JP2016051764A - Method for manufacturing flexible copper wiring board, and support film-attached flexible copper-clad laminate used therefor - Google Patents
Method for manufacturing flexible copper wiring board, and support film-attached flexible copper-clad laminate used therefor Download PDFInfo
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- JP2016051764A JP2016051764A JP2014175364A JP2014175364A JP2016051764A JP 2016051764 A JP2016051764 A JP 2016051764A JP 2014175364 A JP2014175364 A JP 2014175364A JP 2014175364 A JP2014175364 A JP 2014175364A JP 2016051764 A JP2016051764 A JP 2016051764A
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- flexible copper
- support film
- wiring board
- clad laminate
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 124
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 123
- 239000010949 copper Substances 0.000 title claims abstract description 123
- 238000000034 method Methods 0.000 title claims abstract description 56
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 46
- 239000011347 resin Substances 0.000 claims abstract description 46
- 229920005989 resin Polymers 0.000 claims abstract description 46
- 238000010438 heat treatment Methods 0.000 claims abstract description 21
- 238000005530 etching Methods 0.000 claims abstract description 19
- 238000010030 laminating Methods 0.000 claims abstract description 9
- 239000012790 adhesive layer Substances 0.000 claims abstract description 7
- 229920001721 polyimide Polymers 0.000 claims description 16
- 239000010410 layer Substances 0.000 claims description 8
- 229920000728 polyester Polymers 0.000 claims description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 147
- 206010040844 Skin exfoliation Diseases 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- 239000009719 polyimide resin Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 229920002799 BoPET Polymers 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010019 resist printing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
本発明は、チップ・オン・フィルム（ＣＯＦ：Ｃｈｉｐ Ｏｎ Ｆｉｌｍ）やフレキシブルプリント配線板（ＦＰＣ：Ｆｌｅｘｉｂｌｅ Ｐｒｉｎｔｅｄ Ｃｉｒｃｕｉｔ）などに使用されるフレキシブル銅配線板の製造方法、及び、それに用いる支持フィルム付のフレキシブル銅張積層板（ＦＣＣＬ：Ｆｌｅｘｉｂｌｅ Ｃｏｐｐｅｒ Ｃｌａｄ Ｌａｍｉｎａｔｅ）に関する。 The present invention relates to a method for producing a flexible copper wiring board used for a chip-on-film (COF), a flexible printed circuit (FPC), and the like, and a flexible film with a support film used therefor. It is related with a copper clad laminated board (FCCL: Flexible Copper Clad Laminate).
樹脂フィルムはフレキシブル性を有し、加工が容易であるため、その表面に金属膜や酸化物膜を形成して電子部品や光学部品、包装材料などに広く産業界で用いられている。例えば、フレキシブル性を有するフレキシブル配線基板が携帯電話など小型電子機器で使用されている。 Resin films have flexibility and are easy to process. Therefore, a metal film or an oxide film is formed on the surface of the resin film and is widely used in the industry for electronic parts, optical parts, packaging materials, and the like. For example, flexible wiring boards having flexibility are used in small electronic devices such as mobile phones.
フレキシブル銅配線板の製造方法として、例えば樹脂フィルムの一方の表面に金属薄膜が形成されたフレキシブル銅張積層板を出発材料とし、これに選択的エッチング工程により金属薄膜の不要部分を除去して配線パターンを形成し、めっき工程等を経ることで製造する方法が挙げられる。 As a method for manufacturing a flexible copper wiring board, for example, a flexible copper-clad laminate having a metal thin film formed on one surface of a resin film is used as a starting material, and an unnecessary portion of the metal thin film is removed by a selective etching process. The method of manufacturing by forming a pattern and passing through a plating process etc. is mentioned.
しかしながら、フレキシブル銅張積層板は、柔軟性、屈曲性に富むものであるが故に、そのままの状態ではハンドリング強度が十分ではなく搬送時に樹脂フィルムが変形したり、あるいは切れるという問題があり、選択的エッチング処理等を行うことが困難である。また、スプロケットホールの強度を十分に確保することができず、搬送時にスプロケットホールが変形し、配線パターン及びソルダーレジストパターン等を所定の位置に高精度に形成できないという問題もあった。従って、フレキシブル銅張積層板の金属薄膜が形成されていない表面に支持フィルムを粘着層を介して積層し、一時的にハンドリング強度を向上させた状態で選択的エッチング処理を施し、配線パターンを形成した後、金属張積層板から支持フィルムを剥離することによって、フレキシブル銅配線板を得る方法が多く採用されている。 However, since the flexible copper clad laminate is rich in flexibility and flexibility, there is a problem that the handling strength is not sufficient in the state as it is, and there is a problem that the resin film is deformed or cut at the time of transport, and selective etching treatment is performed. Etc. are difficult to perform. In addition, the strength of the sprocket hole cannot be sufficiently ensured, and the sprocket hole is deformed at the time of conveyance, and there is a problem that the wiring pattern, the solder resist pattern, and the like cannot be formed with high precision at predetermined positions. Therefore, a support film is laminated on the surface of the flexible copper-clad laminate on which the metal thin film is not formed via an adhesive layer, and a selective etching process is performed with the handling strength temporarily improved to form a wiring pattern. After that, a method of obtaining a flexible copper wiring board by peeling the support film from the metal-clad laminate is often employed.
このような支持フィルムの一例として、たとえば特許文献１では、ポリエチレンテレフタレート（ＰＥＴ）フィルムなどを基材とした粘着シートが提案されている。
As an example of such a support film, for example,
しかし、支持フィルムを積層した場合、フレキシブル銅張積層板の寸法安定性に及ぼす可能性が懸念されている。近年求められる配線の幅は１０〜１５μｍ程度となっており、寸法安定性の高さがフレキシブル銅張積層板には強く要求されるためである。支持フィルムを接着されていないフレキシブル銅張積層板は、ポリイミドなどが樹脂基材として用いられるために、加熱による収縮自体は若干あるもののロットごとのばらつきは小さい。そのため、予めエッチング工程や加熱工程を行う前のフレキシブル銅張積層板と工程後のフレキシブル銅配線板のサンプル長を測定し、工程前後の収縮率の相関を算出しておき、収縮を予め見込んでフレキシブル銅張積層板のほうを設計することにより、工程後のフレキシブル銅配線板の配線パターンを精度よく形成することが可能であった。 However, when a support film is laminated, there is concern about the possibility of affecting the dimensional stability of the flexible copper-clad laminate. This is because the wiring width required in recent years is about 10 to 15 μm, and high dimensional stability is strongly required for the flexible copper-clad laminate. The flexible copper-clad laminate to which the support film is not bonded has a small variation per lot although there is some shrinkage due to heating because polyimide or the like is used as a resin substrate. Therefore, measure the sample length of the flexible copper-clad laminate before the etching process and heating process and the flexible copper wiring board after the process in advance, calculate the correlation between the shrinkage ratio before and after the process, and anticipate the shrinkage in advance. By designing the flexible copper-clad laminate, it was possible to accurately form the wiring pattern of the flexible copper wiring board after the process.
しかし、ＰＥＴなどの支持フィルムを積層させたフレキシブル銅張積層板を用いた場合には、ＰＥＴ自体の収縮率がポリイミドなどの樹脂基材に比べて極めて大きいため、その積層体である支持フィルム付フレキシブル銅張積層板も寸法変化にはばらつきが大きくなり、工程前後の寸法変化率に相関がほとんど見られない。そのため、近年求められる配線幅のスペックに対応するためには、銅張積層板のロットごとにパラメータを調整しなければならない。そのようなロットごとのパラメータの調整は、工程の調整の手間、調整時の原料ロス、製品の品質バラツキの悪化、歩留まり低下など様々な悪影響を及ぼす。そのため、近年の小型電子機器で使用できるフレキシブル銅張積層板で使用した場合には、その歩留りが低下し、生産性の悪いフレキシブル銅張積層板となってしまうという問題がある。 However, when a flexible copper-clad laminate with a support film such as PET laminated is used, the shrinkage rate of PET itself is much larger than that of a resin substrate such as polyimide. The flexible copper clad laminate also has a large variation in dimensional change, and there is almost no correlation between the dimensional change rate before and after the process. Therefore, parameters must be adjusted for each lot of copper clad laminates in order to meet the wiring width specifications required in recent years. Such parameter adjustment for each lot has various adverse effects such as labor for process adjustment, loss of raw materials during adjustment, deterioration of product quality variation, and yield reduction. Therefore, when it uses with the flexible copper clad laminated board which can be used with recent small electronic devices, the yield falls and there exists a problem that it will become a flexible copper clad laminated board with low productivity.
本発明は、フレキシブル銅配線板の製造方法において、支持フィルム付銅配線板形成工程を含むものであっても、支持フィルム付銅配線板寸法安定性が高く、そのため、その歩留りが高く、生産性の高いフレキシブル銅張積層板の製造方法を提供することを目的とする。 In the method for producing a flexible copper wiring board, the present invention has a high dimensional stability of a copper wiring board with a supporting film, even if it includes a copper wiring board forming step with a supporting film, so that the yield is high and the productivity is high. It aims at providing the manufacturing method of a high flexible copper clad laminated board.
本発明者らは、銅配線板形成工程で用いる支持フィルム付銅配線板について、鋭意検討をした。フレキシブル銅張積層板に用いられているポリイミドなどの樹脂フィルムは、高温条件下で圧縮又は引張応力が加わると、その応力の影響を寸法安定性に変化が生じる。そのため、樹脂フィルムに支持フィルムが密着していた場合、高温条件下でその支持フィルムの寸法が大きく変化する場合には、支持フィルムの寸法変化によって樹脂フィルム自体の寸法安定性に影響を与えることを発見した。そこで、支持フィルムとして、２軸延伸フィルムであって、それぞれ延伸方向における、１５０℃×３０分後における熱収縮率が、それぞれ０．１％以下のものを用いることで、支持フィルム付銅配線板自体の熱安定性が高くなり、課題であった銅張積層板の寸法変化率が安定し、支持フィルム付であっても工程前後の相関が維持できることを見出し、本発明を完成するに至った。 The present inventors diligently studied the copper wiring board with a support film used in the copper wiring board forming step. When a compressive or tensile stress is applied to a resin film such as polyimide used for a flexible copper clad laminate under a high temperature condition, the influence of the stress changes in dimensional stability. Therefore, when the support film is in close contact with the resin film, if the size of the support film changes greatly under high temperature conditions, the dimensional stability of the resin film itself is affected by the change in the size of the support film. discovered. Therefore, the support film is a biaxially stretched film, each having a thermal shrinkage rate at 150 ° C. × 30 minutes in the stretch direction of 0.1% or less, respectively. The thermal stability of itself increased, the dimensional change rate of the copper clad laminate, which was a problem, was stabilized, and it was found that the correlation before and after the process could be maintained even with a support film, and the present invention was completed. .
すなわち、本発明の第一は、樹脂フィルムの一方の面側に銅配線が形成されているフレキシブル銅配線板の製造方法であって、前記樹脂フィルムの一方の面側に銅を積層するフレキシブル銅張積層板形成工程と、前記樹脂フィルムの他方の面側に、粘着層を介して、２軸延伸フィルムを支持フィルムとして積層する支持フィルム付フレキシブル銅張積層板形成工程と、前記銅をエッチングして前記銅配線を形成する銅配線形成工程と、前記支持フィルム付フレキシブル銅張積層板を加熱する加熱工程と、前記支持フィルムを剥離する剥離工程と、を備え、前記支持フィルムとして、前記２軸延伸フィルムのそれぞれ延伸方向における、１５０℃×３０分後における熱収縮率が、それぞれ０．１％以下であるフィルムを用いる、フレキシブル銅配線板の製造方法である。 That is, the first of the present invention is a method for manufacturing a flexible copper wiring board in which a copper wiring is formed on one surface side of a resin film, wherein the copper is laminated on one surface side of the resin film. Etching the copper with a laminated laminate forming step, a flexible copper clad laminate forming step with a support film for laminating a biaxially stretched film as a support film via an adhesive layer on the other surface side of the resin film, A copper wiring forming step for forming the copper wiring, a heating step for heating the flexible copper-clad laminate with a support film, and a peeling step for peeling the support film. Flexible copper using a film having a thermal shrinkage of 0.1% or less after 150 ° C. for 30 minutes in each stretching direction of the stretched film It is a preparation method for one-plate.
本発明の第二は、前記支持フィルムが、２軸延伸ポリエステルである第一の発明に記載のフレキシブル銅配線板の製造方法である。 2nd of this invention is a manufacturing method of the flexible copper wiring board as described in 1st invention whose said support film is biaxially-stretched polyester.
本発明の第三は、前記樹脂フィルムが、ポリイミドフィルムである第一又は第二の発明に記載のフレキシブル銅配線板の製造方法である。 3rd of this invention is a manufacturing method of the flexible copper wiring board as described in 1st or 2nd invention whose said resin film is a polyimide film.
本発明の第四は、前記支持フィルムの厚さが、前記樹脂フィルムの厚さの０．４倍以上３．４倍以下である第一から第三のいずれかの発明に記載のフレキシブル銅配線板の製造方法である。 A fourth aspect of the present invention is the flexible copper wiring according to any one of the first to third aspects, wherein the thickness of the support film is not less than 0.4 times and not more than 3.4 times the thickness of the resin film. It is a manufacturing method of a board.
本発明の第五は、前記支持フィルム付フレキシブル銅張積層板について、所定の条件下での寸法変化の実測値を測定し、この実測値を、前記フレキシブル銅配線板の寸法変化の予測値とする寸法変化予測工程を更に備える第一から第四のいずれかの発明に記載のフレキシブル銅配線板の製造方法である。 In the fifth aspect of the present invention, the flexible copper-clad laminate with a support film is measured for an actual measurement value of a dimensional change under a predetermined condition, and the actual measurement value is calculated as a predicted value of a dimensional change of the flexible copper wiring board. It is a manufacturing method of the flexible copper wiring board as described in any one of the 1st to 4th invention further equipped with the dimension change estimation process to perform.
本発明の第六は、前記所定の条件が、エッチング処理及び／又は加熱処理である第五の発明に記載のフレキシブル銅配線板の製造方法である。 6th of this invention is a manufacturing method of the flexible copper wiring board as described in 5th invention whose said predetermined conditions are an etching process and / or a heat processing.
本発明の第七は、樹脂フィルムの一方の面側に銅が積層されているフレキシブル銅張積層板と、前記フレキシブル銅張積層板の前記樹脂フィルムの他方の面側に、粘着層を介して、２軸延伸フィルムが支持フィルムとして積層されている、支持フィルム付フレキシブル銅張積層板であって、前記２軸延伸フィルムのそれぞれ延伸方向における、１５０℃×３０分後における熱収縮率が、それぞれ０．１％以下である支持フィルム付フレキシブル銅張積層板である。 A seventh aspect of the present invention is a flexible copper clad laminate in which copper is laminated on one surface side of a resin film, and an adhesive layer on the other surface side of the resin film of the flexible copper clad laminate. A biaxially stretched film is laminated as a support film, and is a flexible copper-clad laminate with a support film, each having a heat shrinkage ratio after 150 ° C. × 30 minutes in each stretching direction of the biaxially stretched film, It is a flexible copper clad laminated board with a support film which is 0.1% or less.
本発明の第八は、第七の発明に記載の支持フィルム付フレキシブル銅張積層板が用いられているフレキシブル配線基板である。 The eighth of the present invention is a flexible wiring board in which the flexible copper-clad laminate with a support film described in the seventh invention is used.
本発明によれば、フレキシブル銅配線板の製造方法において、支持フィルム付銅配線板形成工程を含むものであっても、支持フィルムの２軸延伸フィルムのそれぞれ延伸方向（ＭＤ：Ｍａｃｈｉｎｅ Ｄｉｒｅｃｔｉｏｎ、ＴＤ：Ｔｒａｎｓｖｅｒｓｅ Ｄｉｒｅｃｔｉｏｎ）における、１５０℃×３０分後における熱収縮率が、それぞれ０．１％以下のものを用いることでフレキシブル銅配線板そのものの寸法安定性が高く、その歩留りが高く、生産性の高いフレキシブル銅張積層板の製造方法である。 According to the present invention, in the method for producing a flexible copper wiring board, even if it includes a copper wiring board forming step with a support film, each of the stretching directions (MD: Machine Direction, TD :) of the biaxially stretched film of the support film. In the Transverse Direction), the heat shrinkage rate after 150 ° C. × 30 minutes is 0.1% or less, respectively, so that the flexible copper wiring board itself has high dimensional stability, high yield, and high productivity. It is a manufacturing method of a flexible copper clad laminated board.
以下、本発明の実施形態について説明する。本発明に係るフレキシブル銅配線板の製造方法は、図１に示すように、樹脂フィルムの一方の面側に銅を積層するフレキシブル銅張積層板形成工程１と、前記樹脂フィルムの他方の面側に、粘着層を介して、２軸延伸フィルムを支持フィルムとして積層する支持フィルム付フレキシブル銅張積層板形成工程２と、前記銅をエッチングして前記銅配線を形成する銅配線形成工程３と、加熱工程４と、前記支持フィルムを剥離する剥離工程５と、を備えるフレキシブル銅配線板の製造方法であって、前記支持フィルムとして、前記２軸延伸フィルムのそれぞれ延伸方向における、１５０℃×３０分後における熱収縮率が、それぞれ０．１％以下であるフィルムを用いることを特徴とする。
Hereinafter, embodiments of the present invention will be described. As shown in FIG. 1, the method for producing a flexible copper wiring board according to the present invention includes a flexible copper clad
［フレキシブル銅張積層板形成工程１］
本発明に係るフレキシブル銅配線板の製造方法は、樹脂フィルムの一方の面側に銅を積層する工程を含む。当該工程は、例えば、樹脂フィルムと銅箔の間に接着剤を用いて両者を重ねて張り合わせる方法や真空蒸着法、スパッタリング法、イオンプレーティング法などの乾式めっき法により、樹脂フィルム上に、クロム、酸化クロム、ニッケルなどの銅以外の金属からなる下地金属層を５０Å〜２００Å程度成膜した後、乾式めっき法又は湿式めっき法により銅を被膜する方法など、公知の方法を用いることができる。
[Flexible copper-clad laminate forming process 1]
The manufacturing method of the flexible copper wiring board which concerns on this invention includes the process of laminating | stacking copper on the one surface side of a resin film. The process is, for example, on the resin film by a dry plating method such as a method of vacuum bonding, sputtering, ion plating, or the like by using an adhesive between the resin film and the copper foil. A known method such as a method in which a base metal layer made of a metal other than copper, such as chromium, chromium oxide, or nickel, is formed to a thickness of about 50 to 200 mm and then coated with copper by a dry plating method or a wet plating method can be used. .
本発明の銅張積層板形成工程１に使用することができる樹脂フィルムは、一般的なフレキシブル回路基板の製造に使用されている樹脂フィルムであれば、特に限定されることなく使用することができる。例えば、ポリイミド系フィルム、ポリアミド系フィルム、ポリエチレンテレフタレート（ＰＥＴ）やポリエチレンテレナフタレート（ＰＥＮ）などのポリエステル系フィルム、ポリテトラフルオロエチレン系フィルム、ポリフェニレンサルファイド系フィルム、ポリエチレンナフタレート系フィルム、液晶ポリマー系フィルムの群から選ばれた１種の絶縁フィルムを使用することができる。特に、フレキシブル銅配線板に必要とされる、耐熱性、誘電体特性、電気絶縁性、耐薬品性の観点からポリイミドフィルムを用いることが好ましい。
If the resin film which can be used for the copper clad laminated
銅被膜層の膜厚は０．０１μｍ〜３５μｍの範囲とすることが好ましく、０．３μｍ〜１５μｍの範囲とすることがより好ましく、０．３μｍ〜１２μｍの範囲とすることがさらに好ましい。銅被膜層の膜厚が０．０１μｍ未満であると、配線部の電気導電性に問題が発生しやすくなり、また、強度上の問題が生じたりする可能性がある。一方、膜厚が３５μｍを超えて厚くなると、ヘヤークラックや反りなどを生じて密着性が低下する場合があるほか、サイドエッチングの影響が大きくなり、狭ピッチ化が難しくなる場合もある。 The film thickness of the copper coating layer is preferably in the range of 0.01 μm to 35 μm, more preferably in the range of 0.3 μm to 15 μm, and even more preferably in the range of 0.3 μm to 12 μm. If the film thickness of the copper coating layer is less than 0.01 μm, a problem may easily occur in the electrical conductivity of the wiring portion, and a problem in strength may occur. On the other hand, if the film thickness exceeds 35 μm, hair cracking or warping may occur and adhesion may be reduced, and the influence of side etching may be increased, making narrow pitching difficult.
［支持フィルム付フレキシブル銅張積層板形成工程２］
本発明に係るフレキシブル銅配線板の製造方法は、２軸延伸フィルムを支持フィルムとして積層する工程を含むことを特徴とする。当該工程は、樹脂フィルムと支持フィルムの間に粘着剤を介して両者を重ねて張り合わせる方法など従来公知の方法より行うことができる。
[Flexible copper clad laminate with support film forming step 2]
The method for producing a flexible copper wiring board according to the present invention includes a step of laminating a biaxially stretched film as a support film. The said process can be performed from conventionally well-known methods, such as the method of laminating | stacking both together via an adhesive between a resin film and a support film.
本発明に用いられる支持フィルムは、２軸延伸フィルムであり、それぞれ延伸方向における、１５０℃×３０分後における熱収縮率が、それぞれ０．１％以下であるフィルムを用いることを特徴とし、好ましくは０．０７％以下であり、さらに好ましくは０．０５％以下である。支持フィルムとして０．１％以下であるフィルムを用いることで、樹脂フィルムが高温条件下での支持フィルムの寸法変化による圧縮又は引張応力の影響を受けることが小さいため、その歩留りが高く、生産性の高いフレキシブル銅張積層板の製造方法を提供することができる。 The support film used in the present invention is a biaxially stretched film, and is characterized by using a film having a thermal shrinkage rate of 0.1% or less after 150 ° C. × 30 minutes in the stretching direction, respectively. Is 0.07% or less, more preferably 0.05% or less. By using a film that is 0.1% or less as the support film, the resin film is less susceptible to compression or tensile stress due to dimensional changes of the support film under high temperature conditions, so its yield is high and productivity is high. The manufacturing method of a flexible copper clad laminated board with high height can be provided.
支持フィルムは、それぞれ延伸方向における、１５０℃×３０分後における熱収縮率が、それぞれ０．１％以下であるフィルムであればどのような材料を用いることもできる。特に、耐熱性、耐溶剤性、汎用性の高さから、２軸延伸ポリエステル樹脂を用いることが好ましい。 Any material can be used for the supporting film as long as the thermal shrinkage after 30 minutes at 150 ° C. in the stretching direction is 0.1% or less. In particular, it is preferable to use a biaxially stretched polyester resin because of its high heat resistance, solvent resistance, and versatility.
支持フィルム付フレキシブル銅張積層板であって、前記２軸延伸フィルムのそれぞれ延伸方向における、１５０℃×３０分後における熱収縮率が、それぞれ０．１％以下である支持フィルム付フレキシブル銅張積層板は、その後にエッチングして前記銅配線を形成する銅配線形成工程及び加熱工程を加えたとしても、支持フィルム自体の収縮率が小さい。そのため、樹脂フィルムに対し支持フィルムに起因する圧縮又は引張応力が加わる影響が小さく、当該支持フィルム付フレキシブル銅張積層板を用いて製造されたフレキシブル銅張積層板は、その歩留りが高く、生産性の高いものにすることができる。したがって、当該支持フィルム付フレキシブル銅張積層板は極めて有用である。 A flexible copper clad laminate with a support film, wherein the biaxially stretched film has a heat shrinkage rate of 0.1% or less after 150 ° C. for 30 minutes in each stretching direction. Even if it adds the copper wiring formation process and heating process which etch a board after that and forms the said copper wiring, the shrinkage rate of support film itself is small. Therefore, the impact of compressive or tensile stress due to the support film on the resin film is small, and the flexible copper clad laminate produced using the flexible copper clad laminate with the support film has a high yield and productivity. Can be high. Therefore, the said flexible copper clad laminated board with a support film is very useful.
支持フィルムの厚さは、後のフレキシブル銅配線板製造の工程の取扱いの観点から自由に選択することができるが、好ましくは樹脂フィルム厚の０．４倍以上３．４倍以下であり、より好ましくは０．５倍以上１．５倍以下である。 The thickness of the support film can be freely selected from the viewpoint of the handling of the subsequent process of manufacturing the flexible copper wiring board, but is preferably 0.4 to 3.4 times the resin film thickness, and more Preferably they are 0.5 times or more and 1.5 times or less.
［銅配線形成工程３］
本発明に係るフレキシブル銅配線板の製造方法は、銅をエッチングして前記銅配線を形成する銅配線形成工程を含むことを特徴とする。エッチングして前記銅配線を形成する銅配線形成工程には、従来公知の方法で行うことができる。例えば、導電性金属層上にフォトレジスト層を形成し、このフォトレジスト層を露光、現像して所望のパターンを形成する。次に、こうして形成されたフォトレジストパターンをマスクとして、露出した導電性金属層をエッチングして、フォトレジストパターンと略相似形状の導電性金属層からなる配線パターンを形成する。次いでフォトレジスト層をアルカリ溶液等により剥離除去した後、配線パターン間に残存する銅をエッチングにより除去することにより行うことができる。
[Copper wiring formation process 3]
The manufacturing method of the flexible copper wiring board which concerns on this invention includes the copper wiring formation process which etches copper and forms the said copper wiring. The copper wiring forming step of forming the copper wiring by etching can be performed by a conventionally known method. For example, a photoresist layer is formed on the conductive metal layer, and this photoresist layer is exposed and developed to form a desired pattern. Next, using the photoresist pattern thus formed as a mask, the exposed conductive metal layer is etched to form a wiring pattern made of a conductive metal layer having a shape substantially similar to the photoresist pattern. Subsequently, after removing and removing the photoresist layer with an alkaline solution or the like, the copper remaining between the wiring patterns can be removed by etching.
［加熱工程４］
本発明に係るフレキシブル銅配線板の製造方法は、支持フィルム付フレキシブル銅張積層板を加熱する加熱工程を含む。例えば、フォトレジスト塗布後の乾燥のために加熱が行われ、前記エッチング処理後、レジストを剥離し、すずめっきを行った後にホイスカー抑制のため加熱するリフロー処理が行われる。また、ソルダーレジスト印刷後はレジストを完全に硬化させるために加熱が行われる。
[Heating step 4]
The manufacturing method of the flexible copper wiring board which concerns on this invention includes the heating process which heats the flexible copper clad laminated board with a support film. For example, heating is performed for drying after applying the photoresist, and after the etching process, the resist is peeled off, tin plating is performed, and then a reflow process for heating to suppress whisker is performed. Further, after the solder resist printing, heating is performed to completely cure the resist.
［剥離工程５］
本発明に係るフレキシブル銅配線板の製造方法は、支持フィルムを剥離する剥離工程を含む。支持フィルムは、フレキシブル銅配線板製造の工程における取扱いの容易さの観点から積層されたものであるため、フレキシブル銅張積層板として出荷する際には、最終的には、支持フィルムを剥離する剥離工程を含む。なお、当該剥離工程は、フレキシブル銅張積層板として出荷前に剥離させても良いし、出荷後、例えば電子機器への接着直前に剥離させることによって実現できる場合も含む。
[Peeling step 5]
The manufacturing method of the flexible copper wiring board which concerns on this invention includes the peeling process which peels a support film. Since the support film is laminated from the viewpoint of ease of handling in the process of manufacturing a flexible copper wiring board, when shipping as a flexible copper-clad laminate, the support film is finally peeled off. Process. In addition, the said peeling process may be made to peel before shipment as a flexible copper clad laminated board, and also includes the case where it can implement | achieve by making it peel immediately before adhesion, for example to an electronic device after shipment.
［フレキシブル銅配線板の寸法変化の予測値とする寸法変化予測工程］
本発明は、支持フィルムとして前記２軸延伸フィルムのそれぞれ延伸方向における、１５０℃×３０分後における熱収縮率が、それぞれ０．１％以下であるフィルムを用いることを特徴としている。例えば、支持フィルム付フレキシブル銅張積層板について、所定の条件下での寸法変化の実測値を測定し、この実測値を、前記フレキシブル銅配線板の寸法変化の予測値とする寸法変化予測工程を更に備えることもできる。
[Dimensional change prediction process for predicting dimensional change of flexible copper wiring board]
The present invention is characterized by using, as the support film, a film having a thermal shrinkage rate of 0.1% or less after 150 ° C. for 30 minutes in each stretching direction of the biaxially stretched film. For example, for a flexible copper-clad laminate with a support film, a dimensional change prediction step is performed in which an actual measurement value of a dimensional change under a predetermined condition is measured, and the actual measurement value is a predicted value of a dimensional change of the flexible copper wiring board. It can also be provided.
例えば、上記の方法で製造された支持フィルム付フレキシブル銅張積層板について、所定の条件下で寸法変化の実測値を測定し、その後のフレキシブル銅配線板の寸法変化の予測値とする寸法変化予測工程を更に加えることで、その予測値により銅配線の設計を行えば、品質のばらつきが向上し、歩留りも向上することができるため、さらに有用である。 For example, for a flexible copper-clad laminate with a support film manufactured by the above method, a dimensional change prediction is performed by measuring an actual measurement value of a dimensional change under a predetermined condition and then predicting a dimensional change of the flexible copper wiring board. If the copper wiring is designed based on the predicted value by further adding a process, it is more useful because quality variation can be improved and yield can be improved.
上記所定の条件下とは、例えば、エッチング処理工程や加熱工程などフレキシブル銅張積層板の寸法の変化に影響を与える恐れがある工程をいう。例えばエッチング処理工程によって、樹脂フィルムに積層された銅が溶かされることにより、銅の積層によって固定された樹脂フィルムが銅の溶解によって、その樹脂フィルムに掛かるテンションが下がることで、樹脂フィルムが伸びる傾向にある。また、加熱工程によって、樹脂フィルムに積層されている支持フィルムが収縮するため、支持フィルムの収縮によって樹脂フィルムが縮む傾向にある。そのため、これらの工程は寸法の変化に影響を与える恐れがある工程に含まれる。 The predetermined condition refers to a process that may affect changes in the dimensions of the flexible copper-clad laminate, such as an etching process or a heating process. For example, when the copper laminated on the resin film is melted by the etching process, the resin film fixed by the copper lamination tends to stretch due to the dissolution of copper and the tension applied to the resin film is lowered. It is in. Moreover, since the support film laminated | stacked on the resin film shrink | contracts by a heating process, it exists in the tendency for a resin film to shrink by shrinkage | contraction of a support film. Therefore, these processes are included in processes that may affect the change in dimensions.
以下、本発明のフレキシブル銅配線板の製造方法を実施例にもとづいてさらに詳細に説明する。なお、本発明はかかる実施例に限定されるものではない。 Hereinafter, the manufacturing method of the flexible copper wiring board of this invention is demonstrated still in detail based on an Example. In addition, this invention is not limited to this Example.
（実施例１）
＜支持フィルム付フレキシブル銅張積層板の製造＞
樹脂フィルムに通常ＣＴＥ（線膨張係数）グレードであるポリイミド樹脂（厚さ：３８μｍ 東レ・デュポン社製：カプトン１５０ＥＮ）の一方の面側に銅をスパッタリングと電気めっきを用いて８μｍ積層させ、ポリイミド樹脂面側にさらに支持フィルム（厚さ：５０μｍ 改善ＰＥＴフィルム 熱収縮率規格がそれぞれ０．１％以下）を粘着剤にて積層させ、支持フィルム付フレキシブル銅張積層板のサンプルを作成した。また、支持フィルムを積層させないフレキシブル銅張積層板のサンプルを作成した。なお、サンプル長はいずれもＭＤ方向１５６ｍｍ、ＴＤ方向が１６０ｍｍであった。
(Example 1)
<Manufacture of flexible copper clad laminate with support film>
A polyimide resin is usually laminated with 8 μm of copper on one side of a polyimide film (thickness: 38 μm, manufactured by Toray DuPont: Kapton 150EN), which is a CTE (linear expansion coefficient) grade, by using sputtering and electroplating. Further, a support film (thickness: 50 μm improved PET film, heat shrinkage ratio standard of 0.1% or less) was laminated on the surface side with an adhesive to prepare a sample of a flexible copper-clad laminate with a support film. Moreover, the sample of the flexible copper clad laminated board which does not laminate | stack a support film was created. The sample length was 156 mm in the MD direction and 160 mm in the TD direction.
＜環境変化試験＞
上記サンプルについてエッチング処理、加熱処理及び支持フィルム剥離処理を行った。なお、支持フィルムを接着させていないサンプルは支持フィルム剥離処理を行わなかった。
<Environmental change test>
The sample was subjected to etching treatment, heat treatment and support film peeling treatment. In addition, the sample which did not adhere | attach a support film did not perform a support film peeling process.
エッチング処理は塩化第二鉄溶液を４０℃に温めて２０分浸漬させる条件下で行い、その後、２３℃、５０ＲＨ％２４時間放置した。また、加熱試験は、１５０℃、３０分の条件下で行い、その後、２３℃、５０ＲＨ％２４時間放置した。 The etching treatment was performed under the condition that the ferric chloride solution was warmed to 40 ° C. and immersed for 20 minutes, and then allowed to stand at 23 ° C. and 50 RH% for 24 hours. The heating test was performed under conditions of 150 ° C. and 30 minutes, and then left at 23 ° C. and 50 RH% for 24 hours.
（実施例２）
樹脂フィルムに低ＣＴＥグレードであるポリイミド樹脂（厚さ：３８μｍ 東レ・デュポン社製：カプトン１５０ＥＮＡ）を用いたこと以外は実施例１と同様に試験を行った。
（実施例３）
樹脂フィルムに通常ＣＴＥグレードであるポリイミド樹脂（厚さ：３５μｍ 宇部興産ン社製：Ｕｐｉｌｅｘ３５ＳＧＡ）を用いたこと以外は実施例１と同様に試験を行った。
（実施例４）
樹脂フィルムに低ＣＴＥグレードであるポリイミド樹脂（厚さ：３５μｍ 宇部興産社製：Ｕｐｉｌｅｘ３５ＳＧＡＶ１）を用いたこと以外は実施例１と同様に試験を行った。
（比較例１）
支持フィルムとしてポリイミド樹脂面側に熱収縮率規格がそれぞれ０．３〜０．５％である現行のＰＥＴフィルムを用いたこと以外は実施例１と同様に試験を行った。
（比較例２）
支持フィルムとしてポリイミド樹脂面側に熱収縮率規格がそれぞれ０．３〜０．５％である現行のＰＥＴフィルムを用いたこと以外は実施例２と同様に試験を行った。
（比較例３）
支持フィルムとしてポリイミド樹脂面側に熱収縮率規格がそれぞれ０．３〜０．５％である現行のＰＥＴフィルムを用いたこと以外は実施例３と同様に試験を行った。
（比較例４）
支持フィルムとしてポリイミド樹脂面側に熱収縮率規格がそれぞれ０．３〜０．５％である現行のＰＥＴフィルムを用いたこと以外は実施例４と同様に試験を行った。
(Example 2)
The test was performed in the same manner as in Example 1 except that a low CTE grade polyimide resin (thickness: 38 μm, manufactured by Toray DuPont: Kapton 150ENA) was used for the resin film.
(Example 3)
The test was performed in the same manner as in Example 1 except that a polyimide resin (thickness: 35 μm, Ube Industries, Ltd .: Upilex35SGA), which is usually CTE grade, was used for the resin film.
Example 4
The test was conducted in the same manner as in Example 1 except that a low CTE grade polyimide resin (thickness: 35 μm, Ube Industries, Ltd .: Upilex35SGAV1) was used for the resin film.
(Comparative Example 1)
The test was performed in the same manner as in Example 1 except that the current PET film having a thermal shrinkage ratio standard of 0.3 to 0.5% was used on the polyimide resin surface side as the support film.
(Comparative Example 2)
The test was performed in the same manner as in Example 2 except that the current PET film having a heat shrinkage ratio standard of 0.3 to 0.5% was used on the polyimide resin surface side as the support film.
(Comparative Example 3)
The test was performed in the same manner as in Example 3 except that the current PET film having a heat shrinkage standard of 0.3 to 0.5% was used on the polyimide resin surface side as the support film.
(Comparative Example 4)
The test was performed in the same manner as in Example 4 except that the current PET film having a thermal shrinkage ratio standard of 0.3 to 0.5% was used on the polyimide resin surface side as the support film.
（寸法安定試験結果）
各環境変化における試験前の寸法からの寸法変化率（％）の差を表１に示した。具体的には、エッチング処理、加熱処理及び支持フィルム剥離処理を行った前後の各サンプルのＭＤ方向・ＴＤ方向の寸法の測定値から寸法変化率（％）をそれぞれ求め、実施例、比較例の各サンプルの寸法変化率（％）と支持フィルムを積層させていないサンプルとの寸法変化率（％）との差をそれぞれ求めた。なお、寸法測定には０．３μｍ以下の分解能で長さを測定することができる精密測長器を用いる必要があり、大日本スクリーン製造（株）製精密自動測長機ＤＲ−５０００を用いた。
(Dimension stability test results)
Table 1 shows the difference in dimensional change rate (%) from the dimension before the test in each environmental change. Specifically, the dimensional change rate (%) was obtained from the measured values of the MD and TD dimensions of each sample before and after the etching treatment, the heat treatment and the support film peeling treatment, and the examples and comparative examples were obtained. The difference between the dimensional change rate (%) of each sample and the dimensional change rate (%) of the sample on which the support film was not laminated was determined. In addition, it is necessary to use a precision length measuring device that can measure the length with a resolution of 0.3 μm or less for the dimension measurement, and a precision automatic length measuring machine DR-5000 manufactured by Dainippon Screen Mfg. Co., Ltd. was used. .
表１により、いずれの樹脂フィルムにおいても収縮率が０．１％以下の支持フィルムを積層させた実施例に係る支持フィルム付フレキシブル銅張積層板の寸法変化率（％）と、ＰＥＴフィルムを積層させていないフレキシブル銅張積層板の寸法変化率（％）の差はＴＤ方向、ＭＤ方向共に、比較例のそれよりも小さい値であることが分かる。 According to Table 1, the dimensional change rate (%) of the flexible copper-clad laminate with support film according to the example in which the support film having a shrinkage rate of 0.1% or less is laminated in any resin film, and the PET film are laminated. It can be seen that the difference in the dimensional change rate (%) of the flexible copper-clad laminate that has not been made is smaller than that of the comparative example in both the TD direction and the MD direction.
このことから、収縮率が０．１％以下の支持フィルムを用いた実施例に係る支持フィルム付フレキシブル銅張積層板は支持フィルムを張り付けることによる寸法変化の影響が小さいことが分かる。そのため、収縮率が０．１％以下の支持フィルムを用いたフレキシブル銅配線板の製造方法は、製造工程でのハンドリング強度を向上させた状態で製造することを可能にしつつ、且つ支持フィルムを接着されていないで製造するフレキシブル銅配線板同様にロットごとのばらつきは小さくなる。そのため、本発明に係るフレキシブル銅配線板の製造方法は、その歩留りが高く、極めて生産性の高い製造方法であることが分かる。 From this, it can be seen that the flexible copper-clad laminate with support film according to the example using the support film having a shrinkage rate of 0.1% or less is less affected by dimensional change caused by pasting the support film. Therefore, the method for manufacturing a flexible copper wiring board using a support film having a shrinkage rate of 0.1% or less enables manufacturing with improved handling strength in the manufacturing process, and bonds the support film. As with a flexible copper wiring board that is not manufactured, variation among lots is reduced. Therefore, it turns out that the manufacturing method of the flexible copper wiring board which concerns on this invention is a manufacturing method with the high yield and extremely high productivity.
一方、比較例の収縮率０．３〜０．５％の現行支持フィルムを積層させた支持フィルム付フレキシブル銅張積層板の寸法変化率（％）と、支持フィルムのない寸法変化率（％）の差は、実施例のものと比較して大きい値を示している。そのため、収縮率が大きい支持フィルムを用いた場合には、フレキシブル銅配線板の寸法が大きく変化することが分かる。 On the other hand, the dimensional change rate (%) of the flexible copper-clad laminate with support film in which the current support film having a shrinkage rate of 0.3 to 0.5% of the comparative example is laminated, and the dimensional change rate without the support film (%) The difference of is a large value compared with the thing of an Example. Therefore, when a support film with a large shrinkage rate is used, it can be seen that the dimensions of the flexible copper wiring board change greatly.
このことから、収縮率を管理していない支持フィルムを用いてフレキシブル銅配線板を製造した場合には、フレキシブル銅配線板の寸法変化率にばらつきが大きくなることが推認できる。そのため、収縮率が０．１％以下の支持フィルムを用いた製造方法と比較すると、収縮率を管理していない支持フィルムを用いた製造方法は工程前後の寸法変化率に相関が見られなくなると考えられるため、生産性の低い製造方法であることが分かる。 From this, when manufacturing a flexible copper wiring board using the support film which is not managing shrinkage | contraction rate, it can be guessed that dispersion | variation becomes large in the dimensional change rate of a flexible copper wiring board. Therefore, when compared with the production method using a support film having a shrinkage rate of 0.1% or less, the production method using a support film that does not manage the shrinkage rate is no longer correlated with the dimensional change rate before and after the process. Since it is considered, it turns out that it is a manufacturing method with low productivity.
１ 銅板
２ 樹脂フィルム
３ 支持フィルム
４ 粘着層
1
Claims (8)
前記樹脂フィルムの一方の面側に銅を積層するフレキシブル銅張積層板形成工程と、
前記樹脂フィルムの他方の面側に、粘着層を介して、２軸延伸フィルムを支持フィルムとして積層する支持フィルム付フレキシブル銅張積層板形成工程と、
前記銅をエッチングして前記銅配線を形成する銅配線形成工程と、
前記支持フィルム付フレキシブル銅張積層板を加熱する加熱工程と、
前記支持フィルムを剥離する剥離工程と、を備え、
前記支持フィルムとして、前記２軸延伸フィルムのそれぞれ延伸方向における、１５０℃×３０分後における熱収縮率が、それぞれ０．１％以下であるフィルムを用いる、フレキシブル銅配線板の製造方法。 A method for producing a flexible copper wiring board in which copper wiring is formed on one surface side of a resin film,
A flexible copper clad laminate forming step of laminating copper on one surface side of the resin film;
On the other surface side of the resin film, through a pressure-sensitive adhesive layer, a flexible copper-clad laminate with a support film for laminating a biaxially stretched film as a support film;
A copper wiring forming step of etching the copper to form the copper wiring;
A heating step of heating the flexible copper-clad laminate with the support film;
A peeling step of peeling the support film,
The manufacturing method of a flexible copper wiring board using the film whose thermal shrinkage rate after 150 degreeC x 30 minutes in each extending | stretching direction of the said biaxially stretched film is 0.1% or less as said support film, respectively.
この実測値を、前記フレキシブル銅配線板の寸法変化の予測値とする寸法変化予測工程を更に備える請求項１から４のいずれかに記載のフレキシブル銅配線板の製造方法。 For the flexible copper-clad laminate with support film, measure the measured value of the dimensional change under a predetermined condition,
The manufacturing method of the flexible copper wiring board in any one of Claim 1 to 4 further equipped with the dimension change prediction process which makes this measured value the predicted value of the dimension change of the said flexible copper wiring board.
前記フレキシブル銅張積層板の前記樹脂フィルムの他方の面側に、粘着層を介して、２軸延伸フィルムが支持フィルムとして積層されている、支持フィルム付フレキシブル銅張積層板であって、
前記２軸延伸フィルムのそれぞれ延伸方向における、１５０℃×３０分後における熱収縮率が、それぞれ０．１％以下である支持フィルム付フレキシブル銅張積層板。 A flexible copper-clad laminate in which copper is laminated on one side of the resin film;
A biaxially stretched film is laminated as a support film on the other surface side of the resin film of the flexible copper clad laminate via an adhesive layer, and is a flexible copper clad laminate with a support film,
The flexible copper clad laminated board with a support film whose heat shrinkage rate after 150 degreeC x 30 minutes in each extending direction of the said biaxially stretched film is 0.1% or less, respectively.
The flexible wiring board in which the flexible copper clad laminated board with a support film of Claim 7 is used.
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| JP2014175364A JP6323261B2 (en) | 2014-08-29 | 2014-08-29 | Manufacturing method of flexible copper wiring board and flexible copper-clad laminate with support film used therefor |
| CN201580043280.7A CN106576428B (en) | 2014-08-29 | 2015-08-11 | The manufacturing method of flexible copper wiring plate and its flexible copper-clad laminate used with support membrane |
| PCT/JP2015/072753 WO2016031559A1 (en) | 2014-08-29 | 2015-08-11 | Method for manufacturing flexible copper wiring board, and flexible copper-clad layered board with support film used in said copper wiring board |
| KR1020167035645A KR102378236B1 (en) | 2014-08-29 | 2015-08-11 | Method for manufacturing flexible copper wiring board, and flexible copper-clad layered board with support film used in said copper wiring board |
| TW104126325A TWI584707B (en) | 2014-08-29 | 2015-08-13 | A method for manufacturing a flexible copper wiring board, and a method for manufacturing a flexible copper clad sheet |
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