JP2014175090A - LED lighting device - Google Patents
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- JP2014175090A JP2014175090A JP2013044522A JP2013044522A JP2014175090A JP 2014175090 A JP2014175090 A JP 2014175090A JP 2013044522 A JP2013044522 A JP 2013044522A JP 2013044522 A JP2013044522 A JP 2013044522A JP 2014175090 A JP2014175090 A JP 2014175090A
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Abstract
Description
本発明は、ＬＥＤ素子を光源に使用したＬＥＤ照明装置に関し、特に天井に直接取り付ける天井直付け型のＬＥＤ照明装置に関するものである。 The present invention relates to an LED lighting device using an LED element as a light source, and more particularly to a ceiling-mounted LED lighting device directly attached to a ceiling.
近年、環境意識の高まりから、省電力化に優れたＬＥＤ素子を光源に使用した、電源内蔵型の電球型ＬＥＤランプが普及してきた。更に最近は、天井埋め込み型のダウンライトや、天井直付け型のシーリングライトにおいても、ＬＥＤ素子を使用した照明装置が開発され、市場に導入されてきている。
天井埋め込み型のダウンライトは、天井面に大きな孔をあけるものであり、その孔あけ作業や、また孔部の補強が必要であり、施工時に手間がかかるものである。そこで、大きな孔をあけることのない照明装置が検討されている（特許文献１、２）。
また天井直付けシーリングライトは、天井面に取り付けられた引掛シーリングボディに、引掛シーリングアダプタを取り付けた照明装置を装着するものであり、特に最近は厚みの薄いシーリングライトも検討されている（特許文献３）。
2. Description of the Related Art In recent years, due to an increase in environmental awareness, a light bulb type LED lamp with a built-in power source using an LED element excellent in power saving as a light source has been widely used. More recently, lighting devices using LED elements have also been developed and introduced into the market for ceiling-mounted downlights and ceiling-mounted ceiling lights.
The ceiling-embedded downlight is for making a large hole in the ceiling surface, and it is necessary to reinforce the hole and reinforce the hole, which takes time during construction. Then, the illuminating device which does not open a big hole is examined (patent document 1, 2).
In addition, the ceiling-mounted ceiling light is a device in which a lighting device having a hook ceiling adapter is attached to a hook ceiling body attached to the ceiling surface. Recently, a ceiling light with a small thickness has been studied (patent document). 3).
例えば特許文献１に記載されている照明装置は、給電部、ＬＥＤ、ＬＥＤと同一平面上にある点灯装置とが取り付けられたベース板が取付ネジにより天井面に直接ネジ止めされるもので、天井面には円筒形状の給電部が挿入される挿入孔が形成されていて、挿入孔に挿入された給電部に対して、電力供給用の電源線が接続される。それによって天井面に大きな孔をあけることなく天井面に直接取り付けることができる照明装置が提供される。
また特許文献２に記載されている照明装置は、光源及び当該光源に電源を供給する電源ブロックが内部に収納され、天井面に取り付けられる器具本体内部に、外部電線が電気的に接続される速結端子を備えたものであり、薄型化を図りつつ施工性を向上させた照明器具が提供される。
For example, in the illumination device described in Patent Document 1, a base plate to which a power feeding unit, an LED, and a lighting device on the same plane as the LED are attached is directly screwed to a ceiling surface with an attachment screw. An insertion hole into which a cylindrical power feeding part is inserted is formed on the surface, and a power supply power line is connected to the power feeding part inserted into the insertion hole. Accordingly, an illumination device that can be directly attached to the ceiling surface without providing a large hole in the ceiling surface is provided.
In addition, the lighting device described in Patent Document 2 includes a light source and a power block that supplies power to the light source, and a speed at which an external electric wire is electrically connected to the interior of the fixture body attached to the ceiling surface. Provided is a lighting fixture that includes a connection terminal and has improved workability while being thin.
特許文献３に記載されている照明装置は、照明モジュールと、照明モジュールに電力を供給する電源部と、照明モジュール及び電源部を保持するシャーシと、シャーシを引掛シーリングボディに取り付ける引掛シーリングアダプタとを備え、照明モジュール、電源部及び引掛シーリングアダプタは、夫々が引掛シーリングボディに対して互いに重なり合わないようにシャーシに配されている。それによって引掛シーリングボディからの照明モジュール、電源部及び引掛シーリングアダプタの突設高さを低減することができ、薄型化を図った照明装置が提供される。 The illumination device described in Patent Document 3 includes an illumination module, a power supply unit that supplies power to the illumination module, a chassis that holds the illumination module and the power supply unit, and a hooking ceiling adapter that attaches the chassis to the hooking ceiling body. The lighting module, the power supply unit, and the hooking ceiling adapter are arranged on the chassis so as not to overlap each other with respect to the hooking sealing body. As a result, the protruding heights of the lighting module, the power supply unit, and the hooking ceiling adapter from the hooking ceiling body can be reduced, and a lighting device that is reduced in thickness is provided.
特許文献１に記載される照明装置においては、ＬＥＤ光の照射側に、狭角配光部と広角配光部を有する配光制御部材を設け、配光制御部材を回転させてＬＥＤ光の集光、拡散をすることができるようになっているが、このような特殊形状の配光制御部材の制作は高価であり、ＬＥＤ光を照明装置の照明面方向に均一に照射させることができない。また、特許文献２,３の照明装置では、ＬＥＤ光の照明面方向への拡散対策について何ら開示されていない。 In the illumination device described in Patent Document 1, a light distribution control member having a narrow-angle light distribution part and a wide-angle light distribution part is provided on the LED light irradiation side, and the light distribution control member is rotated to collect LED light. Although light and diffusion can be performed, production of such a specially shaped light distribution control member is expensive, and LED light cannot be uniformly irradiated in the direction of the illumination surface of the illumination device. Moreover, in the illuminating device of patent document 2, 3, it is not disclosed at all about the countermeasure against the spreading | diffusion of the LED light to the illumination surface direction.
本発明は、以上のような課題を解決するため鋭意検討した結果なされたものであり、簡単な構成でＬＥＤ光を照明面方向に均一に拡散させ、ムラのない照明効果が得られるＬＥＤ照明装置を提供することを目的とする。 The present invention has been made as a result of intensive studies to solve the above-mentioned problems, and an LED illumination device capable of uniformly diffusing LED light in the direction of the illumination surface with a simple configuration and obtaining a uniform illumination effect. The purpose is to provide.
上記課題を解決するため、請求項１に記載の発明にあっては、ＬＥＤ素子が実装されたＬＥＤ基板と前記ＬＥＤ基板を点灯駆動する点灯回路基板を備えたＬＥＤランプ本体と、前記点灯回路基板に実装された電子部品の領域を覆う遮蔽部材と、前記遮蔽部材の光照射面側に配置された光拡散部材と、該光拡散部材の光照射面側に配置された透光カバー、とを備えたことを特徴とする。 In order to solve the above-mentioned problem, in the invention according to claim 1, an LED lamp body including an LED board on which an LED element is mounted, a lighting circuit board that drives the LED board to light, and the lighting circuit board A shielding member that covers a region of the electronic component mounted on the light diffusion member, a light diffusion member that is disposed on the light irradiation surface side of the shielding member, and a translucent cover that is disposed on the light irradiation surface side of the light diffusion member. It is characterized by having.
また請求項２の発明にあっては、前記光拡散部材に、前記透光性カバー端縁部と密接するリブが形成されていることを特徴とする。 The invention according to claim 2 is characterized in that the light diffusion member is formed with ribs that are in close contact with the edge of the translucent cover.
また請求項３の発明にあっては、前記光拡散部材は前記ＬＥＤ基板と遮蔽部材を覆う平面形状であることを特徴とする。 The invention of claim 3 is characterized in that the light diffusion member has a planar shape covering the LED substrate and the shielding member.
また請求項４の発明にあっては、前記遮蔽部材は半透明であることを特徴とする。 According to a fourth aspect of the present invention, the shielding member is translucent.
また請求項５の発明にあっては、前記ＬＥＤ基板と点灯回路基板が同一平面上に配置されていることを特徴とする。 The invention according to claim 5 is characterized in that the LED substrate and the lighting circuit substrate are arranged on the same plane.
また請求項６の発明にあっては、前記遮蔽部材の内面側に拡散反射面が形成されていることを特徴とする。 The invention according to claim 6 is characterized in that a diffuse reflection surface is formed on the inner surface side of the shielding member.
上述した本発明によれば、特にＬＥＤ基板の光照射面側に光拡散部材を配置したことにより、簡単な構成でＬＥＤ光を照明面方向に均一に拡散させ、ムラのない照明効果が得られる。 According to the present invention described above, the light diffusing member is disposed particularly on the light irradiation surface side of the LED substrate, so that the LED light can be uniformly diffused in the direction of the illumination surface with a simple configuration, and a uniform illumination effect can be obtained. .
以下に本発明の好適な実施の形態について、図面を参照しながら説明する。なお本実施形態は一例であり、これに限定されるものではない。 Preferred embodiments of the present invention will be described below with reference to the drawings. This embodiment is an example, and the present invention is not limited to this.
図１から図４に示したように、本実施形態に係わるＬＥＤ照明装置１００は、連結板１と、ＬＥＤランプ本体２とからなり、外部電源線（Ｆ−ケーブル等）３が出ている直径１５ｍｍ（この直径に限定されるものではない）の孔４−１が開いた天井面４に連結板１がネジ止めされ、該連結板１にＬＥＤランプ本体２が着脱自在に装着される。連結板１にＬＥＤランプ本体２が装着されるときに、ＬＥＤランプ本体２と外部電源線３とが接続され、ＬＥＤ照明装置１００はダウンライトとして使用可能となる。なお直径１５ｍｍ以下の孔４−１であれば、天井に特別な補強を施すことがないので、施工性良くＬＥＤ照明装置を取り付けることができる。 As shown in FIGS. 1 to 4, the LED lighting device 100 according to this embodiment includes a connecting plate 1 and an LED lamp body 2, and a diameter from which an external power line (F-cable or the like) 3 is projected. The connecting plate 1 is screwed to the ceiling surface 4 having a hole 4-1 of 15 mm (not limited to this diameter), and the LED lamp body 2 is detachably attached to the connecting plate 1. When the LED lamp body 2 is mounted on the connecting plate 1, the LED lamp body 2 and the external power supply line 3 are connected, and the LED lighting device 100 can be used as a downlight. If the hole 4-1 has a diameter of 15 mm or less, no special reinforcement is applied to the ceiling, so that the LED lighting device can be attached with good workability.
連結板１は、ステンレス板を使用して、打抜加工、プレス加工、折曲加工等によって作成される。連結板１は円盤形状で、図５から図９に示すように、中央部に、左右対称に扇形となったリボン形の貫通孔１３−１が形成されており、この貫通孔１３−１の左右扇形部が回動規制孔部１３となっている。また、この貫通孔１３−１の中心部、すなわち連結板１の中心部に円形開口部が形成され、その円形開口部が連結板電源挿通部１１となっている。なお、連結板１は板状である必要はなく、円盤形状や函体形状等の立体形状の部材を含んでいる。 The connecting plate 1 is made of a stainless steel plate by punching, pressing, bending, or the like. As shown in FIGS. 5 to 9, the connecting plate 1 has a disk-shaped ribbon-shaped through hole 13-1 formed symmetrically in the center as shown in FIGS. 5 to 9. The left and right fan-shaped portions are rotation restricting hole portions 13. In addition, a circular opening is formed in the central portion of the through hole 13-1, that is, the central portion of the connecting plate 1, and the circular opening serves as the connecting plate power supply insertion portion 11. In addition, the connection plate 1 does not need to be plate-shaped, and includes a three-dimensional member such as a disk shape or a box shape.
前記連結板電源挿通部１１の縁部には一対の連結板位置決め突出部１２が突設されている。連結板位置決め突出部１２は、断面円弧形の湾曲片であり、連結板１の回転軸に沿って天井面４方向に起立している（ここでは、連結板１と同一中心を有する直径１４ｍｍ、外壁厚１ｍｍ、高さ１５mmの仮想円筒の外壁の一部からなるように、対向する所定の長さの円弧から延出した２つの湾曲片である）。この一対の連結板位置決め突出部１２によって、前記天井面孔４−１に対する連結板１の位置決めが容易となり、連結板１を簡単に天井面４に取り付けることができる。 A pair of connecting plate positioning protrusions 12 project from the edge of the connecting plate power supply insertion portion 11. The connecting plate positioning protrusion 12 is a curved piece having a circular arc cross section, and stands in the direction of the ceiling surface 4 along the rotation axis of the connecting plate 1 (here, a diameter of 14 mm having the same center as the connecting plate 1). 2 curved pieces extending from arcs of a predetermined length facing each other so as to consist of a part of the outer wall of a virtual cylinder having an outer wall thickness of 1 mm and a height of 15 mm). The pair of connecting plate positioning protrusions 12 facilitate positioning of the connecting plate 1 with respect to the ceiling surface hole 4-1, and the connecting plate 1 can be easily attached to the ceiling surface 4.
また連結板１には、ＬＥＤランプ本体２を回動させて連結板１と係合させるための回動係合部１４が連結板１の周方向に複数（ここでは、９０度間隔に４箇所）設けられている。回動係合部１４は、略扇形状の開口部１４−１と係止舌片１４−２とを有している。係止舌片１４−２は、図６、図８に示すように連結板１の裏面側（ＬＥＤランプ本体２と接合する面側）に一体的に形成されており、開口部１４−１の開口部よりも小さく、該開口部１４−１と相似形に形成されている。この係止舌片１４−２は、連結板１の周方向（回転方向）に沿って開口部１４−１の一端縁部から開口部１４−１を臨むように設置されている。なお係止舌片１４−２の先端には、回動係合が外れるのを防止するための爪１４−３が形成されている。なお、１３−２は連結板１を天井面４にネジ止めするためのネジ穴である。 Further, the connecting plate 1 includes a plurality of rotating engaging portions 14 for rotating the LED lamp main body 2 to engage with the connecting plate 1 in the circumferential direction of the connecting plate 1 (here, four locations at intervals of 90 degrees). ) Is provided. The rotation engaging portion 14 has a substantially fan-shaped opening 14-1 and a locking tongue piece 14-2. As shown in FIGS. 6 and 8, the locking tongue piece 14-2 is integrally formed on the back surface side (the surface side to be joined to the LED lamp body 2) of the connecting plate 1, and the opening tongue 14-1. It is smaller than the opening and is formed in a similar shape to the opening 14-1. The locking tongue piece 14-2 is installed so as to face the opening 14-1 from the edge of the opening 14-1 along the circumferential direction (rotation direction) of the connecting plate 1. A claw 14-3 is formed at the tip of the locking tongue piece 14-2 to prevent the rotational engagement from being released. Reference numeral 13-2 denotes a screw hole for screwing the connecting plate 1 to the ceiling surface 4.
ＬＥＤランプ本体２は、図１０から図１４及び図２０に示すように、筐体２１と、筐体２１の内部に収納される外部電源線が接続される速結端子２２と、速結端子２２を収納する速結端子収納部２３と、複数のＬＥＤ素子２４とＬＥＤ素子２４を点灯させる点灯回路を構成する各種電子部品２５とが実装された基板２６（回路基板）と、電子部品２５を覆う遮蔽板２７と、筐体２１の下部開口部を覆う透光性カバー２８とから概略構成されている。 As shown in FIGS. 10 to 14 and 20, the LED lamp body 2 includes a housing 21, a quick connection terminal 22 to which an external power supply line housed in the housing 21 is connected, and a quick connection terminal 22. A board 26 (circuit board) on which a plurality of LED elements 24 and various electronic components 25 constituting a lighting circuit for lighting the LED elements 24 are mounted, and the electronic components 25 are covered. The shield plate 27 and the translucent cover 28 that covers the lower opening of the housing 21 are schematically configured.
筐体２１は、アルミニウムを使用して、下端部が開口した中空の有底円筒で高さの低い扁平な形状に形成されている。連結板１に接合される筐体２１の上面部２１−１には、筐体２１の内部に向かって円形に凹んだ凹部２１−２が形成されている。また、上面部２１−１の外周縁には、連結板１の厚みと同じ高さの突縁部２１−８が形成されており、ＬＥＤランプ本体２を連結板１に装着したときに、一体化する構造となっている。なお、前記凹部２１−２は、前記連結板１の係止舌片１４−２が入り込める深さとなっている。 The casing 21 is made of aluminum and has a hollow bottomed cylinder with an open lower end and is formed into a flat shape with a low height. The upper surface portion 21-1 of the housing 21 joined to the connecting plate 1 is formed with a concave portion 21-2 that is recessed in a circular shape toward the inside of the housing 21. Further, a protruding edge portion 21-8 having the same height as the thickness of the connecting plate 1 is formed on the outer peripheral edge of the upper surface portion 21-1, and when the LED lamp main body 2 is attached to the connecting plate 1, it is integrated. It becomes the structure which becomes. In addition, the said recessed part 21-2 becomes the depth which the latching tongue piece 14-2 of the said connection board 1 can enter.
凹部２１−２の中央部には、小片形（平面長方形）の回動規制突起２１−６が凸設されており、その中心部には、中空で楕円筒形状のＬＥＤランプ位置決め突出部２１−４が立設されている。回動規制突起２１−６は、図１３に示すように凹部２１−２の上面部に一体形成されており、内部は後述する速結端子収納部２３を収納するために空洞となっている。 A small piece (planar rectangular) rotation restricting projection 21-6 is provided at the center of the recess 21-2, and at the center thereof is a hollow, elliptical cylindrical LED lamp positioning projection 21-. 4 is erected. As shown in FIG. 13, the rotation restricting projection 21-6 is integrally formed on the upper surface portion of the recess 21-2, and the inside is hollow to accommodate a quick connection terminal accommodating portion 23 described later.
ＬＥＤランプ位置決め突起部２１−４は、断面が略楕円形の筒体であり、回動規制突起２１−６が形成されていない左右両側面部は薄肉となって係合溝部２１−５が対向して形成されており、この係合溝部２１−５に前記連結板位置決め突出部１２が係合するようになっている。ＬＥＤランプ位置決め突起部２１−４は、ＬＥＤランプ電源挿通部２１−３を兼ねており、このＬＥＤランプ電源挿通部２１−３に、後述するように結束端子収納部２３と結束端子２２が収納されている。 The LED lamp positioning protrusion 21-4 is a cylindrical body having a substantially elliptical cross section, and the left and right side surfaces where the rotation restricting protrusion 21-6 is not formed are thin so that the engaging groove 21-5 faces. The connecting plate positioning protrusion 12 is engaged with the engaging groove 21-5. The LED lamp positioning protrusion 21-4 also serves as the LED lamp power supply insertion portion 21-3, and the binding terminal storage portion 23 and the binding terminal 22 are stored in the LED lamp power supply insertion portion 21-3 as will be described later. ing.
ここでは、ＬＥＤランプ位置決め突出部３１−４の外径は１４ｍｍであり、係合溝２１−５の深さは１ｍｍである。またＬＥＤランプ電源挿通部２１−３の周縁部には、連結板１に向かって延出する、外径が１４ｍｍの円筒形状のＬＥＤランプ位置決め突出部２１−４が形成されている（言い換えると、この実施形態では、筒状のＬＥＤランプ電源挿通部２１−３の肉厚部がＬＥＤランプ位置決め突出部２１−４となり、薄肉部が係合溝２１−５となっている）。 Here, the outer diameter of the LED lamp positioning protrusion 31-4 is 14 mm, and the depth of the engagement groove 21-5 is 1 mm. Further, a cylindrical LED lamp positioning protrusion 21-4 having an outer diameter of 14 mm extending toward the connecting plate 1 is formed at the peripheral edge of the LED lamp power supply insertion portion 21-3 (in other words, In this embodiment, the thick part of the cylindrical LED lamp power supply insertion part 21-3 is the LED lamp positioning protrusion 21-4, and the thin part is the engagement groove 21-5).
前記回動規制突起２１−６は、連結板１の回動規制孔部１３に挿入され、回動規制孔部１３の扇を形成する角度で回動でき、この回動角度によってＬＥＤランプ本体２の回動範囲が決定されている。また係合溝２１−５の溝幅も、前記回動できる角度に対応して連結板位置決め突出部１２の幅よりも広く形成されている。 The rotation restricting projection 21-6 is inserted into the turn restricting hole 13 of the connecting plate 1 and can be turned at an angle that forms a fan of the turn restricting hole 13, and the LED lamp main body 2 is turned by this turning angle. The rotation range is determined. The groove width of the engaging groove 21-5 is also formed wider than the width of the connecting plate positioning protrusion 12 corresponding to the pivotable angle.
これら各種部材の構造や寸法によって、連結板位置決め突出部１２と、ＬＥＤランプ位置決め突出部２１−４とが係合したときにできる係合体は、薄さを保った状態で外径１４ｍｍの円筒空間に収まる構造となっている。それによって、連結板１を介していても、扁平なＬＥＤ照明装置１００を実現でき、かつ天井面４に設けられた孔４−１に対して、それぞれの電源挿通部の開口部がずれることなく簡単に開口面が合わせられ取り付けやすい構造となっている。 Depending on the structure and dimensions of these various members, the engagement body formed when the connecting plate positioning protrusion 12 and the LED lamp positioning protrusion 21-4 are engaged with each other is a cylindrical space having an outer diameter of 14 mm in a thin state. It is a structure that fits in. Thereby, even if it connects via the connection board 1, the flat LED lighting apparatus 100 is realizable, and the opening part of each power supply insertion part does not shift | deviate with respect to the hole 4-1 provided in the ceiling surface 4. It has a structure in which the opening surfaces are easily aligned and easy to install.
一方、凹部２１−２の段部近傍の筐体２１の上面部２１−１には、ＬＥＤランプ本体２の中心方向に向けて延出する台形の回動係止片２１−７が形成されている。該回動係止片２１−７は、連結板１の開口部１４−１に挿入可能な大きさに形成されている。なお、図１０に示す２１−９は、後述する基板２６と遮蔽板２７を固定するネジ穴である。 On the other hand, a trapezoidal rotation locking piece 21-7 extending toward the center direction of the LED lamp body 2 is formed on the upper surface portion 21-1 of the casing 21 in the vicinity of the stepped portion of the recess 21-2. Yes. The rotation locking piece 21-7 is formed in a size that can be inserted into the opening 14-1 of the connecting plate 1. In addition, 21-9 shown in FIG. 10 is a screw hole which fixes the board | substrate 26 and the shielding board 27 which are mentioned later.
回動係止片２１−７は、開口部１４−１に挿入され、連結板１の下面側に筐体２１を接合した後に回動すると、連結板１の係止舌片１４−２の上面部に係合されることになる。このとき、係止舌片１４−２の先端には爪１４−３が形成されているので、クリック感によりＬＥＤランプ本体２の装着が完了したことがわかるようになっている。また前述したように、爪１４−３によって筐体２１を装着後の回動が規制され、不用意に取り外れないようになっているが、連結板１とＬＥＤランプ本体２とを繋ぐ落下防止用チェーンや、回動を規制、解除するロック構造を別途設けてもよい。 When the rotation locking piece 21-7 is inserted into the opening 14-1 and rotated after the housing 21 is joined to the lower surface side of the connecting plate 1, the upper surface of the locking tongue piece 14-2 of the connecting plate 1 is obtained. It will be engaged with the part. At this time, since the claw 14-3 is formed at the tip of the locking tongue piece 14-2, it can be seen that the mounting of the LED lamp body 2 is completed by a click feeling. Further, as described above, the rotation after the housing 21 is mounted is restricted by the claw 14-3 so that it cannot be inadvertently removed, but the fall prevention that connects the connecting plate 1 and the LED lamp body 2 is prevented. An additional chain or a lock structure for restricting and releasing the rotation may be provided.
前記速結端子２２は、図１６に示すように、一対の連結端子２２−１から構成され、金属板を加工してＬ字状に形成されたものであって、上部側に外部電源線が差し込まれる左右一対の上部支持片２２−３と下部支持片２２−４を有しており、下部側に接触子２２−２を一体に有している。下部支持片２２−４の一方は、上端部が下方に屈曲した押え片２２−５となっており、接触子２２−２は外側に略Ｖ字形に屈曲した形状となっている。連結端子２２−１は電源端子台等に用いられている公知の速結端子と同じ構造である。 As shown in FIG. 16, the quick connection terminal 22 is composed of a pair of connection terminals 22-1 and is formed in an L shape by processing a metal plate. A pair of left and right upper support pieces 22-3 and a lower support piece 22-4 are inserted, and a contactor 22-2 is integrally provided on the lower side. One of the lower support pieces 22-4 is a presser piece 22-5 whose upper end is bent downward, and the contact 22-2 is bent outward in a substantially V shape. The connection terminal 22-1 has the same structure as a known quick connection terminal used for a power supply terminal block or the like.
このような速結端子２２には外部電源線３（Ｆケーブル）の芯線が差し込まれ、その電源線３は上部支持片２２−３と下部支持片２２−４により支持される。接触子２２−２は、板バネとなっており、後述するように基板２６の電力入力面に押圧されて接触し、該速結端子２２によって、外部電源線３と基板２６とが電気的に接続される。 The core wire of the external power supply line 3 (F cable) is inserted into such a quick connection terminal 22, and the power supply line 3 is supported by the upper support piece 22-3 and the lower support piece 22-4. The contact 22-2 is a leaf spring, and is pressed against and contacted with the power input surface of the board 26 as will be described later. The external connection line 3 and the board 26 are electrically connected by the quick connection terminal 22. Connected.
前記速結端子２２は、図１７から図１９に示すような速結端子収納部２３に収納される。速結端子収納部２３は、電気絶縁性の樹脂で形成されたものであり、全体が逆Ｔ字形状に形成されている。具体的には、結束端子収納部２３は、外部電源線３が挿入される開口部２３−１を備えた略楕円筒形状の縦筒部２３−２と、内部が空洞となっている直方体形状の底延部２３−３を有しており、縦筒部２３−２の内部に２個の連結端子２２−１が収容され、底延部２３−３に接触子２２−２が収容される。 The quick connection terminal 22 is accommodated in a quick connection terminal accommodating portion 23 as shown in FIGS. The quick connection terminal accommodating portion 23 is formed of an electrically insulating resin, and is formed in an inverted T shape as a whole. Specifically, the binding terminal storage portion 23 includes a substantially elliptical cylindrical portion 23-2 having an opening 23-1 into which the external power supply line 3 is inserted, and a rectangular parallelepiped shape having a hollow inside. Bottom extending portion 23-3, two connecting terminals 22-1 are accommodated in the vertical cylindrical portion 23-2, and contacts 22-2 are accommodated in the bottom extending portion 23-3. .
縦筒部２３−２の開口部２３−１の形状は略楕円形状であり、中央部に絶縁板２３−４が設けられ、図１９に示すように縦筒部２３−２の内部には、電線挿入孔２３−５を有する２つに分割された収容空間２３−６が備えられている。２個の連結端子２２−１が収容空間２３−６に離されて配置され、また中央部に設けた絶縁板２３−４が、開口部２３−１まで延出されているので沿面距離が大きく取られており、外部電源線の2本の芯線や、2個の連結端子２２−１の間には十分な絶縁性が確保されている。 The shape of the opening 23-1 of the vertical cylinder part 23-2 is substantially elliptical, and an insulating plate 23-4 is provided in the center part. As shown in FIG. The housing space 23-6 divided into two having the electric wire insertion hole 23-5 is provided. The two connecting terminals 22-1 are arranged apart from the accommodation space 23-6, and the insulating plate 23-4 provided at the center extends to the opening 23-1, so that the creepage distance is large. Thus, sufficient insulation is ensured between the two core wires of the external power line and the two connecting terminals 22-1.
速結端子２２を収納した速結端子収納部２３は、図１３に示すように、筐体２１の内側から挿入され、縦筒部２３−２が筐体２１のＬＥＤランプ位置決め突出部２１−４の内部空間に収納され、底延部２３−３が回動規制突起２１−６の内部空間に収納される。 As shown in FIG. 13, the quick connection terminal storage portion 23 storing the quick connection terminals 22 is inserted from the inside of the housing 21, and the vertical tube portion 23-2 is the LED lamp positioning protrusion 21-4 of the housing 21. The bottom extension 23-3 is stored in the internal space of the rotation restricting projection 21-6.
速結端子収納部２３の内部下端部にはストッパ２３−５が内挿されており、速結端子２２に挿入された外部電源線３の先端部が、基板２６やその基板２６に実装されたＬＥＤ素子、電子部品等と接触することを規制し、それらの内装部品の破損を防いでいる。ストッパ２３−５は、ここでは連結端子２２の接触子２２−２により弾性的に挟持された状態となっている。 A stopper 23-5 is inserted at the inner lower end of the quick connection terminal storage portion 23, and the distal end portion of the external power supply line 3 inserted into the quick connection terminal 22 is mounted on the substrate 26 or the substrate 26. Contact with LED elements, electronic parts, etc. is restricted, and damage to the interior parts is prevented. Here, the stopper 23-5 is elastically held by the contact 22-2 of the connecting terminal 22.
本実施形態では、外部電源線の芯線を直接装着する速結端子を用いたが、外部電源線の芯線に外径１４ｍｍのプラグを取り付け、ＬＥＤランプ本体２の内部に該プラグが挿着されるコネクタを収納してもよい。更に該コネクタの前記プラグ挿着側の他端側に、前述の速結端子２２と同様に、基板２６の電力入力面に押圧されて接触する接触子を設けてもよい。
また本実施形態では、速結端子２２をＬＥＤランプ本体２に収容したが、これに限定されず、連結板１の連結板電源挿通部１１に速結端子２２を取り付けてもよく、更に連結端子２２−１と接触子２２−２を分割し、連結端子２２−１を連結板１に取り付け、接触子２２−２をＬＥＤランプ本体２に取り付け、連結板１にＬＥＤランプ本体２を装着するときに、連結端子２２−１と接触子２２−２が接続され、一体となる速結端子としてもよい。
また、ＬＥＤランプ本体２から点灯回路に繋がった電源線を伸ばし、その先端にプラグを取り付け、前記外部電源線のプラグに挿着してもよい。
In this embodiment, the quick connection terminal for directly attaching the core wire of the external power supply line is used. However, a plug having an outer diameter of 14 mm is attached to the core wire of the external power supply wire, and the plug is inserted into the LED lamp body 2. A connector may be stored. Further, a contact that is pressed against and contacted with the power input surface of the substrate 26 may be provided on the other end side of the connector on the plug insertion side, similarly to the above-described quick connection terminal 22.
Moreover, in this embodiment, although the quick connection terminal 22 was accommodated in the LED lamp main body 2, it is not limited to this, The quick connection terminal 22 may be attached to the connection board power supply insertion part 11 of the connection board 1, and also a connection terminal. 22-1 and contact 22-2 are divided, the connecting terminal 22-1 is attached to the connecting plate 1, the contact 22-2 is attached to the LED lamp body 2, and the LED lamp body 2 is attached to the connecting plate 1. Further, the connecting terminal 22-1 and the contact 22-2 may be connected to form an integral quick-connecting terminal.
Moreover, the power supply line connected to the lighting circuit may be extended from the LED lamp main body 2, a plug may be attached to the tip of the power supply line, and the external power supply line may be inserted into the plug.
ＬＥＤ素子２４としては公知の種々のＬＥＤを用いることができる。本実施形態では、照明用の白色光を発光する高輝度タイプのＬＥＤ素子が用いられている。 Various known LEDs can be used as the LED element 24. In this embodiment, a high-luminance type LED element that emits white light for illumination is used.
点灯回路を構成する電子部品２５は、過電流保護、ノイズカット、整流、平滑、調光制御などを行うための各種ダイオード、コンデンサー、ＩＣ、抵抗などの公知の電子部品である。 The electronic component 25 constituting the lighting circuit is a known electronic component such as various diodes, capacitors, ICs, resistors for performing overcurrent protection, noise cut, rectification, smoothing, dimming control, and the like.
前記基板２６は、円盤形状の平板で、両面に銅箔が貼られたガラスエポキシ基板であり、片面側にＬＥＤ素子２４と電子部品２５とが実装されている。図２２は、基板２６の実装面側（表側）であり、基板２６の中心部側に円形の実装領域Ａが、該実装領域Ａの外側に帯状の半円環形状（略３／４周）の実装領域Ｂが形成されている。実装領域ＡにＬＥＤ素子２４が実装されており、実装領域Ｂに電子部品２５が実装されている。また実装領域Ｂの一部には貫通孔２６−１が備えられていて、他の電子部品に比べて大きな電解コンデンサー等が横向きに設置されている。なお、２６−５は基板２６を筐体２１に固定するためのネジ穴である。 The said board | substrate 26 is a glass epoxy board | substrate with which copper foil was affixed on both surfaces, and the LED element 24 and the electronic component 25 are mounted in the single side | surface. FIG. 22 is the mounting surface side (front side) of the substrate 26, a circular mounting area A on the center side of the substrate 26, and a belt-like semi-annular shape (approximately 3/4 round) outside the mounting area A Mounting region B is formed. The LED element 24 is mounted in the mounting area A, and the electronic component 25 is mounted in the mounting area B. Moreover, a through hole 26-1 is provided in a part of the mounting region B, and a large electrolytic capacitor or the like is installed sideways as compared with other electronic components. Reference numeral 26-5 denotes a screw hole for fixing the substrate 26 to the housing 21.
実装領域Ａと実装領域Ｂの間は、電流が流れる部分を残して前記銅箔が取り除かれ、両側の実装領域よりも熱抵抗が大きい円環状領域Ｃ（熱伝導係数の小さな高熱抵抗領域）となっている。円環の幅は、基板の厚みよりも大きく形成されており、ＬＥＤ素子２４で発生した熱は、実装領域Ｂよりも、基板裏面に早く到達する。
更に、円環状領域Ｃの基板を切り取って貫通したスリットを形成してもよい。これによって更に円環状領域Ｃの熱抵抗を大きくすることがでる。
Between the mounting area A and the mounting area B, the copper foil is removed leaving a portion where current flows, and an annular area C (high thermal resistance area having a small thermal conductivity coefficient) having a higher thermal resistance than the mounting areas on both sides, and It has become. The width of the ring is formed larger than the thickness of the substrate, and the heat generated in the LED element 24 reaches the substrate back surface earlier than the mounting region B.
Furthermore, you may form the slit which cut off the board | substrate of the annular | circular shaped area | region C and penetrated. As a result, the thermal resistance of the annular region C can be further increased.
図２３は、基板２６の裏面側であり、表側の各実装領域に対応した基板裏面に、各実装領域Ａ、Ｂと略同形状の銅箔が貼られている。筐体２１の凹部２１−２は、内部側から見ると円形の凸部（図２１に示した２１−８）を形成し、その凸部の周囲に円環状の凹部（図２１に示した２１−９）を形成している。該凸部２１−８を形成している筐体２１の内壁に、実装領域Ａに対応した裏面位置に貼られた銅箔が接触しており、ＬＥＤ素子２４で発生した熱は、電子部品２５に伝導することなく、基板裏面の銅箔を通って筐体２１に伝導し、筐体２１の外壁を形成している上面部や側面から放熱される。
なお、該接触部に、電気絶縁性の放熱性のグリースを塗布したり、シートを挟んだりすることによって放熱性を更に向上させることもできる。
FIG. 23 is a back surface side of the substrate 26, and a copper foil having substantially the same shape as the mounting regions A and B is attached to the back surface of the substrate corresponding to the mounting regions on the front side. The concave portion 21-2 of the housing 21 forms a circular convex portion (21-8 shown in FIG. 21) when viewed from the inside, and an annular concave portion (21 shown in FIG. 21) around the convex portion. -9). The copper foil affixed to the back surface position corresponding to the mounting area A is in contact with the inner wall of the casing 21 forming the convex portion 21-8, and the heat generated in the LED element 24 is generated by the electronic component 25. Without being conducted, the heat is conducted to the housing 21 through the copper foil on the back surface of the substrate, and is radiated from the upper surface and the side surface forming the outer wall of the housing 21.
In addition, heat dissipation can be further improved by applying an electrically insulating heat dissipating grease or sandwiching a sheet to the contact portion.
実装領域Ｂに対応した裏面位置に貼られた銅箔は、前記円環状の凹部２１−９に位置しており、筐体と直接接触しない。実装領域Ｂにはスルーホールが形成され一部の電子部品２５のリードが基板裏面に出ているが、実装領域Ｂが該凹部２１−９に位置していることで、該リードと金属製の筐体とは接触せず、ショートが防止されている。 The copper foil affixed to the back surface position corresponding to the mounting region B is located in the annular recess 21-9 and does not directly contact the housing. Through holes are formed in the mounting area B, and the leads of some electronic components 25 are exposed on the back surface of the substrate. However, since the mounting area B is located in the recess 21-9, the leads and metal Short circuit is prevented without contact with the housing.
実装領域Ｂと、前記円環状の凹部２１−９との間には、電気絶縁性の硬化性の放熱樹脂が充填されていてもよい。これによって、電子部品２５で発生した熱は、裏面の銅箔を通って筐体２１に伝熱しやすくなっており、電子部品２５の温度上昇が抑制される。また放熱樹脂の熱伝導性よりも、アルミニウム製筐体の熱伝導性の方が１００倍程度大きいので、ＬＥＤ素子２４で発生した熱が、電子部品２５に逆流してくることはなく、ＬＥＤ素子４及び電子部品２５で発生した熱は筐体２１の外壁から効果的に放熱される。
また硬化した樹脂によって、ＬＥＤランプ本体２に何らかの衝撃が加えられても、前記リードが筐体２１の内壁に接触することがないので、樹脂の充填は信頼性の向上にもつながる。
Between the mounting area | region B and the said annular | circular shaped recessed part 21-9, you may be filled with an electrically insulating curable thermal radiation resin. Thereby, the heat generated in the electronic component 25 is easily transferred to the casing 21 through the copper foil on the back surface, and the temperature rise of the electronic component 25 is suppressed. Further, since the heat conductivity of the aluminum casing is about 100 times larger than the heat conductivity of the heat radiation resin, the heat generated in the LED element 24 does not flow back to the electronic component 25, and the LED element. 4 and the electronic component 25 are effectively radiated from the outer wall of the casing 21.
Moreover, even if some impact is applied to the LED lamp main body 2 by the cured resin, the lead does not contact the inner wall of the housing 21, so that the resin filling also improves the reliability.
更に基板２６の裏面には、図２３に示すように、速結端子２２の接触子２２−２が接触する電力入力面２６−２が設けられている。基板入力面２６−２は銅箔であり、実装領域Ａに対応した裏面位置に設けられ、また電力入力面２６−２から、実装領域Ｂに電力を供給するための電力供給経路２６−３が設けられている。これら電力入力面２６−２、電力供給経路２６−３は、実装領域Ａに対応した裏面位置に設けられた銅箔から分断されており、また該電力供給経路２６−３が筐体２１の前記凸部２１−８の表面に接触しないよう前記凸部２１−８の一部に溝（図示していない）が形成されている。電力供給経路２６−３は実装領域Ｂの裏面まで延びており、電力はスルーホールを通って実装領域Ｂの電力供給部２６−４に達する。
なお、前述の電気絶縁性の放熱シートを凸部２１−８の表面に備えれば該電力供給経路２６−３のための溝を設ける必要がなくなり、位置合わせ等の必要もなくなって製造上好ましい。
Furthermore, as shown in FIG. 23, a power input surface 26-2 that contacts the contact 22-2 of the quick connection terminal 22 is provided on the back surface of the substrate 26. The board input surface 26-2 is a copper foil, and is provided at a back surface position corresponding to the mounting region A. A power supply path 26-3 for supplying power to the mounting region B from the power input surface 26-2 is provided. Is provided. The power input surface 26-2 and the power supply path 26-3 are separated from the copper foil provided at the back surface position corresponding to the mounting area A, and the power supply path 26-3 is the above-mentioned of the casing 21. A groove (not shown) is formed in a part of the convex portion 21-8 so as not to contact the surface of the convex portion 21-8. The power supply path 26-3 extends to the back surface of the mounting region B, and the power reaches the power supply unit 26-4 in the mounting region B through the through hole.
If the above-described electrically insulating heat radiation sheet is provided on the surface of the convex portion 21-8, it is not necessary to provide a groove for the power supply path 26-3, and there is no need for alignment, which is preferable in manufacturing. .
また、基板２６の銅箔の形状を図２４、図２５に示したように形成し、実装領域Ａの銅箔の面積を増やし、それらに全面接触する形状の凸部を筐体２１の上面部２１−１に設けてもよい。これによって、ＬＥＤ素子２４の温度上昇が更に抑制される。
また、速結端子収納部２３の底延部２３−３と接触子２２−２を長く伸ばし、電力入力面２６−２を実装領域Ｂに対応した裏面位置に設けてもよい。
Further, the shape of the copper foil of the substrate 26 is formed as shown in FIGS. 24 and 25, the area of the copper foil in the mounting region A is increased, and the convex portion having a shape contacting the entire surface is formed on the upper surface portion of the housing 21. You may provide in 21-1. Thereby, the temperature rise of the LED element 24 is further suppressed.
Moreover, the bottom extension part 23-3 and the contact 22-2 of the quick connection terminal accommodating part 23 may be extended long, and the power input surface 26-2 may be provided at the back surface position corresponding to the mounting region B.
なお、本実施形態では、実装領域ＡにＬＥＤ素子２４を実装し、実装領域Ｂに電子部品２５を実装したが、これとは逆に実装領域Ａに電子部品２５を実装し、実装領域ＢにＬＥＤ素子２４を実装してもよい。これに応じて筐体２１の上面部２１−１の内壁は、中央部が円形の凹部で、その周囲が円環状の凸部に形成される。
またＬＥＤ素子実装基板と、点灯回路用基板を別体の基板として、ＬＥＤ素子の光軸上に点灯回路用基板を配置しない範囲で、両方の基板が略同一平面に位置するように配設してＬＥＤランプ本体を扁平にすることもできる。
In the present embodiment, the LED element 24 is mounted in the mounting area A and the electronic component 25 is mounted in the mounting area B. On the contrary, the electronic component 25 is mounted in the mounting area A and the mounting area B is mounted. The LED element 24 may be mounted. Accordingly, the inner wall of the upper surface portion 21-1 of the housing 21 is formed with a circular concave portion at the center and an annular convex portion around it.
In addition, the LED element mounting board and the lighting circuit board are separated from each other, and the lighting circuit board is not disposed on the optical axis of the LED element so that both boards are positioned on substantially the same plane. The LED lamp body can be made flat.
前記遮蔽板２７は、図２７に示したように、酸化チタンを含有した光を透過しないポリカーボネート樹脂を用いて、上下両端部が開口した朝顔型の曲面形状であって中空円筒に成型されている。開口上端面の周縁部には内側に延出した鍔部２７−１が設けられており、この鍔部２７−１にネジ穴２７−４が形成されている。鍔部２７−１の上面は、基板２６の実装領域Ａと実装領域Ｂとの間の前記円環状領域Ｃに接合され、筐体２１の上面部２１−１との間に基板２６を挟持して、該上面部２１−１にネジ止めされている。 As shown in FIG. 27, the shielding plate 27 is made of a polycarbonate resin containing titanium oxide that does not transmit light, and has a morning glory-shaped curved surface with both upper and lower ends opened, and is formed into a hollow cylinder. . A flange portion 27-1 extending inward is provided at the peripheral edge portion of the upper end surface of the opening, and a screw hole 27-4 is formed in the flange portion 27-1. The upper surface of the flange portion 27-1 is joined to the annular region C between the mounting region A and the mounting region B of the substrate 26, and the substrate 26 is sandwiched between the upper surface portion 21-1 of the housing 21. And is screwed to the upper surface portion 21-1.
開口下端面２７−２は、外側に大きく拡開し鍔状に成型されている。該下端面２７−２は、外側から電子部品２５が見えないように、実装領域Ｂを覆い隠し、その鍔状の最端縁部は筐体２１の内壁部に接している。また、遮蔽板２７の内壁面２７−３は鏡面加工された拡散反射面を形成しており、ＬＥＤ素子２４の出射光を吸収することなく反射し、ＬＥＤランプ２から光をロスすることなく出射させる機能を有している。 The opening lower end surface 27-2 is greatly expanded outward and is shaped like a bowl. The lower end surface 27-2 covers and hides the mounting region B so that the electronic component 25 cannot be seen from the outside, and its bowl-like endmost edge is in contact with the inner wall of the housing 21. Further, the inner wall surface 27-3 of the shielding plate 27 forms a mirror-diffused diffuse reflection surface, which reflects the light emitted from the LED element 24 without absorbing it, and emits the light from the LED lamp 2 without loss. It has a function to make it.
透光性カバー２８は、ポリカーボネートを使用して、円形のドーム形状に成型されている。図２８に示すように該透光性カバー２８の端部に突出部２８−１が、光照射方向の逆側に向けて設けられており、遮蔽板２７の下端面２７−２の縁部と、筐体２１の内壁部とに接触して固定されている。 The translucent cover 28 is molded into a circular dome shape using polycarbonate. As shown in FIG. 28, a protruding portion 28-1 is provided at the end of the translucent cover 28 toward the opposite side of the light irradiation direction, and the edge of the lower end surface 27-2 of the shielding plate 27 is provided. It is fixed in contact with the inner wall portion of the housing 21.
前記突出部２８−１によって、遮蔽板２７との間に空間ができており、透光性カバー２８で反射された光が、遮蔽板２７の内壁面２７−３で拡散反射され、これが繰り返されて、透光性カバー２８の端部側まで光が達する。これによって遮蔽板２７を覆っている部分も含め、透光性カバー２８の全面が光ることができている。 A space is formed between the protruding portion 28-1 and the shielding plate 27, and the light reflected by the translucent cover 28 is diffusely reflected by the inner wall surface 27-3 of the shielding plate 27, and this is repeated. Thus, the light reaches the end side of the translucent cover 28. As a result, the entire surface of the translucent cover 28 including the portion covering the shielding plate 27 can be illuminated.
また遮蔽板２７と透光性カバー２８との間に、アクリル製の円環形状の導光板２９を挿入してもよい。図２８に示すように前記導光板２９の内周側端面が光導入面２９−１を形成し、遮蔽板２７側に位置する面が光出射面２９−２となっており、散乱光が透光性カバーに向けて出射される。これによって、更に遮蔽板２７を覆っている部分からの照射光を増やせ、透光性カバーをより均一に光らせることができる。
なお実装領域ＢにＬＥＤ素子２４が実装した場合など、基板の外周側にＬＥＤ素子が配置されるときは、円盤状の導光板２９の外周側に光導入面が設けられ、円盤状の全面を光出射面とした導光板２９が、遮蔽板２７と透光性カバー２８との間に設置されることで、透光性カバー全体が均一に発光するＬＥＤ照明装置１００が得られる。
Further, an acrylic annular light guide plate 29 may be inserted between the shielding plate 27 and the translucent cover 28. As shown in FIG. 28, the end surface on the inner peripheral side of the light guide plate 29 forms a light introducing surface 29-1, and the surface located on the shielding plate 27 side is a light emitting surface 29-2, so that scattered light is transmitted. The light is emitted toward the light cover. Thereby, the irradiation light from the part which covers the shielding board 27 can be increased further, and a translucent cover can be made to shine more uniformly.
When the LED element 24 is mounted on the outer peripheral side of the substrate, such as when the LED element 24 is mounted in the mounting region B, a light introduction surface is provided on the outer peripheral side of the disk-shaped light guide plate 29, and the disk-shaped entire surface is covered. By installing the light guide plate 29 as the light emitting surface between the shielding plate 27 and the translucent cover 28, the LED illumination device 100 in which the entire translucent cover emits light uniformly is obtained.
本実施形態のＬＥＤ照明装置１００は、以下のようにして被取り付け面である天井面４や壁等に取り付けられる。
まず、天井面４に直径１５ｍｍの孔４−１を開けて、該孔４−１から外部電源線３を引き出す。その後、連結板１の連結板位置決め突出部１２を、前記孔４−１に挿入すると同時に連結板電源挿通部１１から、外部電源線３を引き出し、連結板１を天井面４にネジ止めする。
次に、外部電源線の２本の芯線を、ＬＥＤランプ本体２の速結端子収納部２３の開口部２３−１から挿入し、連結端子２２−１に挿着する。
次に、ＬＥＤランプ本体２の係合溝２１−５が連結板位置決め突出部１２と係合し、ＬＥＤランプ本体２の回動係止片２１−７が連結板１の回動係合部１４と係合するように、ＬＥＤランプ位置決め突出部２１−４を、連結板の連結板電源挿通部１１に挿入する。
最後に、ＬＥＤランプ本体２の上面部２１−１を連結板１に密着するように接合し、ＬＥＤランプ２を所定角度回動させて、連結板１にＬＥＤランプ２を装着する。これにより、ＬＥＤランプ本体２の回動係止片２１−７が連結板１の回動係合部１４の係止舌片１４−２と係合した状態となる。
The LED lighting device 100 according to the present embodiment is attached to the ceiling surface 4 or a wall, which is a surface to be attached, as follows.
First, a hole 4-1 having a diameter of 15 mm is formed in the ceiling surface 4, and the external power supply line 3 is pulled out from the hole 4-1. Thereafter, the connecting plate positioning protrusion 12 of the connecting plate 1 is inserted into the hole 4-1, and at the same time, the external power line 3 is pulled out from the connecting plate power supply insertion portion 11, and the connecting plate 1 is screwed to the ceiling surface 4.
Next, the two core wires of the external power supply line are inserted from the opening 23-1 of the quick connection terminal storage portion 23 of the LED lamp body 2, and are inserted into the connection terminal 22-1.
Next, the engagement groove 21-5 of the LED lamp body 2 is engaged with the connecting plate positioning protrusion 12, and the rotation locking piece 21-7 of the LED lamp body 2 is rotated by the rotation engaging portion 14 of the connection plate 1. The LED lamp positioning protrusion 21-4 is inserted into the connecting plate power supply insertion portion 11 of the connecting plate so as to engage with the connecting plate.
Finally, the upper surface portion 21-1 of the LED lamp body 2 is joined so as to be in close contact with the connecting plate 1, the LED lamp 2 is rotated by a predetermined angle, and the LED lamp 2 is attached to the connecting plate 1. Thereby, the rotation locking piece 21-7 of the LED lamp body 2 is in a state of being engaged with the locking tongue piece 14-2 of the rotation engagement portion 14 of the connecting plate 1.
以上のように、本実施形態では、連結板１は１枚の板であり、ＬＥＤランプ２の筐体２１は、扁平な円筒形状であり、被照射面側に近い側から順番に、透光性カバー２８と、遮蔽板２７と、基板２６と、筐体上面部側２１−１の内壁に形成された凸部２１−８と、連結板１とが、これら各部材の回転軸線とＬＥＤ素子２４の光軸とが略平行となるように配置されている。これらによってＬＥＤ照明装置１００は、天井面４からの突出量が少なく、良好な意匠性を示している。なお、本実施形態では筐体２１の形状を円筒形にしたが、これに限定されず断面が４角形等からなる扁平な多角柱であってもよい。 As described above, in the present embodiment, the connecting plate 1 is a single plate, and the housing 21 of the LED lamp 2 has a flat cylindrical shape, and sequentially transmits light from the side closer to the irradiated surface side. The cover 28, the shielding plate 27, the substrate 26, the convex portion 21-8 formed on the inner wall of the housing upper surface portion side 21-1, and the connecting plate 1, the rotation axis of each of these members and the LED element The 24 optical axes are arranged so as to be substantially parallel. Thus, the LED lighting device 100 has a small amount of protrusion from the ceiling surface 4 and exhibits a good design. In the present embodiment, the casing 21 has a cylindrical shape, but is not limited thereto, and may be a flat polygonal column having a quadrangular cross section.
図２９は、本発明の別の実施形態を示したものであり、ＬＥＤランプ本体２１、基板２６、遮蔽板２７、透光性カバー２８等の構成は前述したＬＥＤ照明装置の実施形態と同じである。この実施形態では、前記遮蔽板２７と前記透光性カバー２８の間に円板形状（平板形状）をした光拡散部材４０を配置している。光拡散部材４０は、アクリルやポリカーボネート等に光拡散剤を添加して成形したものであり、ここでは、基板２６及び遮蔽板２７の照射面側の全体面を覆う面積を有している。光拡散部材４０には、図３０に示すように周縁部に複数のリブ４０−１が突設されており、このリブ４０−１を透光性カバー２８の端縁部と密接させ、透光性カバー２８との隙間を埋めることで光拡散部材４０等のガタツキを防いでいる。このような光拡散部材４０を基板２６の照射面側に配置することにより、ＬＥＤ素子からの照射光が拡散し、照明の明暗差を少なくすることができる。 FIG. 29 shows another embodiment of the present invention, and the configurations of the LED lamp main body 21, the substrate 26, the shielding plate 27, the translucent cover 28, and the like are the same as those of the above-described embodiment of the LED illumination device. is there. In this embodiment, a light diffusing member 40 having a disc shape (flat plate shape) is disposed between the shielding plate 27 and the translucent cover 28. The light diffusing member 40 is formed by adding a light diffusing agent to acrylic, polycarbonate, or the like. Here, the light diffusing member 40 has an area covering the entire surface on the irradiation surface side of the substrate 26 and the shielding plate 27. As shown in FIG. 30, the light diffusing member 40 is provided with a plurality of ribs 40-1 at the peripheral edge thereof, and the ribs 40-1 are brought into close contact with the edge of the translucent cover 28 to transmit the light. The gap between the light-diffusing member 40 and the like is prevented by filling the gap with the protective cover 28. By disposing such a light diffusing member 40 on the irradiation surface side of the substrate 26, the irradiation light from the LED element is diffused, and the brightness difference of illumination can be reduced.
遮蔽板２７は白色不透明でも良いし半透明のものでも良いが、半透明にすればＬＥＤ素子の照射光の透光性が良くなり、光拡散部材４０と相まってＬＥＤ素子の照射光の照度を落とさずに均一に透光性カバー２８を介して照射することができる。さらには、上述したように遮蔽板２７の内壁面２７−３に拡散反射面を形成することで、ＬＥＤ素子２４の出射光は光拡散部材４０との間で拡散を繰り返し、より均一な照射光となる。 The shielding plate 27 may be white opaque or semi-transparent, but if it is made semi-transparent, the transmissivity of the light emitted from the LED element is improved, and the illuminance of the light emitted from the LED element is reduced in combination with the light diffusing member 40. Irradiation through the translucent cover 28 can be performed uniformly. Furthermore, as described above, by forming a diffuse reflection surface on the inner wall surface 27-3 of the shielding plate 27, the emitted light of the LED element 24 is repeatedly diffused between the light diffusing member 40 and more uniform irradiation light. It becomes.
１：連結板
１１：連結板電源挿通部
１２：連結板位置決め突出部
１３：回動規制孔部
１４：回動係合部
２：ＬＥＤランプ本体
２１：筐体
２２：速結端子
２３：速結端子収納部
２４：ＬＥＤ素子
２５：電子部品
２６：基板
２７：遮蔽板
２８：透光性カバー
２９：導光板
３０：ストッパ部材
３１：速結端子
３２：速結端子収納部材
４０：光拡散部材
３： 外部電源線
４： 天井面
１００：ＬＥＤ照明装置
1: connecting plate 11: connecting plate power supply insertion portion 12: connecting plate positioning protrusion 13: rotation restricting hole portion 14: rotation engaging portion 2: LED lamp body 21: housing 22: fast connection terminal 23: fast connection Terminal storage unit 24: LED element 25: electronic component 26: substrate 27: shielding plate 28: light-transmitting cover 29: light guide plate 30: stopper member 31: fast connection terminal 32: fast connection terminal storage member 40: light diffusion member 3 : External power line 4: Ceiling surface 100: LED lighting device
Claims (6)
前記点灯回路基板に実装された電子部品の領域を覆う遮蔽部材と、
前記遮蔽部材の光照射面側に配置された光拡散部材と、
該光拡散部材の光照射面側に配置された透光カバーと、
を備えたことを特徴とするＬＥＤ照明装置。 An LED lamp body provided with an LED board on which an LED element is mounted and a lighting circuit board for lighting and driving the LED board;
A shielding member covering an area of the electronic component mounted on the lighting circuit board;
A light diffusing member disposed on the light irradiation surface side of the shielding member;
A translucent cover disposed on the light irradiation surface side of the light diffusion member;
An LED lighting device comprising:
The LED lighting device according to claim 1, wherein a diffuse reflection surface is formed on an inner surface side of the shielding member.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101909647B1 (en) * | 2017-04-18 | 2018-10-22 | (주)소룩스 | Edge type LED lightint device |
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| KR101909647B1 (en) * | 2017-04-18 | 2018-10-22 | (주)소룩스 | Edge type LED lightint device |
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