JP2014534612A - 真空保持中の表層粗さが制御される装置 - Google Patents
真空保持中の表層粗さが制御される装置 Download PDFInfo
- Publication number
- JP2014534612A JP2014534612A JP2014533358A JP2014533358A JP2014534612A JP 2014534612 A JP2014534612 A JP 2014534612A JP 2014533358 A JP2014533358 A JP 2014533358A JP 2014533358 A JP2014533358 A JP 2014533358A JP 2014534612 A JP2014534612 A JP 2014534612A
- Authority
- JP
- Japan
- Prior art keywords
- chuck
- support
- wafer
- rough surface
- chuck support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/06—Work-clamping means
- B23Q3/08—Work-clamping means other than mechanically-actuated
- B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/11—Vacuum
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/34—Accessory or component
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims (10)
- 微細機械加工される部品を支持する装置であって、
第一表面と前記第一表面の反対側の第二表面を有し、光透過性材料を含むプレート形の本体から形成されるチャックを含み、
前記第一表面または前記第二表面のうちの少なくとも1つは粗面である装置。 - 前記光透過性材料が半透明である請求項1に記載の装置。
- 前記光透過性材料が、天然または合成の融解石英または融解ガラスの少なくとも一つを有する請求項1または2に記載の装置。
- 前記光透過性材料が均一であり、前記第一表面から前記第二表面への均一な通路を提供する請求項1または2に記載の装置。
- 前記粗面が前記第一表面または前記第二表面の前記少なくとも一つの全体に延びている請求項1または2に記載の装置。
- 前記プレートのような形状が0.500の±0.005インチの比較的均一の厚みを有し、前記粗面は、150〜200マイクロインチの深さを有する請求項1または2に記載の装置。
- 前記粗面が負圧の適用通路を提供し、前記部品が前記負圧の適用によって歪められない程度に微細である請求項1または2に記載の装置。
- 更に、
チャックを運動ステージで支えるチャック支持と、
前記チャック支持の内壁に対して前記チャックを封止するOリングと、
を有する請求項1または2に記載の装置。 - 更に、
前記チャック支持の壁を通って延び、前記粗面と空気連通する少なくとも一つの真空吸引孔を有する請求項8に記載の装置。 - 前記部品がテープ・フレームによって支持されるウェーハであり、前記テープ・フレームは前記チャック支持により支持され、真空チャンバは前記チャック支持によって形成され、封止が前記チャック支持の内壁および前記テープ・フレームのテープに対して前記チャックを封止する請求項9に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/250,871 US8960686B2 (en) | 2011-09-30 | 2011-09-30 | Controlled surface roughness in vacuum retention |
US13/250,871 | 2011-09-30 | ||
PCT/US2012/057779 WO2013049476A1 (en) | 2011-09-30 | 2012-09-28 | Controlled surface roughness in vacuum retention |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014534612A true JP2014534612A (ja) | 2014-12-18 |
JP2014534612A5 JP2014534612A5 (ja) | 2015-04-09 |
Family
ID=47991829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014533358A Ceased JP2014534612A (ja) | 2011-09-30 | 2012-09-28 | 真空保持中の表層粗さが制御される装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8960686B2 (ja) |
JP (1) | JP2014534612A (ja) |
KR (1) | KR20140069325A (ja) |
CN (1) | CN103843127A (ja) |
TW (1) | TW201330169A (ja) |
WO (1) | WO2013049476A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018133504A (ja) * | 2017-02-17 | 2018-08-23 | 株式会社ディスコ | ウエーハの保持方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9266192B2 (en) | 2012-05-29 | 2016-02-23 | Electro Scientific Industries, Inc. | Method and apparatus for processing workpieces |
US9502278B2 (en) | 2013-04-22 | 2016-11-22 | International Business Machines Corporation | Substrate holder assembly for controlled layer transfer |
CN104088875B (zh) * | 2014-07-20 | 2017-08-15 | 广东格林精密部件股份有限公司 | 一种气压式防气泡组装夹具 |
US11036147B2 (en) * | 2019-03-20 | 2021-06-15 | Kla Corporation | System and method for converting backside surface roughness to frontside overlay |
US10801969B1 (en) * | 2019-09-12 | 2020-10-13 | Lumentum Operations Llc | Testing device for bottom-emitting or bottom-detecting optical devices |
CN113053774A (zh) * | 2019-12-27 | 2021-06-29 | 迪科特测试科技(苏州)有限公司 | 探测装置 |
US11524392B2 (en) * | 2020-11-24 | 2022-12-13 | Applied Materials, Inc. | Minimal contact gripping of thin optical devices |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000164647A (ja) * | 1998-11-24 | 2000-06-16 | Matsushita Electric Ind Co Ltd | ウエハカセット及び半導体集積回路の検査装置 |
JP2007115961A (ja) * | 2005-10-21 | 2007-05-10 | Tecdia Kk | 基板保持装置 |
JP2009183997A (ja) * | 2008-02-08 | 2009-08-20 | Lintec Corp | ワークの支持体および該支持体を用いたワークの加工方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02239621A (ja) | 1989-03-13 | 1990-09-21 | Fuji Electric Co Ltd | 真空チャツク装置 |
US5959098A (en) * | 1996-04-17 | 1999-09-28 | Affymetrix, Inc. | Substrate preparation process |
US6399143B1 (en) * | 1996-04-09 | 2002-06-04 | Delsys Pharmaceutical Corporation | Method for clamping and electrostatically coating a substrate |
JP2000286329A (ja) | 1999-03-31 | 2000-10-13 | Hoya Corp | 基板保持チャックとその製造方法、露光方法、半導体装置の製造方法及び露光装置 |
JP4090416B2 (ja) * | 2003-09-30 | 2008-05-28 | 日東電工株式会社 | 粘着テープ付ワークの離脱方法及び離脱装置 |
WO2005092564A1 (ja) * | 2004-03-25 | 2005-10-06 | Ibiden Co., Ltd. | 真空チャックおよび吸着板 |
JP4705450B2 (ja) * | 2005-03-11 | 2011-06-22 | 株式会社ディスコ | ウェーハの保持機構 |
US20070026772A1 (en) * | 2005-07-28 | 2007-02-01 | Dolechek Kert L | Apparatus for use in processing a semiconductor workpiece |
CN100468619C (zh) * | 2006-08-23 | 2009-03-11 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 刻蚀设备的控温装置及其控制晶片温度的方法 |
EP2094879A1 (en) | 2006-11-27 | 2009-09-02 | Momentive Performance Materials Inc. | Quartz encapsulated heater assembly |
JP5074125B2 (ja) | 2007-08-09 | 2012-11-14 | リンテック株式会社 | 固定治具並びにワークの処理方法 |
KR101517020B1 (ko) * | 2008-05-15 | 2015-05-04 | 삼성디스플레이 주식회사 | 유기전계발광표시장치의 제조장치 및 제조방법 |
-
2011
- 2011-09-30 US US13/250,871 patent/US8960686B2/en not_active Expired - Fee Related
-
2012
- 2012-09-28 CN CN201280047597.4A patent/CN103843127A/zh active Pending
- 2012-09-28 KR KR1020147011591A patent/KR20140069325A/ko not_active Application Discontinuation
- 2012-09-28 JP JP2014533358A patent/JP2014534612A/ja not_active Ceased
- 2012-09-28 WO PCT/US2012/057779 patent/WO2013049476A1/en active Application Filing
- 2012-09-28 TW TW101136109A patent/TW201330169A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000164647A (ja) * | 1998-11-24 | 2000-06-16 | Matsushita Electric Ind Co Ltd | ウエハカセット及び半導体集積回路の検査装置 |
JP2007115961A (ja) * | 2005-10-21 | 2007-05-10 | Tecdia Kk | 基板保持装置 |
JP2009183997A (ja) * | 2008-02-08 | 2009-08-20 | Lintec Corp | ワークの支持体および該支持体を用いたワークの加工方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018133504A (ja) * | 2017-02-17 | 2018-08-23 | 株式会社ディスコ | ウエーハの保持方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103843127A (zh) | 2014-06-04 |
KR20140069325A (ko) | 2014-06-09 |
WO2013049476A1 (en) | 2013-04-04 |
US8960686B2 (en) | 2015-02-24 |
US20130082448A1 (en) | 2013-04-04 |
TW201330169A (zh) | 2013-07-16 |
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