JP2014511769A5 - - Google Patents
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- Publication number
- JP2014511769A5 JP2014511769A5 JP2014501190A JP2014501190A JP2014511769A5 JP 2014511769 A5 JP2014511769 A5 JP 2014511769A5 JP 2014501190 A JP2014501190 A JP 2014501190A JP 2014501190 A JP2014501190 A JP 2014501190A JP 2014511769 A5 JP2014511769 A5 JP 2014511769A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- item
- polishing system
- optical element
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000005498 polishing Methods 0.000 claims description 67
- 230000003287 optical Effects 0.000 claims description 23
- 239000002002 slurry Substances 0.000 claims description 14
- 239000002904 solvent Substances 0.000 claims description 12
- 239000004094 surface-active agent Substances 0.000 claims description 10
- 238000005296 abrasive Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 5
- 230000000996 additive Effects 0.000 claims description 5
- 239000003945 anionic surfactant Substances 0.000 claims description 4
- 239000003093 cationic surfactant Substances 0.000 claims description 3
- 239000005350 fused silica glass Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 230000001808 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229940063953 AMMONIUM LAURYL SULFATE Drugs 0.000 description 1
- BTBJBAZGXNKLQC-UHFFFAOYSA-N Ammonium lauryl sulfate Chemical compound [NH4+].CCCCCCCCCCCCOS([O-])(=O)=O BTBJBAZGXNKLQC-UHFFFAOYSA-N 0.000 description 1
- OFJATJUUUCAKMK-UHFFFAOYSA-N Cerium(IV) oxide Chemical compound [O-2]=[Ce+4]=[O-2] OFJATJUUUCAKMK-UHFFFAOYSA-N 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161454893P | 2011-03-21 | 2011-03-21 | |
US61/454,893 | 2011-03-21 | ||
PCT/US2012/029837 WO2012129244A1 (en) | 2011-03-21 | 2012-03-20 | Method and system for convergent polishing |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016133727A Division JP6232172B2 (ja) | 2011-03-21 | 2016-07-05 | コンバージェント研磨方法およびコンバージェント研磨システム |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014511769A JP2014511769A (ja) | 2014-05-19 |
JP2014511769A5 true JP2014511769A5 (zh) | 2015-05-07 |
JP5968418B2 JP5968418B2 (ja) | 2016-08-10 |
Family
ID=46879717
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014501190A Active JP5968418B2 (ja) | 2011-03-21 | 2012-03-20 | コンバージェント研磨方法およびコンバージェント研磨システム |
JP2016133727A Active JP6232172B2 (ja) | 2011-03-21 | 2016-07-05 | コンバージェント研磨方法およびコンバージェント研磨システム |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016133727A Active JP6232172B2 (ja) | 2011-03-21 | 2016-07-05 | コンバージェント研磨方法およびコンバージェント研磨システム |
Country Status (6)
Country | Link |
---|---|
EP (2) | EP2688712B1 (zh) |
JP (2) | JP5968418B2 (zh) |
KR (1) | KR20140019392A (zh) |
CN (1) | CN103534062A (zh) |
RU (1) | RU2610991C2 (zh) |
WO (1) | WO2012129244A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10287457B2 (en) | 2012-11-02 | 2019-05-14 | Lawrence Livermore National Security, Llc | Polishing slurry preventing agglomeration of charged colloids without loss of surface activity |
CN110977679A (zh) * | 2019-12-20 | 2020-04-10 | 成都精密光学工程研究中心 | 一种全口径低缺陷平面工件的加工设备及方法 |
CN112405209A (zh) * | 2020-11-11 | 2021-02-26 | 上饶市光耀光学设备制造有限公司 | 一种光学镜片加工用的精磨抛光装置 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH041532Y2 (zh) * | 1985-03-19 | 1992-01-20 | ||
JPS63283859A (ja) * | 1987-05-13 | 1988-11-21 | Hitachi Ltd | ウェハ研磨用治具 |
JPH05228828A (ja) * | 1992-02-19 | 1993-09-07 | Ibiden Co Ltd | 結晶体の研磨方法および研磨治具 |
JP3439501B2 (ja) * | 1993-06-10 | 2003-08-25 | 株式会社住田光学ガラス | レンズ接合装置 |
CA2159797A1 (en) * | 1994-10-28 | 1996-04-29 | John H. Ko | Compliant lens block and tape |
US5649849A (en) * | 1995-03-24 | 1997-07-22 | Eastman Kodak Company | Method and apparatus for realtime monitoring and feedback control of the shape of a continuous planetary polishing surface |
JPH09117859A (ja) * | 1995-10-27 | 1997-05-06 | Matsushita Electric Ind Co Ltd | 被研磨基板の研磨方法 |
JP3880102B2 (ja) * | 1996-07-29 | 2007-02-14 | 東京エレクトロン株式会社 | 研磨装置および研磨方法 |
US6149506A (en) * | 1998-10-07 | 2000-11-21 | Keltech Engineering | Lapping apparatus and method for high speed lapping with a rotatable abrasive platen |
US6099604A (en) * | 1997-08-21 | 2000-08-08 | Micron Technology, Inc. | Slurry with chelating agent for chemical-mechanical polishing of a semiconductor wafer and methods related thereto |
EP1295682B1 (en) * | 2000-05-31 | 2007-10-24 | JSR Corporation | Abrasive material |
US6692573B1 (en) * | 2000-06-01 | 2004-02-17 | Agilent Technologies, Inc. | Automated pitch button dispensing station and method |
US6443811B1 (en) * | 2000-06-20 | 2002-09-03 | Infineon Technologies Ag | Ceria slurry solution for improved defect control of silicon dioxide chemical-mechanical polishing |
JP2003179021A (ja) * | 2001-12-11 | 2003-06-27 | Sony Corp | 化学機械研磨装置 |
US7175503B2 (en) * | 2002-02-04 | 2007-02-13 | Kla-Tencor Technologies Corp. | Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device |
US6866793B2 (en) * | 2002-09-26 | 2005-03-15 | University Of Florida Research Foundation, Inc. | High selectivity and high planarity dielectric polishing |
JP2004330338A (ja) * | 2003-05-06 | 2004-11-25 | Shin Etsu Chem Co Ltd | ワークの研磨装置およびワークの研磨方法 |
WO2006025641A1 (en) * | 2004-09-02 | 2006-03-09 | Joon-Mo Kang | Retaining ring for chemical mechanical polishing |
US20060124592A1 (en) * | 2004-12-09 | 2006-06-15 | Miller Anne E | Chemical mechanical polish slurry |
JP2006159384A (ja) * | 2004-12-10 | 2006-06-22 | Tochigi Nikon Corp | 光学部品の製造方法 |
US7368388B2 (en) * | 2005-04-15 | 2008-05-06 | Small Robert J | Cerium oxide abrasives for chemical mechanical polishing |
JP4787063B2 (ja) * | 2005-12-09 | 2011-10-05 | 株式会社荏原製作所 | 研磨装置及び研磨方法 |
JP2007298608A (ja) * | 2006-04-28 | 2007-11-15 | Victor Co Of Japan Ltd | 光学部品の製造方法 |
US7829464B2 (en) * | 2006-10-20 | 2010-11-09 | Spansion Llc | Planarization method using hybrid oxide and polysilicon CMP |
CN101536171A (zh) * | 2006-11-08 | 2009-09-16 | 圣劳伦斯纳米科技有限公司 | 湿敏表面的化学机械抛光和为此的组合物 |
US20090284837A1 (en) * | 2008-05-13 | 2009-11-19 | Micron Technology, Inc. | Method and apparatus providing uniform separation of lens wafer and structure bonded thereto |
US20090311945A1 (en) * | 2008-06-17 | 2009-12-17 | Roland Strasser | Planarization System |
US8588956B2 (en) * | 2009-01-29 | 2013-11-19 | Tayyab Ishaq Suratwala | Apparatus and method for deterministic control of surface figure during full aperture polishing |
JP5291746B2 (ja) * | 2011-03-22 | 2013-09-18 | 株式会社荏原製作所 | 研磨装置 |
-
2012
- 2012-03-20 CN CN201280014310.8A patent/CN103534062A/zh active Pending
- 2012-03-20 EP EP12760262.1A patent/EP2688712B1/en active Active
- 2012-03-20 WO PCT/US2012/029837 patent/WO2012129244A1/en active Application Filing
- 2012-03-20 JP JP2014501190A patent/JP5968418B2/ja active Active
- 2012-03-20 KR KR1020137027590A patent/KR20140019392A/ko not_active Application Discontinuation
- 2012-03-20 RU RU2013146696A patent/RU2610991C2/ru active
- 2012-03-20 EP EP16207175.7A patent/EP3187304B1/en active Active
-
2016
- 2016-07-05 JP JP2016133727A patent/JP6232172B2/ja active Active
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