JP2015507347A - 電気コネクターのための接触子アッセンブリ - Google Patents
電気コネクターのための接触子アッセンブリ Download PDFInfo
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- JP2015507347A JP2015507347A JP2014557670A JP2014557670A JP2015507347A JP 2015507347 A JP2015507347 A JP 2015507347A JP 2014557670 A JP2014557670 A JP 2014557670A JP 2014557670 A JP2014557670 A JP 2014557670A JP 2015507347 A JP2015507347 A JP 2015507347A
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- 239000002131 composite material Substances 0.000 claims abstract description 157
- 239000000463 material Substances 0.000 claims abstract description 138
- 239000000758 substrate Substances 0.000 claims abstract description 99
- 239000003989 dielectric material Substances 0.000 claims abstract description 44
- 238000005325 percolation Methods 0.000 claims abstract description 27
- 239000011231 conductive filler Substances 0.000 claims abstract description 10
- 239000000945 filler Substances 0.000 claims description 95
- 239000002245 particle Substances 0.000 claims description 19
- 230000008878 coupling Effects 0.000 claims description 11
- 238000010168 coupling process Methods 0.000 claims description 11
- 238000005859 coupling reaction Methods 0.000 claims description 11
- 239000004593 Epoxy Substances 0.000 claims description 10
- 239000006229 carbon black Substances 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 239000000178 monomer Substances 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 2
- 239000012530 fluid Substances 0.000 description 55
- 238000000034 method Methods 0.000 description 21
- 239000004020 conductor Substances 0.000 description 19
- 238000004070 electrodeposition Methods 0.000 description 11
- 239000007788 liquid Substances 0.000 description 9
- 239000003990 capacitor Substances 0.000 description 8
- 239000010949 copper Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910001092 metal group alloy Inorganic materials 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 239000000443 aerosol Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000002659 electrodeposit Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000012713 reactive precursor Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000011853 conductive carbon based material Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011364 vaporized material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
- H01R13/035—Plated dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
- H01R13/7197—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters with filters integral with or fitted onto contacts, e.g. tubular filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6464—Means for preventing cross-talk by adding capacitive elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6598—Shield material
- H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Laminated Bodies (AREA)
Abstract
Description
図1に示されるコネクター100のチクレット(chicklet)における導電性の信号トレースなど、バックプレーン・コネクターの導電性部品として示されている。別法にて、コネクター900は別の種類のコネクターであってもよい。また、接触子902,904は、図9の挿入図に示すようなものであってよい。
Claims (10)
- 電気コネクター(100)のための接触子アッセンブリ(102)であって、
電気コネクター(100)の導電パスを形成すべく構成された導電性基板(202);
導電性基板(202)に係り合うコンポジット層(204);および
コンポジット層(204)に係り合う導電性層(206)
を有して成り、
コンポジット層(204)は、導電性フィラー材(508)を有した誘電体材料(514)を含んでおり、導電性フィラー材(508)がコンポジット層(204)のパーコレーション閾値濃度(708)よりも低い濃度で誘電体材料(514)の内部にて分散しており、また
導電性基板(202)、コンポジット層(204)および導電性層(206)は容量要素を形成し、その容量要素を通るように「導電性層(206)に結合する結合接触子(400)と導電性基板(202)との間」に信号伝播路(402)が通る、接触子アッセンブリ(102)。 - パーコレーション閾値濃度(708)は、コンポジット層(204)に含まれるフィラー材(508)の濃度を表しており、フィラー材(508)の濃度がパーコレーション閾値濃度よりも高くなるように第1割合量増加すると、コンポジット層(204)の電気伝導性が、より大きい第2割合量増加することになる、請求項1に記載の接触子アッセンブリ(102)。
- パーコレーション閾値濃度(708)は、コンポジット層(204)に含まれるフィラー材(508)の濃度のうち指定された濃度を表しており、
その指定された濃度は、コンポジット層(204)の電気伝導性とフィラー材(508)の種々の濃度との関係の第1微分値に関連しており、その第1微分値が、前記関係を示す曲線における1つまたはそれよりも多い他の微分値よりも大きい、請求項1に記載の接触子アッセンブリ(102)。 - 第1微分値は、コンポジット層(204)の電気伝導性とフィラー材(508)の濃度との関係の最大微分値である、請求項3に記載の接触子アッセンブリ(102)。
- フィラー材(508)の濃度が、パーコレーション閾値濃度(708)から10%ずれた範囲内にある、請求項1に記載の接触子アッセンブリ(102)。
- 誘電体材料(514)は、エポキシ、アクリル、他のモノマー、溶融熱可塑性ポリマー、または、部分的に架橋され得るポリマーの少なくとも1つを含んでいる、請求項1に記載の接触子アッセンブリ(102)。
- フィラー材(508)は、金、銀、白金、カーボン・ブラック、または、他の導電性の粒子の少なくとも1つを含んでいる、請求項1に記載の接触子アッセンブリ(102)。
- 誘電体材料(514)がエポキシであり、フィラー材(508)がカーボン・ブラックを含み、フィラー材(508)の濃度がコンポジット層(204)の6%〜19%となっている、請求項1に記載の接触子アッセンブリ(102)。
- 容量要素は、導電性基板(202)と結合接触子(400)との間の信号伝播路(402)に沿ってやり取りされるデータ信号を濾波する、請求項1に記載の接触子アッセンブリ(102)。
- 容量要素は、導電性基板(202)と結合接触子(400)との間の信号伝播路(402)に沿ってやり取りされるデータ信号の直流(DC)成分をブロックする、請求項1に記載の接触子アッセンブリ(102)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/399,528 | 2012-02-17 | ||
US13/399,528 US8790144B2 (en) | 2010-06-07 | 2012-02-17 | Contact assembly for an electrical connector and method of manufacturing the contact assembly |
PCT/US2013/023760 WO2013122740A1 (en) | 2012-02-17 | 2013-01-30 | Contact assembly for an electrical connector |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015507347A true JP2015507347A (ja) | 2015-03-05 |
JP6339942B2 JP6339942B2 (ja) | 2018-06-06 |
Family
ID=47682069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014557670A Active JP6339942B2 (ja) | 2012-02-17 | 2013-01-30 | 電気コネクターのための接触子アッセンブリ |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2815463A1 (ja) |
JP (1) | JP6339942B2 (ja) |
CN (1) | CN104247159B (ja) |
WO (1) | WO2013122740A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6575249B2 (ja) * | 2014-09-19 | 2019-09-18 | 東洋紡株式会社 | 人工透析液の製造方法および人工透析液製造システム |
EP3772784B1 (de) | 2019-08-08 | 2022-12-21 | Nexans | Zweireihiger stecker für ein flachband- oder folienkabel, verfahren zur herstellung desselben und vorrichtung zur stromübertragung |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0888054A (ja) * | 1994-09-20 | 1996-04-02 | Murata Mfg Co Ltd | コネクタ |
JP2002270032A (ja) * | 2001-03-07 | 2002-09-20 | Denki Kagaku Kogyo Kk | 導電性粉末、その製造方法及び用途 |
JP2005500648A (ja) * | 2001-06-08 | 2005-01-06 | エイコス・インコーポレーテッド | ナノ複合材料誘電体 |
JP2008069313A (ja) * | 2006-09-15 | 2008-03-27 | Tokai Rubber Ind Ltd | センサー用架橋エラストマー体およびその製法 |
EP2261400A1 (en) * | 2009-06-09 | 2010-12-15 | Tyco Electronics Corporation | Composite assembly for an electrical connector and method of manufacturing the composite assembly |
US20110230096A1 (en) * | 2010-02-24 | 2011-09-22 | Amphenol Corporation | High bandwidth connector |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7911029B2 (en) * | 2009-07-11 | 2011-03-22 | Ji Cui | Multilayer electronic devices for imbedded capacitor |
-
2013
- 2013-01-30 CN CN201380020587.6A patent/CN104247159B/zh active Active
- 2013-01-30 JP JP2014557670A patent/JP6339942B2/ja active Active
- 2013-01-30 EP EP13703497.1A patent/EP2815463A1/en not_active Withdrawn
- 2013-01-30 WO PCT/US2013/023760 patent/WO2013122740A1/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0888054A (ja) * | 1994-09-20 | 1996-04-02 | Murata Mfg Co Ltd | コネクタ |
JP2002270032A (ja) * | 2001-03-07 | 2002-09-20 | Denki Kagaku Kogyo Kk | 導電性粉末、その製造方法及び用途 |
JP2005500648A (ja) * | 2001-06-08 | 2005-01-06 | エイコス・インコーポレーテッド | ナノ複合材料誘電体 |
JP2008069313A (ja) * | 2006-09-15 | 2008-03-27 | Tokai Rubber Ind Ltd | センサー用架橋エラストマー体およびその製法 |
EP2261400A1 (en) * | 2009-06-09 | 2010-12-15 | Tyco Electronics Corporation | Composite assembly for an electrical connector and method of manufacturing the composite assembly |
US20110230096A1 (en) * | 2010-02-24 | 2011-09-22 | Amphenol Corporation | High bandwidth connector |
Non-Patent Citations (1)
Title |
---|
JPN6016012620; 中村修平 外2名: 'パーコレーション閾値以下のカーボンブラック・ポリエチレン複合体の誘電特性の解釈' 電気学会論文誌A 119巻11号, 1999, 1355〜61頁, 一般社団法人電気学会 * |
Also Published As
Publication number | Publication date |
---|---|
CN104247159A (zh) | 2014-12-24 |
CN104247159B (zh) | 2018-02-09 |
EP2815463A1 (en) | 2014-12-24 |
WO2013122740A1 (en) | 2013-08-22 |
JP6339942B2 (ja) | 2018-06-06 |
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