JP2016198780A - Ultrasonic joining method - Google Patents

Ultrasonic joining method Download PDF

Info

Publication number
JP2016198780A
JP2016198780A JP2015078982A JP2015078982A JP2016198780A JP 2016198780 A JP2016198780 A JP 2016198780A JP 2015078982 A JP2015078982 A JP 2015078982A JP 2015078982 A JP2015078982 A JP 2015078982A JP 2016198780 A JP2016198780 A JP 2016198780A
Authority
JP
Japan
Prior art keywords
synthetic resin
metal
horn
resin member
anvil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015078982A
Other languages
Japanese (ja)
Other versions
JP6641097B2 (en
Inventor
土谷　雅弘
Masahiro Tsuchiya
雅弘 土谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2015078982A priority Critical patent/JP6641097B2/en
Publication of JP2016198780A publication Critical patent/JP2016198780A/en
Application granted granted Critical
Publication of JP6641097B2 publication Critical patent/JP6641097B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
  • Laminated Bodies (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an ultrasonic joining method of capable of strongly joining two metal objects to be joined to be integrated with each other even when a synthetic resin member is interposed between the two metal objects to be joined.SOLUTION: An ultrasonic joining method includes: an arrangement step of arranging a laminate formed by laminating a first metal object to be joined and a second metal object to be joined through a synthetic resin member between an anvil and a horn tip having a projection formed on the tip surface; a sandwiching step of sandwiching the laminate with the anvil and the horn chip; and a joining step of oscillating the first and second metal objects to be joined while pressurizing the metal objects to be joined by the horn chip and thereby joining the first and second metal objects to be joined.SELECTED DRAWING: Figure 1

Description

本発明は、超音波接合方法に関する。   The present invention relates to an ultrasonic bonding method.

超音波接合は、電気発振器によって振動子（ホーン）に超音波振動を付与し、この振動子（ホーン）に嵌めた増幅用ホーンの先のチップ（ホーンチップ）によって、アンビル上に配設した２枚の被接合物の重合部分を加圧、加振して２枚の被接合物を接合するものである。   In ultrasonic bonding, ultrasonic vibration is applied to a vibrator (horn) by an electric oscillator, and the tip of the amplifying horn (horn chip) fitted to the vibrator (horn) is disposed on the anvil 2. The superposed portion of the objects to be bonded is pressurized and vibrated to bond the two objects to be bonded.

このような超音波接合方法として、例えば、特許文献１には、対向して設けられた接合チップと下部台との間で二枚の被接合部材を挟圧し、前記接合チップに静加圧をかけて超音波振動させることにより前記二枚の被接合部材を接合させる超音波接合において、前記二枚の被接合部材の接合部近傍を抑え手段によって押え、被接合部材を拘束しつつ超音波接合するようにした超音波接合方法が開示されている。   As such an ultrasonic bonding method, for example, in Patent Document 1, two members to be bonded are sandwiched between a bonding chip and a lower base provided to face each other, and static pressure is applied to the bonding chip. In ultrasonic bonding in which the two members to be bonded are bonded by ultrasonic vibration, the vicinity of the bonding portion between the two members to be bonded is suppressed by a means, and ultrasonic bonding is performed while restraining the members to be bonded. An ultrasonic bonding method is disclosed.

特開昭６４−８３３８９号公報JP-A-64-83389

しかしながら、上記超音波接合方法は、二枚の被接合部材間に合成樹脂製部材が介在していると、合成樹脂製部材が、ホーンチップによって被接合部材に加えられる超音波振動を吸収してしまい、二枚の被接合部材を接合させることができないという問題点を有する。   However, in the ultrasonic bonding method, when a synthetic resin member is interposed between two bonded members, the synthetic resin member absorbs ultrasonic vibration applied to the bonded member by the horn chip. Therefore, there is a problem that the two members to be joined cannot be joined.

本発明は、二つの金属製被接合物間に合成樹脂製部材が介在している場合にあっても、二つの金属製被接合物を強固に接合一体化させることができる超音波接合方法を提供する。   The present invention provides an ultrasonic bonding method capable of firmly joining and integrating two metal workpieces even when a synthetic resin member is interposed between the two metal workpieces. provide.

本発明の超音波接合方法は、アンビルと、先端面に凸部が形成されたホーンチップとの間に、第一の金属製被接合物と第二の金属製被接合物とが合成樹脂製部材を介して積層されてなる積層体を配設する配設工程と、
上記アンビルと上記ホーンチップとによって上記積層体を挟み込む挟持工程と、
上記第一及び第二の金属製被接合物をホーンチップによって加圧しながら加振することによって、第一及び第二の金属製被接合物を接合する接合工程とを有することを特徴とする。 In the ultrasonic bonding method of the present invention, a first metal bonded object and a second metal bonded object are made of a synthetic resin between an anvil and a horn chip having a convex portion formed on a tip surface. A disposing step of disposing a laminated body laminated via a member;
A sandwiching step of sandwiching the laminate by the anvil and the horn chip;
A bonding step of bonding the first and second metal workpieces by applying vibration while pressing the first and second metal workpieces with a horn chip.

上記超音波接合方法において、ホーンチップの先端面に形成された凸部は、角錐形状であることを特徴とする。   In the ultrasonic bonding method, the convex portion formed on the tip surface of the horn chip has a pyramid shape.

本発明の超音波接合方法によれば、ホーンチップの先端面に凸部が形成されていることから、第一の金属製被接合物と第二の金属製被接合物とが合成樹脂製部材を介して積層されてなる積層体をホーンチップとアンビルとによって強固に挟み込んで挟持することができる。   According to the ultrasonic bonding method of the present invention, since the convex portion is formed on the tip surface of the horn chip, the first metal bonded object and the second metal bonded object are made of synthetic resin. It is possible to firmly sandwich and sandwich the laminated body formed through the horn chip and the anvil.

従って、ホーンチップによって積層体に超音波振動を加えたとき、合成樹脂製部材の弾性変形による超音波振動の吸収が概ね抑制され、超音波振動によって、一方の金属製被接合物を他方の金属製被接合物に対して相対的に超音波振動させて、第一及び第二の金属製被接合物を強固に接合（冶金的接合）することができる。   Therefore, when ultrasonic vibration is applied to the laminate by the horn chip, absorption of ultrasonic vibration due to elastic deformation of the synthetic resin member is substantially suppressed, and one metal object to be bonded is bonded to the other metal by the ultrasonic vibration. The first and second metal workpieces can be strongly bonded (metallurgical bonding) by relatively ultrasonically vibrating the workpieces.

超音波接合装置を示した側面図である。It is the side view which showed the ultrasonic bonding apparatus. ホーンチップの下端面に形成された凸部を示した斜視図である。It is the perspective view which showed the convex part formed in the lower end surface of a horn chip | tip. 積層体の他の一例を示した断面図である。It is sectional drawing which showed another example of the laminated body.

本発明の超音波接合方法を図面を参照しながら詳細に説明する。図１に示したように、超音波接合装置Ａは、第一の金属製被接合物４と第二の金属製被接合物５とが合成樹脂製部材６を介して積層されてなる積層体Ｂを載置するアンビル１と、このアンビル１の上方に上下方向に移動可能に配設され且つ水平方向に超音波振動するホーン２とを有し、ホーン２の下端部にはホーンチップ３が着脱自在に取り付けられている。アンビル１とホーンチップ３とによって、アンビル１上に載置された積層体Ｂを上下方向から挟持可能に構成されている。アンビル１とホーンチップ３とによって積層体Ｂを上下方向から挟持して加圧した状態で、ホーン２を超音波振動させてホーンチップ３を超音波振動させることによって、アンビル１上に載置された積層体Ｂの第一及び第二の金属製被接合物に超音波振動を加え、第一及び第二の金属製被接合物の重なり部分を超音波接合することができるように構成されている。   The ultrasonic bonding method of the present invention will be described in detail with reference to the drawings. As shown in FIG. 1, the ultrasonic bonding apparatus A includes a laminate in which a first metal workpiece 4 and a second metal workpiece 5 are laminated via a synthetic resin member 6. B has an anvil 1 on which B is placed, and a horn 2 which is disposed above the anvil 1 so as to be movable in the vertical direction and vibrates ultrasonically in the horizontal direction. It is detachably attached. The anvil 1 and the horn chip 3 are configured so that the laminated body B placed on the anvil 1 can be sandwiched from above and below. In a state where the laminate B is sandwiched and pressed by the anvil 1 and the horn chip 3 from above and below, the horn 2 is ultrasonically vibrated and the horn chip 3 is ultrasonically vibrated, thereby being placed on the anvil 1. Ultrasonic vibration is applied to the first and second metal workpieces of the laminated body B, and the overlapping portion of the first and second metal workpieces can be ultrasonically bonded. Yes.

図２に示したように、ホーンチップ３の先端面30、即ち、積層体Ｂの表面（第一の金属製被接合物又は第二の金属製被接合物の表面）に直接、接触する面には多数の凸部31が形成されている。凸部31は、積層体Ｂの合成樹脂製部材６をその厚み方向に強固に挟持するために設けられている。積層体Ｂの合成樹脂製部材６を強固に挟持し、合成樹脂製部材６を第一及び第二の金属製被接合物４、５間において強固に固定し、合成樹脂製部材６が弾性的に変形することをできるだけ抑制している。合成樹脂製部材の弾性的変形を概ね抑制することによって、ホーンチップからの超音波振動が吸収されるのを概ね抑制している。従って、ホーンチップ３から積層体Ｂに付与される超音波振動によって、一方の金属製被接合物が他方の金属製被接合物に対して相対的に効果的に超音波振動し、その結果、第一及び第二の金属製被接合物は互いに強固に超音波接合される。   As shown in FIG. 2, the front end surface 30 of the horn chip 3, that is, the surface that directly contacts the surface of the laminate B (the surface of the first metal bonded object or the second metal bonded object). A large number of convex portions 31 are formed in the. The convex portion 31 is provided to firmly hold the synthetic resin member 6 of the laminate B in the thickness direction. The synthetic resin member 6 of the laminate B is firmly sandwiched, and the synthetic resin member 6 is firmly fixed between the first and second metal workpieces 4 and 5 so that the synthetic resin member 6 is elastic. The deformation is suppressed as much as possible. By substantially suppressing the elastic deformation of the synthetic resin member, absorption of ultrasonic vibration from the horn chip is generally suppressed. Therefore, by the ultrasonic vibration applied from the horn chip 3 to the laminate B, one metal workpiece is effectively ultrasonically vibrated relative to the other metal workpiece, and as a result, The first and second metal workpieces are strongly ultrasonically bonded to each other.

ホーンチップ３の先端面30に形成されている凸部31の形状は、合成樹脂製部材にその厚み方向に挟持力を加え、積層体Ｂの合成樹脂製部材が弾性変形するのを抑制し、ホーンチップ３から加えられる超音波振動が概ね吸収されないようにできれば、特に限定されない。凸部31の形状としては、例えば、三角錐形状、四角錐形状などの角錐形状、三角錐台形状、四角錐台形状などの角錐台形状、円錐形状、直方体形状などが挙げられ、角錐形状が好ましく、四角錐形状がより好ましい。   The shape of the convex portion 31 formed on the front end surface 30 of the horn chip 3 applies a clamping force to the synthetic resin member in the thickness direction thereof, and suppresses the elastic deformation of the synthetic resin member of the laminate B. There is no particular limitation as long as the ultrasonic vibration applied from the horn chip 3 is not substantially absorbed. Examples of the shape of the convex portion 31 include a pyramid shape such as a triangular pyramid shape and a quadrangular pyramid shape, a truncated pyramid shape such as a triangular frustum shape and a quadrangular pyramid shape, a conical shape, a rectangular parallelepiped shape, and the like. A quadrangular pyramid shape is preferable.

ホーンチップ３の先端面30上における凸部31の配列形態としては、特に限定されないが、図２に示したように、ホーンチップとアンビルとによって積層体を全体的に均一に加圧することができるので、凸部31を縦横に所定間隔ごとに碁盤目状に配してなる配列形態が好ましい。   The arrangement form of the protrusions 31 on the tip surface 30 of the horn chip 3 is not particularly limited, but as shown in FIG. 2, the laminate can be uniformly pressurized with the horn chip and the anvil as a whole. Therefore, an arrangement form in which the convex portions 31 are arranged in a grid pattern at predetermined intervals in the vertical and horizontal directions is preferable.

互いに隣接する凸部31、31間の距離は、合成樹脂製部材にその厚み方向に挟持力を加え、積層体Ｂの合成樹脂製部材が弾性変形するのを効果的に抑制することができるので、１〜２ｍｍが好ましい。なお、互いに隣接する凸部31、31間の距離は、凸部31の基端間の最短距離をいう。   Since the distance between the convex portions 31 and 31 adjacent to each other can apply a clamping force to the synthetic resin member in the thickness direction and effectively suppress the elastic deformation of the synthetic resin member of the laminate B. 1 to 2 mm is preferable. The distance between the convex portions 31 and 31 adjacent to each other is the shortest distance between the base ends of the convex portions 31.

上記超音波接合装置Ａを用いて、合成樹脂製部材６を介して積層された、第一の金属製被接合物４と第二の金属製被接合物５とを超音波接合する方法を説明する。先ず、図１に示したように、第一の金属製被接合物４と第二の金属製被接合物５とが合成樹脂製部材６を介して積層されてなる積層体Ｂを用意する。複数の合成樹脂製部材６が互いに隣接して積層されている場合、複数の合成樹脂製部材６は全体として一個の合成樹脂製部材６を構成する。   A method of ultrasonically bonding the first metal workpiece 4 and the second metal workpiece 5 laminated via the synthetic resin member 6 using the ultrasonic bonding apparatus A will be described. To do. First, as shown in FIG. 1, a laminate B is prepared in which a first metal article 4 and a second metal article 5 are laminated via a synthetic resin member 6. When the plurality of synthetic resin members 6 are laminated adjacent to each other, the plurality of synthetic resin members 6 constitute one synthetic resin member 6 as a whole.

金属製被接合物４、５は金属から形成されておれば、特に限定されず、例えば、銅、アルミニウム、鉄、ニッケルなどが挙げられる。金属製接合物の形態としては、特に限定されず、例えば、シート状、板状が好ましい。   If the metal to-be-joined objects 4 and 5 are formed from the metal, it will not specifically limit, For example, copper, aluminum, iron, nickel etc. are mentioned. It does not specifically limit as a form of metal joining, For example, a sheet form and plate shape are preferable.

合成樹脂製部材６としては、合成樹脂から形成されておれば、特に限定されず、非発泡体であっても発泡体であってもよい。合成樹脂製部材としては、例えば、合成樹脂非発泡シート、合成樹脂発泡シート、粘着剤などが挙げられる。合成樹脂非発泡シート及び合成樹脂発泡シートを構成している合成樹脂としては、例えば、ポリエチレン系樹脂、ポリプロピレン系樹脂などのポリオレフィン系樹脂、ポリエチレンテレフタレートなどのポリエステル系樹脂などが挙げられる。粘着剤としては、例えば、ウレタン系粘着剤、アクリル系粘着剤などが挙げられる。合成樹脂製部材６の形態としては、特に限定されず、例えば、シート状、板状、層状が好ましい。   The synthetic resin member 6 is not particularly limited as long as it is made of a synthetic resin, and may be a non-foamed body or a foamed body. Examples of the synthetic resin member include a synthetic resin non-foamed sheet, a synthetic resin foamed sheet, and an adhesive. Examples of the synthetic resin non-foamed sheet and the synthetic resin constituting the synthetic resin foamed sheet include polyolefin resins such as polyethylene resins and polypropylene resins, and polyester resins such as polyethylene terephthalate. Examples of the pressure-sensitive adhesive include urethane pressure-sensitive adhesives and acrylic pressure-sensitive adhesives. The form of the synthetic resin member 6 is not particularly limited, and for example, a sheet shape, a plate shape, and a layer shape are preferable.

次に、図１に示したように、超音波接合装置Ａのアンビル１とホーンチップ３との間に積層体Ｂを配設する（配設工程）。次に、ホーンチップ３を下方に移動させてホーンチップ３とアンビル１とによって積層体Ｂを上下方向（厚み方向）から挟み込む（挟持工程）。このとき、積層体Ｂの合成樹脂製部材６は、アンビル１とホーンチップ３とによって上下方向（厚み方向）に強固に挟持されている。従って、後述するホーンチップ３による加振によっても合成樹脂製部材６の弾性変形は抑制される。以下、第一の金属製被接合物４がホーンチップ３に接しているものとして説明する。   Next, as shown in FIG. 1, the laminated body B is arrange | positioned between the anvil 1 and the horn chip | tip 3 of the ultrasonic bonding apparatus A (arrangement | positioning process). Next, the horn chip 3 is moved downward, and the laminate B is sandwiched between the horn chip 3 and the anvil 1 from the vertical direction (thickness direction) (clamping step). At this time, the synthetic resin member 6 of the laminate B is firmly sandwiched between the anvil 1 and the horn chip 3 in the vertical direction (thickness direction). Therefore, the elastic deformation of the synthetic resin member 6 is also suppressed by vibration by the horn chip 3 described later. In the following description, it is assumed that the first metal workpiece 4 is in contact with the horn chip 3.

しかる後、ホーン２を超音波振動させることによってホーンチップ３が超音波振動し、ホーンチップ３の超音波振動が積層体Ｂに加えられる。積層体Ｂは上下方向（厚み方向）に加圧状態にて挟持され、合成樹脂製部材６の弾性変形が抑制されているので、ホーンチップ３による超音波振動は、合成樹脂製部材によって殆ど吸収されない（接合工程）。   Thereafter, the horn chip 3 is ultrasonically vibrated by ultrasonically vibrating the horn 2, and the ultrasonic vibration of the horn chip 3 is applied to the laminate B. Since the laminate B is sandwiched in a pressurized state in the vertical direction (thickness direction) and the elastic deformation of the synthetic resin member 6 is suppressed, the ultrasonic vibration caused by the horn chip 3 is almost absorbed by the synthetic resin member. Not (joining process).

そして、ホーンチップ３によってこれに直接、接している第一の金属製被接合物４が超音波振動し、第一の金属製被接合物４が、合成樹脂製部材６及び第二の金属製被接合物５に対して相対的に超音波振動する。この第一の金属製被接合物４の超音波振動によって、第一の金属製被接合物４と、合成樹脂製部材６及び第二の金属製被接合物との間に摩擦が生じ、この摩擦によって摩擦熱が生じる。   Then, the first metal workpiece 4 that is in direct contact with the horn chip 3 is ultrasonically vibrated, and the first metal workpiece 4 is made of the synthetic resin member 6 and the second metal. The ultrasonic vibration is relative to the workpiece 5. The ultrasonic vibration of the first metal workpiece 4 causes friction between the first metal workpiece 4 and the synthetic resin member 6 and the second metal workpiece. Friction generates heat of friction.

合成樹脂製部材６は、金属製被接合物４、５に比して融点が極めて低いことから、ホーンチップ３を積層体Ｂの厚み方向に投影した部分の合成樹脂製部材６は、摩擦熱によって溶融して最終的には消失し、第一及び第二の金属製被接合物４、５同士が超音波接合される。   Since the synthetic resin member 6 has an extremely low melting point compared to the metal workpieces 4 and 5, the synthetic resin member 6 in the portion where the horn chip 3 is projected in the thickness direction of the laminated body B has frictional heat. And finally disappear, and the first and second metal workpieces 4 and 5 are ultrasonically bonded to each other.

このように、合成樹脂製部材６は、アンビル１及びホーンチップ３による積層体Ｂの挟持方向に強固に挟持されて弾性変形が概ね抑制され、合成樹脂製部材６による超音波振動の吸収が概ね抑制されている。   In this way, the synthetic resin member 6 is firmly held in the holding direction of the laminate B by the anvil 1 and the horn chip 3 and elastic deformation is generally suppressed, and the absorption of ultrasonic vibration by the synthetic resin member 6 is substantially suppressed. It is suppressed.

従って、第一及び第二の金属製被接合物４、５間に合成樹脂製部材６が介在していてもホーンチップ３の超音波振動によって、第一及び第二の金属製被接合物４、５を強固に超音波接合することができる。   Therefore, even if the synthetic resin member 6 is interposed between the first and second metal workpieces 4 and 5, the first and second metal workpieces 4 are caused by the ultrasonic vibration of the horn chip 3. 5 can be strongly ultrasonically bonded.

上記超音波接合方法によれば、第一の金属製被接合物４と、合成樹脂製部材６及び第二の金属製被接合物との間の摩擦は、ホーンチップ３の下端面と第一の金属製被接合物４との接触部分を積層体Ｂの厚み方向に投影した部分においてのみ生じる。従って、摩擦熱は、合成樹脂製部材６に部分的に加えられる。合成樹脂発泡シートなどの合成樹脂シートから構成されている圧電シートは、これに熱が加えられると圧電性が低下するという問題が生じるが、上記超音波接合方法によれば、圧電シートには部分的に熱が加えられるにすぎないことから、圧電シートの圧電性を損なうことなく、第一及び第二の金属製被接合物４、５を強固に超音波接合することができる。   According to the ultrasonic bonding method, the friction between the first metal workpiece 4, the synthetic resin member 6, and the second metal workpiece is reduced between the lower end surface of the horn chip 3 and the first metal workpiece. This occurs only at the portion where the contact portion with the metal workpiece 4 is projected in the thickness direction of the laminate B. Accordingly, the frictional heat is partially applied to the synthetic resin member 6. A piezoelectric sheet composed of a synthetic resin sheet such as a synthetic resin foam sheet has a problem that the piezoelectricity is lowered when heat is applied to the sheet. Since only heat is applied, the first and second metal workpieces 4 and 5 can be strongly ultrasonically bonded without impairing the piezoelectricity of the piezoelectric sheet.

上記では、第一及び第二の金属製被接合物４、５間に、合成樹脂製部材６が介在している一方、金属製被接合物が介在していない場合を説明したが、第一及び第二の金属製被接合物４、５間に別の金属製被接合物が介在していてもよい。   In the above, the case where the synthetic resin member 6 is interposed between the first and second metal workpieces 4 and 5 while the metal workpiece is not interposed is described. In addition, another metal workpiece may be interposed between the second metal workpieces 4 and 5.

具体的には、図３に示したように、第一及び第二の金属製被接合物４、５間に、合成樹脂製部材Ｓと金属製被接合物Ｍとが交互に介在してなる積層体Ｂを用意する。なお、合成樹脂製部材Ｓは、上記した合成樹脂製部材６と同様であり、金属製被接合物Ｍは、第一及び第二の金属製被接合物４、５と同様であるので、これらの説明は省略する。複数の合成樹脂製部材が互いに隣接して積層されている場合、複数の合成樹脂製部材は全体として一個の合成樹脂製部材を構成する。複数の金属製被接合物が互いに隣接して積層されている場合、複数の金属製被接合物は全体として一個の金属製被接合物を構成する。   Specifically, as shown in FIG. 3, the synthetic resin members S and the metal workpieces M are alternately interposed between the first and second metal workpieces 4 and 5. A laminate B is prepared. The synthetic resin member S is the same as the synthetic resin member 6 described above, and the metal workpiece M is the same as the first and second metal workpieces 4 and 5. Description of is omitted. When a plurality of synthetic resin members are laminated adjacent to each other, the plurality of synthetic resin members constitute one synthetic resin member as a whole. When a plurality of metal workpieces are stacked adjacent to each other, the plurality of metal workpieces constitute one metal workpiece as a whole.

次に、積層体Ｂを上述と同様の要領で、アンビル１とホーンチップ３とによって上下方向（厚み方向）から挟み込む（挟持工程）。このとき、積層体Ｂの全ての合成樹脂製部材Ｓは、アンビル１とホーンチップ３とによって上下方向（厚み方向）に強固に挟持されている。従って、後述するホーンチップ３による加振にもかかわらず全ての合成樹脂製部材Ｓの弾性変形は抑制されている。   Next, the laminated body B is sandwiched from the vertical direction (thickness direction) by the anvil 1 and the horn chip 3 in the same manner as described above (a sandwiching step). At this time, all the synthetic resin members S of the laminate B are firmly held in the vertical direction (thickness direction) by the anvil 1 and the horn chip 3. Accordingly, the elastic deformation of all the synthetic resin members S is suppressed despite the vibration by the horn chip 3 described later.

しかる後、ホーン２を超音波振動させることによってホーンチップ３が超音波振動し、ホーンチップ３の超音波振動が積層体Ｂに加えられる。積層体Ｂは上下方向（厚み方向）に加圧状態にて挟持され、合成樹脂製部材６の弾性変形が抑制されているので、ホーンチップ３による超音波振動は、何れの合成樹脂製部材Ｓによっても殆ど吸収されない（接合工程）。   Thereafter, the horn chip 3 is ultrasonically vibrated by ultrasonically vibrating the horn 2, and the ultrasonic vibration of the horn chip 3 is applied to the laminate B. Since the laminated body B is clamped in the up and down direction (thickness direction) and the elastic deformation of the synthetic resin member 6 is suppressed, the ultrasonic vibration by the horn chip 3 is caused by any synthetic resin member S. Is hardly absorbed even by the bonding process.

そして、ホーンチップ３によってこれに直接、接している第一の金属製被接合物４が超音波振動し、第一の金属製被接合物４が、全ての合成樹脂製部材及び金属製被接合物に対して相対的に超音波振動し、上述と同様の作用によって、ホーンチップ３を積層体Ｂの厚み方向に投影した部分の合成樹脂製部材Ｓは消失すると共に、第一及び第二の金属製被接合物４、５は、これらの間に介在している金属製被接合物Ｍを介して超音波接合される。即ち、第一及び第二の金属製被接合物４、５とこれに隣接している金属製被接合物Ｍが超音波接合されていると共に、金属製被接合物Ｍ同士も超音波接合されている。   And the 1st metal to-be-joined object 4 which contact | connects this directly with the horn chip 3 ultrasonically vibrates, and the 1st metal to-be-joined object 4 is all synthetic resin members and metal to-be-joined. The portion made of the synthetic resin S in the portion where the horn chip 3 is projected in the thickness direction of the laminated body B disappears as a result of ultrasonic vibration relative to the object and the same action as described above, and the first and second The metal workpieces 4 and 5 are ultrasonically bonded through the metal workpiece M interposed therebetween. That is, the first and second metal workpieces 4 and 5 and the metal workpiece M adjacent thereto are ultrasonically bonded, and the metal workpieces M are also ultrasonically bonded. ing.

上記では、ホーンチップ３の先端面30に凸部31を形成した場合を説明したが、アンビル１の積層体Ｂの載置面にも凸部を形成していることが好ましい。なお、アンビル１の積層体Ｂの載置面に形成される凸部の形状及び配列形態並びに凸部間の距離は、ホーンチップ３の先端面30に形成されている凸部31の形状及び配列形態並びに凸部間の距離と同様であるので説明を省略する。アンビル１の積層体Ｂの載置面に形成される凸部の形状及び配列形態並びに凸部間の距離と、ホーンチップ３の先端面30に形成されている凸部31の形状及び配列形態並びに凸部間の距離とは同一である必要はなく、相違していてもよい。詳細には、アンビル１の積層体Ｂの載置面において、ホーンチップの先端面30を積層体Ｂの厚み方向に投影した部分に凸部を形成していることが好ましい。アンビル１の積層体Ｂの載置面にも凸部を形成していることによって、積層体Ｂをその厚み方向にホーンチップ３及びアンビル１によってより強固に挟み込んで挟持することができる。   Although the case where the convex part 31 was formed in the front end surface 30 of the horn chip 3 was demonstrated above, it is preferable that the convex part is also formed in the mounting surface of the laminated body B of the anvil 1. It should be noted that the shape and arrangement of the protrusions formed on the mounting surface of the laminate B of the anvil 1 and the distance between the protrusions are the shape and arrangement of the protrusions 31 formed on the tip surface 30 of the horn chip 3. Since it is the same as a form and the distance between convex parts, description is abbreviate | omitted. The shape and arrangement of the protrusions formed on the mounting surface of the laminate B of the anvil 1, the distance between the protrusions, the shape and arrangement of the protrusions 31 formed on the tip surface 30 of the horn chip 3, and The distance between the convex portions need not be the same and may be different. Specifically, it is preferable that a convex portion is formed on a portion of the mounting surface of the laminated body B of the anvil 1 that is projected from the tip surface 30 of the horn chip in the thickness direction of the laminated body B. By forming convex portions on the mounting surface of the laminated body B of the anvil 1, the laminated body B can be sandwiched more firmly between the horn chip 3 and the anvil 1 in the thickness direction.

従って、ホーンチップ３によって積層体に超音波振動を加えたとき、合成樹脂製部材の弾性変形による超音波振動の吸収が更に効果的に概ね抑制され、超音波振動によって、一方の金属製被接合物を他方の金属製被接合物に対して相対的に超音波振動させて、第一及び第二の金属製被接合物をより強固に接合（冶金的接合）することができる。   Therefore, when ultrasonic vibration is applied to the laminated body by the horn chip 3, absorption of ultrasonic vibration due to elastic deformation of the synthetic resin member is further effectively suppressed, and one metal workpiece is joined by the ultrasonic vibration. The object can be ultrasonically vibrated relative to the other metal object to bond the first and second metal objects more firmly (metallurgical bonding).

１ アンビル
２ ホーン
３ ホーンチップ
４ 第一の金属製被接合物
５ 第二の金属製被接合物
６ 合成樹脂製部材
31 凸部
Ａ 超音波接合装置
Ｂ 積層体
Ｍ 金属製被接合物
Ｓ 合成樹脂製部材 DESCRIPTION OF SYMBOLS 1 Anvil 2 Horn 3 Horn chip 4 1st metal to-be-joined object 5 2nd metal to-be-joined object 6 Synthetic resin member
31 Convex part A Ultrasonic bonding apparatus B Laminate M Metal object S Synthetic resin member

Claims (2)

アンビルと、先端面に凸部が形成されたホーンチップとの間に、第一の金属製被接合物と第二の金属製被接合物とが合成樹脂製部材を介して積層されてなる積層体を配設する配設工程と、
上記アンビルと上記ホーンチップとによって上記積層体を挟み込む挟持工程と、
上記第一及び第二の金属製被接合物をホーンチップによって加圧しながら加振することによって、第一及び第二の金属製被接合物を接合する接合工程とを有することを特徴とする超音波接合方法。 A laminate in which a first metal workpiece and a second metal workpiece are laminated via a synthetic resin member between an anvil and a horn chip having a convex portion formed on the tip surface. A disposing step of disposing a body;
A sandwiching step of sandwiching the laminate by the anvil and the horn chip;
And a joining step of joining the first and second metal workpieces by applying vibration while pressing the first and second metal workpieces with a horn tip. Sonic bonding method. ホーンチップの先端面に形成された凸部は、角錐形状であることを特徴とする請求項１に記載の超音波接合方法。   The ultrasonic bonding method according to claim 1, wherein the convex portion formed on the tip surface of the horn chip has a pyramid shape.
JP2015078982A 2015-04-08 2015-04-08 Ultrasonic bonding method Active JP6641097B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015078982A JP6641097B2 (en) 2015-04-08 2015-04-08 Ultrasonic bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015078982A JP6641097B2 (en) 2015-04-08 2015-04-08 Ultrasonic bonding method

Publications (2)

Publication Number Publication Date
JP2016198780A true JP2016198780A (en) 2016-12-01
JP6641097B2 JP6641097B2 (en) 2020-02-05

Family

ID=57422164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015078982A Active JP6641097B2 (en) 2015-04-08 2015-04-08 Ultrasonic bonding method

Country Status (1)

Country Link
JP (1) JP6641097B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020131266A (en) * 2019-02-23 2020-08-31 株式会社アルテクス Joining method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000301357A (en) * 1999-04-23 2000-10-31 Yazaki Corp Ultrasonic welding horn and electric wire terminal joining method
JP2004243402A (en) * 2003-02-17 2004-09-02 Mitsui Chemicals Inc Metal foil joining method, and metal foil connecting device
JP2006212687A (en) * 2005-02-07 2006-08-17 Nissan Motor Co Ltd Apparatus for ultrasonic welding

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000301357A (en) * 1999-04-23 2000-10-31 Yazaki Corp Ultrasonic welding horn and electric wire terminal joining method
JP2004243402A (en) * 2003-02-17 2004-09-02 Mitsui Chemicals Inc Metal foil joining method, and metal foil connecting device
JP2006212687A (en) * 2005-02-07 2006-08-17 Nissan Motor Co Ltd Apparatus for ultrasonic welding

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020131266A (en) * 2019-02-23 2020-08-31 株式会社アルテクス Joining method
JP7208606B2 (en) 2019-02-23 2023-01-19 株式会社アルテクス Joining method

Also Published As

Publication number Publication date
JP6641097B2 (en) 2020-02-05

Similar Documents

Publication Publication Date Title
JP4792945B2 (en) Ultrasonic bonding apparatus and bonded structure
JP5899938B2 (en) Secondary battery manufacturing method, secondary battery
WO2014168111A1 (en) Welding device and welding method
JP2014002246A (en) Protective film affixing tool, film laminate and protective film affixing set
KR20120067291A (en) Ultrasonic bonding machine
JP2019005776A (en) Ultrasonic joining method, ultrasonic joining jig, and joint structure
JP6641097B2 (en) Ultrasonic bonding method
JP6827386B2 (en) Ultrasonic bonding jig, ultrasonic bonding method and bonding structure
JP6493782B2 (en) Ultrasonic bonding apparatus and method for manufacturing power storage element using ultrasonic bonding apparatus
JP6673634B2 (en) Ultrasonic bonding method
JPWO2015129394A1 (en) Transportation equipment parts and panel members
JP2018114670A (en) Method for producing composite body of coated steel sheet and resin material
JP4732124B2 (en) Cushioning material
KR101296993B1 (en) Ultrasonic bonding apparatus
JP3986625B2 (en) Ultrasonic bonding of uneven metal materials
JP6842755B2 (en) Multi-layer foil metal joining method
JP7219495B2 (en) Ultrasonic bonding equipment
JP7169006B2 (en) Ultrasonic bonding equipment
JP4293003B2 (en) Ultrasonic welding equipment
JP6934688B2 (en) Metal parts manufacturing method and metal parts manufacturing equipment
JP2019509921A (en) Ultrasonic welding apparatus and ultrasonic welding method for different types of floor materials
JP2016034656A (en) Face joining method
JP2005335105A (en) Horn of ultrasonic welding machine, ultrasonic welding machine and joining method of thermoplastic resin sheet using it
JP2006181623A (en) Ultrasonic jointing method and ultrasonic joining device
JP2016078113A (en) Ultrasonic welder and ultrasonic horn

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180117

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20181030

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20181031

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181225

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190604

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190711

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20191210

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20191227

R151 Written notification of patent or utility model registration

Ref document number: 6641097

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151