JP2015021172A - スパッタ装置 - Google Patents
スパッタ装置 Download PDFInfo
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- JP2015021172A JP2015021172A JP2013150739A JP2013150739A JP2015021172A JP 2015021172 A JP2015021172 A JP 2015021172A JP 2013150739 A JP2013150739 A JP 2013150739A JP 2013150739 A JP2013150739 A JP 2013150739A JP 2015021172 A JP2015021172 A JP 2015021172A
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- 238000004544 sputter deposition Methods 0.000 title claims abstract description 42
- 230000007246 mechanism Effects 0.000 claims abstract description 68
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 239000013077 target material Substances 0.000 claims abstract description 15
- 239000010408 film Substances 0.000 claims description 123
- 239000000463 material Substances 0.000 claims description 27
- 230000015572 biosynthetic process Effects 0.000 claims description 13
- 239000012530 fluid Substances 0.000 claims description 9
- 239000010409 thin film Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 abstract description 6
- 238000000151 deposition Methods 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 2
- 230000032258 transport Effects 0.000 description 50
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 41
- 239000007789 gas Substances 0.000 description 17
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 238000004804 winding Methods 0.000 description 5
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910001882 dioxygen Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
- H01J37/3277—Continuous moving of continuous material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
【解決手段】真空チャンバー14と、成膜ロール18と、ターゲット材20と、ガス供給機構24と、3個の駆動ロール(下流側搬送ロール)26(1)、26(2)、26(3)と、各駆動ロール26(1)、26(2)、26(3)の温度を、80°C以下で真空チャンバー14内の最低温度よりも高い範囲で、略一定に維持する3個の温度調節機構30(1)、30(2)、30(3)と、を備える。
【選択図】図1
Description
真空チャンバーと、
前記真空チャンバー内に回転可能に配置された前記成膜ロールと、
前記真空チャンバー内に配置され、成膜ロールの表面に沿って搬送される長尺フィルム基材の表面に成膜材料を形成するターゲット材と、
前記成膜ロールと前記ターゲット材との間の成膜空間にガスを供給するガス供給機構と、
前記真空チャンバー内において、前記成膜ロールに対して長尺フィルム基材の搬送方向下流側に配置され、前記成膜ロールの表面に沿って搬送された長尺フィルム基材を該搬送方向下流側へ搬送する複数の下流側搬送ロールと、
前記複数の下流側搬送ロールの中の少なくとも1本の温度を、80°C以下で前記真空チャンバー内の最低温度よりも高い範囲で、略一定に維持する温度調節機構と、
を備えたことを特徴とする。
14:真空チャンバー
16:長尺フィルム基材
18:成膜ロール
20:ターゲット材
22:成膜空間
24:ガス供給機構
26、86:駆動ロール(下流側搬送ロール)
28:ガイドロール(下流側搬送ロール)
30:温度調節機構
32:中空部
34、80:ロータリージョイント
36:巻取ロール
40:原反ロール
42:ガイドロール(上流側搬送ロール)
46:真空ポンプ
48:温水
50:固定部材
52:回転部材
54:入口
56:出口
60:温度計
62:温度調節器
64:流量計
66:可変絞り弁
68:駆動ベルト
70:内管
72、74:タンク
82:入口開口部
84:出口開口部
Claims (6)
- 成膜ロールの表面に沿って搬送される長尺フィルム基材の表面に薄膜を形成するスパッタ装置であり、
真空チャンバーと、
前記真空チャンバー内に回転可能に配置された前記成膜ロールと、
前記真空チャンバー内に配置され、成膜ロールの表面に沿って搬送される長尺フィルム基材の表面に成膜材料を形成するターゲット材と、
前記成膜ロールと前記ターゲット材との間の成膜空間にガスを供給するガス供給機構と、
前記真空チャンバー内において、前記成膜ロールに対して長尺フィルム基材の搬送方向下流側に配置され、前記成膜ロールの表面に沿って搬送された長尺フィルム基材を該搬送方向下流側へ搬送する複数の下流側搬送ロールと、
前記複数の下流側搬送ロールの中の少なくとも1本の温度を、80°C以下で前記真空チャンバー内の最低温度よりも高い範囲で、略一定に維持する温度調節機構と、
を備えたスパッタ装置。 - 前記温度調節機構は、前記複数の下流側搬送ロールの中の2本以上の温度を略一定の各々の温度に維持する請求項1に記載するスパッタ装置。
- 前記温度調節機構により温度を略一定に維持される2本以上の前記下流側搬送ロールは、前記搬送方向下流側へいくに従って、より低温に維持される請求項2に記載するスパッタ装置。
- 前記温度調節機構により温度を略一定に維持される前記下流側搬送ロールが中空部を有し、該温度調節機構は、該中空部内へ略一定温度の流体を送る機構である請求項1〜3のいずれかに記載するスパッタ装置。
- 前記温度調節機構が、前記下流側搬送ロールの前記中空部内へ流体を導くロータリージョイント又はスイベルジョイントを有する請求項4に記載するスパッタ装置。
- 前記温度調節機構により温度を略一定に維持される前記下流側搬送ロールが、駆動手段によって回転する駆動ロールである請求項1〜5のいずれかに記載するスパッタ装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013150739A JP2015021172A (ja) | 2013-07-19 | 2013-07-19 | スパッタ装置 |
KR20140084411A KR20150010594A (ko) | 2013-07-19 | 2014-07-07 | 스퍼터 장치 |
US14/331,406 US20150021177A1 (en) | 2013-07-19 | 2014-07-15 | Sputtering device |
CN201810321536.1A CN108505014B (zh) | 2013-07-19 | 2014-07-16 | 溅射装置 |
CN201410339809.7A CN104294223B (zh) | 2013-07-19 | 2014-07-16 | 溅射装置 |
TW103124436A TWI521079B (zh) | 2013-07-19 | 2014-07-16 | 濺鍍裝置 |
KR1020160068963A KR102062944B1 (ko) | 2013-07-19 | 2016-06-02 | 스퍼터 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013150739A JP2015021172A (ja) | 2013-07-19 | 2013-07-19 | スパッタ装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017148035A Division JP6456439B2 (ja) | 2017-07-31 | 2017-07-31 | スパッタ装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2015021172A true JP2015021172A (ja) | 2015-02-02 |
Family
ID=52314169
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013150739A Pending JP2015021172A (ja) | 2013-07-19 | 2013-07-19 | スパッタ装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20150021177A1 (ja) |
JP (1) | JP2015021172A (ja) |
KR (2) | KR20150010594A (ja) |
CN (2) | CN108505014B (ja) |
TW (1) | TWI521079B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018199169A1 (ja) * | 2017-04-26 | 2018-11-01 | 株式会社アルバック | 成膜装置及び成膜方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6965683B2 (ja) * | 2017-10-17 | 2021-11-10 | 住友金属鉱山株式会社 | キャンロールと長尺基板処理装置 |
JP6953992B2 (ja) * | 2017-10-19 | 2021-10-27 | 住友金属鉱山株式会社 | キャンロールと長尺基板処理装置および長尺基板処理装置の管理方法 |
KR20220035035A (ko) * | 2019-07-11 | 2022-03-21 | 니폰 덴키 가라스 가부시키가이샤 | 유리 롤의 제조 방법 및 제조 장치 |
JP7399643B2 (ja) * | 2019-07-29 | 2023-12-18 | 日東電工株式会社 | 積層ガラスの製造装置および製造方法 |
Citations (6)
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---|---|---|---|---|
JPH0428872A (ja) * | 1990-05-24 | 1992-01-31 | Matsushita Electric Ind Co Ltd | 蒸着装置 |
JPH05131270A (ja) * | 1991-11-08 | 1993-05-28 | Nippon Steel Corp | 真空アーク処理装置 |
JPH11350117A (ja) * | 1998-06-03 | 1999-12-21 | Toppan Printing Co Ltd | 真空成膜装置 |
JP2010007142A (ja) * | 2008-06-27 | 2010-01-14 | Sumitomo Metal Mining Co Ltd | 冷却ロール及び真空処理装置 |
JP2010280943A (ja) * | 2009-06-04 | 2010-12-16 | Sony Corp | 蒸着装置及び蒸着方法 |
JP2013049876A (ja) * | 2011-08-30 | 2013-03-14 | Sumitomo Metal Mining Co Ltd | 長尺ガラスフィルムの処理方法および処理装置 |
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BE705239A (ja) * | 1966-06-15 | 1968-03-01 | ||
US3576664A (en) * | 1968-09-10 | 1971-04-27 | Cornwells Metal Finishing Co I | Method for coating metal strips |
US3840497A (en) * | 1971-12-23 | 1974-10-08 | Allied Chem | Polycaprolactam film for cooking bag |
IT1261918B (it) * | 1993-06-11 | 1996-06-04 | Cetev Cent Tecnolog Vuoto | Struttura per deposizione reattiva di metalli in impianti da vuoto continui e relativo processo. |
CN2232923Y (zh) * | 1995-09-04 | 1996-08-14 | 青州市包装装璜材料厂 | 一种改进的真空镀膜机收卷装置 |
JP4015879B2 (ja) * | 2002-05-10 | 2007-11-28 | 日東電工株式会社 | スパッタリング方法とその装置 |
CN201610446U (zh) * | 2010-02-02 | 2010-10-20 | 深圳市海森应用材料有限公司 | Ito透明导电膜卷绕镀膜机 |
-
2013
- 2013-07-19 JP JP2013150739A patent/JP2015021172A/ja active Pending
-
2014
- 2014-07-07 KR KR20140084411A patent/KR20150010594A/ko active Application Filing
- 2014-07-15 US US14/331,406 patent/US20150021177A1/en not_active Abandoned
- 2014-07-16 CN CN201810321536.1A patent/CN108505014B/zh active Active
- 2014-07-16 CN CN201410339809.7A patent/CN104294223B/zh active Active
- 2014-07-16 TW TW103124436A patent/TWI521079B/zh active
-
2016
- 2016-06-02 KR KR1020160068963A patent/KR102062944B1/ko active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0428872A (ja) * | 1990-05-24 | 1992-01-31 | Matsushita Electric Ind Co Ltd | 蒸着装置 |
JPH05131270A (ja) * | 1991-11-08 | 1993-05-28 | Nippon Steel Corp | 真空アーク処理装置 |
JPH11350117A (ja) * | 1998-06-03 | 1999-12-21 | Toppan Printing Co Ltd | 真空成膜装置 |
JP2010007142A (ja) * | 2008-06-27 | 2010-01-14 | Sumitomo Metal Mining Co Ltd | 冷却ロール及び真空処理装置 |
JP2010280943A (ja) * | 2009-06-04 | 2010-12-16 | Sony Corp | 蒸着装置及び蒸着方法 |
JP2013049876A (ja) * | 2011-08-30 | 2013-03-14 | Sumitomo Metal Mining Co Ltd | 長尺ガラスフィルムの処理方法および処理装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018199169A1 (ja) * | 2017-04-26 | 2018-11-01 | 株式会社アルバック | 成膜装置及び成膜方法 |
JPWO2018199169A1 (ja) * | 2017-04-26 | 2019-06-27 | 株式会社アルバック | 成膜装置及び成膜方法 |
Also Published As
Publication number | Publication date |
---|---|
CN108505014A (zh) | 2018-09-07 |
KR20150010594A (ko) | 2015-01-28 |
KR20160067826A (ko) | 2016-06-14 |
TW201512440A (zh) | 2015-04-01 |
CN104294223A (zh) | 2015-01-21 |
KR102062944B1 (ko) | 2020-01-06 |
CN108505014B (zh) | 2020-08-21 |
US20150021177A1 (en) | 2015-01-22 |
CN104294223B (zh) | 2018-07-20 |
TWI521079B (zh) | 2016-02-11 |
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