JP2014511769A5 - - Google Patents

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Publication number
JP2014511769A5
JP2014511769A5 JP2014501190A JP2014501190A JP2014511769A5 JP 2014511769 A5 JP2014511769 A5 JP 2014511769A5 JP 2014501190 A JP2014501190 A JP 2014501190A JP 2014501190 A JP2014501190 A JP 2014501190A JP 2014511769 A5 JP2014511769 A5 JP 2014511769A5
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JP
Japan
Prior art keywords
polishing
item
polishing system
optical element
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2014501190A
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English (en)
Japanese (ja)
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JP5968418B2 (ja
JP2014511769A (ja
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Publication date
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Priority claimed from PCT/US2012/029837 external-priority patent/WO2012129244A1/en
Publication of JP2014511769A publication Critical patent/JP2014511769A/ja
Publication of JP2014511769A5 publication Critical patent/JP2014511769A5/ja
Application granted granted Critical
Publication of JP5968418B2 publication Critical patent/JP5968418B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014501190A 2011-03-21 2012-03-20 コンバージェント研磨方法およびコンバージェント研磨システム Active JP5968418B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161454893P 2011-03-21 2011-03-21
US61/454,893 2011-03-21
PCT/US2012/029837 WO2012129244A1 (en) 2011-03-21 2012-03-20 Method and system for convergent polishing

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016133727A Division JP6232172B2 (ja) 2011-03-21 2016-07-05 コンバージェント研磨方法およびコンバージェント研磨システム

Publications (3)

Publication Number Publication Date
JP2014511769A JP2014511769A (ja) 2014-05-19
JP2014511769A5 true JP2014511769A5 (zh) 2015-05-07
JP5968418B2 JP5968418B2 (ja) 2016-08-10

Family

ID=46879717

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2014501190A Active JP5968418B2 (ja) 2011-03-21 2012-03-20 コンバージェント研磨方法およびコンバージェント研磨システム
JP2016133727A Active JP6232172B2 (ja) 2011-03-21 2016-07-05 コンバージェント研磨方法およびコンバージェント研磨システム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2016133727A Active JP6232172B2 (ja) 2011-03-21 2016-07-05 コンバージェント研磨方法およびコンバージェント研磨システム

Country Status (6)

Country Link
EP (2) EP2688712B1 (zh)
JP (2) JP5968418B2 (zh)
KR (1) KR20140019392A (zh)
CN (1) CN103534062A (zh)
RU (1) RU2610991C2 (zh)
WO (1) WO2012129244A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10287457B2 (en) 2012-11-02 2019-05-14 Lawrence Livermore National Security, Llc Polishing slurry preventing agglomeration of charged colloids without loss of surface activity
CN110977679A (zh) * 2019-12-20 2020-04-10 成都精密光学工程研究中心 一种全口径低缺陷平面工件的加工设备及方法
CN112405209A (zh) * 2020-11-11 2021-02-26 上饶市光耀光学设备制造有限公司 一种光学镜片加工用的精磨抛光装置

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JPH041532Y2 (zh) * 1985-03-19 1992-01-20
JPS63283859A (ja) * 1987-05-13 1988-11-21 Hitachi Ltd ウェハ研磨用治具
JPH05228828A (ja) * 1992-02-19 1993-09-07 Ibiden Co Ltd 結晶体の研磨方法および研磨治具
JP3439501B2 (ja) * 1993-06-10 2003-08-25 株式会社住田光学ガラス レンズ接合装置
CA2159797A1 (en) * 1994-10-28 1996-04-29 John H. Ko Compliant lens block and tape
US5649849A (en) * 1995-03-24 1997-07-22 Eastman Kodak Company Method and apparatus for realtime monitoring and feedback control of the shape of a continuous planetary polishing surface
JPH09117859A (ja) * 1995-10-27 1997-05-06 Matsushita Electric Ind Co Ltd 被研磨基板の研磨方法
JP3880102B2 (ja) * 1996-07-29 2007-02-14 東京エレクトロン株式会社 研磨装置および研磨方法
US6149506A (en) * 1998-10-07 2000-11-21 Keltech Engineering Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
US6099604A (en) * 1997-08-21 2000-08-08 Micron Technology, Inc. Slurry with chelating agent for chemical-mechanical polishing of a semiconductor wafer and methods related thereto
EP1295682B1 (en) * 2000-05-31 2007-10-24 JSR Corporation Abrasive material
US6692573B1 (en) * 2000-06-01 2004-02-17 Agilent Technologies, Inc. Automated pitch button dispensing station and method
US6443811B1 (en) * 2000-06-20 2002-09-03 Infineon Technologies Ag Ceria slurry solution for improved defect control of silicon dioxide chemical-mechanical polishing
JP2003179021A (ja) * 2001-12-11 2003-06-27 Sony Corp 化学機械研磨装置
US7175503B2 (en) * 2002-02-04 2007-02-13 Kla-Tencor Technologies Corp. Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device
US6866793B2 (en) * 2002-09-26 2005-03-15 University Of Florida Research Foundation, Inc. High selectivity and high planarity dielectric polishing
JP2004330338A (ja) * 2003-05-06 2004-11-25 Shin Etsu Chem Co Ltd ワークの研磨装置およびワークの研磨方法
WO2006025641A1 (en) * 2004-09-02 2006-03-09 Joon-Mo Kang Retaining ring for chemical mechanical polishing
US20060124592A1 (en) * 2004-12-09 2006-06-15 Miller Anne E Chemical mechanical polish slurry
JP2006159384A (ja) * 2004-12-10 2006-06-22 Tochigi Nikon Corp 光学部品の製造方法
US7368388B2 (en) * 2005-04-15 2008-05-06 Small Robert J Cerium oxide abrasives for chemical mechanical polishing
JP4787063B2 (ja) * 2005-12-09 2011-10-05 株式会社荏原製作所 研磨装置及び研磨方法
JP2007298608A (ja) * 2006-04-28 2007-11-15 Victor Co Of Japan Ltd 光学部品の製造方法
US7829464B2 (en) * 2006-10-20 2010-11-09 Spansion Llc Planarization method using hybrid oxide and polysilicon CMP
CN101536171A (zh) * 2006-11-08 2009-09-16 圣劳伦斯纳米科技有限公司 湿敏表面的化学机械抛光和为此的组合物
US20090284837A1 (en) * 2008-05-13 2009-11-19 Micron Technology, Inc. Method and apparatus providing uniform separation of lens wafer and structure bonded thereto
US20090311945A1 (en) * 2008-06-17 2009-12-17 Roland Strasser Planarization System
US8588956B2 (en) * 2009-01-29 2013-11-19 Tayyab Ishaq Suratwala Apparatus and method for deterministic control of surface figure during full aperture polishing
JP5291746B2 (ja) * 2011-03-22 2013-09-18 株式会社荏原製作所 研磨装置

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