JP2015167223A5 - - Google Patents

Claims (11)

第１の回路部材と第２の回路部材とを回路接続材料を介在させて配置する配置工程と、
前記第１の回路部材と前記第２の回路部材とを所定温度にて熱圧着し、接続構造体を得る圧着工程とを有し、
前記回路接続材料が、ラジカル重合性化合物と、前記所定温度より高く、前記所定温度の＋２０℃以下の１分間半減期温度を有する有機過酸化物と、２級チオール化合物とを含有することを特徴とする接続構造体の製造方法。 An arrangement step of arranging the first circuit member and the second circuit member with a circuit connecting material interposed therebetween;
A thermocompression bonding of the first circuit member and the second circuit member at a predetermined temperature to obtain a connection structure,
The circuit connection material contains a radical polymerizable compound, an organic peroxide having a half-life temperature of 1 minute that is higher than the predetermined temperature and not higher than the predetermined temperature and not more than + 20 ° C., and a secondary thiol compound. A method for manufacturing a connection structure. 前記有機過酸化物が、ジ(３，５，５−トリメチルヘキサノイル)パーオキサイドを少なくとも含む１種以上である請求項１記載の接続構造体の製造方法。   The method for producing a connection structure according to claim 1, wherein the organic peroxide is one or more containing at least di (3,5,5-trimethylhexanoyl) peroxide. 前記２級チオール化合物の官能基のモル数が、前記ジ(３，５，５−トリメチルヘキサノイル)パーオキサイドの発生ラジカル換算のモル数の２倍以上である請求項２記載の接続構造体の製造方法。   3. The connection structure according to claim 2, wherein the number of moles of the functional group of the secondary thiol compound is at least twice the number of moles of the generated radicals of the di (3,5,5-trimethylhexanoyl) peroxide. Production method. 前記ジ(３，５，５−トリメチルヘキサノイル)パーオキサイドの発生ラジカル換算のモル数が、前記ラジカル重合性化合物の官能基のモル数の０．２倍以上である請求項２記載の接続構造体の製造方法。   The connection structure according to claim 2, wherein the number of moles of the generated radical equivalent of the di (3,5,5-trimethylhexanoyl) peroxide is 0.2 or more times the number of moles of the functional group of the radical polymerizable compound. Body manufacturing method. 前記所定温度が、９０℃以上１２０℃以下である請求項１に記載の接続構造体の製造方法。   The method for manufacturing a connection structure according to claim 1, wherein the predetermined temperature is 90 ° C. or higher and 120 ° C. or lower. 第１の回路部材と第２の回路部材とを所定温度にて熱圧着させる回路接続材料において、In the circuit connection material for thermocompression bonding the first circuit member and the second circuit member at a predetermined temperature,
ラジカル重合性化合物と、前記所定温度より高く、前記所定温度の＋２０℃以下の１分間半減期温度を有する有機過酸化物と、２級チオール化合物とを含有することを特徴とする回路接続材料。A circuit connecting material comprising a radical polymerizable compound, an organic peroxide having a half-life temperature of 1 minute higher than the predetermined temperature and not higher than + 20 ° C. of the predetermined temperature, and a secondary thiol compound. 前記有機過酸化物が、ジ(３，５，５−トリメチルヘキサノイル)パーオキサイドを少なくとも含む１種以上である請求項６記載の回路接続材料。The circuit connecting material according to claim 6, wherein the organic peroxide is one or more kinds including at least di (3,5,5-trimethylhexanoyl) peroxide. 前記２級チオール化合物の官能基のモル数が、前記ジ(３，５，５−トリメチルヘキサノイル)パーオキサイドの発生ラジカル換算のモル数の２倍以上である請求項７記載の回路接続材料。The circuit connection material according to claim 7, wherein the number of moles of the functional group of the secondary thiol compound is at least twice the number of moles in terms of the generated radical of the di (3,5,5-trimethylhexanoyl) peroxide. 前記ジ(３，５，５−トリメチルヘキサノイル)パーオキサイドの発生ラジカル換算のモル数が、前記ラジカル重合性化合物の官能基のモル数の０．２倍以上である請求項７記載の回路接続材料。The circuit connection according to claim 7, wherein the number of moles of the generated radical equivalent of the di (3,5,5-trimethylhexanoyl) peroxide is 0.2 times or more the number of moles of the functional group of the radical polymerizable compound. material. 前記所定温度が、９０℃以上１２０℃以下である請求項６に記載の回路接続材料。The circuit connection material according to claim 6, wherein the predetermined temperature is 90 ° C. or higher and 120 ° C. or lower. 第１の回路部材と第２の回路部材とを、請求項６から１０のいずれかに記載の回路接続材料の硬化物を介して異方性導電接続させた、接続構造体。A connection structure in which the first circuit member and the second circuit member are anisotropically conductively connected through the cured product of the circuit connection material according to claim 6.