JP2017050311A - Sheet-like coil component and mounting body of sheet-like coil component and mounting method of sheet-like coil component - Google Patents

Sheet-like coil component and mounting body of sheet-like coil component and mounting method of sheet-like coil component Download PDF

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JP2017050311A
JP2017050311A JP2015170290A JP2015170290A JP2017050311A JP 2017050311 A JP2017050311 A JP 2017050311A JP 2015170290 A JP2015170290 A JP 2015170290A JP 2015170290 A JP2015170290 A JP 2015170290A JP 2017050311 A JP2017050311 A JP 2017050311A
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conductor
coil
sheet
layer
coil component
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JP6525319B2 (en
Inventor
尚 中嶋
Takashi Nakajima
尚 中嶋
耕介 宇賀
Kosuke Uga
耕介 宇賀
邦明 用水
Kuniaki Yosui
邦明 用水
佳之 真下
Yoshiyuki Mashita
佳之 真下
耕輔 西野
Kosuke Nishino
耕輔 西野
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Murata Manufacturing Co Ltd
Alps Alpine Co Ltd
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Alps Electric Co Ltd
Murata Manufacturing Co Ltd
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Priority to JP2015170290A priority Critical patent/JP6525319B2/en
Priority to CN201610643212.0A priority patent/CN106486254B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2847—Sheets; Strips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2876—Cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H01F27/323—Insulation between winding turns, between winding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a sheet-like coil component with enhanced heat transmission efficiency in the thickness direction, and to provide a mounting body of the sheet-like coil component and a mounting method of the sheet-like coil component.SOLUTION: A laminate structure 2 is formed by laminating and thermally bonding multiple insulating substrates. In the laminate structure 2, a coil body is formed by coil conductor layers 21, 22, 23, 24 formed on respective coil formation layers C1, C2, C3, C4. On the inside of the coil body, heat conduction parts 30a, 30b extending in the thickness direction are formed of heat conduction conductor layers and bonding conductors. By this heat conduction parts 30a, 30b, heat transfer efficiency is improved in the thickness direction, and thermal hardening of a thermosetting adhesive layer is facilitated between the sheet-like coil component 1 and a mounting body.SELECTED DRAWING: Figure 3

Description

本発明は、絶縁性の積層体の内部の異なる高さ位置に形成されたコイル導体層でコイル体が形成されているシート状コイル部品に係り、特に実装基体との間に介在させた熱硬化性の接着剤を硬化させやすい構造としたシート状コイル部品とシート状コイル部品の実装体およびシート状コイル部品の実装方法に関する。   The present invention relates to a sheet-shaped coil component in which a coil body is formed by coil conductor layers formed at different height positions inside an insulating laminate, and in particular, thermosetting interposed between a mounting substrate and the like. TECHNICAL FIELD The present invention relates to a sheet-like coil component having a structure that easily cures adhesive, a sheet-shaped coil component mounting body, and a sheet-shaped coil component mounting method.

特許文献１に積層コイルユニットに関する発明が記載されている。
この積層コイルユニットは、複数の絶縁基板の表面に平面状空心コイルが形成されている。絶縁基板には平面状空心コイルの端部に通じるスルーホールが形成されている。複数の絶縁基板を積層し、スルーホールを介して上下に重ねられた平面状空心コイルを導通させることで、薄型で伝送効率を向上させた積層コイルユニットを構成できるものとなっている。 Patent Document 1 describes an invention related to a laminated coil unit.
In this laminated coil unit, planar air-core coils are formed on the surfaces of a plurality of insulating substrates. A through hole that leads to the end of the planar air-core coil is formed in the insulating substrate. By laminating a plurality of insulating substrates and conducting the planar air-core coils that are stacked one above the other through through-holes, a thin laminated coil unit with improved transmission efficiency can be configured.

特開２００８−２０５２１５号公報JP 2008-205215 A

特許文献１の図３には、積層コイルユニットを携帯電話の筐体に配置した構造が示されている。   FIG. 3 of Patent Document 1 shows a structure in which a laminated coil unit is arranged in a casing of a mobile phone.

積層コイルユニットを前記筐体などに強固に設置するには、熱硬化性接着剤を使用することが好ましい。しかし、積層コイルユニットは絶縁基板を主体として構成され、熱伝導率が低いため、積層コイルユニットを介して熱硬化性接着剤を効率よく硬化させることは難しい。そのため、熱を加えて熱硬化性接着剤が硬化するまでの間に、位置決めしておいた積層コイルユニットが動いてしまうなど、積層コイルユニットを正確な位置に確実に固定するのが難しくなっている。   In order to firmly install the laminated coil unit on the housing or the like, it is preferable to use a thermosetting adhesive. However, since the laminated coil unit is mainly composed of an insulating substrate and has low thermal conductivity, it is difficult to efficiently cure the thermosetting adhesive through the laminated coil unit. For this reason, it is difficult to securely fix the laminated coil unit in an accurate position, for example, the laminated coil unit that has been positioned moves until the thermosetting adhesive is cured by applying heat. Yes.

本発明は上記従来の課題を解決するものであり、積層体の内部で熱を伝達しやすくし、熱硬化性の接着剤を用いて実装基体に短時間で確実に固定することが可能なシート状コイル部品とシート状コイル部品の実装体およびシート状コイル部品の実装方法を提供することを目的としている。   The present invention solves the above-mentioned conventional problems, facilitates heat transfer inside the laminate, and can be reliably fixed to a mounting substrate in a short time using a thermosetting adhesive. It aims at providing the mounting body of a sheet-like coil component and a sheet-like coil component, and the mounting method of a sheet-like coil component.

本発明は、積層された複数のシート状の絶縁基材と、前記絶縁基材の導体形成面に形成されたコイル導体層と、厚さ方向に隣り合う前記コイル導体層の間に位置する前記絶縁基材に形成された第１のスルーホールと、前記第１のスルーホールに設けられて厚さ方向に隣り合う前記コイル導体層どうしを接合する第１の接合導体とを有し、前記コイル導体層と前記第１の接合導体とでコイル体が形成され、前記コイル体に導通する端子部が設けられているシート状コイル部品において、
前記コイル体の内側に、前記絶縁基材よりも熱伝導率の高い材料で形成された熱伝導部が設けられており、前記熱伝導部は、前記コイル体と絶縁されて、複数の前記絶縁基材を通過するように形成されていることを特徴とするものである。 The present invention provides a plurality of laminated sheet-like insulating base materials, a coil conductor layer formed on a conductor forming surface of the insulating base material, and the coil conductor layers that are located adjacent to each other in the thickness direction. A first through hole formed in the insulating substrate; and a first bonding conductor that is provided in the first through hole and joins the coil conductor layers adjacent to each other in the thickness direction. In a sheet-shaped coil component in which a coil body is formed of a conductor layer and the first bonding conductor, and a terminal portion that is electrically connected to the coil body is provided.
A heat conduction part made of a material having a higher thermal conductivity than the insulating base material is provided inside the coil body, and the heat conduction part is insulated from the coil body and has a plurality of the insulations. It is formed so that it may pass through a base material.

本発明のシート状コイル部品は、内部に厚さ方向に延びる熱伝導部が形成されているため、厚さ方向へ熱が伝達されやすくなる。そのため、シート状コイル部品と実装基体との間に熱硬化性接着剤を介在させ、シート状コイル部品の上面部から熱を与えることで、熱硬化性接着剤を短時間に硬化させることができる。   Since the sheet-like coil component of the present invention has a heat conduction portion extending in the thickness direction therein, heat is easily transferred in the thickness direction. Therefore, the thermosetting adhesive can be cured in a short time by interposing a thermosetting adhesive between the sheet-like coil component and the mounting substrate and applying heat from the upper surface of the sheet-like coil component. .

本発明のシート状コイル部品は、前記絶縁基材の前記導体形成面に、前記コイル導体層と絶縁された熱伝導導体層が形成され、前記絶縁基材の第２のスルーホールに設けられた第２の接合導体によって厚さ方向に隣り合う前記熱伝導導体層どうしが接合されて前記熱伝導部が形成されており、
前記コイル導体層と前記熱伝導導体層とが同じ導電材料で形成され、前記第１の接合導体と前記第２の接合導体とが同じ導電材料で形成されているものとすることができる。 In the sheet-like coil component of the present invention, a heat conductive conductor layer insulated from the coil conductor layer is formed on the conductor forming surface of the insulating base material, and is provided in the second through hole of the insulating base material. The heat conducting portions are formed by joining the heat conducting conductor layers adjacent in the thickness direction by the second joining conductor,
The coil conductor layer and the heat conductive conductor layer may be formed of the same conductive material, and the first bonding conductor and the second bonding conductor may be formed of the same conductive material.

上記構成では、熱伝導導体層とコイル導体層を同じ工程で形成でき、第１の接合導体と第２の接合導体を同じ材料で形成できるため、製造工程を簡略化できるようになる。   In the above configuration, the heat conductive conductor layer and the coil conductor layer can be formed in the same process, and the first bonding conductor and the second bonding conductor can be formed of the same material, so that the manufacturing process can be simplified.

本発明のシート状コイル部品は、実装面側である下面部から最も離れた位置にある最上層の前記絶縁基材は、当該導体形成面が上に向けられており、この導体形成面に、前記コイル導体層と前記熱伝導導体層とが形成されていることが好ましい。   In the sheet-like coil component of the present invention, the uppermost insulating base material at the position farthest from the lower surface portion on the mounting surface side has the conductor forming surface directed upward, and on this conductor forming surface, Preferably, the coil conductor layer and the heat conductive conductor layer are formed.

上記のように、最上層の前記絶縁基材の上面部に熱伝導導体層が現れていると、シート状コイル部品の上面に加熱部材を当てることで、その熱をシート状コイル部品の下面部に効果的に伝達できるようになる。   As described above, when the heat conductive conductor layer appears on the upper surface portion of the uppermost insulating base material, the heat is applied to the upper surface of the sheet-shaped coil component, so that the heat is applied to the lower surface portion of the sheet-shaped coil component. Will be able to communicate effectively.

本発明のシート状コイル部品は、前記下面部に位置する最下層の前記絶縁基材は、前記導体形成面が下に向けられており、当該導体形成面に前記熱伝導導体層に対向し且つ当該熱伝導導体層と接続されていないマーク導体層が形成されており、前記マーク導体層に第１の位置認識マークが形成されているものとすることができる。   In the sheet-like coil component of the present invention, the lowermost insulating base material located on the lower surface portion has the conductor forming surface facing downward, and the conductor forming surface faces the heat conducting conductor layer and A mark conductor layer that is not connected to the heat conductive conductor layer is formed, and a first position recognition mark may be formed on the mark conductor layer.

上記構成では、複数の絶縁基材が積層された積層構造体の下面部に現れるマーク導体層によって第１の位置認識マークを形成しているため、積層構造体の下面部に、第１の位置認識マークを光学的に目立つように形成できる。   In the above configuration, since the first position recognition mark is formed by the mark conductor layer appearing on the lower surface portion of the laminated structure in which a plurality of insulating base materials are laminated, the first position is formed on the lower surface portion of the laminated structure. The recognition mark can be formed so as to be optically conspicuous.

さらに、本発明のシート状コイル部品は、最上層の前記絶縁基材の前記導体形成面に第２の位置認識マークが形成され、最上層の前記絶縁基材の上面部が透光性の絶縁層で覆われているものとして構成できる。   Furthermore, in the sheet-like coil component of the present invention, the second position recognition mark is formed on the conductor forming surface of the uppermost insulating base material, and the upper surface portion of the uppermost insulating base material is translucent insulating. It can be configured as covered with layers.

上記構成では、積層構造体の上面部に第２の位置認識マークが形成されているため、上面部側からシート状コイル部品の位置を確認しやすくなる。また、透光性の絶縁層で覆われていることによって、上面部に現れるコイル導体層や第２の位置認識マークを保護できるようになる。   In the above configuration, since the second position recognition mark is formed on the upper surface portion of the multilayer structure, the position of the sheet-shaped coil component can be easily confirmed from the upper surface portion side. Further, by being covered with the translucent insulating layer, the coil conductor layer and the second position recognition mark appearing on the upper surface can be protected.

本発明のシート状コイル部品は、前記熱伝導導体層と前記第２の接合導体とから成る前記熱伝導部が、前記コイル体の内側に複数設けられていることが好ましい。   In the sheet-like coil component according to the present invention, it is preferable that a plurality of the heat conducting portions including the heat conducting conductor layer and the second bonding conductor are provided inside the coil body.

上記構成では、複数の熱伝導部を有することで、積層構造体の厚さ方向への熱の伝達効果を高めることができる。   In the said structure, the heat transfer effect to the thickness direction of a laminated structure can be heightened by having a several heat conductive part.

本発明のシート状コイル部品は、前記熱伝導導体部が銅箔で形成されており、前記第２の接合導体が、金属成分を含んだ導電性ペーストの固化物で構成されていることが好ましい。   In the sheet-like coil component of the present invention, it is preferable that the heat conductive conductor portion is formed of a copper foil, and the second joining conductor is formed of a solidified conductive paste containing a metal component. .

上記のように、熱伝導部を金属あるいは金属成分を含む材料で形成することで、熱を伝達しやすくなる。   As described above, heat is easily transferred by forming the heat conducting portion with a metal or a material containing a metal component.

次に、本発明のシート状コイル部品の実装体は、前記のいずれかに記載のシート状コイル部品の下面部であって、少なくとも前記熱伝導部に対応する部分が、熱硬化された接着剤層を介して実装基体に固定されていることを特徴とするものである。   Next, the sheet-shaped coil component mounting body according to the present invention is a bottom surface portion of the sheet-shaped coil component according to any one of the above, and at least a portion corresponding to the heat conducting portion is thermally cured. It is fixed to the mounting substrate via a layer.

前記シート状コイル部品の実装体は、実装基体との間に、熱伝導部で伝達された熱によって熱硬化された接着剤層が介在するため、シート状コイル部品を実装基体に強固に固定できる。   Since the mounting body of the sheet-shaped coil component is interposed between the mounting base and the adhesive layer that is thermally cured by the heat transmitted by the heat conducting portion, the sheet-shaped coil component can be firmly fixed to the mounting base. .

さらに、本発明のシート状コイル部品の実装方法は、前記いずれかのシート状コイル部品の下面部であって、少なくとも前記熱伝導部に対応する部分と、実装基体との間に熱硬化性の接着剤を介在させる工程と、
前記シート状コイル部品の上面部であって前記熱伝導部に対応する部分を加熱し、前記熱伝導部を伝わった熱で前記接着剤を熱硬化させる工程と、
前記端子部と前記実装基体の導通部とを電気的に接続する工程と、
を有することを特徴とするものである。 Furthermore, the sheet-like coil component mounting method of the present invention is a thermosetting portion between the mounting base and at least a portion corresponding to the heat conducting portion on the lower surface portion of any one of the sheet-like coil components. A step of interposing an adhesive;
Heating the portion corresponding to the heat conducting portion on the upper surface portion of the sheet-like coil component, and thermally curing the adhesive with the heat transmitted through the heat conducting portion;
Electrically connecting the terminal portion and the conductive portion of the mounting substrate;
It is characterized by having.

前記実装方法では、シート状コイル部品の内部の熱伝導部で熱を伝達することができるため、接着剤層を短時間で熱硬化させることができ、シート状コイル部品を実装基体に確実に固定できるようになる。   In the mounting method, heat can be transferred by the heat conduction part inside the sheet-shaped coil component, so that the adhesive layer can be thermally cured in a short time, and the sheet-shaped coil component is securely fixed to the mounting substrate. become able to.

上記構成では、前記端子部と前記実装基体の導通部とを電気的に接続する工程は、例えば半田付け工程である。   In the above configuration, the step of electrically connecting the terminal portion and the conductive portion of the mounting substrate is, for example, a soldering step.

本発明は、複数の絶縁基材が積層された積層構造体の内部であって、コイル体の巻き中央部に、厚さ方向に延びる熱伝導部が設けられているため、その部分で厚さ方向へ熱を伝達しやすくなっている。そのため、シート状コイル部品と実装基体との間に熱硬化性の接着剤を介在させ、シート状コイル部品の上面部の熱伝導部に対応する部分を加熱することで、その熱を接着剤に誘導して接着剤を短時間で熱硬化させることが可能になる。   The present invention is the inside of a laminated structure in which a plurality of insulating base materials are laminated, and a heat conduction portion extending in the thickness direction is provided at the winding center portion of the coil body. It is easy to transfer heat in the direction. Therefore, a thermosetting adhesive is interposed between the sheet-like coil component and the mounting substrate, and the heat corresponding to the heat conducting portion on the upper surface of the sheet-like coil component is heated, so that heat is used as the adhesive. It is possible to induce and heat cure the adhesive in a short time.

また、熱伝導部を構成する熱伝導導体層ならびに第２の接合導体を、コイル導体層および第１の接合導体と同じ導電材料で構成することにより、特に新たな工程を追加することなく、絶縁性の積層体の内部に厚さ方向に延びる熱伝導部を形成することができる。   Further, by configuring the heat conductive conductor layer and the second bonding conductor constituting the heat conductive portion with the same conductive material as that of the coil conductor layer and the first bonding conductor, insulation can be performed without adding a new process. A heat conduction portion extending in the thickness direction can be formed inside the conductive laminate.

本発明の実施の形態のシート状コイル部品を示す平面図、The top view which shows the sheet-like coil components of embodiment of this invention, 本発明の実施の形態のシート状コイル部品を示す底面図、The bottom view which shows the sheet-like coil components of embodiment of this invention, 図１に示すシート状コイル部品のＩＩＩ−ＩＩＩ線の断面図、Sectional drawing of the III-III line of the sheet-like coil component shown in FIG. 複数の絶縁基材の積層構造を示す断面図、Sectional drawing which shows the laminated structure of several insulation base materials, コイル導体層と第１の接合導体との接合関係および熱伝導導体層と第２の接合導体の接合関係を示す上面側斜視図、A top-side perspective view showing the bonding relationship between the coil conductor layer and the first bonding conductor and the bonding relationship between the heat conductive conductor layer and the second bonding conductor; コイル導体層と第１の接合導体との接合関係および熱伝導導体層と第２の接合導体の接合関係を示す分解斜視図、FIG. 3 is an exploded perspective view showing a bonding relationship between the coil conductor layer and the first bonding conductor and a bonding relationship between the heat conductive conductor layer and the second bonding conductor; コイル導体層と第１の接合導体との接合関係および熱伝導導体層と第２の接合導体の接合関係を示す底面側斜視図、A bottom perspective view showing a bonding relationship between the coil conductor layer and the first bonding conductor and a bonding relationship between the heat conductive conductor layer and the second bonding conductor; 本発明の実施の形態のシート状コイル部品の実装方法と実装体を説明する工程説明図、Process explanatory drawing explaining the mounting method and mounting body of the sheet-like coil component of embodiment of this invention,

図１ないし図３に、本発明の実施の形態のシート状コイル部品１が記載されている。図１は、シート状コイル部品１の平面図、図２は、シート状コイル部品１の底面図、図３は、シート状コイル部品１を図１に示すＩＩＩ−ＩＩＩ線で切断した断面図である。   1 to 3 show a sheet-like coil component 1 according to an embodiment of the present invention. 1 is a plan view of the sheet-like coil component 1, FIG. 2 is a bottom view of the sheet-like coil component 1, and FIG. 3 is a cross-sectional view of the sheet-like coil component 1 taken along line III-III shown in FIG. is there.

図３に示すように、シート状コイル部品１は上面部１ａと下面部１ｂを有している。下面部１ｂが実装基体への実装面である。
シート状コイル部品１が実装される実装基体は、プリント配線基板、または樹脂モールド品であって、内部に埋設された導体がモールド品の表面に露出しているものなどである。 As shown in FIG. 3, the sheet-like coil component 1 has an upper surface portion 1a and a lower surface portion 1b. The lower surface portion 1b is a mounting surface on the mounting substrate.
The mounting substrate on which the sheet-like coil component 1 is mounted is a printed wiring board or a resin molded product, in which a conductor embedded inside is exposed on the surface of the molded product.

図３に示すように、シート状コイル部品１は積層構造体２を有しており、シート状コイル部品１の上面部１ａでは、積層構造体２の上面部２ａが、ポリイミド樹脂などの透光性の絶縁層である上部カバー層３で覆われている。積層構造体２の下面部２ｂはソルダーレジスト層を構成するエポキシ樹脂などの下部カバー層４で覆われている。   As shown in FIG. 3, the sheet-like coil component 1 has a laminated structure 2, and in the upper surface portion 1 a of the sheet-like coil component 1, the upper surface portion 2 a of the laminated structure 2 is light-transmitting such as polyimide resin. It is covered with an upper cover layer 3 that is a conductive insulating layer. The lower surface portion 2b of the laminated structure 2 is covered with a lower cover layer 4 such as an epoxy resin that constitutes a solder resist layer.

図３の断面図に示される積層構造体２の内部は、下面部２ｂから上面部２ａに向けて、第１のコイル形成階層Ｃ１、第１の絶縁階層Ｉ１、第２のコイル形成階層Ｃ２、第２の絶縁階層Ｉ２、第３のコイル形成階層Ｃ３、第３の絶縁階層Ｉ３、第４のコイル形成階層Ｃ４の順で各階層が形成されている。   The inside of the laminated structure 2 shown in the cross-sectional view of FIG. 3 includes a first coil formation layer C1, a first insulation layer I1, a second coil formation layer C2, from the bottom surface 2b toward the top surface 2a. Each layer is formed in the order of the second insulation layer I2, the third coil formation layer C3, the third insulation layer I3, and the fourth coil formation layer C4.

第１のコイル形成階層Ｃ１と第２のコイル形成階層Ｃ２と第３のコイル形成階層Ｃ３および第４のコイル形成階層Ｃ４には、銅箔による導電パターン（２１，２２など）が形成されている。第１の絶縁階層Ｉ１と第２の絶縁階層Ｉ２および第３の絶縁階層Ｉ３には、樹脂部材である絶縁体１０内に接合導体（４１など）が埋設されている。これら導体パターンと接合導体は、図３の断面図に現れているが、さらに、図５ないし図７では、絶縁体１０と上部カバー層３および下部カバー層４とを省略して前記導体パターンと接合導体が図示されている。図５は上方から見た斜視図、図６は上方から見た分解斜視図、図７は下方から見た斜視図である。なお、図５に示すＩＩＩ−ＩＩＩ切断線は、図１に示すＩＩＩ−ＩＩＩ切断線と同じ位置での切断部を示している。   In the first coil formation layer C1, the second coil formation layer C2, the third coil formation layer C3, and the fourth coil formation layer C4, conductive patterns (21, 22, etc.) made of copper foil are formed. . In the first insulating layer I1, the second insulating layer I2, and the third insulating layer I3, a junction conductor (41 or the like) is embedded in the insulator 10 that is a resin member. These conductor patterns and bonding conductors appear in the cross-sectional view of FIG. 3, but in FIGS. 5 to 7, the insulator 10, the upper cover layer 3, and the lower cover layer 4 are omitted. A junction conductor is shown. 5 is a perspective view seen from above, FIG. 6 is an exploded perspective view seen from above, and FIG. 7 is a perspective view seen from below. In addition, the III-III cutting line shown in FIG. 5 has shown the cutting part in the same position as the III-III cutting line shown in FIG.

積層構造体２は、導体パターンと接合導体が形成されていない領域が、樹脂からなる絶縁体１０である。絶縁体１０を構成する樹脂材料として、ＰＥＥＫ（ポリエーテルエーテルケトン）、ＰＥＩ（ポリエーテルイミド）、ＰＰＳ（ポニフェニレンスルファイド）、熱可塑性ＰＩ（ポリイミド）、液晶ポリマーなどを用いることができる。   In the laminated structure 2, the region where the conductor pattern and the bonding conductor are not formed is the insulator 10 made of resin. As a resin material constituting the insulator 10, PEEK (polyetheretherketone), PEI (polyetherimide), PPS (poniphenylene sulfide), thermoplastic PI (polyimide), liquid crystal polymer, or the like can be used.

図３および図５ないし図７に示すように、第１のコイル形成階層Ｃ１には、銅箔で形成された導体パターンとして、コイル導体層２１と熱伝導導体層３１とマーク導体層３５および端子部２８ａ，２８ｂが形成されている。なお、端子部２８ａと端子部２８ｂは、図３には現れておらず、図５ないし図７に示されている。熱伝導導体層３１とマーク導体層３５はコイル導体層２１と分離されて形成されている。   As shown in FIGS. 3 and 5 to 7, the first coil formation layer C1 includes a coil conductor layer 21, a heat conductive conductor layer 31, a mark conductor layer 35, and terminals as conductor patterns formed of copper foil. Portions 28a and 28b are formed. In addition, the terminal part 28a and the terminal part 28b are not appearing in FIG. 3, but are shown in FIGS. The heat conductive conductor layer 31 and the mark conductor layer 35 are formed separately from the coil conductor layer 21.

第２のコイル形成階層Ｃ２には、銅箔で形成された導体パターンとして、コイル導体層２２と２個の熱伝導導体層３２ａ，３２ｂが形成され、さらに中継導体層２９ａが形成されている。なお、中継導体層２９ａは図３に現れておらず、図５ないし図７に示されている。熱伝導導体層３２ａ，３２ｂと中継導体層２９ａは、コイル導体層２２とは分離されて形成されている。   In the second coil formation layer C2, a coil conductor layer 22 and two heat conductive conductor layers 32a and 32b are formed as a conductor pattern formed of copper foil, and a relay conductor layer 29a is further formed. The relay conductor layer 29a does not appear in FIG. 3, but is shown in FIGS. The heat conductive conductor layers 32 a and 32 b and the relay conductor layer 29 a are formed separately from the coil conductor layer 22.

第３のコイル形成階層Ｃ３には、銅箔で形成された導体パターンとして、コイル導体層２３と２個の熱伝導導体層３３ａ，３３ｂが形成され、さらに中継導体層２９ｂが形成されている。中継導体層２９ｂは図３に現れておらず、図５ないし図７に示されている。熱伝導導体層３３ａ，３３ｂと中継導体層２９ｂは、コイル導体層２３と分離されて形成されている。   In the third coil formation layer C3, a coil conductor layer 23 and two heat conductive conductor layers 33a and 33b are formed as a conductor pattern made of copper foil, and a relay conductor layer 29b is further formed. The relay conductor layer 29b does not appear in FIG. 3, but is shown in FIGS. The heat conductive conductor layers 33 a and 33 b and the relay conductor layer 29 b are formed separately from the coil conductor layer 23.

第４のコイル形成階層Ｃ４には、銅箔で形成された導体パターンとして、コイル導体層２４と２個の熱伝導導体層３４ａ，３４ｂが形成されている。熱伝導導体層３４ａ，３４ｂは、コイル導体層２４と分離されて形成されている。なお、各コイル導体層２１，２２，２３，２４は、うず巻き状に形成されている。   In the fourth coil formation layer C4, a coil conductor layer 24 and two heat conductive conductor layers 34a and 34b are formed as a conductor pattern formed of copper foil. The heat conductive conductor layers 34 a and 34 b are formed separately from the coil conductor layer 24. Each coil conductor layer 21, 22, 23, 24 is formed in a spiral shape.

第１の絶縁階層Ｉ１には、第１の接合導体４１と第２の接合導体４４および第３の接合導体４８ａが埋設されている。第３の接合導体４８ａは図５ないし図７に示されている。第２の絶縁階層Ｉ２には、第１の接合導体４２と第２の接合導体４５ａ，４５ｂおよび第３の接合導体４８ｂが埋設されている。第３の接合導体４８ｂは図５ないし図７に示されている。第３の絶縁階層Ｉ３には、第１の接合導体４３と第２の接合導体４６ａ，４６ｂおよび第３の接合導体４８ｃが埋設されている。第３の接合導体４８ｃは図５と図６に示されている。   A first joint conductor 41, a second joint conductor 44, and a third joint conductor 48a are embedded in the first insulating layer I1. The third bonding conductor 48a is shown in FIGS. In the second insulating layer I2, the first bonding conductor 42, the second bonding conductors 45a and 45b, and the third bonding conductor 48b are embedded. The third bonding conductor 48b is shown in FIGS. In the third insulating layer I3, the first bonding conductor 43, the second bonding conductors 46a and 46b, and the third bonding conductor 48c are embedded. The third bonding conductor 48c is shown in FIGS.

なお、後述するように、第１の絶縁階層Ｉ１は、第１の絶縁基材１１によって形成され、第３の絶縁階層Ｉ３は第４の絶縁基材１４によって形成されている。また、第２の絶縁階層Ｉ２は、第２の絶縁基材１２と第３の絶縁基材１３とで形成されている。   As will be described later, the first insulating layer I1 is formed by the first insulating substrate 11, and the third insulating layer I3 is formed by the fourth insulating substrate 14. The second insulating layer I2 is formed of the second insulating base 12 and the third insulating base 13.

第１の接合導体４１，４２，４３と、第２の接合導体４４，４５ａ，４５ｂ，４６ａ，４６ｂ、および第３の接合導体４８ａ，４８ｂ，４８ｃは、同じ導電性材料で形成されており、金属成分を含む導電性ペースト（導電性接着剤）が固化した固化物（金属含有樹脂体）で構成されている。金属成分としては、例えば、銀粉などの導電性の金属フィラーを用いることができる。   The first bonding conductors 41, 42, 43, the second bonding conductors 44, 45a, 45b, 46a, 46b, and the third bonding conductors 48a, 48b, 48c are made of the same conductive material, It consists of a solidified product (metal-containing resin body) obtained by solidifying a conductive paste (conductive adhesive) containing a metal component. As the metal component, for example, a conductive metal filler such as silver powder can be used.

それぞれのコイル形成階層Ｃ１，Ｃ２，Ｃ３，Ｃ４に形成された導電パターンと、それぞれの絶縁階層Ｉ１，Ｉ２，Ｉ３に埋設された接合導体とで、積層構造体２の内部に、図５ないし図７に示す立体的な接合構造が構成されている。   The conductive structure formed in each of the coil formation layers C1, C2, C3, and C4 and the junction conductor embedded in each of the insulation layers I1, I2, and I3 are arranged inside the laminated structure 2 in FIGS. The three-dimensional joining structure shown in FIG.

図６に示す接合ラインＬ１では、端子部２８ｂと２つの中継導体層２９ａ，２９ｂと最上部のコイル導体層２４とが、第３の接合導体４８ａ，４８ｂ，４８ｃを介して導通されている。接合ラインＬ２では、最下部のコイル導体層２１とその上のコイル導体層２２が第１の接合導体４１を介して導通され、接合ラインＬ３では、コイル導体層２２とコイル導体層２３が第１の接合導体４２を介して接合され、接合ラインＬ４では、コイル導体層２３と最上部のコイル導体層２４が第１の接合導体４３を介して接合されている。   In the joining line L1 shown in FIG. 6, the terminal portion 28b, the two relay conductor layers 29a and 29b, and the uppermost coil conductor layer 24 are electrically connected via the third joining conductors 48a, 48b, and 48c. In the joining line L2, the lowermost coil conductor layer 21 and the coil conductor layer 22 thereon are conducted through the first joining conductor 41, and in the joining line L3, the coil conductor layer 22 and the coil conductor layer 23 are the first. In the joining line L4, the coil conductor layer 23 and the uppermost coil conductor layer 24 are joined via the first joining conductor 43.

上記接合ラインＬ１，Ｌ２，Ｌ３，Ｌ４の接合により、端子部２８ａと端子部２８ｂとの間に、上下に多重巻き（実施の形態では４重巻き）のコイル体２０が形成されている。なお、端子部２８ａと端子部２８ｂは積層構造体２の下面部２ｂに現れている。   By joining the joining lines L1, L2, L3, and L4, a coil body 20 having multiple turns (four turns in the embodiment) is formed between the terminal portion 28a and the terminal portion 28b. Note that the terminal portion 28 a and the terminal portion 28 b appear on the lower surface portion 2 b of the laminated structure 2.

図６に示す接合ラインＬ５とＬ６では、熱伝導導体層３２ａ，３３ａ，３４ａが第２の接合導体４５ａ，４６ａを介して接合され、図３と図５に示すように、第１の熱伝導部３０ａが形成されている。図６に示す接合ラインＬ７，Ｌ８，Ｌ９では、熱伝導導体層３１，３２ｂ，３３ｂ，３４ｂが、第２の接合導体４４，４５ｂ，４６ｂを介して接合され、図３と図５に示す第２の熱伝導部３０ｂが形成されている。   In the joining lines L5 and L6 shown in FIG. 6, the heat conducting conductor layers 32a, 33a, and 34a are joined via the second joining conductors 45a and 46a. As shown in FIGS. A portion 30a is formed. In the joining lines L7, L8, and L9 shown in FIG. 6, the heat conductive conductor layers 31, 32b, 33b, and 34b are joined through the second joining conductors 44, 45b, and 46b, and the first shown in FIGS. Two heat conducting portions 30b are formed.

図５に示すように、第１の熱伝導部３０ａと第２の熱伝導部３０ｂは、コイル体２０の内側の開口部（巻き中央部）内に並んで形成されている。図３に示すように、第１の熱伝導部３０ａと第２の熱伝導部３０ｂは、積層構造体２の内部の各階層に形成された複数のコイル導体層２１，２２，２３，２４の内側で各絶縁基材１１〜１４を厚さ方向へ通過するように、シート状コイル部品１内で厚さ方向に向けて形成されている。また、第１の熱伝導部３０ａと第２の熱伝導部３０ｂは、コイル体２０とは絶縁されて形成されている。   As shown in FIG. 5, the first heat conducting unit 30 a and the second heat conducting unit 30 b are formed side by side in the opening (winding center) inside the coil body 20. As shown in FIG. 3, the first heat conducting part 30 a and the second heat conducting part 30 b are formed of a plurality of coil conductor layers 21, 22, 23, 24 formed in each layer inside the laminated structure 2. The sheet-shaped coil component 1 is formed in the thickness direction so as to pass through the insulating base materials 11 to 14 in the thickness direction. Further, the first heat conducting unit 30 a and the second heat conducting unit 30 b are formed to be insulated from the coil body 20.

図３の断面図に示すように、上下の中央部の第２の絶縁階層Ｉ２の厚さ寸法は、第１の絶縁階層Ｉ１の厚さ寸法よりも大きく、第３の絶縁階層Ｉ３の厚さ寸法よりも大きい。そして、第１のコイル形成階層Ｃ１は、積層構造体２の下面部２ｂに露出しており、第４のコイル形成階層Ｃ４は、積層構造体２の上面部２ａに露出している。   As shown in the cross-sectional view of FIG. 3, the thickness dimension of the second insulating layer I2 in the upper and lower central portions is larger than the thickness dimension of the first insulating layer I1, and the thickness of the third insulating layer I3. Greater than dimensions. The first coil formation layer C1 is exposed on the lower surface portion 2b of the multilayer structure 2, and the fourth coil formation layer C4 is exposed on the upper surface portion 2a of the multilayer structure 2.

図６と図７に示すように、最下層の第１のコイル形成階層Ｃ１には、コイル導体層２１と同じ導電材料である銅箔によってマーク導体層３５が形成されている。図３の断面図に示すように、マーク導体層３５は、他の導体層と接続されておらず独立して形成されている。マーク導体層３５に、第１の位置認識マーク３５ａが形成されている。図２と図７に示すように、第１の位置認識マーク３５ａは、マーク導体層３５に厚さ方向に貫通する十字穴である。図３に示すように、マーク導体層３５は、積層構造体２の下面部２ｂに現れており、銅箔で形成されているため、中央の十字穴が光学的に鮮明に目立つものとなる。   As shown in FIGS. 6 and 7, the mark conductor layer 35 is formed of a copper foil, which is the same conductive material as the coil conductor layer 21, in the lowermost first coil formation layer C <b> 1. As shown in the sectional view of FIG. 3, the mark conductor layer 35 is not connected to other conductor layers and is formed independently. A first position recognition mark 35 a is formed on the mark conductor layer 35. As shown in FIGS. 2 and 7, the first position recognition mark 35a is a cross hole penetrating the mark conductor layer 35 in the thickness direction. As shown in FIG. 3, the mark conductor layer 35 appears on the lower surface portion 2b of the multilayer structure 2, and is formed of copper foil, so that the central cross hole is optically conspicuous.

図３に示すように、マーク導体層３５の上には第２の接合導体が設けられておらず、マーク導体層３５の上の層は絶縁体１０で形成されているため、積層構造体２を形成するために上下に圧縮力を与えたときに、マーク導体層３５が変形するのを防止でき、第１の位置認識マーク３５ａを平面状に形成しやすくなる。   As shown in FIG. 3, since the second bonding conductor is not provided on the mark conductor layer 35 and the layer above the mark conductor layer 35 is formed of the insulator 10, the laminated structure 2 When a compressive force is applied up and down to form the mark conductor, the mark conductor layer 35 can be prevented from being deformed, and the first position recognition mark 35a can be easily formed in a planar shape.

図３に示すように、積層構造体２の下面部２ｂは下部カバー層４で覆われているが、マーク導体層３５の領域において下部カバー層４に穴４ａを形成しておくと、マーク導体層３５を下側から光学的に観察しやすくなる。そして、マーク導体層３５と端子部２８ａ，２８ｂ以外は下部カバー層４で覆われているため、コイル導体層２１を保護することが可能である。   As shown in FIG. 3, the lower surface portion 2b of the laminated structure 2 is covered with the lower cover layer 4. However, if the hole 4a is formed in the lower cover layer 4 in the region of the mark conductor layer 35, the mark conductor is formed. It becomes easy to optically observe the layer 35 from below. Since the portions other than the mark conductor layer 35 and the terminal portions 28a and 28b are covered with the lower cover layer 4, the coil conductor layer 21 can be protected.

なお、本実施の形態では、下部カバー層４をソルダーレジスト層で構成したが、下部カバー層４を透明な樹脂材料で形成した場合には、下部カバー層４でマーク導体層３５を覆うと、下側から第１の位置認識マーク３５ａを観察でき、しかも、マーク導体層３５を保護できるようになる。ただし、この場合においても、端子部２８ａ，２８ｂは、下部カバー層４で覆われないように構成する。   In the present embodiment, the lower cover layer 4 is composed of a solder resist layer. However, when the lower cover layer 4 is formed of a transparent resin material, the mark conductor layer 35 is covered with the lower cover layer 4, The first position recognition mark 35a can be observed from the lower side, and the mark conductor layer 35 can be protected. However, even in this case, the terminal portions 28 a and 28 b are configured not to be covered with the lower cover layer 4.

図３に示すように、積層構造体２の上面部２ａには、熱伝導導体層３４ａが露出しているが、この熱伝導導体層３４ａの上に、着色された樹脂層３６が形成され、その表面が透光性を有する前記上部カバー層３で覆われている。図１に示すように、樹脂層３６を構成する樹脂材料は中央部において十字形状に除去されており、この十字形状の部分が第２の位置認識マーク３６ａとなっている。この第２の位置認識マーク３６ａの下に、銅箔で形成された熱伝導導体層３４ａが位置しているため、上方から見たときに、上部カバー層３を透過して、第２の位置認識マーク３６ａ内の銅箔を見ることができ、第２の位置認識マーク３６ａを光学的に認識しやすくなっている。   As shown in FIG. 3, the heat conductive conductor layer 34a is exposed on the upper surface portion 2a of the laminated structure 2, and a colored resin layer 36 is formed on the heat conductive conductor layer 34a. The surface is covered with the upper cover layer 3 having translucency. As shown in FIG. 1, the resin material constituting the resin layer 36 is removed in a cross shape at the central portion, and the cross-shaped portion serves as a second position recognition mark 36a. Since the heat conductive conductor layer 34a formed of copper foil is located under the second position recognition mark 36a, the second position recognition mark 36a is transmitted through the upper cover layer 3 when viewed from above, The copper foil in the recognition mark 36a can be seen, and the second position recognition mark 36a can be easily recognized optically.

図４は、図３に示す積層構造体２の製造方法を説明するものである。
積層構造体２は複数の液晶ポリマーで形成されたシート状の絶縁基材１１，１２，１３，１４を積層することで構成されている。 FIG. 4 illustrates a method for manufacturing the laminated structure 2 shown in FIG.
The laminated structure 2 is configured by laminating sheet-like insulating base materials 11, 12, 13, and 14 formed of a plurality of liquid crystal polymers.

図４に示すように、第１の絶縁階層Ｉ１を形成するための第１の絶縁基材１１は、液晶ポリマーで形成されたフィルムであり、導体形成面１１ｄが下に向けられている。この導体形成面１１ｄに、第１のコイル形成階層Ｃ１を構成する導電パターンとして、コイル導体層２１と端子部２８ａ，２８ｂと熱伝導導体層３１およびマーク導体層３５が形成されている。マーク導体層３５には十字形状の第１の位置認識マーク３５ａが形成されている。これらの導体層は、導体形成面１１ｄに積層されていた銅箔をエッチングすることで形成される。   As shown in FIG. 4, the first insulating base material 11 for forming the first insulating layer I1 is a film formed of a liquid crystal polymer, and the conductor forming surface 11d is directed downward. A coil conductor layer 21, terminal portions 28a and 28b, a heat conductive conductor layer 31, and a mark conductor layer 35 are formed on the conductor forming surface 11d as conductive patterns constituting the first coil formation layer C1. A cross-shaped first position recognition mark 35 a is formed on the mark conductor layer 35. These conductor layers are formed by etching the copper foil laminated on the conductor forming surface 11d.

第１の絶縁基材１１にはスルーホール１１ａ，１１ｂが形成され、スルーホール１１ａ内に第１の接合導体４１が、スルーホール１１ｂ内に第２の接合導体４４が充填されている。第１の接合導体４１はコイル導体層２１に接合されており、第２の接合導体４４は熱伝導導体層３１に接合されている。同様に、絶縁基材１１に形成された他のスルーホールに図６などに示す第３の接合導体４８ａが充填され、この第３の接合導体４８ａが端子部２８ｂに導通されている。   Through holes 11a and 11b are formed in the first insulating base 11, and the first bonding conductor 41 is filled in the through hole 11a, and the second bonding conductor 44 is filled in the through hole 11b. The first joining conductor 41 is joined to the coil conductor layer 21, and the second joining conductor 44 is joined to the heat conducting conductor layer 31. Similarly, another through hole formed in the insulating base material 11 is filled with the third bonding conductor 48a shown in FIG. 6 and the like, and the third bonding conductor 48a is electrically connected to the terminal portion 28b.

第１の接合導体４１と第２の接合導体４４および第３の接合導体４８ａは、金属フィラーが混入された導電性ペースト（導電性接着剤）をスルーホールに充填することで形成されている。   The first bonding conductor 41, the second bonding conductor 44, and the third bonding conductor 48a are formed by filling a through hole with a conductive paste (conductive adhesive) mixed with a metal filler.

なお、第１の絶縁基材１１に形成されたスルーホール１１ａがコイル導体層２１を貫通して形成されて、スルーホール１１ａとコイル導体層２１に形成された穴の双方に第１の接合導体４１を形成する導電性ペーストが充填される構造であってもよい。同様に、スルーホール１１ｂが熱伝導導体層３１にも貫通して形成され、スルーホール１１ｂと熱伝導導体層３１に形成された穴の双方に第２の接合導体４４が充填されていてもよい。さらに、端子部２８ｂにもスルーホールが貫通して形成され、第３の接合導体４８ａが、スルーホールと端子部２８ｂに形成された穴の内部に充填されてもよい。   A through hole 11a formed in the first insulating base 11 is formed through the coil conductor layer 21, and the first bonding conductor is formed in both the through hole 11a and the hole formed in the coil conductor layer 21. The structure filled with the conductive paste which forms 41 may be sufficient. Similarly, the through hole 11b may be formed so as to penetrate the heat conductive conductor layer 31, and the second bonding conductor 44 may be filled in both the through hole 11b and the hole formed in the heat conductive conductor layer 31. . Furthermore, a through hole may be formed through the terminal portion 28b, and the third bonding conductor 48a may be filled in the through hole and the hole formed in the terminal portion 28b.

上記のようにコイル導体層や熱伝導導体層に穴を形成し、穴の内部に接合導体を充填する構造は、次に説明する各絶縁基材１２，１３，１４においても同様に実施できる。   The structure in which holes are formed in the coil conductor layer and the heat conductive conductor layer and the bonding conductor is filled in the holes as described above can be similarly implemented in each of the insulating base materials 12, 13, and 14 described below.

図３に示す第２の絶縁階層Ｉ２は、第２の絶縁基材１２と第３の絶縁基材１３とが重ねられて形成されている。
第２の絶縁階層Ｉ２の下半部を形成するための第２の絶縁基材１２は下面が導体形成面１２ｄであり、ここに、第２のコイル形成階層Ｃ２に形成されるべきコイル導体層２２と２個の熱伝導導体層３２ａ，３２ｂ、および図６などに示す中継導体層２９ａが形成される。図４に示すように、第２の絶縁基材１２にスルーホール１２ａ，１２ｂ，１２ｃが形成されている。スルーホール１２ａには、第２の絶縁階層Ｉ２に形成されるべき第１の接合導体４２の下半部４２−１を構成する導電性ペーストが充填されてコイル導体層２２と導通されている。スルーホール１２ｂには、第２の接合導体４５ａの下半分４５ａ−１を構成する導電性ペーストが充填されて熱伝導導体層３２ａに接合されている。スルーホール１２ｃには、第２の接合導体４５ｂの下半部４５ｂ−１を構成する導電性ペーストが充填されて熱伝導導体層３２ｂに接合されている。 The second insulating layer I2 shown in FIG. 3 is formed by overlapping the second insulating base 12 and the third insulating base 13.
The bottom surface of the second insulating base material 12 for forming the lower half of the second insulating layer I2 is the conductor forming surface 12d, and the coil conductor layer to be formed in the second coil forming layer C2 22 and two heat conductive conductor layers 32a and 32b, and a relay conductor layer 29a shown in FIG. 6 and the like are formed. As shown in FIG. 4, through holes 12 a, 12 b and 12 c are formed in the second insulating base 12. The through hole 12a is filled with a conductive paste constituting the lower half portion 42-1 of the first bonding conductor 42 to be formed in the second insulating layer I2, and is electrically connected to the coil conductor layer 22. The through hole 12b is filled with a conductive paste constituting the lower half 45a-1 of the second bonding conductor 45a and bonded to the heat conductive conductor layer 32a. The through hole 12c is filled with a conductive paste constituting the lower half 45b-1 of the second bonding conductor 45b and bonded to the heat conductive conductor layer 32b.

さらに、第２の絶縁基材１２に形成された別のスルーホール内に、図６などに示す第３の接合導体４８ｂの下半部を構成する導電性ペーストが充填されて中継導体層２９ａに接合されている。   Further, another through hole formed in the second insulating base 12 is filled with the conductive paste constituting the lower half portion of the third bonding conductor 48b shown in FIG. 6 and the like to the relay conductor layer 29a. It is joined.

第２の絶縁階層Ｉ２の上半部を形成するための第３の絶縁基材１３は上面が導体形成面１３ｄであり、ここに、第３のコイル形成階層Ｃ３に形成されるべきコイル導体層２３と２個の熱伝導導体層３３ａ，３３ｂ、および図６などに示す中継導体層２９ｂが形成されている。図４に示すように、第３の絶縁基材１３にスルーホール１３ａ，１３ｂ，１３ｃが形成されている。スルーホール１３ａには、第３の絶縁階層Ｉ３に形成されるべき第１の接合導体４２の上半部４２−２を構成する導電性ペーストが充填されてコイル導体層２３に導通されている。スルーホール１３ｂには、第２の接合導体４５ａの上半分４５ａ−２を構成する導電性ペーストが充填されて熱伝導導体層３３ａに接合されている。スルーホール１３ｃには、第２の接合導体４５ｂの上半部４５ｂ−２を構成する導電性ペーストが充填されて熱伝導導体層３３ｂに接合されている。   The upper surface of the third insulating base 13 for forming the upper half of the second insulating layer I2 is a conductor forming surface 13d, and a coil conductor layer to be formed in the third coil forming layer C3 23 and two heat conductive conductor layers 33a and 33b, and a relay conductor layer 29b shown in FIG. 6 and the like are formed. As shown in FIG. 4, through holes 13 a, 13 b, and 13 c are formed in the third insulating base material 13. The through hole 13a is filled with a conductive paste constituting the upper half 42-2 of the first bonding conductor 42 to be formed in the third insulating layer I3 and is conducted to the coil conductor layer 23. The through hole 13b is filled with a conductive paste constituting the upper half 45a-2 of the second bonding conductor 45a and bonded to the heat conductive conductor layer 33a. The through hole 13c is filled with a conductive paste constituting the upper half 45b-2 of the second bonding conductor 45b and bonded to the heat conductive conductor layer 33b.

さらに、第３の絶縁基材１３に形成された別のスルーホール内に、図６などに示す第３の接合導体４８ｂの上半部を構成する導電性ペーストが充填されて中継導体層２９ｂに接合されている。   Further, another through hole formed in the third insulating base material 13 is filled with the conductive paste constituting the upper half of the third bonding conductor 48b shown in FIG. 6 and the like, and the relay conductor layer 29b is filled. It is joined.

図３に示す第３の絶縁階層Ｉ３を形成するための第４の絶縁基材１４は、導体形成面１４ｄが上に向けられている。この導体形成面１４ｄに、第４のコイル形成階層Ｃ４に形成されるべきコイル導体層２４と２個の熱伝導導体層３４ａ，３４ｂが形成されている。第４の絶縁基材１４にスルーホール１４ａ，１４ｂ，１４ｃが形成されている。スルーホール１４ａ内に第１の接合導体４３を構成する導電性ペーストが充填されてコイル導体層２４に接合されている。スルーホール１４ｂ，１４ｃに第２の接合導体４６ａ，４６ｂを構成する導電性ペーストが充填されて、熱伝導導体層３４ａ，３４ｂに接合されている。   The fourth insulating base material 14 for forming the third insulating layer I3 shown in FIG. 3 has the conductor forming surface 14d facing upward. A coil conductor layer 24 and two heat conductive conductor layers 34a and 34b to be formed in the fourth coil formation layer C4 are formed on the conductor formation surface 14d. Through holes 14 a, 14 b and 14 c are formed in the fourth insulating base material 14. The through hole 14 a is filled with a conductive paste constituting the first bonding conductor 43 and bonded to the coil conductor layer 24. The through holes 14b and 14c are filled with the conductive paste constituting the second bonding conductors 46a and 46b, and bonded to the heat conductive conductor layers 34a and 34b.

この実施の形態では、スルーホール１１ａ，１２ａ，１３ａ，１４ａが第１のスルーホールを構成し、スルーホール１１ｂ，１２ｂ，１２ｃ，１３ｂ，１３ｃ，１４ｂ，１４ｃが第２のスルーホールを構成している。   In this embodiment, the through holes 11a, 12a, 13a and 14a constitute a first through hole, and the through holes 11b, 12b, 12c, 13b, 13c, 14b and 14c constitute a second through hole. Yes.

図４に示す第１の絶縁基材１１と第２の絶縁基材１２と第３の絶縁基材１３および第４の絶縁基材１４が重ねられて、熱プレスされることで、各絶縁基材１１，１２，１３，１４を構成する液晶ポリマーの絶縁体１０が接合されて、図３に示す積層構造体２が構成される。なお、各スルーホールに充填された導電性ペーストは、第１の絶縁基材１１ないし第４の絶縁基材１４を積層した後に、この積層体を加熱することによって固化される。この積層体の加熱は、前記熱プレスの前に行われるが、熱プレスと同時あるいは熱プレスの後に行うこともできる。さらに、絶縁基材１１〜１４を積層する前に、各絶縁基材ごとに導電性ペーストを半硬化させておいても良い。   The first insulating base material 11, the second insulating base material 12, the third insulating base material 13, and the fourth insulating base material 14 shown in FIG. The laminated structure 2 shown in FIG. 3 is formed by bonding the liquid crystal polymer insulators 10 constituting the materials 11, 12, 13, and 14. The conductive paste filled in each through hole is solidified by heating the laminated body after the first insulating base material 11 to the fourth insulating base material 14 are laminated. Although heating of this laminated body is performed before the said hot press, it can also be performed simultaneously with a hot press or after a hot press. Furthermore, before laminating the insulating base materials 11 to 14, the conductive paste may be semi-cured for each insulating base material.

図４に示すように、積層構造体２の図示下側の半分を構成する複数（実施の形態では２枚）の絶縁基材１１，１２は、導体形成面１１ｄ，１２ｄが下に向けられ、積層構造体２の図示上側の半分を構成する複数（実施の形態では２枚）の絶縁基材１３，１４は、導体形成面１３ｄ，１４ｄが上に向けられて接合されている。   As shown in FIG. 4, a plurality (two in the embodiment) of insulating base materials 11 and 12 constituting the lower half of the laminated structure 2 in the drawing have the conductor forming surfaces 11 d and 12 d directed downward, A plurality (two in the embodiment) of insulating base materials 13 and 14 constituting the upper half of the laminated structure 2 in the drawing are joined with the conductor forming surfaces 13d and 14d facing upward.

そのため、図３に示す積層構造体２では、第１のコイル形成階層Ｃ１を積層構造体２の下面部２ｂに露出させることができ、第４のコイル形成階層Ｃ４を積層構造体２の上面部２ａに露出させることができる。そして、第２の絶縁階層Ｉ２は２つの絶縁基材１２，１３で形成されているために厚さ寸法が、他の絶縁階層Ｉ１，Ｉ３よりも大きくなる。なお、最下部の第１の絶縁基材１１の導体形成面１１ｄを下向きにし、最上部の第４の絶縁基材１４の導体形成面１４ｄを上向きにしておけば、内部の絶縁基材の導体形成面は上下のどちら向きでもよい。また絶縁基材の枚数は４個に限られず、５個以上であってもよいし、３個であってもよい。   Therefore, in the multilayer structure 2 shown in FIG. 3, the first coil formation layer C1 can be exposed to the lower surface portion 2b of the multilayer structure 2, and the fourth coil formation layer C4 is exposed to the upper surface portion of the multilayer structure 2. 2a can be exposed. Since the second insulating layer I2 is formed of the two insulating bases 12 and 13, the thickness dimension is larger than the other insulating layers I1 and I3. If the conductor forming surface 11d of the lowermost first insulating base material 11 faces downward and the conductor forming surface 14d of the uppermost fourth insulating base material 14 faces upward, the conductor of the internal insulating base material The formation surface may be either up or down. Further, the number of insulating base materials is not limited to four, but may be five or more or three.

なお、前記実施の形態では、第１の接合導体４１，４２，４３と、第２の接合導体４４，４５ａ，４５ｂ，４６ａ，４６ｂおよび第３の接合導体４８ａ，４８ｂ，４８ｃが金属成分を含んだ導電性ペーストの固化物で構成されているが、これら接合導体は各スルーホール内に形成されたメッキ層や半田層などの金属層で構成されていてもよい。   In the above embodiment, the first bonding conductors 41, 42, 43, the second bonding conductors 44, 45a, 45b, 46a, 46b, and the third bonding conductors 48a, 48b, 48c contain metal components. However, the joint conductor may be composed of a metal layer such as a plating layer or a solder layer formed in each through hole.

次に、図８を参照して、前記シート状コイル部品１を実装基体に実装する実装方法と、実装基体にシート状コイル部品１が実装された実装体について説明する。   Next, referring to FIG. 8, a mounting method for mounting the sheet-shaped coil component 1 on a mounting substrate and a mounting body in which the sheet-shaped coil component 1 is mounted on the mounting substrate will be described.

図８（Ａ）では、シート状コイル部品１を実装すべき実装基体５０の実装面５１を上方からカメラ６１で撮影し、画像処理を施して、前記実装面５１においてシート状コイル部品１を実装する基準点を特定する。   In FIG. 8A, the mounting surface 51 of the mounting substrate 50 on which the sheet-shaped coil component 1 is to be mounted is photographed from above by the camera 61, subjected to image processing, and the sheet-shaped coil component 1 is mounted on the mounting surface 51. The reference point to be specified is specified.

図８（Ｂ）では、自動組み立て装置に設けられた装着アーム６２の先部に設けられた吸着部６３でシート状コイル部品１の上面部１ａを吸着する。その状態で、シート状コイル部品１の下面部１ｂをカメラ６４で撮影し、画像処理で、図２に示すようにシート状コイル部品１の下面部１ｂに現れている第１の位置認識マーク３５ａの位置を特定する。   In FIG. 8B, the upper surface portion 1a of the sheet-like coil component 1 is sucked by the suction portion 63 provided at the front portion of the mounting arm 62 provided in the automatic assembly apparatus. In this state, the lower surface portion 1b of the sheet-like coil component 1 is photographed by the camera 64, and the first position recognition mark 35a appearing on the lower surface portion 1b of the sheet-like coil component 1 as shown in FIG. Specify the position of.

図８（Ｃ）では、画像で得られている第１の位置認識マーク３５ａの十字のクロス点が、カメラ６１からの画像で特定された実装面５１上の基準点に一致するように、装着アーム６２の位置を調整し、実装基体５０にシート状コイル部品１を位置決めして設置する。   In FIG. 8C, the cross position of the cross of the first position recognition mark 35a obtained in the image is mounted so as to coincide with the reference point on the mounting surface 51 specified in the image from the camera 61. The position of the arm 62 is adjusted, and the sheet-like coil component 1 is positioned and installed on the mounting substrate 50.

このとき、シート状コイル部品１の少なくとも第１の熱伝導部３０ａと第２の熱伝導部３０ｂに対向する領域を含む範囲で、実装基体５０の実装面５１と、シート状コイル部品１の下面部１ｂとの間に熱硬化性接着剤（図示せず）を塗布する。この接着剤の塗布工程の前後いずれかの工程で、実装基体５０の接続用導体部と、シート状コイル部品１に設けられた端子部２８ａ，２８ｂとの間に、半田ペースト（図示せず）を塗布して介在させる。   At this time, the mounting surface 51 of the mounting substrate 50 and the lower surface of the sheet-shaped coil component 1 are within a range including at least a region facing the first heat-conductive portion 30a and the second heat-conductive portion 30b of the sheet-shaped coil component 1. A thermosetting adhesive (not shown) is applied between the portion 1b. Solder paste (not shown) is provided between the connecting conductor portion of the mounting substrate 50 and the terminal portions 28a, 28b provided on the sheet-like coil component 1 in any step before or after the adhesive application step. Is applied and interposed.

図８（Ｄ）では、シート状コイル部品１の上面部１ａのうちの少なくなくとも第１の熱伝導部３０ａと第２の熱伝導部３０ｂを含む範囲にヒータ（加熱部材）６５を当てて、シート状コイル部品１を加熱する。なお、図８（Ｄ）では簡略化して図示しているが、このとき、シート状コイル部品１を吸着部６３あるいは他の保持部材で保持したまま上面部１ａにヒータ６５を突き当てることが好ましい。ただし、吸着部６３を上面部１ａから外した後にヒータ６５を上面部１ａに突き当ててもよい。   In FIG. 8D, a heater (heating member) 65 is applied to a range including at least the first heat conduction part 30a and the second heat conduction part 30b in the upper surface part 1a of the sheet-like coil component 1. Then, the sheet-like coil component 1 is heated. 8D, the heater 65 is preferably abutted against the upper surface portion 1a while the sheet-like coil component 1 is held by the suction portion 63 or another holding member. . However, the heater 65 may be abutted against the upper surface portion 1a after the adsorption portion 63 is removed from the upper surface portion 1a.

図３に示すように、第１の熱伝導部３０ａは、熱伝導導体層３２ａ、第２の接合導体４５ａ，熱伝導導体層３３ａ、第２の接合導体４６ａ、熱伝導導体層３４ａが接合されて構成されており、積層構造体２の内部において複数のコイル形成階層すなわち複数の絶縁基材を横断するように形成されている。第２の熱伝導部３０ｂも同様に、熱伝導導体層３１、第２の接合導体４４，熱伝導導体層３２ｂ、第２の接合導体４５ｂ、熱伝導導体層３３ｂ、第２の接合導体４６ｂ、熱伝導導体層３４ｂが接合されて構成されており、積層構造体２の内部において複数のコイル形成階層すなわち複数の絶縁基材を横断するように形成されている。   As shown in FIG. 3, the first heat conducting portion 30a is formed by joining a heat conducting conductor layer 32a, a second joining conductor 45a, a heat conducting conductor layer 33a, a second joining conductor 46a, and a heat conducting conductor layer 34a. The laminated structure 2 is formed so as to cross a plurality of coil forming layers, that is, a plurality of insulating base materials. Similarly, the second heat conducting portion 30b includes the heat conducting conductor layer 31, the second joining conductor 44, the heat conducting conductor layer 32b, the second joining conductor 45b, the heat conducting conductor layer 33b, the second joining conductor 46b, The heat conductive conductor layer 34b is joined and formed so as to cross a plurality of coil formation layers, that is, a plurality of insulating bases, in the laminated structure 2.

それぞれの熱伝導部３０ａ，３０ｂでは、熱伝導導体層が銅箔で形成され、接合導体が、金属フィラーを含む導電性ペーストの固化物で形成されており、それぞれが絶縁体１０すなわち各絶縁基材１１，１２，１３，１４よりも熱伝導率が高くなっている。そのため、ヒータ６５の熱が熱伝導部３０ａ，３０ｂを伝わって、シート状コイル部品１の下面部１ｂに伝達されやすくなり、熱硬化性接着剤を短時間で効果的に加熱して熱硬化させることができる。   In each of the heat conducting portions 30a and 30b, the heat conducting conductor layer is formed of a copper foil, and the bonding conductor is formed of a solidified conductive paste containing a metal filler. The thermal conductivity is higher than that of the materials 11, 12, 13, and 14. Therefore, the heat of the heater 65 is easily transmitted to the lower surface portion 1b of the sheet-like coil component 1 through the heat conducting portions 30a and 30b, and the thermosetting adhesive is effectively heated and cured in a short time. be able to.

シート状コイル部品１には第１の熱伝導部３０ａと第２の熱伝導部３０ｂの２つの熱伝導部が形成されており、少なくとも１つの熱伝導部３０ｂは積層構造体２の上面部２ａから下面部２ｂまで連続して形成されている。したがって、ヒータ６５の熱を熱硬化性接着剤に効果的に伝達できるようになる。   The sheet-like coil component 1 is formed with two heat conducting portions, a first heat conducting portion 30a and a second heat conducting portion 30b, and at least one heat conducting portion 30b is an upper surface portion 2a of the laminated structure 2. To the lower surface portion 2b. Therefore, the heat of the heater 65 can be effectively transmitted to the thermosetting adhesive.

図８（Ｅ）では、熱硬化性接着剤が硬化した後に、カメラ６１でシート状コイル部品１の画像を上方から撮影し、図１に示す第２の位置認識マーク３６ａの十字のクロス点が、実装基体５０の基準点に一致しているかを確認する。   In FIG. 8E, after the thermosetting adhesive is cured, an image of the sheet-like coil component 1 is taken from above with the camera 61, and the cross point of the cross of the second position recognition mark 36a shown in FIG. Then, it is confirmed whether or not it matches the reference point of the mounting substrate 50.

図８（Ｆ）では、前記確認後に、実装基体５０とシート状コイル部品１を加熱炉６６に供給し、リフロー工程で、半田ペーストを溶融させて固化させ、シート状コイル部品１の端子部２８ａ，２８ｂを、実装基体５０の接続用導体部に半田付けし、電気的に接続した実装体が完成する。   In FIG. 8 (F), after the confirmation, the mounting base 50 and the sheet-shaped coil component 1 are supplied to the heating furnace 66, and the solder paste is melted and solidified in the reflow process. , 28b are soldered to the connecting conductor portion of the mounting substrate 50 to complete the electrically connected mounting body.

なお、上述した本発明の実施の形態においては、複数の絶縁基材を通過して、絶縁基材（シート状コイル部品１）の厚さ方向に延在する熱伝導部として、第１の熱伝導部３０ａと第２の熱伝導部３０ｂが２つ設けられたシート状コイル部品１について説明した。しかしながら、本発明はこれに限らず、熱伝導部の数が１つであっても構わない。この場合、この唯一の熱伝導部が、積層構造体２の上面部２ａから下面部２ｂまで連続して形成されているものに限定されず、第１の熱伝導部３０ａのように、積層構造体２の下面部２ｂまで達していない形態であっても良い。   In the above-described embodiment of the present invention, the first heat is used as the heat conducting portion that passes through the plurality of insulating base materials and extends in the thickness direction of the insulating base material (sheet-like coil component 1). The sheet-like coil component 1 provided with two conductive portions 30a and two second heat conductive portions 30b has been described. However, the present invention is not limited to this, and the number of heat conducting portions may be one. In this case, the only heat conduction part is not limited to the one formed continuously from the upper surface part 2a to the lower surface part 2b of the multilayer structure 2, and a laminated structure like the first heat conduction part 30a. The form which has not reached the lower surface part 2b of the body 2 may be sufficient.

また、上記実施の形態においては、４枚のシート状の絶縁基材１１〜１４が積層されて熱プレスされることによって、隣接する絶縁基材どうしが密着する形態について説明したが、本発明は、熱ブレスを施すものに限られない。例えば、複数のシート状の絶縁基材を接着剤を介して一体化するものであっても良い。   Moreover, in the said embodiment, although the four sheet-like insulation base materials 11-14 were laminated | stacked and hot pressed, the form which adjacent insulation base materials contact | adhered was demonstrated, but this invention is , Not limited to those that are subjected to heat brace. For example, a plurality of sheet-like insulating base materials may be integrated via an adhesive.

Ｃ１ 第１のコイル形成階層
Ｃ２ 第２のコイル形成階層
Ｃ３ 第３のコイル形成階層
Ｃ４ 第４のコイル形成階層
Ｉ１ 第１の絶縁階層
Ｉ２ 第２の絶縁階層
Ｉ３ 第３の絶縁階層
１ シート状コイル部品
１ａ 上面部
１ｂ 下面部
２ 積層構造体
２ａ 上面部
２ｂ 下面部
３ 上部カバー層
１０ 絶縁体
１１ 第１の絶縁基材
１１ａ，１１ｂ スルーホール
１１ｄ 導体形成面
１２ 第２の絶縁基材
１２ａ，１２ｂ，１２ｃ スルーホール
１２ｄ 導体形成面
１３ 第３の絶縁基材
１３ａ，１３ｂ，１３ｃ スルーホール
１３ｄ 導体形成面
１４ 第４の絶縁基材
１４ａ，１４ｂ，１４ｃ スルーホール
１４ｄ 導体形成面
２０ コイル体
２１，２２，２３，２４ コイル導体層
２８ａ，２８ｂ 端子部
２９ａ，２９ｂ 中継導体層
３０ａ 第１の熱伝導部
３０ｂ 第２の熱伝導部
３１，３２ａ，３２ｂ，３３ａ，３３ｂ，３４ａ，３４ｂ 熱伝導導体層
３５ マーク導体層
３５ａ 第１の位置認識マーク
３６ａ 第２の位置認識マーク
４１，４２，４３ 第１の接合導体
４４，４５ａ，４５ｂ，４６ａ，４６ｂ 第２の接合導体
４８ａ，４８ｂ，４８ｃ 第３の接合導体
５０ 実装基体
６５ ヒータ C1 First coil formation layer C2 Second coil formation layer C3 Third coil formation layer C4 Fourth coil formation layer I1 First insulation layer I2 Second insulation layer I3 Third insulation layer 1 Sheet coil Component 1a Upper surface portion 1b Lower surface portion 2 Laminated structure 2a Upper surface portion 2b Lower surface portion 3 Upper cover layer 10 Insulator 11 First insulating base material 11a, 11b Through hole 11d Conductor forming surface 12 Second insulating base material 12a, 12b , 12c Through hole 12d Conductor forming surface 13 Third insulating base materials 13a, 13b, 13c Through hole 13d Conductor forming surface 14 Fourth insulating base materials 14a, 14b, 14c Through hole 14d Conductor forming surface 20 Coil bodies 21, 22 , 23, 24 Coil conductor layers 28a, 28b Terminal portions 29a, 29b Relay conductor layer 30a First heat conducting portion 30b Second heat conducting portion 31 32a, 32b, 33a, 33b, 34a, 34b Thermal conductive conductor layer 35 Mark conductor layer 35a First position recognition mark 36a Second position recognition marks 41, 42, 43 First joint conductors 44, 45a, 45b, 46a 46b Second joint conductors 48a, 48b, 48c Third joint conductor 50 Mounting base 65 Heater

Claims (10)

積層された複数のシート状の絶縁基材と、前記絶縁基材の導体形成面に形成されたコイル導体層と、厚さ方向に隣り合う前記コイル導体層の間に位置する前記絶縁基材に形成された第１のスルーホールと、前記第１のスルーホールに設けられて厚さ方向に隣り合う前記コイル導体層どうしを接合する第１の接合導体とを有し、前記コイル導体層と前記第１の接合導体とでコイル体が形成され、前記コイル体に導通する端子部が設けられているシート状コイル部品において、
前記コイル体の内側に、前記絶縁基材よりも熱伝導率の高い材料で形成された熱伝導部が設けられており、前記熱伝導部は、前記コイル体と絶縁されて、複数の前記絶縁基材を通過するように形成されていることを特徴とするシート状コイル部品。 A plurality of laminated sheet-like insulating base materials, a coil conductor layer formed on a conductor forming surface of the insulating base material, and the insulating base material positioned between the coil conductor layers adjacent in the thickness direction. A first through hole formed, and a first bonding conductor that is provided in the first through hole and joins the coil conductor layers adjacent to each other in the thickness direction, the coil conductor layer and the In the sheet-like coil component in which a coil body is formed with the first bonding conductor and a terminal portion that is electrically connected to the coil body is provided,
A heat conduction part made of a material having a higher thermal conductivity than the insulating base material is provided inside the coil body, and the heat conduction part is insulated from the coil body and has a plurality of the insulations. A sheet-shaped coil component formed so as to pass through a substrate. 前記絶縁基材の前記導体形成面に、前記コイル導体層と絶縁された熱伝導導体層が形成され、前記絶縁基材の第２のスルーホールに設けられた第２の接合導体によって厚さ方向に隣り合う前記熱伝導導体層どうしが接合されて前記熱伝導部が形成されており、
前記コイル導体層と前記熱伝導導体層とが同じ導電材料で形成され、前記第１の接合導体と前記第２の接合導体とが同じ導電材料で形成されている請求項１記載のシート状コイル部品。 A heat conductive conductor layer insulated from the coil conductor layer is formed on the conductor forming surface of the insulating base material, and a thickness direction is formed by a second bonding conductor provided in a second through hole of the insulating base material. The heat conducting portions are formed by joining the heat conducting conductor layers adjacent to each other,
The sheet coil according to claim 1, wherein the coil conductor layer and the heat conductive conductor layer are formed of the same conductive material, and the first joint conductor and the second joint conductor are formed of the same conductive material. parts. 実装面側である下面部から最も離れた位置にある最上層の前記絶縁基材は、前記導体形成面が上に向けられており、当該導体形成面に、前記コイル導体層と前記熱伝導導体層とが形成されている請求項２記載のシート状コイル部品。   The uppermost insulating base material located farthest from the lower surface portion on the mounting surface side is such that the conductor forming surface is directed upward, and the coil conductor layer and the heat conducting conductor are placed on the conductor forming surface. The sheet-shaped coil component according to claim 2, wherein a layer is formed. 前記下面部に位置する最下層の前記絶縁基材は、前記導体形成面が下に向けられており、当該導体形成面に、前記熱伝導導体層に対向し且つ当該熱伝導導体層と接続されていないマーク導体層が形成されており、前記マーク導体層に第１の位置認識マークが形成されている請求項３記載のシート状コイル部品。   The lowermost insulating base material located on the lower surface portion has the conductor forming surface facing downward, and is opposed to the heat conducting conductor layer and connected to the heat conducting conductor layer on the conductor forming surface. The sheet-like coil component according to claim 3, wherein an unmarked mark conductor layer is formed, and a first position recognition mark is formed on the mark conductor layer. 最上層の前記絶縁基材の前記導体形成面に第２の位置認識マークが形成され、最上層の前記絶縁基材の上面部が透光性の絶縁層で覆われている請求項３または４記載のシート状コイル部品。   5. The second position recognition mark is formed on the conductor formation surface of the uppermost insulating base material, and the upper surface portion of the uppermost insulating base material is covered with a translucent insulating layer. The sheet-like coil component as described. 前記熱伝導導体層と前記第２の接合導体とから成る前記熱伝導部が、前記コイル体の内側に複数設けられている請求項２ないし５のいずれかに記載のシート状コイル部品。   The sheet-shaped coil component according to any one of claims 2 to 5, wherein a plurality of the heat conducting portions including the heat conducting conductor layer and the second bonding conductor are provided inside the coil body. 前記熱伝導導体部が銅箔で形成されており、前記第２の接合導体が、金属成分を含んだ導電性ペーストの固化物で構成されている請求項２ないし６のいずれかに記載のシート状コイル部品。   The sheet according to any one of claims 2 to 6, wherein the heat conductive conductor portion is formed of copper foil, and the second bonding conductor is formed of a solidified conductive paste containing a metal component. Coil parts. 請求項１ないし７のいずれかに記載のシート状コイル部品の下面部であって、少なくとも前記熱伝導部に対応する部分が、熱硬化された接着剤層を介して実装基体に固定されていることを特徴とするシート状コイル部品の実装体。   The lower surface portion of the sheet-like coil component according to any one of claims 1 to 7, wherein at least a portion corresponding to the heat conducting portion is fixed to the mounting substrate via a thermosetting adhesive layer. A sheet-like coil component mounting body characterized by the above. 請求項１ないし７のいずれかに記載のシート状コイル部品の下面部であって、少なくとも前記熱伝導部に対応する部分と、実装基体との間に熱硬化性の接着剤を介在させる工程と、
前記シート状コイル部品の上面部であって前記熱伝導部に対応する部分を加熱し、前記熱伝導部を伝わった熱で前記接着剤を熱硬化させる工程と、
前記端子部と前記実装基体の導通部とを電気的に接続する工程と、
を有することを特徴とするシート状コイル部品の実装方法。 A step of interposing a thermosetting adhesive between the mounting base and the lower surface portion of the sheet-shaped coil component according to any one of claims 1 to 7, wherein the portion is at least a portion corresponding to the heat conducting portion. ,
Heating the portion corresponding to the heat conducting portion on the upper surface portion of the sheet-like coil component, and thermally curing the adhesive with the heat transmitted through the heat conducting portion;
Electrically connecting the terminal portion and the conductive portion of the mounting substrate;
A method for mounting a sheet-like coil component, comprising: 前記端子部と前記実装基体の導通部とを電気的に接続する工程は、半田付け工程である請求項９記載のシート状コイル部品の実装方法。   The method for mounting a sheet-shaped coil component according to claim 9, wherein the step of electrically connecting the terminal portion and the conductive portion of the mounting substrate is a soldering step.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10998126B2 (en) 2017-06-08 2021-05-04 Tdk Corporation Coil component and manufacturing methods thereof

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57104565U (en) * 1980-12-18 1982-06-28
JP2001230142A (en) * 2000-02-16 2001-08-24 Toko Inc Method of manufacturing laminate inductor
JP2003023250A (en) * 2001-07-06 2003-01-24 Denso Corp Multilayered substrate and its manufacturing method
JP2004158541A (en) * 2002-11-05 2004-06-03 Tdk Corp Laminated electronic part and its manufacturing method
JP2004186637A (en) * 2002-12-06 2004-07-02 Toko Inc Stacked electronic component
JP2008177516A (en) * 2006-12-22 2008-07-31 Kyocera Corp Substrate with built-in coil
JP2010021591A (en) * 2009-10-27 2010-01-28 Tdk Corp Laminated electronic component
JP2013098311A (en) * 2011-10-31 2013-05-20 Kyocera Corp Substrate with built-in coil and electronic device
JP2016152393A (en) * 2015-02-19 2016-08-22 東レエンジニアリング株式会社 Mounting device and mounting method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001155938A (en) * 1999-09-17 2001-06-08 Fdk Corp Laminated inductor and manufacturing method therefor
JP2004140063A (en) * 2002-10-16 2004-05-13 O K Print:Kk Wiring board
JP4809264B2 (en) * 2007-02-22 2011-11-09 京セラ株式会社 Coil built-in board
CN101821822B (en) * 2008-09-24 2012-07-25 株式会社村田制作所 Multilayer coil component

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57104565U (en) * 1980-12-18 1982-06-28
JP2001230142A (en) * 2000-02-16 2001-08-24 Toko Inc Method of manufacturing laminate inductor
JP2003023250A (en) * 2001-07-06 2003-01-24 Denso Corp Multilayered substrate and its manufacturing method
JP2004158541A (en) * 2002-11-05 2004-06-03 Tdk Corp Laminated electronic part and its manufacturing method
JP2004186637A (en) * 2002-12-06 2004-07-02 Toko Inc Stacked electronic component
JP2008177516A (en) * 2006-12-22 2008-07-31 Kyocera Corp Substrate with built-in coil
JP2010021591A (en) * 2009-10-27 2010-01-28 Tdk Corp Laminated electronic component
JP2013098311A (en) * 2011-10-31 2013-05-20 Kyocera Corp Substrate with built-in coil and electronic device
JP2016152393A (en) * 2015-02-19 2016-08-22 東レエンジニアリング株式会社 Mounting device and mounting method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10998126B2 (en) 2017-06-08 2021-05-04 Tdk Corporation Coil component and manufacturing methods thereof

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