JP2014198356A - Band saw - Google Patents

Band saw Download PDF

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JP2014198356A
JP2014198356A JP2013074279A JP2013074279A JP2014198356A JP 2014198356 A JP2014198356 A JP 2014198356A JP 2013074279 A JP2013074279 A JP 2013074279A JP 2013074279 A JP2013074279 A JP 2013074279A JP 2014198356 A JP2014198356 A JP 2014198356A
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band saw
base material
continuous
abrasive grain
side edge
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JP6045960B2 (en
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恭 松本
Yasushi Matsumoto
恭 松本
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Noritake Co Ltd
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Noritake Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a band saw having preferable sharpness, generates crack rarely, and achieving preferable finish of a cut face of a workpiece.SOLUTION: A band saw 10 includes an abrasive grain layer 12 formed along one side edge part 11a of a base material 11 formed of a strip-shaped metal endless belt. The abrasive grain layer 12 has a continuous part 13 formed along a peripheral direction R of the side edge part 11a of the base material 11 and a swollen part 14 arranged alternatively to the continuous part 13 along the peripheral direction R of the base material 11. Thickness 14a of the swollen part 14 is larger than thickness 13a of the continuous part 13, and projection height 14b of the swollen part 14 is larger than projection height 13b of the continuous part 13. The continuous part 13 and the swollen part 14 forming the abrasive grain layer 12 are formed of a nickel plating layer including diamond abrasive grains.

Description

本発明は、シリコン、ガラス、石英などのインゴットの切断加工に使用されるバンドソーに関する。   The present invention relates to a band saw used for cutting a silicon, glass, quartz or other ingot.

従来のバンドソーとしては、金属エンドレスベルト製の母材の片方の側縁部に沿って半円状の砥粒層が所定間隔ごとに形成されたセグメントタイプと、同じく母材の片方の側縁部の全周に渡って砥粒層が形成された連続タイプと、が知られている。   As a conventional band saw, a segment type in which a semicircular abrasive grain layer is formed at predetermined intervals along one side edge of a base material made of a metal endless belt, and also one side edge of the base material And a continuous type in which an abrasive grain layer is formed over the entire circumference.

セグメントタイプのバンドソーは切れ味が良好であるが、切断作業を行っていくうちに、母材と砥粒層との境界部分からの亀裂が発生しやすいなどの短所がある。これに対し、連続タイプのバンドソーは亀裂が発生し難い点においては優れているが、研削液の供給性や切粉の排出性が悪く、切れ味が劣る面がある。   The segment type band saw has good sharpness, but has a disadvantage that cracks are likely to occur from the boundary between the base material and the abrasive grain layer during the cutting operation. On the other hand, the continuous type band saw is excellent in that it is difficult to generate cracks, but it has a poor grinding performance due to poor supply of grinding fluid and discharge of chips.

そこで、エンドレスベルトの全周に渡って連続的に形成された超砥粒層と、この超砥粒層からエンドレスベルト両面の幅方向に向けて延出されたセグメント型の超砥粒層とを備えた電着バンドソーが提案されている（例えば、特許文献１参照。）。   Therefore, a superabrasive grain layer continuously formed over the entire circumference of the endless belt, and a segment type superabrasive grain layer extending from the superabrasive grain layer in the width direction on both sides of the endless belt. An electrodeposition band saw provided has been proposed (see, for example, Patent Document 1).

特開２００５−５９１６４号公報（特許第４３９７１９３号公報）Japanese Patent Laying-Open No. 2005-59164 (Japanese Patent No. 4397193)

特許文献１記載の発明は、エンドレスベルトの側縁部に沿って連続的に形成された超砥粒層と、この砥粒層から幅方向に延出されたセグメント型の超砥粒層とを設けることによって、連続タイプ及びセグメントタイプの両方の長所を兼備した電着バンドソーを提供することを目的としている。   The invention described in Patent Document 1 includes a superabrasive grain layer continuously formed along the side edge of an endless belt, and a segment-type superabrasive grain layer extending in the width direction from the abrasive grain layer. By providing, it aims at providing the electrodeposition band saw which has the advantages of both a continuous type and a segment type.

しかしながら、特許文献１記載の電着バンドソーにおいては、連続型の砥粒層とセグメント型の砥粒層の突出高さ（被加工物に向かう方向に突出するサイズ）が同じであるため、切れ味が劣る面がある。   However, in the electrodeposition band saw described in Patent Document 1, since the protruding height (size protruding in the direction toward the workpiece) of the continuous abrasive layer and the segment abrasive layer is the same, the sharpness is reduced. There is an inferior aspect.

即ち、刃先側の砥材層の突出高さのない構造であるため、加工時に切り粉が砥材層上に目詰まりし易いことから、切れ味が劣る面がある。また、刃先側の砥材層の突出高さのない構造であることにより、加工時に刃先に負荷が加わり易いので、加工負荷により基板（母材）が変形し、加工精度が低下することがある。   That is, since the abrasive layer on the blade edge side does not have a protruding height, chips are likely to be clogged on the abrasive layer during processing, so that there is an inferior sharpness. In addition, since the structure with no protrusion height of the abrasive layer on the blade edge side, a load is easily applied to the blade edge during processing, so the substrate (base material) may be deformed by the processing load, and the processing accuracy may be reduced. .

そこで、本発明が解決しようとする課題は、切れ味が良好で、亀裂が発生し難く、被加工物の切断面の仕上がりも良好なバンドソーを提供することにある。   Therefore, the problem to be solved by the present invention is to provide a band saw that has a good sharpness, does not easily crack, and has a good cut surface finish.

本発明のバンドソーは、帯板状の金属エンドレスベルト製の母材の一方の側縁部に沿って形成された砥粒層を有し、前記砥粒層が、母材の側縁部の周方向に沿って形成された連続部と、前記母材の周方向に沿って前記連続部と交互に配列された膨出部と、を備え、前記膨出部が前記連続部より厚さ及び突出高さが大であることを特徴とする。ここで、前記「厚さ」とは母材の板厚方向のサイズをいい、前記「突出高さ」とは被加工物に向かう方向に突出するサイズをいう。   The band saw of the present invention has an abrasive grain layer formed along one side edge of a base material made of a strip-shaped metal endless belt, and the abrasive grain layer is formed around the side edge of the base material. A continuous portion formed along a direction and a bulging portion arranged alternately with the continuous portion along a circumferential direction of the base material, the bulging portion having a thickness and a protrusion from the continuous portion. The height is large. Here, the “thickness” refers to the size of the base material in the plate thickness direction, and the “projection height” refers to the size protruding in the direction toward the workpiece.

このような構成とすれば、連続部より厚さ及び突出高さが大である膨出部が被加工物に食い込むように作用するので、切れ味が良好であり、母材の側縁部に沿って交互に配置された連続部と膨出部とによって切削液の供給性及び切粉の排出性が確保されるので、被加工物の切断面の仕上がり（例えば、平面度など）も良好である。また、母材の側縁部に沿って連続部と膨出部とが交互に配置されていることにより、母材の側縁部の全周に渡って砥粒層が存在した状態となり、応力集中し易い母材と砥粒層との境界が表れないので、亀裂も発生し難い。   With such a configuration, the bulging portion having a thickness and a protruding height larger than the continuous portion acts so as to bite into the workpiece, so that the sharpness is good and along the side edge portion of the base material Since the supply of cutting fluid and the discharge of chips are ensured by the continuous portions and the bulging portions alternately arranged, the finished surface of the workpiece (for example, flatness, etc.) is also good. . In addition, the continuous portion and the bulging portion are alternately arranged along the side edge portion of the base material, so that the abrasive layer is present over the entire circumference of the side edge portion of the base material, and stress is applied. Since the boundary between the base material that tends to concentrate and the abrasive layer does not appear, cracks hardly occur.

ここで、前記連続部と前記膨出部との境界が滑らかな凹曲面で連続していることが望ましい。このような構成とすれば、応力集中し易い部分を少なくすることができるので、亀裂の防止に有効である。   Here, it is desirable that the boundary between the continuous portion and the bulging portion is continuous with a smooth concave surface. With such a configuration, it is possible to reduce the portion where stress is likely to concentrate, which is effective in preventing cracks.

一方、前記母材の周方向の前記連続部の長さが、前記膨出部の長さと同等であることが望ましい。このような構成とすれば、被加工物の切断面の外周部分にチッピングが発生するのを防止することができる。   On the other hand, it is desirable that the length of the continuous portion in the circumferential direction of the base material is equal to the length of the bulging portion. With such a configuration, it is possible to prevent chipping from occurring in the outer peripheral portion of the cut surface of the workpiece.

なお、前記連続部及び前記膨出部はダイヤモンド砥粒を含むニッケルメッキ層によって形成することができる。   In addition, the said continuous part and the said bulging part can be formed by the nickel plating layer containing a diamond abrasive grain.

本発明により、切れ味が良好で、亀裂が発生し難く、被加工物の切断面の仕上がりも良好なバンドソーを提供することができる。   According to the present invention, it is possible to provide a band saw that has a good sharpness, does not easily generate cracks, and has a good cut surface finish.

本発明の実施形態であるバンドソーを示す斜視図である。It is a perspective view which shows the band saw which is embodiment of this invention. 図１中の矢線Ｘ方向から見た図である。It is the figure seen from the arrow X direction in FIG. （ａ）は図１中のＡ−Ａ線における断面図であり、（ｂ）は図１中のＢ−Ｂ線における断面図である。(A) is sectional drawing in the AA line in FIG. 1, (b) is sectional drawing in the BB line in FIG. 本実施形態のバンドソーと従来品との加工数の違いを示すグラフである。It is a graph which shows the difference in the processing number of the band saw of this embodiment, and a conventional product. 本実施形態のバンドソーと従来品との加工変位の違いを示すグラフである。It is a graph which shows the difference in the processing displacement of the band saw of this embodiment, and a conventional product.

以下、図面に基づいて本発明の実施形態について説明する。図１〜図３に示すように、本実施形態のバンドソー１０は、帯板状の金属エンドレスベルト製の母材１１の一方の側縁部１１ａに沿って形成された砥粒層１２を有し、この砥粒層１２が、母材１１の側縁部１１ａの周方向Ｒに沿って形成された連続部１３と、母材１１の周方向Ｒに沿って連続部１３と交互に配列された膨出部１４とを備えている。膨出部１４の厚さ１４ａは連続部１３の厚さ１３ａより大であり、膨出部１４の突出高さ１４ｂは連続部１３の突出高さ１３ｂより大である。ここで、厚さ１３ａ，１４ａとは母材１１の板厚１１ｔ方向のサイズをいい、突出高さ１３ｂ，１４ｂとは被加工物（図示せず）に向かう方向Ｓに突出するサイズをいう。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in FIGS. 1-3, the band saw 10 of this embodiment has the abrasive grain layer 12 formed along one side edge part 11a of the base material 11 made from a strip-shaped metal endless belt. The abrasive layer 12 is alternately arranged with the continuous portions 13 formed along the circumferential direction R of the side edge portion 11 a of the base material 11 and the continuous portions 13 along the circumferential direction R of the base material 11. And a bulging portion 14. A thickness 14 a of the bulging portion 14 is larger than a thickness 13 a of the continuous portion 13, and a protruding height 14 b of the bulging portion 14 is larger than a protruding height 13 b of the continuous portion 13. Here, the thicknesses 13a and 14a refer to the size of the base material 11 in the direction of the plate thickness 11t, and the protruding heights 13b and 14b refer to the size protruding in the direction S toward the workpiece (not shown).

図１，図２に示すように、連続部１３と膨出部１４との境界１５は、砥粒層１２の表面の一部をなす滑らかな凹曲面で連続している。図１に示すように、母材１１の周方向Ｒの連続部１３の長さ１３ｒが、膨出部１４の周方向Ｒの長さ１４ｒと同等である。砥粒層１２を構成する連続部１３及び膨出部１４はダイヤモンド砥粒を含むニッケルメッキ層によって形成されている。   As shown in FIGS. 1 and 2, the boundary 15 between the continuous portion 13 and the bulging portion 14 is continuous with a smooth concave curved surface forming a part of the surface of the abrasive grain layer 12. As shown in FIG. 1, the length 13 r of the continuous portion 13 in the circumferential direction R of the base material 11 is equivalent to the length 14 r in the circumferential direction R of the bulging portion 14. The continuous portion 13 and the bulging portion 14 constituting the abrasive grain layer 12 are formed of a nickel plating layer containing diamond abrasive grains.

図１〜図３に示すように、バンドソー１０において、膨出部１４の厚さ１４ａ及び突出高さ１４ｂが、連続部１３の厚さ１３ａ及び突出高さ１３ｂより大であることにより、切断作業中は、膨出部１４が被加工物（図示せず）に食い込むように作用するので、切れ味が良好である。   As shown in FIGS. 1 to 3, in the band saw 10, the thickness 14 a and the protruding height 14 b of the bulging portion 14 are larger than the thickness 13 a and the protruding height 13 b of the continuous portion 13, thereby cutting work. Inside, since the bulging part 14 acts so that it may bite into a workpiece (not shown), the sharpness is good.

また、母材１１の側縁部１１ａに沿って交互に配置された連続部１３と膨出部１４とによって切削液の供給性及び切粉の排出性が確保されるので、被加工物（図示せず）の切断面の仕上がりも良好である。   Further, the supply of cutting fluid and the discharge of chips are ensured by the continuous portions 13 and the bulging portions 14 that are alternately arranged along the side edge portions 11a of the base material 11, so that the workpiece (FIG. The finish of the cut surface (not shown) is also good.

さらに、図１，図２に示すように、母材１１の側縁部１１ａに沿って連続部１３と膨出部１４とが交互に配置されていることにより、母材１１の側縁部１１ａの全周に渡って砥粒層１２が存在した状態となり、応力集中し易い母材１１と砥粒層１２との境界が周方向Ｒに表れないので、亀裂も発生し難い。   Further, as shown in FIGS. 1 and 2, the continuous portions 13 and the bulging portions 14 are alternately arranged along the side edge portion 11 a of the base material 11, whereby the side edge portion 11 a of the base material 11. Since the abrasive grain layer 12 is present over the entire circumference, the boundary between the base material 11 and the abrasive grain layer 12 where stress concentration is likely to occur does not appear in the circumferential direction R, so that cracks are hardly generated.

また、前述したように、連続部１３と膨出部１４との境界１５が滑らかな凹曲面で連続しているため、応力集中し易い部分が少なく、亀裂の防止に有効である。   As described above, since the boundary 15 between the continuous portion 13 and the bulging portion 14 is continuous with a smooth concave curved surface, there are few portions where stress is easily concentrated, which is effective in preventing cracks.

次に、図１に示すバンドソー１０（実施形態品）と従来のバンドソー（従来品）との切断試験の結果について説明する。実施形態品であるバンドソー１０は、全長が４３２０ｍｍ、幅１１ｗが６０ｍｍ、板厚１１ｔが０．５ｍｍの母材１１の一方の側縁部１１ａに沿ってダイヤモンド砥粒（粒度１４０／１７０）を含むニッケルメッキ層からなる砥粒層１２が形成されている。   Next, the result of the cutting test of the band saw 10 (the embodiment product) and the conventional band saw (conventional product) shown in FIG. 1 will be described. The band saw 10 as an embodiment product includes diamond abrasive grains (grain size 140/170) along one side edge portion 11a of the base material 11 having a total length of 4320 mm, a width 11w of 60 mm, and a plate thickness 11t of 0.5 mm. An abrasive grain layer 12 made of a nickel plating layer is formed.

図１，図２に示すように、バンドソー１０において、膨出部１４の配置間隔１４ｃは８ｍｍ、膨出部１４の周方向Ｒの長さ１４ｒは４ｍｍであり、連続部１３ｒの周方向Ｒの長さ１３ｒは４ｍｍである。   As shown in FIGS. 1 and 2, in the band saw 10, the arrangement interval 14c between the bulging portions 14 is 8 mm, the length 14r in the circumferential direction R of the bulging portions 14 is 4 mm, and the circumferential portion R in the circumferential direction R of the continuous portion 13r. The length 13r is 4 mm.

また、バンドソー１０の連続部１３の厚さ１３ａは０．７８ｍｍ、膨出部１４の厚さ１４ａは０．９４ｍｍであり、連続部１３の突出高さ１３ｂは０.１４ｍｍ、膨出部１４の突出高さ１４ｂは０．２２ｍｍである。   Further, the thickness 13a of the continuous portion 13 of the band saw 10 is 0.78 mm, the thickness 14a of the bulging portion 14 is 0.94 mm, the protruding height 13b of the continuous portion 13 is 0.14 mm, and the bulging portion 14 The protrusion height 14b is 0.22 mm.

一方、比較対象である従来品のバンドソーは、セグメントタイプであり、バンドソー１０と同じサイズの母材の一方の側縁部に沿って、ダイヤモンド砥粒（粒度１４０/１７０）を含むニッケルメッキ層で形成された砥粒層を備えている。従来品の砥粒層のサイズは基板厚み０．５ｍｍに対し、厚さ０．７８ｍｍ、突出高さ０．１４ｍｍであり、セグメントサイズはφ４ｍｍであり、母材の側縁部の長手方向に隣り合うセグメント中心部分とセグメント中心部分との間の距離は８ｍｍである。   On the other hand, the conventional band saw for comparison is a segment type, and is a nickel plating layer containing diamond abrasive grains (grain size 140/170) along one side edge of a base material having the same size as the band saw 10. A formed abrasive layer is provided. The size of the conventional abrasive grain layer is 0.78 mm thick and the protrusion height is 0.14 mm with respect to the substrate thickness of 0.5 mm, the segment size is φ4 mm, and is adjacent to the longitudinal direction of the side edge of the base material. The distance between the matching segment center portion and the segment center portion is 8 mm.

前述した従来品と、実施形態品であるバンドソー１０とを用いて、周速１２００ｍ／ｍｉｎ、切断送り速度２５ｍｍ／ｍｉｎの切断条件において、外径寸法１２インチの単結晶シリコンを切断したところ、図４，図５に示すような結果が得られた。   Using the conventional product described above and the band saw 10 of the embodiment, a single crystal silicon having an outer diameter of 12 inches was cut under the cutting conditions of a peripheral speed of 1200 m / min and a cutting feed speed of 25 mm / min. 4. Results as shown in FIG. 5 were obtained.

図４は、従来品と実施形態品との「加工数（カット）」の違いを示している。ここで、「加工数（カット）」とは、外径寸法１２インチの単結晶シリコンを規定の加工変位量内で切断した数量である。図４に示すように、従来品の加工数が約５００程度であるのに対し、実施形態品（バンドソー１０）の加工数は約８００であることから、実施形態品（バンドソー１０）は規定の加工変位量内で加工できる数量において優れていることが判る。   FIG. 4 shows the difference in the “number of processing (cut)” between the conventional product and the embodiment product. Here, the “number of cuts (cut)” is a quantity obtained by cutting single crystal silicon having an outer diameter of 12 inches within a specified amount of machining displacement. As shown in FIG. 4, the number of processed products of the embodiment product (band saw 10) is about 800, whereas the number of processed products of the embodiment product (band saw 10) is about 800 while the number of processed products of the conventional product is about 500. It can be seen that the quantity that can be machined within the machining displacement is excellent.

次に、図５は、従来品と実施形態品との「加工変位（μｍ）」の違いを示している。ここで、「加工変位（μｍ）」とは、静止状態のバンドソーのたわみ量をゼロ点とした場合に、ワーク加工中に基板（母材）がたわむ量のことである。図５に示すように、従来品の加工変位が約５５μｍ程度であるのに対し、実施形態品（バンドソー１０）の加工変位は約４９μｍであることから、実施形態品（バンドソー１０）は加工時のバンドソーのたわみ量において優れていることが判る。   Next, FIG. 5 shows the difference in “working displacement (μm)” between the conventional product and the embodiment product. Here, “processing displacement (μm)” is the amount of deflection of the substrate (base material) during workpiece processing when the amount of deflection of the stationary band saw is zero. As shown in FIG. 5, the machining displacement of the embodiment product (band saw 10) is about 49 μm, whereas the machining displacement of the embodiment product (band saw 10) is about 49 μm while the machining displacement of the conventional product is about 55 μm. It can be seen that the band saw is excellent in the amount of deflection.

なお、前述した実施形態に係るバンドソー１０は本発明の一例を示すものであり、本発明のバンドソーは図１〜図５に基づいて説明したバンドソー１０に限定されない。   In addition, the band saw 10 which concerns on embodiment mentioned above shows an example of this invention, and the band saw of this invention is not limited to the band saw 10 demonstrated based on FIGS. 1-5.

本発明のバンドソーは、シリコン、ガラス、石英などのインゴットの切断工具として、電子・電気機器の製造業などの分野において広く利用することができる。   The band saw of the present invention can be widely used as a cutting tool for ingots such as silicon, glass, and quartz in fields such as the manufacturing industry of electronic and electrical equipment.

１０ バンドソー
１１ 母材
１１ａ 側縁部
１１ｔ 板厚
１１ｗ 幅
１２ 砥粒層
１３ 連続部
１４ 膨出部
１３ａ，１４ａ 厚さ
１３ｂ，１４ｂ 突出高さ
１３ｒ，１４ｒ 長さ
１４ｃ 配置間隔
１５ 境界
Ｒ 周方向
Ｓ 被加工物に向かう方向 DESCRIPTION OF SYMBOLS 10 Band saw 11 Base material 11a Side edge part 11t Thickness 11w Width 12 Abrasive grain layer 13 Continuous part 14 Swelling part 13a, 14a Thickness 13b, 14b Protrusion height 13r, 14r Length 14c Arrangement interval 15 Boundary R Circumferential direction S Direction to work piece

Claims (4)

帯板状の金属エンドレスベルト製の母材の一方の側縁部に沿って形成された砥粒層を有し、前記砥粒層が、前記母材の側縁部の周方向に沿って形成された連続部と、前記母材の周方向に沿って前記連続部と交互に配列された膨出部とを備え、前記膨出部が前記連続部より厚さ及び突出高さが大であることを特徴とするバンドソー。   It has an abrasive grain layer formed along one side edge of a base material made of a strip-shaped metal endless belt, and the abrasive grain layer is formed along the circumferential direction of the side edge of the base material And a bulging portion alternately arranged with the continuous portion along the circumferential direction of the base material, and the bulging portion has a thickness and a protruding height larger than those of the continuous portion. A band saw characterized by that. 前記連続部と前記膨出部との境界が滑らかな凹曲面で連続している請求項１記載のバンドソー。   The band saw according to claim 1, wherein a boundary between the continuous portion and the bulging portion is continuous with a smooth concave curved surface. 前記母材の周方向の前記連続部の長さが、前記膨出部の長さと同等である請求項１または２記載のバンドソー。   The band saw according to claim 1 or 2, wherein a length of the continuous portion in the circumferential direction of the base material is equal to a length of the bulging portion. 前記連続部及び前記膨出部がダイヤモンド砥粒を含むニッケルメッキ層によって形成された請求項１〜３のいずれかに記載のバンドソー。   The band saw in any one of Claims 1-3 in which the said continuous part and the said bulging part were formed of the nickel plating layer containing a diamond abrasive grain.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017196695A (en) * 2016-04-27 2017-11-02 株式会社アマダホールディングス Abrasive-grain saw blade
JP2021154442A (en) * 2020-03-27 2021-10-07 株式会社ノリタケカンパニーリミテド Electro-deposition band saw

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6124120U (en) * 1984-07-18 1986-02-13 一男 佐藤 band saw
JPS61284317A (en) * 1985-06-07 1986-12-15 Sanwa Daiyamondo Kogyo Kk Endless band saw for cutting hard material
JPH10202425A (en) * 1997-01-24 1998-08-04 Nachi Fujikoshi Corp Electro plated band saw
JP2003205471A (en) * 2002-01-08 2003-07-22 Hitachi Cable Ltd Blade for cutting hard and brittle material
JP2005059164A (en) * 2003-08-18 2005-03-10 Asahi Diamond Industrial Co Ltd Electro-deposition band saw
JP2006278701A (en) * 2005-03-29 2006-10-12 Kyocera Corp Manufacturing method for semiconductor wafer
WO2014063910A1 (en) * 2012-10-24 2014-05-01 Nv Bekaert Sa A flat fixed abrasive sawing wire

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6124120U (en) * 1984-07-18 1986-02-13 一男 佐藤 band saw
JPS61284317A (en) * 1985-06-07 1986-12-15 Sanwa Daiyamondo Kogyo Kk Endless band saw for cutting hard material
JPH10202425A (en) * 1997-01-24 1998-08-04 Nachi Fujikoshi Corp Electro plated band saw
JP2003205471A (en) * 2002-01-08 2003-07-22 Hitachi Cable Ltd Blade for cutting hard and brittle material
JP2005059164A (en) * 2003-08-18 2005-03-10 Asahi Diamond Industrial Co Ltd Electro-deposition band saw
JP2006278701A (en) * 2005-03-29 2006-10-12 Kyocera Corp Manufacturing method for semiconductor wafer
WO2014063910A1 (en) * 2012-10-24 2014-05-01 Nv Bekaert Sa A flat fixed abrasive sawing wire

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017196695A (en) * 2016-04-27 2017-11-02 株式会社アマダホールディングス Abrasive-grain saw blade
JP2021154442A (en) * 2020-03-27 2021-10-07 株式会社ノリタケカンパニーリミテド Electro-deposition band saw

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