JP2016092153A5 - - Google Patents
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- JP2016092153A5 JP2016092153A5 JP2014223678A JP2014223678A JP2016092153A5 JP 2016092153 A5 JP2016092153 A5 JP 2016092153A5 JP 2014223678 A JP2014223678 A JP 2014223678A JP 2014223678 A JP2014223678 A JP 2014223678A JP 2016092153 A5 JP2016092153 A5 JP 2016092153A5
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- lead frame
- silver
- forming
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000007747 plating Methods 0.000 claims description 64
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 12
- 229910052763 palladium Inorganic materials 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 18
- 229910052709 silver Inorganic materials 0.000 claims 18
- 239000004332 silver Substances 0.000 claims 18
- 238000004519 manufacturing process Methods 0.000 claims 12
- 239000003513 alkali Substances 0.000 claims 8
- 229910001316 Ag alloy Inorganic materials 0.000 claims 6
- 239000002585 base Substances 0.000 claims 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 6
- 229910052802 copper Inorganic materials 0.000 claims 6
- 239000010949 copper Substances 0.000 claims 6
- 239000003518 caustics Substances 0.000 claims 4
- 239000007769 metal material Substances 0.000 claims 3
- IOLCXVTUBQKXJR-UHFFFAOYSA-M Potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 claims 2
- 230000003287 optical Effects 0.000 claims 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims 2
- 229910052700 potassium Inorganic materials 0.000 claims 2
- 239000011591 potassium Substances 0.000 claims 2
- KEAYESYHFKHZAL-UHFFFAOYSA-N sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 claims 2
- 229910052708 sodium Inorganic materials 0.000 claims 2
- 239000011734 sodium Substances 0.000 claims 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- ADZWSOLPGZMUMY-UHFFFAOYSA-M Silver bromide Chemical compound [Ag]Br ADZWSOLPGZMUMY-UHFFFAOYSA-M 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 238000009713 electroplating Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 1
Description
また、例えば、下地層５０をニッケルめっき層、パラジウムめっき層、金めっき層を下層から積層させた積層膜とする場合には、まずリードフレーム材１０をニッケルめっき浴に浸漬させて電気めっき処理を行い、次いで、パラジウムめっき浴にニッケルめっき層が形成されたリードフレーム材１０を浸漬させて電気めっき処理を行い、パラジウムめっき層上にパラジウムめっき層を形成する。更に、金めっき浴にニッケルめっき層及びパラジウムめっき層が表面に積層形成されたリードフレーム材１０を金めっき浴に浸漬させ。電気めっき処理を行うことにより、積層膜の下地層５０を形成することができる。なお、各層の厚さについては、例えば、ニッケルめっき層を０．５〜４．０μｍ、パラジウムめっき層を０．００５〜０．１μｍ、金めっき層を０．００１〜０．０２μｍの範囲で形成してもよい。
Further, for example, when the underlayer 50 is a laminated film in which a nickel plating layer, a palladium plating layer, and a gold plating layer are laminated from the lower layer, the lead frame material 10 is first immersed in a nickel plating bath and subjected to electroplating treatment. Next, the lead frame material 10 on which the nickel plating layer is formed is immersed in a palladium plating bath and electroplating is performed to form a palladium plating layer on the palladium plating layer. Further, the lead frame material 10 having a nickel plating layer and a palladium plating layer laminated on the surface of the gold plating bath is immersed in the gold plating bath. By performing the electroplating process, the underlayer 50 of the laminated film can be formed. The thickness of each layer is, for example, in the range of 0.5 to 4.0 μm for the nickel plating layer, 0.005 to 0.1 μm for the palladium plating layer, and 0.001 to 0.02 μm for the gold plating layer. It may be formed.
Claims (24)
少なくとも前記素子搭載領域上に、光沢性を有し、表面にアルカリ処理が施された銀めっき層又は銀を含有する銀合金めっき層が形成されたリードフレーム。 A lead frame made of a metal material and having an element mounting area for mounting an optical element and a bonding area for wire bonding with the optical element,
A lead frame in which a silver plating layer or a silver alloy plating layer containing silver is formed on at least the element mounting region and having a glossiness and a surface subjected to alkali treatment.
該銀めっき層が形成された前記リードフレーム材をアルカリ溶液に浸漬してアルカリ処理を施す工程と、
該アルカリ処理が施された前記リードフレーム材を加熱処理する工程と、を有するリードフレームの製造方法。 Forming a glossy silver plating layer by applying silver plating to the surface of the lead frame material formed of a metal material into a lead frame; and
Immersing the lead frame material on which the silver plating layer is formed in an alkaline solution to perform an alkali treatment;
And a step of heat-treating the lead frame material subjected to the alkali treatment.
前記リードフレーム材を加熱処理する工程終了後の前記銀めっき層の第２の光沢度は、前記第１の光沢度の９０％以上を維持する請求項１２乃至１７のいずれか一項に記載のリードフレームの製造方法。 The first glossiness of the silver plating layer after completion of the step of forming the silver plating layer is 1.70 or more,
18. The second glossiness of the silver plating layer after the completion of the step of heat-treating the lead frame material is maintained at 90% or more of the first glossiness. Lead frame manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014223678A JP6448986B2 (en) | 2014-10-31 | 2014-10-31 | Lead frame manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014223678A JP6448986B2 (en) | 2014-10-31 | 2014-10-31 | Lead frame manufacturing method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016092153A JP2016092153A (en) | 2016-05-23 |
| JP2016092153A5 true JP2016092153A5 (en) | 2017-03-09 |
| JP6448986B2 JP6448986B2 (en) | 2019-01-09 |
Family
ID=56016369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014223678A Active JP6448986B2 (en) | 2014-10-31 | 2014-10-31 | Lead frame manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6448986B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017005224A (en) * | 2015-06-16 | 2017-01-05 | Ｓｈマテリアル株式会社 | Lead frame for optical element and manufacturing method therefor |
| JP7148792B2 (en) * | 2018-09-27 | 2022-10-06 | 日亜化学工業株式会社 | METAL MATERIAL FOR OPTO-SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND OPTO-SEMICONDUCTOR DEVICE USING THE SAME |
| JP6736643B2 (en) * | 2018-11-28 | 2020-08-05 | 日亜化学工業株式会社 | Multi-row lead frame, multi-row LED lead frame, manufacturing method thereof, and LED package manufacturing method |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09181241A (en) * | 1995-12-21 | 1997-07-11 | Hitachi Cable Ltd | Method for treating surface of lead frame |
| JP4367457B2 (en) * | 2006-07-06 | 2009-11-18 | パナソニック電工株式会社 | Silver film, silver film manufacturing method, LED mounting substrate, and LED mounting substrate manufacturing method |
| JP2008091818A (en) * | 2006-10-05 | 2008-04-17 | Matsushita Electric Ind Co Ltd | Lead frame for optical semiconductor device, optical semiconductor device using it, and these manufacturing methods |
| JP4758976B2 (en) * | 2007-12-03 | 2011-08-31 | 日立ケーブルプレシジョン株式会社 | Lead frame for mounting semiconductor light emitting device, method for manufacturing the same, and light emitting device |
| JP5636184B2 (en) * | 2009-11-19 | 2014-12-03 | 日立マクセル株式会社 | Semiconductor device, substrate for semiconductor device, and manufacturing method thereof |
| CN102471895B (en) * | 2010-05-20 | 2013-12-18 | Jx金属商事株式会社 | Electrolytically silver plated and/or electrolytically silver alloy plated article having oxide layer on surface |
| JP5618189B2 (en) * | 2010-07-30 | 2014-11-05 | 大日本印刷株式会社 | Lead frame with resin and manufacturing method thereof, and semiconductor device and manufacturing method thereof |
| JP2012089830A (en) * | 2010-09-21 | 2012-05-10 | Nichia Chem Ind Ltd | Light emitting device |
| JP6015231B2 (en) * | 2011-08-26 | 2016-10-26 | 大日本印刷株式会社 | LED element mounting substrate, method for manufacturing the same, and semiconductor device using the LED element mounting substrate |
| US9793456B2 (en) * | 2011-09-30 | 2017-10-17 | Kaneka Corporation | Molded resin body for surface-mounted light-emitting device, manufacturing method thereof, and surface-mounted light-emitting device |
| JP2013174865A (en) * | 2012-01-25 | 2013-09-05 | Jx Nippon Mining & Metals Corp | Lamination structure having indium-silver alloy layer on copper or copper alloy layer, and manufacturing method thereof |
| JP5998621B2 (en) * | 2012-05-10 | 2016-09-28 | 大日本印刷株式会社 | LED lead frame and semiconductor device using the LED lead frame |
| JP6230778B2 (en) * | 2012-05-31 | 2017-11-15 | 日亜化学工業株式会社 | Electrolytic silver plating solution for optical semiconductor devices |
| US9590155B2 (en) * | 2012-06-06 | 2017-03-07 | Cree, Inc. | Light emitting devices and substrates with improved plating |
| CN103806058A (en) * | 2012-11-08 | 2014-05-21 | 无锡新三洲特钢有限公司 | Method for electroplating LED pin with high-gloss silver coating |
| JP6175822B2 (en) * | 2013-03-15 | 2017-08-09 | 日亜化学工業株式会社 | Lead frame or substrate for optical semiconductor devices |
| JP2014197605A (en) * | 2013-03-29 | 2014-10-16 | 日立化成株式会社 | Method for manufacturing led mounting substrate |
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2014
- 2014-10-31 JP JP2014223678A patent/JP6448986B2/en active Active
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