JP2014222191A - 蛍光x線分析装置 - Google Patents
蛍光x線分析装置 Download PDFInfo
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- 229910000679 solder Inorganic materials 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000005204 segregation Methods 0.000 claims abstract description 18
- 229910020836 Sn-Ag Inorganic materials 0.000 claims abstract description 15
- 229910020988 Sn—Ag Inorganic materials 0.000 claims abstract description 15
- 238000001514 detection method Methods 0.000 claims abstract description 14
- 238000011156 evaluation Methods 0.000 claims abstract description 12
- 229910052709 silver Inorganic materials 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 238000002441 X-ray diffraction Methods 0.000 claims description 2
- 239000000203 mixture Substances 0.000 abstract description 19
- 238000011002 quantification Methods 0.000 abstract description 7
- 229910020816 Sn Pb Inorganic materials 0.000 description 4
- 229910020922 Sn-Pb Inorganic materials 0.000 description 4
- 229910008783 Sn—Pb Inorganic materials 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000004876 x-ray fluorescence Methods 0.000 description 4
- 238000011088 calibration curve Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 that is Substances 0.000 description 1
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Abstract
【解決手段】基板3a上にSn−Ag系の半田バンプ3bを形成した試料3にX線源1から1次X線2を照射して、発生する蛍光X線4の強度を検出手段9で測定する蛍光X線分析装置であって、検出手段9で測定したAg−Kα線の強度とSn−Kα線の強度との比に基づいて、半田バンプ3bの全体における銀の濃度である全体濃度を求めるとともに、検出手段9で測定したAg−Lα線の強度とSn−Lα線の強度との比に基づいて、半田バンプ3bの表面における銀の濃度である表面濃度を求める定量手段10と、全体濃度と表面濃度との差が所定値以下であるか否かによって、半田バンプ3bにおける偏析の評価を行う偏析評価手段11とを備える。
【選択図】図1
Description
2 1次X線
3 試料
3a 基板
3b 半田バンプ
4 蛍光X線
9 検出手段
10 定量手段
11 偏析評価手段
Claims (1)
- 基板上にSn−Ag系の半田バンプを形成した試料にX線源から1次X線を照射して、発生する蛍光X線の強度を検出手段で測定する蛍光X線分析装置であって、
前記検出手段で測定したAg−Kα線の強度とSn−Kα線の強度との比に基づいて、半田バンプの全体における銀の濃度である全体濃度を求めるとともに、前記検出手段で測定したAg−Lα線の強度とSn−Lα線の強度との比に基づいて、半田バンプの表面における銀の濃度である表面濃度を求める定量手段と、
前記全体濃度と前記表面濃度との差が所定値以下であるか否かによって、半田バンプにおける偏析の評価を行う偏析評価手段とを備えた蛍光X線分析装置。
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JP2014222191A true JP2014222191A (ja) | 2014-11-27 |
JP6191051B2 JP6191051B2 (ja) | 2017-09-06 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015118047A (ja) * | 2013-12-19 | 2015-06-25 | 高周波熱錬株式会社 | はんだ中の銅濃度定量方法 |
WO2020008727A1 (ja) * | 2018-07-04 | 2020-01-09 | 株式会社リガク | 蛍光x線分析装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006292688A (ja) * | 2005-04-14 | 2006-10-26 | Matsushita Electric Ind Co Ltd | ハンダ供試材の作製方法及び分析方法並びにハンダ槽管理システム |
US20070092060A1 (en) * | 2005-10-04 | 2007-04-26 | Thermo Niton Analyzers Llc | Analysis of Elemental Composition and Thickness in Multilayered Materials |
JP2013015539A (ja) * | 2007-01-01 | 2013-01-24 | Jordan Valley Semiconductors Ltd | 検査方法及び検査装置 |
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2013
- 2013-05-14 JP JP2013101900A patent/JP6191051B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006292688A (ja) * | 2005-04-14 | 2006-10-26 | Matsushita Electric Ind Co Ltd | ハンダ供試材の作製方法及び分析方法並びにハンダ槽管理システム |
US20070092060A1 (en) * | 2005-10-04 | 2007-04-26 | Thermo Niton Analyzers Llc | Analysis of Elemental Composition and Thickness in Multilayered Materials |
JP2009510479A (ja) * | 2005-10-04 | 2009-03-12 | サーモ ニトン アナライザーズ リミテッド ライアビリティ カンパニー | 多層材料の元素組成及び厚みの分析 |
JP2013015539A (ja) * | 2007-01-01 | 2013-01-24 | Jordan Valley Semiconductors Ltd | 検査方法及び検査装置 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015118047A (ja) * | 2013-12-19 | 2015-06-25 | 高周波熱錬株式会社 | はんだ中の銅濃度定量方法 |
WO2020008727A1 (ja) * | 2018-07-04 | 2020-01-09 | 株式会社リガク | 蛍光x線分析装置 |
JPWO2020008727A1 (ja) * | 2018-07-04 | 2021-07-08 | 株式会社リガク | 蛍光x線分析装置 |
US11733185B2 (en) | 2018-07-04 | 2023-08-22 | Rigaku Corporation | Fluorescent X-ray analysis apparatus comprising a plurality of X-ray detectors and an X-ray irradiation unit including a multi-wavelength mirror |
JP7394464B2 (ja) | 2018-07-04 | 2023-12-08 | 株式会社リガク | 蛍光x線分析装置 |
TWI837133B (zh) * | 2018-07-04 | 2024-04-01 | 日商理學股份有限公司 | 螢光x射線分析裝置 |
IL279576B1 (en) * | 2018-07-04 | 2024-05-01 | Rigaku Denki Co Ltd | Luminescent x-ray analysis device |
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