JP2016127262A

JP2016127262A - Feedthrough multilayer ceramic capacitor

Info

Publication number: JP2016127262A
Application number: JP2015203774A
Authority: JP
Inventors: 知彦財満; Tomohiko Zaima; 伸中安; Shin Nakayasu; 隆笹木; Takashi Sasaki; 不器男木下; Fukio Kinoshita
Original assignee: Taiyo Yuden Co Ltd
Current assignee: Taiyo Yuden Co Ltd
Priority date: 2014-12-26
Filing date: 2015-10-15
Publication date: 2016-07-11
Also published as: JP2018152594A; HK1222038A1; KR101736718B1; TWI581284B; JP2018152593A; JP6929245B2; JP6901996B2; TW201628033A; KR20160079636A

Abstract

PROBLEM TO BE SOLVED: To provide a feedthrough multilayer ceramic capacitor, the strength of which can be enhanced when mounting on a circuit board.SOLUTION: In addition to a first external electrode 12 provided at one end of a capacitor body 11 in the length direction, and a second external electrode 13 provided at the other end of the capacitor body 11 in the length direction, a feedthrough multilayer ceramic capacitor 10-1 is provided, in the central part of the capacitor body 11 in the length direction, with a square cylindrical third external electrode 14 so as to cover a part of the opposite sides in the height direction, and a part of the opposite sides in the width direction of the capacitor body 11, in non-contact with the first external electrode 12 and second external electrode 13.SELECTED DRAWING: Figure 2

Description

本発明は、貫通型積層セラミックコンデンサに関する。 The present invention relates to a feedthrough multilayer ceramic capacitor.

前記貫通型積層セラミックコンデンサに関連し、後記特許文献１には、図１に示したような貫通型積層セラミックコンデンサ１００（以下単に貫通型コンデンサ１００と言う）が開示されている。 In relation to the feedthrough multilayer ceramic capacitor, Patent Document 1 described below discloses a feedthrough multilayer ceramic capacitor 100 (hereinafter simply referred to as a feedthrough capacitor 100) as shown in FIG.

この貫通型コンデンサ１００は、長さＬ１１＞幅Ｗ１１＞高さＨ１１の条件を満足する略直方体状を成しており、これら長さＬ１１、幅Ｗ１１及び高さＨ１１よりも僅かに小さな長さ、幅及び高さで規定された略直方体状のコンデンサ本体１０１と、コンデンサ本体１０１の長さ方向一端部に設けられた第１外部電極１０２と、コンデンサ本体１０１の長さ方向他端部に設けられた第２外部電極１０３と、コンデンサ本体１０１の幅方向一端部の略中央に設けられた第３外部電極１０４と、コンデンサ本体１０１の幅方向他端部の略中央に設けられた第４外部電極１０５とを有している。 The feedthrough capacitor 100 has a substantially rectangular parallelepiped shape that satisfies the condition of length L11> width W11> height H11, and has a length slightly smaller than these length L11, width W11, and height H11. A substantially rectangular parallelepiped capacitor main body 101 defined by the width and height, the first external electrode 102 provided at one end in the length direction of the capacitor main body 101, and the other end in the length direction of the capacitor main body 101. The second external electrode 103, the third external electrode 104 provided at the approximate center of the one end of the capacitor body 101 in the width direction, and the fourth external electrode provided at the approximate center of the other end of the capacitor body 101 in the width direction. 105.

また、コンデンサ本体１０１内には、複数の第１内部電極層（図示省略）と複数の第２内部電極層（図示省略）とが誘電体層（図示省略）を介して高さ方向に交互に積層された容量部が設けられている。複数の第１内部電極層の一端部は第１外部電極１０２に接続され、且つ、他端部は第２外部電極１０３に接続されており、複数の第２内部電極層の一端部は第３外部電極１０４に接続され、且つ、他端部は第４外部電極１０５に接続されている。 In the capacitor main body 101, a plurality of first internal electrode layers (not shown) and a plurality of second internal electrode layers (not shown) are alternately arranged in the height direction via dielectric layers (not shown). Stacked capacitor portions are provided. One end portions of the plurality of first internal electrode layers are connected to the first external electrode 102, the other end portion is connected to the second external electrode 103, and one end portions of the plurality of second internal electrode layers are third. It is connected to the external electrode 104 and the other end is connected to the fourth external electrode 105.

ところで、この種の貫通型積層セラミックコンデンサに対しては依然として小型化及び薄型化が要求されており、とりわけ薄型化に関しては回路基板に搭載するときの強度が懸念されている。以下に図１を用いてこの点について説明する。 By the way, this type of through-type multilayer ceramic capacitor is still required to be reduced in size and thickness, and in particular, there is a concern about strength when mounted on a circuit board with respect to reduction in thickness. This point will be described below with reference to FIG.

図１に示した従前の貫通型コンデンサ１００は、一般に、部品供給場所において高さ方向一面又は他面の中心（図１（Ａ）の＋印を参照）又はその近傍を吸着ノズルによって吸着された後に搬送され、搬送後に回路基板、例えば表面実装を可能とした回路基板（部品実装基板）や、表面実装及び内部実装を可能とした回路基板（部品内蔵基板）等に搭載される。 The conventional feedthrough capacitor 100 shown in FIG. 1 is generally sucked by a suction nozzle at the part supply location at the center of one surface in the height direction or the other surface (see the + mark in FIG. 1A) or its vicinity. It is transported later and mounted on a circuit board such as a circuit board (component mounting board) capable of surface mounting, a circuit board (component built-in board) capable of surface mounting and internal mounting, etc.

しかしながら、図１に示した従前の貫通型コンデンサ１００は前記搭載時において吸着ノズルから直接コンデンサ本体１０１に荷重が加わる構造にあるため、この荷重によってコンデンサ本体１０１に亀裂が生じる懸念がある。この亀裂は、その大小を問わず、コンデンサ本体１０１内への水分浸入を許容するものであるため、浸入した水分によって第１内部電極層と第２内部電極層が腐食して能力低下を生じる蓋然性が高くなると共に、第１内部電極層と第２内部電極層とが短絡して機能障害を生じる蓋然性が高くなる。 However, since the conventional feedthrough capacitor 100 shown in FIG. 1 has a structure in which a load is directly applied to the capacitor body 101 from the suction nozzle when mounted, there is a concern that the capacitor body 101 may crack due to this load. Regardless of the size of the crack, the crack allows water intrusion into the capacitor body 101. Therefore, there is a probability that the first internal electrode layer and the second internal electrode layer are corroded by the infiltrated water and the capacity is lowered. And the probability that the first internal electrode layer and the second internal electrode layer are short-circuited to cause functional failure increases.

特開２００８−２９４２９８号公報JP 2008-294298 A

本発明の課題は、回路基板に搭載するときの強度向上が図れる貫通型積層セラミックコンデンサを提供することにある。 An object of the present invention is to provide a feedthrough multilayer ceramic capacitor capable of improving strength when mounted on a circuit board.

前記課題を解決するため、本発明に係る貫通型積層セラミックコンデンサは、長さ、幅及び高さで規定された略直方体状のコンデンサ本体内に、複数の第１内部電極層と複数の第２内部電極層とが誘電体層を介して高さ方向に交互に積層された容量部が設けられた貫通型積層セラミックコンデンサであって、（１）前記コンデンサ本体の長さ方向一端部に該コンデンサ本体の長さ方向一面と高さ方向両面の一部と幅方向両面の一部とを連続して覆うように設けられ、前記複数の第１内部電極層の長さ方向一端部が接続された第１外部電極と、（２）前記コンデンサ本体の長さ方向他端部に該コンデンサ本体の長さ方向他面と高さ方向両面の一部と幅方向両面の一部とを連続して覆うように設けられ、前記複数の第１内部電極層の長さ方向他端部が接続された第２外部電極と、（３）前記コンデンサ本体の長さ方向中央部に前記第１外部電極及び前記第２外部電極と非接触下で該コンデンサ本体の高さ方向両面の一部と幅方向両面の一部とを連続して覆うように設けられ、前記幅方向両面の一部を覆う部分の一方に前記複数の第２電極層の幅方向一端部が接続され、且つ、他方に前記複数の第２電極層の幅方向他端部が接続された４角筒状の第３外部電極と、を備えており、（４）前記貫通型積層セラミックコンデンサを高さ方向からみたときの前記第１外部電極の前記コンデンサ本体の長さに沿う寸法をＥ１とし、前記第２外部電極の前記コンデンサ本体の長さに沿う寸法をＥ２とし、前記第３外部電極の前記コンデンサ本体の長さに沿う寸法をＥ３としたとき、前記寸法Ｅ１と前記寸法Ｅ３はＥ１＜Ｅ３の条件を満足し、且つ、前記寸法Ｅ２と前記寸法Ｅ３はＥ２＜Ｅ３の条件を満足している。 In order to solve the above-described problems, a through-type multilayer ceramic capacitor according to the present invention includes a plurality of first internal electrode layers and a plurality of second electrodes in a substantially rectangular parallelepiped capacitor body defined by a length, a width, and a height. A through-type multilayer ceramic capacitor provided with a capacitor portion in which internal electrode layers are alternately stacked in a height direction through dielectric layers, wherein (1) the capacitor body is provided at one end in the length direction of the capacitor body. Provided so as to continuously cover one surface in the length direction, part of both sides in the height direction and part of both surfaces in the width direction, and one end in the length direction of the plurality of first internal electrode layers is connected A first external electrode; and (2) the other end in the length direction of the capacitor body is continuously covered with the other surface in the length direction, part of both sides in the height direction, and part of both sides in the width direction. The other end in the length direction of the plurality of first internal electrode layers A third external electrode connected to the capacitor body; and (3) a part of both sides of the capacitor body in the height direction in a non-contact manner with the first external electrode and the second external electrode at the longitudinal center of the capacitor body. And one end of the plurality of second electrode layers are connected to one of the portions covering a part of the both sides of the width direction, and the other A rectangular tube-shaped third external electrode connected to the other end in the width direction of the plurality of second electrode layers, and (4) when the through-type multilayer ceramic capacitor is viewed from the height direction. The dimension of the first external electrode along the length of the capacitor body is E1, the dimension of the second external electrode along the length of the capacitor body is E2, and the length of the capacitor body of the third external electrode is E2. When the dimension along the length is E3, the dimension E1 and the front Dimensions E3 will satisfy the condition of E1 <E3, and the dimension E3 and the dimension E2 is satisfies the condition of E2 <E3.

本発明によれば、回路基板に搭載するときの強度向上が図れる貫通型積層セラミックコンデンサを提供することができる。 ADVANTAGE OF THE INVENTION According to this invention, the penetration type multilayer ceramic capacitor which can aim at the intensity | strength improvement when mounting in a circuit board can be provided.

図１（Ａ）は従前の貫通型積層セラミックコンデンサの高さ方向一面を示す図、図１（Ｂ）は同幅方向一面を示す図である。FIG. 1A is a view showing one surface in the height direction of a conventional through-type multilayer ceramic capacitor, and FIG. 1B is a view showing one surface in the same width direction. 図２（Ａ）は本発明の第１実施形態に係る貫通型積層セラミックコンデンサの高さ方向一面を示す図、図２（Ｂ）は同幅方向一面を示す図である。FIG. 2A is a view showing one surface in the height direction of the feedthrough multilayer ceramic capacitor according to the first embodiment of the present invention, and FIG. 2B is a view showing one surface in the same width direction. 図３（Ａ）はコンデンサ本体に内蔵された第１内部電極層の形状を示す図、図３（Ｂ）はコンデンサ本体に内蔵された第２内部電極層の形状を示す図である。FIG. 3A is a view showing the shape of the first internal electrode layer built in the capacitor body, and FIG. 3B is a view showing the shape of the second internal electrode layer built in the capacitor body. 図４は図２（Ａ）のＳ１−Ｓ１線に沿う拡大断面図である。FIG. 4 is an enlarged cross-sectional view taken along line S1-S1 in FIG. 図５は図２（Ｂ）のＳ２−Ｓ２線に沿う拡大断面図である。FIG. 5 is an enlarged cross-sectional view taken along line S2-S2 of FIG. 図６は図２（Ｂ）のＳ３−Ｓ３線に沿う拡大断面図である。FIG. 6 is an enlarged sectional view taken along line S3-S3 of FIG. 図７は図２（Ａ）の拡大図である。FIG. 7 is an enlarged view of FIG. 図８（Ａ）は本発明の第２実施形態に係る貫通型積層セラミックコンデンサの高さ方向一面を示す図、図２（Ｂ）は同幅方向一面を示す図である。FIG. 8A is a view showing one surface in the height direction of the feedthrough multilayer ceramic capacitor according to the second embodiment of the present invention, and FIG. 2B is a view showing one surface in the same width direction. 図９（Ａ）はコンデンサ本体に内蔵された第１内部電極層の形状を示す図、図９（Ｂ）はコンデンサ本体に内蔵された第２内部電極層の形状を示す図である。FIG. 9A is a diagram showing the shape of the first internal electrode layer built in the capacitor body, and FIG. 9B is a diagram showing the shape of the second internal electrode layer built in the capacitor body. 図１０はコンデンサ本体の高さ方向一面を示す図である。FIG. 10 is a view showing one surface of the capacitor main body in the height direction. 図１１は図８（Ｂ）のＳ４−Ｓ４線に沿う拡大断面図である。FIG. 11 is an enlarged cross-sectional view taken along line S4-S4 in FIG. 図１２（Ａ）は図９（Ａ）に示した第１内部電極層の形状変形例を示す図、図１２（Ｂ）は図９（Ａ）に示した第１内部電極層の代わりに図１２（Ａ）に示した第１内部電極層を用いたコンデンサ本体の高さ方向一面を示す図１０対応図である。12A is a diagram showing a modification of the shape of the first internal electrode layer shown in FIG. 9A, and FIG. 12B is a diagram instead of the first internal electrode layer shown in FIG. 9A. FIG. 11 is a view corresponding to FIG. 10 showing one surface in the height direction of the capacitor body using the first internal electrode layer shown in FIG.

《第１実施形態》
先ず、図２〜図７を用いて、本発明の第１実施形態に係る貫通型積層セラミックコンデンサ１０-1（以下単に貫通型コンデンサ１０-1と言う）の構造及び効果等について説明する。因みに、図４及び図６には後記第１内部電極層１５を５層描き、且つ、後記第２内部電極層１６を５層描いているが、これは図示の都合に依るものであって後記第１内部電極層１５の層数と後記第２内部電極層１６の層数を制限するものではない。 << First Embodiment >>
First, the structure and effects of the feedthrough multilayer ceramic capacitor 10-1 (hereinafter simply referred to as feedthrough capacitor 10-1) according to the first embodiment of the present invention will be described with reference to FIGS. 4 and 6 illustrate five first internal electrode layers 15 described later and five second internal electrode layers 16 described later. This is for convenience of illustration and is described later. The number of first internal electrode layers 15 and the number of second internal electrode layers 16 to be described later are not limited.

図２（Ａ）及び図２（Ｂ）に示したように、貫通型コンデンサ１０-1は、長さＬ１＞幅Ｗ１＞高さＨ１の条件を満足する略直方体状を成しており、これら長さＬ１、幅Ｗ１及び高さＨ１よりも僅かに小さな長さ、幅及び高さで規定された略直方体状のコンデンサ本体１１と、コンデンサ本体１１の長さ方向一端部（図２（Ａ）及び図２（Ｂ）の左端部）に設けられた第１外部電極１２と、コンデンサ本体１１の長さ方向他端部（図２（Ａ）及び図２（Ｂ）の右端部）に設けられた第２外部電極１３と、コンデンサ本体１１の長さ方向中央部（図２（Ａ）及び図２（Ｂ）の左右中央部）に第１外部電極１２及び第２外部電極１３と非接触下で設けられた４角筒状の第３外部電極１４とを備えている。また、コンデンサ本体１１の高さ方向両面及び幅方向両面のうち、第１外部電極１２と第３外部電極１４の間の部分１１ａと、第２外部電極１３と第３外部電極１４の間の部分１１ｂは、それぞれ露出している（以下露出部分１１ａ及び露出部分１１ｂと言う）。 As shown in FIGS. 2A and 2B, the feedthrough capacitor 10-1 has a substantially rectangular parallelepiped shape that satisfies the condition of length L1> width W1> height H1. A substantially rectangular parallelepiped capacitor main body 11 defined by a length, width and height slightly smaller than the length L1, the width W1 and the height H1, and one end portion in the length direction of the capacitor main body 11 (FIG. 2A) And the first external electrode 12 provided at the left end of FIG. 2B and the other end in the length direction of the capacitor body 11 (the right end of FIGS. 2A and 2B). The first external electrode 12 and the second external electrode 13 are not in contact with the second external electrode 13 and the central portion in the length direction of the capacitor main body 11 (the left and right central portions in FIGS. 2A and 2B). And the third external electrode 14 having a quadrangular cylindrical shape. Further, of both the height direction both surfaces and the width direction both surfaces of the capacitor body 11, a portion 11 a between the first external electrode 12 and the third external electrode 14 and a portion between the second external electrode 13 and the third external electrode 14. 11b is exposed (hereinafter referred to as an exposed portion 11a and an exposed portion 11b).

図４に示したように、コンデンサ本体１１は、誘電体製の第１保護部ＰＰ１と、複数の第１内部電極層１５と複数の第２内部電極層１６とが誘電体層１７を介して高さ方向に交互に積層された容量部ＣＰと、誘電体製の第２保護部ＰＰ２とが、同順序で高さ方向に層状に並ぶように有している。各第１内部電極層１５は、図３（Ａ）に示したような略矩形状を成していて、長さ方向一端部（図３（Ａ）の左端部）と長さ方向他端部（図３（Ａ）の右端部）のそれぞれに、長さ方向に延びる幅狭の引出部１５ａを一体に有している。一方、各第２内部電極層１６は、図３（Ｂ）に示したような略矩形状を成していて、幅方向一端部（図３（Ｂ）の下端部）と幅方向他端部（図３（Ｂ）の上端部）のそれぞれに、幅方向に延びる幅狭の引出部１６ａを一体に有している。 As shown in FIG. 4, the capacitor body 11 includes a dielectric first protective part PP1, a plurality of first internal electrode layers 15 and a plurality of second internal electrode layers 16 with a dielectric layer 17 interposed therebetween. Capacitance portions CP and dielectric second protection portions PP2 alternately stacked in the height direction are arranged in layers in the height direction in the same order. Each first internal electrode layer 15 has a substantially rectangular shape as shown in FIG. 3A, and is one end in the length direction (the left end in FIG. 3A) and the other end in the length direction. Each (right end portion in FIG. 3A) integrally has a narrow drawer portion 15a extending in the length direction. On the other hand, each second internal electrode layer 16 has a substantially rectangular shape as shown in FIG. 3B, and has one end in the width direction (the lower end in FIG. 3B) and the other end in the width direction. Each (upper end portion in FIG. 3B) integrally has a narrow drawer portion 16a extending in the width direction.

図４〜図６から分かるように、各第１内部電極層１５の長さ方向一端部、具体的には図３（Ａ）の左側引出部１５ａの左端縁は第１外部電極１２の後記部分１２ａに電気的に接続され、各第１内部電極層の長さ方向他端部、具体的には図３（Ａ）の右側引出部１５ａの右端縁は第２外部電極１３の後記部分１３ａに電気的に接続されている。一方、各第２内部電極層１６の幅方向一端部、具体的には図３（Ｂ）の下側引出部１６ａの下端縁は第３外部電極１４の後記部分１４ｃに電気的に接続され、各第２内部電極層１６の幅方向他端部、具体的には図３（Ｂ）の上側引出部１６ａの上端縁は第３外部電極１４の後記部分１４ｄに電気的に接続されている。 As can be seen from FIGS. 4 to 6, one end portion in the length direction of each first internal electrode layer 15, specifically, the left end edge of the left lead portion 15 a in FIG. 3A is a postscript portion of the first external electrode 12. The other end in the length direction of each first internal electrode layer, specifically, the right end edge of the right lead portion 15a in FIG. 3A is connected to a postscript portion 13a of the second external electrode 13. Electrically connected. On the other hand, one end in the width direction of each second internal electrode layer 16, specifically, the lower end edge of the lower lead portion 16 a in FIG. 3B is electrically connected to the postscript portion 14 c of the third external electrode 14, The other end in the width direction of each second internal electrode layer 16, specifically, the upper end edge of the upper lead portion 16 a in FIG. 3B is electrically connected to the postscript portion 14 d of the third external electrode 14.

尚、第１保護部ＰＰ１と各誘電体層１７と第２保護部ＰＰ２は、組成が略同じで誘電率も略同じ誘電体セラミックスから成り、各誘電体層１７の厚さは略同じである。この誘電体セラミックスには、好ましくはチタン酸バリウム、チタン酸ストロンチウム、チタン酸カルシウム、チタン酸マグネシウム、ジルコン酸カルシウム、チタン酸ジルコン酸カルシウム、ジルコン酸バリウム、酸化チタン等を主成分とした誘電体セラミックス、より好ましくはε＞１０００又はクラス２（高誘電率系）の誘電体セラミックスを使用できる。ここでの「組成が略同じで誘電率も略同じ誘電体セラミックス」は、組成と誘電率が全く同じ場合の他、焼結度合等の関係から組成と誘電率の少なくとも一方が許容範囲内で若干異なる場合をその意味として含み、「厚さは略同じ」は厚さが全く同じ場合の他、積層時の圧縮度合等の関係から厚さが許容範囲内や製造公差内で若干異なる場合をその意味として含む。 The first protective part PP1, each dielectric layer 17, and the second protective part PP2 are made of dielectric ceramics having substantially the same composition and substantially the same dielectric constant, and the thicknesses of the dielectric layers 17 are substantially the same. . This dielectric ceramic is preferably a dielectric ceramic mainly composed of barium titanate, strontium titanate, calcium titanate, magnesium titanate, calcium zirconate, calcium zirconate titanate, barium zirconate, titanium oxide, etc. More preferably, dielectric ceramics of ε> 1000 or class 2 (high dielectric constant type) can be used. “Dielectric ceramics with substantially the same composition and substantially the same dielectric constant” as used herein means that at least one of the composition and the dielectric constant is within an allowable range due to the degree of sintering, etc. The meaning includes the case where the thickness is almost the same, as well as the case where the thickness is slightly different within the allowable range or manufacturing tolerance due to the degree of compression at the time of lamination. Include as its meaning.

また、各第１内部電極層１５と各第２内部電極層１６は、組成が略同じ良導体から成り、各第１内部電極層１５と各第２内部電極層１６の厚さは略同じである。この良導体には、好ましくはニッケル、銅、パラジウム、白金、銀、金、これらの合金等を主成分した良導体を使用できる。ここでの「組成が略同じ良導体」は組成が全く同じ場合の他、焼結度合等の関係から組成が許容範囲内で若干異なる場合をその意味として含み、「厚さは略同じ」は厚さが全く同じ場合の他、積層時の圧縮度合等の関係から厚さが許容範囲内や製造公差内で若干異なる場合をその意味として含む。 Each first internal electrode layer 15 and each second internal electrode layer 16 are made of good conductors having substantially the same composition, and the thickness of each first internal electrode layer 15 and each second internal electrode layer 16 is substantially the same. . As the good conductor, a good conductor mainly composed of nickel, copper, palladium, platinum, silver, gold, an alloy thereof or the like can be used. The term “good conductor having substantially the same composition” as used herein includes not only the case where the composition is exactly the same, but also the case where the composition is slightly different within an allowable range due to the degree of sintering, etc. In addition to the case where the thicknesses are exactly the same, the meaning includes the case where the thickness is slightly different within the allowable range or within the manufacturing tolerance due to the degree of compression during lamination.

図４〜図６に示したように、第１外部電極１２は、コンデンサ本体１１の長さ方向一面（図４及び図５の左面）を覆う部分１２ａと、コンデンサ本体１１の高さ方向一面（図４の上面）の一部を覆う部分１２ｂと、コンデンサ本体１１の高さ方向他面（図４の下面）の一部を覆う部分１２ｃと、コンデンサ本体１１の幅方向一面（図５の下面）の一部を覆う部分１２ｄと、コンデンサ本体１１の幅方向他面（図５の上面）の一部を覆う部分１２ｅとを連続して有している。また、第１外部電極１２は、コンデンサ本体１１の長さ方向一面（図４及び図５の左面）の稜線（４本の稜線を指す）に近い部分１２ｆの厚さが、部分１２ｂ〜１２ｅの厚さよりも厚くなっている（以下厚肉部分１２ｆと言う）。 As shown in FIGS. 4 to 6, the first external electrode 12 includes a portion 12 a that covers one surface in the length direction of the capacitor body 11 (left surface in FIGS. 4 and 5), and one surface in the height direction of the capacitor body 11 ( A portion 12b covering a part of the upper surface in FIG. 4, a portion 12c covering a part of the other surface in the height direction of the capacitor body 11 (lower surface in FIG. 4), and one surface in the width direction of the capacitor body 11 (lower surface in FIG. 5). ) And a portion 12e covering a part of the other surface in the width direction of the capacitor main body 11 (upper surface in FIG. 5). The first external electrode 12 has a thickness of a portion 12f near the ridgelines (pointing to four ridgelines) of one surface in the length direction of the capacitor main body 11 (left surface in FIGS. 4 and 5) of the portions 12b to 12e. It is thicker than the thickness (hereinafter referred to as the thick portion 12f).

部分１２ｂ〜１２ｅのコンデンサ本体１１の長さに沿う寸法は、製造公差を含まない設計上の基準寸法において同じである。また、部分１２ｂ〜１２ｅの厚さは、製造公差を含まない設計上の基準寸法において同じである。 The dimensions of the portions 12b to 12e along the length of the capacitor body 11 are the same in the design reference dimensions that do not include manufacturing tolerances. Further, the thicknesses of the portions 12b to 12e are the same in design reference dimensions not including manufacturing tolerances.

図４〜図６に示したように、第２外部電極１３は、コンデンサ本体１１の長さ方向他面（図４及び図５の右面）を覆う部分１３ａと、コンデンサ本体１１の高さ方向一面（図４の上面）の一部を覆う部分１３ｂと、コンデンサ本体１１の高さ方向他面（図４の下面）の一部を覆う部分１３ｃと、コンデンサ本体１１の幅方向一面（図５の下面）の一部を覆う部分１３ｄと、コンデンサ本体１１の幅方向他面（図５の上面）の一部を覆う部分１３ｅとを連続して有している。また、第２外部電極１３は、コンデンサ本体１１の長さ方向他面（図４及び図５の右面）の稜線（４本の稜線を指す）に近い部分１３ｆの厚さが、部分１３ｂ〜１３ｅの厚さよりも厚くなっている（以下厚肉部分１３ｆと言う）。 As shown in FIGS. 4 to 6, the second external electrode 13 includes a portion 13 a that covers the other surface in the length direction of the capacitor body 11 (the right surface in FIGS. 4 and 5), and one surface in the height direction of the capacitor body 11. (A top surface in FIG. 4), a portion 13 b covering a part of the capacitor body 11, a portion 13 c covering a part of the other surface in the height direction (a bottom surface in FIG. 4), and one surface in the width direction of the capacitor body 11 (in FIG. 5). A portion 13d covering a part of the lower surface and a portion 13e covering a part of the other surface in the width direction of the capacitor body 11 (upper surface in FIG. 5) are continuously provided. The second external electrode 13 has portions 13b to 13e having a thickness of a portion 13f close to a ridgeline (pointing to four ridgelines) on the other surface in the length direction of the capacitor body 11 (the right surface in FIGS. 4 and 5). (Hereinafter, referred to as a thick portion 13f).

部分１３ｂ〜１３ｅのコンデンサ本体１１の長さに沿う寸法は、製造公差を含まない設計上の基準寸法において同じである。また、部分１３ｂ〜１３ｅの厚さは、製造公差を含まない設計上の基準寸法において同じである。 The dimensions of the portions 13b to 13e along the length of the capacitor body 11 are the same in the design reference dimensions that do not include manufacturing tolerances. Moreover, the thickness of the parts 13b-13e is the same in the design reference dimension which does not include a manufacturing tolerance.

図４〜図６に示したように、第３外部電極１４は、コンデンサ本体１１の高さ方向一面（図４及び図６の上面）の一部を覆う部分１４ａと、コンデンサ本体１１の高さ方向他面（図４及び図６の下面）の一部を覆う部分１４ｂと、コンデンサ本体１１の幅方向一面（図５の下面、図６の左面）の一部を覆う部分１４ｃと、コンデンサ本体１１の幅方向他面（図５の上面、図６の右面）の一部を覆う部分１４ｄとを連続して有している。また、第３外部電極１４は、コンデンサ本体１１の高さ方向一面（図４及び図６の上面）の稜線（２本の稜線を指す）に近い部分１４ｅの厚さと、コンデンサ本体１１の高さ方向他面（図４及び図６の下面）の稜線（２本の稜線を指す）に近い部分１４ｅの厚さが、部分１４ａ〜１４ｄの厚さよりも厚くなっている（以下厚肉部分１４ｅと言う）。 As shown in FIGS. 4 to 6, the third external electrode 14 includes a portion 14 a that covers a part of one surface in the height direction of the capacitor body 11 (upper surface in FIGS. 4 and 6), and the height of the capacitor body 11. A portion 14b that covers a part of the other surface in the direction (the lower surface in FIGS. 4 and 6), a portion 14c that covers a part of one surface in the width direction of the capacitor body 11 (the lower surface in FIG. 5, the left surface in FIG. 6), and the capacitor body 11 continuously covers a portion 14d covering a part of the other surface in the width direction 11 (the upper surface in FIG. 5 and the right surface in FIG. 6). The third external electrode 14 has a thickness of a portion 14e close to a ridgeline (pointing to two ridgelines) of one surface in the height direction of the capacitor body 11 (upper surface in FIGS. 4 and 6), and the height of the capacitor body 11. The thickness of the portion 14e close to the ridge line (pointing to the two ridge lines) of the other direction surface (the lower surface in FIGS. 4 and 6) is thicker than the thickness of the portions 14a to 14d (hereinafter referred to as the thick portion 14e). say).

部分１４ａ〜１４ｄのコンデンサ本体１１の長さに沿う寸法は、製造公差を含まない設計上の基準寸法において同じである。また、部分１４ａ〜１４ｄの厚さは、製造公差を含まない設計上の基準寸法において同じである。 The dimensions of the portions 14a to 14d along the length of the capacitor body 11 are the same in the design reference dimensions that do not include manufacturing tolerances. Moreover, the thickness of the parts 14a-14d is the same in the design standard dimension which does not include a manufacturing tolerance.

尚、第１外部電極１２と第２外部電極１３と第３外部電極１４は、コンデンサ本体１１の外面に密着した下地膜と、この下地膜の外面に密着した表面膜との２層構造、或いは、下地膜と表面膜との間に少なくとも１つの中間膜を有する多層構造を有している。下地膜は例えば焼き付け膜から成り、この焼き付け膜には、好ましくはニッケル、銅、パラジウム、白金、銀、金、これらの合金等を主成分した良導体を使用できる。表面膜は例えばメッキ膜から成り、このメッキ膜には、好ましくは銅、スズ、パラジウム、金、亜鉛、これらの合金等を主成分とした良導体を使用できる。中間膜は例えばメッキ膜から成り、このメッキ膜には、好ましくは白金、パラジウム、金、銅、ニッケル、これらの合金等を主成分とした良導体を使用できる。 The first external electrode 12, the second external electrode 13, and the third external electrode 14 are each a two-layer structure of a base film that is in close contact with the outer surface of the capacitor body 11 and a surface film that is in close contact with the outer surface of the base film, or And a multilayer structure having at least one intermediate film between the base film and the surface film. The base film is made of, for example, a baked film, and a good conductor mainly composed of nickel, copper, palladium, platinum, silver, gold, or an alloy thereof can be used for the baked film. The surface film is made of, for example, a plating film, and a good conductor whose main component is preferably copper, tin, palladium, gold, zinc, or an alloy thereof can be used for the plating film. The intermediate film is made of, for example, a plating film, and a good conductor whose main component is preferably platinum, palladium, gold, copper, nickel, an alloy thereof, or the like can be used for the plating film.

前述の貫通型コンデンサ１０-1は、図２（Ａ）に示したように、貫通型コンデンサ１０-1を高さ方向からみたときの第１外部電極１２のコンデンサ本体１１の長さに沿う寸法をＥ１とし、第２外部電極１３のコンデンサ本体１１の長さに沿う寸法をＥ２とし、第３外部電極１４のコンデンサ本体１１の長さに沿う寸法をＥ３としたとき、寸法Ｅ１と寸法Ｅ３はＥ１＜Ｅ３の条件を満足し、且つ、寸法Ｅ２と寸法Ｅ３はＥ２＜Ｅ３の条件を満足している。因みに、寸法Ｅ１と寸法Ｅ２は、製造公差を含まない設計上の基準寸法において同じであっても良いし、僅かに異なっていても良い。 As shown in FIG. 2A, the feedthrough capacitor 10-1 described above has a dimension along the length of the capacitor body 11 of the first external electrode 12 when the feedthrough capacitor 10-1 is viewed from the height direction. Is E1, the dimension of the second external electrode 13 along the length of the capacitor body 11 is E2, and the dimension of the third external electrode 14 along the length of the capacitor body 11 is E3, the dimensions E1 and E3 are The condition E1 <E3 is satisfied, and the dimension E2 and the dimension E3 satisfy the condition E2 <E3. Incidentally, the dimension E1 and the dimension E2 may be the same or slightly different in the design standard dimension not including the manufacturing tolerance.

前掲のＥ１＜Ｅ３の条件とＥ２＜Ｅ３の条件は、「搭載時の強度向上」に有効であるため、以下にその有効性（効果）について説明する。 The above-mentioned conditions of E1 <E3 and E2 <E3 are effective for “improvement of strength at the time of mounting”, and the effectiveness (effect) will be described below.

前述の貫通型コンデンサ１０-1は、部品供給場所において高さ方向一面又は他面の中心（図２（Ａ）の＋印を参照）又はその近傍を吸着ノズルによって吸着された後に搬送され、搬送後に回路基板、例えば表面実装を可能とした回路基板（部品実装基板）や、表面実装及び内部実装を可能とした回路基板（部品内蔵基板）等に搭載される。 The feedthrough capacitor 10-1 is transported after being sucked by a suction nozzle at the center of one surface in the height direction or the other surface (refer to the + sign in FIG. 2A) or its vicinity at the part supply location. It is mounted on a circuit board, for example, a circuit board (component mounting board) that enables surface mounting, a circuit board (component built-in board) that enables surface mounting and internal mounting, and the like.

図１に示した従前の貫通型コンデンサ１００は、前記搭載時において吸着ノズルから直接コンデンサ本体１０１に荷重が加わる構造にあるため、この荷重によってコンデンサ本体１０１に亀裂が生じる懸念がある。これに対し、前述の貫通型コンデンサ１０-1は、コンデンサ本体１１の長さ方向中央部に４角筒状の第３外部電極１４が存在し、しかも、前掲のＥ１＜Ｅ３の条件とＥ２＜Ｅ３の条件を満足しているため、前記搭載時における吸着ノズルからの荷重を第３外部電極１４で受けることができ、しかも、この荷重を４角筒状の第３外部電極１４に分散して緩和することができ、これにより、前記搭載時にコンデンサ本体１１に亀裂が生じることを防止して、搭載時の強度向上を図ることができる。第３外部電極１４の寸法Ｅ３は可能な限り大きく設計することが望ましく、このようにすれば前記緩和作用をより確実に得られるし、第３外部電極１４に対する吸着ノズルの接触位置がずれた場合でも前記同様の恩恵が得られる。 Since the conventional feedthrough capacitor 100 shown in FIG. 1 has a structure in which a load is directly applied to the capacitor body 101 from the suction nozzle when mounted, there is a concern that the capacitor body 101 may crack due to this load. On the other hand, the feedthrough capacitor 10-1 described above has the third external electrode 14 in the shape of a square tube at the center in the length direction of the capacitor body 11, and the above-described conditions of E1 <E3 and E2 < Since the condition of E3 is satisfied, the load from the suction nozzle at the time of mounting can be received by the third external electrode 14, and this load is distributed to the third external electrode 14 having a rectangular tube shape. Accordingly, the capacitor main body 11 can be prevented from cracking at the time of mounting, and the strength at the time of mounting can be improved. Desirably, the dimension E3 of the third external electrode 14 is designed to be as large as possible. In this way, the relaxation action can be obtained more reliably, and the contact position of the suction nozzle with respect to the third external electrode 14 is shifted. But you can get the same benefits.

また、前述の貫通型コンデンサ１０-1は、図７に示したように、貫通型コンデンサ１０-1を高さ方向から見たときの平面輪郭の総面積をＴＡＲとし、第１外部電極１２の平面輪郭の面積をＡＲ１とし、第２外部電極１３の平面輪郭の面積をＡＲ２とし、第３外部電極１４の平面輪郭の面積をＡＲ３としたとき、総面積ＴＡＲと面積ＡＲ１と面積ＡＲ２と面積ＡＲ３は０．６≦（ＡＲ１＋ＡＲ２＋ＡＲ３）／ＴＡＲ≦０．９の条件を満足している。因みに、面積ＡＲ１と面積ＡＲ２は、製造公差を含まない設計上の基準寸法において同じであっても良いし、僅かに異なっていても良い。 In addition, as shown in FIG. 7, the feedthrough capacitor 10-1 described above has a total area of a planar contour when the feedthrough capacitor 10-1 is viewed from the height direction as TAR, and the first external electrode 12. When the area of the planar outline is AR1, the area of the planar outline of the second external electrode 13 is AR2, and the area of the planar outline of the third external electrode 14 is AR3, the total area TAR, area AR1, area AR2, and area AR3 Satisfies the condition of 0.6 ≦ (AR1 + AR2 + AR3) /TAR≦0.9. Incidentally, the area AR1 and the area AR2 may be the same or slightly different from each other in the design standard dimension not including the manufacturing tolerance.

前掲の０．６≦（ＡＲ１＋ＡＲ２＋ＡＲ３）／ＴＡＲ≦０．９の条件は、「接続時の信頼性向上」に有効であるため、以下にその有効性（効果）について説明する。 Since the above-mentioned condition of 0.6 ≦ (AR1 + AR2 + AR3) /TAR≦0.9 is effective for “reliability improvement at the time of connection”, its effectiveness (effect) will be described below.

前述の貫通型コンデンサ１０-1は、回路基板に搭載された後に各外部電極１２〜１４が導体パッド等に電気的に接続される。具体的には、表面実装を可能とした回路基板（部品実装基板）にあっては、各外部電極１２〜１４がハンダを用いて導体パッドに電気的に接続され、また、表面実装及び内部実装を可能とした回路基板（部品内蔵基板）にあっては、各外部電極１２〜１４がハンダを用いて導体パッドに電気的に接続される他、各外部電極１２〜１４に導体ビアが電気的に接続される。 After the feedthrough capacitor 10-1 is mounted on a circuit board, the external electrodes 12 to 14 are electrically connected to conductor pads and the like. Specifically, in a circuit board (component mounting board) capable of surface mounting, each external electrode 12 to 14 is electrically connected to a conductor pad using solder, and surface mounting and internal mounting. In the circuit board (component built-in board) that enables the external electrodes 12 to 14 to be electrically connected to the conductor pads using solder, and the conductor vias are electrically connected to the external electrodes 12 to 14. Connected to.

図１に示した従前の貫通型コンデンサ１００は、前述の貫通型コンデンサ１０-1のような第３外部電極１４を有しておらず、しかも、貫通型コンデンサ１００を高さ方向から見たときの平面輪郭の面積に対する第１外部電極１０２〜第４外部電極１０５の平面輪郭の面積和の占有割合が５０％前後であるため、回路基板への搭載位置が僅かにずれるだけで導体パッドや導体ビアとの電気的接続の信頼性が低下する懸念がある。これに対し、前述の貫通型コンデンサ１０-1は、コンデンサ本体１１の長さ方向中央部に４角筒状の第３外部電極１４が存在し、しかも、貫通型コンデンサ１０-1を高さ方向からみたときの平面輪郭の面積に対する第１外部電極１２〜第３外部電極１４の平面輪郭の面積和の占有割合が６０％以上であって前掲の０．６≦（ＡＲ１＋ＡＲ２＋ＡＲ３）／ＴＡＲ≦０．９の条件を満足しているため、回路基板への搭載位置が僅かにずれても所期の電気的接続を的確に行って、接続時の信頼性向上を図ることができる。 The conventional feedthrough capacitor 100 shown in FIG. 1 does not have the third external electrode 14 like the feedthrough capacitor 10-1, and when the feedthrough capacitor 100 is viewed from the height direction. Since the occupation ratio of the area sum of the planar outlines of the first external electrode 102 to the fourth external electrode 105 to the area of the planar outline is about 50%, the conductor pad and the conductor are only required to be slightly displaced from the mounting position on the circuit board. There is a concern that the reliability of electrical connection with vias may be reduced. On the other hand, in the feedthrough capacitor 10-1, the third external electrode 14 having a rectangular tube shape is present at the center in the length direction of the capacitor body 11, and the feedthrough capacitor 10-1 is arranged in the height direction. Occupying ratio of the area sum of the planar outlines of the first external electrode 12 to the third external electrode 14 with respect to the area of the planar outline when viewed from above is 60% or more, and 0.6 ≦ (AR1 + AR2 + AR3) / TAR ≦ 0. Since the condition of No. 9 is satisfied, even when the mounting position on the circuit board is slightly shifted, the intended electrical connection can be performed accurately and the reliability at the time of connection can be improved.

尚、前掲の０．６≦（ＡＲ１＋ＡＲ２＋ＡＲ３）／ＴＡＲ≦０．９の条件における０．６は、前掲のＥ１＜Ｅ３の条件とＥ２＜Ｅ３の条件を満足して前記「搭載時の強度向上」が図れることを考慮した下限値である。また、同条件における０．９は、各外部電極１２〜１４と導体パッド又は導体ビアとを電気的に接続するときの、第１外部電極１２と第３外部電極１４との短絡、並びに、第２外部電極１３と第３外部電極１４との短絡を回避することを考慮した上限値である。 In addition, 0.6 in the above-mentioned conditions of 0.6 ≦ (AR1 + AR2 + AR3) /TAR≦0.9 satisfies the above-mentioned conditions of E1 <E3 and E2 <E3, and the above “improvement of strength when mounted” Is a lower limit considering that Further, 0.9 in the same condition is a short circuit between the first external electrode 12 and the third external electrode 14 when the external electrodes 12 to 14 and the conductive pads or the conductive vias are electrically connected, and the first 2 is an upper limit value in consideration of avoiding a short circuit between the external electrode 13 and the third external electrode 14.

さらに、前述の貫通型コンデンサ１０-1は、第１外部電極１２の表面粗さと第２外部電極１３の表面粗さと第３外部電極１４の表面粗さが、コンデンサ本体１１の露出部分１１ａ及び１１ｂの表面粗さよりも粗くなっている。因みに、第１外部電極１２の表面粗さと第２外部電極１３の表面粗さは、製造公差を含まない設計上の基準粗さにおいて同じであっても良いし、僅かに異なっていても良い。 Further, in the feedthrough capacitor 10-1, the surface roughness of the first external electrode 12, the surface roughness of the second external electrode 13, and the surface roughness of the third external electrode 14 are determined by the exposed portions 11a and 11b of the capacitor body 11. It is rougher than the surface roughness. Incidentally, the surface roughness of the first external electrode 12 and the surface roughness of the second external electrode 13 may be the same or slightly different in the design reference roughness not including the manufacturing tolerance.

前掲の粗さ関係は、「封止樹脂の剥離防止」に有効であるため、以下にその有効性（効果）について説明する。 Since the roughness relationship described above is effective for “preventing peeling of the sealing resin”, its effectiveness (effect) will be described below.

前述の貫通型コンデンサ１０-1は、回路基板の導体パッド等に電気的に接続された後に合成樹脂で封止されることがある。特に、表面実装及び内部実装を可能とした回路基板（部品内蔵基板）にあっては、内部実装の貫通型コンデンサ１０-1の殆どは合成樹脂で封止されて気密性が確保される。 The feedthrough capacitor 10-1 described above may be sealed with a synthetic resin after being electrically connected to a conductor pad or the like of a circuit board. In particular, in a circuit board (component built-in board) capable of surface mounting and internal mounting, most of the internal mounting feedthrough capacitor 10-1 is sealed with a synthetic resin to ensure airtightness.

図１に示した従前の貫通型コンデンサ１００は、前述の貫通型コンデンサ１０-1のような粗さ関係を有していないため、接続後の貫通型コンデンサ１００を合成樹脂で封止すると、コンデンサ本体１０１に対する封止樹脂の密着力よりも各外部電極１０２〜１０５に対する封止樹脂の密着力が弱いが故に、各外部電極１０２〜１０５から封止樹脂が剥離して腐食等の発生原因となる懸念がある。これに対し、前述の貫通型コンデンサ１０-1は、各外部電極１２〜１４の表面粗さがコンデンサ本体１１の露出部分１１ａ及び１１ｂの表面粗さよりも粗いため、各外部電極１２〜１４に対する封止樹脂の密着力を高めて、封止樹脂の剥離防止を図ることができる。 The conventional feedthrough capacitor 100 shown in FIG. 1 does not have the roughness relationship as the feedthrough capacitor 10-1 described above. Therefore, when the feedthrough capacitor 100 after connection is sealed with a synthetic resin, the capacitor Since the adhesion of the sealing resin to the external electrodes 102 to 105 is weaker than the adhesion of the sealing resin to the main body 101, the sealing resin is peeled off from the external electrodes 102 to 105, causing corrosion and the like. There are concerns. On the other hand, since the surface roughness of the external electrodes 12 to 14 is rougher than the surface roughness of the exposed portions 11 a and 11 b of the capacitor body 11, the feedthrough capacitor 10-1 described above is sealed against the external electrodes 12 to 14. The adhesion of the stop resin can be increased to prevent the sealing resin from peeling off.

さらに、前述の貫通型コンデンサ１０-1は、第１外部電極１２におけるコンデンサ本体１１の長さ方向一面の稜線に近い部分（厚肉部分１２ｆ）の厚さが部分１２ｂ〜１２ｄの厚さよりも厚く、第２外部電極１３におけるコンデンサ本体１１の長さ方向他面の稜線に近い部分の厚さ（厚肉部分１３ｆ）が部分１３ｂ〜１３ｄの厚さよりも厚く、第３外部電極１４におけるコンデンサ本体１１の高さ方向一面の稜線に近い部分（厚肉部分１４ｅ）の厚さとコンデンサ本体１１の高さ方向他面の稜線に近い部分（厚肉部分１４ｅ）の厚さが部分１４ａ〜１４ｄの厚さよりも厚くなっている。 Further, in the feedthrough capacitor 10-1, the thickness of the portion (thick portion 12f) near the ridge line on the first surface of the capacitor body 11 in the first external electrode 12 is thicker than the thickness of the portions 12b to 12d. The thickness (thick portion 13f) of the second external electrode 13 near the ridge line on the other surface in the length direction of the capacitor body 11 is thicker than the thickness of the portions 13b to 13d. The thickness of the portion close to the ridge line on one surface in the height direction (thick wall portion 14e) and the thickness of the portion close to the ridge line on the other surface in the height direction of the capacitor body 11 (thick wall portion 14e) are larger than the thickness of the portions 14a to 14d. Is also thicker.

前掲の厚さ関係は、「接続不良の防止」に有効であるため、以下にその有効性（効果）について説明する。 Since the thickness relationship described above is effective for “preventing connection failure”, its effectiveness (effect) will be described below.

前述の貫通型コンデンサ１０-1は、部品収納凹部を有するテープ状梱包材に包装されて使用に供されることがある。テープ状梱包材に包装された貫通型コンデンサ１０-1は、カバーテープをテープ本体から剥離した後、吸着ノズルによって部品収納凹部から取り出され、先に述べたような回路基板への搭載が行われる。 The feedthrough capacitor 10-1 described above may be used after being packaged in a tape-shaped packing material having a component housing recess. The through-type capacitor 10-1 packaged in the tape-shaped packing material is removed from the component housing recess by the suction nozzle after the cover tape is peeled off from the tape body, and mounted on the circuit board as described above. .

図１に示した従前の貫通型コンデンサ１００は、前述の貫通型コンデンサ１０-1のような厚さ関係（厚肉部分１２ｆ、１３ｆ及び１４ｅ）を有していないため、テープ状梱包材に包装すると、各外部電極１０２〜１０５の表面、特に電気的接続に利用される高さ方向両側の表面がテープ状梱包材の部品収納凹部の底面やカバーテープの凹部閉塞面に接触して各々の表面に摩擦による変質や汚れ等が生じ、これらが原因となって各外部電極１０２〜１０５の電気的な接続に不良を生じる懸念がある。これに対し、前述の貫通型コンデンサ１０-1は、各外部電極１２〜１４におけるコンデンサ本体１１の稜線に近い部分に厚肉部分１２ｆ、１３ｆ及び１４ｅが設けられているため、テープ状梱包材に包装しても、各外部電極１２〜１４の表面、特に電気的接続に利用される高さ方向両側の表面（部分１２ｂ、１２ｃ、１３ｂ、１３ｃ、１４ａ及び１４ｂの表面）がテープ状梱包材の部品収納凹部の底面やカバーテープの凹部閉塞面に接触することを抑制して、各々の表面に摩擦による変質や汚れ等を生じることを防止することができ、これにより、各外部電極１２〜１４と導体パッド又は導体ビアとを電気的に接続するときの接続不良の防止を図ることができる。 Since the conventional feedthrough capacitor 100 shown in FIG. 1 does not have the thickness relationship (thick portions 12f, 13f, and 14e) as the feedthrough capacitor 10-1 described above, it is packaged in a tape-shaped packing material. Then, the surfaces of the external electrodes 102 to 105, particularly the surfaces on both sides in the height direction used for electrical connection, come into contact with the bottom surfaces of the component storage recesses of the tape-shaped packing material and the recess closing surfaces of the cover tapes. There is a concern that deterioration, dirt, and the like may occur due to friction, which may cause defects in the electrical connection between the external electrodes 102 to 105. On the other hand, since the feedthrough capacitor 10-1 is provided with thick portions 12f, 13f, and 14e near the ridgeline of the capacitor body 11 in each of the external electrodes 12-14, Even after packaging, the surfaces of the external electrodes 12 to 14, particularly the surfaces on both sides in the height direction used for electrical connection (the surfaces of the portions 12 b, 12 c, 13 b, 13 c, 14 a and 14 b) are the tape-shaped packing material. It is possible to suppress contact with the bottom surface of the component housing recess and the recess closing surface of the cover tape, thereby preventing each surface from being altered or contaminated due to friction, whereby each of the external electrodes 12 to 14 can be prevented. It is possible to prevent connection failure when electrically connecting the conductor pad and the conductor via.

次に、前述の有効性（効果）を確認するために用意した、
・図２〜図７に示した貫通型コンデンサ１０-1に対応した評価用サンプル１
・図１に示した従前の貫通型コンデンサ１００に対応した評価用サンプル２
の仕様について各図に記した符号を適宜用いて説明する。因みに、後記寸法値は何れも製造公差を含まない設計上の基準寸法である。 Next, we prepared to confirm the effectiveness (effect) described above,
・ Evaluation sample 1 corresponding to feedthrough capacitor 10-1 shown in FIGS.
Sample 2 for evaluation corresponding to the conventional feedthrough capacitor 100 shown in FIG.
The specifications will be described using the symbols shown in each figure as appropriate. Incidentally, the dimension values described later are design reference dimensions that do not include manufacturing tolerances.

評価用サンプル１の仕様は以下のとおりである。
・全体の長さＬが１０００μｍ、幅Ｗが６００μｍ、高さＨが２２０μｍ
・コンデンサ本体１１の長さが９６０μｍ、幅が５６０μｍ、高さが１８０μｍ
・コンデンサ本体１１の第１保護部ＰＰ１の厚さと第２保護部ＰＰ２の厚さが３０μｍ、容量部ＣＰの厚さが１２０μｍ
・容量部ＣＰに含まれる第１内部電極層１５の厚さと第２内部電極層１６の厚さが０．７μｍ、誘電体層１７の厚さが０．８μｍ、第１内部電極層１５の層数が４０層、第２内部電極層１６の層数が４０層
・第１保護部ＰＰ１と各誘電体層１７と第２保護部ＰＰ２がチタン酸バリウムを主成分とした誘電体セラミックス、各第１内部電極層１５と各第２内部電極層１６がニッケルを主成分とした良導体
・第１外部電極１２の部分１２ｂ〜１２ｅの厚さと第２外部電極１３の部分１３ｂ〜１３ｅの厚さと第３外部電極１４の部分１４ａ〜１４ｄの厚さが１５μｍ、第１外部電極１２の部分１２ａの厚さと第２外部電極１３の部分１３ａの厚さが２０μｍ、各外部電極１２〜１４の厚肉部分１２ｆ、１３ｆ及び１４ｅの厚さが２０μｍ
・第１外部電極１２と第２外部電極１３と第３外部電極１４がニッケルを主成分とした下地膜と銅を主成分とした表面膜の２層構造
・第１外部電極１２の寸法Ｅ１と第２外部電極１３の寸法Ｅ２が２００μｍ、第３外部電極１４の寸法Ｅ３が３５０μｍ
・第１外部電極１２の表面粗さＲａと第２外部電極１３の表面粗さＲａと第３外部電極１４の表面粗さＲａが０．３１μｍ以上、コンデンサ本体１１の露出部分１１ａ及び１１ｂの表面粗さＲａが０．０８μｍ以下 The specifications of the evaluation sample 1 are as follows.
-Overall length L is 1000 μm, width W is 600 μm, height H is 220 μm
・ The length of the capacitor body 11 is 960 μm, the width is 560 μm, and the height is 180 μm.
The thickness of the first protection part PP1 and the thickness of the second protection part PP2 of the capacitor body 11 are 30 μm, and the thickness of the capacitance part CP is 120 μm.
The thickness of the first internal electrode layer 15 and the thickness of the second internal electrode layer 16 included in the capacitor portion CP is 0.7 μm, the thickness of the dielectric layer 17 is 0.8 μm, and the first internal electrode layer 15 layer The number of the second internal electrode layers 16 is 40. The first protective part PP1, each dielectric layer 17, and the second protective part PP2 are dielectric ceramics mainly composed of barium titanate. 1 internal electrode layer 15 and each 2nd internal electrode layer 16 are the good conductor which has nickel as a main component, the thickness of the parts 12b-12e of the 1st external electrode 12, the thickness of the parts 13b-13e of the 2nd external electrode 13, and 3rd The thickness of the parts 14a to 14d of the external electrode 14 is 15 μm, the thickness of the part 12a of the first external electrode 12 and the thickness of the part 13a of the second external electrode 13 are 20 μm, and the thick part 12f of each external electrode 12 to 14 , 13f and 14e are 20 μm thick
The first external electrode 12, the second external electrode 13, and the third external electrode 14 have a two-layer structure of a base film mainly composed of nickel and a surface film mainly composed of copper. A dimension E1 of the first external electrode 12 The dimension E2 of the second external electrode 13 is 200 μm, and the dimension E3 of the third external electrode 14 is 350 μm.
The surface roughness Ra of the first external electrode 12, the surface roughness Ra of the second external electrode 13, and the surface roughness Ra of the third external electrode 14 are 0.31 μm or more, and the surfaces of the exposed portions 11a and 11b of the capacitor body 11 Roughness Ra is 0.08μm or less

ここで、評価用サンプル１の製法を簡単に紹介する。製造に際しては、先ず、チタン酸バリウム粉末とエタノール（溶剤）とポリビニルブチラール（バインダ）と分散剤等の添加剤等とを含むセラミックスラリーを用意すると共に、ニッケル粉末とターピネオール（溶剤）とエチルセルロース（バインダ）と分散剤等の添加剤とを含む金属ペーストを用意する。 Here, the manufacturing method of the sample 1 for evaluation is introduced briefly. In production, first, a ceramic slurry containing barium titanate powder, ethanol (solvent), polyvinyl butyral (binder), and additives such as a dispersant is prepared, and nickel powder, terpineol (solvent), and ethyl cellulose (binder) are prepared. ) And an additive such as a dispersant.

続いて、ダイコータやグラビアコータ等の塗工装置と乾燥装置とを用いて、キャリアフィルムの表面にセラミックスラリーを塗工し乾燥して、第１グリーンシートを作製する。また、スクリーン印刷機やグラビア印刷機等の印刷装置と乾燥装置とを用いて、第１グリーンシートの表面に金属ペーストをマトリクス状又は千鳥状に印刷し乾燥して、第１内部電極層１５用パターン群が形成された第２グリーンシートを作製すると共に、第１グリーンシートの表面に金属ペーストをマトリクス状又は千鳥状に印刷し乾燥して、第２内部電極層１６用パターン群が形成された第３グリーンシートを作製する。 Subsequently, using a coating device such as a die coater or a gravure coater and a drying device, a ceramic slurry is coated on the surface of the carrier film and dried to produce a first green sheet. Further, using a printing device such as a screen printing machine or a gravure printing machine and a drying device, a metal paste is printed on the surface of the first green sheet in a matrix or zigzag pattern and dried to be used for the first internal electrode layer 15. The second green sheet on which the pattern group was formed was produced, and a metal paste was printed on the surface of the first green sheet in a matrix or zigzag pattern and dried to form a pattern group for the second internal electrode layer 16. A third green sheet is produced.

続いて、打ち抜き刃及びヒータを有する可動式吸着ヘッド等の積層装置を用いて、第１グリーンシートから打ち抜いた単位シートを所定枚数に達するまで積み重ねて熱圧着して第２保護部ＰＰ２に対応した部位を作製する。続いて、前記同様の積層装置を用いて、第３グリーンシートから打ち抜いた単位シート（第２内部電極層１６用パターン群を含む）の上に第２グリーンシートから打ち抜いた単位シート（第１内部電極層１５用パターン群を含む）を積み重ねて熱圧着する作業を繰り返して容量部ＣＰに対応した部位を作製する。続いて、前記同様の積層装置を用いて、第１グリーンシートから打ち抜いた単位シートを所定枚数に達するまで積み重ねて熱圧着して第１保護部ＰＰ１に対応した部位を作製する。続いて、熱間静水圧プレス機や機械式又は油圧式プレス機等の本圧着装置を用いて、前記各部位を積み重ねたものを本熱圧着して、未焼成積層シートを作製する。 Subsequently, using a laminating apparatus such as a movable suction head having a punching blade and a heater, the unit sheets punched from the first green sheet are stacked until they reach a predetermined number and are thermocompression bonded to correspond to the second protective part PP2. Create the site. Subsequently, using the same laminating apparatus, a unit sheet (first internal sheet) punched from the second green sheet on a unit sheet (including the pattern group for the second internal electrode layer 16) punched from the third green sheet. The portion corresponding to the capacitor portion CP is produced by repeating the operation of stacking and thermocompression bonding (including the pattern group for the electrode layer 15). Subsequently, using the same laminating apparatus as described above, the unit sheets punched from the first green sheet are stacked until they reach a predetermined number and are thermocompression bonded to produce a portion corresponding to the first protection part PP1. Subsequently, using a main crimping apparatus such as a hot isostatic press or a mechanical or hydraulic press, the stacked parts are subjected to main thermocompression to produce an unfired laminated sheet.

続いて、ブレードダイシング機やレーザーダイシング機等の切断装置を用いて、未焼成積層シートを格子状に切断して、コンデンサ本体１１に対応した未焼成チップを作製する。続いて、トンネル型焼成炉や箱型焼成炉等の焼成装置を用いて、多数の未焼成チップを還元性雰囲気下、或いは、低酸素分圧雰囲気下で、チタン酸バリウム及びニッケルに応じた温度プロファイルにて焼成（脱バインダ処理と焼成処理を含む）を行って、コンデンサ本体１１を作製する。 Subsequently, by using a cutting device such as a blade dicing machine or a laser dicing machine, the unfired laminated sheet is cut into a lattice shape, and an unfired chip corresponding to the capacitor body 11 is produced. Subsequently, using a firing apparatus such as a tunnel-type firing furnace or a box-type firing furnace, a large number of unfired chips are subjected to a temperature corresponding to barium titanate and nickel in a reducing atmosphere or in a low oxygen partial pressure atmosphere. The capacitor body 11 is fabricated by firing (including binder removal processing and firing processing) using a profile.

続いて、ローラ塗布機やディップ塗布機等の塗布装置と乾燥装置とを用いて、コンデンサ本体１１の長さ方向両端部に金属ペースト（前記の金属ペーストを流用）を塗布し乾燥して、前記同様の雰囲気下で焼き付け処理を行って下地膜を形成した後、下地膜を覆う表面膜を電解メッキ等のメッキ処理で形成して、第１外部電極１２及び第２外部電極１３を作製する。また、前記同様の塗布装置と乾燥装置とを用いて、コンデンサ本体１１の長さ方向中央部分に金属ペースト（前記の金属ペーストを流用）を塗布し乾燥して、前記同様の雰囲気下で焼き付け処理を行って下地膜を形成した後、下地膜を覆う表面膜を電解メッキ等のメッキ処理で形成して、第３外部電極１４を作製する。続いて、第１外部電極１２の表面と第２外部電極１３の表面と第３外部電極１４の表面に化学エッチング処理を施して各々の表面を荒らす。 Subsequently, using a coating device such as a roller coating machine or a dip coating machine and a drying device, a metal paste (using the metal paste) is applied to both ends in the length direction of the capacitor body 11 and dried. After a baking process is performed in the same atmosphere to form a base film, a surface film covering the base film is formed by a plating process such as electrolytic plating, and the first external electrode 12 and the second external electrode 13 are manufactured. Further, using the same coating apparatus and drying apparatus as described above, a metal paste (using the metal paste is applied) is applied to the central portion in the length direction of the capacitor body 11 and dried, followed by baking in the same atmosphere as described above. After forming the base film, a surface film covering the base film is formed by a plating process such as electrolytic plating, and the third external electrode 14 is manufactured. Subsequently, the surface of the first external electrode 12, the surface of the second external electrode 13, and the surface of the third external electrode 14 are subjected to chemical etching to roughen the surfaces.

一方、評価用サンプル２の仕様は、以下の点においてのみ、評価用サンプル１の仕様と異なる。因みに、評価用サンプル２の製法は、最後の化学エッチング処理を除き、評価用サンプル１の製法と同様である。
・第１外部電極１０２の厚さと第２外部電極１０３の厚さと第３外部電極１０４の厚さと第４外部電極１０５の厚さが２０μｍ
・第３外部電極１０４の寸法Ｅ１３と第４外部電極１０５の寸法Ｅ１４が３５０μｍ、第３外部電極１０４の寸法Ｅ１５と第４外部電極１０５の寸法Ｅ１６が１５０μｍ（寸法Ｅ１３〜Ｅ１６は図１（Ａ）を参照）
・第１外部電極１０２の表面粗さＲａと第２外部電極１０３の表面粗さＲａと第３外部電極１０４の表面粗さＲａと第４外部電極１０５の表面粗さＲａが０．０６μｍ以下、コンデンサ本体１０１の露出部分の表面粗さＲａが０．０８μｍ以下 On the other hand, the specification of the evaluation sample 2 differs from the specification of the evaluation sample 1 only in the following points. Incidentally, the manufacturing method of the evaluation sample 2 is the same as the manufacturing method of the evaluation sample 1 except for the last chemical etching treatment.
The thickness of the first external electrode 102, the thickness of the second external electrode 103, the thickness of the third external electrode 104, and the thickness of the fourth external electrode 105 are 20 μm.
The dimension E13 of the third external electrode 104 and the dimension E14 of the fourth external electrode 105 are 350 μm, the dimension E15 of the third external electrode 104 and the dimension E16 of the fourth external electrode 105 are 150 μm (the dimensions E13 to E16 are shown in FIG. See))
The surface roughness Ra of the first external electrode 102, the surface roughness Ra of the second external electrode 103, the surface roughness Ra of the third external electrode 104, and the surface roughness Ra of the fourth external electrode 105 are 0.06 μm or less, The surface roughness Ra of the exposed portion of the capacitor body 101 is 0.08 μm or less.

次に、前述の有効性（効果）を、前記評価用サンプル１及び２を用いて確認した結果等について説明する。 Next, the results of confirming the effectiveness (effect) described above using the evaluation samples 1 and 2 will be described.

評価用サンプル１は、第１外部電極１２の寸法Ｅ１と第２外部電極１３の寸法Ｅ２が何れも２００μｍで、第３外部電極１４の寸法Ｅ３が３５０μｍであることから、Ｅ１＜Ｅ３の条件とＥ２＜Ｅ３の条件を満足している。一方、評価用サンプル２は、評価用サンプル１のような４角筒状の第３外部電極１４を有しないため、前記両条件を満足しない。搭載時の強度向上に係り、計５個の評価用サンプル１の抗折強度と計５個の評価用サンプル２の抗折強度を測定したところ、評価用サンプル１の抗折強度は１８０ｇｆ以上、評価用サンプル２の抗折強度は１１０ｇｆ以下であった。このことから、図２〜図７に示した貫通型コンデンサ１０-1に対応した評価用サンプル１は、図１に示した従前の貫通型コンデンサ１００に対応した評価用サンプル２に比べて、前記「搭載時の強度向上」に有効であると言える。 In the sample 1 for evaluation, since the dimension E1 of the first external electrode 12 and the dimension E2 of the second external electrode 13 are both 200 μm and the dimension E3 of the third external electrode 14 is 350 μm, the condition of E1 <E3 is satisfied. The condition of E2 <E3 is satisfied. On the other hand, the evaluation sample 2 does not have the quadrangular cylindrical third external electrode 14 unlike the evaluation sample 1, and therefore does not satisfy the both conditions. Regarding the strength improvement at the time of mounting, the bending strength of a total of five evaluation samples 1 and the bending strength of a total of five evaluation samples 2 were measured, and the bending strength of the evaluation sample 1 was 180 gf or more. The bending strength of the sample 2 for evaluation was 110 gf or less. From this, the evaluation sample 1 corresponding to the feedthrough capacitor 10-1 shown in FIGS. 2 to 7 is compared with the evaluation sample 2 corresponding to the previous feedthrough capacitor 100 shown in FIG. It can be said that it is effective for “improvement of strength when mounted”.

また、評価用サンプル１は、評価用サンプル１を高さ方向から見たときの（第１外部電極１２の平面輪郭の面積ＡＲ１＋第２外部電極１３の平面輪郭の面積ＡＲ２＋第３外部電極１４の平面輪郭の面積ＡＲ３）／評価用サンプル１の平面輪郭の総面積ＴＡＲ）の算出値（計５個の平均値）が０．７７であることから、０．６≦（ＡＲ１＋ＡＲ２＋ＡＲ３）／ＴＡＲ≦０．９の条件を満足している。一方、評価用サンプル２は、評価用サンプル２を高さ方向から見たときの（第１外部電極１０２の平面輪郭の面積＋第２外部電極１０３の平面輪郭の面積＋第３外部電極１０４の平面輪郭の面積＋第４外部電極１０５の平面輪郭の面積）／評価用サンプル２の平面輪郭の総面積）の算出値（計５個の平均値）が０．５０であることから、前記条件を満足していない。このことから、図２〜図７に示した貫通型コンデンサ１０-1に対応した評価用サンプル１は、図１に示した従前の貫通型コンデンサ１００に対応する評価用サンプル２に比べて、前記「接続時の信頼性向上」に有効であると言える。 Further, the evaluation sample 1 is obtained when the evaluation sample 1 is viewed from the height direction (the area AR1 of the planar outline of the first external electrode 12 + the area AR2 + of the planar outline of the second external electrode 13 + the area of the third external electrode 14). Since the calculated value of the area of the planar contour AR3) / the total area TAR of the planar contour of the evaluation sample 1 (average value of a total of five) is 0.77, 0.6 ≦ (AR1 + AR2 + AR3) / TAR ≦ 0 .9 condition is satisfied. On the other hand, when the evaluation sample 2 is viewed from the height direction, the evaluation sample 2 (the area of the planar outline of the first external electrode 102 + the area of the planar outline of the second external electrode 103 + the area of the third external electrode 104) Since the calculated value (the total area of the plane contour of the area of the plane contour + the area of the plane contour of the fourth external electrode 105) / the total area of the plane contour of the sample 2 for evaluation) is 0.50, the above condition is satisfied. Not satisfied. From this, the evaluation sample 1 corresponding to the feedthrough capacitor 10-1 shown in FIGS. 2 to 7 is compared with the evaluation sample 2 corresponding to the previous feedthrough capacitor 100 shown in FIG. It can be said that it is effective for “improvement of connection reliability”.

さらに、評価用サンプル１は、第１外部電極１２の表面粗さＲａと第２外部電極１３の表面粗さＲａと第３外部電極１４の表面粗さＲａが０．３１μｍ以上、コンデンサ本体１１の露出部分１１ａ及び１１ｂの表面粗さＲａが０．０８μｍ以下であるから、第１外部電極１２と第２外部電極１３と第３外部電極１４の各々の表面粗さがコンデンサ本体１１の露出部分の表面粗さよりも粗いといった粗さ関係を満足している。一方、評価用サンプル２は、第１外部電極１０２の表面粗さＲａと第２外部電極１０３の表面粗さＲａと第３外部電極１０４の表面粗さＲａと第４外部電極１０５の表面粗さＲａが０．０６μｍ以下、コンデンサ本体１０１の露出部分の表面粗さＲａが０．０８μｍ以下であるから、前記粗さ関係を満足していない。このことから、図２〜図７に示した貫通型コンデンサ１０-1に対応した評価用サンプル１は、図１に示した従前の貫通型コンデンサ１００に対応した評価用サンプル２に比べて、前記「封止樹脂の剥離防止」に有効であると言える。 Furthermore, in the sample 1 for evaluation, the surface roughness Ra of the first external electrode 12, the surface roughness Ra of the second external electrode 13, and the surface roughness Ra of the third external electrode 14 are 0.31 μm or more. Since the surface roughness Ra of the exposed portions 11 a and 11 b is 0.08 μm or less, the surface roughness of each of the first external electrode 12, the second external electrode 13, and the third external electrode 14 is that of the exposed portion of the capacitor body 11. Satisfies the roughness relationship of being rougher than the surface roughness. On the other hand, the evaluation sample 2 includes the surface roughness Ra of the first external electrode 102, the surface roughness Ra of the second external electrode 103, the surface roughness Ra of the third external electrode 104, and the surface roughness of the fourth external electrode 105. Since Ra is 0.06 μm or less and the surface roughness Ra of the exposed portion of the capacitor body 101 is 0.08 μm or less, the above-described roughness relationship is not satisfied. From this, the evaluation sample 1 corresponding to the feedthrough capacitor 10-1 shown in FIGS. 2 to 7 is compared with the evaluation sample 2 corresponding to the previous feedthrough capacitor 100 shown in FIG. It can be said that it is effective for “preventing peeling of the sealing resin”.

さらに、評価用サンプル１は、第１外部電極１２の部分１２ｂ〜１２ｅの厚さと第２外部電極１３の部分１３ｂ〜１３ｅの厚さと第３外部電極１４の部分１４ａ〜１４ｄの厚さが１５μｍで、各外部電極１２〜１４の厚肉部分１２ｆ、１３ｆ及び１４ｅの厚さが２０μｍであり、両者の間には５μｍのギャップがある。つまり、評価用サンプル１を部品収納凹部を有するテープ状梱包材に包装しても、各外部電極１０２〜１０５の表面、特に電気的接続に利用される高さ方向両側の表面がテープ状梱包材の部品収納凹部の底面やカバーテープの凹部閉塞面に接触し難い。一方、評価用サンプル２は、評価用サンプル１のようなギャップが存在しない。そのため、評価用サンプル２を部品収納凹部を有するテープ状梱包材に包装すると、各外部電極１０２〜１０５の表面、特にハンダ接続やビア接続に利用される高さ方向両側面の表面がテープ状梱包材の部品収納凹部の内面やカバーテープの凹部閉塞面に接触して、各々の表面に摩擦による変質や汚れ等を生じ易い。このことから、図２〜図７に示した貫通型コンデンサ１０-1に対応した評価用サンプル１は、図１に示した従前の貫通型コンデンサ１００に対応した評価用サンプル２に比べて、前記「接続不良の防止」に有益であると言える。 Furthermore, in the sample 1 for evaluation, the thickness of the portions 12b to 12e of the first external electrode 12, the thickness of the portions 13b to 13e of the second external electrode 13, and the thickness of the portions 14a to 14d of the third external electrode 14 are 15 μm. The thicknesses of the thick portions 12f, 13f, and 14e of the external electrodes 12 to 14 are 20 μm, and there is a 5 μm gap between them. That is, even if the evaluation sample 1 is packaged in a tape-shaped packing material having a component storage recess, the surfaces of the external electrodes 102 to 105, particularly the surfaces on both sides in the height direction used for electrical connection, are tape-shaped packing materials. It is difficult to come into contact with the bottom surface of the component housing recess and the recess closing surface of the cover tape. On the other hand, the evaluation sample 2 does not have a gap like the evaluation sample 1. Therefore, when the evaluation sample 2 is packaged in a tape-shaped packaging material having a component housing recess, the surfaces of the external electrodes 102 to 105, particularly the surfaces on both sides in the height direction used for solder connection and via connection, are tape-shaped. Contact with the inner surface of the component housing recess of the material or the recess closing surface of the cover tape tends to cause alteration or contamination due to friction on each surface. From this, the evaluation sample 1 corresponding to the feedthrough capacitor 10-1 shown in FIGS. 2 to 7 is compared with the evaluation sample 2 corresponding to the previous feedthrough capacitor 100 shown in FIG. It can be said that it is useful for “preventing poor connection”.

〈第１実施形態の変形例〉
（１）前述の貫通型コンデンサ１０-1（評価用サンプル１を含む）として、第１外部電極１２の高さ方向両面部分の最大厚さ（厚肉部分１２ｆの厚さ）と、第２外部電極１３の高さ方向両面部分の最大厚さ（厚肉部分１３ｆの厚さ）と、第３外部電極１４の高さ方向両面部分の最大厚さ（厚肉部分１４ｅの厚さ）が略同じものを示したが、第１外部電極１２の高さ方向両面部分の最大厚さ並びに第２外部電極１３の高さ方向両面部分の最大厚さよりも第３外部電極１４の高さ方向両面部分の最大厚さを薄くすれば、貫通型コンデンサ１０-1を回路基板に搭載した後の「安定性の向上」に有効である。 <Modification of First Embodiment>
(1) As the above-described feedthrough capacitor 10-1 (including the evaluation sample 1), the maximum thickness (thickness of the thick portion 12f) of the both sides in the height direction of the first external electrode 12 and the second external The maximum thickness of both side portions of the electrode 13 in the height direction (thickness of the thick portion 13f) and the maximum thickness of both side portions of the third external electrode 14 in the height direction (thickness of the thick portion 14e) are substantially the same. Although the maximum thickness of the both sides in the height direction of the first external electrode 12 and the maximum thickness of the both sides in the height direction of the second external electrode 13 are shown, If the maximum thickness is reduced, it is effective for “improvement of stability” after the feedthrough capacitor 10-1 is mounted on the circuit board.

つまり、前述の貫通型コンデンサ１０-1にあっては、第３外部電極１４の高さ方向両面部分の最大厚さが、第１外部電極１２の高さ方向両面部分の最大厚さ並びに第２外部電極１３の高さ方向両面部分の最大厚さよりも厚くなると、回路基板に搭載された貫通型コンデンサ１０-1に傾きを生じたり、第１外部電極１２又は第２外部電極１３に浮き上がりを生じたりして、その後の電気的接続に支障を生じる懸念がある。けれども、第１外部電極１２の高さ方向両面部分の最大厚さをＴ１ｍａｘとし、第２外部電極１３の高さ方向両面部分の最大厚さをＴ２ｍａｘとし、第３外部電極１４の高さ方向両面部分の最大厚さをＴ３ｍａｘとしたときに、最大厚さＴ１ｍａｘと最大厚さＴ３ｍａｘがＴ１ｍａｘ＞Ｔ３ｍａｘの条件を満足し、且つ、最大厚さＴ２ｍａｘと最大厚さＴ３ｍａｘがＴ２ｍａｘ＞Ｔ３ｍａｘの条件を満足するようにすれば、前記の傾きや浮き上がりを防止して、前記「安定性の向上」を図ることができる。 That is, in the feedthrough capacitor 10-1, the maximum thickness of the both sides in the height direction of the third external electrode 14 is equal to the maximum thickness of the both sides in the height direction of the first external electrode 12 and the second thickness. When the thickness is larger than the maximum thickness of the both sides in the height direction of the external electrode 13, the feedthrough capacitor 10-1 mounted on the circuit board is inclined or the first external electrode 12 or the second external electrode 13 is lifted. There is a concern that the subsequent electrical connection may be hindered. However, the maximum thickness of both the height direction both sides of the first external electrode 12 is T1max, the maximum thickness of the both sides of the second external electrode 13 in the height direction is T2max, and both the height directions of the third external electrode 14 are both When the maximum thickness of the portion is T3max, the maximum thickness T1max and the maximum thickness T3max satisfy the condition of T1max> T3max, and the maximum thickness T2max and the maximum thickness T3max satisfy the condition of T2max> T3max. By doing so, it is possible to prevent the above-described inclination and lifting, and to achieve the “improvement of stability”.

（２）前述の貫通型コンデンサ１０-1（評価用サンプル１を含む）として、コンデンサ本体１１の露出部分１１ａ及び１１ｂに特段の間隔制限を設けていないものを示したが、これら露出部分１１ａ及び１１ｂの間隔を第３外部電極１４の高さ方向両面部分の平均厚さに基づいて定めれば、イオンマイグレーションを原因とした「短絡の防止」に有効である。 (2) Although the feedthrough capacitor 10-1 (including the evaluation sample 1) described above has not been provided with any particular spacing restrictions on the exposed portions 11a and 11b of the capacitor body 11, these exposed portions 11a and 11b If the distance of 11b is determined based on the average thickness of the both sides in the height direction of the third external electrode 14, it is effective for “prevention of short circuit” due to ion migration.

つまり、前述の貫通型コンデンサ１０-1にあっては、第３外部電極１４は４角筒状を成していて高さ方向両面部分の面積が広いため、この高さ方向両面部分の平均厚さが厚くなると、濃度勾配を原因とし、金属イオンが第３外部電極１４からセラミック本体１１を介して第１外部電極１２及び第２外部電極１３に移動する現象（イオンマイグレーション）が生じ、第３外部電極１４と第１外部電極１２及び第２外部電極１３に短絡が生じる懸念がある。けれども、第３外部電極１４の高さ方向両面部分の平均厚さをＴ３ａｖｅとし、コンデンサ本体１１の露出部分１１ａの間隔をＩ１とし、コンデンサ本体１１の露出部分１１ｂの間隔をＩ２としたときに（Ｉ１及びＩ２は図２（Ａ）を参照）、平均厚さＴ３ａｖｅと間隔Ｉ１がＴ３ａｖｅ≦Ｉ１／２の条件を満足し、且つ、平均厚さＴ３ａｖｅと間隔Ｉ２がＴ３ａｖｅ≦Ｉ２／２の条件を満足するようにすれば、前記のイオンマイグレーションを抑制して、前記「短絡の防止」を図ることができる。 That is, in the feedthrough capacitor 10-1, the third external electrode 14 has a quadrangular cylindrical shape and has a large area on both sides in the height direction. When the thickness increases, a phenomenon (ion migration) occurs in which metal ions move from the third external electrode 14 to the first external electrode 12 and the second external electrode 13 through the ceramic body 11 due to a concentration gradient, There is a concern that a short circuit may occur in the external electrode 14, the first external electrode 12, and the second external electrode 13. However, when the average thickness of both side portions of the third external electrode 14 in the height direction is T3ave, the interval between the exposed portions 11a of the capacitor body 11 is I1, and the interval between the exposed portions 11b of the capacitor body 11 is I2. I1 and I2 refer to FIG. 2A), the average thickness T3ave and the interval I1 satisfy the condition of T3ave ≦ I1 / 2, and the average thickness T3ave and the interval I2 satisfy the condition of T3ave ≦ I2 / 2. If satisfied, the ion migration can be suppressed and the “prevention of short circuit” can be achieved.

この「短絡の防止」に係る有効性（効果）を確認するために、前記評価用サンプル１の第３外部電極１４の寸法Ｅ１を増加して間隔Ｉ１と間隔Ｉ２の両方を４０μｍとし、且つ、第３外部電極１４の高さ方向両面部分の平均厚さＴ３ａｖｅを前記評価用サンプル１に合わせて１７．５μｍとしたサンプルＡ１と、サンプルＡ１の第３外部電極１４の高さ方向両面部分の平均厚さＴ３ａｖｅを２０μｍとしたサンプルＡ２と、サンプルＡ１の第３外部電極１４の高さ方向両面部分の平均厚さＴ３ａｖｅを２２．５μｍとしたサンプルＡ３を用意した。そして、各１００個のサンプルＡ１〜Ａ３を温度８５℃で湿度８５％の雰囲気下で５００時間放置した後、ハイレジスタンスメータ（アジレント社製、４３２９Ａ）を利用して、第３外部電極１４と第１外部電極１２との短絡発生率並びに第３外部電極１４と第２外部電極１３との短絡発生率を調べたところ、サンプルＡ１の短絡発生率は０％、サンプルＡ２の短絡発生率は０％、サンプルＡ３の短絡発生率は５％であった。即ち、前掲のＴ３ａｖｅ≦Ｉ１／２の条件とＴ３ａｖｅ≦Ｉ２／２の条件を満足するサンプルＡ１及びＡ２は、同条件を満足しないサンプルＡ３に比べて、前記「短絡の防止」に有効であることが確認できた。 In order to confirm the effectiveness (effect) related to the “prevention of short circuit”, the dimension E1 of the third external electrode 14 of the evaluation sample 1 is increased so that both the interval I1 and the interval I2 are 40 μm, and The average thickness T3ave of the both sides in the height direction of the third external electrode 14 is set to 17.5 μm in accordance with the sample 1 for evaluation, and the average of both sides in the height direction of the third external electrode 14 of the sample A1 A sample A2 having a thickness T3ave of 20 μm and a sample A3 having an average thickness T3ave of both sides in the height direction of the third external electrode 14 of the sample A1 of 22.5 μm were prepared. Then, after each 100 samples A1 to A3 were left in an atmosphere of 85 ° C. and 85% humidity for 500 hours, the third external electrode 14 and the second electrode 14 and the third external electrode 14 were obtained using a high resistance meter (Agilent, 4329A). When the short-circuit occurrence rate with the first external electrode 12 and the short-circuit occurrence rate with the third external electrode 14 and the second external electrode 13 were examined, the short-circuit occurrence rate of the sample A1 was 0% and the short-circuit occurrence rate of the sample A2 was 0%. The short-circuit occurrence rate of sample A3 was 5%. That is, the samples A1 and A2 that satisfy the above-mentioned conditions of T3ave ≦ I1 / 2 and T3ave ≦ I2 / 2 are more effective in the “prevention of short circuit” than the sample A3 that does not satisfy the conditions. Was confirmed.

（３）前述の貫通型コンデンサ１０-1（評価用サンプル１を含む）として、コンデンサ本体１１の露出部分１１ａ及び１１ｂに特段の間隔制限を設けていないものを示したが、これら露出部分１１ａ及び１１ｂの間隔を貫通型コンデンサ１０-1の長さＬ１に基づいて定めれば、「ＥＳＬ（等価直列インダクタンス）の低減」に有効である。 (3) As the above-described feedthrough capacitor 10-1 (including the sample 1 for evaluation), the exposed portions 11a and 11b of the capacitor body 11 are not provided with a special interval restriction. If the interval 11b is determined based on the length L1 of the feedthrough capacitor 10-1, it is effective for "reduction of ESL (equivalent series inductance)".

つまり、前述の貫通型コンデンサ１０-1にあっては、第１内部導体層１５と第２内部電極層１６との実質的な電流距離が長くなるとＥＳＬが増加する。けれども、貫通型コンデンサ１０-1の長さをＬ１とし、コンデンサ本体１１の露出部分１１ａの間隔をＩ１とし露出部分１１ｂの間隔をＩ２としたときに（Ｌ１、Ｉ１及びＩ２は図２（Ａ）を参照）、間隔Ｉ１と長さＬ１がＩ１≦０．１５×Ｌ１の条件を満足し、且つ、間隔Ｉ２と長さＬ１がＩ２≦０．１５×Ｌ１の条件を満足するようすれば、前記「ＥＳＬの低減」を図ることができる。因みに、間隔Ｉ１と間隔Ｉ２は、製造公差を含まない設計上の基準寸法において同じであっても良いし、僅かに異なっていても良い。 That is, in the feedthrough capacitor 10-1, the ESL increases as the substantial current distance between the first internal conductor layer 15 and the second internal electrode layer 16 increases. However, when the length of the feedthrough capacitor 10-1 is L1, the interval between the exposed portions 11a of the capacitor body 11 is I1, and the interval between the exposed portions 11b is I2 (L1, I1 and I2 are shown in FIG. 2A). If the distance I1 and the length L1 satisfy the condition of I1 ≦ 0.15 × L1 and the distance I2 and the length L1 satisfy the condition of I2 ≦ 0.15 × L1, “Reduction of ESL” can be achieved. Incidentally, the interval I1 and the interval I2 may be the same or slightly different from each other in the design standard dimension not including the manufacturing tolerance.

この「ＥＳＬの低減」に係る有効性（効果）を確認するために、前記評価用サンプル１（長さＬ１が１０００μｍ、間隔Ｉ１及びＩ２の両方が１２５μｍ）と同じサンプルＢ１と、サンプルＢ１の第３外部電極１４の寸法Ｅ１を減少して間隔Ｉ１と間隔Ｉ２の両方を１５０μｍとしたサンプルＢ２と、サンプルＢ１の第３外部電極１４の寸法Ｅ１を減少して間隔Ｉ１と間隔Ｉ２の両方を１７５μｍとしたサンプルＢ３を用意した。そして、各１００個のサンプルＢ１〜Ｂ３のＥＳＬ値を、ネットワークアナライザ（アジレント社製、８７５３Ｄ）を利用して調べたところ、サンプルＢ１のＥＳＬ値（平均値）は１５ｐＦ、サンプルＢ２のＥＳＬ値（平均値）は１８ｐＦ、サンプルＢ３のＥＳＬ値（平均値）は２０ｐＦであった。即ち、前掲のＩ１≦０．１５×Ｌ１の条件とＩ２≦０．１５×Ｌ１の条件の満足するサンプルＢ１及びＢ２は、同条件を満足しないサンプルＢ３に比べて、前記「ＥＳＬの低減」に有効であることが確認できた。 In order to confirm the effectiveness (effect) related to the “reduction of ESL”, the same sample B1 as the sample 1 for evaluation (the length L1 is 1000 μm, both the intervals I1 and I2 are 125 μm), and the first sample B1 3 The sample E2 in which the dimension E1 of the external electrode 14 is reduced to reduce both the interval I1 and the interval I2 to 150 μm, and the dimension E1 of the third external electrode 14 in the sample B1 is reduced to reduce both the interval I1 and the interval I2 to 175 μm. Sample B3 was prepared. And when the ESL value of each of 100 samples B1 to B3 was examined using a network analyzer (manufactured by Agilent, 8753D), the ESL value (average value) of sample B1 was 15 pF, and the ESL value of sample B2 ( The average value) was 18 pF, and the ESL value (average value) of Sample B3 was 20 pF. In other words, the samples B1 and B2 satisfying the above-mentioned conditions of I1 ≦ 0.15 × L1 and I2 ≦ 0.15 × L1 are compared with the sample B3 not satisfying the same conditions in the above “reduction of ESL”. It was confirmed that it was effective.

《第２実施形態》
先ず、図８〜図１１を用いて、本発明の第２実施形態に係る貫通型積層セラミックコンデンサ１０-2（以下単に貫通型コンデンサ１０-2と言う）の構造及び効果等について説明する。 << Second Embodiment >>
First, the structure, effect, etc. of the feedthrough multilayer ceramic capacitor 10-2 (hereinafter simply referred to as feedthrough capacitor 10-2) according to the second embodiment of the present invention will be described with reference to FIGS.

この貫通型コンデンサ１０-2が構造上で前述の貫通型コンデンサ１０-1と相違するところは、図３（Ａ）に示した第１内部電極層１５の代わりに、これと形状が異なる第１内部電極層１８（図９（Ａ）を参照）を用いた点にある。この相違点以外の構造は前述の貫通型コンデンサ１０-1と同じであり、この相違点に基づいて得られる効果以外の効果は前述の貫通型コンデンサ１０-1で得られる効果と同等であるため、各々の説明を省略する。 The feedthrough capacitor 10-2 is different from the feedthrough capacitor 10-1 in the structure in that the first internal electrode layer 15 shown in FIG. The internal electrode layer 18 (see FIG. 9A) is used. Since the structure other than this difference is the same as that of the feedthrough capacitor 10-1, the effects other than those obtained based on this difference are the same as the effects obtained with the feedthrough capacitor 10-1. Each description is omitted.

各第１内部電極層１８は、図９（Ａ）に示したようなＩ字形状を成していて、長さ方向一端部（図９（Ａ）の左端部）の幅方向両側（図９（Ａ）の上下側）と長さ方向他端部（図９（Ａ）の右端部）の幅方向両側（図９（Ａ）の上下側）のそれぞれに、幅方向に延びる幅狭の引出部１８ａを一体に有している。各第１内部電極層１８の引出部１８ａは、第２内部電極層１６の引出部１６ａと同様に幅方向に延びるものであるため、図１０から分かるように、コンデンサ本体１０の高さ方向一面に第１内部電極層１８と第２内部電極層１６を平行投影すると、図１０の左下と引出部１８ａと中央下の引出部１６ａの間、並びに、左上の引出部１８ａと中央上の引出部１６ａの間に間隔Ｉ３が形成され、図１０の右下の引出部１８ａと中央下の引出部１６ａの間、並びに、右下の引出部１８ａと中央下の引出部１６ａの間に間隔Ｉ４が形成される。 Each of the first internal electrode layers 18 has an I shape as shown in FIG. 9A, and both sides in the width direction (FIG. 9) of one end portion in the length direction (left end portion in FIG. 9A). A narrow drawer extending in the width direction on both sides in the width direction (upper and lower sides in FIG. 9A) of the other side in the length direction (the right end portion in FIG. 9A) and the other end in the length direction (the right end portion in FIG. 9A). The portion 18a is integrally formed. Since the lead portion 18a of each first internal electrode layer 18 extends in the width direction similarly to the lead portion 16a of the second internal electrode layer 16, as can be seen from FIG. When the first internal electrode layer 18 and the second internal electrode layer 16 are projected in parallel to each other, the lower left portion between the lead portion 18a and the middle lower lead portion 16a in FIG. 10, and the upper left lead portion 18a and the middle upper lead portion. An interval I3 is formed between 16a, and an interval I4 is provided between the lower right drawer 18a and the lower center drawer 16a in FIG. 10 and between the lower right drawer 18a and the lower center drawer 16a. It is formed.

図１１から分かるように、各第１内部電極層１８の長さ方向一端部、具体的には図９（Ａ）の左下と左上の引出部１８ａの下端縁と上端縁は第１外部電極１２の部分１２ｄと部分１２ｅにそれぞれ電気的に接続され、各第１内部電極層１８の長さ方向他端部、具体的には図９（Ａ）の２個の右側引出部１８ａの下端縁と上端縁は第２外部電極１３の部分１３ｄと部分１３ｅにそれぞれ電気的に接続されている。 As can be seen from FIG. 11, one end in the length direction of each first internal electrode layer 18, specifically, the lower and upper edges of the lower left and upper left lead portions 18 a in FIG. 9A are the first outer electrodes 12. 12d and 12e are electrically connected to each other, and the other end in the length direction of each of the first internal electrode layers 18, specifically, the lower end edges of the two right lead portions 18a in FIG. The upper end edge is electrically connected to the portion 13d and the portion 13e of the second external electrode 13, respectively.

前述の貫通型コンデンサ１０-2は、図１０に示したように、コンデンサ本体１１の長さをＬ２とし、コンデンサ本体１１の高さ方向一面に平行投影された第１内部電極層１８の長さ方向一方の引出部１８ａと第２内部電極層１６の引出部１６ａの間隔をＩ３とし、第１内部電極層１８の長さ方向他方の引出部１８ａと第２内部電極層１６の引出部１６ａの間隔をＩ４としたとき、間隔Ｉ３と長さＬ２はＩ３≦０．３５×Ｌ２の条件を満足し、且つ、間隔Ｉ４と長さＬ２はＩ４≦０．３５×Ｌ２の条件を満足している。因みに、間隔Ｉ３と間隔Ｉ４は、製造公差を含まない設計上の基準寸法において同じであっても良いし、僅かに異なっていても良い。 In the feedthrough capacitor 10-2, as shown in FIG. 10, the length of the first internal electrode layer 18 projected in parallel on one surface of the capacitor body 11 in the height direction is set to L2. The distance between the one lead portion 18a in the direction and the lead portion 16a of the second internal electrode layer 16 is I3, and the other lead portion 18a in the length direction of the first internal electrode layer 18 and the lead portion 16a of the second internal electrode layer 16 When the interval is I4, the interval I3 and the length L2 satisfy the condition of I3 ≦ 0.35 × L2, and the interval I4 and the length L2 satisfy the condition of I4 ≦ 0.35 × L2. . Incidentally, the interval I3 and the interval I4 may be the same or slightly different from each other in the design standard dimension not including the manufacturing tolerance.

前掲のＩ３≦０．３５×Ｌ２の条件とＩ４≦０．３５×Ｌ２の条件は、「ＥＳＬ（等価直列インダクタンス）の低減」に有効である。つまり、前述の貫通型コンデンサ１０-2にあっては、第１内部導体層１８と第２内部電極層１６との実質的な電流距離が長くなるとＥＳＬが増加する。けれども、前掲のＩ３≦０．３５×Ｌ２の条件とＩ４≦０．３５×Ｌ２の条件を満足するようにすれば、前記「ＥＳＬの低減」を図ることができる。 The condition of I3 ≦ 0.35 × L2 and the condition of I4 ≦ 0.35 × L2 are effective for “reduction of ESL (equivalent series inductance)”. That is, in the feedthrough capacitor 10-2, ESL increases as the substantial current distance between the first internal conductor layer 18 and the second internal electrode layer 16 increases. However, if the above-described conditions of I3 ≦ 0.35 × L2 and I4 ≦ 0.35 × L2 are satisfied, the “ESL reduction” can be achieved.

この「ＥＳＬの低減」に係る有効性（効果）を確認するため、前記評価用サンプル１（長さＬ２が９６０μｍ）の第１内部電極層１５を図９（Ａ）に示した第１内部電極層１８に変え、且つ、引出部１８ａの位置を変えて間隔Ｉ３と間隔Ｉ４を３０６μｍとしたサンプルＣ１と、サンプルＣ１の第１内部電極層１８の引出部１８ａの位置を変えて間隔Ｉ３と間隔Ｉ４を３３６μｍとしたサンプルＣ２と、サンプルＣ１の第１内部電極層１８の引出部１８ａの位置を変えて間隔Ｉ３と間隔Ｉ４を３６６μｍとしたサンプルＣ３を用意した。因みに、サンプルＣ１〜Ｃ３における引出部１８ａ及び１６ａの幅（図１０の長さＬ２に沿う方向の寸法）は９０μｍで統一した。そして、各１００個のサンプルＣ１〜Ｃ３のＥＳＬ値を、ネットワークアナライザ（アジレント社製、８７５３Ｄ）を利用して調べたところ、サンプルＣ１のＥＳＬ値（平均値）は１３ｐＦ、サンプルＣ２のＥＳＬ値（平均値）は１５ｐＦ、サンプルＣ３のＥＳＬ値（平均値）は１７ｐＦであった。即ち、前掲のＩ３≦０．３５×Ｌ２の条件とＩ４≦０．３５×Ｌ２の条件を満足するサンプルＣ１及びＣ２は、同条件を満足しないサンプルＣ３に比べて、前記「ＥＳＬの低減」に有効であることが確認できた。 In order to confirm the effectiveness (effect) related to this “reduction of ESL”, the first internal electrode layer 15 of the evaluation sample 1 (length L2 is 960 μm) is shown in FIG. The sample 18 is changed to the layer 18 and the positions of the lead-out portions 18a are changed to set the intervals I3 and I4 to 306 μm, and the positions of the lead-out portions 18a of the first internal electrode layer 18 of the sample C1 are changed. Sample C2 having I4 of 336 μm and sample C3 having interval I3 and interval I4 of 366 μm were prepared by changing the position of the lead-out portion 18a of the first internal electrode layer 18 of sample C1. Incidentally, the widths (the dimension in the direction along the length L2 in FIG. 10) of the lead portions 18a and 16a in the samples C1 to C3 were unified to 90 μm. Then, when the ESL values of 100 samples C1 to C3 were examined using a network analyzer (manufactured by Agilent, 8753D), the ESL value (average value) of sample C1 was 13 pF, and the ESL value of sample C2 ( The average value) was 15 pF, and the ESL value (average value) of Sample C3 was 17 pF. That is, the samples C1 and C2 satisfying the above-described conditions of I3 ≦ 0.35 × L2 and I4 ≦ 0.35 × L2 are compared with the sample C3 not satisfying the same conditions as the above “reduction of ESL”. It was confirmed that it was effective.

〈第２実施形態の変形例〉
（１）前述の貫通型コンデンサ１０-2（サンプルＣ１及びＣ２を含む）として、図９（Ａ）に示した第１内部電極層１８を用いたものを示したが、この第１内部電極層１８の代わりに図１２（Ａ）に示した第１内部電極層１９を用いても良い。この第１内部電極層１９は、図１２（Ｂ）にも示したように、コンデンサ本体１１の長さ方向一端から長さ方向他端に及ぶ長さを有している点で図９（Ａ）に示した第１内部電極層１８と形状が異なる。図１２（Ｂ）から分かるように、この第１内部電極層１９を用いた場合でも、第１内部電極層１８を用いた場合と同様に、コンデンサ本体１０の高さ方向一面に第１内部電極層１９と第２内部電極層１６を平行投影すると、図１２（Ｂ）の左下の引出部１９ａと中央下の引出部１６ａの間、並びに、左上と引出部１９ａと中央上の引出部１６ａの間に間隔Ｉ３が形成され、図１２（Ｂ）の右下の引出部１９ａと中央下の引出部１６ａの間、並びに、右下の引出部１９ａと中央下の引出部１６ａの間に間隔Ｉ４が形成される。 <Modification of Second Embodiment>
(1) As the above-described feedthrough capacitor 10-2 (including samples C1 and C2), the one using the first internal electrode layer 18 shown in FIG. 9A is shown. This first internal electrode layer Instead of 18, the first internal electrode layer 19 shown in FIG. As shown in FIG. 12B, the first internal electrode layer 19 has a length extending from one end in the length direction of the capacitor body 11 to the other end in the length direction. The shape is different from the first internal electrode layer 18 shown in FIG. As can be seen from FIG. 12B, even when the first internal electrode layer 19 is used, the first internal electrode is disposed on the entire surface of the capacitor body 10 in the same manner as when the first internal electrode layer 18 is used. When the layer 19 and the second internal electrode layer 16 are projected in parallel, the lower left lead portion 19a and the lower center lead portion 16a in FIG. 12B, as well as the upper left, the lead portion 19a, and the upper center lead portion 16a. An interval I3 is formed between the lower right drawer portion 19a and the lower center drawer portion 16a in FIG. 12B, and between the lower right drawer portion 19a and the lower center drawer portion 16a. Is formed.

（２）前述の貫通型コンデンサ１０-2（サンプルＣ１及びＣ２を含む）には、前記〈第１実施形態の変形例〉の（１）〜（３）で説明した条件、即ち、「Ｔ１ｍａｘ＞Ｔ３ｍａｘの条件とＴ２ｍａｘ＞Ｔ３ｍａｘの条件」と、「Ｔ３ａｖｅ≦Ｉ１／２の条件とＴ３ａｖｅ≦Ｉ２／２」と、「Ｉ１≦０．１５×Ｌ１の条件とＩ２≦０．１５×Ｌ１の条件」を適宜採用することができ、採用することによって同様の効果を得ることができる。 (2) The feedthrough capacitor 10-2 (including the samples C1 and C2) includes the conditions described in (1) to (3) of <Modification of the first embodiment>, that is, “T1max>. “T3max condition and T2max> T3max condition”, “T3ave ≦ I1 / 2 condition and T3ave ≦ I2 / 2”, “I1 ≦ 0.15 × L1 condition and I2 ≦ 0.15 × L1 condition” Can be adopted as appropriate, and the same effect can be obtained by adopting.

１０-1…貫通型積層セラミックコンデンサ、１１…コンデンサ本体、１１ａ，１１ｂ…コンデンサ本体の露出部分、１２…第１外部電極、１２ａ…第１外部電極におけるコンデンサ本体の長さ方向一面を覆う部分、１２ｂ…第１外部電極におけるコンデンサ本体の高さ方向一面の一部を覆う部分、１２ｃ…第１外部電極におけるコンデンサ本体の高さ方向他面の一部を覆う部分、１２ｄ…第１外部電極におけるコンデンサ本体の幅方向一面の一部を覆う部分、１２ｅ…第１外部電極におけるコンデンサ本体の幅方向他面の一部を覆う部分、１２ｆ…第１外部電極の厚肉部分、１３…第２外部電極、１３ａ…第２外部電極におけるコンデンサ本体の長さ方向他面を覆う部分、１３ｂ…第２外部電極におけるコンデンサ本体の高さ方向一面の一部を覆う部分、１３ｃ…第２外部電極におけるコンデンサ本体の高さ方向他面の一部を覆う部分、１３ｄ…第２外部電極におけるコンデンサ本体の幅方向一面の一部を覆う部分、１３ｅ…第２外部電極におけるコンデンサ本体の幅方向他面の一部を覆う部分、１３ｆ…第２外部電極の厚肉部分、１４…第３外部電極、１４ａ…第３外部電極におけるコンデンサ本体の高さ方向一面の一部を覆う部分、１４ｂｃ…第３外部電極におけるコンデンサ本体の高さ方向他面の一部を覆う部分、１４ｃ…第３外部電極におけるコンデンサ本体の幅方向一面の一部を覆う部分、１４ｄ…第３外部電極におけるコンデンサ本体の幅方向他面の一部を覆う部分、１４ｅ…第４外部電極の厚肉部分、１５…第１内部電極層、１５ａ…第１内部電極層の引出部、１６…第２内部電極層、１６ａ…第２内部電極層の引出部、１７…誘電体層、ＣＰ…容量部、ＰＰ１…第１保護部、ＰＰ２…第２保護部、１０-2…貫通型積層セラミックコンデンサ、１８…第１内部電極層、１８ａ…第１内部電極層の引出部、１９…第１内部電極層、１９ａ…第１内部電極層の引出部。 10-1 ... through-type multilayer ceramic capacitor, 11 ... capacitor body, 11a, 11b ... exposed portion of the capacitor body, 12 ... first external electrode, 12a ... a portion of the first external electrode that covers one surface in the length direction of the capacitor body, 12b: a portion covering a part of one surface in the height direction of the capacitor body in the first external electrode, 12c: a portion covering a part of the other surface in the height direction of the capacitor body in the first external electrode, 12d: in the first external electrode A portion covering a part of one surface in the width direction of the capacitor body, 12e... A portion covering a part of the other surface in the width direction of the capacitor body in the first external electrode, 12f... A thick portion of the first external electrode, 13. Electrode, 13a: A portion covering the other surface in the length direction of the capacitor body in the second external electrode, 13b: A portion of one surface in the height direction of the capacitor body in the second external electrode Covering part, 13c: Part covering the other part of the second external electrode in the height direction of the capacitor body, 13d: Part covering the part of the second external electrode in the width direction of the capacitor body, 13e: Second external part A part of the electrode that covers a part of the other surface in the width direction of the capacitor body, 13f ... a thick part of the second external electrode, 14 ... a third external electrode, 14a ... one surface in the height direction of the capacitor body in the third external electrode 14bc: a portion covering a part of the other surface in the height direction of the capacitor body in the third external electrode, 14c: a portion covering a part of one surface in the width direction of the capacitor body in the third external electrode, 14d ... 3 A portion of the external electrode that covers a part of the other surface in the width direction of the capacitor body, 14e, a thick portion of the fourth external electrode, 15 a first internal electrode layer, 15a, a lead portion of the first internal electrode layer, 16 ... Second internal electrode layer, 16a ... extraction part of second internal electrode layer, 17 ... dielectric layer, CP ... capacitance part, PP1 ... first protection part, PP2 ... second protection part, 10-2 ... penetrating multilayer ceramic Capacitors, 18 ... first internal electrode layer, 18a ... leading portion of the first internal electrode layer, 19 ... first internal electrode layer, 19a ... leading portion of the first internal electrode layer.

Claims

長さ、幅及び高さで規定された略直方体状のコンデンサ本体内に、複数の第１内部電極層と複数の第２内部電極層とが誘電体層を介して高さ方向に交互に積層された容量部が設けられた貫通型積層セラミックコンデンサであって、
（１）前記コンデンサ本体の長さ方向一端部に該コンデンサ本体の長さ方向一面と高さ方向両面の一部と幅方向両面の一部とを連続して覆うように設けられ、前記複数の第１内部電極層の長さ方向一端部が接続された第１外部電極と、
（２）前記コンデンサ本体の長さ方向他端部に該コンデンサ本体の長さ方向他面と高さ方向両面の一部と幅方向両面の一部とを連続して覆うように設けられ、前記複数の第１内部電極層の長さ方向他端部が接続された第２外部電極と、
（３）前記コンデンサ本体の長さ方向中央部に前記第１外部電極及び前記第２外部電極と非接触下で該コンデンサ本体の高さ方向両面の一部と幅方向両面の一部とを連続して覆うように設けられ、前記幅方向両面の一部を覆う部分の一方に前記複数の第２電極層の幅方向一端部が接続され、且つ、他方に前記複数の第２電極層の幅方向他端部が接続された４角筒状の第３外部電極と、を備えており、
（４）前記貫通型積層セラミックコンデンサを高さ方向からみたときの前記第１外部電極の前記コンデンサ本体の長さに沿う寸法をＥ１とし、前記第２外部電極の前記コンデンサ本体の長さに沿う寸法をＥ２とし、前記第３外部電極の前記コンデンサ本体の長さに沿う寸法をＥ３としたとき、前記寸法Ｅ１と前記寸法Ｅ３はＥ１＜Ｅ３の条件を満足し、且つ、前記寸法Ｅ２と前記寸法Ｅ３はＥ２＜Ｅ３の条件を満足している、
貫通型積層セラミックコンデンサ。 A plurality of first internal electrode layers and a plurality of second internal electrode layers are alternately stacked in the height direction through a dielectric layer in a substantially rectangular parallelepiped capacitor body defined by length, width and height. A through-type multilayer ceramic capacitor provided with a capacitance portion,
(1) One end of the capacitor body in the length direction is provided so as to continuously cover one surface in the length direction, part of both sides in the height direction, and part of both surfaces in the width direction. A first external electrode to which one longitudinal end of the first internal electrode layer is connected;
(2) provided at the other end in the length direction of the capacitor body so as to continuously cover the other side in the length direction, part of both sides in the height direction and part of both sides in the width direction, A second external electrode to which the other longitudinal ends of the plurality of first internal electrode layers are connected;
(3) A part of both sides of the capacitor body in the height direction and a part of both sides in the width direction are continuously connected to the center part in the length direction of the capacitor body in a non-contact manner with the first external electrode and the second external electrode. One end of the plurality of second electrode layers is connected to one of the portions covering a part of both sides in the width direction, and the width of the plurality of second electrode layers is connected to the other. A quadrangular cylindrical third external electrode to which the other end in the direction is connected,
(4) E1 is a dimension along the length of the capacitor body of the first external electrode when the through-type multilayer ceramic capacitor is viewed from the height direction, and is along the length of the capacitor body of the second external electrode. When the dimension is E2, and the dimension of the third external electrode along the length of the capacitor body is E3, the dimension E1 and the dimension E3 satisfy the condition of E1 <E3, and the dimension E2 and the dimension The dimension E3 satisfies the condition of E2 <E3.
Through-type multilayer ceramic capacitors.

前記貫通型積層セラミックコンデンサを高さ方向から見たときの平面輪郭の総面積をＴＡＲとし、前記第１外部電極の平面輪郭の面積をＡＲ１とし、前記第２外部電極の平面輪郭の面積をＡＲ２とし、前記第３外部電極の平面輪郭の面積をＡＲ３としたとき、前記総面積ＴＡＲと前記面積ＡＲ１と前記面積ＡＲ２と前記面積ＡＲ３は０．６≦（ＡＲ１＋ＡＲ２＋ＡＲ３）／ＴＡＲ≦０．９の条件を満足している、
請求項１に記載の貫通型積層セラミックコンデンサ。 The total area of the planar outline when the feedthrough multilayer ceramic capacitor is viewed from the height direction is TAR, the area of the planar outline of the first external electrode is AR1, and the area of the planar outline of the second external electrode is AR2. When the area of the planar contour of the third external electrode is AR3, the total area TAR, the area AR1, the area AR2, and the area AR3 are such that 0.6 ≦ (AR1 + AR2 + AR3) /TAR≦0.9. Are satisfied,
The feedthrough multilayer ceramic capacitor according to claim 1.

前記コンデンサ本体の高さ方向両面及び幅方向両面のうち、前記第１外部電極と前記第３外部電極の間の部分と、前記第２外部電極と前記第３外部電極の間の部分は、それぞれ露出しており、
前記第１外部電極の表面粗さと前記第２外部電極の表面粗さと前記第３外部電極の表面粗さは、前記コンデンサ本体の露出部分の表面粗さよりも粗い、
請求項１又は２に記載の貫通型積層セラミックコンデンサ。 Of both the height direction both sides and the width direction both sides of the capacitor body, a portion between the first external electrode and the third external electrode, and a portion between the second external electrode and the third external electrode are respectively Exposed
The surface roughness of the first external electrode, the surface roughness of the second external electrode, and the surface roughness of the third external electrode are rougher than the surface roughness of the exposed portion of the capacitor body.
The feedthrough multilayer ceramic capacitor according to claim 1 or 2.

前記第１外部電極は、前記コンデンサ本体の長さ方向一面の稜線に近い部分の厚さが他の部分の厚さよりも厚く、
前記第２外部電極は、前記コンデンサ本体の長さ方向他面の稜線に近い部分の厚さが他の部分の厚さよりも厚く、
前記第３外部電極は、前記コンデンサ本体の高さ方向一面の稜線に近い部分の厚さと前記コンデンサ本体の高さ方向他面の稜線に近い部分の厚さが他の部分の厚さよりも厚い、
請求項１〜３の何れか１項に記載の貫通型積層セラミックコンデンサ。 In the first external electrode, the thickness of the portion near the ridge line on one surface in the length direction of the capacitor body is thicker than the thickness of the other portion.
In the second external electrode, the thickness of the portion near the ridge line on the other surface in the length direction of the capacitor body is thicker than the thickness of the other portion.
In the third external electrode, the thickness of the portion close to the ridge line on one surface in the height direction of the capacitor body and the thickness of the portion close to the ridge line on the other surface in the height direction of the capacitor body are thicker than the thickness of the other portion.
The feedthrough multilayer ceramic capacitor according to claim 1.

前記貫通型積層セラミックコンデンサの高さは２５０μｍ以下である、
請求項１〜４の何れか１項に記載の貫通型積層セラミックコンデンサ。 The feedthrough multilayer ceramic capacitor has a height of 250 μm or less.
The feedthrough multilayer ceramic capacitor according to any one of claims 1 to 4.

前記第１外部電極の高さ方向両面部分の最大厚さをＴ１ｍａｘとし、前記第２外部電極の高さ方向両面部分の最大厚さをＴ２ｍａｘとし、前記第３外部電極の高さ方向両面部分の最大厚さをＴ３ｍａｘとしたとき、前記最大厚さＴ１ｍａｘと前記最大厚さＴ３ｍａｘはＴ１ｍａｘ＞Ｔ３ｍａｘの条件を満足し、且つ、前記最大厚さＴ２ｍａｘと前記最大厚さＴ３ｍａｘはＴ２ｍａｘ＞Ｔ３ｍａｘの条件を満足している、
請求項１〜５の何れか１項に記載の貫通型積層セラミックコンデンサ。 T1max is the maximum thickness of the both sides in the height direction of the first external electrode, T2max is the maximum thickness of the both sides in the height direction of the second external electrode, and When the maximum thickness is T3max, the maximum thickness T1max and the maximum thickness T3max satisfy the condition of T1max> T3max, and the maximum thickness T2max and the maximum thickness T3max satisfy the condition of T2max> T3max. Is pleased,
The feedthrough multilayer ceramic capacitor according to any one of claims 1 to 5.

前記コンデンサ本体の高さ方向両面及び幅方向両面のうち、前記第１外部電極と前記第３外部電極の間の部分と、前記第２外部電極と前記第３外部電極の間の部分は、それぞれ露出しており、
前記第３外部電極の高さ方向両面部分の平均厚さをＴ３ａｖｅとし、前記コンデンサ本体における前記第１外部電極と前記第３外部電極の間の露出部分の間隔をＩ１とし、前記コンデンサ本体における前記第２外部電極と前記第３外部電極の間の露出部分の間隔をＩ２としたとき、前記平均厚さＴ３ａｖｅと前記間隔Ｉ１はＴ３ａｖｅ≦Ｉ１／２の条件を満足し、且つ、前記平均厚さＴ３ａｖｅと前記間隔Ｉ２はＴ３ａｖｅ≦Ｉ２／２の条件を満足している、
請求項１〜６の何れか１項に記載の貫通型積層セラミックコンデンサ。 Of both the height direction both sides and the width direction both sides of the capacitor body, a portion between the first external electrode and the third external electrode, and a portion between the second external electrode and the third external electrode are respectively Exposed
The average thickness of the both sides in the height direction of the third external electrode is T3ave, the interval between the exposed portions of the capacitor body between the first external electrode and the third external electrode is I1, and the capacitor body When the interval of the exposed portion between the second external electrode and the third external electrode is I2, the average thickness T3ave and the interval I1 satisfy the condition of T3ave ≦ I1 / 2, and the average thickness T3ave and the interval I2 satisfy the condition of T3ave ≦ I2 / 2.
The feedthrough multilayer ceramic capacitor according to any one of claims 1 to 6.

前記コンデンサ本体の高さ方向両面及び幅方向両面のうち、前記第１外部電極と前記第３外部電極の間の部分と、前記第２外部電極と前記第３外部電極の間の部分は、それぞれ露出しており、
前記貫通型コンデンサの長さをＬ１とし、前記コンデンサ本体における前記第１外部電極と前記第３外部電極の間の露出部分の間隔をＩ１とし、前記コンデンサ本体における前記第２外部電極と前記第３外部電極の間の露出部分の間隔をＩ２としたとき、前記間隔Ｉ１と前記長さＬ１はＩ１≦０．１５×Ｌ１の条件を満足し、且つ、前記間隔Ｉ２と前記長さＬ１はＩ２≦０．１５×Ｌ１の条件を満足している、
請求項１〜７の何れか１項に記載の貫通型積層セラミックコンデンサ。 Of both the height direction both sides and the width direction both sides of the capacitor body, a portion between the first external electrode and the third external electrode, and a portion between the second external electrode and the third external electrode are respectively Exposed
The length of the feedthrough capacitor is L1, the interval of the exposed portion between the first external electrode and the third external electrode in the capacitor body is I1, and the second external electrode and the third external body in the capacitor body are When the interval of the exposed portion between the external electrodes is I2, the interval I1 and the length L1 satisfy the condition of I1 ≦ 0.15 × L1, and the interval I2 and the length L1 are I2 ≦ Satisfies the condition of 0.15 × L1,
The feedthrough multilayer ceramic capacitor according to any one of claims 1 to 7.

前記複数の第１内部電極層は長さ方向両端部に長さ方向に延びる幅狭の引出部を有する形状を成し、前記複数の第２内部電極層は幅方向両端部に幅方向に延びる幅狭の引出部を有する形状を成している、
請求項１〜８の何れか１項に記載の貫通型積層セラミックコンデンサ。 The plurality of first internal electrode layers have a shape having narrow lead portions extending in the length direction at both ends in the length direction, and the plurality of second internal electrode layers extend in the width direction at both width direction ends. It has a shape with a narrow drawer,
The feedthrough multilayer ceramic capacitor according to any one of claims 1 to 8.

前記複数の第１内部電極層は長さ方向両端部の幅方向両側に幅方向に延びる幅狭の引出部を有する形状を成し、前記複数の第２内部電極層は幅方向両端部に幅方向に延びる幅狭の引出部を有する形状を成している、
請求項１〜８の何れか１項に記載の貫通型積層セラミックコンデンサ。 The plurality of first internal electrode layers have a shape having narrow lead portions extending in the width direction on both sides in the width direction at both ends in the length direction, and the plurality of second internal electrode layers have a width at both ends in the width direction. It has a shape with a narrow drawer extending in the direction,
The feedthrough multilayer ceramic capacitor according to any one of claims 1 to 8.

前記コンデンサ本体の長さをＬ２とし、前記コンデンサ本体の高さ方向一面に平行投影された前記複数の第１内部電極層における長さ方向一方の引出部と前記複数の第２内部電極層の引出部との間隔をＩ３とし、前記複数の第１内部電極層における長さ方向他方の引出部と前記複数の第２内部電極層の引出部との間隔をＩ４としたとき、前記間隔Ｉ３と前記長さＬ２はＩ３≦０．３５×Ｌ２の条件を満足し、且つ、前記間隔Ｉ４と前記長さＬ２はＩ４≦０．３５×Ｌ２の条件を満足している、
請求項１０に記載の貫通型積層セラミックコンデンサ。 The length of the capacitor main body is L2, and one lead portion in the length direction of the plurality of first internal electrode layers projected in parallel on one surface in the height direction of the capacitor main body and the lead of the plurality of second internal electrode layers are drawn. When the interval between the lead portion of the plurality of first internal electrode layers and the lead portion of the plurality of second internal electrode layers is I4, the interval between the portion I3 and the second internal electrode layer is I3. The length L2 satisfies the condition of I3 ≦ 0.35 × L2, and the interval I4 and the length L2 satisfy the condition of I4 ≦ 0.35 × L2.
The feedthrough multilayer ceramic capacitor according to claim 10.