JP2014223692A - Polishing device of work - Google Patents

Polishing device of work Download PDF

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Publication number
JP2014223692A
JP2014223692A JP2013103719A JP2013103719A JP2014223692A JP 2014223692 A JP2014223692 A JP 2014223692A JP 2013103719 A JP2013103719 A JP 2013103719A JP 2013103719 A JP2013103719 A JP 2013103719A JP 2014223692 A JP2014223692 A JP 2014223692A
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Prior art keywords
polishing
workpiece
work
template
cloth
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JP2013103719A
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JP2014223692A5 (en
JP5870960B2 (en
Inventor
浩昌 橋本
Hiromasa Hashimoto
浩昌 橋本
正直 佐々木
Masanao Sasaki
正直 佐々木
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Shin Etsu Handotai Co Ltd
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Shin Etsu Handotai Co Ltd
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Priority to JP2013103719A priority Critical patent/JP5870960B2/en
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Priority to US14/787,659 priority patent/US20160082567A1/en
Priority to CN201480026546.2A priority patent/CN105189045B/en
Priority to SG11201509094YA priority patent/SG11201509094YA/en
Priority to KR1020157032613A priority patent/KR102192288B1/en
Priority to PCT/JP2014/002066 priority patent/WO2014185003A1/en
Priority to DE112014002107.5T priority patent/DE112014002107T5/en
Priority to TW103114539A priority patent/TWI597127B/en
Publication of JP2014223692A publication Critical patent/JP2014223692A/en
Publication of JP2014223692A5 publication Critical patent/JP2014223692A5/ja
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Publication of JP5870960B2 publication Critical patent/JP5870960B2/en
Priority to US16/123,383 priority patent/US20190001463A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a polishing device of a work which has a stable polishing speed in polishing a work outer circumferential part and can polish the work highly flatly.SOLUTION: A polishing device 1 of a work W includes: a polishing cloth 4 for polishing the work W; a polishing agent supply mechanism 7 for supplying a polishing agent; and a polishing head 2 for retaining the work W. Therein, in the polishing head 2, a back surface of the work W is retained by a backing pad 5, an edge part of the work W is retained by an annular template 6, and the work W and the template 6 are pressed onto the polishing cloth 4, thereby, the work W is brought into sliding contact with the polishing cloth 4 and the work W is polished. The template 6 is made of resin to which filler is added or resin in which woven fabrics are contained, and the filler or woven fabrics are exposed on the surface which presses the polishing cloth 4. Thus, the surface which presses the polishing cloth 4 has fine recessed parts.

Description

本発明は、ワークの研磨装置に関する。   The present invention relates to a workpiece polishing apparatus.

シリコンウェーハ等の半導体ウェーハを製造する場合、重要な工程の一つにウェーハの表面粗さを改善するとともに、平坦度を高めるための研磨工程がある。
近年のデバイスの高精度化に伴い、デバイス作製に用いられる半導体ウェーハは非常に高精度に平坦化することが要求されている。このような要求に対し、半導体ウェーハの表面を平坦化する技術として、化学機械研磨（ＣＭＰ；Ｃｈｅｍｉｃａｌ Ｍｅｃｈａｎｉｃａｌ Ｐｏｌｉｓｈｉｎｇ）が用いられている。 When manufacturing a semiconductor wafer such as a silicon wafer, one of important processes is a polishing process for improving the surface roughness of the wafer and increasing the flatness.
With the recent increase in accuracy of devices, semiconductor wafers used for device fabrication are required to be planarized with very high accuracy. In response to such demands, chemical mechanical polishing (CMP) is used as a technique for planarizing the surface of a semiconductor wafer.

シリコンウェーハ等のワーク表面を研磨する装置として、ワークを片面ずつ研磨する片面研磨装置と、両面同時に研磨する両面研磨装置とがある。
一般的な片面研磨装置は、例えば図７に示すように、研磨布１０７が貼り付けられた定盤１０４と、研磨剤供給機構１０８と、研磨ヘッド１０２等から構成されている。このような研磨装置１０１では、研磨ヘッド１０２でワークＷを保持し、研磨剤供給機構１０８から研磨布１０７上に研磨剤１０９を供給するとともに、定盤１０４と研磨ヘッド１０２をそれぞれ回転させてワークＷの表面を研磨布１０７に摺接させることにより研磨を行う。 As a device for polishing the surface of a workpiece such as a silicon wafer, there are a single-side polishing device for polishing a workpiece one by one and a double-side polishing device for polishing both surfaces simultaneously.
As shown in FIG. 7, for example, a general single-side polishing apparatus includes a surface plate 104 to which a polishing cloth 107 is attached, an abrasive supply mechanism 108, a polishing head 102, and the like. In such a polishing apparatus 101, the workpiece W is held by the polishing head 102, the polishing agent 109 is supplied from the polishing agent supply mechanism 108 onto the polishing cloth 107, and the surface plate 104 and the polishing head 102 are respectively rotated to rotate the workpiece. Polishing is performed by bringing the surface of W into sliding contact with the polishing pad 107.

ワークを保持する方法としては、平坦な円盤上のプレートにワックス等の接着剤を介してワークを貼り付ける方法、軟質のパッド（バッキング材）で水貼りする方法、真空吸着する方法などがある。
図７の研磨ヘッド１０２は、セラミックス等からなる円盤上の保持プレート１０６の下面にポリウレタン等の弾性パッド（バッキングパッド）１０５が貼り付けられており、この弾性パッド１０５に水分を吸収させてワークＷを表面張力により保持する。また、研磨中に保持プレート１０６からワークＷが外れるのを防ぐため、保持プレート１０６の周りにガイドリング１０３が設けられている。 As a method of holding the work, there are a method of attaching the work to a plate on a flat disk through an adhesive such as wax, a method of attaching water with a soft pad (backing material), a method of vacuum suction, and the like.
In the polishing head 102 of FIG. 7, an elastic pad (backing pad) 105 such as polyurethane is attached to the lower surface of a holding plate 106 on a disk made of ceramics or the like. Is held by surface tension. Further, a guide ring 103 is provided around the holding plate 106 in order to prevent the workpiece W from being detached from the holding plate 106 during polishing.

この研磨装置１０１は、保持プレート１０６を介してワークＷを間接的に押圧しているので、保持プレート１０６の平坦度の精度、保持プレート１０６に加圧力が作用した際の変形による寸法変化、およびバッキングパッド１０５の厚さの精度等による影響を受け易く、ワークの全面を、非常に高い精度で研磨することは難しいという課題があった。また、ワークの外周部が多く研磨される傾向にあり、いわゆる外周のダレが発生し易く、ワークの全面について非常に高い精度の平坦度が要求される場合には対応できないという課題があった。   Since the polishing apparatus 101 indirectly presses the workpiece W via the holding plate 106, the accuracy of the flatness of the holding plate 106, the dimensional change due to deformation when a pressure is applied to the holding plate 106, and There is a problem that it is easy to be affected by the accuracy of the thickness of the backing pad 105 and the like, and it is difficult to polish the entire surface of the workpiece with very high accuracy. Further, there is a problem that the outer peripheral portion of the work tends to be polished, so that so-called sagging of the outer periphery is likely to occur, and it is not possible to cope with a case where flatness with very high accuracy is required on the entire surface of the work.

上記の課題に対して、特許文献１には、ワーク全面を研磨面へ均等に押圧することによってワーク全面を均一に研磨し、ワーク外周のダレを防止すると共に、ワーク表面の平坦度を向上できる研磨ヘッドとして、図８、図９に示した研磨ヘッドが提案されている。図８は研磨ヘッド全体の概略図である。図９は、従来の研磨ヘッドの一部の拡大図である。
この研磨ヘッド１１７は、保持部が下方に向けて開放する凹部を備えるヘッド部材１２０と、該ヘッド部材１２０の凹部内側に配された保持部材１２１と、外側部がヘッド部材１２０の壁部に固定されると共に、内側部が保持部材１２１に固定され、該保持部材１２１を上下方向及び水平方向への移動を微小範囲内で許容可能に吊持する弾性部材１１０と、ヘッド部材１２０の内部を保持部材１２１および弾性部材によって画成して設けられる第１圧力室１１１と、弾性のある薄膜からなり、保持部材１２１の外面側に外周部で固定され、外側面でワークＷに当接してワークＷを定盤の研磨面へ押圧可能に設けられた弾性薄膜１１２と、保持プレート１１６の外側面１１６ａおよび弾性薄膜内側面１１２ａによって画成される第２圧力室１１３を備え、第１圧力室１１１へは第１流体供給手段１２２によって所定圧力の流体が供給され、第２圧力室１１３へは第２流体供給手段１２３によって所定圧力の流体が供給される。 In order to solve the above problems, Patent Document 1 can uniformly polish the entire surface of the work by pressing the entire surface of the work uniformly against the polishing surface, thereby preventing the outer periphery of the work from being sag and improving the flatness of the work surface. As the polishing head, the polishing head shown in FIGS. 8 and 9 has been proposed. FIG. 8 is a schematic view of the entire polishing head. FIG. 9 is an enlarged view of a part of a conventional polishing head.
The polishing head 117 includes a head member 120 having a concave portion whose holding portion is opened downward, a holding member 121 disposed inside the concave portion of the head member 120, and an outer portion fixed to the wall portion of the head member 120. At the same time, the inner portion is fixed to the holding member 121, and the inside of the head member 120 is held, and the elastic member 110 that suspends the holding member 121 in an up and down direction and a horizontal direction in an allowable range. The first pressure chamber 111 defined by the member 121 and the elastic member, and an elastic thin film, are fixed to the outer surface of the holding member 121 at the outer peripheral portion, and abuts against the workpiece W on the outer surface. The second pressure chamber 11 is defined by the elastic thin film 112 provided so as to be pressed against the polishing surface of the surface plate, the outer surface 116a of the holding plate 116 and the inner surface 112a of the elastic thin film. Comprising a, it is the first pressure chamber 111 fluid having a predetermined pressure is fed by the first fluid supply means 122, the the second pressure chamber 113 fluid having a predetermined pressure is applied by the second fluid supply means 123.

弾性薄膜１１２は、保持プレート１１６の外面側に、弾性薄膜外周部１１２ｂが、ボルト（不図示）の締め付けで固定リング１１５に挟まれることで固定されている。この弾性薄膜１１２は、その外側面でワークＷに当接して、エアバック作用でワークＷを定盤の研磨面へ均等に押圧できるように設けられている。また、弾性薄膜１１２の表面にワークＷが水等の液体の表面張力によって確実に貼着されている。   The elastic thin film 112 is fixed to the outer surface side of the holding plate 116 by the elastic thin film outer peripheral portion 112b being sandwiched between fixing rings 115 by tightening bolts (not shown). The elastic thin film 112 is provided so as to abut against the work W on the outer surface thereof and to press the work W evenly against the polishing surface of the surface plate by an air bag action. In addition, the work W is securely attached to the surface of the elastic thin film 112 by the surface tension of a liquid such as water.

テンプレート１１４は環状円板であり、弾性薄膜１１２の外面側（下面）に装着され、ワークＷを囲うことが可能に形成されており、ワークＷの横滑りを防止する。テンプレート１１４の内周部は、ワークＷ外周部と連続して弾性薄膜１１２により同時に押圧され、テンプレート１１４の厚さは、ワークＷの厚さと同等に設定されており、これにより、ワークＷ外周部には、均一な荷重がかかり、ワークＷの外周のダレが発生することを抑制できる。   The template 114 is an annular disk, is attached to the outer surface side (lower surface) of the elastic thin film 112, is formed so as to be able to surround the workpiece W, and prevents the workpiece W from slipping. The inner peripheral portion of the template 114 is simultaneously pressed by the elastic thin film 112 continuously with the outer peripheral portion of the workpiece W, and the thickness of the template 114 is set to be equal to the thickness of the workpiece W. In this case, a uniform load is applied, and the occurrence of sagging of the outer periphery of the workpiece W can be suppressed.

特開平９−２９６１８号公報JP-A-9-29618 特開平１１−９０８２０号公報JP-A-11-90820

しかし、特許文献１に記載された研磨ヘッド１１７を用いて研磨を行った場合でも、ワークの平坦度が悪化することがある。そこで本発明者等はこの原因について検討したところ以下のことが分かった。
テンプレート１１４の内周部が均等に押圧されることによって、テンプレート１１４と研磨布１０７の間の隙間が小さくなり、テンプレート１１４と研磨布１０７の間に研磨剤が供給されにくくなる。その結果、研磨布とワーク外周部の間に供給される研磨剤の量が不安定となり、研磨剤の砥粒濃度にばらつきが発生する。 However, even when polishing is performed using the polishing head 117 described in Patent Document 1, the flatness of the workpiece may deteriorate. Therefore, the present inventors examined this cause and found the following.
When the inner peripheral portion of the template 114 is pressed evenly, the gap between the template 114 and the polishing pad 107 is reduced, and it becomes difficult for the abrasive to be supplied between the template 114 and the polishing pad 107. As a result, the amount of abrasive supplied between the polishing cloth and the outer periphery of the workpiece becomes unstable, and the abrasive concentration of the abrasive varies.

さらに、本発明者等は、研磨剤の砥粒濃度と研磨後のワークの取り代ばらつきの関係を調査した。研磨ヘッドとしては、図８の研磨ヘッドを使用し、研磨するウェーハとして、３００ｍｍ鏡面シリコンウェーハを使用した。予め、ウェーハの断面厚み形状をＫＬＡ―Ｔｅｎｃｏｒ社製ＷａｆｅｒＳｉｇｈｔを用いて測定しておいた。テンプレートとしては、市販のガラス織布にエポキシ樹脂を含浸させた積層板を使用した。研磨剤には、市販のコロイダルシリカスラリーを使用した。砥粒として平均粒径３５ｎｍ〜７０ｎｍのコロイダルシリカを用い、これを純水で希釈し、ｐＨが１０．５になるように苛性カリを添加した。   Furthermore, the present inventors investigated the relationship between the abrasive grain concentration of the abrasive and the machining allowance variation after polishing. The polishing head shown in FIG. 8 was used as the polishing head, and a 300 mm mirror silicon wafer was used as the wafer to be polished. The cross-sectional thickness shape of the wafer was measured in advance using WaferSight manufactured by KLA-Tencor. As the template, a laminated sheet obtained by impregnating a commercially available glass woven fabric with an epoxy resin was used. A commercial colloidal silica slurry was used as the abrasive. Colloidal silica having an average particle diameter of 35 nm to 70 nm was used as abrasive grains, which was diluted with pure water, and caustic potash was added so that the pH became 10.5.

研磨布には、市販の不織布タイプを使用し、研磨の際には、研磨ヘッドと研磨定盤は、各３０ｒｐｍで回転させた。ウェーハの研磨圧力(流体の圧力)は、１５０ｇ／ｃｍ２とした。研磨剤の希釈率を変えて、砥粒濃度を変化させて３枚のシリコンウェーハの研磨加工を行った。研磨後のウェーハを洗浄した後に、ＫＬＡ―Ｔｅｎｃｏｒ社製ＷａｆｅｒＳｉｇｈｔを用いて研磨前と同様に断面厚み形状を測定し、研磨前後で厚みの差分計算を行い、ウェーハ取り代を評価した。図４に示すように、砥粒濃度とウェーハ取り代には相関があり、砥粒が濃いほど、ウェーハ取り代はダレ側に変化することがわかった。 A commercially available non-woven fabric type was used for the polishing cloth, and the polishing head and the polishing surface plate were rotated at 30 rpm each when polishing. The wafer polishing pressure (fluid pressure) was 150 g / cm 2 . Three silicon wafers were polished by changing the abrasive dilution and changing the abrasive concentration. After cleaning the polished wafer, the cross-sectional thickness shape was measured using WaferLight manufactured by KLA-Tencor in the same manner as before polishing, and the difference in thickness was calculated before and after polishing to evaluate the wafer removal allowance. As shown in FIG. 4, it was found that there is a correlation between the abrasive grain concentration and the wafer removal allowance, and the higher the abrasive grains, the more the wafer removal allowance changes.

従って、ワークを研磨する際に、研磨布とワークの外周部の間に供給される研磨剤の砥粒濃度にばらつきが発生すると、この砥粒濃度のばらつきがワークの外周形状の不安定化を増長させ、ワークの平坦度が悪化するということが言える。   Therefore, when polishing the workpiece, if variation occurs in the abrasive concentration of the abrasive supplied between the polishing cloth and the outer peripheral portion of the workpiece, the variation in the abrasive concentration causes the outer peripheral shape of the workpiece to become unstable. It can be said that the flatness of the workpiece is deteriorated by increasing the length.

また、テンプレートと研磨布の間に研磨剤を十分に供給する対策として、テンプレートに外周端から内周端に貫通する溝、穴、もしくは凹設路等からなる流路を設けたことを特徴とするテンプレートが公知である（特許文献２参照）。このような対策をすると溝、穴の影響で研磨剤の粗密がワーク外周部に影響を与え、円周方向にうねり形状が発生し、ワークの平坦度を悪化させてしまうという問題がある。   In addition, as a measure for sufficiently supplying the abrasive between the template and the polishing cloth, the template is provided with a flow path including a groove, a hole, or a recessed path that penetrates from the outer peripheral end to the inner peripheral end. A template to be used is known (see Patent Document 2). When such measures are taken, there is a problem that the density of the abrasive affects the outer periphery of the workpiece due to the influence of the grooves and holes, and a waviness shape is generated in the circumferential direction, thereby deteriorating the flatness of the workpiece.

研磨布側の対策として、研磨布の表面に溝をつけることが公知であるが、研磨加工後ワーク表面に溝に由来する微細な粗さが発生してしまうという問題がある。   As a countermeasure on the polishing cloth side, it is known to form a groove on the surface of the polishing cloth, but there is a problem that fine roughness derived from the groove is generated on the surface of the work after polishing.

また、テンプレートが研磨布表面のドレッシング体と兼用され、テンプレートの研磨布側の表面を、ドレッシング用の凹凸を有するドレッシング作用面とする特許もあるが、研磨加工中に研磨布の研磨作用面を粗くさせるような変化をさせると、削りカスが発生し、これにより、研磨中にウェーハ表面にキズが１０％を超える不良率で発生してしまい、実用的ではない。このドレッシング体の例としては、微細な凹凸であるエンボス、微細でなだらかな窪みのディンプル、ドレッシング作用面（環状面を含む）の中心部を中心とした放射線状の凹凸部などが形成されたもので、このような凹凸部分の大きさは、例えば５００μｍ程度である。   There is also a patent in which a template is also used as a dressing body on the surface of a polishing cloth, and the surface on the polishing cloth side of the template is a dressing working surface having irregularities for dressing. If the change is made rough, scraps are generated, which causes defects on the wafer surface at a defect rate exceeding 10% during polishing, which is not practical. Examples of this dressing body include embosses that are fine irregularities, fine dimples with gentle depressions, and radial irregularities that are centered on the center of the dressing working surface (including the annular surface). Thus, the size of such an uneven portion is, for example, about 500 μm.

本発明は前述のような問題に鑑みてなされたもので、テンプレートと研磨布の間を介して、研磨布とワークの外周部の間に供給される研磨剤の量を安定させ、その研磨剤の砥粒濃度のばらつきを抑制し、その結果、ワーク外周部の研磨速度が安定し、高平坦にワークを研磨できるワークの研磨装置を提供することを目的とする。   The present invention has been made in view of the above-described problems, and stabilizes the amount of abrasive supplied between the polishing cloth and the outer peripheral portion of the workpiece via the template and the polishing cloth. An object of the present invention is to provide a workpiece polishing apparatus that suppresses the variation in abrasive grain concentration of the workpiece, and as a result, stabilizes the polishing rate of the outer periphery of the workpiece and can polish the workpiece in a highly flat manner.

上記目的を達成するために、本発明によれば、ワークを研磨するため研磨布と、研磨剤を供給するための研磨剤供給機構と、ワークを保持するための研磨ヘッドを具備し、該研磨ヘッドは前記ワークの裏面をバッキングパッドによって保持し、前記ワークのエッジ部を環状のテンプレートによって保持し、前記研磨布に前記ワークと前記テンプレートを押圧することで、前記ワークを前記研磨布に摺接させ、前記ワークを研磨するワークの研磨装置であって、前記テンプレートは、フィラーが添加された樹脂又は織布が含まれた樹脂から成り、前記研磨布を押圧する面に前記フィラー又は前記織布が露出していることにより、該押圧する面に微細な凹部を有するものであることを特徴とするワークの研磨装置を提供する。   To achieve the above object, according to the present invention, a polishing cloth for polishing a workpiece, an abrasive supply mechanism for supplying an abrasive, and a polishing head for holding the workpiece are provided. The head holds the back surface of the workpiece with a backing pad, holds the edge portion of the workpiece with an annular template, and presses the workpiece and the template against the polishing cloth, thereby sliding the workpiece against the polishing cloth. A workpiece polishing apparatus for polishing the workpiece, wherein the template is made of a resin to which a filler is added or a woven fabric, and the filler or the woven fabric is pressed against a surface pressing the polishing cloth. The workpiece polishing apparatus is characterized by having a fine recess on the surface to be pressed due to the exposed surface.

このようなワークの研磨装置であれば、テンプレートの押圧面にある微細な凹部を介することで、テンプレートと研磨布の間を研磨剤が通り易くなり、研磨布とワークの外周部の間に供給される研磨剤の量を安定させ、ワーク表面と研磨布表面に均一な砥粒濃度で研磨剤が供給される。その結果、ワーク外周部の形状を平坦にすることができるため、高平坦なワークを得ることができる。また、テンプレートを、フィラーが添加された樹脂又は織布が含まれた樹脂とし、研磨布を押圧する面にフィラー又は織布を露出させたものであれば、微細で均一な凹部を簡単に形成することができるものとなる。しかも、この様な凹部は研磨布の削りカスを生じさせ、ウェーハにキズを生じさせることもない。   If it is such a workpiece polishing device, it becomes easy for the abrasive to pass between the template and the polishing cloth through the fine recesses on the pressing surface of the template, and is supplied between the polishing cloth and the outer periphery of the workpiece. The amount of the abrasive to be applied is stabilized, and the abrasive is supplied to the work surface and the polishing cloth surface with a uniform abrasive concentration. As a result, since the shape of the outer periphery of the workpiece can be flattened, a highly flat workpiece can be obtained. In addition, if the template is a resin with a filler or a woven cloth, and the filler or the woven cloth is exposed on the surface that presses the polishing cloth, a fine and uniform recess can be easily formed. Will be able to do. In addition, such recesses cause scraping of the polishing cloth and do not cause scratches on the wafer.

このとき、前記テンプレートの前記研磨布を押圧する面における前記露出しているフィラーの表面占有率、または織布の表面占有率が５％以上８５％以下であることが好ましい。
このように、フィラーまたは織布の表面占有率が５％以上であれば、より確実にテンプレートと研磨布の間を研磨剤が均一に通り易くなり、研磨剤の砥粒濃度のばらつきを抑制でき、その結果、より確実にワークの平坦度を高くできる。また、該表面占有率を８５％以下にすることで、確実にキズ不良率が低いワークを得ることができる。 At this time, it is preferable that the surface occupancy ratio of the exposed filler or the surface occupancy ratio of the woven cloth is 5% or more and 85% or less on the surface of the template that presses the polishing cloth.
Thus, if the surface occupancy of the filler or woven fabric is 5% or more, the abrasive can more easily pass between the template and the abrasive cloth more reliably, and variation in the abrasive concentration of the abrasive can be suppressed. As a result, the flatness of the workpiece can be increased more reliably. Further, by making the surface occupation ratio 85% or less, it is possible to reliably obtain a work having a low scratch defect rate.

またこのとき、前記凹部の深さが０．０５ｍｍ以上であることが好ましい。
このようなものであれば、テンプレートと研磨布の間を研磨剤がより確実に通り易くなり、研磨布とワークの間に供給される研磨剤の量がより安定し、研磨布とワーク外周部の間の研磨剤の砥粒濃度のばらつきをさらに抑制することができる。その結果、特にワーク外周部の研磨速度がより安定し、高平坦にワークを研磨できる。 Moreover, it is preferable at this time that the depth of the said recessed part is 0.05 mm or more.
In such a case, it becomes easier for the abrasive to pass between the template and the polishing cloth, the amount of the abrasive supplied between the polishing cloth and the workpiece is more stable, and the outer periphery of the polishing cloth and the workpiece. It is possible to further suppress the variation in the abrasive concentration of the abrasive during the period. As a result, the polishing rate of the workpiece outer peripheral portion is more stable, and the workpiece can be polished highly flat.

さらに、前記凹部の開口幅が５ｍｍ以下で、凹部間のピッチが１０ｍｍ以下であることが好ましい。
このようなものであれば、ワークの円周方向に発生するうねりを抑制することができる。その結果、より平坦度が良好なワークを得ることができる。 Furthermore, it is preferable that the opening width of the recesses is 5 mm or less and the pitch between the recesses is 10 mm or less.
If it is such, the wave | undulation which generate | occur | produces in the circumferential direction of a workpiece | work can be suppressed. As a result, it is possible to obtain a work with better flatness.

このとき、前記凹部と前記研磨布との接触角が９０°以下であることが好ましい。
このようなものであれば、研磨布を傷つけることなくワークの研磨を行える。その結果、よりキズ不良率の低いワークを得ることができる。 At this time, it is preferable that a contact angle between the concave portion and the polishing pad is 90 ° or less.
If it is such, a workpiece | work can be grind | polished without damaging a polishing cloth. As a result, it is possible to obtain a work with a lower scratch defect rate.

本発明の研磨装置は、テンプレートが、フィラーが添加された樹脂又は織布が含まれた樹脂から成り、研磨布を押圧する面にフィラー又は織布が露出していることにより該押圧する面に微細な凹部を有するものであるので、テンプレートの凹部を介することで、テンプレートと研磨布の間を研磨剤が均一に通り易くなり、研磨布とワークの特に外周部の間に供給される研磨剤の量が安定し、ワーク外周部表面と研磨布表面に均一な砥粒濃度で研磨剤を供給できる。その結果、ワーク外周部の形状を平坦にすることができ、高平坦なワークを得ることができる。また、テンプレートを、フィラーが添加された樹脂又は織布が含まれた樹脂とし、研磨布を押圧する面にフィラー又は織布を露出させたものであるので、微細な凹部を簡単かつ均一に形成できるものとなるとともに、研磨されたワークにうねりやキズが発生し難いものとなる。   In the polishing apparatus of the present invention, the template is made of a resin to which a filler is added or a resin containing a woven cloth, and the filler or the woven cloth is exposed on the surface that presses the polishing cloth. Since it has fine recesses, it becomes easier for the abrasive to pass between the template and the polishing cloth through the recesses of the template, and the abrasive supplied between the polishing cloth and the workpiece, particularly the outer periphery. Thus, the abrasive can be supplied at a uniform abrasive concentration to the outer peripheral surface of the workpiece and the surface of the polishing pad. As a result, the shape of the work outer periphery can be flattened, and a highly flat work can be obtained. In addition, the template is made of resin with filler added or woven cloth, and the filler or woven cloth is exposed on the surface that presses the polishing cloth. As well as being able to be produced, the polished workpiece is less prone to swell and scratches.

本発明に係る研磨装置の一例を示した概略図である。It is the schematic which showed an example of the grinding | polishing apparatus which concerns on this invention. 本発明に係る研磨装置の研磨ヘッドのフィラーを添加したテンプレート周辺の一例を示した拡大図である。It is the enlarged view which showed an example of the template periphery which added the filler of the grinding | polishing head of the grinding | polishing apparatus which concerns on this invention. 本発明に係る研磨装置の研磨ヘッドの織布を含むテンプレート周辺の一例を示した拡大図である。It is the enlarged view which showed an example of the template periphery containing the woven fabric of the grinding | polishing head of the grinding | polishing apparatus which concerns on this invention. 研磨剤の砥粒濃度と研磨後のワークの取り代ばらつきの関係を示した図である。It is the figure which showed the relationship between the abrasive grain density | concentration of an abrasive | polishing agent, and the machining allowance variation of the workpiece | work after grinding | polishing. 実施例１、２、比較例におけるテンプレートの研磨布に押圧する面側の凹部表面占有率とワークの表面平坦度の関係を示した図である。It is the figure which showed the relationship between the surface occupation rate of the recessed part surface of the surface side pressed to the polishing cloth of the template in Examples 1, 2, and a comparative example, and the surface flatness of a workpiece | work. 実施例１、２、比較例におけるテンプレートの研磨布に押圧する面側の凹部表面占有率とワークの表面のキズ不良率の関係を示した図である。It is the figure which showed the relationship between the recessed surface ratio of the surface side pressed to the polishing cloth of the template in Example 1, 2, and a comparative example, and the defect rate of the surface of a workpiece | work. 従来の研磨装置の一例を示した概略図である。It is the schematic which showed an example of the conventional grinding | polishing apparatus. 従来の研磨装置の研磨ヘッドの一例を示した概略図である。It is the schematic which showed an example of the grinding | polishing head of the conventional grinding | polishing apparatus. 従来の研磨装置の研磨ヘッドの一部の拡大図である。It is a partially enlarged view of a polishing head of a conventional polishing apparatus.

以下、本発明について実施の形態を説明するが、本発明はこれに限定されるものではない。
上記したように、ワークの研磨において、テンプレートの内周部が均等に押圧されることで、テンプレートと研磨布の間に研磨剤が供給されにくくなり、研磨布とワーク外周部の間に研磨剤が供給されにくくなることで、研磨布とワークの間の研磨剤の砥粒濃度にばらつきが発生し易くなる。その結果、砥粒濃度のばらつきが特にワークの外周形状の不安定化を増長させ、ワーク平坦度が悪化するという問題があった。 Hereinafter, although an embodiment is described about the present invention, the present invention is not limited to this.
As described above, in polishing the workpiece, the inner peripheral portion of the template is pressed evenly, so that it becomes difficult to supply the abrasive between the template and the polishing cloth, and the abrasive is between the polishing cloth and the outer peripheral portion of the workpiece. As a result, it becomes difficult for the abrasive grain concentration of the abrasive between the polishing cloth and the workpiece to vary. As a result, there is a problem that the variation in the abrasive grain concentration particularly increases the instability of the outer peripheral shape of the workpiece and deteriorates the workpiece flatness.

そこで、本発明者等はワークの研磨において、高平坦度のワークを得るために鋭意検討を重ねた。その結果、テンプレートに、フィラーが添加された樹脂又は織布が含まれた樹脂から成り、研磨布を押圧する面にフィラー又は織布が露出していることにより、該押圧する面に微細な凹部を有する研磨装置に想到した。このような装置では、研磨剤が凹部を介して、テンプレートと研磨布の間を均一に通り易くなり、研磨布とワークの外周部の間に供給される研磨剤の量が安定し、ワーク表面と研磨布表面に均一な砥粒濃度で研磨剤が供給される。その結果、特にワーク外周部の形状を平坦にすることができるため、高平坦なワークを得ることができることに想到し、本発明を完成させた。   Therefore, the present inventors have conducted intensive studies in order to obtain a workpiece with high flatness in polishing the workpiece. As a result, the template is made of a resin to which a filler is added or a woven fabric, and the filler or the woven fabric is exposed on the surface that presses the polishing cloth, so that a minute recess is formed on the pressing surface. A polishing apparatus having the above has been conceived. In such an apparatus, the abrasive easily passes between the template and the polishing cloth through the recess, and the amount of the abrasive supplied between the polishing cloth and the outer peripheral portion of the workpiece is stabilized, and the workpiece surface is stabilized. The polishing agent is supplied to the polishing cloth surface with a uniform abrasive concentration. As a result, the present invention has been completed by conceiving that a highly flat workpiece can be obtained because the shape of the outer periphery of the workpiece can be flattened.

以下、本発明のワークの研磨装置について図を参照して詳細に説明するが、本発明はこれらに限定されるものではない。
図１に示すように、本発明の研磨装置１はワークを研磨するための研磨布４と、研磨剤８を供給するための研磨剤供給機構７と、ワークＷを保持するための研磨ヘッド２から構成されている。研磨布４は定盤３に貼り付けられている。研磨ヘッド２は、ワークＷを裏面から保持するためのバッキングパッド５とワークＷのエッジ部を保持するための環状のテンプレート６を有している。 Hereinafter, although the workpiece | work grinding | polishing apparatus of this invention is demonstrated in detail with reference to figures, this invention is not limited to these.
As shown in FIG. 1, a polishing apparatus 1 of the present invention includes a polishing cloth 4 for polishing a workpiece, an abrasive supply mechanism 7 for supplying an abrasive 8, and a polishing head 2 for holding a workpiece W. It is composed of The polishing cloth 4 is affixed to the surface plate 3. The polishing head 2 has a backing pad 5 for holding the workpiece W from the back surface and an annular template 6 for holding the edge portion of the workpiece W.

この研磨装置１ではワークＷの裏面をバッキングパッド５によって保持し、ワークＷのエッジ部をテンプレート６によって保持し、研磨剤供給機構７から研磨布４上に研磨剤８を供給するとともに、定盤３と研磨ヘッド２をそれぞれ回転させながら、研磨布４にワークＷとテンプレート６を押圧することで、ワークＷを研磨布４に摺接させ、ワークＷの研磨を行う。   In this polishing apparatus 1, the back surface of the workpiece W is held by the backing pad 5, the edge portion of the workpiece W is held by the template 6, the polishing agent 8 is supplied from the polishing agent supply mechanism 7 onto the polishing cloth 4, and the surface plate The workpiece W and the template 6 are pressed against the polishing pad 4 while rotating the polishing head 3 and the polishing head 2, whereby the workpiece W is brought into sliding contact with the polishing pad 4 to polish the workpiece W.

図２、図３は、研磨ヘッドの周辺部９を拡大して示した概略図の一例である。図２に示すように、テンプレート６はフィラー１０が添加された樹脂から成り、研磨布４を押圧する面にフィラー１０が露出していることにより、該押圧する面に微細な凹部１２を有している。若しくは、図３に示すように、テンプレート６は織布１１が含まれた樹脂であり、研磨布４を押圧する面に織布１１が露出していることにより、該押圧する面に微細な凹部１２を有している。   2 and 3 are examples of schematic views showing the periphery 9 of the polishing head in an enlarged manner. As shown in FIG. 2, the template 6 is made of a resin to which a filler 10 is added, and the filler 10 is exposed on the surface that presses the polishing pad 4, so that the pressing surface has a fine recess 12. ing. Alternatively, as shown in FIG. 3, the template 6 is a resin including a woven cloth 11, and the woven cloth 11 is exposed on the surface that presses the polishing cloth 4. 12.

研磨ヘッド２のその他部材は、特に限定されず、ワークの裏面とエッジ部を、それぞれバッキングパッドと上記凹部を有したテンプレートで保持できるものであれば、どのような構成としても良い。   The other members of the polishing head 2 are not particularly limited, and any configuration may be used as long as the back surface and the edge portion of the workpiece can be held by the template having the backing pad and the concave portion, respectively.

このような研磨装置１であれば、テンプレート６の凹部１２を介することで、研磨剤８がテンプレート６と研磨布４の間を均一に通り易くなり、研磨布４とワークＷの外周部との間に供給される研磨剤８の量を安定させ、ワークＷ表面と研磨布４表面に均一な砥粒濃度で研磨剤８を供給できる。その結果、特にワークＷ外周部における研磨速度が周内で安定し外周部の形状を平坦にすることができるため、高平坦なワークＷを得ることができる。また、厚みを適正化したテンプレート６を、フィラー１０が添加された樹脂又は織布１１が含まれた樹脂とし、研磨布４を押圧する面にフィラー１０又は織布１１を露出させることにより、微細な凹部１２を簡単かつ均一に形成することができる。従って、微細な凹部１２を加工するための複雑な加工装置や加工方法も必要なくコストを低く抑えることができる。   With such a polishing apparatus 1, the polishing agent 8 can easily pass between the template 6 and the polishing cloth 4 through the recess 12 of the template 6, and the polishing cloth 4 and the outer peripheral portion of the workpiece W can be connected to each other. The amount of the abrasive 8 supplied therebetween is stabilized, and the abrasive 8 can be supplied to the surface of the work W and the surface of the polishing cloth 4 with a uniform abrasive grain concentration. As a result, the polishing rate especially on the outer periphery of the work W is stable in the periphery and the shape of the outer periphery can be flattened, so that a highly flat work W can be obtained. Further, the template 6 having an optimized thickness is a resin to which a filler 10 is added or a resin containing a woven fabric 11, and the filler 10 or the woven fabric 11 is exposed on the surface against which the polishing cloth 4 is pressed. The concave portion 12 can be easily and uniformly formed. Therefore, a complicated processing apparatus and processing method for processing the fine recess 12 are not required, and the cost can be reduced.

このとき、テンプレート６の研磨布４を押圧する面における露出しているフィラー１０の表面占有率、または織布１１の表面占有率が５％以上８５％以下、より好ましくは８０％以下であることが好ましい。
このように、フィラー１０または織布１１の表面占有率が５％以上であれば、研磨布４とワークＷの外周部の間に供給される研磨剤８の量を安定させ、研磨布４とワークＷの外周部の間の研磨剤８の砥粒濃度のばらつきを抑制し、より確実にワークＷの平坦度を高くできる。また、該表面占有率を８５％以下にすることで、テンプレート６の研磨布４を押圧する面の摩耗を減らすことができ、削りカスの発生を抑えることができる。その結果、確実にキズ不良率が低いワークＷを得ることができる。 At this time, the surface occupancy ratio of the exposed filler 10 on the surface of the template 6 that presses the polishing cloth 4 or the surface occupancy ratio of the woven cloth 11 is 5% or more and 85% or less, more preferably 80% or less. Is preferred.
Thus, if the surface occupancy of the filler 10 or the woven fabric 11 is 5% or more, the amount of the abrasive 8 supplied between the polishing cloth 4 and the outer peripheral portion of the workpiece W is stabilized, and the polishing cloth 4 Variation in abrasive grain concentration of the abrasive 8 between the outer peripheral portions of the workpiece W can be suppressed, and the flatness of the workpiece W can be increased more reliably. Further, by setting the surface occupation ratio to 85% or less, it is possible to reduce the wear of the surface of the template 6 that presses the polishing pad 4 and to suppress the generation of scraps. As a result, it is possible to reliably obtain a workpiece W having a low scratch defect rate.

またこのとき、凹部１２の深さが０．０５ｍｍ以上であることが好ましい。
このようなものであれば、ワークの研磨中にテンプレート６の表面が共に研磨されても凹部１２をより長時間維持することができるため、テンプレートの寿命を向上できる。 Moreover, it is preferable that the depth of the recessed part 12 is 0.05 mm or more at this time.
If it is such, since the recessed part 12 can be maintained for a long time even if the surface of the template 6 is grind | polished together during grinding | polishing of a workpiece | work, the lifetime of a template can be improved.

さらに、凹部１２の開口幅が５ｍｍ以下で、凹部１２間のピッチが１０ｍｍ以下であることが好ましい。
このようなものであれば、研磨剤８の粗密がワーク外周部に与える影響を抑制でき、ワークＷの円周方向のうねりの発生を抑制することができる。その結果、より平坦度が良好なワークＷを得ることができる。 Furthermore, the opening width of the recesses 12 is preferably 5 mm or less, and the pitch between the recesses 12 is preferably 10 mm or less.
If it is such, the influence which the density of the abrasive | polishing agent 8 has on a workpiece | work outer peripheral part can be suppressed, and generation | occurrence | production of the waviness of the circumferential direction of the workpiece | work W can be suppressed. As a result, a workpiece W with better flatness can be obtained.

このとき、凹部１２と研磨布４との接触角が９０°以下であることが好ましい。
このようなものであれば、凹部１２によって研磨布４を傷つけることなくワークＷの研磨を行える。その結果、よりキズ不良率の低いワークＷを得ることができる。 At this time, the contact angle between the recess 12 and the polishing pad 4 is preferably 90 ° or less.
If it is such, the workpiece | work W can be grind | polished, without damaging the polishing cloth 4 by the recessed part 12. FIG. As a result, it is possible to obtain a workpiece W having a lower scratch defect rate.

以下、本発明の実施例及び比較例を示して本発明をより具体的に説明するが、本発明はこれらに限定されるものではない。   EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples of the present invention, but the present invention is not limited to these.

（実施例１）
本発明のワークの研磨装置を用いてワークの研磨を行い、研磨後のワークの平坦度とキズ不良率を評価した。 Example 1
The workpiece was polished using the workpiece polishing apparatus of the present invention, and the flatness and scratch defect rate of the polished workpiece were evaluated.

実施例１においては図１の研磨装置を用いた。この研磨装置に具備する研磨ヘッドは図２に示すものでテンプレート以外が図８の研磨ヘッドと同一のものを用いた。このときのテンプレートは、以下の方法で作製した。最大外形寸法が２ｍｍのガラス製フィラーを、濃度を調整して添加したビスフェノールＡ型エポキシ樹脂を準備し、これをスプレーで塗布したガラス繊維入りエポキシ樹脂製プリプレグを作製し、このプリプレグを研磨布に押圧する面側にして積層し、環状に加圧成形した。該テンプレートは厚さ７５０μｍで、研磨布を押圧する面における、露出しているフィラーの表面占有率が２５％であった。   In Example 1, the polishing apparatus of FIG. 1 was used. The polishing head provided in this polishing apparatus is as shown in FIG. 2, and the same polishing head as in FIG. 8 was used except for the template. The template at this time was produced by the following method. Prepare a glass fiber-filled epoxy resin prepreg coated with sprayed bisphenol A-type epoxy resin with a glass filler having a maximum outer dimension of 2 mm, and add the prepreg to the polishing cloth. The layers were laminated on the side to be pressed and pressure-formed in an annular shape. The template had a thickness of 750 μm, and the surface occupancy of the exposed filler on the surface against which the polishing cloth was pressed was 25%.

また、研磨対象として、直径３００ｍｍシリコンウェーハを使用した。研磨剤は、純水で希釈し、ｐＨが１０．５になるように苛性カリを添加した市販のコロイダルシリカスラリーを使用した。このとき、コロイダルシリカの砥粒の平均粒径３５ｎｍ〜７０ｎｍであった。研磨布には、市販の不織布タイプを使用し、研磨の際には、研磨ヘッドと研磨定盤を、それぞれ３０ｒｐｍで回転させた。ウェーハの研磨圧力(流体の圧力)は、１５０ｇ／ｃｍ２とした。ウェーハの研磨終了後に、ウェーハを洗浄し、ＫＬＡ―Ｔｅｎｃｏｒ社製ＷａｆｅｒＳｉｇｈｔを用いてウェーハの平坦度測定を行い、ＳＦＱＲｍａｘを評価した。また、ＫＬＡ―Ｔｅｎｃｏｒ社製ＳＰ−１を用いて表面のキズ不良率を評価した。 Further, a silicon wafer having a diameter of 300 mm was used as an object to be polished. The abrasive used was a commercially available colloidal silica slurry diluted with pure water and added with caustic potash so that the pH was 10.5. At this time, the average particle size of the colloidal silica abrasive grains was 35 nm to 70 nm. A commercially available non-woven fabric type was used as the polishing cloth, and the polishing head and the polishing platen were each rotated at 30 rpm during polishing. The wafer polishing pressure (fluid pressure) was 150 g / cm 2 . After the polishing of the wafer, the wafer was cleaned, and the flatness of the wafer was measured using WaferSight manufactured by KLA-Tencor, and SFQRmax was evaluated. Moreover, the surface defect rate was evaluated using SP-1 manufactured by KLA-Tencor.

（実施例２）
テンプレートが以下のように異なること以外、実施例１と同様な条件でワークの研磨を行い、研磨後のワークの平坦度とキズ不良率を評価した。このときのテンプレートは、以下の方法で作製した。ビスフェノールＡ型エポキシ樹脂を厚み０．１８ｍｍの平織の縦横ピッチ０．５ｍｍのガラス繊維クロスに含浸し、乾燥させて、表面用のプリプレグを作製した。このプリプレグを研磨布に押圧する面側にして積層し、厚さ７６０μｍの環状に加圧成形した。その後、研磨布に押圧する面側を研磨加工することで、ガラス繊維を網状に露出させた。該テンプレートは、研磨布を押圧する面における、露出しているガラス繊維クロスの表面占有率が１６％であった。 (Example 2)
The workpiece was polished under the same conditions as in Example 1 except that the templates were different as follows, and the flatness and the defect rate of the workpiece after polishing were evaluated. The template at this time was produced by the following method. Bisphenol A type epoxy resin was impregnated into a 0.18 mm thick plain weave glass fiber cloth having a vertical and horizontal pitch of 0.5 mm and dried to prepare a prepreg for the surface. This prepreg was laminated on the side to be pressed against the polishing pad, and pressure-molded into an annular shape having a thickness of 760 μm. Thereafter, the glass fiber was exposed in a net shape by polishing the surface side pressed against the polishing cloth. In the template, the surface occupancy ratio of the exposed glass fiber cloth on the surface against which the polishing cloth was pressed was 16%.

（比較例）
本発明のような凹部を有さない従来のテンプレートを用いた以外、実施例１と同様な条件でワークの研磨を行い、研磨後のワークの平坦度とキズ不良率を評価した。このときのテンプレートは、市販のガラス繊維入りエポキシ樹脂製円板を使用して作製した。該テンプレートは厚さ７５０μｍで研磨布を押圧する面にフィラー又はガラス繊維クロスが露出することによる凹部が存在しないもの、すなわち凹部の表面占有率は０％であった。 (Comparative example)
The workpiece was polished under the same conditions as in Example 1 except that a conventional template having no concave portions as in the present invention was used, and the flatness and scratch defect rate of the polished workpiece were evaluated. The template at this time was produced using the commercially available epoxy resin disk containing glass fiber. The template had a thickness of 750 μm and had no recesses due to the exposure of the filler or glass fiber cloth on the surface against which the polishing cloth was pressed, that is, the surface occupation ratio of the recesses was 0%.

実施例１、実施例２を、凹部表面占有率を４０％、６０％、８０％、８５％に変えて、同様の手順で研磨を繰り返した。その結果を図５、図６に示す。図５はテンプレートの研磨布を押圧する面における凹部表面占有率とＳＦＱＲｍａｘの相関を示す図である。実施例１、２と比較例の平坦度を測定したところ、実施例１、２ではいずれもウェーハ外周形状については平坦から弱いダレ形状を示し、ＳＦＱＲｍａｘは良好であった。比較例では、ウェーハ外周部形状としては、ハネが強いウェーハが多く観察され、ＳＦＱＲｍａｘは悪化した。
また、図６はテンプレートの研磨布を押圧する面における凹部表面占有率とキズ不良率の相関を示す図である。実施例１、２と比較例のキズ不良率を測定したところ、凹部表面占有率が４０％、６０％、８０％であるとき、キズ不良がほとんど無いウェーハを得ることができた。また、凹部表面占有率が８５％であるとき、キズ不良率は若干上がったが、それでも従来の１０％を超えるキズ不良率よりも低く抑えることができた。 Polishing was repeated in the same procedure as in Example 1 and Example 2, except that the concave surface area occupation ratio was changed to 40%, 60%, 80%, and 85%. The results are shown in FIGS. FIG. 5 is a diagram showing the correlation between the recess surface occupancy ratio and SFQRmax on the surface of the template against which the polishing cloth is pressed. When the flatness of Examples 1 and 2 and the comparative example was measured, in both Examples 1 and 2, the wafer outer peripheral shape showed a flat to weak sagging shape, and SFQRmax was good. In the comparative example, as the wafer outer peripheral portion shape, a lot of wafers with strong splashes were observed, and SFQRmax deteriorated.
FIG. 6 is a diagram showing the correlation between the recess surface occupancy ratio and the defect rate on the surface of the template against which the polishing cloth is pressed. When the scratch defect rates of Examples 1 and 2 and the comparative example were measured, a wafer having almost no scratch defects could be obtained when the recess surface occupancy was 40%, 60%, and 80%. Further, when the recess surface occupancy was 85%, the scratch defect rate slightly increased, but it could still be kept lower than the conventional scratch defect rate exceeding 10%.

なお、本発明は、上記実施形態に限定されるものではない。上記実施形態は例示であり、本発明の特許請求の範囲に記載された技術的思想と実質的に同一な構成を有し、同様な作用効果を奏するものは、いかなるものであっても本発明の技術的範囲に包含される。   The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

１…研磨装置、２…研磨ヘッド、３…定盤、
４…研磨布、５…バッキングパッド、６…テンプレート、
７…研磨剤供給機構、８…研磨剤、９…研磨ヘッド周辺部、
１０…フィラー、１１…織布、１２…凹部。 DESCRIPTION OF SYMBOLS 1 ... Polishing apparatus, 2 ... Polishing head, 3 ... Surface plate,
4 ... polishing cloth, 5 ... backing pad, 6 ... template,
7 ... Abrasive supply mechanism, 8 ... Abrasive, 9 ... Abrasion head periphery,
10 ... filler, 11 ... woven fabric, 12 ... recess.

Claims (5)

ワークを研磨するため研磨布と、研磨剤を供給するための研磨剤供給機構と、ワークを保持するための研磨ヘッドを具備し、該研磨ヘッドは前記ワークの裏面をバッキングパッドによって保持し、前記ワークのエッジ部を環状のテンプレートによって保持し、前記研磨布に前記ワークと前記テンプレートを押圧することで、前記ワークを前記研磨布に摺接させ、前記ワークを研磨するワークの研磨装置であって、
前記テンプレートは、フィラーが添加された樹脂又は織布が含まれた樹脂から成り、前記研磨布を押圧する面に前記フィラー又は前記織布が露出していることにより、該押圧する面に微細な凹部を有するものであることを特徴とするワークの研磨装置。 A polishing cloth for polishing a workpiece, an abrasive supply mechanism for supplying an abrasive, and a polishing head for holding the workpiece, the polishing head holding the back surface of the workpiece by a backing pad, A workpiece polishing apparatus for holding an edge portion of a workpiece by an annular template and pressing the workpiece and the template against the polishing cloth to bring the workpiece into sliding contact with the polishing cloth and polishing the workpiece. ,
The template is made of a resin to which a filler is added or a resin containing a woven fabric, and the filler or the woven fabric is exposed on the surface that presses the polishing cloth. An apparatus for polishing a workpiece, comprising a recess. 前記テンプレートの前記研磨布を押圧する面における前記露出しているフィラーの表面占有率、または織布の表面占有率が５％以上８５％以下であることを特徴とする請求項１に記載のワークの研磨装置。   The workpiece according to claim 1, wherein a surface occupancy ratio of the exposed filler or a surface occupancy ratio of the woven cloth on a surface of the template pressing the polishing cloth is 5% or more and 85% or less. Polishing equipment. 前記凹部の深さが０．０５ｍｍ以上であることを特徴とする請求項１または請求項２に記載のワークの研磨装置。   The workpiece polishing apparatus according to claim 1, wherein a depth of the concave portion is 0.05 mm or more. 前記凹部の開口幅が５ｍｍ以下で、凹部間のピッチが１０ｍｍ以下であることを特徴とする請求項１乃至請求項３のいずれか１項に記載のワークの研磨装置。   The workpiece polishing apparatus according to any one of claims 1 to 3, wherein an opening width of the recesses is 5 mm or less and a pitch between the recesses is 10 mm or less. 前記凹部と前記研磨布との接触角が９０°以下であることを特徴とする請求項１乃至請求項４のいずれか１項に記載のワークの研磨装置。
5. The workpiece polishing apparatus according to claim 1, wherein a contact angle between the concave portion and the polishing pad is 90 ° or less. 6.
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