JP2017120897A - Light-emitting apparatus and color-matching apparatus - Google Patents

Light-emitting apparatus and color-matching apparatus Download PDF

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JP2017120897A
JP2017120897A JP2016246966A JP2016246966A JP2017120897A JP 2017120897 A JP2017120897 A JP 2017120897A JP 2016246966 A JP2016246966 A JP 2016246966A JP 2016246966 A JP2016246966 A JP 2016246966A JP 2017120897 A JP2017120897 A JP 2017120897A
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light emitting
sets
light
emitting elements
substrate
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JP6915983B2 (en
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ゆか 渡辺
Yuka Watanabe
ゆか 渡辺
矢野　敬和
Takakazu Yano
矢野　　敬和
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Citizen Electronics Co Ltd
Citizen Watch Co Ltd
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Citizen Electronics Co Ltd
Citizen Watch Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting apparatus and a color-matching apparatus, capable of adjusting the chromaticity of emitted light to multi-levels.SOLUTION: A light-emitting apparatus includes: a substrate; a resin frame fixed on the substrate; a plurality of sets of light-emitting elements mounted in a region on the substrate surrounded by the resin frame, the light-emitting elements which configure each of the sets being connected in series to each other; a plurality of pairs of connection electrodes which are provided on the substrate, electrically connected to the plurality of sets of light-emitting elements and capable of supplying a drive current selectively to some of the plurality of sets of light-emitting elements; and a sealing resin in which a phosphor excited by light from the plurality of sets of light-emitting elements is mixed and which is filled in such a way as to bury the region on the substrate surrounded by the resin frame, to seal integrally the plurality of sets of light-emitting elements. A thickness of the sealing resin immediately above the plurality of sets of light-emitting elements differs for the respective sets, and thereby, a chromaticity of light emitted from the sealing resin differs when each of the sets of light-emitting elements emits the light singly.SELECTED DRAWING: Figure 2

Description

本発明は、発光装置および調色装置に関する。   The present invention relates to a light emitting device and a toning device.

特許文献１には、外形をほとんど変えず、色度調整の過程において与えるダメージが少なく、容易に色度調整が可能なＬＥＤ（発光ダイオード）光源として、ＬＥＤ素子と、ＬＥＤ素子からの発光の一部を吸収し波長変換して発光する蛍光体を含みＬＥＤ素子の周囲に配置された封止材と、封止材を切削して形成された凹部と、凹部全体に充填された封止材とは異なる色度調整用樹脂とを有するＬＥＤ光源が記載されている。   Patent Document 1 discloses an LED element and an LED element that emits light from an LED element as an LED (light-emitting diode) light source that can be easily adjusted in chromaticity with little change in the chromaticity adjustment process with almost no change in outer shape. A sealing material disposed around the LED element, including a phosphor that absorbs the light and converts the wavelength to emit light, a recess formed by cutting the sealing material, and a sealing material filled in the entire recess LED light sources having different chromaticity adjusting resins are described.

特許文献２には、樹脂基板の配線パターンに、それぞれ赤色、緑色及び青色に発光する発光ダイオードのベアチップを接続し、これらを一組として、基板に対し、凸状の第１のコーティング層を、均一に、且つ、略等間隔に隣接させて形成し、さらにその上から基板全体に第２コーティング層を形成したベアチップ実装面発光体が記載されている。   In Patent Document 2, a bare chip of a light-emitting diode that emits red, green, and blue light is connected to a wiring pattern of a resin substrate, respectively, and a convex first coating layer is formed on the substrate as a set. There is described a bare chip mounting surface light emitter that is formed uniformly and adjacent to each other at substantially equal intervals, and further has a second coating layer formed on the entire substrate from above.

特許文献３には、独立して駆動される２つ以上の発光素子チップと、その２つ以上の発光素子チップを覆う一体の蛍光体層とを含み、一体の蛍光体層の厚みが少なくとも１つの発光素子チップを覆う部位とその他の発光素子チップを覆う部位とで異なるように形成されている発光装置が記載されている。   Patent Document 3 includes two or more light-emitting element chips that are driven independently, and an integral phosphor layer that covers the two or more light-emitting element chips, and the thickness of the integral phosphor layer is at least 1. A light emitting device is described in which a portion covering one light emitting element chip is different from a portion covering another light emitting element chip.

特開２０１０−２３２５２５号公報JP 2010-232525 A 特開２０１２−００９５３０号公報JP 2012-009530 A 特開２０１２−０６９７８７号公報JP 2012-069787 A

青色ＬＥＤなどの複数の発光素子が１つの基板上に実装されて蛍光体含有樹脂により封止され、発光素子からの光を蛍光体で波長変換して出射するＣＯＢ（Chip On Board）の発光装置では、例えば封止樹脂の厚さによって出射光の色度が製品ごとにわずかに異なり、また、駆動中に装置内部の温度上昇に起因して色度シフトが発生することもある。しかしながら、こうした発光装置では、製品単体では色度の調整ができないため、製品ごとの色度のバラつきおよび駆動中の色度シフトを補正することは難しい。   A COB (Chip On Board) light emitting device in which a plurality of light emitting elements such as blue LEDs are mounted on one substrate and sealed with a phosphor-containing resin, and the wavelength of the light from the light emitting elements is converted by the phosphor and emitted. Then, for example, the chromaticity of the emitted light slightly varies depending on the product depending on the thickness of the sealing resin, and a chromaticity shift may occur due to a temperature rise inside the apparatus during driving. However, in such a light emitting device, the chromaticity cannot be adjusted by a single product, so it is difficult to correct the chromaticity variation and the chromaticity shift during driving for each product.

そこで、本発明は、出射光の色度を複数段階に調整可能な発光装置および調色装置を提供することを目的とする。   Accordingly, an object of the present invention is to provide a light-emitting device and a toning device that can adjust the chromaticity of emitted light in a plurality of stages.

基板と、基板上に固定された樹脂枠と、樹脂枠により囲まれる基板上の領域に実装された複数組の発光素子であって、組ごとに、その組を構成する発光素子同士が互いに直列接続された複数組の発光素子と、基板上に設けられ、複数組の発光素子に電気的に接続された複数組の接続電極であって、複数組の発光素子のうちで一部の組の発光素子に選択的に駆動電流を供給可能な複数組の接続電極と、複数組の発光素子からの光により励起される蛍光体が混入され、樹脂枠により囲まれた基板上の領域を埋め尽くすように充填されて複数組の発光素子を一体的に封止する封止樹脂とを有し、複数組の発光素子の直上における封止樹脂の厚さが組ごとに互いに異なることで、複数組の発光素子のそれぞれを１組だけ発光させたときの封止樹脂からの出射光の色度が互いに異なる発光装置が提供される。   A plurality of sets of light-emitting elements mounted on a substrate, a resin frame fixed on the substrate, and a region on the substrate surrounded by the resin frame, and each set of light-emitting elements constituting the set is in series with each other A plurality of sets of connected light-emitting elements, and a plurality of sets of connection electrodes provided on the substrate and electrically connected to the plurality of sets of light-emitting elements, wherein some of the plurality of sets of light-emitting elements A plurality of sets of connection electrodes capable of selectively supplying a drive current to the light emitting elements and phosphors excited by light from the plurality of sets of light emitting elements are mixed to fill the region on the substrate surrounded by the resin frame. Sealing resin for integrally sealing a plurality of sets of light emitting elements so that the thicknesses of the sealing resins immediately above the plurality of sets of light emitting elements are different from one another for each set. From the sealing resin when only one set of each of the light emitting elements is made to emit light Chromaticity of emitted light is different light emitting device is provided.

上記の発光装置では、ＡＮＳＩ Ｃ７８．３７７の規格で相対色温度により分類されている複数の白色のうちの１つに相当する色度図上の領域の中心点を中心とする当該中心点の色度値の±２％の範囲内に出射光の色度値が収まるように、複数組の発光素子の実装位置における封止樹脂の厚さが定められていることが好ましい。   In the above light emitting device, the color of the center point centered on the center point of the region on the chromaticity diagram corresponding to one of a plurality of whites classified by relative color temperature according to the ANSI C78.377 standard. It is preferable that the thickness of the sealing resin at the mounting position of the plurality of sets of light emitting elements is determined so that the chromaticity value of the emitted light is within a range of ± 2% of the degree value.

複数組の発光素子は、基板の水平な実装面上に実装され、実装面からの樹脂枠の高さは、基板の一端部側から一端部に対向する基板の他端部側に向けて徐々に小さくなり、封止樹脂は、一端部側から他端部側にかけて厚さが次第に減少するように複数組の発光素子を封止することが好ましい。   The plurality of sets of light emitting elements are mounted on a horizontal mounting surface of the substrate, and the height of the resin frame from the mounting surface is gradually increased from one end of the substrate toward the other end of the substrate facing the one end. It is preferable that the plurality of sets of light emitting elements be sealed so that the thickness of the sealing resin gradually decreases from one end to the other end.

基板は水平面に対して傾斜した実装面を有し、複数組の発光素子は傾斜した実装面上に実装され、実装面からの樹脂枠の高さは、樹脂枠の上端が全周にわたって同じ水平面上に位置するように、水平面に対する実装面上の高さが低い位置ほど大きくなり、封止樹脂の下端は傾斜した実装面に沿って広がり、封止樹脂の上端は１つの水平面であることが好ましい。   The substrate has a mounting surface that is inclined with respect to a horizontal plane, and a plurality of sets of light emitting elements are mounted on the inclined mounting surface, and the height of the resin frame from the mounting surface is the same horizontal plane over the entire circumference of the resin frame. The lower the height on the mounting surface relative to the horizontal plane is, the higher the position is, and the lower end of the sealing resin extends along the inclined mounting surface, and the upper end of the sealing resin is one horizontal plane. preferable.

基板は、上面が傾斜した実装面である金属製の実装基板と、厚さが一様であり、開口部を有し、実装基板の上面に固定され、複数組の接続電極が設けられた回路基板とで構成され、複数組の発光素子は、開口部内で露出した実装基板の上面に実装されていることが好ましい。   The substrate is a metal mounting substrate whose mounting surface is inclined, and a circuit that is uniform in thickness, has an opening, is fixed to the upper surface of the mounting substrate, and is provided with a plurality of sets of connection electrodes Preferably, the plurality of sets of light emitting elements are mounted on the upper surface of the mounting substrate exposed in the opening.

基板は、上面に段差が形成されていることにより、鉛直方向の高さが互いに異なる複数の水平面を有し、複数組の発光素子は、組ごとに異なる高さの位置に実装されており、封止樹脂の上端は１つの水平面であることが好ましい。   The substrate has a plurality of horizontal surfaces whose vertical heights are different from each other by forming a step on the upper surface, and the plurality of sets of light emitting elements are mounted at different height positions for each set, The upper end of the sealing resin is preferably one horizontal plane.

基板は、複数の水平面を有する金属製の実装基板と、厚さが一様であり、開口部を有し、実装基板の上面に固定され、複数組の接続電極が設けられた回路基板とで構成され、複数組の発光素子は、開口部内で露出した実装基板の上面に実装されていることが好ましい。   The board includes a metal mounting board having a plurality of horizontal planes, and a circuit board having a uniform thickness, an opening, and fixed to the upper surface of the mounting board, and provided with a plurality of sets of connection electrodes. Preferably, the plurality of sets of light emitting elements are mounted on the upper surface of the mounting substrate exposed in the opening.

同じ組を構成する複数の発光素子はいずれも同じ発光波長帯域を有し、複数組の発光素子の一部は、残りの組の発光素子とは異なる発光波長帯域を有することが好ましい。   It is preferable that a plurality of light-emitting elements constituting the same set have the same emission wavelength band, and that some of the plurality of sets of light-emitting elements have emission wavelength bands different from those of the remaining sets.

また、基板と、基板上に固定された樹脂枠と、樹脂枠により囲まれる基板上の領域に実装された複数組の発光素子であって、組ごとに、当該組を構成する発光素子同士が互いに直列接続された複数組の発光素子と、基板上に設けられ、複数組の発光素子に電気的に接続された複数組の接続電極であって、複数組の発光素子のうちで一部の組の発光素子に選択的に駆動電流を供給可能な複数組の接続電極と、複数組の発光素子からの光により励起される蛍光体が混入され、樹脂枠により囲まれた基板上の領域を埋め尽くすように充填されて複数組の発光素子を一体的に封止する封止樹脂と、複数組の接続電極の少なくともいずれかに接続されて、複数組の発光素子のうちで対応する組の発光素子に駆動電流を供給することで、封止樹脂を通して当該組に対応する色度の光を出射させる定電流電源とを有し、複数組の発光素子の直上における封止樹脂の厚さが組ごとに互いに異なることで、複数組の発光素子のそれぞれを１組だけ発光させたときの封止樹脂からの出射光の色度が互いに異なる調色装置が提供される。   Further, there are a plurality of sets of light emitting elements mounted on a substrate, a resin frame fixed on the substrate, and a region on the substrate surrounded by the resin frame. A plurality of sets of light emitting elements connected in series with each other, and a plurality of sets of connection electrodes provided on the substrate and electrically connected to the plurality of sets of light emitting elements, A plurality of sets of connection electrodes capable of selectively supplying a driving current to a set of light emitting elements and a phosphor excited by light from the plurality of sets of light emitting elements are mixed, and an area on the substrate surrounded by a resin frame A sealing resin for filling and filling a plurality of sets of light emitting elements integrally, and a corresponding set of the plurality of sets of light emitting elements connected to at least one of the plurality of sets of connection electrodes. By supplying driving current to the light emitting element, A constant current power source that emits light of chromaticity corresponding to the set, and the thickness of the sealing resin immediately above the plurality of sets of light emitting elements is different for each set, so that each of the plurality of sets of light emitting elements A toning device is provided in which the chromaticities of the light emitted from the sealing resin when only one set is emitted are different from each other.

上記の発光装置および調色装置によれば、出射光の色度を複数段階に調整することが可能になる。   According to the light emitting device and the color adjusting device, the chromaticity of the emitted light can be adjusted in a plurality of stages.

調色装置１の概略構成図である。1 is a schematic configuration diagram of a toning device 1. FIG. 図１のＩＩ−ＩＩ線に沿った発光装置１０の縦断面図である。It is a longitudinal cross-sectional view of the light-emitting device 10 along the II-II line of FIG. 基板１１の上面図および縦断面図である。It is the upper side figure and longitudinal cross-sectional view of the board | substrate 11. FIG. 白色レジスト１９が取り除かれた基板１１の上面図および縦断面図である。It is the top view and longitudinal cross-sectional view of the board | substrate 11 from which the white resist 19 was removed. ＬＥＤ素子１２の接続関係の例を示す図である。It is a figure which shows the example of the connection relation of the LED element. 出射光の色度と出射光に含まれる青色光の強度との対応関係の例を示す表である。It is a table | surface which shows the example of the correspondence of the chromaticity of emitted light, and the intensity | strength of the blue light contained in emitted light. 発光装置１０の出射光のスペクトルの例を示す図である。It is a figure which shows the example of the spectrum of the emitted light of the light-emitting device. 図６に対応する色度図である。FIG. 7 is a chromaticity diagram corresponding to FIG. 6. 発光装置１０の製造工程の例を示すフローチャートである。4 is a flowchart illustrating an example of a manufacturing process of the light emitting device 10. 発光装置１０の製造工程を説明するための上面図および縦断面図である。FIG. 6 is a top view and a longitudinal sectional view for explaining a manufacturing process of the light emitting device 10. 発光装置１０の製造工程を説明するための上面図および縦断面図である。FIG. 6 is a top view and a longitudinal sectional view for explaining a manufacturing process of the light emitting device 10. 出射光の色度と出射光に含まれる青色光の強度との対応関係の別の例を示す表である。It is a table | surface which shows another example of the correspondence of the chromaticity of an emitted light, and the intensity | strength of the blue light contained in an emitted light. 図１２に対応する色度図である。FIG. 13 is a chromaticity diagram corresponding to FIG. 12. 別の発光装置２０の上面図および縦断面図である。It is the top view and longitudinal cross-sectional view of another light-emitting device 20. さらに別の発光装置３０の上面図および縦断面図である。4 is a top view and a longitudinal sectional view of still another light emitting device 30. FIG. さらに別の発光装置４０の上面図および縦断面図である。FIG. 6 is a top view and a longitudinal sectional view of still another light emitting device 40. さらに別の発光装置１０’の縦断面図である。It is a longitudinal cross-sectional view of another light-emitting device 10 '. さらに別の発光装置２０’の縦断面図である。It is a longitudinal cross-sectional view of another light-emitting device 20 '. さらに別の発光装置３０’の縦断面図である。It is a longitudinal cross-sectional view of another light-emitting device 30 '. さらに別の発光装置４０’の縦断面図である。It is a longitudinal cross-sectional view of another light-emitting device 40 '. ＬＥＤ素子１２の接続関係の別の例を示す図である。It is a figure which shows another example of the connection relation of the LED element. ＬＥＤ素子１２の接続関係の別の例を示す図である。It is a figure which shows another example of the connection relation of the LED element.

以下、図面を参照しつつ、発光装置および調色装置について説明する。ただし、本発明は図面または以下に記載される実施形態には限定されないことを理解されたい。   Hereinafter, the light emitting device and the toning device will be described with reference to the drawings. However, it should be understood that the present invention is not limited to the drawings or the embodiments described below.

図１は、調色装置１の概略構成図である。また、図２は、図１のＩＩ−ＩＩ線に沿った発光装置１０の縦断面図である。調色装置１は、発光装置１０および定電流電源８０を有し、発光装置１０は、基板１１、ＬＥＤ素子１２、樹脂枠１３および封止樹脂１４を有する。発光装置１０は、パッケージ化されていない複数のＬＥＤ素子（ＬＥＤダイ）１２が基板１１上に直接実装されたＣＯＢのＬＥＤモジュールであり、各種の照明装置のＬＥＤ光源として利用される。   FIG. 1 is a schematic configuration diagram of the toning device 1. 2 is a longitudinal sectional view of the light emitting device 10 taken along the line II-II in FIG. The toning device 1 includes a light emitting device 10 and a constant current power supply 80, and the light emitting device 10 includes a substrate 11, an LED element 12, a resin frame 13, and a sealing resin 14. The light emitting device 10 is a COB LED module in which a plurality of unpackaged LED elements (LED dies) 12 are directly mounted on a substrate 11, and is used as an LED light source for various lighting devices.

図３は、基板１１の上面図および縦断面図である。基板１１は、実装基板１１Ａと、実装基板１１Ａの上に重ね合わされた回路基板１１Ｂとで構成され、回路基板１１Ｂの上面には、一部の領域を除いて白色レジスト１９が設けられている。図４は、白色レジスト１９が取り除かれた基板１１の上面図および縦断面図である。図３の断面図は、図３の上面図内のＩＩＩ−ＩＩＩ線に沿った基板１１の切断面を示し、図４の断面図も、図４の上面図内のＩＶ−ＩＶ線に沿った基板１１の切断面を示す。   FIG. 3 is a top view and a longitudinal sectional view of the substrate 11. The substrate 11 includes a mounting substrate 11A and a circuit substrate 11B superimposed on the mounting substrate 11A, and a white resist 19 is provided on the upper surface of the circuit substrate 11B except for a part of the region. FIG. 4 is a top view and a longitudinal sectional view of the substrate 11 from which the white resist 19 has been removed. 3 shows a cut surface of the substrate 11 along the line III-III in the top view of FIG. 3, and the cross-sectional view of FIG. 4 also follows the line IV-IV in the top view of FIG. The cut surface of the board | substrate 11 is shown.

実装基板１１Ａは、例えば、耐熱性および放熱性に優れたアルミニウムで構成され、その上面に複数のＬＥＤ素子１２が実装される平坦な金属基板であり、数ｃｍ角程度の大きさの矩形の形状を有する。実装基板１１Ａは、ＬＥＤ素子１２および後述する蛍光体の粒子により発生した熱を放熱させる放熱基板としても機能する。なお、実装基板１１Ａの材質は、耐熱性と放熱性に優れたものであれば、例えば銅などの別の金属でもよい。   The mounting substrate 11A is made of, for example, aluminum excellent in heat resistance and heat dissipation, and is a flat metal substrate on which a plurality of LED elements 12 are mounted, and has a rectangular shape with a size of several cm square. Have The mounting substrate 11A also functions as a heat dissipation substrate that dissipates heat generated by the LED elements 12 and phosphor particles described later. The material of the mounting substrate 11A may be another metal such as copper as long as it is excellent in heat resistance and heat dissipation.

回路基板１１Ｂは、例えばガラスエポキシ基板などの絶縁性の基板であり、一例として、実装基板１１Ａと同じ大きさの矩形の形状を有する。回路基板１１Ｂは、端部が実装基板１１Ａの端部と合うように揃えられ、下面が例えば接着シートにより実装基板１１Ａの上面に貼り付けられて固定されている。図３および図４に示すように、回路基板１１Ｂの中央には、円形の開口部（貫通孔）１１１が形成されている。   The circuit board 11B is an insulating board such as a glass epoxy board, for example, and has a rectangular shape having the same size as the mounting board 11A as an example. The circuit board 11B is aligned so that the end thereof is aligned with the end of the mounting substrate 11A, and the lower surface is bonded and fixed to the upper surface of the mounting substrate 11A by, for example, an adhesive sheet. As shown in FIGS. 3 and 4, a circular opening (through hole) 111 is formed at the center of the circuit board 11B.

また、図４に示すように、回路基板１１Ｂの上面には、ＬＥＤ素子１２に電力を供給するための６個の配線パターン１７１〜１７６が設けられている。このうち、配線パターン１７１〜１７３は、図４における開口部１１１の上側半分を取り囲み、そこから回路基板１１Ｂの左上の角部に向かって延びている。配線パターン１７４〜１７６は、回路基板１１Ｂの中央に関して配線パターン１７１〜１７３と回転対称（点対称）な形状を有し、図４における開口部１１１の下側半分を取り囲み、そこから回路基板１１Ｂの右下の角部に向かって延びている。   As shown in FIG. 4, six wiring patterns 171 to 176 for supplying power to the LED elements 12 are provided on the upper surface of the circuit board 11B. Among these, the wiring patterns 171 to 173 surround the upper half of the opening 111 in FIG. 4 and extend from the upper half toward the upper left corner of the circuit board 11B. The wiring patterns 174 to 176 have a rotationally symmetric (point symmetry) shape with respect to the wiring patterns 171 to 173 with respect to the center of the circuit board 11B, and surround the lower half of the opening 111 in FIG. It extends toward the lower right corner.

図３に示すように、回路基板１１Ｂの上面には、左上および右下の向かい合う２つの角部に、白色レジスト１９が設けられておらず配線パターン１７１〜１７６が露出している６個の矩形部分がある。これらの矩形部分は、発光装置１０を外部電源に接続するための接続電極１７ａ〜１７ｃに相当する。接続電極１７ａ〜１７ｃは、配線パターン１７１，１７４の組、配線パターン１７２，１７５の組、および配線パターン１７３，１７６の組にそれぞれ対応している。発光装置１０には、配線パターン１７１〜１７６により３組（３対、３系統）の電極が設けられている。接続電極１７ａ〜１７ｃのそれぞれは、一方がアノード電極で他方がカソード電極となり、定電流電源８０に接続されている。以下では、接続電極１７ａ〜１７ｃを互いに区別しないときには、単に「接続電極１７」と表記する。   As shown in FIG. 3, on the upper surface of the circuit board 11B, six rectangles in which the white resist 19 is not provided and the wiring patterns 171 to 176 are exposed at two corners facing the upper left and lower right. There is a part. These rectangular portions correspond to connection electrodes 17a to 17c for connecting the light emitting device 10 to an external power source. The connection electrodes 17a to 17c correspond to a set of wiring patterns 171, 174, a set of wiring patterns 172, 175, and a set of wiring patterns 173, 176, respectively. The light emitting device 10 is provided with three sets (three pairs, three systems) of electrodes by wiring patterns 171 to 176. Each of the connection electrodes 17 a to 17 c is connected to a constant current power supply 80 with one being an anode electrode and the other being a cathode electrode. Hereinafter, when the connection electrodes 17a to 17c are not distinguished from each other, they are simply referred to as “connection electrodes 17”.

ＬＥＤ素子１２は、発光素子の一例であり、例えばＩｎＧａＮ系化合物半導体で構成され、発光スペクトルが４５０ｎｍ付近にピークをもつ青色系の半導体発光素子（青色ＬＥＤ）である。例えば、ＬＥＤ素子１２は上面に一対の素子電極を有し、ＬＥＤ素子１２の下面は、透明な絶縁性の接着剤などにより、開口部１１１内で露出した実装基板１１Ａの上面に固定されている。発光装置１０では、５個のＬＥＤ素子１２を１組として、６組の計３０個のＬＥＤ素子１２が、実装基板１１Ａに実装されている。同じ組のＬＥＤ素子１２の素子電極はボンディングワイヤ１８により相互に接続され、各組の端部に位置するＬＥＤ素子１２から出たボンディングワイヤ１８は、配線パターン１７１〜１７６のいずれかに接続されている。   The LED element 12 is an example of a light-emitting element, and is a blue semiconductor light-emitting element (blue LED) that is made of, for example, an InGaN-based compound semiconductor and has an emission spectrum having a peak near 450 nm. For example, the LED element 12 has a pair of element electrodes on the upper surface, and the lower surface of the LED element 12 is fixed to the upper surface of the mounting substrate 11A exposed in the opening 111 by a transparent insulating adhesive or the like. . In the light emitting device 10, a total of 30 LED elements 12 are mounted on the mounting substrate 11 </ b> A. The element electrodes of the LED elements 12 in the same set are connected to each other by bonding wires 18, and the bonding wires 18 coming out of the LED elements 12 located at the ends of each set are connected to any one of the wiring patterns 171 to 176. Yes.

図５は、ＬＥＤ素子１２の接続関係の例を示す図である。６組のＬＥＤ素子１２は、組ごとに、その組を構成する５個のＬＥＤ素子１２同士が互いに直列に接続されている。図５に示す符号ａ１，ａ２の組のＬＥＤ素子１２は接続電極１７ａに、符号ｂ１，ｂ２の組のＬＥＤ素子１２は接続電極１７ｂに、符号ｃ１，ｃ２の組のＬＥＤ素子１２は接続電極１７ｃに、それぞれ電気的に接続されている。   FIG. 5 is a diagram illustrating an example of the connection relationship of the LED elements 12. In each of the six sets of LED elements 12, the five LED elements 12 constituting the set are connected in series to each other. 5, the LED element 12 of the set a1 and a2 is connected to the connection electrode 17a, the LED element 12 of the set b1 and b2 is to the connection electrode 17b, and the LED element 12 of the set c1 and c2 is the connection electrode 17c. Are electrically connected to each other.

接続電極１７ａ〜１７ｃのうちの１つまたは複数が定電流電源８０に接続されることにより、発光装置１０では、それらの接続電極に対応する組のＬＥＤ素子１２に選択的に駆動電流を供給可能である。発光装置１０では、複数組の接続電極１７ａ〜１７ｃが設けられていることにより、対応する組のＬＥＤ素子１２に、予め定められた大きさの駆動電流が独立に供給される。後述するように、ａ１〜ｃ２の組のＬＥＤ素子１２による出射光の色度は互いに異なるので、発光装置１０では、所望の色度に応じて、ａ１〜ｃ２のうちの１つまたは複数の組のＬＥＤ素子１２が駆動される。   By connecting one or more of the connection electrodes 17a to 17c to the constant current power supply 80, the light emitting device 10 can selectively supply drive current to the LED elements 12 corresponding to the connection electrodes. It is. In the light emitting device 10, a plurality of sets of connection electrodes 17 a to 17 c are provided, so that a predetermined amount of driving current is independently supplied to the corresponding set of LED elements 12. As will be described later, since the chromaticities of the emitted light from the LED elements 12 in the sets a1 to c2 are different from each other, the light emitting device 10 has one or more sets of a1 to c2 depending on the desired chromaticity. LED element 12 is driven.

発光装置１０では、すべてのＬＥＤ素子１２が青色ＬＥＤであるため、同じ組を構成する複数のＬＥＤ素子１２は、いずれも同じ発光波長帯域を有する。ただし、必ずしも発光装置１０内のすべてのＬＥＤ素子１２が同じ発光波長帯域を有していなくてもよい。例えば、一部の組のＬＥＤ素子１２は、例えばＩｎＧａＮ系化合物半導体で構成され、発光スペクトルが５２０ｎｍ付近にピークをもつ緑色系の半導体発光素子（緑色ＬＥＤ）であってもよく、残りの組のＬＥＤ素子１２とは異なる発光波長帯域を有してもよい。この点は、以下で説明する他のいずれの発光装置についても同様である。   In the light emitting device 10, since all the LED elements 12 are blue LEDs, the plurality of LED elements 12 constituting the same set all have the same emission wavelength band. However, all the LED elements 12 in the light emitting device 10 do not necessarily have the same emission wavelength band. For example, some of the LED elements 12 may be green semiconductor light-emitting elements (green LEDs) made of, for example, an InGaN-based compound semiconductor and having an emission spectrum having a peak near 520 nm. The LED element 12 may have a different emission wavelength band. This is the same for any of the other light-emitting devices described below.

なお、組ごとに独立して駆動電流を供給できれば、ＬＥＤ素子１２の接続関係は図５に示したものとは異なっていてもよい。例えば、接続電極１７の組ごとにＬＥＤ素子１２が１組ずつ接続されていてもよいし、接続電極１７の組ごとに、接続されるＬＥＤ素子１２の組数が異なっていてもよい。また、ボンディングワイヤ１８を用いずに、半田バンプを用いて基板１１上に各ＬＥＤ素子１２をフリップチップ実装してもよい。   Note that the connection relationship of the LED elements 12 may be different from that shown in FIG. 5 as long as the drive current can be supplied independently for each group. For example, one set of LED elements 12 may be connected for each set of connection electrodes 17, or the number of sets of LED elements 12 to be connected may be different for each set of connection electrodes 17. Alternatively, the LED elements 12 may be flip-chip mounted on the substrate 11 using solder bumps without using the bonding wires 18.

樹脂枠１３は、例えば白色または無色透明の樹脂で構成された円形の枠体であり、封止樹脂１４の流出しを防止するためのダム材である。樹脂枠１３は、開口部１１１の縁を取り囲むように回路基板１１Ｂの上面に固定されている。このため、ＬＥＤ素子１２は、樹脂枠１３により囲まれる実装基板１１Ａ上の領域に実装されているとも言える。樹脂枠１３は、ＬＥＤ素子１２から側方に出射された光を、ＬＥＤ素子１２から見て基板１１とは反対側である発光装置１０の上方に向けて反射させる。   The resin frame 13 is a circular frame made of, for example, a white or colorless and transparent resin, and is a dam material for preventing the sealing resin 14 from flowing out. The resin frame 13 is fixed to the upper surface of the circuit board 11B so as to surround the edge of the opening 111. For this reason, it can be said that the LED element 12 is mounted in a region on the mounting substrate 11 </ b> A surrounded by the resin frame 13. The resin frame 13 reflects light emitted laterally from the LED element 12 toward the upper side of the light emitting device 10 on the side opposite to the substrate 11 when viewed from the LED element 12.

封止樹脂１４は、例えば、複数のＬＥＤ素子１２からの光により励起される黄色蛍光体１５と赤色蛍光体１６が分散混入された、エポキシ樹脂またはシリコン樹脂などの無色透明の樹脂である。封止樹脂１４は、樹脂枠１３により囲まれた実装基板１１Ａ上の領域を埋め尽くすように充填され、例えば半球状にモールド成型されて、基板１１上のすべてのＬＥＤ素子１２を組ごとに異なる厚さで一体的に被覆（封止）する。   The sealing resin 14 is, for example, a colorless and transparent resin such as an epoxy resin or a silicon resin in which a yellow phosphor 15 and a red phosphor 16 that are excited by light from the plurality of LED elements 12 are dispersed and mixed. The sealing resin 14 is filled so as to fill the region on the mounting substrate 11A surrounded by the resin frame 13, and is molded into a hemispherical shape, for example, so that all LED elements 12 on the substrate 11 are different for each group. Covering (sealing) integrally with the thickness.

発光装置１０では、図２に示すように、樹脂枠１３に近い外周部から基板１１の中央に近付くほど封止樹脂１４の厚さが大きくなる。このため、外周部のａ１とｃ２の組については、そのＬＥＤ素子１２の上方にある封止樹脂１４の厚さはそれぞれ同じであり、ａ１とｃ２の組よりも基板１１の中央に近いａ２とｃ１の組、さらにはｂ１とｂ２の組の方が、そのＬＥＤ素子１２の上方にある封止樹脂１４の厚さは大きい。これにより、発光装置１０では、ＬＥＤ素子１２の組ごとに、ＬＥＤ素子１２の直上における黄色蛍光体１５と赤色蛍光体１６を含有する樹脂層の厚さが異なるため、複数組のＬＥＤ素子１２のそれぞれを１組だけ発光させたときの封止樹脂１４からの出射光の色度は互いに異なる。なお、ａ１とｃ２の組のように、一部の組については、封止樹脂１４の厚さは同じであってもよい。   In the light emitting device 10, as shown in FIG. 2, the thickness of the sealing resin 14 increases as the distance from the outer peripheral portion near the resin frame 13 approaches the center of the substrate 11. For this reason, the thickness of the sealing resin 14 above the LED element 12 is the same for the pair of a1 and c2 on the outer peripheral part, and a2 and a2 closer to the center of the substrate 11 than the pair of a1 and c2 The thickness of the sealing resin 14 above the LED element 12 is larger in the set c1 and further in the set b1 and b2. Thereby, in the light-emitting device 10, since the thickness of the resin layer containing the yellow phosphor 15 and the red phosphor 16 immediately above the LED element 12 is different for each set of the LED elements 12, The chromaticities of the emitted light from the sealing resin 14 are different from each other when only one set is emitted. Note that the sealing resin 14 may have the same thickness for some of the sets, such as the set of a1 and c2.

黄色蛍光体１５は、ＬＥＤ素子１２からの青色光を励起光として吸収して黄色系の蛍光を発する粒子状の蛍光体材料である。例えば、黄色蛍光体１５には、ＹＡＧ（イットリウム・アルミニウム・ガーネット）系、デルビウム系、ストロンチウム系、リン酸塩系、ケイ酸塩系、アルミン酸塩系などの蛍光体が用いられる。   The yellow phosphor 15 is a particulate phosphor material that absorbs blue light from the LED element 12 as excitation light and emits yellowish fluorescence. For example, YAG (yttrium / aluminum / garnet) -based, derbium-based, strontium-based, phosphate-based, silicate-based, and aluminate-based phosphors are used for the yellow phosphor 15.

赤色蛍光体１６は、ＬＥＤ素子１２からの青色光を励起光として吸収して赤色光を発する粒子状の蛍光体材料である。例えば、赤色蛍光体１６には、Ｅｕ２＋（ユーロピウム）固溶のＣａＡｌＳｉＮ３（カルシウム・アルミニウム・シリコン三窒化物）蛍光体などが用いられる。 The red phosphor 16 is a particulate phosphor material that absorbs blue light from the LED element 12 as excitation light and emits red light. For example, as the red phosphor 16, a Eu2 + (europium) solid solution CaAlSiN 3 (calcium, aluminum, silicon trinitride) phosphor or the like is used.

このように、発光装置１０では、黄色蛍光体１５および赤色蛍光体１６が混入された封止樹脂１４により、青色ＬＥＤであるＬＥＤ素子１２が被覆されている。これにより、発光装置１０では、ＬＥＤ素子１２が発光すると、ＬＥＤ素子１２からの青色光と、それによって黄色蛍光体１５および赤色蛍光体１６が励起されることでそれぞれ得られる黄色光と赤色光とが混合して、白色光が得られる。なお、封止樹脂に混入させる蛍光体は２種類以上でなくてもよく、例えば、ＬＥＤ素子１２として青色ＬＥＤと緑色ＬＥＤの２種類を使用し、蛍光体として赤色蛍光体の１種類を使用してもよい。   As described above, in the light emitting device 10, the LED element 12 that is a blue LED is covered with the sealing resin 14 in which the yellow phosphor 15 and the red phosphor 16 are mixed. Thereby, in the light-emitting device 10, when the LED element 12 emits light, the blue light from the LED element 12, and the yellow light and the red light obtained by exciting the yellow phosphor 15 and the red phosphor 16, respectively, are obtained. Are mixed to obtain white light. Note that the phosphors to be mixed into the sealing resin may not be two or more types, for example, two types of blue LED and green LED are used as the LED element 12, and one type of red phosphor is used as the phosphor. May be.

定電流電源８０は、複数組の接続電極１７ａ〜１７ｃの少なくともいずれかに接続されて、複数組のＬＥＤ素子１２のうちで対応する組のＬＥＤ素子１２に駆動電流を供給する。これにより、調色装置１は、封止樹脂１４を通してその組のＬＥＤ素子１２に対応する色度の光を出射させる。   The constant current power supply 80 is connected to at least one of the plurality of sets of connection electrodes 17a to 17c, and supplies drive current to the corresponding set of LED elements 12 among the plurality of sets of LED elements 12. Thereby, the toning apparatus 1 emits light of chromaticity corresponding to the LED element 12 of the set through the sealing resin 14.

図６は、出射光の色度と出射光に含まれる青色光の強度との対応関係の例を示す表である。黄色蛍光体と赤色蛍光体の百分率は、それぞれ、封止樹脂１４中に含まれる蛍光体全体に対する黄色蛍光体１５および赤色蛍光体１６の重量比である。青色強度の百分率は、発光装置１０の出射光全体に対する波長４５０ｎｍの青色光の強度比である。色度の値は、ＣＩＥ（国際照明委員会）により規定されたｘ，ｙ座標の値である。図６の表は、黄色蛍光体１５と赤色蛍光体１６の配合比がそれぞれ異なる（１）〜（６）の場合について、例えば封止樹脂１４の厚さが異なる複数の発光装置１０を用意し、ＬＥＤ素子１２の駆動電流の大きさを固定して、各発光装置１０の出射光全体に対する青色光の強度比（青色強度）と出射光の色度とを測定することにより作成される。   FIG. 6 is a table showing an example of a correspondence relationship between the chromaticity of the emitted light and the intensity of the blue light included in the emitted light. The percentages of the yellow phosphor and the red phosphor are respectively the weight ratios of the yellow phosphor 15 and the red phosphor 16 with respect to the whole phosphor contained in the sealing resin 14. The percentage of blue intensity is the intensity ratio of blue light having a wavelength of 450 nm with respect to the entire light emitted from the light emitting device 10. The chromaticity value is an x, y coordinate value defined by the CIE (International Commission on Illumination). In the table of FIG. 6, for the cases (1) to (6) in which the blend ratios of the yellow phosphor 15 and the red phosphor 16 are different, for example, a plurality of light emitting devices 10 having different sealing resin 14 thicknesses are prepared. It is created by fixing the magnitude of the drive current of the LED element 12 and measuring the intensity ratio (blue intensity) of the blue light with respect to the entire emitted light of each light emitting device 10 and the chromaticity of the emitted light.

青色強度の大きさは、発光するＬＥＤ素子１２を覆う封止樹脂１４の厚さ、およびＬＥＤ素子１２の駆動電流の大きさにより変化する。例えば、封止樹脂１４の厚さが一定であれば、ＬＥＤ素子１２の駆動電流が大きくなるほど青色強度は高くなり、逆に、ＬＥＤ素子１２の駆動電流が小さくなるほど青色強度は低くなる。また、駆動電流の大きさが一定であれば、封止樹脂１４の厚さが薄くなるほど、黄色蛍光体１５と赤色蛍光体１６による励起光が発生しにくくなるため青色強度は高くなり、逆に、封止樹脂１４の厚さが厚くなるほど青色強度は低くなる。したがって、発光装置１０内で発光させるＬＥＤ素子１２の組を変えることは、青色強度を変化させることに対応する。   The magnitude of the blue intensity varies depending on the thickness of the sealing resin 14 covering the LED element 12 that emits light and the magnitude of the drive current of the LED element 12. For example, if the thickness of the sealing resin 14 is constant, the blue intensity increases as the drive current of the LED element 12 increases, and conversely, the blue intensity decreases as the drive current of the LED element 12 decreases. Further, if the magnitude of the drive current is constant, the blue intensity increases as the thickness of the sealing resin 14 decreases, and excitation light from the yellow phosphor 15 and the red phosphor 16 is less likely to be generated. As the thickness of the sealing resin 14 increases, the blue intensity decreases. Therefore, changing the set of LED elements 12 that emit light within the light emitting device 10 corresponds to changing the blue intensity.

図７は、発光装置１０の出射光のスペクトルの例を示す図である。グラフの横軸は波長λ（ｎｍ）を示し、縦軸は相対強度Ｌを示す。発光装置１０では、青色ＬＥＤであるＬＥＤ素子１２、黄色蛍光体１５および赤色蛍光体１６により生成される青色光（Ｂ）、黄色光（Ｙ）および赤色光（Ｒ）に対応して、波長４５０ｎｍ、５６０ｎｍおよび６７０ｎｍ付近に相対強度のピークが現れる。そこで、発光装置１０では、波長４５０ｎｍの青色光の相対強度が青色強度として用いられる。   FIG. 7 is a diagram illustrating an example of a spectrum of emitted light from the light emitting device 10. The horizontal axis of the graph indicates the wavelength λ (nm), and the vertical axis indicates the relative intensity L. In the light emitting device 10, the wavelength is 450 nm corresponding to the blue light (B), yellow light (Y), and red light (R) generated by the LED element 12, which is a blue LED, the yellow phosphor 15 and the red phosphor 16. Relative intensity peaks appear around 560 nm and 670 nm. Therefore, in the light emitting device 10, the relative intensity of blue light having a wavelength of 450 nm is used as the blue intensity.

図８は、図６に対応する色度図である。グラフの横軸は色度のｘ座標を示し、縦軸は色度のｙ座標を示す。（１）〜（６）で示す６本の直線は、それぞれ、図６に示す各配合比の場合において青色強度を変化させたときの色度の軌跡であり、各直線上に円または四角の記号で示した点は、図６に示した色度の値に対応する。また、グラフ中の８個の四角形は、ＡＮＳＩ（米国規格協会）Ｃ７８．３７７の規格で定められている相対色温度（ＣＣＴ）による白色の分類（２７００Ｋ〜６５００Ｋ）を示す。   FIG. 8 is a chromaticity diagram corresponding to FIG. The horizontal axis of the graph represents the x coordinate of chromaticity, and the vertical axis represents the y coordinate of chromaticity. Each of the six straight lines shown in (1) to (6) is a locus of chromaticity when the blue intensity is changed in the case of each blending ratio shown in FIG. 6, and a circle or a square is formed on each straight line. The points indicated by symbols correspond to the chromaticity values shown in FIG. In addition, eight squares in the graph indicate white classification (2700K to 6500K) based on relative color temperature (CCT) defined in ANSI (American Standards Association) C78.377 standard.

発光させるＬＥＤ素子１２の組を変えることで青色強度を変化させると、出射光の色度は、図８の色度図上で、黄色蛍光体１５と赤色蛍光体１６の配合比に応じて異なる直線状の軌跡を描いて変化する。このとき、色度の値は、青色強度が高くなるほどグラフの右上に、青色強度が低くなるほどグラフの左下に移動する。特に、蛍光体の配合比を図６の（１）〜（６）のいずれかに設定し、かつ青色強度を図６に示した範囲内で変化させれば、色度の軌跡は、ＡＮＳＩ２０１１で規定された各相対色温度（ＣＣＴ）の中心座標を通り、かつ１つの色温度に対応する四角形領域のほぼ左下から右上にわたって広がる。したがって、青色強度を調整することにより、蛍光体の配合比に対応する（１）〜（６）のいずれかの四角形領域の範囲内で、図８に示す各直線に沿って発光装置１０の出射光の色度を調整することが可能になる。   When the blue intensity is changed by changing the set of the LED elements 12 to emit light, the chromaticity of the emitted light varies depending on the blending ratio of the yellow phosphor 15 and the red phosphor 16 on the chromaticity diagram of FIG. It changes by drawing a linear trajectory. At this time, the chromaticity value moves to the upper right of the graph as the blue intensity increases, and to the lower left of the graph as the blue intensity decreases. In particular, if the blending ratio of the phosphor is set to any one of (1) to (6) in FIG. 6 and the blue intensity is changed within the range shown in FIG. It passes through the center coordinates of each specified relative color temperature (CCT) and extends from the lower left to the upper right of a rectangular area corresponding to one color temperature. Therefore, by adjusting the blue intensity, within the range of any one of the square regions (1) to (6) corresponding to the phosphor mixture ratio, the light emitting device 10 exits along each straight line shown in FIG. It becomes possible to adjust the chromaticity of the incident light.

特に、図８に（１）〜（６）で示す６本の直線上における各点のｘ座標およびｙ座標と各相対色温度（ＣＣＴ）の中心点のｘ座標およびｙ座標との差は、その中心点のｘ座標およびｙ座標の±２％の範囲内にある。したがって、ＬＥＤ素子１２として青色ＬＥＤを用いて、蛍光体の配合比を図６の（１）〜（６）のいずれかに設定し、かつ青色強度が図６に示した範囲内の値になるように各組のＬＥＤ素子１２の実装位置における封止樹脂１４の厚さを定めれば、各相対色温度（ＣＣＴ）の中心点から±２％の範囲内で、出射光の色度を調整することが可能になる。   In particular, the difference between the x coordinate and y coordinate of each point on the six straight lines indicated by (1) to (6) in FIG. 8 and the x coordinate and y coordinate of the center point of each relative color temperature (CCT) is as follows: It is within ± 2% of the x and y coordinates of the center point. Therefore, a blue LED is used as the LED element 12, the phosphor mixture ratio is set to any one of (1) to (6) in FIG. 6, and the blue intensity becomes a value within the range shown in FIG. Thus, if the thickness of the sealing resin 14 at the mounting position of each set of LED elements 12 is determined, the chromaticity of the emitted light is adjusted within a range of ± 2% from the center point of each relative color temperature (CCT). It becomes possible to do.

なお、色度の軌跡である直線の傾きは、ＬＥＤ素子１２の発光波長によって決まる。発光装置１０では、ＬＥＤ素子１２として青色ＬＥＤのみを使用するため、色度の調整が可能な範囲は色度図における１本の直線上に限定される。しかしながら、例えば、直列接続された一部の組のＬＥＤ素子１２を青色ＬＥＤとし、残りの組のＬＥＤ素子１２を緑色ＬＥＤとすれば、緑色強度（出射光全体に対する緑色光の強度比）を変化させることにより、図８に示すものとは異なる傾きの直線に沿って出射光の色度が変化する。したがって、ＬＥＤ素子１２として青色ＬＥＤと緑色ＬＥＤの２種類を使用する場合には、青色強度と緑色強度の両方を変化させることにより、色度図上の２次元領域内で色度を調整することが可能になる。   The slope of the straight line that is the locus of chromaticity is determined by the light emission wavelength of the LED element 12. In the light emitting device 10, since only the blue LED is used as the LED element 12, the range in which the chromaticity can be adjusted is limited to one straight line in the chromaticity diagram. However, for example, if a group of LED elements 12 connected in series is a blue LED, and the remaining group of LED elements 12 is a green LED, the green intensity (the ratio of the intensity of green light to the total emitted light) changes. By doing so, the chromaticity of the emitted light changes along a straight line having a different slope from that shown in FIG. Therefore, when two types of blue LED and green LED are used as the LED element 12, the chromaticity is adjusted within a two-dimensional region on the chromaticity diagram by changing both the blue intensity and the green intensity. Is possible.

図９は、発光装置１０の製造工程の例を示すフローチャートである。図１０および図１１は、発光装置１０の製造工程を説明するための上面図および縦断面図である。図１０の断面図は、図１０の上面図内のＸ−Ｘ線に沿った基板１１の切断面を示し、図１１の断面図も、図１１の上面図内のＸＩ−ＸＩ線に沿った基板１１の切断面を示す。   FIG. 9 is a flowchart illustrating an example of a manufacturing process of the light emitting device 10. 10 and 11 are a top view and a longitudinal sectional view for explaining a manufacturing process of the light emitting device 10. 10 shows a cut surface of the substrate 11 along the line XX in the top view of FIG. 10, and the sectional view of FIG. 11 also follows the line XI-XI in the top view of FIG. The cut surface of the board | substrate 11 is shown.

発光装置１０を製造するためには、まず、黄色蛍光体と赤色蛍光体の配合比が同じである封止樹脂により互いに異なる樹脂厚で青色ＬＥＤが封止された複数のＣＯＢの発光装置が用意される。それらの発光装置を定電流電源８０で駆動し、青色強度として波長４５０ｎｍの青色光の相対強度を測定することにより、樹脂厚と青色強度の対応関係が予め測定される（Ｓ１）。続いて、Ｓ１で得られた対応関係ならびに図６および図８に示す対応関係を参照して、所望の色度を与える青色強度に対応する樹脂厚が決定される（Ｓ２）。すなわち、複数組のＬＥＤ素子１２のそれぞれについて、各相対色温度（ＣＣＴ）の中心点を中心とするその中心点の色度値の±２％の範囲内に出射光の色度値のｘ座標およびｙ座標が収まるように、封止樹脂１４の厚さが定められる。   In order to manufacture the light emitting device 10, first, a plurality of COB light emitting devices in which blue LEDs are sealed with different resin thicknesses by a sealing resin having the same blending ratio of the yellow phosphor and the red phosphor are prepared. Is done. These light emitting devices are driven by a constant current power source 80, and the relative intensity of blue light having a wavelength of 450 nm is measured as blue intensity, whereby the correspondence between the resin thickness and the blue intensity is measured in advance (S1). Subsequently, with reference to the correspondence obtained in S1 and the correspondence shown in FIGS. 6 and 8, the resin thickness corresponding to the blue intensity giving the desired chromaticity is determined (S2). That is, for each of the plurality of sets of LED elements 12, the x coordinate of the chromaticity value of the emitted light is within a range of ± 2% of the chromaticity value of the center point around the center point of each relative color temperature (CCT). And the thickness of the sealing resin 14 is determined so that the y-coordinates can be accommodated.

その後で、図１０に示すように、開口部１１１内で露出した実装基板１１Ａの円形領域に複数のＬＥＤ素子１２が実装され、独立して駆動電流が供給される組ごとに、それらのＬＥＤ素子１２がボンディングワイヤ１８で電気的に接続される（Ｓ３）。図示した例では、３０個のＬＥＤ素子１２が実装され、それらが５個ずつ直列接続され、６組のＬＥＤ素子１２の列が、配線パターン１７１，１７４の組、配線パターン１７２，１７５の組、および配線パターン１７３，１７６の組の間に接続される。   Thereafter, as shown in FIG. 10, each LED element 12 is mounted in a circular area of the mounting substrate 11 </ b> A exposed in the opening 111, and each LED element 12 is independently supplied with a drive current. 12 are electrically connected by the bonding wire 18 (S3). In the illustrated example, 30 LED elements 12 are mounted, and 5 LED elements 12 are connected in series, and six sets of LED elements 12 are divided into a set of wiring patterns 171, 174, a set of wiring patterns 172, 175, And connected between a set of wiring patterns 173 and 176.

次に、図１１に示すように、開口部１１１の縁を取り囲むように、円環状の樹脂枠１３が回路基板１１Ｂの上面に固定される（Ｓ４）。そして、黄色蛍光体１５と赤色蛍光体１６が規定の配合比で混入された封止樹脂１４が、樹脂枠１３により囲まれた実装基板１１Ａ上の領域を埋め尽くすように充填され、複数組のＬＥＤ素子１２が組ごとに、Ｓ２で決定された厚さで封止される（Ｓ５）。以上の工程により、図１および図２に示す発光装置１０が得られる。   Next, as shown in FIG. 11, the annular resin frame 13 is fixed to the upper surface of the circuit board 11B so as to surround the edge of the opening 111 (S4). Then, the sealing resin 14 in which the yellow phosphor 15 and the red phosphor 16 are mixed in a prescribed blending ratio is filled so as to fill the region on the mounting substrate 11A surrounded by the resin frame 13, and a plurality of sets The LED elements 12 are sealed for each group with the thickness determined in S2 (S5). Through the above steps, the light emitting device 10 shown in FIGS. 1 and 2 is obtained.

図１２は、出射光の色度と出射光に含まれる青色光の強度との対応関係の別の例を示す表である。封止樹脂１４に混入させる蛍光体は黄色蛍光体と赤色蛍光体に限らず、他の組合せでもよい。図１２では、黄色蛍光体を緑色蛍光体に替え、緑色蛍光体と赤色蛍光体の配合比を（１）〜（６）に示す通りに変化させて図６の表と同様に作成された、出射光の色度と出射光に含まれる青色光の強度との対応関係の例を示している。緑色蛍光体は、ＬＥＤ素子１２からの青色光を励起光として吸収して緑色光を発する、例えば（ＢａＳｒ）２ＳｉＯ４：Ｅｕ２＋などの粒子状の蛍光体材料である。緑色蛍光体と赤色蛍光体の百分率は、それぞれ、封止樹脂１４中に含まれる蛍光体全体に対する緑色蛍光体および赤色蛍光体の重量比である。また、青色強度と色度の値の定義は、図６のときと同じである。 FIG. 12 is a table showing another example of the correspondence relationship between the chromaticity of the emitted light and the intensity of the blue light included in the emitted light. The phosphor mixed in the sealing resin 14 is not limited to the yellow phosphor and the red phosphor, and other combinations may be used. In FIG. 12, the yellow phosphor was changed to the green phosphor, and the green phosphor and the red phosphor were mixed in the same ratio as shown in (1) to (6), and the same as the table of FIG. An example of the correspondence between the chromaticity of the emitted light and the intensity of blue light included in the emitted light is shown. The green phosphor is a particulate phosphor material such as (BaSr) 2 SiO 4 : Eu 2+ that emits green light by absorbing blue light from the LED element 12 as excitation light. The percentages of the green phosphor and the red phosphor are respectively the weight ratios of the green phosphor and the red phosphor with respect to the whole phosphor contained in the sealing resin 14. The definitions of the values of blue intensity and chromaticity are the same as in FIG.

図１３は、図１２に対応する色度図である。グラフの横軸は色度のｘ座標を示し、縦軸は色度のｙ座標を示す。（１）〜（６）で示す６本の直線は、それぞれ、図１２に示す各配合比の場合において青色強度を変化させたときの色度の軌跡であり、各直線上に円または四角の記号で示した点は、図１２に示した色度の値に対応する。また、グラフ中の１２個の四角形は、ＡＮＳＩ（米国規格協会）Ｃ７８．３７７の規格で定められている相対色温度（ＣＣＴ）による白色の分類（２７００Ｋ〜６５００Ｋ）を示す。   FIG. 13 is a chromaticity diagram corresponding to FIG. The horizontal axis of the graph represents the x coordinate of chromaticity, and the vertical axis represents the y coordinate of chromaticity. The six straight lines shown in (1) to (6) are chromaticity trajectories when the blue intensity is changed in the case of each blending ratio shown in FIG. 12, and a circle or a square is formed on each straight line. The points indicated by symbols correspond to the chromaticity values shown in FIG. Further, twelve squares in the graph indicate white classification (2700K to 6500K) based on relative color temperature (CCT) defined in ANSI (American National Standards Institute) C78.377 standard.

黄色蛍光体に代えて緑色蛍光体を使用した場合にも、図８の場合と同様に、発光させるＬＥＤ素子１２の組を変えることで青色強度を変化させると、出射光の色度は、図１３の色度図上で緑色蛍光体と赤色蛍光体の配合比に応じて異なる直線状の軌跡を描いて変化する。蛍光体の配合比が図１２の（１）〜（４）の場合については、青色強度を図１２に示した範囲内で変化させることにより、色度の軌跡は、ＡＮＳＩ２０１１で規定された各相対色温度（ＣＣＴ）の中心座標を通り、かつ１つの色温度に対応する四角形領域のほぼ左下から右上にわたって広がる。しかしながら、緑色蛍光体を使用した場合には、蛍光体の配合比が図１２の（５）と（６）の場合については、色度の軌跡は、３０００Ｋと２７００Ｋの四角形領域において、それぞれ、ほぼ中心から左下の限られた範囲にのみ広がる。したがって、緑色蛍光体と赤色蛍光体を使用した発光装置では、蛍光体の配合比に対応する（１）〜（６）のいずれかの四角形領域の範囲内で、図１３に示す各直線に沿って出射光の色度を調整することが可能になる。   Even when a green phosphor is used instead of the yellow phosphor, as in the case of FIG. 8, when the blue intensity is changed by changing the set of LED elements 12 to emit light, the chromaticity of the emitted light is On the chromaticity diagram of 13, it changes while drawing a different linear locus according to the blending ratio of the green phosphor and the red phosphor. In the case where the blending ratio of the phosphors is (1) to (4) in FIG. 12, by changing the blue intensity within the range shown in FIG. It passes through the center coordinates of the color temperature (CCT) and spreads from the lower left to the upper right of the rectangular area corresponding to one color temperature. However, when the green phosphor is used, the chromaticity trajectories in the square regions of 3000K and 2700K are almost equal in the cases where the blending ratio of the phosphors is (5) and (6) in FIG. It spreads only in a limited range from the center to the lower left. Therefore, in the light emitting device using the green phosphor and the red phosphor, along each straight line shown in FIG. 13 within the range of any one of (1) to (6) corresponding to the blending ratio of the phosphors. Thus, the chromaticity of the emitted light can be adjusted.

図１４は、別の発光装置２０の上面図および縦断面図である。図１４の断面図は、図１４の上面図内のＸＩＶ−ＸＩＶ線に沿った発光装置２０の切断面を示す。発光装置２０は、基板２１、ＬＥＤ素子１２、樹脂枠２３および封止樹脂２４を有し、封止樹脂２４には黄色蛍光体１５と赤色蛍光体１６が混入されている。発光装置２０の構成は、基板２１と封止樹脂２４の形状を除いて、発光装置１０のものと同様である。   FIG. 14 is a top view and a longitudinal sectional view of another light emitting device 20. The cross-sectional view of FIG. 14 shows a cut surface of the light emitting device 20 along the line XIV-XIV in the top view of FIG. The light emitting device 20 includes a substrate 21, an LED element 12, a resin frame 23, and a sealing resin 24, and a yellow phosphor 15 and a red phosphor 16 are mixed in the sealing resin 24. The configuration of the light emitting device 20 is the same as that of the light emitting device 10 except for the shapes of the substrate 21 and the sealing resin 24.

基板２１は、実装基板２１Ａと、回路基板２１Ｂとで構成される。実装基板２１Ａは、アルミニウムなどで構成された矩形の金属基板である。回路基板２１Ｂは、厚さが一様な矩形の絶縁基板であり、円形の開口部２１１を有し、実装基板２１Ａの上面に固定されている。回路基板２１Ｂは発光装置１０の回路基板１１Ｂと同じものであるが、実装基板２１Ａは、実装基板１１Ａとは異なり、開口部２１１内で露出した部分の上面に段差が形成されていることにより、鉛直方向の高さが互いに異なる複数の水平面を有する。図１４では、段差が３段であり、高さが３段階で異なる水平面２２１〜２２３が形成された場合の例を示している。   The board 21 includes a mounting board 21A and a circuit board 21B. The mounting substrate 21A is a rectangular metal substrate made of aluminum or the like. The circuit board 21B is a rectangular insulating board having a uniform thickness, has a circular opening 211, and is fixed to the upper surface of the mounting board 21A. The circuit board 21B is the same as the circuit board 11B of the light emitting device 10, but the mounting board 21A is different from the mounting board 11A in that a step is formed on the upper surface of the exposed part in the opening 211. It has several horizontal surfaces from which the height of a perpendicular direction mutually differs. FIG. 14 shows an example in which the level difference is three steps, and different horizontal surfaces 221 to 223 are formed in three steps.

発光装置２０のＬＥＤ素子１２は、開口部２１１内で露出した実装基板２１Ａの上面において、互いに異なる高さの位置に実装されている。例えば、発光装置２０も、５個のＬＥＤ素子１２を１組として、６組の計３０個のＬＥＤ素子１２を有し、直列接続された各組のＬＥＤ素子１２は、実装基板２１Ａにおける同じ高さの水平面に配置されている。より正確には、図１４の断面図の右側と左側における水平面２２１には、それぞれ、符号ａ１，ｃ２で示す２組のＬＥＤ素子１２が配置されている。また、水平面２２１よりも図の中央側で水平面２２１よりも１段低い２つの水平面２２２には、それぞれ、符号ａ２，ｃ１で示す２組のＬＥＤ素子１２が配置されている。さらに、図の中央における最も低い水平面２２３には、符号ｂ１，ｂ２で示す２組のＬＥＤ素子１２が配置されている。   The LED elements 12 of the light emitting device 20 are mounted at different height positions on the upper surface of the mounting substrate 21 </ b> A exposed in the opening 211. For example, the light-emitting device 20 also includes six LED elements 12 in a set of 30 LED elements 12 in total, and each set of LED elements 12 connected in series has the same height on the mounting substrate 21A. It is arranged on the horizontal plane. More precisely, two sets of LED elements 12 indicated by reference numerals a1 and c2 are arranged on the horizontal plane 221 on the right and left sides of the cross-sectional view of FIG. In addition, two sets of LED elements 12 indicated by reference numerals a2 and c1 are arranged on two horizontal planes 222 that are one step lower than the horizontal plane 221 on the center side in the figure than the horizontal plane 221. Further, two sets of LED elements 12 indicated by reference numerals b1 and b2 are arranged on the lowest horizontal plane 223 in the center of the figure.

発光装置１０では、図２に示すように、樹脂枠１３に近い外周部から中央に近付くほど封止樹脂１４を上方に突出させることで、ＬＥＤ素子１２の組ごとに封止樹脂１４の厚さを変化させている。一方、発光装置２０では、図１４に示すように、基板２１は外周部から中央に近付くほど低くなる段差を有し、封止樹脂２４の上面は１つの水平面になっている。このように、基板２１の厚さを階段状に変化させて、ＬＥＤ素子１２の組ａ１〜ｃ２のそれぞれを互いに異なる高さに実装し、かつ独立に駆動できるように接続してもよい。そして、封止樹脂２４の上面が水平になるようにＬＥＤ素子１２を封止することで、ＬＥＤ素子１２の組ごとに、ＬＥＤ素子１２の直上における封止樹脂１４の厚さを変化させてもよい。   In the light emitting device 10, as shown in FIG. 2, the thickness of the sealing resin 14 for each set of the LED elements 12 is caused by protruding the sealing resin 14 upward as it approaches the center from the outer peripheral portion close to the resin frame 13. Is changing. On the other hand, in the light emitting device 20, as shown in FIG. 14, the substrate 21 has a step that becomes lower from the outer peripheral portion toward the center, and the upper surface of the sealing resin 24 is one horizontal plane. As described above, the thickness of the substrate 21 may be changed stepwise, and the sets a1 to c2 of the LED elements 12 may be mounted at different heights and connected so that they can be driven independently. And by sealing LED element 12 so that the upper surface of sealing resin 24 may become horizontal, even if the thickness of sealing resin 14 just above LED element 12 is changed for every group of LED element 12, Good.

図１５は、さらに別の発光装置３０の上面図および縦断面図である。図１５の断面図は、図１５の上面図内のＸＶ−ＸＶ線に沿った発光装置３０の切断面を示す。発光装置３０は、基板３１、ＬＥＤ素子１２、樹脂枠３３および封止樹脂３４を有し、封止樹脂３４には黄色蛍光体１５と赤色蛍光体１６が混入されている。発光装置３０の構成は、基板３１、樹脂枠３３および封止樹脂３４の形状を除いて、発光装置１０のものと同様である。   FIG. 15 is a top view and a longitudinal sectional view of still another light emitting device 30. The cross-sectional view of FIG. 15 shows a cut surface of the light emitting device 30 along line XV-XV in the top view of FIG. The light emitting device 30 includes a substrate 31, an LED element 12, a resin frame 33, and a sealing resin 34, and the yellow phosphor 15 and the red phosphor 16 are mixed in the sealing resin 34. The configuration of the light emitting device 30 is the same as that of the light emitting device 10 except for the shapes of the substrate 31, the resin frame 33, and the sealing resin 34.

図１５に示すように、発光装置３０では、樹脂枠３３は矩形の枠体である。基板３１は実装基板３１Ａと回路基板３１Ｂとで構成され、これらの構成は、樹脂枠３３に合わせて回路基板３１Ｂの開口部３１１が矩形になっている点を除いて、発光装置１０の実装基板１１Ａおよび回路基板１１Ｂと同じである。また、封止樹脂３４は、樹脂枠３３により囲まれた実装基板３１Ａ上の領域を埋め尽くすように充填され、上方から見ると矩形の形状を有する。   As shown in FIG. 15, in the light emitting device 30, the resin frame 33 is a rectangular frame. The substrate 31 includes a mounting substrate 31A and a circuit substrate 31B, and these configurations are the mounting substrate of the light emitting device 10 except that the opening 311 of the circuit substrate 31B is rectangular according to the resin frame 33. 11A and circuit board 11B. The sealing resin 34 is filled so as to fill the region on the mounting substrate 31A surrounded by the resin frame 33, and has a rectangular shape when viewed from above.

発光装置３０では、符号ａ１〜ｃ２で示す５組のＬＥＤ素子１２は、実装基板３１Ａの水平な実装面上に実装されており、その実装面からの樹脂枠３３の高さは、図の右側よりも図の左側の方が高くなっている。すなわち、実装面からの樹脂枠３３の高さは、基板３１の一端部側（図の左側）からその一端部に対向する基板３１の他端部側（図の右側）に向けて徐々に小さくなっている。また、図の左側における封止樹脂３４の厚さが最も大きく、図の右側に向かうにつれて厚さが小さくなることにより、封止樹脂３４の上面は傾斜している。すなわち、封止樹脂３４は、基板３１の一端部側からその一端部に対向する基板３１の他端部側にかけて厚さが次第に減少するように複数組のＬＥＤ素子１２を封止する。このようにして、独立に駆動可能なＬＥＤ素子１２の組の間で、ＬＥＤ素子１２の直上における封止樹脂の厚さを変化させてもよい。   In the light emitting device 30, the five sets of LED elements 12 indicated by reference numerals a1 to c2 are mounted on the horizontal mounting surface of the mounting substrate 31A, and the height of the resin frame 33 from the mounting surface is the right side of the figure. It is higher on the left side of the figure. That is, the height of the resin frame 33 from the mounting surface is gradually decreased from one end portion side (left side in the figure) of the substrate 31 toward the other end portion side (right side in the figure) of the substrate 31 facing the one end portion. It has become. Moreover, the thickness of the sealing resin 34 on the left side of the drawing is the largest, and the thickness decreases toward the right side of the drawing, whereby the upper surface of the sealing resin 34 is inclined. That is, the sealing resin 34 seals the plurality of sets of LED elements 12 so that the thickness gradually decreases from one end of the substrate 31 to the other end of the substrate 31 facing the one end. In this manner, the thickness of the sealing resin immediately above the LED element 12 may be changed between the sets of LED elements 12 that can be driven independently.

図１６は、さらに別の発光装置４０の上面図および縦断面図である。図１６の断面図は、図１６の上面図内のＸＶＩ−ＸＶＩ線に沿った発光装置４０の切断面を示す。発光装置４０は、基板４１、ＬＥＤ素子１２、樹脂枠４３および封止樹脂４４を有し、封止樹脂４４には黄色蛍光体１５と赤色蛍光体１６が混入されている。発光装置４０の構成は、基板４１、樹脂枠４３および封止樹脂４４の形状を除いて、発光装置１０のものと同様である。   FIG. 16 is a top view and a longitudinal sectional view of still another light emitting device 40. The sectional view of FIG. 16 shows a cut surface of the light emitting device 40 along the line XVI-XVI in the top view of FIG. The light emitting device 40 includes a substrate 41, the LED element 12, a resin frame 43, and a sealing resin 44, and the yellow phosphor 15 and the red phosphor 16 are mixed in the sealing resin 44. The configuration of the light emitting device 40 is the same as that of the light emitting device 10 except for the shapes of the substrate 41, the resin frame 43, and the sealing resin 44.

基板４１は、実装基板４１Ａと、回路基板４１Ｂとで構成される。実装基板４１Ａは、アルミニウムなどで構成された矩形の金属基板である。回路基板４１Ｂは、厚さが一様な矩形の絶縁基板であり、円形の開口部４１１を有し、実装基板４１Ａの上面に固定されている。回路基板４１Ｂは発光装置１０の回路基板１１Ｂと同じものであるが、図１６に示すように、ＬＥＤ素子１２の実装面である実装基板４１Ａの上面は、実装基板１１Ａとは異なり、図の左側よりも右側の方が低くなることで、水平面に対して傾斜している。発光装置４０のＬＥＤ素子１２は、開口部４１１内で露出した実装基板４１Ａの上面（傾斜面）に実装されている。   The board 41 includes a mounting board 41A and a circuit board 41B. The mounting substrate 41A is a rectangular metal substrate made of aluminum or the like. The circuit board 41B is a rectangular insulating board having a uniform thickness, has a circular opening 411, and is fixed to the upper surface of the mounting board 41A. The circuit board 41B is the same as the circuit board 11B of the light emitting device 10. However, as shown in FIG. 16, the upper surface of the mounting board 41A, which is the mounting surface of the LED element 12, is different from the mounting board 11A, It is inclined with respect to the horizontal plane because the right side is lower than the horizontal plane. The LED element 12 of the light emitting device 40 is mounted on the upper surface (inclined surface) of the mounting substrate 41 </ b> A exposed in the opening 411.

また、樹脂枠４３は、樹脂枠１３と同様に円形の枠体であるが、実装面からの樹脂枠４３の高さは、樹脂枠４３の上端が全周にわたって同じ水平面上に位置するように、水平面に対する実装面上の高さが低い位置ほど大きくなっている。そして、封止樹脂４４は、下端が基板４１の傾斜した実装面に沿って広がり、かつ上端が１つの水平面になるように成型されている。発光装置４０では、このように複数のＬＥＤ素子１２を封止することで、図の左側から図の右側に向かうにつれて封止樹脂４４の厚さが大きくなる。このようにして、独立に駆動可能なＬＥＤ素子１２の組の間で、ＬＥＤ素子１２の直上における封止樹脂４４の厚さを変化させてもよい。   The resin frame 43 is a circular frame similar to the resin frame 13, but the height of the resin frame 43 from the mounting surface is such that the upper end of the resin frame 43 is positioned on the same horizontal plane over the entire circumference. The lower the height on the mounting surface with respect to the horizontal plane, the larger the position. The sealing resin 44 is molded such that the lower end spreads along the inclined mounting surface of the substrate 41 and the upper end becomes one horizontal plane. In the light emitting device 40, by sealing the plurality of LED elements 12, the thickness of the sealing resin 44 increases from the left side of the figure toward the right side of the figure. In this manner, the thickness of the sealing resin 44 immediately above the LED elements 12 may be changed between the sets of LED elements 12 that can be driven independently.

図１７〜図２０は、それぞれ、さらに別の発光装置１０’〜４０’の縦断面図である。発光装置１０’〜４０’は、基板の構成を除いて、それぞれ、上記の発光装置１０〜４０と同様の構成を有する。発光装置１０’〜４０’の基板１１’〜４１’は、実装基板と回路基板とが貼り合わされたものではなく、いずれも、１枚のセラミック基板である。基板１１’〜４１’は、上記した配線パターン１７１〜１７６および接続電極１７と同様のものが上面に形成され、かつＬＥＤ素子１２が実装される平坦な基板であり、実装基板と回路基板を兼ねている。このように、発光装置の基板には、開口部がないセラミック基板を用いてもよい。   17 to 20 are longitudinal sectional views of further light emitting devices 10 'to 40', respectively. The light emitting devices 10 ′ to 40 ′ have the same configuration as the above light emitting devices 10 to 40 except for the configuration of the substrate. The substrates 11 ′ to 41 ′ of the light emitting devices 10 ′ to 40 ′ are not a laminate of a mounting substrate and a circuit substrate, but are all a single ceramic substrate. The substrates 11 ′ to 41 ′ are flat substrates on which the same wiring patterns 171 to 176 and connection electrodes 17 as described above are formed and on which the LED elements 12 are mounted. The substrates 11 ′ to 41 ′ also serve as a mounting substrate and a circuit substrate. ing. As described above, a ceramic substrate having no opening may be used as the substrate of the light emitting device.

また、発光装置１０’，２０’では、複数のＬＥＤ素子１２は、図１７および図１８に符号ａ〜ｃで示す３組に分かれて３組の接続電極１７に別々に接続されており、これらの組は互いに独立に駆動可能である。発光装置３０’，４０’では、複数のＬＥＤ素子１２は、図１９および図２０に符号ａ，ｂで示す２組に分かれて２組の接続電極１７に別々に接続されており、これらの組は互いに独立に駆動可能である。このように、ＬＥＤ素子１２の組数は２組以上であれば何組でもよく、実装されるＬＥＤ素子１２の総数も何個でもよい。また、接続電極１７の組数も、２組以上であれば何組でもよい。   Further, in the light emitting devices 10 ′ and 20 ′, the plurality of LED elements 12 are divided into three sets indicated by reference numerals a to c in FIGS. 17 and 18 and are separately connected to the three sets of connection electrodes 17, respectively. Can be driven independently of each other. In the light emitting devices 30 ′ and 40 ′, the plurality of LED elements 12 are divided into two sets indicated by reference numerals a and b in FIG. 19 and FIG. 20 and are separately connected to the two sets of connection electrodes 17, respectively. Can be driven independently of each other. As described above, the number of LED elements 12 may be any number as long as it is two or more, and the total number of LED elements 12 to be mounted may be any number. Further, the number of connection electrodes 17 may be any number as long as it is two or more.

以上説明したように、発光装置１０（あるいは発光装置２０〜４０，１０’〜４０’）では、独立に駆動するＬＥＤ素子１２の組ごとに封止樹脂１４（封止樹脂２４〜４４）の厚さが異なり、所望の色度に応じて、発光するＬＥＤ素子１２の組が切り変えられる。これにより、調色装置１は、ＡＮＳＩ２０１１で規定された同じ色温度の範囲内で発光装置（ＬＥＤパッケージ）の色度を変化させる調色機能を実現可能である。また、このような調色機能を有することにより、発光装置１０〜４０，１０’〜４０’では、温度変化に起因する色度シフトを補正することも可能になる。したがって、発光装置１０〜４０，１０’〜４０’では、温度変化による色度シフトを考慮した設計が不要になるため、製造工程がより簡略化される。   As described above, in the light emitting device 10 (or the light emitting devices 20 to 40, 10 ′ to 40 ′), the thickness of the sealing resin 14 (sealing resins 24 to 44) for each set of LED elements 12 that are driven independently. The sets of LED elements 12 that emit light are switched according to the desired chromaticity. Thereby, the toning apparatus 1 can implement a toning function that changes the chromaticity of the light emitting device (LED package) within the same color temperature range defined by ANSI2011. Further, by having such a color matching function, the light emitting devices 10 to 40 and 10 ′ to 40 ′ can correct a chromaticity shift caused by a temperature change. Therefore, in the light emitting devices 10 to 40 and 10 ′ to 40 ′, the design in consideration of the chromaticity shift due to the temperature change is not required, so that the manufacturing process is further simplified.

図２１および図２２は、ＬＥＤ素子１２の接続関係の別の例を示す図である。これらの図では、直列接続された３個または４個のＬＥＤ素子１２を１組として、符号ａ〜ｃの３組のＬＥＤ素子１２が並列接続された場合の例を示している。符号ａ，ｃは封止樹脂の厚さが相対的に薄い領域に実装されたＬＥＤ素子１２の組を、符号ｂは符号ａ，ｃの領域よりも封止樹脂の厚さが厚い領域に実装されたＬＥＤ素子１２の組をそれぞれ示している。上記した発光装置１０内の複数のＬＥＤ素子１２は、図２１または図２２に示すように定電流電源８０に接続してもよい。   21 and 22 are diagrams showing another example of the connection relationship of the LED elements 12. In these drawings, three or four LED elements 12 connected in series are regarded as one set, and an example in which three sets of LED elements 12 having a symbol a to c are connected in parallel is shown. Symbols a and c indicate a set of LED elements 12 mounted in a region where the sealing resin is relatively thin, and symbol b indicates a region where the sealing resin is thicker than the regions a and c. Each set of LED elements 12 is shown. The plurality of LED elements 12 in the light emitting device 10 described above may be connected to a constant current power source 80 as shown in FIG. 21 or FIG.

図２１において、符号ａ，ｃの組はそれぞれ４個のＬＥＤ素子１２で構成される。一方、符号ｂの組では、ＬＥＤ素子１２の個数は１個少ない３個であり、代わりに１個の抵抗がＬＥＤ素子１２に直列に接続されている。図２１の例では、定電流電源８０（可変定電流回路）からの電流Ｉｆの大きさに応じて、符号ａ〜ｃのうちの１つまたは複数の組のＬＥＤ素子１２が駆動される。   In FIG. 21, each set of symbols a and c is composed of four LED elements 12. On the other hand, in the group of the symbol b, the number of LED elements 12 is three, which is one less, and one resistor is connected in series to the LED element 12 instead. In the example of FIG. 21, one or a plurality of sets of LED elements 12 among the symbols a to c are driven according to the magnitude of the current If from the constant current power supply 80 (variable constant current circuit).

図２２において、符号ａの組は４個のＬＥＤ素子１２で構成される。符号ｂの組は３個のＬＥＤ素子１２で構成され、このＬＥＤ素子１２にはデプレッション型ＦＥＴと抵抗が直列に接続されている。符号ｃの組は３個のＬＥＤ素子１２で構成され、このＬＥＤ素子１２には抵抗が直列に接続されている。図２２の例でも、定電流電源８０（可変定電流回路）からの電流Ｉｆの大きさに応じて、符号ａ〜ｃのうちの１つまたは複数の組のＬＥＤ素子１２が駆動される。   In FIG. 22, the set of symbol a is composed of four LED elements 12. A set of symbols b includes three LED elements 12, and a depletion type FET and a resistor are connected in series to the LED element 12. The set of the code | symbol c is comprised by the three LED elements 12, and resistance is connected to this LED element 12 in series. Also in the example of FIG. 22, one or a plurality of sets of LED elements 12 among the symbols a to c are driven according to the magnitude of the current If from the constant current power supply 80 (variable constant current circuit).

また、上記した発光装置２０〜４０，１０’〜４０’についても、封止樹脂の厚さが相対的に薄い領域に実装されたＬＥＤ素子１２の組と、封止樹脂の厚さが相対的に厚い領域に実装されたＬＥＤ素子１２の組とを、図２１または図２２に示すように接続してもよい。   In addition, for the light emitting devices 20 to 40 and 10 ′ to 40 ′ described above, the set of the LED elements 12 mounted in the region where the thickness of the sealing resin is relatively thin and the thickness of the sealing resin are relatively A pair of LED elements 12 mounted in a thick region may be connected as shown in FIG. 21 or FIG.

１ 調色装置
１０，１０’，２０，２０’，３０，３０’，４０，４０’ 発光装置
１１，１１’，２１，２１’，３１，３１’，４１，４１’ 基板
１１Ａ，２１Ａ，３１Ａ，４１Ａ 実装基板
１１Ｂ，２１Ｂ，３１Ｂ，４１Ｂ 回路基板
１２ ＬＥＤ素子
１３，２３，３３，４３ 樹脂枠
１４，２４，３４，４４ 封止樹脂
１５ 黄色蛍光体
１６ 赤色蛍光体
１７，１７ａ，１７ｂ，１７ｃ 接続電極
８０ 定電流電源 1 Toning device 10, 10 ', 20, 20', 30, 30 ', 40, 40' Light emitting device 11, 11 ', 21, 21,', 31, 31 ', 41, 41' Substrate 11A, 21A, 31A , 41A Mounting board 11B, 21B, 31B, 41B Circuit board 12 LED element 13, 23, 33, 43 Resin frame 14, 24, 34, 44 Sealing resin 15 Yellow phosphor 16 Red phosphor 17, 17a, 17b, 17c Connection electrode 80 Constant current power supply

Claims (9)

基板と、
前記基板上に固定された樹脂枠と、
前記樹脂枠により囲まれる前記基板上の領域に実装された複数組の発光素子であって、組ごとに、当該組を構成する発光素子同士が互いに直列接続された複数組の発光素子と、
前記基板上に設けられ、前記複数組の発光素子に電気的に接続された複数組の接続電極であって、前記複数組の発光素子のうちで一部の組の発光素子に選択的に駆動電流を供給可能な複数組の接続電極と、
前記複数組の発光素子からの光により励起される蛍光体が混入され、前記樹脂枠により囲まれた前記基板上の領域を埋め尽くすように充填されて前記複数組の発光素子を一体的に封止する封止樹脂と、を有し、
前記複数組の発光素子の直上における前記封止樹脂の厚さが組ごとに互いに異なることで、前記複数組の発光素子のそれぞれを１組だけ発光させたときの前記封止樹脂からの出射光の色度が互いに異なる、
ことを特徴とする発光装置。 A substrate,
A resin frame fixed on the substrate;
A plurality of sets of light-emitting elements mounted in a region on the substrate surrounded by the resin frame, and for each set, a plurality of sets of light-emitting elements in which the light-emitting elements constituting the set are connected in series with each other;
A plurality of sets of connection electrodes provided on the substrate and electrically connected to the plurality of sets of light emitting elements, wherein the plurality of sets of light emitting elements are selectively driven to a part of the sets of light emitting elements. A plurality of connection electrodes capable of supplying current; and
Phosphors excited by light from the plurality of sets of light emitting elements are mixed and filled so as to fill the region on the substrate surrounded by the resin frame, thereby integrally sealing the plurality of sets of light emitting elements. Sealing resin to stop,
Light emitted from the sealing resin when only one set of each of the plurality of light emitting elements emits light because the thickness of the sealing resin directly above the plurality of sets of light emitting elements is different for each set. Have different chromaticities,
A light emitting device characterized by that. ＡＮＳＩ Ｃ７８．３７７の規格で相対色温度により分類されている複数の白色のうちの１つに相当する色度図上の領域の中心点を中心とする当該中心点の色度値の±２％の範囲内に前記出射光の色度値が収まるように、前記複数組の発光素子の実装位置における前記封止樹脂の厚さが定められている、請求項１に記載の発光装置。   ± 2% of the chromaticity value of the center point centered on the center point of the region on the chromaticity diagram corresponding to one of a plurality of whites classified by relative color temperature in the ANSI C78.377 standard 2. The light emitting device according to claim 1, wherein a thickness of the sealing resin at a mounting position of the plurality of sets of light emitting elements is determined so that a chromaticity value of the emitted light falls within the range of 2. 前記複数組の発光素子は、前記基板の水平な実装面上に実装され、
前記実装面からの前記樹脂枠の高さは、前記基板の一端部側から前記一端部に対向する前記基板の他端部側に向けて徐々に小さくなり、
前記封止樹脂は、前記一端部側から前記他端部側にかけて厚さが次第に減少するように前記複数組の発光素子を封止する、請求項１または２に記載の発光装置。 The plurality of sets of light emitting elements are mounted on a horizontal mounting surface of the substrate,
The height of the resin frame from the mounting surface gradually decreases from the one end of the substrate toward the other end of the substrate facing the one end.
3. The light emitting device according to claim 1, wherein the sealing resin seals the plurality of sets of light emitting elements such that the thickness gradually decreases from the one end side to the other end side. 前記基板は水平面に対して傾斜した実装面を有し、
前記複数組の発光素子は前記傾斜した実装面上に実装され、
前記実装面からの前記樹脂枠の高さは、前記樹脂枠の上端が全周にわたって同じ水平面上に位置するように、水平面に対する前記実装面上の高さが低い位置ほど大きくなり、
前記封止樹脂の上端は１つの水平面である、請求項１または２に記載の発光装置。 The substrate has a mounting surface inclined with respect to a horizontal plane;
The plurality of sets of light emitting elements are mounted on the inclined mounting surface,
The height of the resin frame from the mounting surface is increased as the position on the mounting surface with respect to the horizontal plane is lower such that the upper end of the resin frame is positioned on the same horizontal plane over the entire circumference.
The light emitting device according to claim 1, wherein an upper end of the sealing resin is one horizontal plane. 前記基板は、上面が前記傾斜した実装面である金属製の実装基板と、厚さが一様であり、開口部を有し、前記実装基板の上面に固定され、前記複数組の接続電極が設けられた回路基板と、で構成され、
前記複数組の発光素子は、前記開口部内で露出した前記実装基板の上面に実装されている、請求項４に記載の発光装置。 The substrate has a metal mounting substrate whose upper surface is the inclined mounting surface, has a uniform thickness, has an opening, is fixed to the upper surface of the mounting substrate, and the plurality of sets of connection electrodes are A circuit board provided, and
The light emitting device according to claim 4, wherein the plurality of sets of light emitting elements are mounted on an upper surface of the mounting substrate exposed in the opening. 前記基板は、上面に段差が形成されていることにより、鉛直方向の高さが互いに異なる複数の水平面を有し、
前記複数組の発光素子は、組ごとに異なる高さの位置に実装されており、
前記封止樹脂の上端は１つの水平面である、請求項１または２に記載の発光装置。 The substrate has a plurality of horizontal surfaces whose vertical heights are different from each other by forming a step on the upper surface,
The plurality of sets of light emitting elements are mounted at different height positions for each set,
The light emitting device according to claim 1, wherein an upper end of the sealing resin is one horizontal plane. 前記基板は、前記複数の水平面を有する金属製の実装基板と、厚さが一様であり、開口部を有し、前記実装基板の上面に固定され、前記複数組の接続電極が設けられた回路基板と、で構成され、
前記複数組の発光素子は、前記開口部内で露出した前記実装基板の上面に実装されている、請求項６に記載の発光装置。 The board has a metal mounting board having the plurality of horizontal planes, has a uniform thickness, has an opening, is fixed to an upper surface of the mounting board, and the plurality of sets of connection electrodes are provided. Circuit board, and
The light emitting device according to claim 6, wherein the plurality of sets of light emitting elements are mounted on an upper surface of the mounting substrate exposed in the opening. 同じ組を構成する複数の発光素子はいずれも同じ発光波長帯域を有し、
前記複数組の発光素子の一部は、残りの組の発光素子とは異なる発光波長帯域を有する、請求項１〜７のいずれか一項に記載の発光装置。 A plurality of light emitting elements constituting the same set all have the same emission wavelength band,
The light emitting device according to claim 1, wherein some of the plurality of sets of light emitting elements have a light emission wavelength band different from that of the remaining sets of light emitting elements. 基板と、
前記基板上に固定された樹脂枠と、
前記樹脂枠により囲まれる前記基板上の領域に実装された複数組の発光素子であって、組ごとに、当該組を構成する発光素子同士が互いに直列接続された複数組の発光素子と、
前記基板上に設けられ、前記複数組の発光素子に電気的に接続された複数組の接続電極であって、前記複数組の発光素子のうちで一部の組の発光素子に選択的に駆動電流を供給可能な複数組の接続電極と、
前記複数組の発光素子からの光により励起される蛍光体が混入され、前記樹脂枠により囲まれた前記基板上の領域を埋め尽くすように充填されて前記複数組の発光素子を一体的に封止する封止樹脂と、
前記複数組の接続電極の少なくともいずれかに接続されて、前記複数組の発光素子のうちで対応する組の発光素子に駆動電流を供給することで、前記封止樹脂を通して当該組に対応する色度の光を出射させる定電流電源と、を有し、
前記複数組の発光素子の直上における前記封止樹脂の厚さが組ごとに互いに異なることで、前記複数組の発光素子のそれぞれを１組だけ発光させたときの前記封止樹脂からの出射光の色度が互いに異なる、
ことを特徴とする調色装置。 A substrate,
A resin frame fixed on the substrate;
A plurality of sets of light-emitting elements mounted in a region on the substrate surrounded by the resin frame, and for each set, a plurality of sets of light-emitting elements in which the light-emitting elements constituting the set are connected in series with each other;
A plurality of sets of connection electrodes provided on the substrate and electrically connected to the plurality of sets of light emitting elements, wherein the plurality of sets of light emitting elements are selectively driven to a part of the sets of light emitting elements. A plurality of connection electrodes capable of supplying current; and
Phosphors excited by light from the plurality of sets of light emitting elements are mixed and filled so as to fill the region on the substrate surrounded by the resin frame, thereby integrally sealing the plurality of sets of light emitting elements. Sealing resin to stop,
A color that is connected to at least one of the plurality of connection electrodes and supplies a driving current to a corresponding set of light emitting elements among the plurality of sets of light emitting elements, so that the color corresponding to the set is transmitted through the sealing resin. A constant current power source that emits light of a degree,
Light emitted from the sealing resin when only one set of each of the plurality of light emitting elements emits light because the thickness of the sealing resin directly above the plurality of sets of light emitting elements is different for each set. Have different chromaticities,
A toning device characterized by that.
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