JP2015029005A - Dielectric film and film capacitor - Google Patents
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Abstract
Description
本発明は、誘電体フィルムおよびこれを用いたフィルムコンデンサに関する。 The present invention relates to a dielectric film and a film capacitor using the dielectric film.
フィルムコンデンサは、例えば、ポリプロピレン樹脂をフィルム化した誘電体フィルムの表面に蒸着によって形成された金属膜を電極として有している。このような構成により、誘電体フィルムの絶縁欠陥部で短絡が生じた場合にも、短絡のエネルギーで欠陥部周辺の金属膜が蒸発、飛散して絶縁化し、フィルムコンデンサの絶縁破壊を防止できるという利点を有している（例えば、特許文献１を参照）。 The film capacitor has, for example, a metal film formed by vapor deposition on the surface of a dielectric film obtained by filming a polypropylene resin as an electrode. With such a configuration, even when a short-circuit occurs in an insulation defect portion of the dielectric film, the metal film around the defect portion is evaporated and scattered by the short-circuit energy to insulate and prevent dielectric breakdown of the film capacitor. It has an advantage (see, for example, Patent Document 1).
このため、フィルムコンデンサは電気回路が短絡した際の発火や感電を防止することができるという点が注目され、近年、ＬＥＤ（Light Emitting Diode）照明等の電源回路への適用を始め、用途が拡大しつつある（例えば、特許文献２を参照）。 For this reason, film capacitors are attracting attention because they can prevent ignition and electric shock when electrical circuits are short-circuited, and in recent years, they have been applied to power supply circuits such as LED (Light Emitting Diode) lighting, and their use has expanded. (For example, see Patent Document 2).
また、フィルムコンデンサについても、他の電子部品と同様、小型化の要求がますます高まってきており、誘電体フィルムを薄層化する試みが行われている。ところが、誘電体フィルムを薄層化すると、誘電体フィルムの表面の凹凸が小さくなり、より平滑になってくるために、誘電体フィルムの表面に電極層として形成される金属膜との密着性が低下してしまうという問題がある。 In addition, as with other electronic components, there is an increasing demand for miniaturization of film capacitors, and attempts have been made to make dielectric films thinner. However, when the dielectric film is thinned, the unevenness of the surface of the dielectric film becomes smaller and smoother, so that the adhesion with the metal film formed as an electrode layer on the surface of the dielectric film is improved. There is a problem that it falls.
本発明は上記課題に鑑みなされたものであり、金属膜との密着性の高い誘電体フィルムと、それを用いたフィルムコンデンサを提供することを目的とする。 This invention is made | formed in view of the said subject, and aims at providing a dielectric film with high adhesiveness with a metal film, and a film capacitor using the same.
本発明の誘電体フィルムは、有機樹脂シートの表面に、セラミック粒子が略線状に連なった粒子群が５００μｍ以内の間隔で点在していることを特徴とする。 The dielectric film of the present invention is characterized in that a group of particles in which ceramic particles are connected in a substantially linear manner are scattered on the surface of an organic resin sheet at intervals of 500 μm or less.
本発明のフィルムコンデンサは、上記誘電体フィルムの表面に導体層を有していることを特徴とする。 The film capacitor of the present invention is characterized by having a conductor layer on the surface of the dielectric film.
本発明によれば、金属膜との密着性の高い誘電体フィルムと、それを用いたフィルムコンデンサを得ることができる。 ADVANTAGE OF THE INVENTION According to this invention, a dielectric film with high adhesiveness with a metal film and a film capacitor using the same can be obtained.
図１（ａ）は、本発明の誘電体フィルムの一実施形態を部分的に示す外観斜視図であり、（ｂ）は、（ａ）のＡ−Ａ断面図である。 Fig.1 (a) is an external appearance perspective view which partially shows one Embodiment of the dielectric film of this invention, (b) is AA sectional drawing of (a).
本実施形態の誘電体フィルム１は、有機樹脂シート３の表面に、セラミック粒子５ａが略線状に連なった粒子群５が５００μｍ以内の間隔で点在している構成となっている。 The dielectric film 1 of the present embodiment has a configuration in which the particle groups 5 in which the ceramic particles 5a are connected in a substantially linear shape are scattered on the surface of the organic resin sheet 3 at intervals of 500 μm or less.
本実施形態の誘電体フィルム１によれば、有機樹脂シート３の表面に、セラミック粒子５ａが略線状に連なった粒子群５が５００μｍ以内の間隔で点在しているため、有機樹脂シート３と、その表面に電極層として形成される金属膜との密着性を高めることができる。これは金属膜とセラミック粒子５ａとの間の密着力の方が金属膜と有機樹脂シート３との間の密着力よりも高いことによる。 According to the dielectric film 1 of the present embodiment, the organic resin sheet 3 is scattered on the surface of the organic resin sheet 3 at intervals of 500 μm or less in which the particle groups 5 in which the ceramic particles 5a are connected in a substantially linear shape. And the adhesiveness with the metal film formed as an electrode layer on the surface can be improved. This is because the adhesion between the metal film and the ceramic particles 5 a is higher than the adhesion between the metal film and the organic resin sheet 3.
これに対し、有機樹脂シート３の表面における、粒子群５の間隔（この場合、セラミック粒子５ａの最近接距離）が５００μｍを超えるような場合には、強固に接着する箇所の間隔が広くなることから、金属膜と有機樹脂シート３との間に隙間が形成されやすくなるため、有機樹脂シート３と金属膜との間の密着力が低下してしまう。 On the other hand, when the distance between the particle groups 5 on the surface of the organic resin sheet 3 (in this case, the closest distance of the ceramic particles 5a) exceeds 500 μm, the distance between the places to be firmly bonded becomes wide. Therefore, a gap is easily formed between the metal film and the organic resin sheet 3, so that the adhesion between the organic resin sheet 3 and the metal film is reduced.
また、セラミック粒子５ａが略線状に連なった状態ではなく、例えば、面状に広がったような形状の場合には、有機樹脂シート３がセラミック粒子５ａの粒子群５に拘束され、変形しにくくなり、このような場合にも金属膜が剥がれやすくなる。 In addition, when the ceramic particles 5a are not in a substantially linear state, for example, in a shape that spreads in a planar shape, the organic resin sheet 3 is restrained by the particle groups 5 of the ceramic particles 5a and is not easily deformed. In such a case, the metal film is easily peeled off.
このためにも有機樹脂シート３の表面に形成されるセラミック粒子５ａの粒子群５は略線状に連なった状態であるのが良い。 For this purpose, the particle group 5 of the ceramic particles 5a formed on the surface of the organic resin sheet 3 is preferably in a substantially linear state.
なお、粒子群５の間隔は、粒子群５が密に配置されたときの有機樹脂シート３への拘束力を低く抑えることができという理由から５０μｍ以上離れていることが望ましい。 The interval between the particle groups 5 is desirably 50 μm or more because the binding force to the organic resin sheet 3 when the particle groups 5 are densely arranged can be kept low.
とりわけ、本実施形態の誘電体フィルム１においては、粒子群５を平面視したときに、その形状がＹ字状であり、該Ｙ字状の粒子群５が多角形状を形成するように配置されていることが望ましい。 In particular, in the dielectric film 1 of the present embodiment, when the particle group 5 is viewed in plan, the shape is Y-shaped, and the Y-shaped particle group 5 is arranged to form a polygonal shape. It is desirable that
略線状の粒子群が多角形状など所定の平面形状を為す配置になっていると、多角形状の内側領域にセラミック粒子３が存在しないため、粒子群５が密に配置されたときにも有機樹脂シート３への拘束力を低く抑えることができ、これにより有機樹脂シート３の巻回を可能にできる。また、金属膜と強力に接着する部分が周期的となるため、局部的に密着力の低い部分が形成されにくくなり、有機樹脂シート３と金属膜の密着力を安定化させることが可能になる。このような粒子群５の形状としては、形状の対称性が高く、異方性が小さいという点で、四角形状または六角形状であることが望ましい。 When the substantially linear particle groups are arranged to form a predetermined planar shape such as a polygonal shape, the ceramic particles 3 do not exist in the inner region of the polygonal shape, so that even when the particle groups 5 are densely arranged, the organic particles are organic. The restraining force on the resin sheet 3 can be kept low, whereby the organic resin sheet 3 can be wound. In addition, since the portion that strongly adheres to the metal film becomes periodic, it becomes difficult to form a portion having a low adhesion force locally, and the adhesion force between the organic resin sheet 3 and the metal film can be stabilized. . The shape of the particle group 5 is preferably a quadrangular shape or a hexagonal shape in that the shape is highly symmetric and the anisotropy is small.
この場合、粒子群５を平面視したときの形状は、Ｙ字状だけに限らず、Ｖ字状であっても良く、その平面形状が四角形状であってもよい。 In this case, the shape of the particle group 5 when viewed in plan is not limited to the Y shape, but may be a V shape, and the planar shape may be a square shape.
この場合、本実施形態の誘電体フィルム１を構成するセラミック粒子５ａの粒子群５を形成するのに好適なセラミック粒子３のサイズ（平均粒径）としては、セラミック粒子５ａの凝集の低減やセラミック粒子５ａ同士が当接したときに変形しやすくなるという理由から１０〜２００ｎｍであることが望ましい。 In this case, as the size (average particle diameter) of the ceramic particles 3 suitable for forming the particle group 5 of the ceramic particles 5a constituting the dielectric film 1 of the present embodiment, reduction of aggregation of the ceramic particles 5a or ceramic It is desirable that the thickness is 10 to 200 nm because the particles 5a are easily deformed when they are in contact with each other.
また、本実施形態の誘電体フィルムでは、セラミック粒子３の割合は１〜１０体積％、
特に、２〜７体積％であることが望ましい。
Moreover, in the dielectric film of this embodiment, the ratio of the ceramic particles 3 is 1 to 10% by volume,
In particular, the content is desirably 2 to 7% by volume.
上記した構成を有する誘電体フィルム１としては、その平均厚みが３μｍ、特には、２μｍといった薄層化したものに好適であり、また、有機樹脂シート３の表面粗さ（Ｒａ）についても５０ｎｍ以下、特に、１０ｎｍ以下と平滑な表面を有するものに好適である。 The dielectric film 1 having the above configuration is suitable for a thin film having an average thickness of 3 μm, particularly 2 μm, and the surface roughness (Ra) of the organic resin sheet 3 is also 50 nm or less. In particular, it is suitable for those having a smooth surface of 10 nm or less.
ここで、略線状とは、セラミック粒子５ａがネック部を介してほぼ直線状に並んでいる状態のことを言う。この場合、略線状の粒子群５がＹ字状やＶ字状となっているものも含む意味である。なお、セラミック粒子５ａが当接したネック部にも有機樹脂シート３の成分が存在していてもよい。 Here, the term “substantially linear” means a state in which the ceramic particles 5a are arranged in a substantially straight line through the neck portion. In this case, it is meant to include those in which the substantially linear particle group 5 is Y-shaped or V-shaped. In addition, the component of the organic resin sheet 3 may exist also in the neck part which the ceramic particle 5a contact | abutted.
本実施形態の誘電体フィルム１において、有機樹脂シート３の表面に存在しているセラミック粒子３は、その一部が露出していれば良い。セラミック粒子５ａの露出した部分以外の部分が有機樹脂シート３に埋設された状態であると、セラミック粒子５ａの有機樹脂シート３からの欠落を抑制することができる。この場合、金属膜とセラミック粒子３との間の密着力を高められるという理由から、有機樹脂シート３の表面に露出したセラミック粒子５ａの表面には表面改質剤などが塗られていない方が望ましい。 In the dielectric film 1 of the present embodiment, the ceramic particles 3 present on the surface of the organic resin sheet 3 may be partially exposed. When the portion other than the exposed portion of the ceramic particles 5a is embedded in the organic resin sheet 3, the lack of the ceramic particles 5a from the organic resin sheet 3 can be suppressed. In this case, the surface of the ceramic particles 5a exposed on the surface of the organic resin sheet 3 is not coated with a surface modifier or the like because the adhesion between the metal film and the ceramic particles 3 can be increased. desirable.
有機樹脂シート３の表面に露出したセラミック粒子５ａの粒子群５の状態の確認は、例えば、フィルムコンデンサの誘電体フィルム１から化学的方法あるいは物理的方法によって電極層を除いた後の表面を走査型電子顕微鏡などの分析装置を用いて行う。 The state of the particle group 5 of the ceramic particles 5a exposed on the surface of the organic resin sheet 3 is confirmed by, for example, scanning the surface after removing the electrode layer from the dielectric film 1 of the film capacitor by a chemical method or a physical method. Using an analyzer such as a scanning electron microscope.
図２は、（ａ）は、誘電体フィルムの両面に電極層（金属膜）を有する構造を模式的に示す断面図であり、（ｂ）は、本発明のフィルムコンデンサの一実施形態を示す外観斜視図である。 2A is a cross-sectional view schematically showing a structure having electrode layers (metal films) on both surfaces of a dielectric film, and FIG. 2B shows an embodiment of the film capacitor of the present invention. It is an external perspective view.
上述した誘電体フィルム１を具備する本実施形態のフィルムコンデンサは、誘電体フィルム１の両面に電極層１１を備えている構成を基本構造とする本体部１３により構成されている。この本体部１３は、矩形状の誘電体フィルム１と電極層１１とが交互に積層された積層型のフィルムコンデンサの他に、長尺状の誘電体フィルム１と電極層１１とが巻回された構造の巻回型のフィルムコンデンサにも適用することができる。これらのフィルムコンデンサは外部電極１４に端子としてさらにリード線１５を有していても良いが、フィルムコンデンサの小型化という点でリード線１５を有しない構造が望ましい。また、コンデンサ本体１３、外部電極１４およびリード線１５の一部は絶縁性および耐環境の点から外装部材１６に覆われていてもよい。 The film capacitor of the present embodiment including the dielectric film 1 described above is constituted by a main body 13 having a basic structure in which the electrode layers 11 are provided on both surfaces of the dielectric film 1. The main body 13 is formed by winding the long dielectric film 1 and the electrode layer 11 in addition to the laminated film capacitor in which the rectangular dielectric films 1 and the electrode layers 11 are alternately laminated. The present invention can also be applied to a wound film capacitor having a different structure. These film capacitors may further have a lead wire 15 as a terminal on the external electrode 14, but a structure without the lead wire 15 is desirable in terms of miniaturization of the film capacitor. Further, a part of the capacitor body 13, the external electrode 14, and the lead wire 15 may be covered with the exterior member 16 in terms of insulation and environment resistance.
次に、本実施形態のフィルムコンデンサは、例えば、以下に示すような製造方法によって得ることができる。まず、誘電体フィルム１の母材となる有機樹脂を用意する。 Next, the film capacitor of this embodiment can be obtained, for example, by a manufacturing method as shown below. First, an organic resin that serves as a base material for the dielectric film 1 is prepared.
有機樹脂としては、ポリエチレンテレフタレート（ＰＥＴ）、ポリプロピレン（ＰＰ）、ポリフェニレンサルファイド（ＰＰＳ）、ポリエチレンナフタレート（ＰＥＮ）およびシクロオレフィンポリマー（ＣＯＰ）、などが好適である。 As the organic resin, polyethylene terephthalate (PET), polypropylene (PP), polyphenylene sulfide (PPS), polyethylene naphthalate (PEN), cycloolefin polymer (COP), and the like are suitable.
これらの有機樹脂の室温（約２５℃）における比誘電率（ε）は、例えば、ポリエチレンテレフタレート（ＰＥＴ）が３．３、ポリプロピレン（ＰＰ）が２．３、ポリフェニレンサルファイド（ＰＰＳ）が３．０、シクロオレフィンポリマー（ＣＯＰ）が２．２〜３．０である。 The relative dielectric constant (ε) of these organic resins at room temperature (about 25 ° C.) is, for example, 3.3 for polyethylene terephthalate (PET), 2.3 for polypropylene (PP), and 3.0 for polyphenylene sulfide (PPS). The cycloolefin polymer (COP) is 2.2 to 3.0.
また、これらの有機樹脂の室温（約２５℃）における破壊電界強度（Ｅ）は、例えば、ポリエチレンテレフタレート（ＰＥＴ）が３１０（Ｖ／μｍ）、ポリプロピレン（ＰＰ）
が３８０（Ｖ／μｍ）、ポリフェニレンサルファイド（ＰＰＳ）が２１０（Ｖ／μｍ）、シクロオレフィンポリマー（ＣＯＰ）が３７０〜５１０（Ｖ／μｍ）である。
The breakdown electric field strength (E) of these organic resins at room temperature (about 25 ° C.) is, for example, 310 (V / μm) for polyethylene terephthalate (PET), polypropylene (PP)
Is 380 (V / μm), polyphenylene sulfide (PPS) is 210 (V / μm), and cycloolefin polymer (COP) is 370 to 510 (V / μm).
セラミック粒子３としては、アルミナ、酸化チタン、酸化珪素などの他にペロブスカイト型構造の複合酸化物などを適用できる。セラミック粒子３と有機樹脂５との相溶性を高める上で、セラミック粒子３にシランカップリング処理やチタネートカップリング処理等の表面処理を行っても良い。 As the ceramic particles 3, a composite oxide having a perovskite structure can be applied in addition to alumina, titanium oxide, silicon oxide, and the like. In order to enhance the compatibility between the ceramic particles 3 and the organic resin 5, the ceramic particles 3 may be subjected to a surface treatment such as a silane coupling treatment or a titanate coupling treatment.
誘電体フィルム１を形成する場合、例えば、基材としてＰＥＴ製のフィルムを適用し、この表面に、セラミック粒子５ａを含む有機樹脂シート３を形成することにより、誘電体フィルム１を得ることができる。この場合、誘電体フィルム１となるスラリーの粘度および膜厚を調整し、マランゴニ対流を発生させることにより本実施形態の誘電体フィルム１を得ることができる。この場合、マランゴニ数を８０以上とすることで、誘電体フィルムの製膜時に、対流が発生し、セラミック粒子５ａが集合して、セラミック粒子５ａが略線状に連なった粒子群が５００μｍ以内の間隔で点在している構成とすることができる。 When forming the dielectric film 1, for example, a film made of PET is applied as a base material, and the dielectric film 1 can be obtained by forming the organic resin sheet 3 including the ceramic particles 5a on the surface. . In this case, the dielectric film 1 of this embodiment can be obtained by adjusting the viscosity and film thickness of the slurry to be the dielectric film 1 and generating Marangoni convection. In this case, by setting the Marangoni number to 80 or more, convection occurs during the formation of the dielectric film, and the ceramic particles 5a are aggregated, and the particle group in which the ceramic particles 5a are connected in a substantially linear shape is within 500 μm. It can be set as the structure scattered at intervals.
成膜には、ドクターブレード法、ダイコータ法およびナイフコータ法等から選ばれる一種の成形法を用いる。なお、マランゴニ数は、以下の式によって定義される値である。Ｍ＝ｔ／（μｋ）＊（｜ｄσ／ｄT｜）＊ΔT、｛Ｍ：マランゴニ数、ｔ：膜厚（ｍ）、μ（粘度（Ｎ・ｓ／ｍ２）、ｋ：熱伝導率（Ｗ／ｍ・Ｋ）、（｜ｄσ／ｄT｜）：表面張力の
温度勾配（Ｎ／ｍ・Ｋ）、ΔＴ：塗膜の表面と裏面の温度差（Ｋ）｝ここで、熱伝導率は便宜上、有機樹脂の熱伝導率（０．１〜０．５Ｗ／ｍ・Ｋ）を適用し、他に、表面張力の温度勾配（Ｎ／ｍ・Ｋ）、ΔＴ：塗膜の表面と裏面の温度差（Ｋ）は適宜規定する。
For film formation, a kind of molding method selected from a doctor blade method, a die coater method, a knife coater method and the like is used. The Marangoni number is a value defined by the following equation. M = t / (μk) * (| dσ / dT |) * ΔT, {M: Marangoni number, t: film thickness (m), μ (viscosity (N · s / m 2 ), k: thermal conductivity ( W / m · K), (| dσ / dT |): temperature gradient of surface tension (N / m · K), ΔT: temperature difference between the front surface and the back surface of the coating film (K)} where the thermal conductivity is For convenience, the thermal conductivity (0.1 to 0.5 W / m · K) of the organic resin is applied, and in addition, the temperature gradient of the surface tension (N / m · K), ΔT: between the surface and the back surface of the coating film The temperature difference (K) is appropriately defined.
成膜に使用する溶剤としては、例えば、メタノール、イソプロパノール、n-ブタノール、エチレングリコール、エチレングリコールモノプロピルエーテル、メチルエチルケトン、メチルイソブチルケトン、キシレン、プロピレングリコールモノメチルエーテル、プロピレングリコールモノメチルエーテルアセテート、ジメチルアセトアミド、シクロヘキサン、又は、これらから選択された２種以上の混合物を含んだ有機溶剤を用いるのがよい。 Examples of the solvent used for film formation include methanol, isopropanol, n-butanol, ethylene glycol, ethylene glycol monopropyl ether, methyl ethyl ketone, methyl isobutyl ketone, xylene, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, dimethylacetamide, It is preferable to use an organic solvent containing cyclohexane or a mixture of two or more selected from these.
次に、誘電体フィルム１の表面にＡｌ（アルミニウム）などの金属成分を蒸着することによって電極層１１を形成し、次いで、電極層１１を形成した誘電体フィルム１０を巻回させてフィルムコンデンサの本体部１３を得る。 Next, the electrode layer 11 is formed by vapor-depositing a metal component such as Al (aluminum) on the surface of the dielectric film 1, and then the dielectric film 10 on which the electrode layer 11 is formed is wound to form a film capacitor. A main body 13 is obtained.
次に、本体部１３の電極層１１が露出した端面に外部電極１４を形成する。外部電極１４の形成には、例えば、金属の溶射、スパッタ法、メッキ法などが好適である。また、ここで、外部電極１４にリード線１５を形成しても良い。次いで、外部電極１４（リード線１５を含む）を形成した本体部１３の表面に外装樹脂１６を形成することによって本実施形態のフィルムコンデンサを得ることができる。 Next, the external electrode 14 is formed on the end surface of the main body 13 where the electrode layer 11 is exposed. For forming the external electrode 14, for example, metal spraying, sputtering, plating, or the like is suitable. Here, the lead wire 15 may be formed on the external electrode 14. Next, the film capacitor of the present embodiment can be obtained by forming the exterior resin 16 on the surface of the main body 13 on which the external electrodes 14 (including the lead wires 15) are formed.
具体的な材料の選択を行って誘電体フィルムを作製し、以下の評価を行った。 A specific material was selected to produce a dielectric film, and the following evaluation was performed.
まず平均粒径が１００ｎｍのアルミナ粒子（比誘電率：９）と、樹脂としてポリシクロオレフィンポリマー（分子量：Ｍｗ＝２００００、比誘電率２．２）を準備した。アルミナには樹脂との相溶性を向上させるためにシランカップリング処理を行った。 First, alumina particles having an average particle diameter of 100 nm (relative dielectric constant: 9) and a polycycloolefin polymer (molecular weight: Mw = 20000, relative dielectric constant: 2.2) as a resin were prepared. Alumina was subjected to silane coupling treatment in order to improve compatibility with the resin.
次に、上記のアルミナ粒子をシクロオレフィンポリマー中に分散させてスラリーを調製した。このときシクロヘキサンを希釈剤として加えた。 Next, a slurry was prepared by dispersing the alumina particles in a cycloolefin polymer. At this time, cyclohexane was added as a diluent.
この後、上記スラリーをコーターを用いてポリエチレンテレフタレート（ＰＥＴ）フィルム上に塗布してシート状に成形した。この時、セラミック凝集部がフィルム内部で連結されるような成膜条件で製膜を行った（例えば、マランゴニ数８０以上）。 Thereafter, the slurry was applied onto a polyethylene terephthalate (PET) film using a coater and formed into a sheet. At this time, the film was formed under film forming conditions such that the ceramic agglomerates were connected inside the film (for example, Marangoni number 80 or more).
作製した誘電体フィルムは、１８０℃で脱溶剤を行った後の平均厚みが２．５μｍであった。 The produced dielectric film had an average thickness of 2.5 μm after solvent removal at 180 ° C.
次に、真空蒸着法により誘電体フィルムの両面に平均厚みが７５ｎｍのＡｌの電極層を形成した。 Next, an Al electrode layer having an average thickness of 75 nm was formed on both surfaces of the dielectric film by vacuum deposition.
スラリの粘度は回転円板型粘度計を用いて室温（２５℃）にて測定した。膜厚は作製した誘電体フィルムの一部を切り取り、１０等分した領域を測定した平均値より求めた。マランゴニ数は測定したスラリ粘度および膜厚を用いて表１に示した式に代入して求めた。このとき熱伝導率、表面張力の温度勾配および塗膜の表面と裏面の温度差は基本的な物性値を用いた。 The viscosity of the slurry was measured at room temperature (25 ° C.) using a rotating disk viscometer. The film thickness was obtained from an average value obtained by measuring a region obtained by cutting out a part of the produced dielectric film and dividing it into 10 equal parts. The Marangoni number was obtained by substituting into the equation shown in Table 1 using the measured slurry viscosity and film thickness. At this time, basic physical property values were used for the thermal conductivity, the temperature gradient of the surface tension, and the temperature difference between the front surface and the back surface of the coating film.
金属膜の密着強度は、クロスカット法（ＪＩＳＫ５６００−５−６）を用いて評価した。カッターを用いて金属膜の表面に２ｍｍ間隔で６本切り込みを入れ、９０°方向を変えて直行する６本の切込みをさらに入れ、格子状とした。７５ｍｍの長さに切り出したセロハンテープを金属膜の格子にカットした部分に貼り、強く圧着させ、その後、テープの端を約６０°の角度で一気に引き剥がした。金属膜の剥離状態をＪＩＳＫ５６００−５−６の０〜５段階の評価方法で評価した。測定試料数は１０個とした。 The adhesion strength of the metal film was evaluated using a cross-cut method (JISK5600-5-6). Using a cutter, 6 cuts were made at intervals of 2 mm on the surface of the metal film, and 6 cuts that were changed perpendicularly by changing the 90 ° direction were made into a lattice shape. A cellophane tape cut out to a length of 75 mm was attached to the cut portion of the metal film lattice and pressed firmly, and then the end of the tape was peeled off at an angle of about 60 °. The peeled state of the metal film was evaluated by the 0-5 grade evaluation method of JISK5600-5-6. The number of measurement samples was 10.
これに対し、マランゴニ数が８０以下の試料（試料Ｎｏ．４）では、有機樹脂シートの
表面にセラミック粒子が略線状に連なった粒子群は形成されず、クロスカット法を用いて剥離処理した時に金属膜に剥がれが見られた(３段階)。また、セラミック粒子を含ませなかった試料（試料Ｎｏ．３）についてもクロスカット法を用いて剥離処理した時に金属膜に剥がれが見られた（５段階）。
On the other hand, in the sample (sample No. 4) having a Marangoni number of 80 or less, a particle group in which ceramic particles are connected in a substantially linear shape is not formed on the surface of the organic resin sheet, and is peeled using a cross-cut method. Sometimes the metal film was peeled off (3 steps). In addition, the sample that did not contain ceramic particles (sample No. 3) was also peeled off when peeled using the cross-cut method (five steps).
１・・・・・・・誘電体フィルム
３・・・・・・・有機樹脂シート
５・・・・・・・粒子群
５ａ・・・・・・セラミック粒子
１１・・・・・・金属膜
１３・・・・・・本体部
１４・・・・・・外部電極
１５・・・・・・リード
１６・・・・・・外装部材
DESCRIPTION OF SYMBOLS 1 ..... Dielectric film 3 .... Organic resin sheet 5 .... Particle group 5a ... Ceramic particles 11 ... Metal film 13 ... Body 14 ... External electrode 15 ... Lead 16 ... Exterior member
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016152800A1 (en) * | 2015-03-26 | 2016-09-29 | 京セラ株式会社 | Film capacitor, connected capacitor, inverter and electric vehicle |
| JPWO2020039638A1 (en) * | 2018-08-20 | 2021-08-10 | 株式会社村田製作所 | Manufacturing method of film capacitors, films for film capacitors, and films for film capacitors |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001006968A (en) * | 1999-06-18 | 2001-01-12 | Mitsubishi Polyester Film Copp | Laminated film for capacitor |
| JP2007332224A (en) * | 2006-06-13 | 2007-12-27 | Nitto Denko Corp | Sheetlike composite material and method for producing the same |
| JP2013175579A (en) * | 2012-02-24 | 2013-09-05 | Kyocera Corp | Capacitor |
| JP2013175658A (en) * | 2012-02-27 | 2013-09-05 | Kyocera Corp | Capacitor |
| JP2013182908A (en) * | 2012-02-29 | 2013-09-12 | Kyocera Corp | Capacitor |
-
2013
- 2013-07-30 JP JP2013157863A patent/JP2015029005A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001006968A (en) * | 1999-06-18 | 2001-01-12 | Mitsubishi Polyester Film Copp | Laminated film for capacitor |
| JP2007332224A (en) * | 2006-06-13 | 2007-12-27 | Nitto Denko Corp | Sheetlike composite material and method for producing the same |
| JP2013175579A (en) * | 2012-02-24 | 2013-09-05 | Kyocera Corp | Capacitor |
| JP2013175658A (en) * | 2012-02-27 | 2013-09-05 | Kyocera Corp | Capacitor |
| JP2013182908A (en) * | 2012-02-29 | 2013-09-12 | Kyocera Corp | Capacitor |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016152800A1 (en) * | 2015-03-26 | 2016-09-29 | 京セラ株式会社 | Film capacitor, connected capacitor, inverter and electric vehicle |
| JPWO2016152800A1 (en) * | 2015-03-26 | 2017-11-30 | 京セラ株式会社 | Film capacitors and connected capacitors, inverters, and electric vehicles |
| JPWO2020039638A1 (en) * | 2018-08-20 | 2021-08-10 | 株式会社村田製作所 | Manufacturing method of film capacitors, films for film capacitors, and films for film capacitors |
| JP7200997B2 (en) | 2018-08-20 | 2023-01-10 | 株式会社村田製作所 | Film capacitor, film for film capacitor, and method for manufacturing film for film capacitor |
| US11710602B2 (en) | 2018-08-20 | 2023-07-25 | Murata Manufacturing Co., Ltd. | Film capacitor, film-capacitor film, and method for manufacturing film-capacitor film |
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