JP2016046338A - Flexible printed circuit board - Google Patents

Flexible printed circuit board Download PDF

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JP2016046338A
JP2016046338A JP2014168215A JP2014168215A JP2016046338A JP 2016046338 A JP2016046338 A JP 2016046338A JP 2014168215 A JP2014168215 A JP 2014168215A JP 2014168215 A JP2014168215 A JP 2014168215A JP 2016046338 A JP2016046338 A JP 2016046338A
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terminal
film
circuit board
flexible printed
printed circuit
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池田　貴
Takashi Ikeda
貴 池田
令 江川
Rei Egawa
令 江川
桂一郎 遠藤
Keiichiro Endo
桂一郎 遠藤
晃廣 小林
Akihiro Kobayashi
晃廣 小林
利弘 小林
Toshihiro Kobayashi
利弘 小林
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Nippon Seiki Co Ltd
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Nippon Seiki Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a flexible printed circuit board which responds flexibly to change in the relation of connection.SOLUTION: A flexible printed circuit board F includes a film-like insulating substrate 1, a first terminal 3 formed at one end of the film-like insulating substrate 1, a second terminal 4 formed at the other end of the film-like insulating substrate 1, a conductor pattern 2 formed on the film-like insulating substrate 1, and connecting the first terminal 3 and second terminal 4 electrically, and a film-like insulation coating 6 covering a predetermined part of the conductor pattern 2. The first terminal 3 and second terminal 4 are formed on both sides of the film-like insulating substrate 1, terminals on the front and back are electrically interconnected by the conductor pattern 2 via a through hole 5 boring the film-like insulating substrate 1, and the film-like insulation coating 6 covers any one, not used, of the first terminal 3 and second terminal 4 on the front and back.SELECTED DRAWING: Figure 2

Description

本発明は、フレキシブルプリント基板に関する。   The present invention relates to a flexible printed circuit board.

従来、例えば特許文献１に開示されるように、屈曲性に優れ配線の取り回しが良いフレキシブル回路基板が開示されている。   Conventionally, as disclosed in Patent Document 1, for example, a flexible circuit board having excellent flexibility and good wiring is disclosed.

特開２００５−３９０５２号公報JP-A-2005-39052

しかしながら、フレキシブルプリント基板によって接続される互いの回路基板の位置関係が設計変更されて変わってしまうと、予め設計したフレキシブルプリント基板では端子の接点方向が合わずフレキシブルプリント基板の取り回しができなくなってしまう場合があった。この場合、フレキシブルプリント基板を再設計する必要があり、設計者の作業負担が増大してしまう。   However, if the positional relationship between the circuit boards connected by the flexible printed circuit board changes due to a design change, the contact direction of the terminals does not match with the pre-designed flexible printed circuit board, and the flexible printed circuit board cannot be handled. There was a case. In this case, it is necessary to redesign the flexible printed circuit board, which increases the work load on the designer.

本発明は、上述した課題を鑑みてなされたものであり、接続関係の変更に柔軟に対応可能なフレキシブルプリント基板を提供することを目的とする。   The present invention has been made in view of the above-described problems, and an object thereof is to provide a flexible printed circuit board that can flexibly cope with a change in connection relation.

本発明に係るフレキシブルプリント基板は、
フィルム状絶縁基材と、
前記フィルム状絶縁基材の一端に形成される第１の端子と、前記フィルム状絶縁基材の他端に形成される第２の端子と、
前記フィルム状絶縁基材に形成され、前記第１の端子と前記第２の端子を電気的に接続する導体パターンと、
前記導体パターンの所定箇所を覆うフィルム状絶縁被覆と、
を備えたフレキシブルプリント基板であって、
前記第１の端子および前記第２の端子は、前記フィルム状絶縁基材の両面に形成されると共に、前記フィルム状絶縁基材を穿つスルーホールを介して表裏の端子同士が前記導体パターンで互いに電気的に接続され、
前記フィルム状絶縁被覆は、前記第１の端子および前記第２の端子の表裏の端子のいずれか一方を覆う。 The flexible printed circuit board according to the present invention is
A film-like insulating substrate;
A first terminal formed at one end of the film-like insulating base; a second terminal formed at the other end of the film-like insulating base;
A conductor pattern formed on the film-like insulating base material and electrically connecting the first terminal and the second terminal;
A film-like insulating coating covering a predetermined portion of the conductor pattern;
A flexible printed circuit board comprising:
The first terminal and the second terminal are formed on both surfaces of the film-like insulating base material, and the terminals on the front and back sides are connected to each other in the conductor pattern through a through hole that penetrates the film-like insulating base material. Electrically connected,
The film-like insulating coating covers either one of the first terminal and the front and back terminals of the second terminal.

本発明によれば、接続関係の変更に柔軟に対応可能なフレキシブルプリント基板を提供できる。   ADVANTAGE OF THE INVENTION According to this invention, the flexible printed circuit board which can respond flexibly to the change of a connection relationship can be provided.

本発明の第１実施形態に係るフレキシブルプリント基板の上面図、下面図、および、端部拡大図である。（ａ）が上面図であり、（ｂ）が下面図であり、（ｃ）が下面図における一端部拡大図であり、（ｄ）が下面図における他端部拡大図である。It is the top view, bottom view, and end part enlarged view of the flexible printed circuit board concerning 1st Embodiment of this invention. (A) is a top view, (b) is a bottom view, (c) is an enlarged view of one end of the bottom view, and (d) is an enlarged view of the other end of the bottom view. 本発明の第１実施形態に係るフレキシブルプリント基板のＡ−Ａにおける断面図である。It is sectional drawing in AA of the flexible printed circuit board concerning 1st Embodiment of this invention. 本発明の第１実施形態に係るフレキシブルプリント基板の回路基板への接続図である。It is a connection figure to the circuit board of the flexible printed circuit board concerning a 1st embodiment of the present invention. 本発明の第２実施形態に係るフレキシブルプリント基板の回路基板への接続図である。It is a connection figure to the circuit board of the flexible printed circuit board concerning a 2nd embodiment of the present invention.

（第１実施形態）
以下、添付図面に基づいて、本発明の第１実施形態を説明する。 (First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the accompanying drawings.

本発明に係るフレキシブルプリント基板Ｆは、フィルム状絶縁基材１に、導体パターン２と端子３，４を形成し、導体パターン２の所定箇所をフィルム状絶縁被覆６で覆って形成され、フレキシブルプリント基板Ｆの一端に形成された第１の端子３と、他端に形成された第２の端子４とを電気的に接続するものである。   A flexible printed circuit board F according to the present invention is formed by forming a conductor pattern 2 and terminals 3 and 4 on a film-like insulating base material 1 and covering a predetermined portion of the conductor pattern 2 with a film-like insulating coating 6. The first terminal 3 formed at one end of the substrate F is electrically connected to the second terminal 4 formed at the other end.

フィルム状絶縁基材１は、例えばポリミイド等の電気絶縁性に優れた絶縁材料をフィルム状にしたものからなる。   The film-like insulating base material 1 is made of, for example, a film-like insulating material having excellent electrical insulation properties such as polyimide.

フィルム状絶縁基材１の一端部には、表端子３ａと裏端子３ｂからなる第１の端子３が両面に形成されており、他端部には、表端子４ａと裏端子４ｂからなる第２の端子４が両面に形成されている。これら端子３，４は、例えば銅箔等に金メッキを施した導電性金属で構成する。   A first terminal 3 composed of a front terminal 3a and a back terminal 3b is formed on one surface of one end of the film-like insulating substrate 1, and a second terminal composed of a front terminal 4a and a back terminal 4b is formed on the other end. Two terminals 4 are formed on both sides. These terminals 3 and 4 are made of, for example, a conductive metal obtained by plating a copper foil or the like with gold.

第１の端子３と第２の端子４とは、例えば銅箔等の導電性金属からなる導体パターン２によって電気的に接続される。導体パターン２は、フィルム状絶縁基材１の両面に形成されると共に、フィルム状絶縁基材１を穿ち表面がメッキ処理されたスルーホール５を介して表面と裏面に形成された導体パターン２同士を電気的に接続している。   The 1st terminal 3 and the 2nd terminal 4 are electrically connected by the conductor pattern 2 which consists of electroconductive metals, such as copper foil, for example. The conductor pattern 2 is formed on both surfaces of the film-like insulating base material 1, and the conductor patterns 2 formed on the front and back sides through the through-holes 5 that have been perforated through the film-like insulating base material 1 and are plated. Are electrically connected.

これら導体パターン２、端子３，４，スルーホール５が形成されたフィルム状絶縁基材１を、例えばポリミイド等の電気絶縁性に優れた絶縁材料をフィルム状にした表絶縁被覆６ａと裏絶縁被覆６ｂからなるフィルム状絶縁被覆６で覆う。第１実施形態におけるフレキシブルプリント基板Ｆにおいては、第１の端子３の表端子３ａと第２の端子４の表端子４ａは表絶縁被覆６ａによって覆われ、裏端子３ｂ，４ｂは裏絶縁被覆６ｂは覆われず露出する。つまり、第１の端子３の表端子３ａと第２の端子４の表端子４ａはフィルム状絶縁被覆６で覆われるため、接続端子として使用されない。   The film-like insulating base material 1 in which the conductor pattern 2, terminals 3, 4 and through-holes 5 are formed is made of a surface insulating coating 6a and a back insulating coating in which an insulating material excellent in electrical insulation such as polyimide is formed into a film. It is covered with a film-like insulating coating 6 made of 6b. In the flexible printed circuit board F in the first embodiment, the front terminal 3a of the first terminal 3 and the front terminal 4a of the second terminal 4 are covered with the front insulating coating 6a, and the back terminals 3b and 4b are covered with the back insulating coating 6b. Exposed without being covered. That is, since the front terminal 3a of the first terminal 3 and the front terminal 4a of the second terminal 4 are covered with the film-like insulating coating 6, they are not used as connection terminals.

当該フレキシブルプリント基板Ｆは、図３に示すようにコネクタＣ３を有する回路基板Ｃ同士を互いに電気的に接続するために用いられる。
回路基板Ｃは、硬質基材Ｃ１上に電気回路Ｃ２が実装されると共に、電気回路Ｃ２と電気的に接続している接点Ｃ３０を有するコネクタＣ３が実装されている。
回路基板Ｃ同士は、フレキシブルプリント基板Ｆの端子３，４をそれぞれコネクタＣ３に挿通して接点Ｃ３０に押圧して回路基板Ｃの電気回路Ｃ２同士を電気的に接続する。つまり、第１実施形態におけるフレキシブルプリント基板Ｆにおいては、第１の端子３の裏端子３ｂと第２の端子４の裏端子４ｂがそれぞれ回路基板Ｃの接点Ｃ３０に押圧されて回路基板Ｃの電気回路Ｃ２同士を電気的に接続する。 The flexible printed circuit board F is used for electrically connecting circuit boards C having connectors C3 to each other as shown in FIG.
In the circuit board C, the electric circuit C2 is mounted on the hard base material C1, and the connector C3 having the contact C30 electrically connected to the electric circuit C2 is mounted.
The circuit boards C are electrically connected to the electric circuits C2 of the circuit boards C by inserting the terminals 3 and 4 of the flexible printed circuit board F into the connectors C3 and pressing the terminals C4 to the contacts C30, respectively. That is, in the flexible printed circuit board F in the first embodiment, the back terminal 3b of the first terminal 3 and the back terminal 4b of the second terminal 4 are pressed against the contact C30 of the circuit board C, respectively. The circuits C2 are electrically connected to each other.

（第２実施形態）
次に、設計変更等によって図３に示した回路基板Ｃの一方の表裏の位置関係を逆にする場合において、第１実施形態におけるフレキシブルプリント基板Ｆの導体パターン２を再設計することなく、回路基板Ｃ同士を電気的に接続する第２実施形態を図４に基づいて説明する。 (Second Embodiment)
Next, when the positional relationship between one front and back of the circuit board C shown in FIG. 3 is reversed due to a design change or the like, the circuit without redesigning the conductor pattern 2 of the flexible printed circuit board F in the first embodiment. A second embodiment in which the substrates C are electrically connected will be described with reference to FIG.

図３に示した回路基板Ｃの一方の表裏の位置関係を逆にする場合、第１実施形態におけるフレキシブルプリント基板Ｆのフィルム状絶縁被覆６で覆う箇所を変更するだけで良い。つまり、第１の端子３の表端子３ａを露出し第２の端子４の４ａを覆うように表絶縁被覆６ａを形成し、第１の端子４の裏端子３ｂを覆い第２の端子４の裏端子４ｂを露出するように裏絶縁被覆６ｂを形成する。
これにより、第１の端子３の表端子３ａと第２の端子４の裏端子４ｂがそれぞれ回路基板Ｃの接点Ｃ３０に押圧されることによって、回路基板Ｃの電気回路Ｃ２同士を電気的に接続することができる。 In order to reverse the positional relationship of one front and back of the circuit board C shown in FIG. 3, it is only necessary to change the location covered with the film-like insulating coating 6 of the flexible printed board F in the first embodiment. That is, the front terminal 3a of the first terminal 3 is exposed and the front insulating coating 6a is formed so as to cover the second terminal 4a, the back terminal 3b of the first terminal 4 is covered, and the second terminal 4 of the second terminal 4 is covered. A back insulating coating 6b is formed so as to expose the back terminal 4b.
As a result, the front terminal 3a of the first terminal 3 and the back terminal 4b of the second terminal 4 are each pressed against the contact C30 of the circuit board C, thereby electrically connecting the electric circuits C2 of the circuit board C to each other. can do.

第１実施形態と第２実施形態のように構成することで、設計変更等によって、互いに裏面側に露出している第１の端子３と第２の端子４のどちらか一方を表面側で接続するように変更を余儀なくされた場合においても、フレキシブルプリント基板Ｆの導体パターン２を再設計することなく、フィルム状絶縁被覆６で覆う箇所を適宜変更するだけで対応が可能となる。
これにより、設計者の作業負荷を軽減する効果に加え、再設計に係る費用も低減することができる。 By configuring as in the first embodiment and the second embodiment, one of the first terminal 3 and the second terminal 4 exposed on the back surface side is connected on the front surface side by design change or the like. Even when the change is unavoidable, it is possible to cope with the problem by simply changing the portion covered with the film-like insulating coating 6 without redesigning the conductor pattern 2 of the flexible printed circuit board F.
Thereby, in addition to the effect of reducing the designer's workload, the cost for redesign can also be reduced.

また、表面と裏面に形成された導体パターン２同士を電気的に接続するスルーホール５は、第１の端子３と第２の端子４とを電気的に接続するための導体パターン２を共通化するために、端子３，４に近い箇所に設けることが好ましい。   Also, the through hole 5 for electrically connecting the conductor patterns 2 formed on the front surface and the back surface has a common conductor pattern 2 for electrically connecting the first terminal 3 and the second terminal 4. Therefore, it is preferable to provide it at a location close to the terminals 3 and 4.

また、スルーホール５同士は、互いに近接して配置するために、フィルム状絶縁基材１の短手方向に互い違いに配置することが好ましい。   Moreover, in order to arrange | position through-holes 5 mutually close, it is preferable to arrange | position alternately in the transversal direction of the film-form insulating base material 1. FIG.

以上の説明では、本発明の理解を容易にするために、重要でない公知の技術的事項の説明を適宜省略した。   In the above description, in order to facilitate the understanding of the present invention, the description of known unimportant technical matters is appropriately omitted.

Ｆ ：フレキシブルプリント基板
１ ：フィルム状絶縁基材
２ ：導体パターン
３ ：第１の端子
３ａ ：表端子
３ｂ ：裏端子
４ ：第２の端子
４ａ ：表端子
４ｂ ：裏端子
５ ：スルーホール
６ ：フィルム状絶縁被覆
６ａ ：表絶縁被覆
６ｂ ：裏絶縁被覆 F: Flexible printed circuit board 1: Film-like insulating base material 2: Conductive pattern 3: First terminal 3a: Front terminal 3b: Back terminal 4: Second terminal 4a: Front terminal 4b: Back terminal 5: Through hole 6: Film-like insulation coating 6a: Front insulation coating 6b: Back insulation coating

Claims (1)

フィルム状絶縁基材と、
前記フィルム状絶縁基材の一端に形成される第１の端子と、前記フィルム状絶縁基材の他端に形成される第２の端子と、
前記フィルム状絶縁基材に形成され、前記第１の端子と前記第２の端子を電気的に接続する導体パターンと、
前記導体パターンの所定箇所を覆うフィルム状絶縁被覆と、
を備えたフレキシブルプリント基板であって、
前記第１の端子および前記第２の端子は、前記フィルム状絶縁基材の両面に形成されると共に、前記フィルム状絶縁基材を穿つスルーホールを介して表裏の端子同士が前記導体パターンで互いに電気的に接続され、
前記フィルム状絶縁被覆は、前記第１の端子および前記第２の端子の表裏の端子のいずれか一方を覆う
ことを特徴とするフレキシブルプリント基板。 A film-like insulating substrate;
A first terminal formed at one end of the film-like insulating base; a second terminal formed at the other end of the film-like insulating base;
A conductor pattern formed on the film-like insulating base material and electrically connecting the first terminal and the second terminal;
A film-like insulating coating covering a predetermined portion of the conductor pattern;
A flexible printed circuit board comprising:
The first terminal and the second terminal are formed on both surfaces of the film-like insulating base material, and the terminals on the front and back sides are connected to each other in the conductor pattern through a through hole that penetrates the film-like insulating base material. Electrically connected,
The film-like insulating coating covers either one of the first terminal and the front and back terminals of the second terminal. A flexible printed board.
JP2014168215A 2014-08-21 2014-08-21 Flexible printed circuit board Pending JP2016046338A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018093101A (en) * 2016-12-06 2018-06-14 三菱電機株式会社 Flexible print circuit board and image display unit
JP2018157128A (en) * 2017-03-21 2018-10-04 株式会社東海理化電機製作所 Circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018093101A (en) * 2016-12-06 2018-06-14 三菱電機株式会社 Flexible print circuit board and image display unit
JP2018157128A (en) * 2017-03-21 2018-10-04 株式会社東海理化電機製作所 Circuit board

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