JP2014186396A - Downsized ic card manufacturing method - Google Patents

Downsized ic card manufacturing method Download PDF

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JP2014186396A
JP2014186396A JP2013059114A JP2013059114A JP2014186396A JP 2014186396 A JP2014186396 A JP 2014186396A JP 2013059114 A JP2013059114 A JP 2013059114A JP 2013059114 A JP2013059114 A JP 2013059114A JP 2014186396 A JP2014186396 A JP 2014186396A
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card
module
substrate
external terminal
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JP6143510B2 (en
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Hideaki Arai
英朗 新井
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Toshiba Corp
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Abstract

PROBLEM TO BE SOLVED: To enable a downsized IC card to be manufactured without the need for a card base material for an ID-1 size.SOLUTION: A manufacturing method of a downsized IC card includes: preparing a supporting body that mounts an IC module composed of an external terminal part consisting of a plurality of contact terminals provided on one surface side, and an LSI encapsulation part arranged and provided on an opposite side of the external terminal part on the other surface side; preparing a card base material that has a housing concavity part for housing the LSI encapsulation part on one surface side; housing the LSI encapsulation part of the IC module in the housing concavity part by overlapping one surface side of the card base material with the other surface side of the supporting body, and adheredly anchoring the card base material and the supporting body; and after adheredly anchored, punching out the supporting body and the card base material together along an external periphery part of the external terminal of the IC module.

Description

本発明の実施形態は、小型ICカードの製造方法に関する。   Embodiments described herein relate generally to a method for manufacturing a small IC card.

携帯電話加入者のID認証のために小型ICカードとしてUIM（User Identity Module）カードが用いられている。UIMカードはETSI TS 102 221にて規定されるPlug-in UICC（Universal Integrated Circuit Card）とMini-UICCの２種類のサイズが一般的に使用されている。   A UIM (User Identity Module) card is used as a small IC card for ID authentication of mobile phone subscribers. UIM cards are generally used in two sizes: Plug-in UICC (Universal Integrated Circuit Card) and Mini-UICC defined in ETSI TS 102 221.

なお、最近では、ETSI TS 102 221にて規定されるMini-UICCカードより小さいサイズの4FFカードを携帯電話に取り付けて使用するものもある。   Recently, some 4FF cards having a size smaller than the Mini-UICC card defined in ETSI TS 102 221 are attached to a mobile phone.

この小型ICカードは、以下のようにして製造されている。   This small IC card is manufactured as follows.

まず、表面に複数の接触端子からなる外部端子部を複数配したテープ状基板を用意し、このテープ状基板の裏面側に各外部端子部の反対側に位置してICチップをそれぞれ実装する。この実装後、ICチップのパッドと外部端子部とをボンディングホールに挿通されるボンデンィングワイヤを介して電気的に接続し、ICチップを封止材で封止することによりICモジュールを作成する。この作成後、テープ状基板からICモジュール毎に打ち抜き、この打ち抜いたICモジュールを予めICカード状に形成されたカード基材に埋め込む。そして、この埋め込み後、カード基材のICモジュール周辺に、カード基材の一部を残して打ち抜いて溝を形成することによりカード基材よりも小サイズの小型ICカードを形成する。   First, a tape-like substrate having a plurality of external terminal portions each composed of a plurality of contact terminals is prepared on the surface, and an IC chip is mounted on the back side of the tape-like substrate so as to be opposite to each external terminal portion. After this mounting, the IC chip pad and the external terminal portion are electrically connected via a bonding wire inserted into the bonding hole, and the IC chip is sealed with a sealing material to produce an IC module. After the creation, each IC module is punched from the tape-like substrate, and the punched IC module is embedded in a card base formed in advance in an IC card shape. Then, after this embedding, a small IC card smaller than the card base is formed by punching around the IC module of the card base leaving a part of the card base to form a groove.

なお、カード基材としては、通常、Plug-in UICCとMini-UICCのサイズより大きいISO/IEC 7810:2003に規定されるサイズのID-1カードが用いられる。   As a card substrate, an ID-1 card having a size defined in ISO / IEC 7810: 2003, which is larger than the size of Plug-in UICC and Mini-UICC, is usually used.

利用に当たっては、カード基材から小型ICカードを切り離して携帯電話に取り付けて使用される。   In use, a small IC card is detached from the card substrate and attached to a mobile phone.

特開２０１２−１９８６７７号公報JP 2012-198677 A

しかしながら、従来においては、小型ICカードよりも大きなサイズ、即ち、ID-1サイズのカード基材を必要としていたため、その分コストが上昇してしまうという問題があった。   However, in the past, since a card base having a size larger than that of a small IC card, that is, an ID-1 size was required, there was a problem that the cost was increased accordingly.

そこで、この実施の形態では、ID-1サイズのカード基材を必要とすることなく、小型ICカードを製造できるようにした小型ICカードの製造方法を提供する。   Therefore, in this embodiment, there is provided a method for manufacturing a small IC card that allows a small IC card to be manufactured without the need for an ID-1 size card substrate.

上記課題を解決するため、実施形態は、一面側に設けられる複数の接触端子からなる外部端子部、及び、他面側に前記外部端子部の反対側に位置して設けられるLSI封止部からなるICモジュールを実装する支持体を用意し、一面側に前記LSI封止部を収納するための収納用凹部を有したカード基材を用意し、前記支持体の他面側に前記カード基材の一面側を重ね合わせてその収納用凹部内に前記ICモジュールのLSI封止部を収納して接着固定し、この接着固定後、前記支持体と前記カード基材とを前記ICモジュールの外部端子の外周部に沿って一緒に打ち抜き加工する。   In order to solve the above-described problem, the embodiment includes an external terminal portion including a plurality of contact terminals provided on one surface side, and an LSI sealing portion provided on the other surface side opposite to the external terminal portion. A support for mounting the IC module is prepared, a card base having a recess for storing the LSI sealing portion on one side is prepared, and the card base is provided on the other side of the support The LSI sealing portion of the IC module is housed and bonded and fixed in the storage recess by superimposing one surface side of the IC module, and after the bonding and fixing, the support and the card substrate are connected to external terminals of the IC module. Stamped together along the outer perimeter of

一実施形態である小型ICカードを示す平面図。The top view which shows the small IC card which is one Embodiment. 図１の小型ICカードを示す正面図。The front view which shows the small IC card of FIG. 一実施形態である複数個のICモジュールを実装するテープ状基板を示す平面図。The top view which shows the tape-shaped board | substrate which mounts the some IC module which is one Embodiment. 図３のテープ状基板を示す正面図。The front view which shows the tape-shaped board | substrate of FIG. 一実施形態であるカード基材を示す平面図。The top view which shows the card | curd base material which is one Embodiment. 図５のカード基材を示す断面図。Sectional drawing which shows the card | curd base material of FIG. 図１の小型ICカードの製造方法を示す図。The figure which shows the manufacturing method of the small IC card of FIG. 図７のテープ状基板とカード基材とが重ね合わされて接着固定された状態を示す図。The figure which shows the state by which the tape-shaped board | substrate and card | curd base material of FIG. 図８のテープ状基板とカード基材とを一緒に打ち抜くための部位を示す図。The figure which shows the site | part for punching out the tape-shaped board | substrate and card | curd base material of FIG.

以下、実施の形態について、図面を参照して説明する。   Hereinafter, embodiments will be described with reference to the drawings.

図１は、接触式のICカード、例えば、携帯電話用のUIMカード１を示す平面図で、図２はその正面図である。   FIG. 1 is a plan view showing a contact IC card, for example, a UIM card 1 for a mobile phone, and FIG. 2 is a front view thereof.

UIMカード１は、カード基板２と、このカード基板２に重ね合わされたモジュール基板４とから構成され、モジュール基板４にはICモジュール３が実装されている。   The UIM card 1 includes a card substrate 2 and a module substrate 4 superimposed on the card substrate 2, and an IC module 3 is mounted on the module substrate 4.

ICモジュール３は、モジュール基板４の表面側に設けられた外部端子部５と、モジュール基板４の裏面側に設けられたLSIを封止材で封止してなるLSI封止部６とによって構成されている。   The IC module 3 includes an external terminal portion 5 provided on the front surface side of the module substrate 4 and an LSI sealing portion 6 formed by sealing an LSI provided on the back surface side of the module substrate 4 with a sealing material. Has been.

外部端子部５は、ISO/IEC 7816-2:2007の端子位置に準拠する接触端子としての端子C１〜C3、及び端子C5〜C7を有している。   The external terminal unit 5 has terminals C1 to C3 and terminals C5 to C7 as contact terminals conforming to the terminal positions of ISO / IEC 7816-2: 2007.

LSI封止部６のLSIのパッドと外部端子部５の端子C１〜C3、C5〜C7とは図示しないボンディングワイヤを介して電気的に接続されている。   The LSI pads of the LSI sealing unit 6 and the terminals C1 to C3 and C5 to C7 of the external terminal unit 5 are electrically connected via bonding wires (not shown).

図３は、支持体としてのテープ状基板１１を示す平面図で、図４はその正面図である。   FIG. 3 is a plan view showing a tape-like substrate 11 as a support, and FIG. 4 is a front view thereof.

テープ状基板１１には、所定間隔を存して複数個のICモジュール３が搭載されている。テープ状基板１１の両側部にはその走行方向に亘って多数個の空孔１２が穿設されている。テープ状基板１１の空孔１２には歯車が噛み合わされ、この歯車の回転により、カード製造位置へとテープ状基板１１が搬送されるようになっている。   A plurality of IC modules 3 are mounted on the tape-like substrate 11 with a predetermined interval. A large number of holes 12 are formed in both sides of the tape-like substrate 11 in the running direction. A gear is meshed with the hole 12 of the tape-like substrate 11, and the tape-like substrate 11 is conveyed to the card manufacturing position by the rotation of this gear.

図５は、カード基材１３を示す平面図で、図６はその断面図である。   FIG. 5 is a plan view showing the card substrate 13, and FIG. 6 is a sectional view thereof.

カード基材１３には、所定間隔を存して複数個の収納用凹部１４がざぐり加工されている。これら収納用凹部１４には、上記したテープ状基板１１に搭載されたICモジュール３のLSI封止部６が収納されるようになっている。   The card base 13 is counterbored with a plurality of storage recesses 14 at predetermined intervals. These storage recesses 14 store the LSI sealing portion 6 of the IC module 3 mounted on the tape-shaped substrate 11 described above.

なお、カード基材１３には、８個の収納用凹部１４が形成されているが、８個に限られることなく、任意の個数で良い。   The card base 13 is formed with eight storage recesses 14, but is not limited to eight and may be any number.

次に、上記したUIMカード１の製造方法について説明する。   Next, a method for manufacturing the UIM card 1 will be described.

まず、図７に示すように、テープ状基板１１をICカード製造位置へと搬送する。そして、この製造位置で、テープ状基板１１に対し、カード基材１３を離間対向させてその収納用凹部１４内に接着剤（図示しない）を充填する。この対向時には、テープ状基板１１のICモジュール３のLSI封止部６とカード基材１３の収納用凹部１４とが対向された状態とする。   First, as shown in FIG. 7, the tape-shaped substrate 11 is transported to the IC card manufacturing position. Then, at this manufacturing position, the card base 13 is separated from and opposed to the tape-like substrate 11, and an adhesive (not shown) is filled in the storage recess 14. At the time of this opposition, the LSI sealing portion 6 of the IC module 3 of the tape-like substrate 11 and the storing concave portion 14 of the card base 13 are opposed to each other.

こののち、カード基材１３を矢印で示すように上昇させて図８に示すように、テープ状基板１１に重ね合わせてそのLSI封止部６をカード基材１３の収納用凹部１４内に収納させて接着固定する。   Thereafter, the card base 13 is raised as indicated by an arrow, and as shown in FIG. 8, the LSI sealing portion 6 is stored in the storage recess 14 of the card base 13 by being superimposed on the tape-like substrate 11. And fix it.

このように接着固定したのち、図９に示すように、テープ状基板１１の上部側からその各ICモジュール３の外周部を破線に沿って金型により打ち抜く。この打ち抜き時には、テープ状基板１１とともにカード基材１３が一緒に打ち抜き加工され、図１及び図２に示すようにICカード１が製造される。   After bonding and fixing in this way, as shown in FIG. 9, the outer peripheral portion of each IC module 3 is punched out from the upper side of the tape-like substrate 11 by a die along the broken line. At the time of punching, the card base 13 is punched together with the tape-like substrate 11, and the IC card 1 is manufactured as shown in FIGS.

上記したように、この実施の形態によれば、テープ状基板１１にカード基材１３を重ね合わせてその収納用凹部１４内にICモジュールのLSI封止部６を収納させて接着固定し、ICモジュールの外周部をテープ状基板１１とともにカード基材１３を一緒に打ち抜いてICカード１を最終形態の状態で製造するため、カード基材１３の大部分を有効に使用できるという利点を有する。   As described above, according to this embodiment, the card base 13 is superposed on the tape-like substrate 11 and the LSI sealing portion 6 of the IC module is accommodated in the accommodating recess 14 and bonded and fixed. Since the IC card 1 is manufactured in the final state by punching the card base 13 together with the tape-like substrate 11 at the outer periphery of the module, it has an advantage that most of the card base 13 can be used effectively.

なお、上記実施の形態では、６個の端子C１〜C3、C5〜C7のみが存在する６端子用のテープ状基板１１を用いて小型ICカードを製造したが、これに限られることなく、４FF用のテープ状基板を用いて小型ICカードを製造するものであってもよい。   In the above embodiment, the small IC card is manufactured using the tape-like substrate 11 for six terminals having only the six terminals C1 to C3 and C5 to C7. However, the present invention is not limited to this. A small IC card may be manufactured using a tape-shaped substrate for use.

なお、上記した実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。この新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。   The above-described embodiment is presented as an example, and is not intended to limit the scope of the invention. The novel embodiment can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

C1〜C3、5〜C7…接触端子、３…ICモジュール、４…モジュール基板、５…外部端子部、６…LSI封止部、１１…テープ状基板（支持体）、１３…カード基材、１４…収納用凹部。   C1 to C3, 5 to C7 ... contact terminals, 3 ... IC module, 4 ... module substrate, 5 ... external terminal portion, 6 ... LSI sealing portion, 11 ... tape-like substrate (support), 13 ... card base material, 14: Recess for storage.

Claims (4)

一面側に設けられる複数の接触端子からなる外部端子部、及び、他面側に前記外部端子部の反対側に位置して設けられるLSI封止部からなるICモジュールを実装する支持体を用意し、
一面側に前記LSI封止部を収納するための収納用凹部を有したカード基材を用意し、
前記支持体の他面側に前記カード基材の一面側を重ね合わせてその収納用凹部内に前記ICモジュールのLSI封止部を収納して接着固定し、
この接着固定後、前記支持体と前記カード基材とを前記ICモジュールの外部端子の外周部に沿って一緒に打ち抜き加工する小型ICカードの製造方法。 Prepare a support for mounting an IC module consisting of an external terminal part consisting of a plurality of contact terminals provided on one side and an LSI sealing part located on the other side opposite to the external terminal part. ,
Prepare a card substrate having a recess for storing the LSI sealing portion on one side,
The one side of the card base material is overlaid on the other side of the support, and the LSI sealing portion of the IC module is stored and bonded and fixed in the storage recess.
A method of manufacturing a small IC card, in which, after this bonding and fixing, the support and the card substrate are punched together along the outer peripheral portion of the external terminal of the IC module. 前記支持体は前記ICモジュールを複数実装し、前記カード基材は前記複数個のICモジュールを収納する複数個の収納用凹部を有する請求項１記載の小型ICカードの製造方法。   2. The method of manufacturing a small IC card according to claim 1, wherein the supporting body mounts a plurality of the IC modules, and the card substrate has a plurality of storage recesses for storing the plurality of IC modules. 前記外部端子部は、C1〜C3、及びC5〜C7の６端子によって構成される請求項１または２記載の小型ICカードの製造方法。   The method of manufacturing a small IC card according to claim 1 or 2, wherein the external terminal portion includes six terminals C1 to C3 and C5 to C7. 前記小型ICカードは４FFで、その外径寸法と接触端子はETSI TS 102 221に規定される請求項１または２記載の小型ICカードの製造方法。   The method of manufacturing a small IC card according to claim 1 or 2, wherein the small IC card is 4FF, and an outer diameter and a contact terminal thereof are defined in ETSI TS 102 221.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5626451A (en) * 1979-05-17 1981-03-14 Gao Ges Automation Org Identification card having ic chip and method of manufacturing same
JP2010073050A (en) * 2008-09-19 2010-04-02 Toshiba Corp Ic card and method for manufacturing the same
US20110101105A1 (en) * 2008-01-21 2011-05-05 Schropf Grundwurmer Manuela Card-shaped data carrier
JP2014534493A (en) * 2011-09-28 2014-12-18 ジェマルト・テクノロジーズ・アジア・リミテッド Method for manufacturing a data carrier with a microcircuit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5626451A (en) * 1979-05-17 1981-03-14 Gao Ges Automation Org Identification card having ic chip and method of manufacturing same
US20110101105A1 (en) * 2008-01-21 2011-05-05 Schropf Grundwurmer Manuela Card-shaped data carrier
JP2010073050A (en) * 2008-09-19 2010-04-02 Toshiba Corp Ic card and method for manufacturing the same
JP2014534493A (en) * 2011-09-28 2014-12-18 ジェマルト・テクノロジーズ・アジア・リミテッド Method for manufacturing a data carrier with a microcircuit

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