JP2015088575A - Heat insulation sheet and thermal insulation structure using the same - Google Patents
Heat insulation sheet and thermal insulation structure using the same Download PDFInfo
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- JP2015088575A JP2015088575A JP2013224939A JP2013224939A JP2015088575A JP 2015088575 A JP2015088575 A JP 2015088575A JP 2013224939 A JP2013224939 A JP 2013224939A JP 2013224939 A JP2013224939 A JP 2013224939A JP 2015088575 A JP2015088575 A JP 2015088575A
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Abstract
Description
本発明は、ノート型パーソナルコンピュータ、タブレット端末等に用いられる熱対策シートに関するものである。 The present invention relates to a heat countermeasure sheet used for notebook personal computers, tablet terminals, and the like.
近年スマートフォン、タブレット、ノートＰＣ 等の携帯機器のさらなる高性能化に伴い、機器の中での発熱量は非常に大きくなってきている。この発熱量が大きくなると次の２つの課題が発生してくる。まず第１の課題としてこの機器に用いられる半導体素子の温度が仕様温度を超えると正常に動作しなくなるため、その処理速度を落とさざるを得なくなる。さらに第２の課題として、筐体の温度が上がると、使用する人に不快感を与えたり、火傷を引き起こす可能性がある。そのため、図３のように、基板２に実装した発熱部品１に熱拡散シート４を接触させ、筐体３のほうに熱を逃がすような構成が提案されている。 In recent years, the amount of heat generated in devices has become very large as mobile devices such as smartphones, tablets, and notebook computers become more sophisticated. When this calorific value increases, the following two problems arise. First, as a first problem, when the temperature of a semiconductor element used in this device exceeds a specified temperature, the semiconductor device does not operate normally, and the processing speed must be reduced. Further, as a second problem, when the temperature of the housing rises, there is a possibility that the user may feel uncomfortable or cause burns. Therefore, as shown in FIG. 3, a configuration has been proposed in which the heat diffusion sheet 4 is brought into contact with the heat generating component 1 mounted on the substrate 2 and heat is released to the housing 3.
なお、この出願の発明に関連する先行技術文献情報としては、例えば、特許文献１が知られている。 As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
しかし従来例の構成においては、筐体３が金属もしくはその合金からなる場合において、筐体の温度を下げる効果がほとんどない。 However, in the configuration of the conventional example, when the housing 3 is made of metal or an alloy thereof, there is almost no effect of lowering the temperature of the housing.
上記従来の構成では、表面の温度が局所的に高くなることはある程度防止できるが、発熱量が多いと、表面の温度が上がってくるため、使用する人に不快感を与えたり、火傷を引き起こす可能性がでてくる。 With the above conventional configuration, it is possible to prevent the surface temperature from becoming locally high to some extent, but if the amount of heat generated is large, the surface temperature will rise, causing discomfort to the user and causing burns. The possibility comes out.
本発明はこの課題に対して、発熱部品の温度が上がり過ぎるのを防ぐとともに、筐体の温度も上がり過ぎないようにすることができる熱対策シートを提供することを目的とする。 An object of the present invention is to provide a thermal countermeasure sheet that can prevent the temperature of a heat-generating component from excessively increasing and prevent the temperature of a casing from excessively increasing.
本発明は上記課題を解決するために、熱伝導率が０．１Ｗ／ｍＫより大きく０．３Ｗ／ｍＫより小さく、厚さが０．２ｍｍ以上０．８ｍｍ以下の低熱伝導シートを、グラファイトシートに貼りあわせた構成としたものである。 In order to solve the above-mentioned problems, the present invention provides a low thermal conductive sheet having a thermal conductivity of greater than 0.1 W / mK and smaller than 0.3 W / mK and a thickness of 0.2 mm or more and 0.8 mm or less as a graphite sheet. This is a laminated structure.
上記構成により、発熱部品の温度の上昇を抑えながら、筐体表面の温度が部分的に上昇することを防ぐことができる熱対策シートを得ることができる。 With the above configuration, it is possible to obtain a heat countermeasure sheet that can prevent the temperature of the casing surface from partially rising while suppressing the temperature rise of the heat generating component.
以下、本発明の一実施の形態における熱対策シートについて、図面を参照しながら説明する。 Hereinafter, a thermal countermeasure sheet according to an embodiment of the present invention will be described with reference to the drawings.
図１は本発明の一実施の形態における熱対策シートを用いた電子機器の断面図である。ＩＣ等の発熱部品１１を実装した基板１２を筐体１３に収納したものであって、発熱部品１１と対向する位置の筐体１３の内側の間に、熱対策シート１４が設けられている。この熱対策シート１４は、グラファイトシート１５に低熱伝導シート１６が貼りあわされたものであり、グラファイトシート側を発熱部品１１と当接させることにより、発熱部品１１と熱的に接続されたものとなっている。 FIG. 1 is a cross-sectional view of an electronic device using a heat countermeasure sheet according to an embodiment of the present invention. A substrate 12 on which a heat generating component 11 such as an IC is mounted is housed in a housing 13, and a heat countermeasure sheet 14 is provided between the inside of the housing 13 at a position facing the heat generating component 11. This heat countermeasure sheet 14 is obtained by pasting a low thermal conductive sheet 16 on a graphite sheet 15 and is thermally connected to the heat generating component 11 by bringing the graphite sheet side into contact with the heat generating component 11. It has become.
この低熱伝導シート１６は、エポキシ樹脂からなり、その熱伝導率は約０．２Ｗ／ｍＫとなっており、その厚さは約０．５ｍｍのものを用いている。またグラファイトシート１５は、厚さ約２５μｍの熱分解グラファイトシートを用い、その面方向の熱伝導率は約１６００Ｗ／ｍＫとなっている。さらに筐体１３は、アルミニウム合金を用い、その熱伝導率は約１００Ｗ／ｍＫとなっている。 The low thermal conductive sheet 16 is made of an epoxy resin, has a thermal conductivity of about 0.2 W / mK, and has a thickness of about 0.5 mm. The graphite sheet 15 is a pyrolytic graphite sheet having a thickness of about 25 μm, and the thermal conductivity in the plane direction is about 1600 W / mK. Furthermore, the housing 13 uses an aluminum alloy, and its thermal conductivity is about 100 W / mK.
このように構成することにより、発熱部品１１で発生した熱はグラファイトシート１５に伝わり、その面方向に拡散され、発熱部品１１の温度が上がりすぎるのを防ぐことができる。しかしながら、特に筐体１３に熱伝導率の高い金属製の材料を用い、グラファイトシート１５と筐体１３が熱的に直接接続された状態となると、熱はそのまま筐体の方に伝わってしまい、発熱部品１１の温度は下がるものの、今度は筐体１３の温度が大きく上昇してしまう。 By configuring in this way, the heat generated in the heat generating component 11 is transmitted to the graphite sheet 15 and is diffused in the surface direction, so that the temperature of the heat generating component 11 can be prevented from being excessively increased. However, when a metal material having a high thermal conductivity is used for the housing 13 and the graphite sheet 15 and the housing 13 are in a state of being directly thermally connected, the heat is transferred to the housing as it is, Although the temperature of the heat generating component 11 is lowered, the temperature of the housing 13 is greatly increased this time.
これに対して本実施の形態のように、グラファイトシート１５と筐体１３との間に低熱伝導シート１６を挟むことにより、発熱部品１１で発生した熱がそのまま筐体１３に伝わることを防ぎ、筐体１３の温度が上昇しすぎることを防ぐことができる。 On the other hand, by sandwiching the low thermal conductive sheet 16 between the graphite sheet 15 and the casing 13 as in the present embodiment, the heat generated in the heat generating component 11 is prevented from being transmitted to the casing 13 as it is, It can prevent that the temperature of the housing | casing 13 rises too much.
図２は、この低熱伝導シートについて、厚さを変えたときの発熱部品１１および筐体１３の温度についてグラフ化したものである。発熱部品１１の温度は、低熱伝導シート１６の厚さにほぼ比例して温度が上昇する。一方筐体１３の温度は、低熱伝導シート１６の厚さが薄くなるのにしたがって上昇し、０．２ｍｍより薄くなると急激に高くなってくる。そこで低熱伝導シート１６の厚さを０．２ｍｍ以上とすることで、発熱部品１１の温度の上昇を抑えながら、筐体１３表面の温度が部分的に上昇することを防ぐことができる。また低熱伝導シート１６の厚さが０．８ｍｍを超えると、たいていの場合において携帯機器の隙間に収まらない厚みとなるため、低熱伝導シート１６の厚さを０．２ｍｍ以上０．８ｍｍ以下とすることが望ましい。 FIG. 2 is a graph of the temperature of the heat generating component 11 and the housing 13 when the thickness of the low thermal conductive sheet is changed. The temperature of the heat generating component 11 rises almost in proportion to the thickness of the low thermal conductive sheet 16. On the other hand, the temperature of the housing 13 increases as the thickness of the low thermal conductive sheet 16 becomes thinner, and rapidly increases when the thickness becomes thinner than 0.2 mm. Therefore, by setting the thickness of the low thermal conductive sheet 16 to 0.2 mm or more, it is possible to prevent the temperature of the surface of the housing 13 from partially rising while suppressing an increase in the temperature of the heat generating component 11. If the thickness of the low thermal conductive sheet 16 exceeds 0.8 mm, the thickness of the low thermal conductive sheet 16 will not fit in the gaps of portable devices in most cases, so the thickness of the low thermal conductive sheet 16 is 0.2 mm or more and 0.8 mm or less. It is desirable.
また低熱伝導シート１６の熱伝導率は、大きすぎると熱はそのまま筐体１３の方に伝わりやすくなり、この低熱伝導シート１６の効果が出にくくなる。また小さすぎると発熱部品１１から出た熱の行き場がなくなり、発熱部品１１の温度が高くなりすぎる。そのため低熱伝導シート１６の熱伝導率を０．１Ｗ／ｍＫより大きく０．３Ｗ／ｍＫより小さくすることが望ましい。 On the other hand, if the thermal conductivity of the low thermal conductive sheet 16 is too large, the heat is easily transmitted to the housing 13 as it is, and the effect of the low thermal conductive sheet 16 becomes difficult. On the other hand, if it is too small, there is no place for the heat generated from the heat generating component 11, and the temperature of the heat generating component 11 becomes too high. Therefore, it is desirable that the thermal conductivity of the low thermal conductive sheet 16 is larger than 0.1 W / mK and smaller than 0.3 W / mK.
なお、本実施の形態では、グラファイトシートと発熱部品とが直接接するようになっているが、グラファイトシートの表面にポリエチレンテレフタレート等の保護膜を形成し、この保護膜を介してグラファイトシートと発熱部品とを熱的に接続してもかまわない。但し、厚さ方向の熱抵抗が、低熱伝導シートよりも保護膜の方が小さくなるようにすることが望ましい。 In this embodiment, the graphite sheet and the heat generating component are in direct contact with each other, but a protective film such as polyethylene terephthalate is formed on the surface of the graphite sheet, and the graphite sheet and the heat generating component are interposed through this protective film. And may be thermally connected. However, it is desirable that the thermal resistance in the thickness direction be smaller in the protective film than in the low thermal conductive sheet.
本発明に係る熱対策シートは、発熱部品の温度の上昇を抑えながら、筐体表面の温度が部分的に上昇することを防ぐことができ、産業上有用である。 The heat countermeasure sheet according to the present invention is industrially useful because it can prevent the temperature of the housing surface from partially rising while suppressing the temperature rise of the heat-generating component.
１１ 発熱部品
１２ 基板
１３ 筐体
１４ 熱対策シート
１５ グラファイトシート
１６ 低熱伝導シート
DESCRIPTION OF SYMBOLS 11 Heat-generating component 12 Board | substrate 13 Case 14 Thermal countermeasure sheet 15 Graphite sheet 16 Low heat conductive sheet
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| Application Number | Priority Date | Filing Date | Title |
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| JP2013224939A JP2015088575A (en) | 2013-10-30 | 2013-10-30 | Heat insulation sheet and thermal insulation structure using the same |
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| Application Number | Priority Date | Filing Date | Title |
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| JP2013224939A JP2015088575A (en) | 2013-10-30 | 2013-10-30 | Heat insulation sheet and thermal insulation structure using the same |
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| JP2015088575A true JP2015088575A (en) | 2015-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2013224939A Pending JP2015088575A (en) | 2013-10-30 | 2013-10-30 | Heat insulation sheet and thermal insulation structure using the same |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017071404A (en) * | 2015-10-05 | 2017-04-13 | 株式会社カネカ | Graphite sheet packing body |
| CN106659079A (en) * | 2016-12-23 | 2017-05-10 | 努比亚技术有限公司 | Composite heat dissipation film and mobile terminal |
| JP2018014428A (en) * | 2016-07-21 | 2018-01-25 | レノボ・シンガポール・プライベート・リミテッド | Electronic device |
| US11923264B2 (en) | 2019-09-20 | 2024-03-05 | Samsung Electronics Co., Ltd. | Semiconductor apparatus for discharging heat |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000106495A (en) * | 1998-09-29 | 2000-04-11 | Kitagawa Ind Co Ltd | Inner structure of electric/electronic apparatus |
| JP2010251386A (en) * | 2009-04-10 | 2010-11-04 | Nec Corp | Electronic apparatus with thermal diffusion member, method of manufacturing electronic apparatus with thermal diffusion member, and thermal diffusion member |
| JP2012151196A (en) * | 2011-01-18 | 2012-08-09 | Panasonic Corp | Thermal insulation sheet |
| JP2013128034A (en) * | 2011-12-19 | 2013-06-27 | Seiwa Electric Mfg Co Ltd | Heat countermeasure sheet |
| WO2013158976A1 (en) * | 2012-04-19 | 2013-10-24 | 3M Innovative Properties Company | Heat reduction sheet |
-
2013
- 2013-10-30 JP JP2013224939A patent/JP2015088575A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000106495A (en) * | 1998-09-29 | 2000-04-11 | Kitagawa Ind Co Ltd | Inner structure of electric/electronic apparatus |
| JP2010251386A (en) * | 2009-04-10 | 2010-11-04 | Nec Corp | Electronic apparatus with thermal diffusion member, method of manufacturing electronic apparatus with thermal diffusion member, and thermal diffusion member |
| JP2012151196A (en) * | 2011-01-18 | 2012-08-09 | Panasonic Corp | Thermal insulation sheet |
| JP2013128034A (en) * | 2011-12-19 | 2013-06-27 | Seiwa Electric Mfg Co Ltd | Heat countermeasure sheet |
| WO2013158976A1 (en) * | 2012-04-19 | 2013-10-24 | 3M Innovative Properties Company | Heat reduction sheet |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017071404A (en) * | 2015-10-05 | 2017-04-13 | 株式会社カネカ | Graphite sheet packing body |
| JP2018014428A (en) * | 2016-07-21 | 2018-01-25 | レノボ・シンガポール・プライベート・リミテッド | Electronic device |
| CN106659079A (en) * | 2016-12-23 | 2017-05-10 | 努比亚技术有限公司 | Composite heat dissipation film and mobile terminal |
| US11923264B2 (en) | 2019-09-20 | 2024-03-05 | Samsung Electronics Co., Ltd. | Semiconductor apparatus for discharging heat |
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