JP2015211043A - 基板処理方法 - Google Patents

基板処理方法 Download PDF

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Publication number
JP2015211043A
JP2015211043A JP2014089383A JP2014089383A JP2015211043A JP 2015211043 A JP2015211043 A JP 2015211043A JP 2014089383 A JP2014089383 A JP 2014089383A JP 2014089383 A JP2014089383 A JP 2014089383A JP 2015211043 A JP2015211043 A JP 2015211043A
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JP
Japan
Prior art keywords
substrate
holder
substrates
processing
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014089383A
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English (en)
Japanese (ja)
Other versions
JP2015211043A5 (zh
Inventor
竜也 小泉
Tatsuya Koizumi
竜也 小泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2014089383A priority Critical patent/JP2015211043A/ja
Priority to US14/691,465 priority patent/US20150308010A1/en
Priority to TW104112653A priority patent/TW201604330A/zh
Publication of JP2015211043A publication Critical patent/JP2015211043A/ja
Publication of JP2015211043A5 publication Critical patent/JP2015211043A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Automation & Control Theory (AREA)
JP2014089383A 2014-04-23 2014-04-23 基板処理方法 Pending JP2015211043A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014089383A JP2015211043A (ja) 2014-04-23 2014-04-23 基板処理方法
US14/691,465 US20150308010A1 (en) 2014-04-23 2015-04-20 Substrate processing method
TW104112653A TW201604330A (zh) 2014-04-23 2015-04-21 基板處理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014089383A JP2015211043A (ja) 2014-04-23 2014-04-23 基板処理方法

Publications (2)

Publication Number Publication Date
JP2015211043A true JP2015211043A (ja) 2015-11-24
JP2015211043A5 JP2015211043A5 (zh) 2016-12-22

Family

ID=54334204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014089383A Pending JP2015211043A (ja) 2014-04-23 2014-04-23 基板処理方法

Country Status (3)

Country Link
US (1) US20150308010A1 (zh)
JP (1) JP2015211043A (zh)
TW (1) TW201604330A (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018047908A1 (ja) * 2016-09-08 2018-03-15 株式会社荏原製作所 基板ホルダ、めっき装置、基板ホルダの製造方法、及び基板を保持する方法
JP6951269B2 (ja) * 2018-01-29 2021-10-20 株式会社荏原製作所 基板処理装置、基板処理装置の制御装置、基板処理装置の制御方法、プログラムを格納した記憶媒体

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09266166A (ja) * 1996-03-28 1997-10-07 Nikon Corp 露光装置
JPH10284565A (ja) * 1997-04-11 1998-10-23 Hitachi Ltd 半導体評価装置
JPH1145926A (ja) * 1997-07-25 1999-02-16 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH11227931A (ja) * 1998-02-10 1999-08-24 Yaskawa Electric Corp 搬送順序決定方法および装置
JP2000277401A (ja) * 1999-03-25 2000-10-06 Dainippon Screen Mfg Co Ltd 基板処理装置、基板処理装置のシミュレート装置、及び基板処理装置のシミュレートプログラムを記録したコンピュータ読み取り可能な記録媒体
JP2002511193A (ja) * 1997-06-09 2002-04-09 アプライド マテリアルズ インコーポレイテッド マルチチャンバ式半導体ウェーハ処理ツール内でのウェーハ処理用スケジュールを自動的に生成するための方法および装置
JP2005240108A (ja) * 2004-02-26 2005-09-08 Ebara Corp めっき装置及びめっき方法
JP2007329233A (ja) * 2006-06-07 2007-12-20 Nikon Corp ウェハ処理装置
JP2010166008A (ja) * 2009-01-19 2010-07-29 Canon Inc 基板搬送システム、露光装置およびデバイス製造方法
JP2011243812A (ja) * 2010-05-19 2011-12-01 Ebara Corp 基板処理装置の基板搬送方法、スケジューラ、及び基板処理装置の運転制御装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060141157A1 (en) * 2003-05-27 2006-06-29 Masahiko Sekimoto Plating apparatus and plating method
JP5282021B2 (ja) * 2009-12-14 2013-09-04 株式会社日立ハイテクノロジーズ 半導体処理システム及び半導体処理方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09266166A (ja) * 1996-03-28 1997-10-07 Nikon Corp 露光装置
JPH10284565A (ja) * 1997-04-11 1998-10-23 Hitachi Ltd 半導体評価装置
JP2002511193A (ja) * 1997-06-09 2002-04-09 アプライド マテリアルズ インコーポレイテッド マルチチャンバ式半導体ウェーハ処理ツール内でのウェーハ処理用スケジュールを自動的に生成するための方法および装置
JPH1145926A (ja) * 1997-07-25 1999-02-16 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH11227931A (ja) * 1998-02-10 1999-08-24 Yaskawa Electric Corp 搬送順序決定方法および装置
JP2000277401A (ja) * 1999-03-25 2000-10-06 Dainippon Screen Mfg Co Ltd 基板処理装置、基板処理装置のシミュレート装置、及び基板処理装置のシミュレートプログラムを記録したコンピュータ読み取り可能な記録媒体
JP2005240108A (ja) * 2004-02-26 2005-09-08 Ebara Corp めっき装置及びめっき方法
JP2007329233A (ja) * 2006-06-07 2007-12-20 Nikon Corp ウェハ処理装置
JP2010166008A (ja) * 2009-01-19 2010-07-29 Canon Inc 基板搬送システム、露光装置およびデバイス製造方法
JP2011243812A (ja) * 2010-05-19 2011-12-01 Ebara Corp 基板処理装置の基板搬送方法、スケジューラ、及び基板処理装置の運転制御装置

Also Published As

Publication number Publication date
TW201604330A (zh) 2016-02-01
US20150308010A1 (en) 2015-10-29

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