JP2015196741A - conductive shield tape - Google Patents

conductive shield tape Download PDF

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Publication number
JP2015196741A
JP2015196741A JP2014074432A JP2014074432A JP2015196741A JP 2015196741 A JP2015196741 A JP 2015196741A JP 2014074432 A JP2014074432 A JP 2014074432A JP 2014074432 A JP2014074432 A JP 2014074432A JP 2015196741 A JP2015196741 A JP 2015196741A
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Prior art keywords
conductive
thin film
protective layer
shield tape
metal thin
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修 手嶋
Osamu Tejima
修 手嶋
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Dexerials Corp
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Dexerials Corp
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Priority to JP2014074432A priority Critical patent/JP2015196741A/en
Priority to TW104106245A priority patent/TW201606808A/en
Priority to PCT/JP2015/055736 priority patent/WO2015151674A1/en
Publication of JP2015196741A publication Critical patent/JP2015196741A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Abstract

PROBLEM TO BE SOLVED: To provide a conductive shield tape in which a metallic thin film does not break off and which is not made sticky.SOLUTION: Provided is a conductive shield tape (1) in which a conductive adhesive layer (2) is arranged at one side of a metallic thin film (3), a conductive protective layer (4) is arranged at the face on the opposite side, and, since the conductive protective layer (4) has strength higher than that of the metallic thin film (3), the metallic thin film (3) is not destroyed. Further, the metallic thin film (3) has conductivity in both of a thickness direction and a widening direction, and the conductive adhesive layer (2) and the conductive protective layer (4) have conductivity at least in the thickness direction, and when each conductive shield tape (1) is laminated, each conductive shield tape (1) is electrically connected.

Description

本発明は、導電性シールドテープに関し、特にリワーク性及び導電性に優れる導電性シールドテープに関する。   The present invention relates to a conductive shield tape, and particularly relates to a conductive shield tape excellent in reworkability and conductivity.

従来から、ＰＣモニタ、スマートホン、携帯型ゲーム機、デジタルオーディオプレーヤー、タブレット端末やウェアラブル端末、あるいは車載用モニタ等の各種表示入力手段として、液晶表示装置や有機ＥＬパネル等の表示装置と、該表示装置に圧力を加えることにより画面位置の情報を感知して情報信号として出力する入力装置とを備えたタッチパネルが用いられている。   Conventionally, as various display input means such as a PC monitor, a smart phone, a portable game machine, a digital audio player, a tablet terminal, a wearable terminal, or an in-vehicle monitor, a display device such as a liquid crystal display device or an organic EL panel, A touch panel is used that includes an input device that senses information on a screen position by applying pressure to the display device and outputs the information as an information signal.

近年、このようなタッチパネル装置においては、ファインピッチ化、軽量薄型化等が進み、液晶パネル等の表示装置とタッチパネルとが近接することにより、液晶パネルの動作時におけるノイズ(静電気)がタッチパネル走査に影響を及ぼすことがある。そこで、表示装置は、接地線として、導電性シールドテープが貼付されている。   In recent years, in such touch panel devices, fine pitch, light weight, and thinning have progressed, and the display device such as a liquid crystal panel and the touch panel are close to each other. May have an effect. Therefore, a conductive shield tape is attached to the display device as a ground line.

特開昭６３−４０２１６号公報JP 63-40216 A

ところで、液晶パネル等の表示装置では、近年画像表示部周辺が狭額縁化するとともに薄型化の進展に伴い、導電性シールドテープには、薄型化や、狭い場所でもカールやしわが発生せずに貼付できる作業性に加え、仮に貼付に失敗した場合のリワーク性も求められている。
また、導電性シールドテープは、表示装置の基板コーナー部に貼付する際などに重畳させることから、面方向の導電性に加え厚み方向の導電性も求められている。 By the way, in the display device such as a liquid crystal panel, the periphery of the image display unit has been narrowed in recent years, and with the progress of thinning, the conductive shield tape has been thinned and no curling or wrinkle occurs even in a narrow place. In addition to the workability that can be applied, there is also a need for reworkability if the application fails.
Further, since the conductive shield tape is superposed when being applied to the corner portion of the substrate of the display device, the conductivity in the thickness direction is also required in addition to the conductivity in the surface direction.

ここで、従来の導電性シールドテープとしては、金属薄膜を使用されるが(特許文献１)、金属薄膜が薄いために熟練者でないとリワーク作業の途中で千切れるために、その作業効率が上がらない現実がある。   Here, a metal thin film is used as a conventional conductive shield tape (Patent Document 1). However, since the metal thin film is thin, if it is not an expert, it will be broken in the middle of the rework work, and the work efficiency will be improved. There is no reality.

そこで、本発明は、貼付作業性、リワーク性及び導電性に優れる導電性シールドテープ提供することを目的とする。   Then, an object of this invention is to provide the electroconductive shield tape which is excellent in sticking workability | operativity, rework property, and electroconductivity.

上述した課題を解決するために、本発明者は２つの態様を提供する。
すなわち、本発明に係る導電性シールドテープ(１)の第１の態様は、導電性粘着剤層(２)が金属薄膜(３)の片面に設けられ、導電性保護層(４)が前記金属薄膜(３)の反対側の面に設けられた導電性シールドテープ(１)であって、前記導電性保護層(４)は、バインダ成分(ｃ１)と導電粒子(ｃ２)とを含み、前記バインダ成分(ｃ１)は、数平均分子量が２００００以上３００００以下であり、ガラス転移温度が５℃未満の温度である第一のポリエステル樹脂(イ)と、前記第一のポリエステル樹脂(イ)の水酸基価に対して、１５当量以上のイソシアネート化合物(ハ)を反応させてなることを特徴とする導電性シールドテープ(１)である。
また、本発明に係る導電性シールドテープ(１)の第２の態様は、導電性粘着剤層(２)が金属薄膜(３)の片面に設けられ、導電性保護層(４)が前記金属薄膜(３)の反対側の面に設けられた導電性シールドテープ(１)であって、前記導電性保護層(４)は、バインダ成分(ｃ１)と導電粒子(ｃ２)とを含み、前記バインダ成分(ｃ１)は、数平均分子量が２００００以上３００００以下であり、ガラス転移温度が５℃未満の温度である第一のポリエステル樹脂(イ)と、数平均分子量が８０００以上２００００以下であり、ガラス転移温度が３５℃を超える温度である第二のポリエステル樹脂(ロ)と、前記第一、第二のポリエステル樹脂(イ)，(ロ)の水酸基価の平均値に対して、５当量以上のイソシアネート化合物(ハ)を反応させてなることを特徴とする導電性シールドテープ(１)である。
また、本発明は、前記導電性粘着剤層(２)には、剥離フィルム(７)が貼付された導電性シールドテープ(１)である。
また、本発明は、前記導電性粘着剤層(２)と、前記導電性保護層(４)とは、少なくとも厚み方向に導電性を有する導電性シールドテープ(１)である。 In order to solve the above-described problems, the present inventor provides two aspects.
That is, in the first aspect of the conductive shield tape (1) according to the present invention, the conductive adhesive layer (2) is provided on one surface of the metal thin film (3), and the conductive protective layer (4) is the metal. A conductive shield tape (1) provided on the opposite surface of the thin film (3), wherein the conductive protective layer (4) includes a binder component (c1) and conductive particles (c2), The binder component (c1) has a number average molecular weight of 20000 or more and 30000 or less, a glass transition temperature of less than 5 ° C., and a hydroxyl group of the first polyester resin (a). The conductive shield tape (1) is characterized by reacting an isocyanate compound (c) of 15 equivalents or more with respect to the value.
The second aspect of the conductive shield tape (1) according to the present invention is that the conductive adhesive layer (2) is provided on one side of the metal thin film (3), and the conductive protective layer (4) is the metal. A conductive shield tape (1) provided on the opposite surface of the thin film (3), wherein the conductive protective layer (4) includes a binder component (c1) and conductive particles (c2), The binder component (c1) has a number average molecular weight of 20000 or more and 30000 or less, a first polyester resin (A) having a glass transition temperature of less than 5 ° C., and a number average molecular weight of 8000 or more and 20000 or less, 5 equivalents or more with respect to the average value of the hydroxyl values of the second polyester resin (b) having a glass transition temperature exceeding 35 ° C. and the first and second polyester resins (a) and (b). Conductive sheet characterized by reacting with an isocyanate compound (c) Is a Dotepu (1).
Moreover, this invention is a conductive shield tape (1) by which the peeling film (7) was stuck to the said conductive adhesive layer (2).
In the present invention, the conductive pressure-sensitive adhesive layer (2) and the conductive protective layer (4) are conductive shield tapes (1) having conductivity at least in the thickness direction.

本発明の導電性シールドテープ(１)は、第１の態様、第２の態様とも、導電性粘着剤層(２)、金属薄膜(３)、及び導電性保護層(４)を順次形成してなり、この導電性保護層(４)を構成するバインダ成分(ｃ１)に対して過剰量となるイソシアネート化合物(ハ)を反応させている点で共通する。
このような導電性保護層(４)は金属薄膜(３)よりも強度が高く、金属薄膜(３)が支持又は補強としてリワーク作業の際に金属薄膜(３)が千切れるのを防止する役割を果たす。
また、導電性保護層(４)の表面がべとつくと、リワークそのものは可能であっても、作業が円滑に進まず、却って他の領域を汚染する可能性が高いが、本発明の導電性保護層(４)はべとつきがない効果を奏する。
また、複数枚を積層させた場合に、積層された導電性シールドテープ(１)間は電気的に接続されるので、種々の形状の被着体に適している。 In the conductive shield tape (1) of the present invention, the conductive adhesive layer (2), the metal thin film (3), and the conductive protective layer (4) are sequentially formed in both the first aspect and the second aspect. This is common in that an excess amount of the isocyanate compound (c) is reacted with the binder component (c1) constituting the conductive protective layer (4).
Such a conductive protective layer (4) is stronger than the metal thin film (3), and the metal thin film (3) serves as a support or reinforcement to prevent the metal thin film (3) from being shredded during rework. Fulfill.
In addition, if the surface of the conductive protective layer (4) is sticky, even if rework itself is possible, the work does not proceed smoothly and there is a high possibility that it will contaminate other areas. The layer (4) has an effect without stickiness.
In addition, when a plurality of sheets are laminated, the laminated conductive shield tapes (1) are electrically connected, so that they are suitable for adherends having various shapes.

本発明の導電性シールドテープを示す断面図Sectional drawing which shows the conductive shield tape of this invention

以下、項目に従い、本発明の形態を説明する。
１．導電性シールドテープ
２．導電性粘着剤層
３．金属薄膜
４．導電性保護層
５．導電性シールドテープの製造方法 Hereinafter, embodiments of the present invention will be described according to items.
1. 1. Conductive shield tape 2. Conductive adhesive layer Metal thin film 4. 4. Conductive protective layer Manufacturing method of conductive shield tape

［１．導電性シールドテープ］
本発明が適用された導電性シールドテープ(１)は、例えば、液晶パネルの額縁部と液晶パネルが組み込まれた機器筐体との間に配置されることにより、液晶パネルに発生したノイズ電荷を機器筐体のグランドに逃がす接地線として用いられるものであり、図１に示すように、剥離フィルム(７)上に、導電性粘着剤層(２)と、金属薄膜(３)と、導電性保護層(４)を有する。 [1. Conductive shield tape]
The conductive shield tape (1) to which the present invention is applied is arranged between, for example, a frame portion of a liquid crystal panel and a device housing in which the liquid crystal panel is incorporated, thereby reducing noise charges generated in the liquid crystal panel. As shown in FIG. 1, the conductive adhesive layer (2), the metal thin film (3), and the conductive film are used on the release film (7) as shown in FIG. It has a protective layer (4).

金属薄膜(３)の片面は、導電性粘着剤層(２)と接触し、反対側の面は導電性保護層(４)と接触しており、金属薄膜(３)は、導電性粘着剤層(２)と導電性保護層(４)と電気的に接続されている。
金属薄膜(３)は厚み方向と広がり方向(薄膜の表面に沿った方向)の両方に導電性を有しており、導電性保護層(４)と導電性粘着剤層(２)とは電気的に接続されている。 One side of the metal thin film (3) is in contact with the conductive adhesive layer (2), the other side is in contact with the conductive protective layer (4), and the metal thin film (3) is in contact with the conductive adhesive. The layer (2) and the conductive protective layer (4) are electrically connected.
The metal thin film (3) has conductivity in both the thickness direction and the spreading direction (direction along the surface of the thin film), and the conductive protective layer (4) and the conductive adhesive layer (2) are electrically connected. Connected.

導電性保護層(４)と導電性粘着剤層(２)とは、少なくとも厚み方向に導電性を有しており、厚み方向に加え、広がり方向にも導電性を有していてもよい。
厚み方向の導電性により、二枚の導電性シールドテープ(１)のうち、一方の導電性シールドテープ(１)の導電性保護層(４)の表面に、他方の導電性シールドテープ(１)の導電性粘着剤層(２)が接触して貼付すると、二枚の導電性シールドテープ(１)の金属薄膜(３)同士は電気的に接続される。 The conductive protective layer (4) and the conductive pressure-sensitive adhesive layer (2) have conductivity at least in the thickness direction, and may have conductivity in the spreading direction in addition to the thickness direction.
Of the two conductive shield tapes (1), the other conductive shield tape (1) is provided on the surface of the conductive protective layer (4) of one conductive shield tape (1) due to the conductivity in the thickness direction. When the conductive pressure-sensitive adhesive layer (2) is contacted and stuck, the metal thin films (3) of the two conductive shield tapes (1) are electrically connected to each other.

［２．導電性粘着剤層］
導電性粘着剤層(２)は、機器筐体などの表面に導電性シールドテープ(１)を貼付させる目的で使用され、具体的には、導電粒子を含有した公知の粘着剤(ｃ３)を用いることができる。粘着剤(ｃ３)としては、例えば、ゴム系粘着剤やアクリル系粘着剤、シリコーン系粘着剤やウレタン系粘着剤、ビニルアルキルエーテル系粘着剤やポリビニルアルコール系粘着剤、ポリビニルピロリドン系粘着剤やポリアクリルアミド系粘着剤、セルロース系粘着剤などがあげられ、一般にはゴム系粘着剤やアクリル系粘着剤などが用いられる。 [2. Conductive adhesive layer]
The conductive pressure-sensitive adhesive layer (2) is used for the purpose of attaching the conductive shield tape (1) to the surface of a device housing or the like. Specifically, a known pressure-sensitive adhesive (c3) containing conductive particles is used. Can be used. Examples of the adhesive (c3) include rubber adhesives, acrylic adhesives, silicone adhesives, urethane adhesives, vinyl alkyl ether adhesives, polyvinyl alcohol adhesives, polyvinyl pyrrolidone adhesives and polyadhesives. Examples include acrylamide-based adhesives and cellulose-based adhesives. Generally, rubber-based adhesives and acrylic-based adhesives are used.

また、導電粒子(ｃ４)としては、導電性接着剤に一般的に使用されている公知の導電粒子(ｃ４)を使用することができる。例えば、ニッケル、銀、銅などの金属粉、銀コート銅粉等の金属コート金属粉、扁平スチレン粒子コアのＮｉコート、Ａｕフラッシュメッキ物等の金属コート樹脂粉等を使用することが可能である。また、上記の粉及び粒子を混合して使用してもよい。   Moreover, as the conductive particles (c4), known conductive particles (c4) generally used for conductive adhesives can be used. For example, metal powder such as nickel, silver and copper, metal coat metal powder such as silver coat copper powder, Ni coat of flat styrene particle core, metal coat resin powder such as Au flash plating, etc. can be used. . Moreover, you may mix and use said powder and particle | grains.

［３．金属薄膜］
金属薄膜(３)は、導電性シールドテープ(１)が貼付される液晶パネル等のノイズ電荷をアースするための導電層であり、薄型ながら導通性に優れるアルミニウム箔や銅箔等の金属薄膜が好適に用いられる。 [3. Metal thin film]
The metal thin film (3) is a conductive layer for grounding noise charges of a liquid crystal panel or the like to which the conductive shield tape (1) is affixed. A thin metal film such as an aluminum foil or copper foil that is thin but excellent in conductivity is used. Preferably used.

金属薄膜(３)としてアルミニウム箔を用いた場合、特別な防食処理を施すことなく耐食性に優れるとともに、単位重量あたりの導電率が比較的高いため、導電性シールドテープ(１)の重量を軽量化させ得るものとなる。したがって、導電特性の維持や、導電性シールドテープ(１)が設けられる電子機器の軽量化等の点で好適に用いられる。   When aluminum foil is used as the metal thin film (3), it has excellent corrosion resistance without any special anti-corrosion treatment, and the conductivity per unit weight is relatively high, so the weight of the conductive shield tape (1) is reduced. It can be made to be. Therefore, it is preferably used in terms of maintaining the conductive characteristics and reducing the weight of the electronic device provided with the conductive shield tape (1).

また、金属薄膜(３)として銅箔を用いる場合、マット面を有し、アンカー効果により導電性保護層(４)との接着性を向上させる点から電解銅箔が好適に用いられる。また、金属薄膜(３)として銅箔を用いる場合、酸化皮膜の形成による導電性の低下を防止するために防錆処理、ニッケルメッキなどの処理が施されていることが好ましい。   Moreover, when using copper foil as a metal thin film (3), an electrolytic copper foil is used suitably from the point which has a mat surface and improves adhesiveness with an electroconductive protective layer (4) by an anchor effect. Moreover, when using copper foil as a metal thin film (3), in order to prevent the electroconductivity fall by formation of an oxide film, it is preferable to perform processes, such as a rust prevention process and nickel plating.

金属薄膜(３)は、導電性シールドテープ(１)の貼付位置に応じた形状をなし、例えばフィルム状に形成されている。   The metal thin film (3) has a shape corresponding to the attachment position of the conductive shield tape (1), and is formed in a film shape, for example.

また、金属薄膜(３)は、厚みが２０μｍ以下が好ましい。電子機器の小型化、薄型化に伴い、導電性シールドテープ(１)も薄型化(例えば総厚みが７０μｍ以下)が求められている。そのため、導電性シールドテープ(１)も、各層の厚みの薄型化が求められ、金属薄膜(３)としては２０μｍ以下が好ましい。   The metal thin film (3) preferably has a thickness of 20 μm or less. With the downsizing and thinning of electronic devices, the conductive shield tape (1) is also required to be thin (for example, the total thickness is 70 μm or less). Therefore, the conductive shield tape (1) is also required to be thin in the thickness of each layer, and the metal thin film (3) is preferably 20 μm or less.

また、金属薄膜(３)は、引張強度が１００ＭＰａ以下であることが好ましい。これにより、導電性シールドテープ(１)に適度なコシを与えることができ、剥離フィルム(７)から剥離した際にカールが発生することもなく、また貼付場所の形状に追従して剥離やめくれ等の発生を防止することができる。   The metal thin film (3) preferably has a tensile strength of 100 MPa or less. As a result, the conductive shield tape (1) can be given a proper stiffness, and no curling will occur when it is peeled off from the release film (7). Etc. can be prevented.

〔４．導電性保護層〕
導電性保護層(４)は、リワーク作業の際、金属薄膜(３)を支持し又は補強して、千切れないように防止すると共に、厚み方向の導電性を確保する役割を果たす。 [4. Conductive protective layer)
The conductive protective layer (4) supports or reinforces the metal thin film (3) during the reworking work to prevent it from being broken and to ensure conductivity in the thickness direction.

本発明において、第１の態様又は第２に態様においても、導電性保護層(４)は導電性の樹脂層であり、バインダ成分(ｃ１)と導電粒子(ｃ２)からなっており、バインダ成分(ｃ１)は所定の数平均分子量を有する第一のポリエステル樹脂(イ)と、その第一のポリエステル樹脂(イ)が含む水酸基の量(以下、水酸基価)に対して、過剰量のイソシアネート化合物(ハ)を反応させた硬化樹脂層である。
導電性保護層(４)は金属薄膜(３)よりも強く、破壊しにくい材料で形成されており、曲がることができる硬化樹脂であり、また、導電性保護層(４)には、柔軟性を付与することができる。 In the present invention, also in the first aspect or the second aspect, the conductive protective layer (4) is a conductive resin layer, and includes a binder component (c1) and conductive particles (c2). (c1) is an excess amount of isocyanate compound relative to the amount of hydroxyl group (hereinafter referred to as hydroxyl value) contained in the first polyester resin (a) having a predetermined number average molecular weight and the first polyester resin (a). It is a cured resin layer reacted with (c).
The conductive protective layer (4) is made of a material that is stronger and harder to break than the metal thin film (3) and can be bent. The conductive protective layer (4) is flexible. Can be granted.

(第１の態様)
本発明の第１の態様では、バインダ成分(ｃ１)として、その数平均分子量が２００００〜３００００であり、且つそのガラス転移温度が５℃未満の温度である第一のポリエステル樹脂(イ)を使用する。いわゆる常温(５〜３５℃)の最低温度よりも低温に設定されている。 (First aspect)
In the first aspect of the present invention, as the binder component (c1), the first polyester resin (A) having a number average molecular weight of 20000 to 30000 and a glass transition temperature of less than 5 ° C. is used. To do. It is set to a temperature lower than the lowest temperature of the so-called normal temperature (5-35 ° C.).

このような第一のポリエステル樹脂(イ)は、通常2ｍｇＫＯＨ／ｇ〜10ｍｇＫＯＨ／ｇの水酸基価を有し、このような水酸基価に対して、１５当量以上のイソシアネート化合物(ハ)を反応させる。   Such a first polyester resin (a) usually has a hydroxyl value of 2 mgKOH / g to 10 mgKOH / g, and 15 equivalents or more of the isocyanate compound (c) is reacted with such a hydroxyl value.

１５当量未満である場合には、導電性保護層(４)全体の強度が十分でなく、その結果リワークの際に金属薄膜(３)の千切れが生じ、また導電性保護層(４)の表面にはべとつきがあるので、リワーク作業が円滑に進まない不具合がある。なおイソシアネート化合物(ハ)は、実用上の観点から、２０当量以下でよい。
なお、導電性保護層(４)の厚みは、第１の態様の場合、上記のイソシアネート化合物(ハ)の量にもよるが、2μｍ〜30μｍである。 When the amount is less than 15 equivalents, the strength of the entire conductive protective layer (4) is not sufficient, and as a result, the metal thin film (3) is shredded during rework, and the conductive protective layer (4) Since the surface is sticky, there is a problem that the rework work does not proceed smoothly. The isocyanate compound (C) may be 20 equivalents or less from a practical viewpoint.
In the first embodiment, the thickness of the conductive protective layer (4) is 2 μm to 30 μm, although it depends on the amount of the isocyanate compound (c).

イソシアネート化合物(ハ)は、ヘキサメチレンジイソシアネート、トルエンジイソシアネート、キシレンジイソシアネート、水添化キシレンジイソシアネートなどのイソシアネート化合物が好ましく使用することができる。   As the isocyanate compound (C), isocyanate compounds such as hexamethylene diisocyanate, toluene diisocyanate, xylene diisocyanate, and hydrogenated xylene diisocyanate can be preferably used.

また、導電粒子(ｃ２)は、前述の導電性粘着剤層(２)に使用される導電粒子(ｃ４)がそのまま使用できる。これら導電粒子の大きさは特に限定しないが、導電粒子の直径は、導電性保護層(４)の厚みを考慮して、1μｍ〜20μｍが好ましい。   Moreover, as the conductive particles (c2), the conductive particles (c4) used in the conductive adhesive layer (2) can be used as they are. The size of these conductive particles is not particularly limited, but the diameter of the conductive particles is preferably 1 μm to 20 μm in consideration of the thickness of the conductive protective layer (4).

(第２の態様)
その一方、本発明の第２の態様では、具体的に、バインダ成分(ｃ１)として、その数平均分子量が２００００〜３００００であり、且つそのガラス転移温度が５℃未満の温度である第一のポリエステル樹脂(イ)と、数平均分子量が８０００〜２００００であり、そのガラス転移温度が３５℃を超える温度である第二のポリエステル樹脂(ロ)を併用する。すなわち常温(５〜３５℃)の最低温度よりもガラス転移温度が低い第一のポリエステル樹脂（イ）と、常温の最高温度よりもガラス転移温度が高い第二のポリエステル樹脂（ロ）を併用する。 (Second aspect)
On the other hand, in the second aspect of the present invention, specifically, the binder component (c1) is a first component whose number average molecular weight is 20000 to 30000 and whose glass transition temperature is less than 5 ° C. A polyester resin (a) and a second polyester resin (b) having a number average molecular weight of 8000 to 20000 and a glass transition temperature exceeding 35 ° C. are used in combination. That is, the first polyester resin (A) whose glass transition temperature is lower than the lowest temperature of normal temperature (5-35 ° C.) and the second polyester resin (B) whose glass transition temperature is higher than the highest temperature of normal temperature are used in combination. .

このような第一のポリエステル樹脂(イ)の水酸基価は、通常2ｍｇＫＯＨ/ｇ〜10ｍｇＫＯＨ/ｇの範囲であり、他方、第二のポリエステル樹脂(ロ)の水酸基価も、通常2ｍｇＫＯＨ/ｇ〜10ｍｇＫＯＨ/ｇである。なお、第一のポリエステル樹脂(イ)及び第二のポリエステル樹脂(ロ)は９０：１０〜５０：５０の質量比が好ましい。   The hydroxyl value of the first polyester resin (a) is usually in the range of 2 mgKOH / g to 10 mgKOH / g, while the hydroxyl value of the second polyester resin (b) is also usually 2 mgKOH / g to 10 mgKOH. / g. The first polyester resin (a) and the second polyester resin (b) preferably have a mass ratio of 90:10 to 50:50.

そして、このように第一のポリエステル樹脂(イ)及び第二のポリエステル樹脂(ロ)を併用する本発明の第２の態様においては、５当量以上のイソシアネート化合物(ハ)を反応させる。
５当量未満である場合には、第１の態様と同様に、リワークの際に金属薄膜(３)の千切れが生じ又は表面にべとつきが生じ、実質的にリワーク作業が円滑に進まない不具合がある。 In the second embodiment of the present invention in which the first polyester resin (A) and the second polyester resin (B) are used in combination, 5 equivalents or more of the isocyanate compound (C) is reacted.
If the amount is less than 5 equivalents, as in the first embodiment, the metal thin film (3) may be broken or sticky on the surface during rework, and the rework work may not proceed smoothly. is there.

なお、第２の態様における導電性保護層(４)の厚みは、第１の態様の場合と同様、上記のイソシアネート化合物(ハ)の当量にもよるが、2μｍ〜30μｍである。   In addition, although the thickness of the electroconductive protective layer (4) in a 2nd aspect is based also on the equivalent of said isocyanate compound (c) similarly to the case of a 1st aspect, it is 2 micrometers-30 micrometers.

イソシアネート化合物(ハ)は、第１の態様の化合物と同様の化合物を使用することができる。   As the isocyanate compound (C), the same compound as the compound of the first embodiment can be used.

なお、導電性保護層(４)に更に耐熱性が要求される場合には、イソシアネート化合物（ハ）を５当量以上とし、更に第一のポリエステル樹脂(イ)の配合比率を８０以上配合するか、またはイソシアネート化合物（ハ）を７当量以上反応させることで対応が可能である。   In addition, when further heat resistance is required for the conductive protective layer (4), the isocyanate compound (c) should be 5 equivalents or more, and the blending ratio of the first polyester resin (a) should be 80 or more. Alternatively, it can be handled by reacting 7 equivalents or more of the isocyanate compound (C).

〔５．導電性シールドテープの製造方法〕
次に、導電性シールドテープ(１)の製造工程について説明する。
剥離フィルムに導電性保護層(４)の原料となるバインダ成分(ｃ１)及び導電粒子(ｃ２)を有機溶剤に溶解した塗布液を塗布・乾燥して塗布層を形成した後、アルミ箔等の金属薄膜(３)を塗布層上に貼付し、塗布層を硬化させ、導電性保護層(４)を形成し、剥離フィルムを除去して中間フィルムＡを得る。 [5. Manufacturing method of conductive shield tape]
Next, the manufacturing process of the conductive shield tape (1) will be described.
After applying a coating solution prepared by dissolving the binder component (c1) and conductive particles (c2), which are raw materials of the conductive protective layer (4), in an organic solvent to the release film and forming a coating layer, an aluminum foil or the like is formed. A metal thin film (3) is stuck on the coating layer, the coating layer is cured, a conductive protective layer (4) is formed, and the release film is removed to obtain an intermediate film A.

その一方、剥離フィルム(７)に、導電性粘着剤層(２)の原料となる、例えばアクリル系粘着剤と導電粒子を有機溶剤に溶解した塗布液を塗布、及び乾燥して、所定の導電性粘着剤層(２)が形成された中間フィルムＢを得る。
最後に、中間フィルムＡの金属薄膜(３)表面に、中間フィルムＢの導電性粘着剤層(２)表面を対向させて積層することで、導電性シールドテープ(１)を得る。 On the other hand, a predetermined conductive material is applied to the release film (7) by applying and drying a coating solution that is a raw material for the conductive adhesive layer (2), for example, an acrylic adhesive and conductive particles dissolved in an organic solvent. The intermediate film B on which the adhesive layer (2) is formed is obtained.
Finally, the conductive shield tape (1) is obtained by laminating the surface of the metal film (3) of the intermediate film A with the surface of the conductive adhesive layer (2) of the intermediate film B facing each other.

導電性シールドテープ(１)は、使用する際には所定の長さに切断された後、図１の剥離フィルム(７)が剥離され、導電性粘着剤層(２)を所定の部位に貼付する。   The conductive shield tape (1) is cut into a predetermined length when used, and then the release film (7) of FIG. 1 is peeled off, and the conductive adhesive layer (2) is applied to a predetermined site. To do.

また、導電性シールドテープ(１)は、金属薄膜(３)によって面方向に良好な導通性を有するのみならず、金属薄膜(３)との厚さ方向の導電性が向上されている。したがって、導電性シールドテープ(１)は、例えば液晶パネルに発生したノイズ電荷を機器筐体に逃がす接地線として用いられた場合に、ノイズの発生源と接地点が離れていても確実に筐体に電荷を逃がすことができ、ノイズによる誤動作等の悪影響を防止することができる。   Further, the conductive shield tape (1) has not only good conductivity in the surface direction due to the metal thin film (3), but also the conductivity in the thickness direction with the metal thin film (3) is improved. Therefore, when the conductive shield tape (1) is used as, for example, a grounding wire for releasing noise charges generated in the liquid crystal panel to the equipment housing, the housing is surely provided even if the noise generation source is separated from the grounding point. In addition, it is possible to release electric charges, and it is possible to prevent adverse effects such as malfunction caused by noise.

なお、導電性シールドテープ(１)の製造工程については、上記手順とは異なり、先ず、剥離フィルム(７)に、導電性粘着剤層(２)の原料液を塗布、及び乾燥して、導電性粘着剤層(２)を形成した後、導電性粘着剤層(２)の表面に金属薄膜(３)を貼付して、中間フィルムＣを得る。
次に、中間フィルムＣの金属薄膜(３)表面に、導電性保護層(４)の原料となる塗布液を塗布・乾燥して、導電性シールドテープ(１)を得るようにしてもよい。 The manufacturing process of the conductive shield tape (1) is different from the above procedure. First, the raw material liquid for the conductive adhesive layer (2) is applied to the release film (7) and dried to conduct the conductive process. After forming the adhesive layer (2), the metal thin film (3) is stuck on the surface of the conductive adhesive layer (2) to obtain the intermediate film C.
Next, the conductive shielding tape (1) may be obtained by applying and drying a coating solution as a raw material for the conductive protective layer (4) on the surface of the metal thin film (3) of the intermediate film C.

次に、本発明の実施例を、第１の態様及び第２の態様に分けて説明する。
(第１の態様)
導電性保護層の原料として、導電粒子(ニッケル粒子、品番255、バーレー社製)２０質量部、第一のポリエステル樹脂(イ)として、バイロン５００(東洋紡、数平均分子量２３０００、ガラス転移温度４℃、水酸基価５ｍｇＫＯＨ／１ｇ)１００質量部、そして、イソシアネート化合物(ハ)(コロネートＨＸ、日本ポリウレタン社製)を７質量部、１０質量部、１３質量部、２５質量部と変化させた各種塗布液を、金属薄膜としてアルミ箔(１N３０、日本製箔社製、厚さ７μｍ、引張強度６５ＭＰａ)に乾燥厚みが１５μｍとなるように形成し、次に、４０℃で硬化反応させることで、第一のポリエステル樹脂(イ)に対して、イソシアネート化合物(ハ)の当量が異なる中間フィルムＡを形成した。 Next, an embodiment of the present invention will be described by dividing it into a first aspect and a second aspect.
(First aspect)
As raw materials for the conductive protective layer, 20 parts by mass of conductive particles (nickel particles, product number 255, manufactured by Burley), and as the first polyester resin (a), Byron 500 (Toyobo, number average molecular weight 23000, glass transition temperature 4 ° C.) , Hydroxyl value 5 mg KOH / 1 g) 100 parts by mass, and various coating solutions in which the isocyanate compound (C) (Coronate HX, manufactured by Nippon Polyurethane Co., Ltd.) was changed to 7 parts by mass, 10 parts by mass, 13 parts by mass, and 25 parts by mass. Is formed as a metal thin film on aluminum foil (1N30, manufactured by Nihon Foil Co., Ltd., thickness 7 μm, tensile strength 65 MPa) to a dry thickness of 15 μm, and then cured at 40 ° C. An intermediate film A in which the equivalent amount of the isocyanate compound (C) was different from that of the polyester resin (A) was formed.

次に、導電性粘着剤層の原料として、導電粒子(ニッケル粒子、品番２５５、ヴァーレ社製)と、アクリル酸ブチル、アクリル酸、メタクリル酸２−ヒドロキシエチルからなるアクリル共重合体１００質量部と、イソシアネート化合物(ハ)(コロネートL、日本ポリウレタン社製)０．５質量部を含有する塗布液を、剥離フィルム(７)上に乾燥厚みが、20μｍとなるように塗布して塗布液層を形成した後、乾燥して中間フィルムＢを形成した。   Next, as a raw material for the conductive pressure-sensitive adhesive layer, conductive particles (nickel particles, product number 255, manufactured by Vale Co., Ltd.), 100 parts by mass of an acrylic copolymer composed of butyl acrylate, acrylic acid, 2-hydroxyethyl methacrylate, The coating liquid layer containing 0.5 parts by mass of isocyanate compound (C) (Coronate L, manufactured by Nippon Polyurethane Co., Ltd.) was applied on the release film (7) so that the dry thickness was 20 μm. After forming, it was dried to form an intermediate film B.

そして、中間フィルムＡの金属薄膜面に対して、中間フィルムＢの導電性粘着剤層面を積層することで、目的の導電性シールドテープ(１)を得た。イソシアネート化合物(ハ)の量を変化させて得られたテープに関して、以下の試験方法により評価を行い、その結果を表１に示す。   And the target electroconductive shield tape (1) was obtained by laminating | stacking the electroconductive adhesive layer surface of the intermediate film B with respect to the metal thin film surface of the intermediate film A. As shown in FIG. The tape obtained by changing the amount of the isocyanate compound (c) was evaluated by the following test method, and the results are shown in Table 1.

Figure 2015196741
Figure 2015196741

試験方法
１．リワーク性
得られた導電性シールドテープ(１)を、所望のサイズ(2ｃｍ×10ｃｍ)にスリットし、電子機器の筐体に見立てたSUS、ガラス板に貼り付けた後、1時間経過した後に、作業者がリワーク作業を行った。リワークできる場合を○として、リワーク作業中に金属薄膜が千切れ及び切れ目が入った場合を×として評価した。 Test method 1. Reworkability After 1 hour has passed after slitting the obtained conductive shield tape (1) to the desired size (2cm x 10cm) and sticking it to SUS or glass plate as if the casing of the electronic equipment. The worker reworked. The case where reworking was possible was evaluated as ◯, and the case where the metal thin film was broken and cut during the reworking operation was evaluated as x.

２．表面のべとつき
なお、上記のリワーク作業の際に、ポリエステル樹脂が高架橋状態であって導電性樹脂層の表面にべとつきがなく、作業が容易であった場合を○、そうでない場合を×として評価した。なお、通常、プローブタックにより10ｋｇｆ／ｃｍ以上である場合には作業者がべとつきを感じ、その作業が困難になる。また、ロール形状にしたときにはブロッキングしてしまう不具合がある。 2. In addition, when the above-mentioned rework work, the polyester resin was highly cross-linked and the surface of the conductive resin layer was not sticky, and the work was easy. . Normally, when the probe tack is 10 kgf / cm or more, the operator feels stickiness and the operation becomes difficult. Moreover, there exists a malfunction which will block when it makes it roll shape.

表１に記載された通り、第一のポリエステル樹脂(イ)に対して、イソシアネート化合物(ハ)が１５当量含有されている場合には、リワークが可能であり、且つ表面のべとつきがない。   As described in Table 1, when 15 equivalents of the isocyanate compound (C) is contained with respect to the first polyester resin (A), rework is possible and the surface is not sticky.

(第２の態様)
第一のポリエステル樹脂(イ)に加え、第二のポリエステル樹脂(ロ)としてＵＥ３２００(ユニチカ社製、数平均分子量１６０００、ガラス転移温度６５℃、水酸基価６mgKOH/g)の配合量、及びイソシアネート化合物(ハ)の配合量を変化させた以外は、第１の実施例と同様に導電性シールドテープを作成し、第一の態様が行ったのと同じ試験を行った。
なお、第２の態様においては、更に耐熱性について評価し、あわせて表２に示す。 (Second aspect)
In addition to the first polyester resin (a), the blend amount of UE3200 (manufactured by Unitika, number average molecular weight 16000, glass transition temperature 65 ° C., hydroxyl value 6 mgKOH / g) as the second polyester resin (b), and isocyanate compound Except for changing the blending amount of (c), a conductive shield tape was prepared in the same manner as in the first example, and the same test as in the first embodiment was performed.
In the second embodiment, the heat resistance is further evaluated and is shown in Table 2.

Figure 2015196741
Figure 2015196741

表２のとおり、リワーク作業に関する評価項目(表面のべとつき、リワーク性)は、第一、第二のポリエステル樹脂(イ)及び(ロ)の水酸基価に対してイソシアネート化合物(ハ)を５当量以上含有させると○として評価でき、リワーク作業が円滑となることがわかる。
なお、耐熱性が要求される場合には、イソシアネート化合物(ハ)を５当量以上とし、ポリエステル樹脂(イ)の配合比率を８０以上配合するか、またはイソシアネート化合物(ハ)を７当量以上反応させると良い。 As shown in Table 2, the evaluation items related to the rework work (surface stickiness, reworkability) are 5 equivalents or more of the isocyanate compound (c) with respect to the hydroxyl values of the first and second polyester resins (a) and (b). When it is contained, it can be evaluated as ○, and it can be seen that the rework work becomes smooth.
In addition, when heat resistance is required, the isocyanate compound (C) is made 5 equivalents or more and the blending ratio of the polyester resin (A) is 80 or more, or the isocyanate compound (C) is reacted for 7 equivalents or more. And good.

１……導電性シールドテープ
２……導電性粘着剤層
３……金属薄膜
４……導電性保護層
７……剥離フィルム
ｃ１……バインダ成分
ｃ２……導電粒子
DESCRIPTION OF SYMBOLS 1 ... Conductive shield tape 2 ... Conductive adhesive layer 3 ... Metal thin film 4 ... Conductive protective layer 7 ... Release film c1 ... Binder component c2 ... Conductive particle

Claims (4)

導電性粘着剤層(２)が金属薄膜(３)の片面に設けられ、導電性保護層(４)が前記金属薄膜(３)の反対側の面に設けられた導電性シールドテープ(１)であって、
前記導電性保護層(４)は、バインダ成分(ｃ１)と導電粒子(ｃ２)とを含み、
前記バインダ成分(ｃ１)は、
数平均分子量が２００００以上３００００以下であり、ガラス転移温度が５℃未満の温度である第一のポリエステル樹脂(イ)と、前記第一のポリエステル樹脂(イ)の水酸基価に対して、１５当量以上のイソシアネート化合物(ハ)を反応させてなることを特徴とする導電性シールドテープ(１)。 Conductive pressure-sensitive adhesive layer (2) is provided on one side of metal thin film (3), and conductive protective layer (4) is provided on the opposite side of metal thin film (3). Because
The conductive protective layer (4) includes a binder component (c1) and conductive particles (c2),
The binder component (c1) is
The number average molecular weight is 20000 or more and 30000 or less, and the glass transition temperature is a temperature of less than 5 ° C., and 15 equivalents to the hydroxyl value of the first polyester resin (a) A conductive shield tape (1) obtained by reacting the above isocyanate compound (c). 導電性粘着剤層(２)が金属薄膜(３)の片面に設けられ、導電性保護層(４)が前記金属薄膜(３)の反対側の面に設けられた導電性シールドテープ(１)であって、
前記導電性保護層(４)は、バインダ成分(ｃ１)と導電粒子(ｃ２)とを含み、
前記バインダ成分(ｃ１)は、
数平均分子量が２００００以上３００００以下であり、ガラス転移温度が５℃未満の温度である第一のポリエステル樹脂(イ)と、数平均分子量が８０００以上２００００以下であり、ガラス転移温度が３５℃を超える温度である第二のポリエステル樹脂(ロ)と、前記第一、第二のポリエステル樹脂(イ)，(ロ)の水酸基価の平均値に対して、５当量以上のイソシアネート化合物(ハ)を反応させてなることを特徴とする導電性シールドテープ(１)。 Conductive pressure-sensitive adhesive layer (2) is provided on one side of metal thin film (3), and conductive protective layer (4) is provided on the opposite side of metal thin film (3). Because
The conductive protective layer (4) includes a binder component (c1) and conductive particles (c2),
The binder component (c1) is
The number average molecular weight is 20000 or more and 30000 or less, the first polyester resin (A) having a glass transition temperature of less than 5 ° C, the number average molecular weight is 8000 or more and 20000 or less, and the glass transition temperature is 35 ° C. More than 5 equivalents of the isocyanate compound (c) with respect to the average value of the hydroxyl values of the second polyester resin (b) and the first and second polyester resins (a) and (b) above the temperature exceeding A conductive shielding tape (1) characterized by reacting. 前記導電性粘着剤層(２)には、剥離フィルム(７)が貼付された請求項１又は請求項２のいずれか１項記載の導電性シールドテープ(１)。   The conductive shield tape (1) according to any one of claims 1 and 2, wherein a release film (7) is attached to the conductive pressure-sensitive adhesive layer (2). 前記導電性粘着剤層(２)と、前記導電性保護層(４)とは、少なくとも厚み方向に導電性を有する請求項１乃至請求項３のいずれか１項記載の導電性シールドテープ(１)。
The conductive shield tape (1) according to any one of claims 1 to 3, wherein the conductive pressure-sensitive adhesive layer (2) and the conductive protective layer (4) are conductive at least in a thickness direction. ).
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