JP2016524336A - 全体的または部分的に溶着された誘電体リード線を有するダイパッケージング - Google Patents
全体的または部分的に溶着された誘電体リード線を有するダイパッケージング Download PDFInfo
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- JP2016524336A JP2016524336A JP2016522336A JP2016522336A JP2016524336A JP 2016524336 A JP2016524336 A JP 2016524336A JP 2016522336 A JP2016522336 A JP 2016522336A JP 2016522336 A JP2016522336 A JP 2016522336A JP 2016524336 A JP2016524336 A JP 2016524336A
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Abstract
Description
Claims (19)
- 複数の接続パッド(3)を有する第1のダイ(1)と、
前記第1のダイ(1)から延出するリボンリード線(10,20)とを備え、前記リボンリード線(20,30)は、コア径を持つ複数の金属コア(12)と、前記金属コアを被覆する誘電体厚を持つ誘電体層(15)とを有し、前記誘電体層の少なくとも一部が複数の前記金属コアの長さ方向に沿って隣接する別の前記金属コアとの間で溶着され、さらに、接地接続される外側金属層を有する配線システム。 - 前記配線システムは、第1のダイ(1)と第2のダイ(2)とを備えたマルチダイ配線システムであり、前記第1のダイおよび前記第2のダイ(1,2)は、それぞれ複数の接続パッド(3)を有し、前記リボンリード線は、前記第1のダイ(1)から前記第2のダイ(2)に延出することを特徴とする請求項1に記載の配線システム。
- 前記配線システムは、第1のダイと第2のダイとを備えたトラフライン配線システムであり、前記第1のダイおよび前記第2のダイは、それぞれ複数の接続パッドを有し、前記リボンリード線は、前記第1のダイから前記第2のダイに延出することを特徴とする請求項1に記載の配線システム。
- 前記配線システムは、複数の接続パッドを有するパッケージ基板を備えたトラフライン配線システムであり、前記リボンリード線は、前記パッケージ基板から前記第1のダイに延出することを特徴とする請求項1に記載の配線システム。
- 前記外側金属層は、溶着された前記誘電体層を部分的にのみ被覆することを特徴とする請求項1から4のいずれか一項に記載の配線システム。
- 前記誘電体層は、前記リード線の長さ方向に沿って完全に溶着されるか、または、部分的にのみ溶着されることを特徴とする請求項1から5のいずれか一項に記載の配線システム。
- 前記第2のダイは、前記第1のダイよりも小型であり、小型の前記第2のダイ付近のリード線の限定された長さ分のみに誘電体が溶着されていることを特徴とする請求項2または3に記載の配線システム。
- 第1のダイと第2のダイとを有する少なくとも1つのスタックドダイを備え、前記リボンリード線は、前記第1のダイから前記第2のダイに延出、または、前記第1のダイから前記スタックドダイの一部ではない別のダイおよび/またはダイ基板に延出することを特徴とする請求項1から7のいずれか一項に記載の配線システム。
- 第1のダイパッケージと第2のダイパッケージとを有し、
前記リボンリード線は、前記第1のダイパッケージから前記第2のダイパッケージに延出することを特徴とする請求項1から8のいずれか一項に記載の配線システム。 - アンテナまたはアンテナシステムのような少なくとも1つのアクティブ素子またはパッシブ素子を有し、
リボンリード線は、前記第1のダイから前記アクティブ素子および/または前記パッシブ素子に延出することを特徴とする請求項1から9のいずれか一項に記載の配線システム。 - 大型ダイから小型ダイへの配線構造の形式であり、1以上のリード線がそれらの少なくとも長さ方向の一部にわたりリボンリード線を形成している請求項1から10のいずれか一項に記載の配線システム。
- 第1のコアを被覆する前記誘電体層は、第1の厚さを有し、
第2のコアを被覆する前記誘電体層は、前記第1の厚さとは異なる第2の厚さを有することを特徴とする請求項1から11のいずれか一項に記載の配線システム。 - 前記外側金属層は、伝熱を促進するために周囲条件に曝されることを特徴とする請求項1から12のいずれか一項に記載の配線システム。
- 前記リード線は、空気または液体の移動、高伝熱性金属、熱ペーストまたは伝熱性接着材、および/または圧電クーラーのような能動冷却手段を含むアクティブおよび/またはパッシブヒートシンクによって対流式または接触により冷却されることを特徴とする請求項1から13のいずれか一項に記載の配線システム。
- 前記リード線は、前記第1のダイからヒートシンクに延出することを特徴とする請求項1から14のいずれか一項に記載の配線システム。
- 請求項1から15のいずれか一項に記載の配線システムを有するBGAパッケージ。
- 請求項1から15のいずれか一項に記載の配線システムを有するリードフレームパッケージ。
- 請求項1から15のいずれか一項に記載の配線システムを備え、前記リード線が前記第1のダイからヒートシンクに延出するパッケージダイの伝熱システム。
- 前記ヒートシンクは、基板、接着層、熱導電ペーストおよび/または金属スラグであることを特徴とする請求項18に記載の伝熱システム。
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US61/842,949 | 2013-07-03 | ||
PCT/EP2014/001823 WO2015000594A1 (en) | 2013-07-03 | 2014-07-02 | An interconnect system comprising an interconnect having a plurality of metal cores at least partially surrounded by a dielectric layer |
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EP3297093B1 (de) * | 2016-09-16 | 2019-01-02 | Rosenberger Hochfrequenztechnik GmbH & Co. KG | Steckverbinder zum verbinden einer optischen faser und eines elektrischen leiters |
US20190206827A1 (en) * | 2017-12-29 | 2019-07-04 | Intel Corporation | Semiconductor package with externally accessible wirebonds |
US11812545B2 (en) | 2020-01-08 | 2023-11-07 | Delta Electronics (Shanghai) Co., Ltd | Power supply system and electronic device |
CN113098234B (zh) | 2020-01-08 | 2022-11-01 | 台达电子企业管理(上海)有限公司 | 供电*** |
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- 2014-07-02 WO PCT/EP2014/001823 patent/WO2015000594A1/en active Application Filing
- 2014-07-02 CA CA2915407A patent/CA2915407C/en active Active
- 2014-07-02 TW TW103211711U patent/TWM506373U/zh unknown
- 2014-07-02 KR KR1020157037293A patent/KR20160029037A/ko not_active Application Discontinuation
- 2014-07-02 CN CN201480038207.6A patent/CN105359267B/zh active Active
- 2014-07-02 JP JP2016522336A patent/JP2016524336A/ja active Pending
- 2014-07-02 EP EP14737150.4A patent/EP3017472A1/en active Pending
- 2014-07-02 US US14/902,504 patent/US9812420B2/en active Active
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2016
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Also Published As
Publication number | Publication date |
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CA2915407A1 (en) | 2015-01-08 |
WO2015000594A1 (en) | 2015-01-08 |
US20160379952A1 (en) | 2016-12-29 |
US9812420B2 (en) | 2017-11-07 |
KR20160029037A (ko) | 2016-03-14 |
EP3017472A1 (en) | 2016-05-11 |
TWM506373U (zh) | 2015-08-01 |
CN105359267B (zh) | 2018-06-05 |
CA2915407C (en) | 2020-09-29 |
HK1218991A1 (zh) | 2017-03-17 |
CN105359267A (zh) | 2016-02-24 |
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