material) may be used.
Further, a metal film that forms the light reflecting film 21 may be a plating film or a PVD (Physical Vapor Deposition) film of a highly light reflective metal material (for example, tin, silver, gold, chromium, etc.).

第２実施形態の照明装置２０では、光反射膜２１を設けることにより、取付孔１３ｃの内周壁面の光反射性を高めることが可能であるため、第１実施形態の前記［１］の作用・効果を更に確実に得ることができる。
尚、取付孔１３ｃの内周壁面の全体を覆うのではなく、取付孔１３ｃの内周壁面の少なくとも一部分を覆うように光反射膜２１を形成してもよい。
また、第２実施形態によれば、第１実施形態の前記［２］［３］と同様の作用・効果が得られる。 In the illuminating device 20 of the second embodiment, by providing the light reflecting film 21, it is possible to improve the light reflectivity of the inner peripheral wall surface of the mounting hole 13c. Therefore, the function of [1] of the first embodiment.・ Effects can be obtained more reliably.
In addition, you may form the light reflection film | membrane 21 so that at least one part of the inner peripheral wall surface of the attachment hole 13c may be covered instead of covering the whole inner peripheral wall surface of the attachment hole 13c.
Further, according to the second embodiment, the same operations and effects as the above [2] [3] of the first embodiment can be obtained.

＜第３実施形態＞
図５および図６に示すように、第３実施形態の照明装置３０は、ＬＥＤチップ１１（アノード電極１１ａ、カソード電極１１ｂ）、パッケージ１２（配線層１２ａ，１２ｂ）、基板１３（配線層１３ａ，１３ｂ、取付孔１３ｃ）、封止部１４などを備える。
第３実施形態の照明装置３０において、第１実施形態の照明装置１０と異なるのは、基板１３の取付孔１３ｃの内周壁面が、取付孔１３ｃの開口部に向かって取付孔１３ｃの横断面積が広がるように傾斜した平面状の傾斜面に形成されている点である。 <Third Embodiment>
As shown in FIGS. 5 and 6, the illumination device 30 according to the third embodiment includes an LED chip 11 (anode electrode 11a and cathode electrode 11b), a package 12 (wiring layers 12a and 12b), a substrate 13 (wiring layers 13a, 13b, mounting hole 13c), sealing portion 14 and the like.
The illumination device 30 according to the third embodiment differs from the illumination device 10 according to the first embodiment in that the inner peripheral wall surface of the attachment hole 13c of the substrate 13 faces the opening of the attachment hole 13c. It is the point formed in the planar inclined surface inclined so that may spread.

第３実施形態の照明装置３０では、基板１３の取付孔１３ｃの内周壁面を平面状の傾斜面にすることにより、取付孔１３ｃの内周壁面のリフレクタ機能を高めることが可能であるため、第１実施形態の前記［１］の作用・効果を更に確実に得ることができる。
尚、取付孔１３ｃの内周壁面を平面状の傾斜面に形成するのではなく、凹面状の傾斜面（湾曲面）に形成してもよい。
また、第３実施形態によれば、第１実施形態の前記［２］［３］と同様の作用・効果が得られる。 In the illumination device 30 of the third embodiment, the reflector function of the inner peripheral wall surface of the mounting hole 13c can be enhanced by making the inner peripheral wall surface of the mounting hole 13c of the substrate 13 into a flat inclined surface. The operation and effect of [1] of the first embodiment can be obtained more reliably.
The inner peripheral wall surface of the mounting hole 13c may be formed as a concave inclined surface (curved surface) instead of being formed as a flat inclined surface.
Further, according to the third embodiment, the same operation and effect as the above [2] and [3] of the first embodiment can be obtained.

＜第４実施形態＞
図７および図８に示すように、第４実施形態の照明装置４０は、ＬＥＤチップ１１（アノード電極１１ａ、カソード電極１１ｂ）、パッケージ１２（配線層１２ａ，１２ｂ）、基板１３（配線層１３ａ，１３ｂ、取付孔１３ｃ）、封止部１４、第１光反射部材４１などを備える。
第４実施形態の照明装置４０において、第１実施形態の照明装置１０と異なるのは、基板１３の取付孔１３ｃに第１光反射部材４１が取付固定されており、第１光反射部材４１の内周壁面が取付孔１３ｃの内周壁面になっている点である。 <Fourth embodiment>
As shown in FIGS. 7 and 8, the illumination device 40 of the fourth embodiment includes an LED chip 11 (anode electrode 11a and cathode electrode 11b), a package 12 (wiring layers 12a and 12b), a substrate 13 (wiring layers 13a, 13b, mounting hole 13c), sealing portion 14, first light reflecting member 41, and the like.
The illumination device 40 of the fourth embodiment is different from the illumination device 10 of the first embodiment in that the first light reflecting member 41 is fixedly attached to the attachment hole 13 c of the substrate 13. The inner peripheral wall surface is the inner peripheral wall surface of the mounting hole 13c.

第１光反射部材４１の内周壁面は、取付孔１３ｃの開口部に向かって取付孔１３ｃの横断面積が広がるように傾斜した平面状の傾斜面に形成されている。
第１光反射部材４１の形成材料には、例えば、光反射性の高い白色顔料が含有混合された合成樹脂材料、光反射性の高い金属材料などがある。
第１光反射部材４１を取付孔１３ｃに取付固定するには、接着材（図示略）を用いればよい。 The inner peripheral wall surface of the first light reflecting member 41 is formed on a flat inclined surface that is inclined so that the cross-sectional area of the mounting hole 13c increases toward the opening of the mounting hole 13c.
Examples of the material for forming the first light reflecting member 41 include a synthetic resin material mixed and mixed with a white pigment having high light reflectivity, and a metal material having high light reflectivity.
In order to attach and fix the first light reflecting member 41 to the attachment hole 13c, an adhesive (not shown) may be used.

第４実施形態の照明装置４０では、第１光反射部材４１を設けることにより、取付孔１３ｃの内周壁面の光反射性を高めることが可能であるため、第１実施形態の前記［１］の作用・効果を更に確実に得ることができる。
尚、第１光反射部材４１の内周壁面の少なくとも一部分を覆うように、第２実施形態の光反射膜２１と同様の光反射膜を形成してもよい。
また、第１光反射部材４１の内周壁面を平面状の傾斜面に形成するのではなく、凹面状の傾斜面に形成してもよい。
そして、第４実施形態によれば、第１実施形態の前記［２］［３］と同様の作用・効果が得られる。 In the illuminating device 40 of the fourth embodiment, by providing the first light reflecting member 41, it is possible to enhance the light reflectivity of the inner peripheral wall surface of the mounting hole 13c, so the [1] of the first embodiment. The effects and effects of can be obtained more reliably.
A light reflecting film similar to the light reflecting film 21 of the second embodiment may be formed so as to cover at least a part of the inner peripheral wall surface of the first light reflecting member 41.
Further, the inner peripheral wall surface of the first light reflecting member 41 may be formed on a concave inclined surface instead of being formed on a flat inclined surface.
And according to 4th Embodiment, the effect | action and effect similar to said [2] [3] of 1st Embodiment are acquired.

＜第５実施形態＞
図９および図１０に示すように、第５実施形態の照明装置５０は、ＬＥＤチップ１１（アノード電極１１ａ、カソード電極１１ｂ）、パッケージ１２（配線層１２ａ，１２ｂ）、基板１３（配線層１３ａ，１３ｂ、取付孔１３ｃ）、封止部１４、第２光反射部材５１などを備える。
第５実施形態の照明装置５０において、第１実施形態の照明装置１０と異なるのは、基板１３の取付孔１３ｃの全体を囲むように配置形成された額縁枠状の第２光反射部材５１が基板１３の表面上に取付固定されている点である。 <Fifth Embodiment>
As shown in FIGS. 9 and 10, the illumination device 50 according to the fifth embodiment includes an LED chip 11 (anode electrode 11a and cathode electrode 11b), a package 12 (wiring layers 12a and 12b), a substrate 13 (wiring layers 13a, 13b, the mounting hole 13c), the sealing portion 14, the second light reflecting member 51, and the like.
The illumination device 50 according to the fifth embodiment differs from the illumination device 10 according to the first embodiment in that a frame-shaped second light reflecting member 51 arranged and formed so as to surround the entire attachment hole 13c of the substrate 13 is provided. It is a point that it is fixedly mounted on the surface of the substrate 13.

第２光反射部材５１の内周壁面は、第２光反射部材５１の開口部に向かって第２光反射部材５１に囲まれた空間の横断面積が広がるように傾斜した平面状の傾斜面に形成されている。
第２光反射部材５１の形成材料には、第４実施形態の第１光反射部材４１と同様の形成材料を用いればよい。
第２光反射部材５１を基板１３の表面上に取付固定するには、接着材（図示略）を用いればよい。 The inner peripheral wall surface of the second light reflecting member 51 is a flat inclined surface that is inclined so that the transverse area of the space surrounded by the second light reflecting member 51 is widened toward the opening of the second light reflecting member 51. Is formed.
As the forming material of the second light reflecting member 51, the same forming material as that of the first light reflecting member 41 of the fourth embodiment may be used.
In order to attach and fix the second light reflecting member 51 on the surface of the substrate 13, an adhesive (not shown) may be used.

［第５実施形態の作用・効果］
第５実施形態の照明装置５０によれば、第１実施形態の前記［１］［３］の作用・効果に加えて、以下の作用・効果を得ることができる。 [Operation and Effect of Fifth Embodiment]
According to the illumination device 50 of the fifth embodiment, in addition to the operations and effects of [1] and [3] of the first embodiment, the following operations and effects can be obtained.

［４］第２光反射部材５１が、ＬＥＤチップ１１の放射光をＬＥＤチップ１１の前方向（図９に示す矢印α方向）へ反射するリフレクタとして機能するため、ＬＥＤチップ１１の放射光を照明装置５０から取り出す光取り出し効率を向上させることができる。   [4] Since the second light reflecting member 51 functions as a reflector that reflects the emitted light of the LED chip 11 in the forward direction of the LED chip 11 (the direction of the arrow α shown in FIG. 9), the emitted light of the LED chip 11 is illuminated. The light extraction efficiency extracted from the device 50 can be improved.

［５］ＬＥＤチップ１１が第２光反射部材５１から突出している場合には、第２光反射部材５１のリフレクタ機能が得られ難くなる。
そのため、第２光反射部材５１のリフレクタ機能を高めるには、ＬＥＤチップ１１が第２光反射部材５１から突出しないよう、図９に示すように、パッケージ１２の表面から基板１３の表面までの高さｄと、第２光反射部材５１の高さＨとを合わせた寸法（ｄ＋Ｈ）を、パッケージ１２の表面からＬＥＤチップ１１の表面までの高さｈ以上に設定すればよい（ｄ＋Ｈ≧ｈ）。 [5] When the LED chip 11 protrudes from the second light reflecting member 51, it is difficult to obtain the reflector function of the second light reflecting member 51.
Therefore, in order to enhance the reflector function of the second light reflecting member 51, as shown in FIG. 9, the height from the surface of the package 12 to the surface of the substrate 13 is prevented so that the LED chip 11 does not protrude from the second light reflecting member 51. The dimension (d + H) obtained by combining the height d and the height H of the second light reflecting member 51 may be set to be not less than the height h from the surface of the package 12 to the surface of the LED chip 11 (d + H ≧ h). .

［６］特許文献２の前記構成（シリコンサブマウント素子における発光ダイオードの周辺部分にミラー構造体を配置）に比べて、照明装置５０では、第２光反射部材５１を基板１３の表面上に取付固定することにより、取付孔１３ｃを小さくすることが可能であるため、取付孔１３ｃが大きくなることによる基板１３の強度低下を防止することができる。   [6] Compared to the configuration described in Patent Document 2 (a mirror structure is disposed in the peripheral portion of the light emitting diode in the silicon submount element), in the lighting device 50, the second light reflecting member 51 is mounted on the surface of the substrate 13. By fixing, it is possible to make the mounting hole 13c small, so that it is possible to prevent the strength of the substrate 13 from being lowered due to the mounting hole 13c becoming large.

［７］取付孔１３ｃの全体を囲むのではなく、取付孔１３ｃの少なくとも一部分を囲むように第２光反射部材５１を配置形成してもよい。
また、第２光反射部材５１の内周壁面の少なくとも一部分を覆うように、第２実施形態の光反射膜２１と同様の光反射膜を形成してもよい。
そして、第２光反射部材５１の内周壁面を平面状の傾斜面に形成するのではなく、凹面状の傾斜面に形成してもよい。 [7] The second light reflecting member 51 may be arranged and formed so as to surround at least a part of the mounting hole 13c, instead of surrounding the entire mounting hole 13c.
Moreover, you may form the light reflection film | membrane similar to the light reflection film | membrane 21 of 2nd Embodiment so that at least one part of the inner peripheral wall surface of the 2nd light reflection member 51 may be covered.
Then, the inner peripheral wall surface of the second light reflecting member 51 may be formed on a concave inclined surface instead of being formed on a flat inclined surface.

＜別の実施形態＞
本発明は前記各実施形態に限定されるものではなく、以下のように具体化してもよく、その場合でも、前記各実施形態と同等もしくはそれ以上の作用・効果を得ることができる。 <Another embodiment>
The present invention is not limited to the above-described embodiments, and may be embodied as follows. Even in this case, operations and effects equivalent to or higher than those of the above-described embodiments can be obtained.

［Ａ］前記各実施形態において、パッケージ１２の裏面側にヒートシンクを取付固定してもよい。このようにすれば、照明装置の放熱性を高めることが可能になるため、ＬＥＤチップ１１の劣化や故障を防止して照明装置の信頼性を向上させることができる。   [A] In each of the above embodiments, a heat sink may be attached and fixed to the back side of the package 12. If it does in this way, since it becomes possible to improve the heat dissipation of an illuminating device, deterioration and failure of the LED chip 11 can be prevented and the reliability of an illuminating device can be improved.

［Ｂ］パッケージ１２が光透過性を有する場合には、パッケージ１２の裏面側に光反射性の高いシート材を取付固定してもよい。このようにすれば、ＬＥＤチップ１１からパッケージ１２の裏面側に放射された光を、シート材によりＬＥＤチップ１１の前方向に反射させることが可能になるため、照明装置の光取り出し効率を更に向上させることができる。   [B] When the package 12 is light transmissive, a sheet material having high light reflectivity may be attached and fixed to the back side of the package 12. In this way, the light emitted from the LED chip 11 to the back side of the package 12 can be reflected in the front direction of the LED chip 11 by the sheet material, so that the light extraction efficiency of the lighting device is further improved. Can be made.

［Ｃ］ＬＥＤチップ１１は、どのような半導体発光素子（例えば、ＥＬ（Electro Luminescence）チップ、ＬＤ（Laser Diode）チップなど）に置き換えてもよい。   [C] The LED chip 11 may be replaced with any semiconductor light emitting element (for example, EL (Electro Luminescence) chip, LD (Laser Diode) chip, etc.)).

［Ｄ］第１〜第４実施形態と第５実施形態とを適宜組み合わせて実施してもよく、その場合には組み合わせた実施形態の作用・効果を合わせもたせたり、相乗効果を得ることができる。   [D] The first to fourth embodiments and the fifth embodiment may be appropriately combined and implemented, and in that case, the actions and effects of the combined embodiments can be combined or a synergistic effect can be obtained. .

本発明は、前記各局面および前記各実施形態の説明に何ら限定されるものではない。特許請求の範囲の記載を逸脱せず、当業者が容易に想到できる範囲で種々の変形態様も本発明に含まれる。本明細書の中で明示した公報などの内容は、その全ての内容を援用によって引用することとする。   The present invention is not limited to the description of each aspect and each embodiment. Various modifications are also included in the present invention as long as those skilled in the art can easily conceive without departing from the scope of the claims. The contents of publications and the like specified in the present specification are all incorporated by reference.

１０，２０，３０，４０，５０…照明装置
１１…ＬＥＤチップ（発光素子）
１２…パッケージ
１３…基板
１３ｃ…取付孔
２１…光反射膜
４１…第１光反射部材
５１…第２光反射部材 10, 20, 30, 40, 50 ... Illumination device 11 ... LED chip (light emitting element)
DESCRIPTION OF SYMBOLS 12 ... Package 13 ... Board | substrate 13c ... Mounting hole 21 ... Light reflection film 41 ... 1st light reflection member 51 ... 2nd light reflection member

Claims (5)

発光素子と
前記発光素子が実装されたパッケージと、
取付孔が貫通形成された基板と
を備え、
前記パッケージは前記基板の背面側に取付固定されて実装され、前記発光素子は前記取付孔に挿入されており、
前記取付孔の内周壁面は、前記基板の表面よりも光反射性が高い照明装置。 A light emitting element and a package on which the light emitting element is mounted;
A substrate having a mounting hole formed therethrough,
The package is mounted and fixed on the back side of the substrate, and the light emitting element is inserted into the mounting hole.
The inner peripheral wall surface of the mounting hole is a lighting device having higher light reflectivity than the surface of the substrate. 前記取付孔の内周壁面の少なくとも一部分を覆うように形成された光反射膜を備えた、
請求項１に記載の照明装置。 A light reflecting film formed so as to cover at least a part of the inner peripheral wall surface of the mounting hole;
The lighting device according to claim 1. 前記取付孔の内周壁面が、当該取付孔の開口部に向かって当該取付孔の横断面積が広がるように傾斜した傾斜面に形成されている、
請求項１または請求項２に記載の照明装置。 The inner peripheral wall surface of the mounting hole is formed on an inclined surface that is inclined so that a cross-sectional area of the mounting hole widens toward the opening of the mounting hole.
The lighting device according to claim 1 or 2. 前記取付孔に取付固定された第１光反射部材を備え、
前記第１光反射部材の内周壁面が、前記取付孔の内周壁面になっていると共に、前記取付孔の開口部に向かって前記取付孔の横断面積が広がるように傾斜した傾斜面に形成されている、
請求項１または請求項２に記載の照明装置。 A first light reflecting member fixedly mounted in the mounting hole;
An inner peripheral wall surface of the first light reflecting member is an inner peripheral wall surface of the mounting hole, and is formed on an inclined surface inclined so that a cross-sectional area of the mounting hole is widened toward the opening of the mounting hole. Being
The lighting device according to claim 1 or 2. 前記取付孔の少なくとも一部分を囲むように配置形成され、前記基板の表面上に取付固定された第２光反射部材を備えた、
請求項１〜４に記載の照明装置。 A second light reflecting member disposed and formed so as to surround at least a part of the mounting hole and fixedly mounted on the surface of the substrate;
The lighting device according to claim 1.
JP2016002470A 2016-01-08 2016-01-08 Illumination device Withdrawn JP2017123418A (en)

Priority Applications (1)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006128511A (en) * 2004-10-29 2006-05-18 Ngk Spark Plug Co Ltd Ceramic substrate for light emitting element
JP2007150228A (en) * 2005-11-02 2007-06-14 Trion:Kk Light-emitting diode packaging substrate
JP2009123828A (en) * 2007-11-13 2009-06-04 Denki Kagaku Kogyo Kk Light emitting device
JP2012517697A (en) * 2009-02-17 2012-08-02 ポイント エンジニアリング カンパニー，リミテッド Optical element substrate, optical element package having the same, and manufacturing method thereof
JP2013058396A (en) * 2011-09-08 2013-03-28 Koito Mfg Co Ltd Vehicular lamp

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006128511A (en) * 2004-10-29 2006-05-18 Ngk Spark Plug Co Ltd Ceramic substrate for light emitting element
JP2007150228A (en) * 2005-11-02 2007-06-14 Trion:Kk Light-emitting diode packaging substrate
JP2009123828A (en) * 2007-11-13 2009-06-04 Denki Kagaku Kogyo Kk Light emitting device
JP2012517697A (en) * 2009-02-17 2012-08-02 ポイント エンジニアリング カンパニー，リミテッド Optical element substrate, optical element package having the same, and manufacturing method thereof
JP2013058396A (en) * 2011-09-08 2013-03-28 Koito Mfg Co Ltd Vehicular lamp

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